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Quality Electronic Design, International Symposium on (2002)
San Jose, California
Mar. 18, 2002 to Mar. 21, 2002
ISBN: 0-7695-1561-4
TABLE OF CONTENTS
pp. xv
Tutorial Track A: Test Methodologies for Quality Designs: Chair and Moderator: Yervant Zorian, LogicVision
Tutorial Track B: Design for Reliability in UDSM: Issues and Solutions: Chair and Moderator: Ken Shepard, Columbia University
Tutorial Track C: Interconnect and Device Modeling for Quality Design: Chair and Moderator: Amit Mehrotra, University of Illinois, Urbana
Tutorial Track D: Design Flows and Methodologies: Chair and Moderator: Resve Saleh, University of British Columbia
Plenary Session I: Co-Chairs: Resve Saleh, ISQED Conference Chair, University of British Columbia
Session 1A: Interconnect Extraction and Modeling: Co-Chairs:Rajendran Panda, Motorola
Rafael Reif , Massachusetts Institute of Technology
Andy Fan , Massachusetts Institute of Technology
Kuan-Neng Chen , Massachusetts Institute of Technology
Shamik Das , Massachusetts Institute of Technology
pp. 33
Vikram Jandhyala , University of Washington
Yong Wang , University of Washington
Dipanjan Gope , University of Washington
Richard Shi , University of Washington
pp. 38
Kaustav Banerjee , Stanford University
Amit Mehrotra , University of Illinois at Urbana-Champaign
pp. 43
Gaofeng Wang , Intpax Inc.
Xiaoning Qi , Sun Microsystems
Zhiping Yu , Stanford University
Robert W. Dutton , Stanford University
pp. 48
Himanshu Kaul , University of Michigan
Dennis Sylvester , University of Michigan
pp. 53
Session 1B: Quality and Interoperability of EDA Tools: Co-Chairs: Tom Chen, Colorado State University
R. Seepold , Forschungszentrum Informatik
N. Martínez Madrid , Forschungszentrum Informatik
A. Vörg , Forschungszentrum Informatik
W. Rosenstiel , University of T?bingen
M. Radetzki , sci-worx GmbH
P. Neumann , sci-worx GmbH
J. Haase , sci-worx GmbH
pp. 75
Session 1C: Design for Test: Co-Chairs: George Alexiou, University of Patras, Greece
Y. Tsiatouhas , ISD S.A.
Th. Haniotakis , Southern Illinois University
D. Nicolos , University of Patras
A. Arapoyanni , University of Athens
pp. 100
D. de Venuto , Politecnico di Bari
M. J. Ohletz , Alcatel Microelectronics
B. Riccò , Universit? di Bologna
pp. 112
F. Corno , Politecnico di Torino
G. Cumani , Politecnico di Torino
M. Sonza Reorda , Politecnico di Torino
G. Squillero , Politecnico di Torino
pp. 120
Session 2A: Design for Process Variations: Co-Chairs: Lukas van Ginneken, Magma Design
Session 2B: Power, Signal and EMI Analysis and Optimization: Co-Chairs: Amit Narayan, EDA Consultant
Kenji Shimazaki , Matsushita Electric Industrial Co., Ltd
Shouzou Hirano , Matsushita Electric Industrial Co., Ltd
Hiroyuki Tsujikawa , Matsushita Electric Industrial Co., Ltd
pp. 169
Session 2C: Methods and Metrics for Design Quality: Co-Chairs: Tak Young, Monterey Design
Andrew B. Kahng , University of California at San Diego
Gary Smith , Gartner Dataquest, Inc.
pp. 190
Martin Saint-Laurent , Intel Corporation
Vojin G. Oklobdzija , University of California at Davis
Simon S. Singh , National Semiconductor Corporation
Madhavan Swaminathan , Georgia Institute of Technology
pp. 194
J.M. Gilbert , University of Hull
I.M. Bell , University of Hull
D.R. Johnson , University of Hull
pp. 200
Andrew B. Kahng , University of California at San Diego
Stefanus Mantik , University of California at Los Angeles
pp. 206
Siva Narendra , Intel Corporation
Vivek De , Intel Corporation
Ron Wilson , ISD magazine
pp. 213
Plenary Session II: Co-Chairs: Kris Verma, ISQED Plenary Committee Chair, Seagate Technology
Poster Session: Co-Chairs: Enrico Malavasi, PDF Solutions
Aiqun Cao , Purdue University
Naran Sirisantana , Purdue University
Cheng-Kok Koh , Purdue University
Kaushik Roy , Purdue University
pp. 229
Bok-Gue Park , SungKyunKwan University
Koon-Shik Cho , SungKyunKwan University
Jun-Dong Cho , SungKyunKwan University
pp. 235
Dinesh Pamunuwa , Royal Institute of Technology (KTH)
Hannu Tenhunen , Royal Institute of Technology (KTH)
pp. 240
Syed M. Alam , Massachusetts Institute of Technology
Donald E. Troxel , Massachusetts Institute of Technology
Carl V. Thompson , Massachusetts Institute of Technology
pp. 246
Zhuo Gao , University of Maryland at College Park
Ji Luo , University of Maryland at College Park
Hu Huang , University of Maryland at College Park
Wei Zhang , University of Maryland at College Park
Joseph B. Bernstein , University of Maryland at College Park
pp. 252
Pierre Bricaud , Mentor Graphics Corporation
pp. 257
E. Kalligeros , University of Patras and Computer Technology Institute
X. Kavousianos , University of Patras and Computer Technology Institute
D. Bakalis , University of Patras and Computer Technology Institute
D. Nikolos , University of Patras and Computer Technology Institute
pp. 261
Gert Jervan , Link?ping University
Zebo Peng , Link?ping University
Raimund Ubar , Tallinn Technical University
Helena Kruus , Tallinn Technical University
pp. 273
Kamalnayan Jayaraman , Intel Corp.
Vivekananda M. Vedula , The University of Texas at Austin
Jacob A. Abraham , The University of Texas at Austin
pp. 280
Mandeep Singh , Advanced Micro Devices
Israel Koren , University of Massachusetts at Amherst
pp. 286
P. K. Lala , University of Arkansas
B. Kiran Kumar , University of Arkansas
pp. 292
G. Servel , Laboratoire d'Informatique de Robotique et de Micro?lectronique de Montpellier
D. Deschacht , Laboratoire d'Informatique de Robotique et de Micro?lectronique de Montpellier
F. Saliou , Universit? de Bretagne Occidentale
J.L. Mattei , Universit? de Bretagne Occidentale
F. Huret , Universit? de Bretagne Occidentale
pp. 298
Summit Ghosh , Stevens Institute of Technology
pp. 310
Jin-Kyu Park , SAMSUNG Electronics Co., Ltd.
Keun-Ho Lee , SAMSUNG Electronics Co., Ltd.
Chang-Sub Lee , SAMSUNG Electronics Co., Ltd.
Gi-Young Yang , SAMSUNG Electronics Co., Ltd.
Young-Kwan Park , SAMSUNG Electronics Co., Ltd.
Jeong-Taek Kong , SAMSUNG Electronics Co., Ltd.
pp. 322
Tae-young Oh , Center for Integrated Systems
Zhiping Yu , Center for Integrated Systems
Robert W. Dutton , Center for Integrated Systems
pp. 326
Ming-Dou Ker , National Chiao-Tung University
Chien-Hui Chuang , National Chiao-Tung University
Kuo-Chun Hsu , National Chiao-Tung University
Wen-Yu Lo , Silicon Integrated Systems Corp.
pp. 331
N. Shigyo , Toshiba Corporation
H. Kawashima , Toshiba Corporation
S. Yasuda , Toshiba Corporation
pp. 337
Mehmet Sahinoglu , Troy State University Montgomery
Scott Glover , Troy State University Montgomery
pp. 341
Session 3A: Design Issues for Power and Noise Management: Co-Chairs: Ajith Amerasekera, Texas Instruments
David Scott , Texas Instruments Inc
Shaoping Tang , Texas Instruments Inc
Song Zhao , Texas Instruments Inc
Mahalingam Nandakumar , Texas Instruments Inc
pp. 349
Wai-Ching Douglas Lam , Purdue University
Chengkok Koh , Purdue University
Chung-Wen Albert Tsao , Celestry Design Technologies
pp. 355
Atul Maheshwari , University of Massachusetts at Amherst
Wayne Burleson , University of Massachusetts at Amherst
Russell Tessier , University of Massachusetts at Amherst
pp. 361
Peter A. Beerel , Fulcrum Microsystems and University of Southern California
pp. 367
R. Saleh , University of British Columbia
G. Lim , University of British Columbia
T. Kadowaki , Sony Corporation
pp. 373
Session 3B: Verification in Achieving Design Quality: Co-Chairs: Lech Jozwiak, University of Eindhoven, The Netherlands
Sebastien Pillement , LASTI-ENSSAT-University of Rennes
Daniel Chillet , LASTI-ENSSAT-University of Rennes
Olivier Sentieys , LASTI-ENSSAT-University of Rennes and IRISA-INRIA, Campus de Beaulieu
pp. 388
Sherief Reda , University of California at San Diego
Alex Orailoglu , University of California at San Diego
Rolf Drechsler , University of Bremen
pp. 394
José R. Sendra , University of Las Palmas de Gran Canaria (Spain) and INCIDE Canary S.L. (Spain)
Javier del Pino , University of Las Palmas de Gran Canaria (Spain) and INCIDE Canary S.L. (Spain)
Antonio Hernández , University of Las Palmas de Gran Canaria (Spain) and INCIDE Canary S.L. (Spain)
Antonio Nunez , University of Las Palmas de Gran Canaria (Spain) and INCIDE Canary S.L. (Spain)
Javier Hernández , INCIDE Canary S.L. (Spain) and INCIDE S.A. (Spain)
Jaime Aguilera , INCIDE S.A. (Spain) and University of Navarra (Spain)
Andrés García-Alonso , INCIDE S.A. (Spain) and Centro de Estudios e Investigaciones T?cnicas de Guip?zcoa (Spain)
pp. 400
Nguyen Quang Trung , Institute of Electron Technology, Poland
Artur Kokoszka , Institute of Electron Technology, Poland
Krystyna Siekierska , Institute of Electron Technology, Poland
Adam Pawlak , Institute of Electron Technology, Poland
Dariusz Obrebski , Institute of Electron Technology, Poland
Norbert Lugowski , Institute of Electron Technology, Poland
pp. 405
Session 3C: Signal Integrity: Co-Chairs: Narain Arora, Simplex
Murat R. Becer , Motorola, Inc.
Rajendran Panda , Motorola, Inc.
David Blaauw , University of Michigan
Ibrahim N. Hajj , American University, Beirut
pp. 413
Emrah Acar , IBM Austin Research Labs
Sani Nassif , IBM Austin Research Labs
Ying Liu , IBM Austin Research Labs
Lawrence T. Pileggi , Carnegie Mellon University
pp. 419
Vladimir Zolotov , Motorola Inc.
Rajendran Panda , Motorola Inc.
Chanhee Oh , Motorola Inc.
David Blaauw , University of Michigan
pp. 425
Lauren Hui Chen , Avant! Corporation
Malgorzata Marek-Sadowska , University of California at Santa Barbara
pp. 431
Alexey Glebov , MicroStyle
Sergey Gavrilov , MicroStyle
Vladimir Zolotov , Motorola Inc.
Rajendran Panda , Motorola Inc.
Chanhee Oh , Motorola Inc.
David Blaauw , University of Michigan
pp. 437
Session 4A: Low Power Design Techniques: Co-Chairs: Vivek De, Intel Corporation
Grun Rae Cho , Colorado State University
Tom Chen , Colorado State University
pp. 458
Chih-Hung Lee , Chung-Yuan Christian University
Yu-Chung Lin , Chung-Yuan Christian University
Hsin-Hsiung Huang , Chung-Yuan Christian University
Tsai-Ming Hsieh , Chung-Yuan Christian University
pp. 464
Yazdan Aghaghiri , University of Southern California
Massoud Pedram , University of Southern California
Farzan Fallah , Fujitsu Labs of America, Inc.
pp. 470
Session 4B: Advanced Device Technology Issues in Circuit Design: Co-Chairs: Ken Shepard, Columbia University
David A. Sunderland , Boeing Satellite Systems
Gary L. Duncan , Boeing Satellite Systems
Brad J. Rasmussen , Boeing Satellite Systems
Harry E. Nichols , Boeing Satellite Systems
Daniel T. Kain , Boeing Satellite Systems
Lawrence C. Lee , Boeing Satellite Systems
Brian A. Clebowicz , Boeing Satellite Systems
Richard W. Hollis Iv , Boeing Satellite Systems
Larry Wissel , IBM Microelectronics
Tad Wilder , IBM Microelectronics
pp. 479
Pin Su , University of California at Berkeley
Weidong Liu , University of California at Berkeley
Chenming Hu , University of California at Berkeley
pp. 487
A.M. Ionescu , Swiss Federal Institute of Technology
V. Pott , Swiss Federal Institute of Technology
R. Fritschi , Swiss Federal Institute of Technology
M. Declercq , Swiss Federal Institute of Technology
Ph. Renaud , Swiss Federal Institute of Technology
C. Hibert , Swiss Federal Institute of Technology
Ph. Fluckiger , Swiss Federal Institute of Technology
G.A. Racine , Swiss Federal Institute of Technology
K. Banerjee , Stanford University
pp. 496
Session 4C: Design, Planning and Closure: Co-Chairs: Charlie Chen, University of Wisconsin
Olivier Coudert , Monterey Design Systems
pp. 511
Chee How Lim , Portland State University
W. Robert Daasch , Portland State University
George Cai , Intel Corporation
pp. 517
Nicholas Chia-Yuan Chang , Global Unichip Corp.
Yao-Wen Chang , National Taiwan University
Iris Hui-Ru Jiang , National Chiao Tung University
pp. 523
Wei-Jin Dai , Silicon Perspective Co.
Michel Courtoy , Silicon Perspective Co.
pp. 529
Charlie Chung-Ping Chen , University of Wisconsin - Madison
Ed Cheng , Synopsys Corporate
pp. 534
Author Index (PDF)
pp. 539
pp. 545
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