ISBN: 0-7695-2523-7

Rajiv Joshi, IBM T J Watson Research Center, NY

Kaustav Banerjee, University of California, Santa Barbara, CA

Andre DeHon, California Institute of Technology, Pasadena, CA

Keith Bowman, Intel Corporation

Michael Orshansky, University of Texas-Austin

Sachin S. Sapatnekar, University of Minnesota

Mike Santarini, EDN magazine

Pallab Chatterjee, SiliconMap

Risto Suoranta, Nokia

T. Furuyama, Toshiba

Di Ma, TSMC

Praveen Ghanta, Arizona State University, Tempe.

Sarma Vrudhula, CSE, Arizona State University, Tempe.

Evelyn Grossar, IMEC,Kapeldreef , Leuven, Belgium

Michele Stucchi, IMEC,Kapeldreef , Leuven, Belgium

Karen Maex, IMEC,Kapeldreef , Leuven, Belgium

Wim Dehaene, K.U.Leuven, ESAT, Kasteelpark Arenberg 10,B-3001 Leuven, Belgium

Zhiyu Liu, University of Wisconsin - Madison

Volkan Kursun, University of Wisconsin - Madison

Andrew B. Kahng, UC San Diego, La Jolla, CA

Bao Liu, UC San Diego, La Jolla, CA

Xu Xu, UC San Diego, La Jolla, CA

Zhuo Feng, Texas A&M University

Peng Li, Texas A&M University

Jiang Hu, Texas A&M University

Miroslav N. Velev, Miroslav Velev

Giuseppe Di Guglielmo, Universita di Verona ,Verona, Italy

Franco Fummi, Universita di Verona ,Verona, Italy

Cristina Marconcini, Universita di Verona ,Verona, Italy

Graziano Pravadelli, Universita di Verona ,Verona, Italy

Indradeep Ghosh, Fujitsu Laboratories of America, Sunnyvale, CA, USA

Mukul R. Prasad, Fujitsu Laboratories of America, Sunnyvale, CA, USA

C Karfa, Indian Institute of Technology, Kharagpur, India

C Mandal, Indian Institute of Technology, Kharagpur, India

D Sarkar, Indian Institute of Technology, Kharagpur, India

S R Pentakota, Indian Institute of Technology, Kharagpur, India

Chris Reade

Anand Rajaram, University of Texas at Austin

David Z. Pan, University of Texas at Austin

C. Yeh, Apache Design Sol.

G. Wilke, UFRGS, Brazil

H. Chen, Synopsys, CA, USA

S. Reddy, Fujitsu Laboratories of America, Inc., CA, USA

H. Nguyen, Fujitsu Laboratories of America, Inc., CA, USA

T. Miyoshi, Fujitsu Laboratories of America, Inc., CA, USA

W. Walker, Fujitsu Laboratories of America, Inc., CA, USA

R. Murgai, Fujitsu Laboratories of America, Inc., CA, USA

Narender Hanchate, University of South Florida, Tampa

Nagarajan Ranganathan, University of South Florida, Tampa

W.-L. Hung, Pennsylvania State University, University Park

G.M. Link, Pennsylvania State University, University Park

Yuan Xie, Pennsylvania State University, University Park

N. Vijaykrishnan, Pennsylvania State University, University Park

M. J. Irwin, Pennsylvania State University, University Park

Mike Keating, Synopsys

Y. S. Chauhan, Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland

C. Anghel, Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland

F. Krummenacher, Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland

R. Gillon, AMI Semiconductor, Belgium

A. Baguenier, 3Cadence Design Systems, France

Jin He, Peking University, Beijing, P.R.China

Xing Zhang, Peking University, Beijing, P.R.China

Ganggang Zhang, Peking University, Beijing, P.R.China

Mansun Chan, Hong Kong University of Science & Technology

Yangyuan Wang, Peking University, Beijing, China

Brian Swahn, Tufts University, Medford, MA

Soha Hassoun, Tufts University, Medford, MA

Jin He, Peking University, Beijing, China

Xing Zhang, Peking University, Beijing, China

Ganggang Zhang, Peking University, Beijing, China

Yangyuan Wang, Peking University, Beijing, .China

Chong Zhao, University of California at San Diego

Sujit Dey, University of California at San Diego

Soheil Ghiasi, University of California, Davis

Po-Kuan Huang, University of California, Davis

Jindrich Zejda, Synopsys, Mountain View, CA

Li Ding, Synopsys, Mountain View, CA

Nahmsuk Oh, Synopsys Inc., 700 E. Middlefield Road, Mountain View, CA

Li Ding, Synopsys Inc., 700 E. Middlefield Road, Mountain View, CA

Alireza Kasnavi, Synopsys Inc., 700 E. Middlefield Road, Mountain View, CA

Emre Salman, University of Rochester

Eby G. Friedman, University of Rochester

Ali Dasdan, Synopsys, Inc., Mountain View, CA

Feroze Taraporevala, Synopsys, Inc., Mountain View, CA

Kayhan Kucukcakar, Synopsys, Inc., Mountain View, CA

Deniz Dal, Syracuse University

Adrian Nunez, Syracuse University

Nazanin Mansouri, Syracuse University

Andrew Havlir, University of Texas at Austin

David Z. Pan, University of Texas at Austin

Fadi J. Kurdahi, University of California, Irvine

Ahmed M. Eltawil, University of California, Irvine

Young-Hwan Park, University of California, Irvine

Rouwaida N. Kanj, IBM Austin Research Labs

Sani R. Nassif, IBM Austin Research Labs

Young-Gu Kim, CAE Team, Semiconductor R&D Center

Sang-Hoon Lee, CAE Team, Semiconductor R&D Center

Dae-Han Kim, CAE Team, Semiconductor R&D Center

Dae-Han Kim, Flash Team, SRAM/Flash Product & Technology, Samsung

Jae-Woo Im, Flash Team, SRAM/Flash Product & Technology, Samsung

Sung-Eun Yu, CAE Team, Semiconductor R&D Center

Dae-Wook Kim, CAE Team, Semiconductor R&D Center

Young-Kwan Park, CAE Team, Semiconductor R&D Center

Jeong-Taek Kong, CAE Team, Semiconductor R&D Center

R. Venkatraman, LSI Logic Corporation, Milpitas, CA

R. Castagnetti, LSI Logic Corporation, Milpitas, CA

S. Ramesh, LSI Logic Corporation, Milpitas, CA

Makoto Sugihara, ISIT, 2-1-22 Momochihama, Sawara-ku, Fukuoka, Japan

Tohru Ishihara, Kyushu Univ., Fukuoka, Japan

Masanori Muroyama, Kyushu Univ., Fukuoka, Japan

Koji Hashimoto, Fukuoka Univ.,Fukuoka, Japan

Praveen Elakkumanan, University at Buffalo

Jente B Kuang, University at Buffalo IBM Austin Research Lab

Kevin Nowka, University at Buffalo IBM Austin Research Lab

Ramalingam Sridhar, University at Buffalo IBM Austin Research Lab

Rouwaida Kanj, University at Buffalo IBM Austin Research Lab

Sani Nassif, University at Buffalo IBM Austin Research Lab

Sanjay V. Kumar, University of Minnesota, Minneapolis

Chris H. Kim, University of Minnesota, Minneapolis

Sachin S. Sapatnekar, University of Minnesota, Minneapolis

Krishna Raghuraman, Southern Illinois University, Carbondale, IL

Haibo Wang, Southern Illinois University, Carbondale, IL

Spyros Tragoudas, Southern Illinois University, Carbondale, IL

Kaiping Zeng, Darmstadt University of Technology, Germany

Sorin A. Huss, Darmstadt University of Technology, Germany

Yi-Le Huang, National Tsing-Hua University, China

Chun-Yao Wang, National Tsing-Hua University, China

Richard Yeh, SpringSoft, Inc., Taiwan

Shih-Chieh Chang, National Tsing-Hua University, China

Yung-Chih Chen, National Tsing-Hua University, China

Xinjie Wei, Tsinghua University, China

Yici Cai, Tsinghua University, China

Xianlong Hong, Tsinghua University, China

Qikai Chen, Purdue University, IN, USA

Mesut Meterelliyoz, Purdue University, IN, USA

Kaushik Roy, Purdue University, IN, USA

Rasit Onur Topaloglu, University of California at San Diego

Peng Li, Texas A&M University, College Station, TX

C. Tabery, Advanced Micro Devices, One AMD Place, Sunnyvale, CA

M. Craig, Advanced Micro Devices, One AMD Place, Sunnyvale, CA

G. Burbach, Advanced Micro Devices, One AMD Place, Sunnyvale, CA

B. Wagner, Advanced Micro Devices, One AMD Place, Sunnyvale, CA

S. McGowan, Advanced Micro Devices, One AMD Place, Sunnyvale, CA

P. Etter, Advanced Micro Devices, One AMD Place, Sunnyvale, CA

S. Roling, Advanced Micro Devices, One AMD Place, Sunnyvale, CA

C. Haidinyak, Advanced Micro Devices, One AMD Place, Sunnyvale, CA

E. Ehrichs, Advanced Micro Devices, One AMD Place, Sunnyvale, CA

Xiongfei Meng, University of British Columbia, Canada

Resve Saleh, University of British Columbia, Canada

Karim Arabi, MC-Sierra, Inc., BC, Canada

Jeffrey Fan, University of California, Riverside

I-Fan Liao, University of California, Riverside

X.-D Sheldon, University of California, Riverside

Yici Cai, Tsinghua University, Beijing, China

Xianlong Hong, Tsinghua University, Beijing, China

Seongkyun Shin, Hanyang Univ. Korea, S. Korea

Yungseon Eo, Hanyang Univ. Korea, S. Korea

K. Srinivasan, Georgia Institute of Technology

P. Muthana, Georgia Institute of Technology

R. Mandrekar, Georgia Institute of Technology

E. Engin, Georgia Institute of Technology

J. Choi, Georgia Institute of Technology

M. Swaminathan, Georgia Institute of Technology

Cheng Zhuo, Zhejiang University, Hangzhou, China

Jiang Hu, Texas A&M University, College Station, TX

Kangsheng Chen, Zhejiang University, Hangzhou, China

Miroslav N. Velev, Miroslav N. Velev

Arkan Abdulrahman, Southern Illinois University, Carbondale

Spyros Tragoudas, Southern Illinois University, Carbondale

Debjit Sinha, EECS, Northwestern University, Evanston, IL

Hai Zhou, EECS, Northwestern University, Evanston, IL

Narendra V. Shenoy, ATG, Synopsys Inc., Mountain View, CA

Ali Bastani, Columbia University

Charles A. Zukowski, Columbia University

Zhiyu Liu, University of Wisconsin, Madison

Volkan Kursun, University of Wisconsin, Madison

Randy Bach, LSI Logic Inc., 1621 Barber Lane, Milpitas CA, USA

Bob Davis, LSI Logic Inc., 1621 Barber Lane, Milpitas CA, USA

Rich Laubhan, LSI Logic Inc., 1621 Barber Lane, Milpitas CA, USA

S. Baloch, Institute for System Level Integration, Alba Centre, Alba Campus, Livingston, EH54 7EG, UK

T. Arslan, University of Edinburgh, Kings Buildings, Edinburgh,EH9 3JL, UK

A. Stoica, Jet Propulsion Laboratory, NASA, 4800 Oak Grove Drive Pasadena, CA

Jean-Marc Philippe, CEA-List DRT/DTSI/SARC/LCEI, France

S?ebastien Pillement, University of Rennes (ENSSAT), Lannion, France

Olivier Sentieys, University of Rennes (ENSSAT), Lannion, France

Jia Wang, Northwestern University Evanston, IL

Hai Zhou, Northwestern University Evanston, IL

Ping-Chih Wu, Cadence Design Systems Inc., San Jose, CA

Zile Wei, University of California at Berkeley, CA

Donald Chai, University of California at Berkeley, CA

A. Richard Newton, University of California at Berkeley, CA

Andreas Kuehlmann, Cadence Berkeley Labs, Berkeley, CA, USA

Krishnan Srinivasan, Arizona State University, Tempe, AZ

Karam S. Chatha, Arizona State University, Tempe, AZ

Praveen Bhojwani, Texas A&M University, College Station, Texas

Rabi N. Mahapatra, Texas A&M University, College Station, Texas

Vyas Krishnan, University of South Florida,Tampa

Srinivas Katkoori, University of South Florida,Tampa

Takeshi Matsumoto, Electronics Engineering, University of Tokyo

Hiroshi Saito, VLSI Design and Education Center, University of Tokyo

Masahiro Fujita, University of Aizu

C. Sanz, Universidad Complutense, 28040 Madrid, Spain

M. Prieto, Universidad Complutense, Madrid, Spain

A. Papanikolaou, IMEC v.z.w, Leuven, Belgium

M. Miranda, IMEC v.z.w, Leuven, Belgium

F. Catthoor, IMEC v.z.w, Leuven, Belgium

Biye Wang, San Jose State University

Lili He, San Jose State University

Morris Jones, San Jose State University

J. Balachandran, Microwave and RF Systems Group, IMEC vzw, Kapeldreef 75, 3001, Leuven, Belgium

S. Brebels, Microwave and RF Systems Group, IMEC vzw, Kapeldreef 75, 3001, Leuven, Belgium

G. Carchon, Microwave and RF Systems Group, IMEC vzw, Kapeldreef 75, 3001, Leuven, Belgium

W.De Raedt, Microwave and RF Systems Group, IMEC vzw, Kapeldreef 75, 3001, Leuven, Belgium

E. Beyne, Microwave and RF Systems Group, IMEC vzw, Kapeldreef 75, 3001, Leuven, Belgium

M. Kuijk, Vrije Universiteit Brussel,ETRO, Pleinlaan 2,1050 Brussel, Belgium

B. Nauwelaers, Katholieke Universiteit Leuven, ESAT, Kasteelpark Arenberg 10, 3001 Leuven, Belgium.

Yuichi Tanji, Kagawa University, Japan

Takayuki Watanabe, University of Shizuoka, Japan

Hidemasa Kubota, Shizuoka University, Japan

Hideki Asai, Shizuoka University, Japan

Min Chen, Arizona State University

Yu Cao, Arizona State University

Rohit Singhal, Texas A & M University, College Station, TX

Gwan S. Choi, Texas A & M University, College Station, TX

Rabi Mahapatra, Texas A & M University, College Station, TX

Pu Liu, University of California, Riverside

Sheldon X.-D. Tan, University of California, Riverside

Bruce McGaughy, Cadence Design Systems Inc., San Jose, CA

Lifeng Wu, Cadence Design Systems Inc., San Jose, CA

Taeyong Je, Hanynag Univ., Ansan, Kyunggi-do, Korea

Yungseon Eo, Hanynag Univ., Ansan, Kyunggi-do, Korea

Maged Ghoneima, Northwestern University

Yehea Ismail, Northwestern University

Muhammad Khellah, Circuit Research Lab, Intel Corporation

Vivek De, Circuit Research Lab, Intel Corporation

E. Kalligeros, University of Ioannina, 45110 Ioannina, Greece

X. Kavousianos, University of Ioannina, 45110 Ioannina, Greece

D. Nikolos, Computer Engineering & Informatics Dept., University of Patras, 26500 Patras, Greece

Rajsekhar Adapa, Southern Illinois University Carbondale

Spyros Tragoudas, Southern Illinois University Carbondale

Maria K Michael, University of Cyprus

Yu Huang, Mentor Graphics Corporation,

Li-Chung Hsu, SpringSoft, Inc., Hsinchu, Taiwan

Hung-Ming Chen, National Chiao Tung University, Hsinchu, Taiwan

E. Flanigan, Southern Illinois University at Carbondale

T. Haniotakis, Southern Illinois University at Carbondale

S. Tragoudas, Southern Illinois University at Carbondale

Vishal J. Mehta, UC, Santa Barbara,CA

Malgorzata Marek-Sadowska, UC, Santa Barbara,CA

Zhiyuan Wang, Cisco Systems Inc., San Jose, CA

Kun-Han Tsai, Mentor Graphics Corporation, Wilsonville, OR

Janusz Rajski, Mentor Graphics Corporation, Wilsonville, OR

Jeanne Bickford, IBM Microelectronics, Burlington, VT, USA

Jason Hibbeler, IBM Microelectronics, Burlington, VT, USA

Markus Buhler, IBM Deutschland Entwicklung GmbH, Boblingen, Germany

Jurgen Koehl, IBM Deutschland Entwicklung GmbH, Boblingen, Germany

Dirk Muller3, University of Bonn, Germany

Sven Peyer, University of Bonn, Germany

Christian Schulte, University of Bonn, Germany

Takumi Uezono, Tokyo Institute of Technology

Kenichi Okada, Tokyo Institute of Technology

Kazuya Masu, Tokyo Institute of Technology

Lawrence S. III Melvin, Synopsys, Inc.

Daniel N. Zhang, Synopsys, Inc.

Kirk J. Strozewski, Synopsys, Inc.

Skye Wolfer, Synopsys, Inc.

Robert Aitken, ARM Physical IP, Inc., Sunnyvale, CA, USA

Arnaud Epinat, STMicroelectronics

N. Vijayaraghavan, STMicroelectronics

Matthieu Sautier, STMicroelectronics

Olivier Callen, STMicroelectronics

Sebastien Fabre, Philips Semiconductors

Ryan Ross, Freescale Semiconductor - Crolles2 Alliance Crolles, France

Paul Simon, Philips Semiconductors

Robin Wilson, STMicroelectronics

Hsin-Chyh Hsu, Institute of Electronics, National Chiao-Tung University, Taiwan

Ming-Dou Ker, Institute of Electronics, National Chiao-Tung University, Taiwan

Ron Wilson, EDN

David Overhauser, David Overhauser

Raul Camposano, Synopsys

Changhyun Kim, Samsung

H.-S. Philip Wong, Stanford University

Adam Matthews, University of Arkansas

Qingqi Dou, University of Texas at Austin

Jacob A. Abraham, University of Texas at Austin

Amit Laknaur, Southern Illinois University, Carbondale, IL

Haibo Wang, Southern Illinois University, Carbondale, IL

Daniela De Venuto, Politecnico di Bari, Italy

Leonardo Reyneri, Politecnico di Torino, Italy

J. L. Catalano, Universidad Tecnologica Nacional, Argentina

G. Peretti, Universidad Tecnologica Nacional, Argentina

E. Romero, Universidad Tecnologica Nacional, Argentina

C. Marques, Universidad Nacional de Cordoba, Medina Allende y Haya de Torre, Cordoba

Ozcan Ozturk, Pennsylvania State University

Mahmut Kandemir, Pennsylvania State University

Minh Q. Do, Chalmers University of Technology, Sweden

Mindaugas Dra?zd?ziulis, Chalmers University of Technology, Sweden

Per Larsson-Edefors, Chalmers University of Technology, Sweden

Lars Bengtsson, Chalmers University of Technology, Sweden

Saraju P. Mohanty, University of North Texas, Denton, TX

Ramakrishna Velagapudi, University of North Texas, Denton, TX

Elias Kougianos, University of North Texas, Denton, TX

Sri Hari Krishna Narayanan, Pennsylvania State University

Mahmut Kandemir, Pennsylvania State University

Ozcan Ozturk, Pennsylvania State University

Ozcan Ozturk, Pennsylvania State University

Mahmut Kandemir, Pennsylvania State University

Ibrahim Kolcu, University of Manchester, UK

Wei Zhao, Arizona State University, Tempe, AZ

Yu Cao, Arizona State University, Tempe, AZ

M. Thomas, MEMTEL, LLC.

J. Pathak, MEMTEL, LLC.

J. Payne, MEMTEL, LLC.

F. Leisenberger, Austriamicrosystems, AG

E. Wachmann, Austriamicrosystems, AG

G. Schatzberger, Austriamicrosystems, AG

A. Wiesner, Austriamicrosystems, AG

M. Schrems, Austriamicrosystems, AG

Tai-Xiang Lai, National Chiao-Tung University, Hsinchu, Taiw

Ming-Dou Ker, National Chiao-Tung University, Hsinchu, Taiw

Chung-Kuan Tsai, University of California, Santa Barbara

Malgorzata Marek-Sadowska, University of California, Santa Barbara

Vivek Joshi, Indian Institute of Technology, Kanpur, India

Rajeev R. Rao, University of Michigan, Ann Arbor, MI

David Blaauw, University of Michigan, Ann Arbor, MI

Dennis Sylvester, University of Michigan, Ann Arbor, MI

Praveen Elakkumanan, University at Buffalo

Kishan Prasad, University at Buffalo

Ramalingam Sridhar, University at Buffalo

G. M. Link, Pennsylvania State University

N. Vijaykrishnan, Pennsylvania State University

Kanak Agarwal, IBM Research, Austin, TX

Kevin Nowka, IBM Research, Austin, TX

Harmander Deogun, University of Michigan, Ann Arbor, MI

Dennis Sylvester, University of Michigan, Ann Arbor, MI

Andrew B. Kahng, UC San Diego

Bao Liu, UC San Diego

Sheldon Tan, UC Riverside

Anand Ramalingam, University of Texas, Austin, TX

David Z. Pan, University of Texas, Austin, TX

Frank Liu, IBM Research Division, Austin, TX

Sani R. Nassif, IBM Research Division, Austin, TX

Mark M. Budnik, Purdue University

Kaushik Roy, Purdue University

Anand P. Kulkarni, OASIS Tooling

Thomas J. Grebinski, OASIS Tooling

Sanghamitra Roy, University of Wisconsin-Madison

Charlie Chung-Ping Chen, University of Wisconsin-Madison

Guangyu Sun, Tsinghua University, Beijing, China

Zhiqiang Gao, Tsinghua University, Beijing, China

Yi Xu, Tsinghua University, Beijing, China

Anand P. Kulkarni, OASIS Tooling

Thomas J. Grebinski, OASIS Tooling

Dimitris Kagaris, Southern Illinois University, Carbondale, IL

Themistoklis Haniotakis, Southern Illinois University, Carbondale, IL

Andrew B. Kahng, UCSD CSE and ECE Departments, La Jolla, CA

Kambiz Samadi, UCSD ECE Department, La Jolla, CA

Puneet Sharma, UCSD ECE Department, La Jolla, CA

Karen Chow, Mentor Graphics

Laureline David, STMicroelectronics, France

Stephane Martin, STMicroelectronics, France

Corinne Cregut, STMicroelectronics, France

Eric Balossier, STMicroelectronics, France

Frederic Nyer, STMicroelectronics, France

Fabrice Huret, LEST UMR CNRS 6165 , Brest, France

Changhao Yan, Tsinghua Univ., Beijing , China

Wenjian Yu, Tsinghua Univ., Beijing , China

Zeyi Wang, Tsinghua Univ., Beijing , China

Sarvesh Bhardwaj, Electrical Engineering, Arizona State University, Tempe, AZ

Yu Cao, Electrical Engineering, Arizona State University, Tempe, AZ

Sarma Vrudhula, Computer Science and Engineering, Arizona State University, Tempe, AZ

Wang Yu, Tsinghua University, Beijing, China

Lin Hai, Tsinghua University, Beijing, China

Yang Huazhong, Tsinghua University, Beijing, China

Luo Rong, Tsinghua University, Beijing, China

Wang Hui, Tsinghua University, Beijing, China

Behnam Amelifard, University of Southern California

Massoud Pedram, University of Southern California

Farzan Fallah, Fujitsu Labs of America, Sunnyvale, CA

Akhilesh Kumar, University of Waterloo, ON, Canada

Mohab Anis, University of Waterloo, ON, Canada

Chanseok Hwang, University of Southern California

Changwoo Kang, University of Southern California

Massoud Pedram, University of Southern California

Andrew B. Kahng, ECE and CSE UC San Diego

Swamy Muddu, ECE UC San Diego

Puneet Sharma, ECE UC San Diego

Bin Zhang, University of Texas

Wei-Shen Wang, University of Texas

Michael Orshansky, University of Texas

Lee Barford, Agilent Laboratories, Palo Alto, CA

Bhaskar J. Karmakar, DSP Systems, Texas Instruments, Bangalore, India.

V. Kalyana Chakravarty, DSP Systems, Texas Instruments, Bangalore, India.

R. Venkatraman, DSP Systems, Texas Instruments, Bangalore, India.

Jagdish C. Rao, DSP Systems, Texas Instruments, Bangalore, India.

I.-C. Lin, Pennsylvania State University

S. Srinivasan, Pennsylvania State University

N. Vijaykrishnan, Pennsylvania State University

N. Dhanwada, IBM Electronic Design Automation Systems and Technology Group

Riad Ben Mouhoub, ENSTA 32, Bvd Victor, Paris, FRANCE

Omar Hammami, ENSTA 32, Bvd Victor, Paris, FRANCE

Artur Balasinski, Cypress Semiconductor, San Jose, CA

Usha Narasimha, Texas Instruments Inc., Dallas, TX

Binu Abraham, Texas Instruments Inc., Dallas, TX

Nagaraj NS, Texas Instruments Inc., Dallas, TX

S. Tirumala, Synopsys Inc, California, USA

Y. Mahotin, Synopsys Inc, California, USA

X. Lin, Synopsys Inc, California, USA

V. Moroz, Synopsys Inc, California, USA

L. Smith, Synopsys Inc, California, USA

S. Krishnamurthy, Synopsys Inc, California, USA

L. Bomholt, Synopsys Inc, California, USA

D. Pramanik, Synopsys Inc, California, USA

Victor Moroz, Synopsys, Inc., Mountain View, CA

Lee Smith, Synopsys, Inc., Mountain View, CA

Xi-Wei Lin, Synopsys, Inc., Mountain View, CA

Dipu Pramanik, Synopsys, Inc., Mountain View, CA

Greg Rollins, Synopsys, Inc., Mountain View, CA

Peter Wright, Synopsys Corporation, Mountain View, CA

Minghui Fan, Synopsys Corporation, Mountain View, CA