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  • 5th International Symposium on Quality Electronic Design (ISQED'04)
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5th International Symposium on Quality Electronic Design (ISQED'04)
San Jose, California
March 22-March 24
ISBN: 0-7695-2093-6
Table of Contents
Introduction
ISQED Tutorials: Compact Modeling and Analysis for Nanometer-Scale CMOS Design
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Andrew B. Kahng, University of California at San Diego
pp. 8
ISQED Panel Discussion EP1
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Plenary Session I
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Session 1A: Physical Design Migration
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Session 1B: CMOS Device and Memory
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Jin He, University of California at Berkeley
Xuemei Xi, University of California at Berkeley
Mansun Chan, Hong Kong University of Science and Technology
Chung-Hsun Lin, University of California at Berkeley
Ali Niknejad, University of California at Berkeley
Chenming Hu, University of California at Berkeley
pp. 45-50
Y. Z. Xu, Cypress Semiconductor
O. Pohland, Cypress Semiconductor
C. Cai, Cypress Semiconductor
H. Puchner, Cypress Semiconductor
pp. 51-54
Huifang Qin, University of California at Berkeley
Yu Cao, University of California at Berkeley
Dejan Markovic, University of California at Berkeley
Andrei Vladimirescu, University of California at Berkeley
Jan Rabaey, University of California at Berkeley
pp. 55-60
Session 1C: Poster Session
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Zhu Pan, Tsinghua University
Yici Cai, Tsinghua University
Sheldon X.-D. Tan, University of California at Riverside
Zuying Luo, Tsinghua University
Xianlong Hong, Tsinghua University
pp. 63-68
Lucanus Simonson, University of California at Los Angeles
King Ho Tam, University of California at Los Angeles
Nataraj Akkiraju, Intel Corporation
Mosur Mohan, Intel Corporation
Lei He, University of California at Los Angeles
pp. 69-74
E. Kursun, University of California at Los Angeles
S. Ghiasi, University of California at Los Angeles
M. Sarrafzadeh, University of California at Los Angeles
pp. 116-121
Sunil Yu, Santa Clara University and KAIST
Dusan M. Petranovic, Mentor Graphics Corporation
Shoba Krishnan, Santa Clara University
Kwyro Lee, KAIST
Cary Y. Yang, Santa Clara University
pp. 122-125
Jong-Eun Koo, Samsung Electronics Co., Ltd.
Kyung-Ho Lee, Samsung Electronics Co., Ltd.
Young-Hoe Cheon, Samsung Electronics Co., Ltd.
Joon-Ho Choi, Samsung Electronics Co., Ltd.
Moon-Hyun Yoo, Samsung Electronics Co., Ltd.
Jeong-Taek Kong, Samsung Electronics Co., Ltd.
pp. 137-142
M. Moiz Khan, Southern Illinois University
Spyros Tragoudas, Southern Illinois University
pp. 143-148
ISQED Luncheon Speech
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Session 2A: Topics in Printability
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Frank E. Gennari, University of California at Berkeley
Andrew R. Neureuther, University of California at Berkeley
pp. 165-170
Session 2B: Package Design and Interaction
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Lalitha Immaneni, Intel Corporation
Anju Kapur, Intel Corporation
Brett Neal, Intel Corporation
pp. 179-183
Meigen Shen, Royal Institute of Technology
Li-Rong Zheng, Royal Institute of Technology
Hannu Tenhunen, Royal Institute of Technology
pp. 184-189
Janet Wang, University of Arizona at Tucson
Kishore Kumar Muchherla, University of Arizona at Tucson
Jai Ganesh Kumar, University of Arizona at Tucson
pp. 196-201
Session 2C: Test Generation and Application
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M. Bellos, University of Patras and Research Academic Computer Technology Institute
D. Bakalis, University of Patras and Research Academic Computer Technology Institute
D. Nikolos, University of Patras and Research Academic Computer Technology Institute
X. Kavousianos, University of Ioannina
pp. 205-210
J. Sosa, University of Las Palmas de Gran Canaria
Juan A. Montiel-Nelson, University of Las Palmas de Gran Canaria
H. Navarro, University of Las Palmas de Gran Canaria
José C. García, University of Las Palmas de Gran Canaria
pp. 217-222
Session 3A: Modeling and Simulations of Electromigration and Eletromagnetic Effect
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Syed M. Alam, Massachusetts Institute of Technology
Gan Chee Lip, Nanyang Technological University
Carl V. Thompson, Massachusetts Institute of Technology
Donald E. Troxel, Massachusetts Institute of Technology
pp. 238-243
Pavel V. Nikitin, University of Washington
Vikram Jandhyala, University of Washington
Daniel White, Lawrence Livermore National Laboratory
Nathan Champagne, Lawrence Livermore National Laboratory
John D. Rockway, Lawrence Livermore National Laboratory
C.-J. Richard Shi, University of Washington
Chuanyi Yang, University of Washington
Yong Wang, University of Washington
Gong Ouyang, University of Washington
Rob Sharpe, Lawrence Livermore National Laboratory
John W. Rockway, Space and Naval Warfare Systems Command
pp. 244-249
Session 3B: Interconnect: Capacitance Extraction and Delay Calculation
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Anirban Basu, University of California at Santa Barbara
Sheng-Chih Lin, University of California at Santa Barbara
Christoph Wasshuber, Texas Instruments
Adrian M. Ionescu, Swiss Federal Institute of Technology
Kaustav Banerjee, University of California at Santa Barbara
pp. 259-264
Y. Qu?r?, Universit? de Bretagne
T. LeGouguec, Universit? de Bretagne
P.M. Martin, Universit? de Bretagne
F. Huret, Universit? de Bretagne
pp. 265-270
Ye Liu, Shanghai Jiao Tong University
Mei Xue, Shanghai Jiao Tong University
Zheng-Fan Li, Shanghai Jiao Tong University
Rui-Feng Xue, Shanghai Jiao Tong University
pp. 271-275
Xiang Lu, Texas A&M University
Zhuo Li, Texas A&M University
Wangqi Qiu, Texas A&M University
D. M. H. Walker, Texas A&M University
Weiping Shi, Texas A&M University
pp. 276-280
Session 3C: Substrate Noise: Analysis and Prevention
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Meng-Fan Chang, National Chiao Tung University
Kuei-Ann Wen, National Chiao Tung University
Ding-Ming Kwai, Intellectual Property Library Company
pp. 297-302
ISQED Panel Discussion EP2
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Plenary Session II
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Session 4A: Interconnect Delay and Coupling
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Cristian Grecu, University of British Columbia
Partha Pratim Pande, University of British Columbia
Andr? Ivanov, University of British Columbia
Res Saleh, University of British Columbia
pp. 343-348
Session 4B: Analysis of Variations
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Session 4C: Layout and Design Techniques for Quality and Reliability
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Session 5A: Analog Testing
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Session 5B: Low Power Design
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Man L Mui, University of Illinois at Urbana-Champaign
Kaustav Banerjee, University of California at Santa Barbara
Amit Mehrotra, University of Illinois at Urbana-Champaign
pp. 409-414
Ge Yang, University of California at Santa Cruz
Zhongda Wang, University of California at Santa Cruz
Sung-Mo Kang, University of California at Santa Cruz
pp. 421-424
Session 5C: ESD
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Sachio Hayashi, Toshiba Corporation Semiconductor Company
Fumihiro Minami, Toshiba Corporation Semiconductor Company
Masaaki Yamada, Toshiba Microelectronics Corporation
pp. 439-444
Session 6A: DFM Design Techniques
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Hans-J? Brand, AMD Saxony LLC & Co. KG
Steffen R?, Fraunhofer Institute for Integrated Circuits/EAS, Zeunerstr
Martin Radetzki, sci-worx GmbH
pp. 478-482
Session 6B: Delay Test Issues
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Zhiyuan Wang, University of California at Santa Barbara
Malgorzata Marek-Sadowska, University of California at Santa Barbara
Kun-Han Tsai, Mentor Graphics Corporation
Janusz Rajski, Mentor Graphics Corporation
pp. 485-490
Saravanan Padmanaban, University of Maryland Baltimore County
Spyros Tragoudas, Southern Illinois University
pp. 491-496
V. Degalahal, Pennsylvania State University
R. Ramanarayanan, Pennsylvania State University
N. Vijaykrishnan, Pennsylvania State University
Y. Xie, Pennsylvania State University
M. J. Irwin, Pennsylvania State University
pp. 503-508
Session 6C: Circuit Design Trends in DSM
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Ji Luo, University of Maryland at College Park
Joseph B. Bernstein, University of Maryland at College Park
J. Ari Tuchman, University of Maryland at College Park
Hu Huang, University of Maryland at College Park
Kuan-Jung Chung, University of Maryland at College Park
Anthony L. Wilson, Mission Research Corporation
pp. 522-527
Backmatter
Author Index (PDF)
pp. 541-543
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