- I
- ISQED
- 2000
- First International Symposium on Quality of Electronic Design
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| | | | Bibliographic References | | | |
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First International Symposium on Quality of Electronic Design San Jose, California March 20-March 22 ISBN: 0-7695-0525-2 Table of Contents
 | Tutorial Track 1: Design for Reliability and Manufacturability: Organizer and Moderator: Ibrahim Hajj |
MOS Models as a Factor in the Quality of Electronic Design
Design-in Hot as a factor in the Reliabilty Modeling and Simulation
Thermal Effects in Deep Submicron VLSI Interconnects
Design with Copper and the Reliability Impact
Physical Design of Mixed-Signal VLSI Chips
| Tutorial Track II: Design for Reliability and Manufacturability: Organizer and Moderator: Ali Iramanesh |
Voltage Drop Effects on DSM VLSI Design
Signal and Power/Ground Integrity for IC and Package
Accurate Analysis of Cross-Talk Effects in DSM Designs
Managing Noise in VDSM Designs
| Tutorial Track III: Closing the Manufacturing Loop: Organizer and Moderator: Andrzej Strojwas |
Voltage Drop Effects on DSM VLSI Design
Signal and Power/Ground Integrity for IC and Package
Accurate Analysis of Cross-Talk Effects in DSM Designs
Implementation Issues for Production RET (OPC and PSM)
| Evening Panel Discussion |
| Plenary Session I: Session Chair: Ali Iramanesh |
| Session 1A: Panel Discussion |
| Session 1B: DSM Modeling: Organizers: Ann Spratt and Antonio Nunez: Co-Chairs: Resve Saleh and Antonio Nunez |
| Session 1C: Emerging Process and Device Technology: Organizers: David Overhauser and Chune-Sin Yeh: Co-Chairs: David Overhauser and Chune-Sin Yeh |
| Session 2A: Quality of Design and EDA Tools: Organizer: George Alexiou and Ali Iramanesh: Co-Chairs: George Alexiou and Kevin Lashkari |
| Session 2B: Emerging Integrity Issues: Organizer: Tak Young and Marco Casale-Rossi: Co-Chairs: Marco Casale-Rossi and Norman Chang |
Zhiping Yu, Stanford University and Hewlett Packard Co. pp. 145
| Session 2C: Low Power Test: Organizers: Fadi Maamari, Marcel Jacomet, Kaushik Roy, Anne-Marie Trullemans, Ibramham Hajj and Raimund Ubar: Co-Chairs: Marcel Jacomet and Ibrahim Hajj |
| Plenary Session II: Co-Chairs: Resve Saleh and Carlo Guardiani |
| Session 3A: Quality of IP Blocks: Organizers: Ann Spratt and Antonio N??ez: Co-Chairs: Fadi Maamari and Robert Aitken |
| Session 3B: Impact of Emerging Processes on Design Quality: Organizer: Kris Verma: Co-Chairs: Kris Verma and NS Nagaraj |
Ana Hunter, Chartered Semiconductor Manufacturing Ltd
Ck Lau, Chartered Semiconductor Manufacturing Ltd pp. 245
| Session 3C: Poster Session: Co-Chairs: Norman Chang and C.K. Cheng |
G. Bai, University of Illinois at Urbana-Champaign
S. Bobba, University of Illinois at Urbana-Champaign
I.N. Hajj, University of Illinois at Urbana-Champaign pp. 263
Rong Lin, State University of New York at Geneseo pp. 321
Y.S. Lee, Hong Kong Polytechnic University pp. 361
Gin S. Yee, University of Washington and Sun Microsystems Incorporated
Tyler Thorp, University of Washington and Sun Microsystems Incorporated pp. 369
| Session 4A: Panel Discussion |
| Session 4B: Quality Definitions and Metrics: Organizers: George Alexiou and Ali Iramanesh: Co-Chairs: Justin Harlow and Lei He |
Einar J. Aas, Norwegian University of Science and Technology pp. 389
| Session 4C: Low Power Design and Test: Organizers: Fadi Maamari, Marcel Jacomet, Kaushik Roy, Anne-Marie Trullemans and Ibramham Hajj: Co-Chairs: Kaushik Roy and Vamsi K. Srikantam |
D. Bakalis, University of Patras and Computer Technology Institute
D. Nikolos, University of Patras and Computer Technology Institute
G. Alexiou, University of Patras and Computer Technology Institute pp. 433
| Session 5A: Panel Discussion |
| Session 5B: Design for Manufacturability: Organizers: Andrzej J. Strojwas and Carlo Guardiani: Co-Chairs: Glendy Sun and Vinod Malhotra |
V. Boksha, Massachusetts Institute of Technology pp. 461
| Session 5C: VDSM Capacitive and Inductive Issues: Organizers: Tak Young and Marco Casale-Rossi: Co-Chairs: Tak Young and Eileen Hong You |
Tong Xiao, University of California at Santa Barbara pp. 491 Usage of this product signifies your acceptance of the Terms of Use.
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