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Proceedings of the 2006 7th International Symposium on Quality Electronic Design (2006)
San Jose, CA
March 27, 2006 to March 29, 2006
ISBN: 0-7695-2523-7
TABLE OF CONTENTS
Participating Organizations
Best Paper Award
pp. 820
Introduction
ISQED Tutorials
Kaustav Banerjee , University of California, Santa Barbara, CA
Rajiv Joshi , IBM T J Watson Research Center, NY
pp. 4
Keith Bowman , Intel Corporation
Sachin S. Sapatnekar , University of Minnesota
pp. 5
ISQED Panel Discussion
ISQED Plenary Session
Session 1A: Variation Aware Timing
Praveen Ghanta , Arizona State University, Tempe.
Sarma Vrudhula , CSE, Arizona State University, Tempe.
pp. 19-24
Evelyn Grossar , IMEC,Kapeldreef , Leuven, Belgium
Michele Stucchi , IMEC,Kapeldreef , Leuven, Belgium
Karen Maex , IMEC,Kapeldreef , Leuven, Belgium
Wim Dehaene , K.U.Leuven, ESAT, Kasteelpark Arenberg 10,B-3001 Leuven, Belgium
pp. 25-30
Andrew B. Kahng , UC San Diego, La Jolla, CA
Xu Xu , UC San Diego, La Jolla, CA
pp. 37-42
Peng Li , Texas A&M University
Zhuo Feng , Texas A&M University
pp. 43-50
Session 1B: High-Level Design Verification
Franco Fummi , Universita di Verona ,Verona, Italy
Cristina Marconcini , Universita di Verona ,Verona, Italy
Giuseppe Di Guglielmo , Universita di Verona ,Verona, Italy
pp. 57-62
Indradeep Ghosh , Fujitsu Laboratories of America, Sunnyvale, CA, USA
pp. 63-70
C Mandal , Indian Institute of Technology, Kharagpur, India
D Sarkar , Indian Institute of Technology, Kharagpur, India
S R Pentakota , Indian Institute of Technology, Kharagpur, India
C Karfa , Indian Institute of Technology, Kharagpur, India
pp. 71-78
Session 1C.: Physical Planning
Anand Rajaram , University of Texas at Austin
David Z. Pan , University of Texas at Austin
pp. 79-84
G. Wilke , UFRGS, Brazil
H. Chen , Synopsys, CA, USA
S. Reddy , Fujitsu Laboratories of America, Inc., CA, USA
H. Nguyen , Fujitsu Laboratories of America, Inc., CA, USA
T. Miyoshi , Fujitsu Laboratories of America, Inc., CA, USA
W. Walker , Fujitsu Laboratories of America, Inc., CA, USA
R. Murgai , Fujitsu Laboratories of America, Inc., CA, USA
pp. 85-91
Narender Hanchate , University of South Florida, Tampa
Nagarajan Ranganathan , University of South Florida, Tampa
pp. 92-97
G.M. Link , Pennsylvania State University, University Park
Yuan Xie , Pennsylvania State University, University Park
N. Vijaykrishnan , Pennsylvania State University, University Park
M. J. Irwin , Pennsylvania State University, University Park
pp. 98-104
ISQED Luncheon Speech
Session 2A.: Robust Device and Circuit Design
C. Anghel , Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland
F. Krummenacher , Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland
R. Gillon , AMI Semiconductor, Belgium
Y. S. Chauhan , Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland
pp. 109-114
Xing Zhang , Peking University, Beijing, P.R.China
Ganggang Zhang , Peking University, Beijing, P.R.China
Mansun Chan , Hong Kong University of Science & Technology
Yangyuan Wang , Peking University, Beijing, China
pp. 115-120
Xing Zhang , Peking University, Beijing, China
Ganggang Zhang , Peking University, Beijing, China
Jin He , Peking University, Beijing, China
pp. 127-132
Session 2B.: Power, Noise and Timing Issues in DSM Designs
Soheil Ghiasi , University of California, Davis
Po-Kuan Huang , University of California, Davis
pp. 141-146
Nahmsuk Oh , Synopsys Inc., 700 E. Middlefield Road, Mountain View, CA
Li Ding , Synopsys Inc., 700 E. Middlefield Road, Mountain View, CA
Alireza Kasnavi , Synopsys Inc., 700 E. Middlefield Road, Mountain View, CA
pp. 153-159
Eby G. Friedman , University of Rochester
Emre Salman , University of Rochester
Feroze Taraporevala , Synopsys, Inc., Mountain View, CA
Kayhan Kucukcakar , Synopsys, Inc., Mountain View, CA
pp. 159-164
Deniz Dal , Syracuse University
Adrian Nunez , Syracuse University
Nazanin Mansouri , Syracuse University
pp. 165-170
Andrew Havlir , University of Texas at Austin
David Z. Pan , University of Texas at Austin
pp. 171-178
Session 2C.: Memory Analysis
Fadi J. Kurdahi , University of California, Irvine
Young-Hwan Park , University of California, Irvine
Rouwaida N. Kanj , IBM Austin Research Labs
Sani R. Nassif , IBM Austin Research Labs
pp. 179-184
Sang-Hoon Lee , CAE Team, Semiconductor R&D Center
Dae-Han Kim , CAE Team, Semiconductor R&D Center
Young-Gu Kim , CAE Team, Semiconductor R&D Center
Jae-Woo Im , Flash Team, SRAM/Flash Product & Technology, Samsung
Sung-Eun Yu , CAE Team, Semiconductor R&D Center
Dae-Wook Kim , CAE Team, Semiconductor R&D Center
Young-Kwan Park , CAE Team, Semiconductor R&D Center
Jeong-Taek Kong , CAE Team, Semiconductor R&D Center
pp. 185-189
R. Venkatraman , LSI Logic Corporation, Milpitas, CA
R. Castagnetti , LSI Logic Corporation, Milpitas, CA
S. Ramesh , LSI Logic Corporation, Milpitas, CA
pp. 190-195
Makoto Sugihara , ISIT, 2-1-22 Momochihama, Sawara-ku, Fukuoka, Japan
Masanori Muroyama , Kyushu Univ., Fukuoka, Japan
Koji Hashimoto , Fukuoka Univ.,Fukuoka, Japan
pp. 196-203
Jente B Kuang , University at Buffalo IBM Austin Research Lab
Kevin Nowka , University at Buffalo IBM Austin Research Lab
Ramalingam Sridhar , University at Buffalo IBM Austin Research Lab
Praveen Elakkumanan , University at Buffalo
Sani Nassif , University at Buffalo IBM Austin Research Lab
pp. 204-209
Chris H. Kim , University of Minnesota, Minneapolis
Sanjay V. Kumar , University of Minnesota, Minneapolis
pp. 210-218
Session 2D.: Posters
Haibo Wang , Southern Illinois University, Carbondale, IL
Krishna Raghuraman , Southern Illinois University, Carbondale, IL
pp. 219-224
Kaiping Zeng , Darmstadt University of Technology, Germany
Sorin A. Huss , Darmstadt University of Technology, Germany
pp. 225-230
Yi-Le Huang , National Tsing-Hua University, China
Chun-Yao Wang , National Tsing-Hua University, China
Richard Yeh , SpringSoft, Inc., Taiwan
Shih-Chieh Chang , National Tsing-Hua University, China
Yung-Chih Chen , National Tsing-Hua University, China
pp. 231-236
Xinjie Wei , Tsinghua University, China
Yici Cai , Tsinghua University, China
Xianlong Hong , Tsinghua University, China
pp. 237-242
Qikai Chen , Purdue University, IN, USA
Kaushik Roy , Purdue University, IN, USA
pp. 243-248
Rasit Onur Topaloglu , University of California at San Diego
pp. 249-253
M. Craig , Advanced Micro Devices, One AMD Place, Sunnyvale, CA
G. Burbach , Advanced Micro Devices, One AMD Place, Sunnyvale, CA
B. Wagner , Advanced Micro Devices, One AMD Place, Sunnyvale, CA
S. McGowan , Advanced Micro Devices, One AMD Place, Sunnyvale, CA
C. Tabery , Advanced Micro Devices, One AMD Place, Sunnyvale, CA
S. Roling , Advanced Micro Devices, One AMD Place, Sunnyvale, CA
C. Haidinyak , Advanced Micro Devices, One AMD Place, Sunnyvale, CA
E. Ehrichs , Advanced Micro Devices, One AMD Place, Sunnyvale, CA
pp. 260-265
Xiongfei Meng , University of British Columbia, Canada
Resve Saleh , University of British Columbia, Canada
Karim Arabi , MC-Sierra, Inc., BC, Canada
pp. 266-271
I-Fan Liao , University of California, Riverside
X.-D Sheldon , University of California, Riverside
Yici Cai , Tsinghua University, Beijing, China
Jeffrey Fan , University of California, Riverside
pp. 272-277
P. Muthana , Georgia Institute of Technology
R. Mandrekar , Georgia Institute of Technology
E. Engin , Georgia Institute of Technology
J. Choi , Georgia Institute of Technology
M. Swaminathan , Georgia Institute of Technology
pp. 284-291
Jiang Hu , Texas A&M University, College Station, TX
Cheng Zhuo , Zhejiang University, Hangzhou, China
pp. 290-295
Arkan Abdulrahman , Southern Illinois University, Carbondale
Spyros Tragoudas , Southern Illinois University, Carbondale
pp. 300-305
Hai Zhou , EECS, Northwestern University, Evanston, IL
Debjit Sinha , EECS, Northwestern University, Evanston, IL
pp. 306-311
Zhiyu Liu , University of Wisconsin, Madison
pp. 318-323
Randy Bach , LSI Logic Inc., 1621 Barber Lane, Milpitas CA, USA
Bob Davis , LSI Logic Inc., 1621 Barber Lane, Milpitas CA, USA
Rich Laubhan , LSI Logic Inc., 1621 Barber Lane, Milpitas CA, USA
pp. 324-329
T. Arslan , University of Edinburgh, Kings Buildings, Edinburgh,EH9 3JL, UK
S. Baloch , Institute for System Level Integration, Alba Centre, Alba Campus, Livingston, EH54 7EG, UK
pp. 330-345
Jean-Marc Philippe , CEA-List DRT/DTSI/SARC/LCEI, France
S?ebastien Pillement , University of Rennes (ENSSAT), Lannion, France
Olivier Sentieys , University of Rennes (ENSSAT), Lannion, France
pp. 334-339
Hai Zhou , Northwestern University Evanston, IL
Ping-Chih Wu , Cadence Design Systems Inc., San Jose, CA
pp. 340-345
Donald Chai , University of California at Berkeley, CA
A. Richard Newton , University of California at Berkeley, CA
Andreas Kuehlmann , Cadence Berkeley Labs, Berkeley, CA, USA
pp. 346-351
Praveen Bhojwani , Texas A&M University, College Station, Texas
pp. 358-363
Vyas Krishnan , University of South Florida,Tampa
Srinivas Katkoori , University of South Florida,Tampa
pp. 364-369
Hiroshi Saito , VLSI Design and Education Center, University of Tokyo
Masahiro Fujita , University of Aizu
pp. 370-375
M. Prieto , Universidad Complutense, Madrid, Spain
A. Papanikolaou , IMEC v.z.w, Leuven, Belgium
M. Miranda , IMEC v.z.w, Leuven, Belgium
F. Catthoor , IMEC v.z.w, Leuven, Belgium
pp. 376-382
Biye Wang , San Jose State University
Morris Jones , San Jose State University
pp. 383-386
J. Balachandran , Microwave and RF Systems Group, IMEC vzw, Kapeldreef 75, 3001, Leuven, Belgium
S. Brebels , Microwave and RF Systems Group, IMEC vzw, Kapeldreef 75, 3001, Leuven, Belgium
G. Carchon , Microwave and RF Systems Group, IMEC vzw, Kapeldreef 75, 3001, Leuven, Belgium
W.De Raedt , Microwave and RF Systems Group, IMEC vzw, Kapeldreef 75, 3001, Leuven, Belgium
E. Beyne , Microwave and RF Systems Group, IMEC vzw, Kapeldreef 75, 3001, Leuven, Belgium
M. Kuijk , Vrije Universiteit Brussel,ETRO, Pleinlaan 2,1050 Brussel, Belgium
B. Nauwelaers , Katholieke Universiteit Leuven, ESAT, Kasteelpark Arenberg 10, 3001 Leuven, Belgium.
pp. 387-392
Takayuki Watanabe , University of Shizuoka, Japan
Yuichi Tanji , Kagawa University, Japan
Hideki Asai , Shizuoka University, Japan
pp. 393-400
Session 3A.: Interconnect Analysis and Optimization
Min Chen , Arizona State University
pp. 401-406
Rohit Singhal , Texas A & M University, College Station, TX
Gwan S. Choi , Texas A & M University, College Station, TX
Rabi Mahapatra , Texas A & M University, College Station, TX
pp. 407-412
Sheldon X.-D. Tan , University of California, Riverside
Pu Liu , University of California, Riverside
Lifeng Wu , Cadence Design Systems Inc., San Jose, CA
pp. 413-418
Taeyong Je , Hanynag Univ., Ansan, Kyunggi-do, Korea
Yungseon Eo , Hanynag Univ., Ansan, Kyunggi-do, Korea
pp. 419-424
Yehea Ismail , Northwestern University
Muhammad Khellah , Circuit Research Lab, Intel Corporation
Maged Ghoneima , Northwestern University
pp. 425-432
Session 3B: Digital Test and Diagnosis Techniques
X. Kavousianos , University of Ioannina, 45110 Ioannina, Greece
E. Kalligeros , University of Ioannina, 45110 Ioannina, Greece
pp. 433-438
Rajsekhar Adapa , Southern Illinois University Carbondale
Spyros Tragoudas , Southern Illinois University Carbondale
Maria K Michael , University of Cyprus
pp. 439-444
Yu Huang , Mentor Graphics Corporation,
pp. 445-450
Li-Chung Hsu , SpringSoft, Inc., Hsinchu, Taiwan
pp. 451-456
E. Flanigan , Southern Illinois University at Carbondale
T. Haniotakis , Southern Illinois University at Carbondale
S. Tragoudas , Southern Illinois University at Carbondale
pp. 457-462
Vishal J. Mehta , UC, Santa Barbara,CA
Malgorzata Marek-Sadowska , UC, Santa Barbara,CA
Zhiyuan Wang , Cisco Systems Inc., San Jose, CA
Kun-Han Tsai , Mentor Graphics Corporation, Wilsonville, OR
Janusz Rajski , Mentor Graphics Corporation, Wilsonville, OR
pp. 463-472
Session 3C.: Back of Line DFM
Jason Hibbeler , IBM Microelectronics, Burlington, VT, USA
Markus Buhler , IBM Deutschland Entwicklung GmbH, Boblingen, Germany
Jurgen Koehl , IBM Deutschland Entwicklung GmbH, Boblingen, Germany
Dirk Muller3 , University of Bonn, Germany
Jeanne Bickford , IBM Microelectronics, Burlington, VT, USA
Christian Schulte , University of Bonn, Germany
pp. 473-478
Takumi Uezono , Tokyo Institute of Technology
Kenichi Okada , Tokyo Institute of Technology
Kazuya Masu , Tokyo Institute of Technology
pp. 479-484
Robert Aitken , ARM Physical IP, Inc., Sunnyvale, CA, USA
pp. 491-496
N. Vijayaraghavan , STMicroelectronics
Matthieu Sautier , STMicroelectronics
Olivier Callen , STMicroelectronics
Sebastien Fabre , Philips Semiconductors
Ryan Ross , Freescale Semiconductor - Crolles2 Alliance Crolles, France
Paul Simon , Philips Semiconductors
Arnaud Epinat , STMicroelectronics
pp. 497-502
ISQED Panel Discussion 2
ISQED Plenary Session 2
Session 4A.: Analog Test and Self-Checking Design
Qingqi Dou , University of Texas at Austin
pp. 525-530
Amit Laknaur , Southern Illinois University, Carbondale, IL
Haibo Wang , Southern Illinois University, Carbondale, IL
pp. 531-536
G. Peretti , Universidad Tecnologica Nacional, Argentina
J. L. Catalano , Universidad Tecnologica Nacional, Argentina
C. Marques , Universidad Nacional de Cordoba, Medina Allende y Haya de Torre, Cordoba
pp. 543-550
Session 4B.: Power Aware Designs and Memory Management
Ozcan Ozturk , Pennsylvania State University
pp. 551-556
Mindaugas Dra?zd?ziulis , Chalmers University of Technology, Sweden
Per Larsson-Edefors , Chalmers University of Technology, Sweden
Minh Q. Do , Chalmers University of Technology, Sweden
pp. 557-563
Ramakrishna Velagapudi , University of North Texas, Denton, TX
Saraju P. Mohanty , University of North Texas, Denton, TX
pp. 564-569
Mahmut Kandemir , Pennsylvania State University
Sri Hari Krishna Narayanan , Pennsylvania State University
pp. 570-575
Ozcan Ozturk , Pennsylvania State University
Mahmut Kandemir , Pennsylvania State University
Ibrahim Kolcu , University of Manchester, UK
pp. 576-584
Session 4C.: Technologies for Robust Design
Wei Zhao , Arizona State University, Tempe, AZ
Yu Cao , Arizona State University, Tempe, AZ
pp. 585-590
J. Pathak , MEMTEL, LLC.
J. Payne , MEMTEL, LLC.
M. Thomas , MEMTEL, LLC.
E. Wachmann , Austriamicrosystems, AG
G. Schatzberger , Austriamicrosystems, AG
A. Wiesner , Austriamicrosystems, AG
M. Schrems , Austriamicrosystems, AG
pp. 591-596
Tai-Xiang Lai , National Chiao-Tung University, Hsinchu, Taiw
Ming-Dou Ker , National Chiao-Tung University, Hsinchu, Taiw
pp. 597-602
Vivek Joshi , Indian Institute of Technology, Kanpur, India
Rajeev R. Rao , University of Michigan, Ann Arbor, MI
David Blaauw , University of Michigan, Ann Arbor, MI
Dennis Sylvester , University of Michigan, Ann Arbor, MI
pp. 611-616
Praveen Elakkumanan , University at Buffalo
Kishan Prasad , University at Buffalo
Ramalingam Sridhar , University at Buffalo
pp. 617-624
Session 5A.: IC-Package Design Challenges
G. M. Link , Pennsylvania State University
N. Vijaykrishnan , Pennsylvania State University
pp. 625-632
Kevin Nowka , IBM Research, Austin, TX
Kanak Agarwal , IBM Research, Austin, TX
Dennis Sylvester , University of Michigan, Ann Arbor, MI
pp. 633-637
David Z. Pan , University of Texas, Austin, TX
Frank Liu , IBM Research Division, Austin, TX
Anand Ramalingam , University of Texas, Austin, TX
pp. 644-649
Mark M. Budnik , Purdue University
Kaushik Roy , Purdue University
pp. 650-658
Session 5B.: IP, Interoperability: Design Optimization
Sanghamitra Roy , University of Wisconsin-Madison
Charlie Chung-Ping Chen , University of Wisconsin-Madison
pp. 665-670
Guangyu Sun , Tsinghua University, Beijing, China
Zhiqiang Gao , Tsinghua University, Beijing, China
Yi Xu , Tsinghua University, Beijing, China
pp. 671-675
Dimitris Kagaris , Southern Illinois University, Carbondale, IL
pp. 682-690
Session 5C.: DSM Interconnect Challenges
Andrew B. Kahng , UCSD CSE and ECE Departments, La Jolla, CA
Puneet Sharma , UCSD ECE Department, La Jolla, CA
pp. 691-696
Stephane Martin , STMicroelectronics, France
Corinne Cregut , STMicroelectronics, France
Eric Balossier , STMicroelectronics, France
Frederic Nyer , STMicroelectronics, France
Fabrice Huret , LEST UMR CNRS 6165 , Brest, France
pp. 703-708
Changhao Yan , Tsinghua Univ., Beijing , China
Zeyi Wang , Tsinghua Univ., Beijing , China
pp. 709-716
Session 6A.: Leakage Analysis and Optimization
Yu Cao , Electrical Engineering, Arizona State University, Tempe, AZ
Sarvesh Bhardwaj , Electrical Engineering, Arizona State University, Tempe, AZ
pp. 717-722
Lin Hai , Tsinghua University, Beijing, China
Yang Huazhong , Tsinghua University, Beijing, China
Luo Rong , Tsinghua University, Beijing, China
Wang Yu , Tsinghua University, Beijing, China
pp. 723-728
Behnam Amelifard , University of Southern California
Massoud Pedram , University of Southern California
Farzan Fallah , Fujitsu Labs of America, Sunnyvale, CA
pp. 729-734
Akhilesh Kumar , University of Waterloo, ON, Canada
Mohab Anis , University of Waterloo, ON, Canada
pp. 735-740
Changwoo Kang , University of Southern California
Massoud Pedram , University of Southern California
pp. 741-746
Andrew B. Kahng , ECE and CSE UC San Diego
Swamy Muddu , ECE UC San Diego
Puneet Sharma , ECE UC San Diego
pp. 747-754
Session 6B.: System Level Designs and Reliability Models
Bin Zhang , University of Texas
Michael Orshansky , University of Texas
pp. 755-760
Lee Barford , Agilent Laboratories, Palo Alto, CA
pp. 761-768
Bhaskar J. Karmakar , DSP Systems, Texas Instruments, Bangalore, India.
R. Venkatraman , DSP Systems, Texas Instruments, Bangalore, India.
Jagdish C. Rao , DSP Systems, Texas Instruments, Bangalore, India.
pp. 769-774
S. Srinivasan , Pennsylvania State University
N. Vijaykrishnan , Pennsylvania State University
N. Dhanwada , IBM Electronic Design Automation Systems and Technology Group
pp. 775-780
Riad Ben Mouhoub , ENSTA 32, Bvd Victor, Paris, FRANCE
Omar Hammami , ENSTA 32, Bvd Victor, Paris, FRANCE
pp. 781-788
Session 6C.: Modeling for DFM
Artur Balasinski , Cypress Semiconductor, San Jose, CA
pp. 789-794
Binu Abraham , Texas Instruments Inc., Dallas, TX
Usha Narasimha , Texas Instruments Inc., Dallas, TX
pp. 795-800
Y. Mahotin , Synopsys Inc, California, USA
X. Lin , Synopsys Inc, California, USA
V. Moroz , Synopsys Inc, California, USA
L. Smith , Synopsys Inc, California, USA
S. Krishnamurthy , Synopsys Inc, California, USA
L. Bomholt , Synopsys Inc, California, USA
D. Pramanik , Synopsys Inc, California, USA
pp. 801-806
Lee Smith , Synopsys, Inc., Mountain View, CA
Victor Moroz , Synopsys, Inc., Mountain View, CA
Dipu Pramanik , Synopsys, Inc., Mountain View, CA
Greg Rollins , Synopsys, Inc., Mountain View, CA
pp. 807-812
Peter Wright , Synopsys Corporation, Mountain View, CA
Minghui Fan , Synopsys Corporation, Mountain View, CA
pp. 813-817
Author Index
Author Index (PDF)
pp. 818
ISQED 2007 Call for Papers
pp. 821
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