ISBN: 0-7695-2301-3

John Kibarian, PDF Solutions

Ashok K. Sinha, Applied Materials, Inc

Joe Sawicki, Mentor Graphics

Aaron Ng, The University of Michigan

Igor L. Markov, The University of Michigan

Alex Gyure, Synopsys, Inc., Mountain View, CA

Alireza Kasnavi, Synopsys, Inc., Mountain View, CA

Sam Lo, Synopsys, Inc., Mountain View, CA

Peivand F. Tehrani, Synopsys, Inc., Mountain View, CA

William Shu, Synopsys, Inc., Mountain View, CA

Mahmoud Shahram, Synopsys, Inc., Mountain View, CA

Joddy W. Wang, Synopsys, Inc., Mountain View, CA

Jindrich Zedja, Synopsys, Inc., Mountain View, CA

Qianying Tang, University of Toronto, Canada

Jianwen Zhu, University of Toronto, Canada

Luo Chun, Southeast University, P.R. China

Yang Jun, Southeast University, P.R. China

Shi Longxing, Southeast University, P.R. China

Wu XuFan, Southeast University, P.R. China

Zhang Yu, Southeast University, P.R. China

Dongku Kang, Purdue University, West Lafayette, IN

Yiran Chen, Purdue University, West Lafayette, IN

Kaushik Roy, Purdue University, West Lafayette, IN

Shivakumar Swaminathan, IBM Microelectronics, Research Triangle Park, NC

Sanjay B. Patel, Qualcomm, Research Triangle Park, NC

James Dieffenderfer, Qualcomm, Research Triangle Park, NC

Joel Silberman, IBM Research, Yorktown Heights, NY

Kee-Jong Kim, Purdue University, West Lafayette, IN; LG-Philips LCD, Korea

Chris H. Kim, University of Minnesota, Minneapolis, MN

Kaushik Roy, Purdue University, West Lafayette, IN

David Roberts, University of Michigan, USA

Todd Austin, University of Michigan, USA

David Blauww, University of Michigan, USA

Trevor Mudge, University of Michigan, USA

Kriszti?n Flautner, ARM Ltd., UK

Bhavana Jharia, Indian Institute of Technology, India

S. Sarkar, Indian Institute of Technology, India

R. P. Agarwal, Indian Institute of Technology, India

Afshin Abdollahi, University of Southern California

Farzan Fallah, Fujitsu Labs of America

Massoud Pedram, University of Southern California

Jayakumaran Sivagnaname, The University of Michigan, Ann Arbor, MI

Hung C. Ngo, IBM Austin Research Laboratory, Austin, TX

Kevin J. Nowka, IBM Austin Research Laboratory, Austin, TX

Robert K. Montoye, IBM Austin Research Laboratory, Austin, TX

Richard B. Brown, The University of Michigan, Ann Arbor, MI

Harmander Singh Deogun, University of Michigan, Ann Arbor, MI

Rahul Rao, University of Michigan, Ann Arbor, MI

Dennis Sylvester, University of Michigan, Ann Arbor, MI

Richard Brown, University of Utah, Salt Lake City, UT

Kevin Nowka, Austin Research Laboratories, IBM, Austin, TX

Jin He, University of California, Berkeley, CA

Jane Xi, University of California, Berkeley, CA

Mansun Chan, University of California, Berkeley, CA

Hui Wan, University of California, Berkeley, CA

Mohan Dunga, University of California, Berkeley, CA

Babak Heydari, University of California, Berkeley, CA

Ali M. Niknejad, University of California, Berkeley, CA

Chenming Hu, University of California, Berkeley, CA

Lionel Riviere-Cazaux, Freescale Semiconductor

Kevin Lucas, Freescale Semiconductor

Jon Fitch, Freescale Semiconductor

Carlo Roma, STMicroelectronics, Agrate Brianza, Milan, Italy

Pierluigi Daglio, STMicroelectronics, Agrate Brianza, Milan, Italy

Guido De Sandre, STMicroelectronics, Agrate Brianza, Milan, Italy

Marco Pasotti, STMicroelectronics, Agrate Brianza, Milan, Italy

Marco Poles, STMicroelectronics, Agrate Brianza, Milan, Italy

Mini Nanua, Sun MicroSystems

David Blaauw, University of Michigan

Chanhee Oh, Nascentric Inc.

Jasjeet Kaur, Mentor Graphics Corporation

Arun Shrimali, Texas Instruments India

Anand Venkitachalam, Texas Instruments India

Ravi Arora, Texas Instruments India

C. K. Tang, University of Arkansas, Fayetteville, AR

P. K. Lala, University of Arkansas, Fayetteville, AR

J. P. Parkerson, University of Arkansas, Fayetteville, AR

C. Talarico, University of Arizona, Tucson, AZ

B. Pillilli, University of Arizona, Tucson, AZ

K. L. Vakati, University of Arizona, Tucson, AZ

J. M. Wang, University of Arizona, Tucson, AZ

Zhaojun Wo, University of Massachusetts, Amherst, MA

Israel Koren, University of Massachusetts, Amherst, MA

DiaaEldin Khalil, Ain Shams University, Cairo, Egypt

Mohamed Dessouky, Ain Shams University, Cairo, Egypt

Vincent Bourguet, University of Paris 6, Paris, France

Marie-Minerve Louerat, University of Paris 6, Paris, France

Andreia Cathelin, STMicroelectronics - Central R&D/DAIS, Crolles, France

Hani Ragai, Ain Shams University, Cairo, Egypt

Behnam Amelifard, University of Southern California

Farzan Fallah, Fujitsu Laboratories of America

Massoud Pedram, University of Southern California

Atsushi Kurokawa, Semiconductor Technology Academic Research Center (STARC); Waseda University

Masaharu Yamamoto, Semiconductor Technology Academic Research Center (STARC)

Nobuto Ono, Jedat Innovation Inc.

Tetsuro Kage, Tokyo National College of Technology

Yasuaki Inoue, Waseda University

Hiroo Masuda, Semiconductor Technology Academic Research Center (STARC)

Haixia Gao, Microelectronics Institute, Xidian University, China

Yintang Yang, Microelectronics Institute, Xidian University, China

Xiaohua Ma, Microelectronics Institute, Xidian University, China

Gang Dong, Microelectronics Institute, Xidian University, China

E. Sokolowska, Pultronics Inc.

M. Barszcz, Pultronics Inc.

B. Kaminska, Pultronics Inc.

Yong-Chan Ban, Samsung Electronics Co., Ltd, Korea

Soo-Han Choi, Samsung Electronics Co., Ltd, Korea

Ki-Hung Lee, Samsung Electronics Co., Ltd, Korea

Dong-Hyun Kim, Samsung Electronics Co., Ltd, Korea

Ji-Suk Hong, Samsung Electronics Co., Ltd, Korea

Yoo-Hyon Kim, Samsung Electronics Co., Ltd, Korea

Moon-Hyun Yoo, Samsung Electronics Co., Ltd, Korea

Jeong-Taek Kong, Samsung Electronics Co., Ltd, Korea

Harmander Singh Deogun, University of Michigan, Ann Arbor, MI

Dennis Sylvester, University of Michigan, Ann Arbor, MI

David Blaauw, University of Michigan, Ann Arbor, MI

Hua Xiang, IBM T.J. Watson Research Center, Yorktown Heights, NY

Kai-Yuan Chao, Intel Corporation, Hillsboro, Oregon

Martin D. F. Wong, UIUC, Urbana, IL

J. Huynh, San Jose State University, CA

B. Ngo, San Jose State University, CA

M. Pham, San Jose State University, CA

L. He, San Jose State University, CA

R. Castagnetti, LSI Logic Corporation, Milpitas, CA

R. Venkatraman, LSI Logic Corporation, Milpitas, CA

B. Bartz, LSI Logic Corporation, Milpitas, CA

C. Monzel, LSI Logic Corporation, Milpitas, CA

T. Briscoe, LSI Logic Corporation, Milpitas, CA

A. Teene, LSI Logic Corporation, Milpitas, CA

S. Ramesh, LSI Logic Corporation, Milpitas, CA

Khadija Stewart, Southern Illinois University Carbondale

Themistoklis Haniotakis, Southern Illinois University Carbondale

Spyros Tragoudas, Southern Illinois University Carbondale

M. Welling, Southern Illinois University at Carbondale

S. Tragoudas, Southern Illinois University at Carbondale

H. Wang, Southern Illinois University at Carbondale

Young-Seok Hong, Samsung Electronics Co., Ltd., Korea

Heeseok Lee, Samsung Electronics Co., Ltd., Korea

Joon-Ho Choi, Samsung Electronics Co., Ltd., Korea

Moon-Hyun Yoo, Samsung Electronics Co., Ltd., Korea

Jeong-Taek Kong, Samsung Electronics Co., Ltd., Korea

Yuchun Ma, Tsinghua University, Beijing, China

Xianlong Hong, Tsinghua University, Beijing, China

Sheqin Dong, Tsinghua University, Beijing, China

Song Chen, Tsinghua University, Beijing, China

Chung-Kuan Cheng, University of California, San Diego

Michael Keating, Synopsys, Inc.

E. Kalligeros, University of Patras, Greece; Research Academic Computer Technology Institute, Greece

D. Kaseridis, University of Patras, Greece; Research Academic Computer Technology Institute, Greece

X. Kavousianos, University of Ioannina, Greece

D. Nikolos, University of Patras, Greece; Research Academic Computer Technology Institute, Greece

Th. Haniotakis, Southern Illinois University Carbondale

S. Tragoudas, Southern Illinois University Carbondale

G. Pani, Southern Illinois University Carbondale

Yinhe Han, Chinese Academy of Sciences, Beijing; Graduate School of Chinese Academy of Sciences, Beijing

Yu Hu, Chinese Academy of Sciences, Beijing

Huawei Li, Chinese Academy of Sciences, Beijing; Graduate School of Chinese Academy of Sciences, Beijing

Xiaowei Li, Chinese Academy of Sciences, Beijing; Graduate School of Chinese Academy of Sciences, Beijing

Ahmad A. Al-Yamani, Stanford University, Stanford, CA; LSI Logic Corporation, Milpitas, CA

Edward J. McCluskey, Stanford University, Stanford, CA

Irith Pomeranz, Purdue University, W. Lafayette, IN

Sudhakar M. Reddy, University of Iowa, Iowa City, IA

Xin Wang, Synopsys Inc., Mountain View, CA

Charles C. Chiang, Synopsys Inc., Mountain View, CA

Jamil Kawa, Synopsys Inc., Mountain View, CA

Qing Su, Synopsys Inc., Mountain View, CA

Michel Cote, Synopsys Inc.

Philippe Hurat, Synopsys Inc.

Puneet Gupta, University of California at San Diego

Andrew B. Kahng, University of California at San Diego

Dennis Sylvester, University of Michigan at Ann Arbor

Jie Yang, University of Michigan at Ann Arbor

Jay Jahangiri, Mentor Graphics Corporation

David Abercrombie, Mentor Graphics Corporation

Rahul Rao, University of Michigan, Ann Arbor, MI

Kanak Agarwal, University of Michigan, Ann Arbor, MI

Anirudh Devgan, Austin Research Laboratories, IBM, Austin, TX

Kevin Nowka, Austin Research Laboratories, IBM, Austin, TX

Dennis Sylvester, University of Michigan, Ann Arbor, MI

Richard Brown, University of Utah, Salt Lake City, UT

Dipanjan Sengupta, University of British Columbia, Canada

Resve Saleh, University of British Columbia, Canada

Justin Gregg, Colorado State University, Fort Collins

Tom W. Chen, Colorado State University, Fort Collins

Syed M. Alam, Freescale Semiconductor

Frank L. Wei, Massachusetts Institute of Technology

Chee Lip Gan, Nanyang Technological University

Carl V. Thompson, Massachusetts Institute of Technology

Donald E. Troxel, Massachusetts Institute of Technology

Anat Dahan, IBM Haifa Research Lab, Haifa Israel

Daniel Geist, IBM Haifa Research Lab, Haifa Israel

Leonid Gluhovsky, IBM Haifa Research Lab, Haifa Israel

Dmitry Pidan, IBM Haifa Research Lab, Haifa Israel

Gil Shapir, IBM Haifa Research Lab, Haifa Israel

Yaron Wolfsthal, IBM Haifa Research Lab, Haifa Israel

Lyes Benalycherif, ST Microelectronics, Grenoble, France

Romain Kamdem, ST Microelectronics, Grenoble, France

Younes Lahbib, ST Microelectronics, Grenoble, France

Haihua Yan, Auburn University

Gefu Xu, Auburn University

Adit D. Singh, Auburn University

Nicola Bombieri, Universit? di Verona, Italy

Franco Fummi, Universit? di Verona, Italy

Graziano Pravadelli, Universit? di Verona, Italy

Maria K. Michael, University of Cyprus

Stelios Neophytou, University of Cyprus

Spyros Tragoudas, Southern Illinois University

Mikhail Popovich, University of Rochester, New York

Eby G. Friedman, University of Rochester, New York

Aishwarya Dubey, Texas Instruments (India)

Navin Srivastava, University of California, Santa Barbara, CA

Xiaoning Qi, Sun Microsystems Inc., Sunnyvale, CA

Kaustav Banerjee, University of California, Santa Barbara, CA

Qing K. Zhu, Matrix Semiconductor Inc.

David Ayers, Intel Corporation

Animesh Datta, Purdue University

Swarup Bhunia, Purdue University

Nilanjan Banerjee, Purdue University

Kaushik Roy, Purdue University

S. Tosun, Syracuse University

O. Ozturk, Pennsylvania State University

N. Mansouri, Syracuse University

E. Arvas, Syracuse University

M. Kandemir, Pennsylvania State University

Y. Xie, Pennsylvania State University

W-L. Hung, Pennsylvania State University

Haixia Gao, Xidian University, China

Yintang Yang, Xidian University, China

Xiaohua Ma, Xidian University, China

Gang Dong, Xidian University, China

S. Tosun, Syracuse University

N. Mansouri, Syracuse University

E. Arvas, Syracuse University

M. Kandemir, Pennsylvania State University

Y. Xie, Pennsylvania State University

W-L. Hung, Pennsylvania State University

Xiaojun Li, University of Maryland, College Park

B. Huang, University of Maryland, College Park

J. Qin, University of Maryland, College Park

X. Zhang, University of Maryland, College Park

M. Talmor, University of Maryland, College Park

Z. Gur, University of Maryland, College Park

Joseph B. Bernstein, University of Maryland, College Park

Henry H. Y. Chan, Microelectronics and Computer Systems Laboratory, Canada

Zeljko Zilic, Microelectronics and Computer Systems Laboratory, Canada

Kambiz Rahimi, University of Washington, Seattle

Chris Diorio, University of Washington, Seattle

Masanori Hashimoto, Kyoto University, Japan

Tomonori Yamamoto, Kyoto University, Japan

Hidetoshi Onodera, Kyoto University, Japan

Saibal Mukhopadhyay, Purdue University, West Lafayette, IN

Keunwoo Kim, IBM T. J. Watson Research Center, Yorktown Heights, NY

Jae-Joon Kim, IBM T. J. Watson Research Center, Yorktown Heights, NY

Shih-Hsien Lo, IBM T. J. Watson Research Center, Yorktown Heights, NY

Rajiv V. Joshi, IBM T. J. Watson Research Center, Yorktown Heights, NY

Ching-Te Chuang, IBM T. J. Watson Research Center, Yorktown Heights, NY

Kaushik Roy, Purdue University, West Lafayette, IN

Ananth Somayaji Goda, Texas Instruments India Pvt Ltd, Bangalore, India

Gautam Kapila, Texas Instruments India Pvt Ltd, Bangalore, India

Puneet Gupta, Blaze DFM, Inc., Sunnyvale, CA

Andrew B. Kahng, Blaze DFM, Inc., Sunnyvale, CA; UCSD, La Jolla, CA

Puneet Sharma, UCSD, La Jolla, CA

O. Semenov, University of Waterloo, Canada

H. Sarbishaei, University of Waterloo, Canada

M. Sachdev, University of Waterloo, Canada

Amit Laknaur, Southern Illinois University Carbondale, Carbondale, IL

Haibo Wang, Southern Illinois University Carbondale, Carbondale, IL

Daniela De Venuto, Politecnico di Bari, Italy

Grazia Marchione, Politecnico di Bari, Italy

Leonardo Reyneri, Politecnico di Torino, Italy

L. Dermentzoglou, University of Athens, Greece

Y. Tsiatouhas, University of Ioannina, Greece

A. Arapoyanni, University of Athens, Greece

Swarup Bhunia, Purdue University, West Lafayette, IN

Hamid Mahmoodi, Purdue University, West Lafayette, IN

Debjyoti Ghosh, Purdue University, West Lafayette, IN

Kaushik Roy, Purdue University, West Lafayette, IN

Aki Fujimura, Cadence Design Systems, Inc.

Kurt A. Wolf, TSMC

Bernard Candaele, IC & EDA, Thales, Paris Colombes, France

Jihyun Lee, Northeastern University, Boston, MA

Yong-Bin Kim, Northeastern University, Boston, MA

Yuanzhong (Paul) Zhou, Fairchild Semiconductor, South Portland, ME

Duane Connerney, Fairchild Semiconductor, South Portland, ME

Ronald Carroll, Fairchild Semiconductor, South Portland, ME

Timwah Luk, Fairchild Semiconductor, South Portland, ME

Subhrajit Bhattacharya, IBM T.J. Watson Research Center, Yorktown Heights, NY

John Darringer, IBM T.J. Watson Research Center, Yorktown Heights, NY

Daniel Ostapko, IBM T.J. Watson Research Center, Yorktown Heights, NY

Youngsoo Shin, Korea Advanced Institute of Science and Technology, Republic of Korea

Saibal Mukhopadhyay, Purdue University, West Lafayette, IN

Hamid Mahmoodi, Purdue University, West Lafayette, IN

Kaushik Roy, Purdue University, West Lafayette, IN

Xiaojun Li, University of Maryland, College Park, MD

Joerg D. Walter, University of Maryland, College Park, MD

Joseph B. Bernstein, University of Maryland, College Park, MD

Vishal Gupta, Georgia Institute of Technology, Atlanta, GA

Gabriel A. Rinc?n-Mora, Georgia Institute of Technology, Atlanta, GA

Norman Gunther, Santa Clara University, CA

Emad Hamadeh, Santa Clara University, CA; Applied Micro C. Co. (AMCC), Sunnyvale, CA

Darrell Niemann, Santa Clara University, CA

Iliya Pesic, Santa Clara University, CA; Silvaco International, Santa Clara, CA

Mahmud Rahman, Santa Clara University, CA

Paul Friedberg, University of California, Berkeley, CA

Yu Cao, University of California, Berkeley, CA

Jason Cain, University of California, Berkeley, CA

Ruth Wang, University of California, Berkeley, CA

Jan Rabaey, University of California, Berkeley, CA

Costas Spanos, University of California, Berkeley, CA

Vishak Venkatraman, University of Massachusetts Amherst

Wayne Burleson, University of Massachusetts Amherst

Sreeram Chandrasekar, Texas Instruments India

Gaurav Kumar Varshney, Texas Instruments India

V. Visvanathan, Texas Instruments India

Shahin Nazarian, University of Southern California, Los Angeles, CA

Massoud Pedram, University of Southern California, Los Angeles, CA

Emre Tuncer, Magma Design Automation, Santa Clara, CA

Tao Lin, Magma Design Automation, Santa Clara, CA

Zhenyu Qi, University of California, Riverside

Hang Li, University of California, Riverside

Sheldon X.-D. Tan, University of California, Riverside

Lifeng Wu, Cadence Design Systems Inc. San Jose, CA

Yici Cai, Tsinghua University, Beijing, China

Xianlong Hong, Tsinghua University, Beijing, China

Deepak C. Sekar, Georgia Institute of Technology, Atlanta

Bill McCaffrey, Cadence Design Systems, Inc.

Anru Wang, University of California, Santa Cruz

Wayne Dai, University of California, Santa Cruz

Chung-Seok(Andy) Seo, Georgia Institute of Technology, Atlanta, GA

Abhijit Chatterjee, Georgia Institute of Technology, Atlanta, GA

Nan M. Jokerst, Duke University, Durham, NC

Meigen Shen, Royal Institute of Technology (KTH), Sweden

Li-Rong Zheng, Royal Institute of Technology (KTH), Sweden

Esa Tjukanoff, University of Turku, Finland

Jouni Isoaho, University of Turku, Finland

Hannu Tenhunen, Royal Institute of Technology (KTH), Sweden

Muzhou Shao, Synopsys Inc., Mountain View, CA

Youxin Gao, Synopsys Inc., Mountain View, CA

Li-Pen Yuan, Synopsys Inc., Mountain View, CA

Hung-Ming Chen, National Chiao Tung University, Hsinchu, Taiwan

Martin DF Wong, University of Illinois at Urbana-Champaign, Urbana, IL

Atsushi Kurokawa, STARC; Waseda University

Toshiki Kanamoto, Renesas Technology Corp.

Tetsuya Ibe, Sanyo Electric Corp.

Akira Kasebe, Meitec Corp.

Chang Wei Fong, Cristal Cosmotech Corp.

Tetsuro Kage, Tokyo National College of Technology

Yasuaki Inoue, Waseda University

Hiroo Masuda, STARC

Vinita V. Deodhar, Georgia Institute of Technology, Atlanta

Jeffrey A. Davis, Georgia Institute of Technology, Atlanta

Jiaxing Sun, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China

Yun Zheng, CEC Huada Electronic Design Co., Ltd., Beijing, China

Qing Ye, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China

Tianchun Ye, Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China

Pu Liu, University of California, Riverside, CA

Zhenyu Qi, University of California, Riverside, CA

Sheldon X.-D. Tan, University of California, Riverside, CA

Meng-Chiou Wu, Yuan Ze University, Taiwan

Rung-Bin Lin, Yuan Ze University, Taiwan

Jingyu Xu, Tsinghua Univ., Beijing, China

Xianlong Hong, Tsinghua Univ., Beijing, China

Tong Jing, Tsinghua Univ., Beijing, China

Yang Yang, Tsinghua Univ., Beijing, China

Hua Xiang, IBM T.J. Watson Research Center, Yorktown Heights, NY

I-Min Liu, Cadence Design System, San Jose, CA

Martin D. F. Wong, UIUC, Urbana, IL

Song Chen, Tsinghua Univ. China

Xianlong Hong, Tsinghua Univ. China

Sheqin Dong, Tsinghua Univ. China

Yuchun Ma, Tsinghua Univ. China

Chung-kuan Cheng, Univ. of California, San Diego

W-L. Hung, The Pennsylvania State University, University Park, PA

Y. Xie, The Pennsylvania State University, University Park, PA

N. Vijaykrishnan, The Pennsylvania State University, University Park, PA

C. Addo-Quaye, The Pennsylvania State University, University Park, PA

T. Theocharides, The Pennsylvania State University, University Park, PA

M. J. Irwin, The Pennsylvania State University, University Park, PA

Srinivasa R. Sridhara, University of Illinois at Urbana Champaign

Naresh R. Shanbhag, University of Illinois at Urbana Champaign

Ganesh Balamurugan, Intel Corporation, Hillsboro OR

Sani R. Nassif, IBM Austin Research Laboratory, Austin, Texas

Zhuo Li, Texas A&M University, College Station, Texas

Chung-Kuan Tsai, University of California, Santa Barbara

Malgorzata Marek-Sadowska, University of California, Santa Barbara

A. Zahabi, University of Tehran, Tehran, Iran

O. Shoaei, University of Tehran, Tehran, Iran

Y. Koolivand, University of Tehran, Tehran, Iran

Payam Heydari, University of California, Irvine

Dinesh Patil, Stanford University, Stanford, CA

Sunghee Yun, Stanford University, Stanford, CA

Seung-Jean Kim, Stanford University, Stanford, CA

Alvin Cheung, Stanford University, Stanford, CA

Mark Horowitz, Stanford University, Stanford, CA

Stephen Boyd, Stanford University, Stanford, CA

Hao Yu, University of California, Los Angeles

Lei He, University of California, Los Angeles

Wei Ling, Ecole Polytechnique de Montreal, Canada

Yvon Savaria, Ecole Polytechnique de Montreal, Canada

A. Teene, LSI Logic Corporation, Fort Collins, CO

B. Davis, LSI Logic Corporation, Fort Collins, CO

R. Castagnetti, LSI Logic Corporation, Fort Collins, CO

J. Brown, LSI Logic Corporation, Fort Collins, CO

S. Ramesh, LSI Logic Corporation, Fort Collins, CO