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Quality Electronic Design, International Symposium on (2001)
San Jose, California
Mar. 26, 2001 to Mar. 28, 2001
ISBN: 0-7695-1025-6
TABLE OF CONTENTS
pp. xvi
pp. xviii
pp. null
pp. null
Tutorial A1: System-on-Chip: Embedded Test Strategies
Tutorial A2: Design and Test of Low Voltage CMOS Circuits
Tutorial A3: Redundancy Requirements for Embedded Memories
pp. null
Tutorial B1: Design Metrics to Achieve Design Quality
Tutorial B2: Fundamental Methods to Enable SoC Design and Reuse
Tutorial B3: Issues in Deep Submicron State-of-the-Art ESD Design
pp. null
Tutorial C1: Application of Formal Verification to Design Creation and Implementation
Tutorial C2: Verification and Validation of Complex Digital Systems: An Industrial Perspective
Tutorial C3: Physical Verification at 0.13 Micron and Below
pp. null
Tutorial D1: Re-Connecting MOS Modeling and Circuit Design: New Methods for Design Quality
Tutorial D2: Interconnect Modeling for Timing, Signal Integrity and Reliability
Tutorial D3: On-Chip Inductance Extraction and Modeling
Evening Panel Discussion: The 50-Million Transistor Chip: The Quality Challenge for 2001
Plenary Session I
Session 1A: Impact of Verification on Complex SOC Quality
Tom Chen , Colorado State University
Isabelle Munn , Colorado State University
Anneliese Andrews , Colorado State University
Maria Bjorkman , Colorado State University
pp. 31
Umberto Rossi , STMicroelectronics
Marco Boschini , STMicroelectronics
Franco Toto , STMicroelectronics
pp. 38
Zan Yang , Texas A&M University
Gwan Choi , Texas A&M University
pp. 44
L. Battù , STMicroelectronics
M. Brunelli , STMicroelectronics
A. Castelnuovo , STMicroelectronics
F. Sforza , STMicroelectronics
pp. 50
Session 1B: Quality of EDA Tools and Design Methodologies
Charles Chiu , IBM Microelectronics Division
Gulsun Yasar , IBM Microelectronics Division
James P. Libous , IBM Microelectronics Division
pp. 71
Kurt Keutzer , U.C. Berkeley
Pinhong Chen , U.C. Berkeley
pp. 87
Session 1C: Design, Fabrication and Reliability Challenges for Emerging Technologies
Akira Matsuzawa , Matsushita Electric Industrial Co., Ltd.
pp. 97
Kenneth L. Shepard , Columbia University and CadMOS Design Technlogy
pp. 105
Fred Wang , Taiwan Semiconductor Manufacturing Company
Sheldon Wu , Taiwan Semiconductor Manufacturing Company
pp. 111
Session 2A: Capacitive Crosstalk Analysis
Ninglong Lu , University of Illinois
Ibrahim N. Hajj , University of Illinois
pp. 133
Sudhakar Muddu , Sanera Systems, Inc.
Niranjan Pol , Cadence Design Systems, Inc.
Devendra Vidhani , SUN Microsystems, Inc.
pp. 145
Qingjian Yu , Univ. of California at Berkeley
Ernest S. Kuh , Univ. of California at Berkeley
pp. 151
David Blaauw , Motorola Inc.
Supamas Sirichotiyakul , Motorola Inc.
Chanhee Oh , Motorola Inc.
Vladimir Zolotov , Motorola Inc.
Murat R. Becer , Motorola Inc.
Rafi Levy , Motorola Semiconductor Israel Ltd.
Ibrahim N. Hajj , University of Illinois at Urbana-Champaign
pp. 158
Session 2B: Interconnect Modeling and Analysis
Asim Husain , Intel Corporation
pp. 167
Makoto Ikeda , The University of Tokyo
Yusuke Nakashima , The University of Tokyo
pp. 179
Yu Cao , University of California, at Berkeley
Chenming Hu , University of California, at Berkeley
Norman Chang , Hewlett-Packard Laboratories
Shen Lin , Hewlett-Packard Laboratories
O. Sam Nakagawa , Hewlett-Packard Laboratories
Weize Xie , Hewlett-Packard Laboratories
pp. 185
Mehdi M. Mechaik , Cisco Systems
pp. 191
Session 2C: Power-Aware Design
Wei-Chung Cheng , University of Southern California
pp. 199
G. Bai , University of Illinois at Urbana-Champaign
S. Bobba , University of Illinois at Urbana-Champaign
I.N. Hajj , University of Illinois at Urbana-Champaign
pp. 205
Lei He , Univ. of Wisconsin
Norman Chang , Hewlett-Packard Laboratories
Zhenyu Tang , Univ. of Wisconsin
Weize Xie , Hewlett-Packard Laboratories
Sam Nakagawa , Hewlett-Packard Laboratories
pp. 211
J.A. Montiel-Nelson , University of Las Palmas de Gran Canaria.
V de ARMAS , University of Las Palmas de Gran Canaria.
R. Sarmiento , University of Las Palmas de Gran Canaria.
And A. Nunez , University of Las Palmas de Gran Canaria.
pp. 223
Evening Panel Discussion: 0.13 micron: Will the Speed Bumps Slow the Race to Market?
Plenary Session II
Session D: Ph.D. Student Forum
Session E: Poster Session
Rajnish Prasad , University of Massachusetts
Israel Koren , University of Massachusetts
pp. 261
Wen-Yu Lo , National Chiao-Tung University,
Tung-Yang Chen , National Chiao-Tung University,
Howard Tang , United Microelectronics Corporation (UMC)
S.-S. Chen , United Microelectronics Corporation (UMC)
Ming-Dou Ker , National Chiao-Tung University,
pp. 267
Alexander Zemliak , Puebla Autonomous University
pp. 273
Mark Birnbaum , Fujitsu Microelectronics, Inc.
pp. 279
Qiang Li , University of Central Florida
J.S. Yuan , University of Central Florida
Joshua McConkey , University of Central Florida
Yuan Chen , Bell Laboratories
Sundar Chetlur , Bell Laboratories
Jonathan Zhou , Bell Laboratories
Wei Li , University of Central Florida
pp. 284
Tom Egan , Santa Clara University
Samiha Mourad , Santa Clara University
pp. 290
Yi-Min Jiang , Synopsys, Inc.
Han Young Koh , LightSpeed Semiconductor Corp.
Kwang-Ting (Tim) Cheng , University of California at Santa Barbara
pp. 307
Imed Ben Dhaou , Royal Institute of Technology
Vijay Sundararajan , University of Minnesota
Keshab K. Parhi , University of Minnesota
pp. 319
Dan Pitica , Technical University of Cluj-Napoca
Radu Munteanu , Technical University of Cluj-Napoca
Cristian Posteuca , Technical University of Cluj-Napoca
pp. 331
Josef Schmid , Lucent Technologies Network Systems
Timo Schüring , Lucent Technologies Network Systems
Christoph Smalla , Lucent Technologies Network Systems
pp. 337
M. Psarakis , NCSR "Demokritos"
D. Gizopoulos , University of Piraeus
A. Paschalis , University of Athens
N. Kranitis , NCSR "Demokritos"
pp. 343
D. Nikolos , Computer Technology Institute
H. T. Vergos , Computer Technology Institute
X. Kavousianos , University of Patras
pp. 350
Session 3A: Defect Analysis and Test Generation
M. Renovell , Universit? de Montpellier II: Sciences et Techniques du Languedoc
pp. 359
W. Kuzmicz , Warsaw University of Technology
W. Pleskacz , Warsaw University of Technology
J. Raik , Tallinn Technical University
R. Ubar , Tallinn Technical University
pp. 365
Chia-Chih Yen , National Chiao Tung University
Chien-Nan Jimmy Liu , National Chiao Tung University
pp. 372
M. Michael , Southern Illinois University
S. Tragoudas , Southern Illinois University
pp. 384
Session 3B: Design of Programmable and Platform-Based IP
Marcel Oosterhuis , Philips Research Laboratories
Sethuraman Ramanathan , Philips Research Laboratories
Paul Lippens , Philips Research Laboratories
Albert Van der Werf , Philips Research Laboratories
Steffen Maul , Philips Research Laboratories
Rafael Peset Llopis , Philips Research Laboratories
pp. 393
Michael Schlicht , Fraunhofer Institute for Integrated Circuits
Martin Leyh , Fraunhofer Institute for Integrated Circuits
pp. 399
Chih-Yuan Chen , Industrial Technology Research Institute
Shing-Wu Tung , Industrial Technology Research Institute
pp. 405
Kazimierz Wiatr , AGH Technical University of Cracow
pp. 415
Session 3C: Embedded Panel Discussion: Consequences of Technology: What is the Impact of Electronic Design on the Quality of Life?
Session 4A: Design for Manufacturability
Emrah Acar , Carnegie Mellon Univ.
Sani Nassif , IBM-Austin Research Labs
Ying Liu , IBM-Austin Research Labs
pp. 431
Sani Nassif , IBM Austin Research Lab
Rashmi Dinakar , Rensselaer Polytechnic Institute
Chris Long , Sematech
pp. 437
Sang-Hoon Lee , SAMSUNG Electronics Co., Ltd.
Tae-Seon Kim , SAMSUNG Electronics Co., Ltd.
Hoe-Jin Lee , SAMSUNG Electronics Co., Ltd.
Young-Kwan Park , SAMSUNG Electronics Co., Ltd.
Taek-Soo Kim , SAMSUNG Electronics Co., Ltd.
Tae-Jin Kwon , SAMSUNG Electronics Co., Ltd.
Jeong-Taek Kong , SAMSUNG Electronics Co., Ltd.
pp. 443
Session 4B: Embedded Memories
M. Araldi , STMicroelectronics N.V.
P. Daglio , STMicroelectronics N.V.
C. Roma , STMicroelectronics N.V.
pp. 451
A. Argyriou , Democritus University of Thrace
M. Dasigenis , Democritus University of Thrace
D. Soudris , Democritus University of Thrace
N. Zervas , University of Patras
pp. 456
Nai-Yin Sung , Taiwan Semiconductor Manufacturing Company Ltd.
pp. 462
Session 4C: Device Modeling and Design Quality
Amit Mehrotra , University of Illinois at Urbana Champaign
pp. 469
Makoto Nagata , Hiroshima University
Takafumi Ohmoto , Hiroshima University
Takashi Morie , Hiroshima University
Yoshitaka Murasaka , Hiroshima University
pp. 482
Andrea Neviani , Universita degli Studi di Padova
Enrico Zanoni , Universita degli Studi di Padova
Paolo Miliozzi , Conexant Systems Inc.
Edoardo Charbon , Cadence Design Systems Inc.
Carlo Guardiani , PDF Solutions Inc.
Luca Carloni , University of California Berkeley
Alberto Sangiovanni-Vincentelli , University of California Berkeley
pp. 488
Author Index (PDF)
pp. 493
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