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Low Power Electronics and Design, International Symposium on (2009)
San Fancisco, CA, USA
Aug. 19, 2009 to Aug. 21, 2009
ISBN: 978-1-60558-684-7
TABLE OF CONTENTS
Papers
Dina Kamel , Université catholique de Louvain, Louvain-la-Neuve, Belgium
Denis Flandre , Université catholique de Louvain, Louvain-la-Neuve, Belgium
David Bol , Université catholique de Louvain, Louvain-la-Neuve, Belgium
pp. 3-8
Vita Pi-Ho Hu , National Chiao Tung University, Hsinchu, Taiwan ROC
Yu-Sheng Wu , National Chiao Tung University, Hsinchu, Taiwan ROC
Ming-Long Fan , National Chiao Tung University, Hsinchu, Taiwan ROC
Pin Su , National Chiao Tung University, Hsinchu, Taiwan ROC
Ching-Te Chuang , National Chiao Tung University, Hsinchu, Taiwan ROC
pp. 9-14
Xin Zhao , Georgia Institute of Technology, Atlanta, GA, USA
Sung Kyu Lim , Georgia Institute of Technology, Atlanta, GA, USA
Jeremy R. Tolbert , Georgia Institute of Technology, Atlanta, GA, USA
pp. 15-20
David Bol , Université catholique de Louvain, Louvain-la-Neuve, Belgium
Denis Flandre , Université catholique de Louvain, Louvain-la-Neuve, Belgium
Jean-Didier Legat , Université catholique de Louvain, Louvain-la-Neuve, Belgium
pp. 21-26
Sudhanshu Khanna , University of Virginia, Charlottesville, VA, USA
pp. 27-32
Domenik Helms , OFFIS, D26121 Oldenburg, Germany
Kai Hylla , OFFIS, D26121, Oldenburg, Germany
Wolfgang Nebel , CvO Univerity, D26121, Oldenburg, Germany
pp. 33-38
Xiaoming Chen , Dept. of E.E., TNList, Tsinghua University, Beijing, China
Yu Wang , Dept. of E.E., TNList, Tsinghua University, Beijing, China
Yu Cao , Dept. of E.E., Arizona State University, Tempe, USA
Yuchun Ma , Dept. of C.S., TNList, Tsinghua University, Beijing, China
Huazhong Yang , Dept. of E.E., TNList, Tsinghua University, Beijing, China
pp. 39-44
Amlan Ghosh , University of Utah, Salt Lake City, UT, USA
Richard B. Brown , University of Utah, Salt Lake City, UT, USA
pp. 45-50
Koichi Hamamoto , Osaka University, Suita, Japan
Masanori Hashimoto , Osaka University, Suita, Japan
Yukio Mitsuyama , Osaka University, Suita, Japan
Takao Onoye , Osaka University, Suita, Japan
pp. 51-56
Azadeh Davoodi , University of Wisconsin - Madison, Madison, WI, USA
Jungseob Lee , University of Wisconsin - Madison, Madison, WI, USA
Abhishek Sinkar , University of Wisconsin - Madison, Madison, WI, USA
Nam Sung Kim , University of Wisconsin - Madison, Madison, WI, USA
pp. 57-62
Xin Zhou , NC State University, Raleigh, NC, USA
Liyu Yang , NC State University, Raleigh, NC, USA
Alex Huang , NC State University, Raleigh, NC, USA
pp. 63-68
Hui Shao , The Hong Kong University of Science and Technology, Hong Kong, Hong Kong
Chi-Ying Tsui , The Hong Kong University of Science and Technology, Hong Kong, Hong Kong
Wing-Hung Ki , The Hong Kong University of Science and Technology, Hong Kong, Hong Kong
pp. 69-74
Hussain Alzaher , King Fahd University of Petroleum & Minerals, Dhahran, Saudi Arabia
pp. 75-80
Kaushik Bhattacharyya , IIT-Kharagpur, Kharagpur, India
Tamal Das , IIT-Kharagpur, Kharagpur, India
P.V. Ratna Kumar , IIT-Kharagpur, Kharagpur, India
pp. 81-86
Koichi Ishida , University of Tokyo, Tokyo, Japan
Shinji Miyamoto , Toshiba Corporation, Yokohama, Japan
Hiroto Nakai , Toshiba Corporation, Yokohama, Japan
Makoto Takamiya , University of Tokyo, Tokyo, Japan
Tadashi Yasufuku , University of Tokyo, Tokyo, Japan
Ken Takeuchi , University of Tokyo, Tokyo, Japan
pp. 87-92
Chia-Lin Yang , National Taiwan University, Taipei, Taiwan ROC
Ku-Jei King , IBM Corporation, Taipei, Taiwan ROC
pp. 93-98
Raid Zuhair Ayoub , University of California, San Diego, La Jolla, CA, USA
Tajana Simunic Rosing , University of California, San Diego, La Jolla, CA, USA
pp. 99-104
Thidapat Chantem , University of Notre Dame, Notre Dame, IN, USA
Robert P. Dick , University of Michigan, Ann Arbor, MI, USA
pp. 105-110
José González , Intel, Barcelona, Spain
Qiong Cai , Intel Barcelona Research Center, Intel Labs-UPC, Barcelona, Spain
Greg Chrysler , Intel, Santa Clara, USA
pp. 111-116
A 2.6 (Abstract)
Jonathan F. Bolus , University of Virginia, Charlottesville, VA, USA
Stuart N. Wooters , University of Virginia, Charlottesville, VA, USA
Travis N. Blalock , University of Virginia, Charlottesville, VA, USA
Benton H. Calhoun , University of Virginia, Charlottesville, VA, USA
pp. 117-118
Pulkit Jain , University of Minnesota, Minneapolis, MN, USA
Chris H. Kim , University of Minnesota, Minneapolis, MN, USA
pp. 119-120
Jun Seomun , Korea Advanced Institute of Science and Technology, Taejon, South Korea
Abhishek Sinkar , University of Wisconsin-Madison, Madison, USA
Jungseob Lee , University of Wisconsin-Madison, Madison, USA
Tae Hee Han , Sungkyunkwan University, Suwon, South Korea
Nam Sung Kim , University of Wisconsin-Madison, Madison, WI, USA
Youngsoo Shin , Korea Advanced Institute of Science and Technology, Taejon, USA
pp. 121-126
Enrico Macii , Politecnico di Torino, Torino, Italy
Andrea Calimera , Politecnico di Torino, Torino, Italy
pp. 127-132
Victor V. Zyuban , IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
Matthew M. Ziegler , IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
Milena Vratonjic , University of California Davis, Davis, CA, USA
Joshua Friedrich , IBM Systems and Technology Group, Austin, TX, USA
pp. 133-138
Jason Cong , Computer Science Department, UCLA, Los Angeles, CA, USA
Zhiru Zhang , AutoESL Design Technologies, Inc., Los Angeles, CA, USA
pp. 139-144
Ehsan Pakbaznia , USC, Los Angeles, CA, USA
pp. 145-150
Thomas F. Wenisch , University of Michigan, Ann Arbor, MI, USA
pp. 151-152
John B. Carter , IBM Austin Research Laboratory, Austin, TX, USA
pp. 153-154
Cullen E. Bash , Hewlett-Packard Laboratories, Palo Alto, CA, USA
pp. 155-156
Kevin Zhang , Intel Corporation, Hillsboro, OR, USA
pp. 157-158
Jianwei Dai , University of Connecticut, Storrs, CT, USA
Lei Wang , University of Connecticut, Storrs, CT, USA
pp. 159-164
Emre Ozer , ARM Ltd., Cambridge, United Kingdom
Simon Ford , ARM Ltd., Cambridge, United Kingdom
Stuart Biles , ARM Ltd., Cambridge, United Kingdom
Hsien-Hsin S. Lee , Georgia Tech, Atlanta, GA, USA
pp. 165-170
Ju-Young Jung , State University of New York, Binghamton, NY, USA
Kanad Ghose , State University of New York, Binghamton, NY, USA
Dmitry Ponomarev , State University of New York, Binghamton, NY, USA
pp. 171-176
Hiroshi Sasaki , The University of Tokyo, Meguro-ku, Tokyo, Japan
Masaaki Kondo , The University of Electro-Communications, Chofu-shi, Tokyo, Japan
Hiroshi Nakamura , The University of Tokyo, Meguro-ku, Tokyo, Japan
pp. 177-182
Hui Zeng , State University of New York, Binghamton, NY, USA
Matt T. Yourst , State University of New York, Binghamton, NY, USA
Kanad Ghose , State University of New York, Binghamton, NY, USA
pp. 183-188
Debabrata Mohapatra , Purdue University, West Lafayette, IN, USA
Georgios Karakonstantis , Purdue University, West Lafayette, IN, USA
Kaushik Roy , Purdue University, West Lafayette, IN, USA
pp. 195-200
Jungseob Lee , University of Wisconsin-Madison, Madison, WI, USA
Nam Sung Kim , University of Wisconsin-Madison, Madison, WI, USA
pp. 201-206
Sebastian Herbert , Carnegie Mellon University, Pittsburgh, PA, USA
Diana Marculescu , Carnegie Mellon University, Pittsburgh, PA, USA
Alyssa Bonnoit , Carnegie Mellon University, Pittsburgh, PA, USA
pp. 207-212
Mackenzie R. Scott , University of California, Davis, Davis, CA, USA
Rajeevan Amirtharajah , University of California, Davis, Davis, CA, USA
pp. 213-218
Yoonmyung Lee , University of Michigan, Ann Arbor, MI, USA
Jin Cai , IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
Isaac Lauer , IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
Leland Chang , IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
Daeyeon Kim , University of Michigan, Ann Arbor, MI, USA
Dennis Sylvester , University of Michigan, Ann Arbor, MI, USA
David Blaauw , University of Michigan, Ann Arbor, MI, USA
pp. 219-224
Sylvain Clerc , STMicroelectronics, Crolles, France
Fabian Firmin , STMicroelectronics, Crolles, France
Marc Renaudin , TIEMPO SAS, Montbonnot-Saint-Martin, France
Gilles Sicard , TIMA Laboratory, Grenoble, France
pp. 225-230
Thorlindur Thorolfsson , North Carolina State University, Raleigh, NC, USA
Paul D. Franzon , North Carolina State University, Raleigh, NC, USA
pp. 231-236
Jibang Liu , Rensselaer Polytechnic Institute, Troy, NY, USA
Tong Zhang , Rensselaer Polytechnic Institute, Troy, NY, USA
pp. 237-242
Gaurav Dhiman , UC San Diego, La Jolla, CA, USA
Giacomo Marchetti , UC San Diego, La Jolla, CA, USA
Tajana Rosing , UC San Diego, La Jolla, CA, USA
pp. 243-248
Karam S. Chatha , Arizona State University, Tempe, AZ, USA
Sushu Zhang , Arizona State University, Tempe, AZ, USA
pp. 249-254
Xia Zhao , Peking University
Xiangqun Chen , Peking University
pp. 255-260
Justin Meza , HP Labs, Palo Alto, CA, USA
Mehul A. Shah , HP Labs, Palo Alto, CA, USA
Parthasarathy Ranganathan , HP Labs, Palo Alto, CA, USA
Mike Fitzner , Hewlett-Packard BCS, Redmond, WA, USA
Judson Veazey , Hewlett-Packard BCS, Ft. Collins, CO, USA
pp. 261-266
Karthik Kumar , Purdue University, West Lafayette, IN, USA
Yamini Nimmagadda , Purdue University, West Lafayette, IN, USA
Yung-Hsiang Lu , Purdue University, West Lafayette, IN, USA
pp. 267-272
Kiyoo Itoh , Hitachi, Ltd.,, Kokubunji, Tokyo, Japan
pp. 273-274
Al Fazio , Intel Fellow, Director, Memory Technology Development, Technology and Manufacturing Group, , USA
pp. 275-276
Suman Datta , Pennsylvania State University, University Park, PA, USA
pp. 277-278
Sherief Reda , Brown University, Providence, RI, USA
R. Iris Bahar , Brown University, Providence, RI, USA
pp. 283-286
Ge Chen , University of New South Wales, Gwangju, Australia
Steven Duvall , University of New South Wales, Sydney, Australia
pp. 287-290
Jie Wu , Tsinghua University, Beijing, China
Li Shang , University of Colorado, Boulder, CO, USA
Alan R. Mickelson , University of Colorado, Boulder, CO, USA
Manish Vachharajani , University of Colorado, Boulder, CO, USA
Dejan Filipovic , University of Colorado, Boulder, CO, USA
Wounjhang Park , University of Colorado, Boulder, CO, USA
Yihe Sun , Tsinghua University, Beijing, China
pp. 291-294
Guangyu Sun , Pennsylvania State University, State College, PA, USA
Xiaoxia Wu , Pennsylvania State University, State College, PA, USA
Yuan Xie , Pennsylvania State University, State College, PA, USA
pp. 295-298
Chunhong Chen , University of Windsor, Windsor, ON, Canada
Shu-Yi Wong , University of Windsor, Windsor, ON, Canada
pp. 299-302
Aarul Jain , Arizona State University, Tempe, AZ, USA
Veera Papirla , Arizona State University, Tempe, AZ, USA
pp. 303-306
Amin Ansari , University of Michigan, Ann Arbor, MI, USA
Shuguang Feng , University of Michigan, Ann Arbor, MI, USA
Shantanu Gupta , University of Michigan, Ann Arbor, MI, USA
Scott Mahlke , University of Michigan, Ann Arbor, MI, USA
pp. 307-310
Lou Jiana , Zhejiang University, Hangzhou, China
pp. 311-314
Aida Todri , University of California Santa Barbara, Santa Barbara, CA, USA
Malgorzata Marek-Sadowska , University of California Santa Barbara, Santa Barbara, CA, USA
pp. 315-318
Rajdeep Bondade , The University of Arizona, Tucson, AZ, USA
Feng Luo , The University of Arizona, Tucson, AZ, USA
pp. 319-322
A novel 0.5 V 15 (Abstract)
Dominic Maurath , Chair of Microelectronics, Department of Microsystems Engineering (IMTEK), Freiburg, Germany
Yiannos Manoli , Chair of Microelectronics, Department of Microsystems Engineering (IMTEK), Freiburg, Germany
pp. 323-326
Joseph Nayfach-Battilana , UC Santa Cruz, Santa Cruz, CA, USA
pp. 327-330
Yousra Alkabani , Rice University, Houston, TX, USA
Miodrag Potkonjak , UCLA, Los Angeles, CA, USA
pp. 331-334
Jungsoo Kim , Dept. of EECS, Korea Advanced Institute of Science and Technology, Daejeon, South Korea
Sangkwon Na , Dept. of EECS, Korea Advanced Institute of Science and Technology, Daejeon, South Korea
Seungrok Jung , SOC Platform Development Team, System LSI Division, Device Solution Business, Samsung Electronics, Yongin, South Korea
pp. 335-338
Yung-Seok Kevin Choi , Rice University, Houston, TX, USA
Lin Zhong , Rice University, Houston, TX, USA
pp. 339-342
Jongmin Lee , Korea Advanced Institute of Science and Technology, Daejoen, South Korea
Soontae Kim , Korea Advanced Institute of Science and Technology, Daejoen, South Korea
pp. 343-346
Se Hun Kim , Georgia Institute of Technology, Atlanta, GA, USA
Saibal Mukohopadhyay , Georgia Institute of Technology, Atlanta, GA, USA
Wayne Wolf , Georgia Institute of Technology, Atlanta, GA, USA
pp. 347-350
Shimeng Huang , University of Pittsburgh, Pittsburgh, PA, USA
Joseph Oresko , University of Pittsburgh, Pittsburgh, PA, USA
John Krais , University of Pittsburgh, Pittsburgh, PA, USA
Yuwen Sun , University of Pittsburgh, Pittsburgh, PA, USA
pp. 351-354
Sonali Chouhan , Indian Institute of Technology Delhi, New Delhi, India
Ranjan Bose , Indian Institute of Technology Delhi, New Delhi, India
pp. 355-358
Brian Fuller , Editor, Corte Madera, USA
Sandeep Mirchandani , Broadcom, San Jose, USA
Jon McDonald , Mentor, San Jose, USA
Soheil Modirzadeh , Cadence, San Jose, USA
Camille Kokozaki , IDT, San Jose, USA
pp. 359-360
Mojy Chian , GLOBALFOUNDRIES, USA
pp. 361-362
Yankin Tanurhan , Virage Logic Corporation, Fremont, CA, USA
pp. 363-364
Joo-Young Kim , Korea Advanced Institute of Science and Technology, Daejeon, South Korea
Seungjin Lee , Korea Advanced Institute of Science and Technology, Daejeon, South Korea
Jinwook Oh , Korea Advanced Institute of Science and Technology, Daejeon, South Korea
Minsu Kim , Korea Advanced Institute of Science and Technology, Daejeon, South Korea
Hoi-Jun Yoo , Korea Advanced Institute of Science and Technology, Daejeon, South Korea
pp. 365-370
Michael J. Lyons , Harvard University, Cambridge, MA, USA
David Brooks , Harvard University, Cambridge, MA, USA
pp. 371-376
Anita Lungu , Duke University, Durham, NC, USA
Pradip Bose , IBM, Yorktown Heights, NY, USA
Alper Buyuktosunoglu , IBM, Yorktown Heights, NY, USA
Daniel J. Sorin , Duke University, Durham, NC, USA
pp. 377-382
Madhu Saravana Sibi Govindan , University of Texas at Austin, Austin, TX, USA
Doug Burger , Microsoft, Redmond, WA, USA
pp. 383-388
Yinhe Han , Institute of Computing Technology, Chinese Academy of Sciences, Beijing, China
Hui Liu , Institute of Computing Technology, Chinese Academy of Sciences, Beijing, China
Guihai Yan , Institute of Computing Technology, Chinese Academy of Sciences, Beijing, China
Xiaowei Li , Institute of Computing Technology, Chinese Academy of Sciences, Beijing, China
pp. 395-400
Hang Yu , Rice University, Houston, TX, USA
Ashutosh Sabharwal , Rice University, Houston, TX, USA
pp. 401-406
Jinsik Kim , University of California, Irvine, Irvine, CA, USA
Pai H. Chou , University of California, Irvine, Irvine, CA, USA
pp. 407-412
Jian-Jia Chen , ETH, Zurich, Switzerland
Clemens Moser , ETH, Zurich, Switzerland
pp. 413-418
Younghun Kim , University of California, Los Angeles, Los Angeles, CA, USA
Sadaf Zahedi , University of California, Los Angeles, Los Angeles, CA, USA
Jonathan Friedman , University of California, Los Angeles, Los Angeles, CA, USA
Mani B. Srivastava , University of California, Los Angeles, Los Angeles, CA, USA
pp. 419-424
Kaushik Roy , Purdue University, , USA
pp. 425-426
Suman Datta , Pennsylvania State University, University Park, USA
Vijaykrishnan Narayanan , Pennsylvania State University, University Park, USA
pp. 429-430
Vijay Raghunathan , Purdue University, West Lafayette, IN, USA
pp. 431-432
5 ms
(Ver 2.0)

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