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Proceedings of the 14th ACM/IEEE international symposium on Low power electronics and design (ISLPED '09)
San Fancisco, CA, USA
August 19-August 21
ISBN: 978-1-60558-684-7
Table of Contents
Papers
David Bol, Université catholique de Louvain, Louvain-la-Neuve, Belgium
Dina Kamel, Université catholique de Louvain, Louvain-la-Neuve, Belgium
Denis Flandre, Université catholique de Louvain, Louvain-la-Neuve, Belgium
Jean-Didier Legat, Université catholique de Louvain, Louvain-la-Neuve, Belgium
pp. 3-8
Vita Pi-Ho Hu, National Chiao Tung University, Hsinchu, Taiwan ROC
Yu-Sheng Wu, National Chiao Tung University, Hsinchu, Taiwan ROC
Ming-Long Fan, National Chiao Tung University, Hsinchu, Taiwan ROC
Pin Su, National Chiao Tung University, Hsinchu, Taiwan ROC
Ching-Te Chuang, National Chiao Tung University, Hsinchu, Taiwan ROC
pp. 9-14
Jeremy R. Tolbert, Georgia Institute of Technology, Atlanta, GA, USA
Xin Zhao, Georgia Institute of Technology, Atlanta, GA, USA
Sung Kyu Lim, Georgia Institute of Technology, Atlanta, GA, USA
Saibal Mukhopadhyay, Georgia Institute of Technology, Atlanta, GA, USA
pp. 15-20
David Bol, Université catholique de Louvain, Louvain-la-Neuve, Belgium
Denis Flandre, Université catholique de Louvain, Louvain-la-Neuve, Belgium
Jean-Didier Legat, Université catholique de Louvain, Louvain-la-Neuve, Belgium
pp. 21-26
Sudhanshu Khanna, University of Virginia, Charlottesville, VA, USA
Benton H. Calhoun, University of Virginia, Charlottesville, VA, USA
pp. 27-32
Domenik Helms, OFFIS, D26121 Oldenburg, Germany
Kai Hylla, OFFIS, D26121, Oldenburg, Germany
Wolfgang Nebel, CvO Univerity, D26121, Oldenburg, Germany
pp. 33-38
Xiaoming Chen, Dept. of E.E., TNList, Tsinghua University, Beijing, China
Yu Wang, Dept. of E.E., TNList, Tsinghua University, Beijing, China
Yu Cao, Dept. of E.E., Arizona State University, Tempe, USA
Yuchun Ma, Dept. of C.S., TNList, Tsinghua University, Beijing, China
Huazhong Yang, Dept. of E.E., TNList, Tsinghua University, Beijing, China
pp. 39-44
Amlan Ghosh, University of Utah, Salt Lake City, UT, USA
Rahul M. Rao, IBM T. J. Watson Center, Yorktown Heights, NY, USA
Richard B. Brown, University of Utah, Salt Lake City, UT, USA
pp. 45-50
Koichi Hamamoto, Osaka University, Suita, Japan
Masanori Hashimoto, Osaka University, Suita, Japan
Yukio Mitsuyama, Osaka University, Suita, Japan
Takao Onoye, Osaka University, Suita, Japan
pp. 51-56
Michael J. Anderson, University of Wisconsin - Madison, Madison, WI, USA
Azadeh Davoodi, University of Wisconsin - Madison, Madison, WI, USA
Jungseob Lee, University of Wisconsin - Madison, Madison, WI, USA
Abhishek Sinkar, University of Wisconsin - Madison, Madison, WI, USA
Nam Sung Kim, University of Wisconsin - Madison, Madison, WI, USA
pp. 57-62
Jiwei Fan, NC State University, Raleigh, NC, USA
Xin Zhou, NC State University, Raleigh, NC, USA
Liyu Yang, NC State University, Raleigh, NC, USA
Alex Huang, NC State University, Raleigh, NC, USA
pp. 63-68
Hui Shao, The Hong Kong University of Science and Technology, Hong Kong, Hong Kong
Chi-Ying Tsui, The Hong Kong University of Science and Technology, Hong Kong, Hong Kong
Wing-Hung Ki, The Hong Kong University of Science and Technology, Hong Kong, Hong Kong
pp. 69-74
Hussain Alzaher, King Fahd University of Petroleum & Minerals, Dhahran, Saudi Arabia
Noman Tasadduq, King Fahd University of Petroleum & Minerals, Dhahran, Saudi Arabia
pp. 75-80
P.V. Ratna Kumar, IIT-Kharagpur, Kharagpur, India
Kaushik Bhattacharyya, IIT-Kharagpur, Kharagpur, India
Tamal Das, IIT-Kharagpur, Kharagpur, India
Pradip Mandal, IIT-Kharagpur, Kharagpur, India
pp. 81-86
Tadashi Yasufuku, University of Tokyo, Tokyo, Japan
Koichi Ishida, University of Tokyo, Tokyo, Japan
Shinji Miyamoto, Toshiba Corporation, Yokohama, Japan
Hiroto Nakai, Toshiba Corporation, Yokohama, Japan
Makoto Takamiya, University of Tokyo, Tokyo, Japan
Takayasu Sakurai, University of Tokyo, Tokyo, Japan
Ken Takeuchi, University of Tokyo, Tokyo, Japan
pp. 87-92
Chung-Hsiang Lin, National Taiwan University, Taipei, Taiwan ROC
Chia-Lin Yang, National Taiwan University, Taipei, Taiwan ROC
Ku-Jei King, IBM Corporation, Taipei, Taiwan ROC
pp. 93-98
Raid Zuhair Ayoub, University of California, San Diego, La Jolla, CA, USA
Tajana Simunic Rosing, University of California, San Diego, La Jolla, CA, USA
pp. 99-104
Thidapat Chantem, University of Notre Dame, Notre Dame, IN, USA
X. Sharon Hu, University of Notre Dame, Notre Dame, IN, USA
Robert P. Dick, University of Michigan, Ann Arbor, MI, USA
pp. 105-110
Pedro Chaparro, Intel Barcelona Research Center, Intel Labs-UPC, Barcelona, Spain
José González, Intel, Barcelona, Spain
Qiong Cai, Intel Barcelona Research Center, Intel Labs-UPC, Barcelona, Spain
Greg Chrysler, Intel, Santa Clara, USA
pp. 111-116
A 2.6 (Abstract)
Steven C. Jocke, University of Virginia, Charlottesville, VA, USA
Jonathan F. Bolus, University of Virginia, Charlottesville, VA, USA
Stuart N. Wooters, University of Virginia, Charlottesville, VA, USA
Travis N. Blalock, University of Virginia, Charlottesville, VA, USA
Benton H. Calhoun, University of Virginia, Charlottesville, VA, USA
pp. 117-118
Ki Chul Chun, University of Minnesota, Minneapolis, MN, USA
Pulkit Jain, University of Minnesota, Minneapolis, MN, USA
Chris H. Kim, University of Minnesota, Minneapolis, MN, USA
pp. 119-120
Nam Sung Kim, University of Wisconsin-Madison, Madison, WI, USA
Jun Seomun, Korea Advanced Institute of Science and Technology, Taejon, South Korea
Abhishek Sinkar, University of Wisconsin-Madison, Madison, USA
Jungseob Lee, University of Wisconsin-Madison, Madison, USA
Tae Hee Han, Sungkyunkwan University, Suwon, South Korea
Ken Choi, Illinois Inst. of Tech., Chicago, USA
Youngsoo Shin, Korea Advanced Institute of Science and Technology, Taejon, USA
pp. 121-126
Andrea Calimera, Politecnico di Torino, Torino, Italy
Enrico Macii, Politecnico di Torino, Torino, Italy
Massimo Poncino, Politecnico di Torino, Torino, Italy
pp. 127-132
Matthew M. Ziegler, IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
Victor V. Zyuban, IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
George D. Gristede, IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
Milena Vratonjic, University of California Davis, Davis, CA, USA
Joshua Friedrich, IBM Systems and Technology Group, Austin, TX, USA
pp. 133-138
Jason Cong, Computer Science Department, UCLA, Los Angeles, CA, USA
Bin Liu, Computer Science Department, UCLA, Los Angeles, CA, USA
Zhiru Zhang, AutoESL Design Technologies, Inc., Los Angeles, CA, USA
pp. 139-144
Ehsan Pakbaznia, USC, Los Angeles, CA, USA
Massoud Pedram, USC, Los Angeles, CA, USA
pp. 145-150
John B. Carter, IBM Austin Research Laboratory, Austin, TX, USA
pp. 153-154
Cullen E. Bash, Hewlett-Packard Laboratories, Palo Alto, CA, USA
pp. 155-156
Jianwei Dai, University of Connecticut, Storrs, CT, USA
Lei Wang, University of Connecticut, Storrs, CT, USA
pp. 159-164
Mrinmoy Ghosh, ARM Inc., Austin, TX, USA
Emre Ozer, ARM Ltd., Cambridge, United Kingdom
Simon Ford, ARM Ltd., Cambridge, United Kingdom
Stuart Biles, ARM Ltd., Cambridge, United Kingdom
Hsien-Hsin S. Lee, Georgia Tech, Atlanta, GA, USA
pp. 165-170
Hui Zeng, State University of New York, Binghamton, NY, USA
Ju-Young Jung, State University of New York, Binghamton, NY, USA
Kanad Ghose, State University of New York, Binghamton, NY, USA
Dmitry Ponomarev, State University of New York, Binghamton, NY, USA
pp. 171-176
Noriko Takagi, The University of Tokyo, Meguro-ku, Tokyo, Japan
Hiroshi Sasaki, The University of Tokyo, Meguro-ku, Tokyo, Japan
Masaaki Kondo, The University of Electro-Communications, Chofu-shi, Tokyo, Japan
Hiroshi Nakamura, The University of Tokyo, Meguro-ku, Tokyo, Japan
pp. 177-182
Hui Zeng, State University of New York, Binghamton, NY, USA
Matt T. Yourst, State University of New York, Binghamton, NY, USA
Kanad Ghose, State University of New York, Binghamton, NY, USA
pp. 183-188
Abhishek Sinkar, University of Wisconsin-Madison, Madison, WI, USA
Nam Sung Kim, University of Wisconsin-Madison, Madison, WI, USA
pp. 189-194
Debabrata Mohapatra, Purdue University, West Lafayette, IN, USA
Georgios Karakonstantis, Purdue University, West Lafayette, IN, USA
Kaushik Roy, Purdue University, West Lafayette, IN, USA
pp. 195-200
Jungseob Lee, University of Wisconsin-Madison, Madison, WI, USA
Nam Sung Kim, University of Wisconsin-Madison, Madison, WI, USA
pp. 201-206
Alyssa Bonnoit, Carnegie Mellon University, Pittsburgh, PA, USA
Sebastian Herbert, Carnegie Mellon University, Pittsburgh, PA, USA
Diana Marculescu, Carnegie Mellon University, Pittsburgh, PA, USA
Lawrence Pileggi, Carnegie Mellon University, Pittsburgh, PA, USA
pp. 207-212
Mackenzie R. Scott, University of California, Davis, Davis, CA, USA
Rajeevan Amirtharajah, University of California, Davis, Davis, CA, USA
pp. 213-218
Daeyeon Kim, University of Michigan, Ann Arbor, MI, USA
Yoonmyung Lee, University of Michigan, Ann Arbor, MI, USA
Jin Cai, IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
Isaac Lauer, IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
Leland Chang, IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
Steven J. Koester, IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
Dennis Sylvester, University of Michigan, Ann Arbor, MI, USA
David Blaauw, University of Michigan, Ann Arbor, MI, USA
pp. 219-224
Fady Abouzeid, STMicroelectronics, Crolles, France
Sylvain Clerc, STMicroelectronics, Crolles, France
Fabian Firmin, STMicroelectronics, Crolles, France
Marc Renaudin, TIEMPO SAS, Montbonnot-Saint-Martin, France
Gilles Sicard, TIMA Laboratory, Grenoble, France
pp. 225-230
Thorlindur Thorolfsson, North Carolina State University, Raleigh, NC, USA
Nariman Moezzi-Madani, North Carolina State University, Raleigh, NC, USA
Paul D. Franzon, North Carolina State University, Raleigh, NC, USA
pp. 231-236
Wei Xu, Rensselaer Polytechnic Institute, Troy, NY, USA
Jibang Liu, Rensselaer Polytechnic Institute, Troy, NY, USA
Tong Zhang, Rensselaer Polytechnic Institute, Troy, NY, USA
pp. 237-242
Gaurav Dhiman, UC San Diego, La Jolla, CA, USA
Giacomo Marchetti, UC San Diego, La Jolla, CA, USA
Tajana Rosing, UC San Diego, La Jolla, CA, USA
pp. 243-248
Sushu Zhang, Arizona State University, Tempe, AZ, USA
Karam S. Chatha, Arizona State University, Tempe, AZ, USA
Goran Konjevod, Arizona State University, Tempe, AZ, USA
pp. 249-254
Justin Meza, HP Labs, Palo Alto, CA, USA
Mehul A. Shah, HP Labs, Palo Alto, CA, USA
Parthasarathy Ranganathan, HP Labs, Palo Alto, CA, USA
Mike Fitzner, Hewlett-Packard BCS, Redmond, WA, USA
Judson Veazey, Hewlett-Packard BCS, Ft. Collins, CO, USA
pp. 261-266
Karthik Kumar, Purdue University, West Lafayette, IN, USA
Yamini Nimmagadda, Purdue University, West Lafayette, IN, USA
Yung-Hsiang Lu, Purdue University, West Lafayette, IN, USA
pp. 267-272
Al Fazio, Intel Fellow, Director, Memory Technology Development, Technology and Manufacturing Group, , USA
pp. 275-276
Sherief Reda, Brown University, Providence, RI, USA
Aung Si, Brown University, Providence, RI, USA
R. Iris Bahar, Brown University, Providence, RI, USA
pp. 283-286
Ge Chen, University of New South Wales, Gwangju, Australia
Saeid Nooshabadi, Gwangju Institute of Science and Technology, Gwangju, South Korea
Steven Duvall, University of New South Wales, Sydney, Australia
pp. 287-290
Zheng Li, Tsinghua University, Beijing, China
Jie Wu, Tsinghua University, Beijing, China
Li Shang, University of Colorado, Boulder, CO, USA
Alan R. Mickelson, University of Colorado, Boulder, CO, USA
Manish Vachharajani, University of Colorado, Boulder, CO, USA
Dejan Filipovic, University of Colorado, Boulder, CO, USA
Wounjhang Park, University of Colorado, Boulder, CO, USA
Yihe Sun, Tsinghua University, Beijing, China
pp. 291-294
Guangyu Sun, Pennsylvania State University, State College, PA, USA
Xiaoxia Wu, Pennsylvania State University, State College, PA, USA
Yuan Xie, Pennsylvania State University, State College, PA, USA
pp. 295-298
Shu-Yi Wong, University of Windsor, Windsor, ON, Canada
Chunhong Chen, University of Windsor, Windsor, ON, Canada
Q.M. Jonathan Wu, University of Windsor, Windsor, ON, Canada
pp. 299-302
Veera Papirla, Arizona State University, Tempe, AZ, USA
Aarul Jain, Arizona State University, Tempe, AZ, USA
Chaitali Chakrabarti, Arizona State University, Tempe, AZ, USA
pp. 303-306
Amin Ansari, University of Michigan, Ann Arbor, MI, USA
Shuguang Feng, University of Michigan, Ann Arbor, MI, USA
Shantanu Gupta, University of Michigan, Ann Arbor, MI, USA
Scott Mahlke, University of Michigan, Ann Arbor, MI, USA
pp. 307-310
Lou Jiana, Zhejiang University, Hangzhou, China
Wu Xiaobo, Zhejiang University, Hangzhou, China
pp. 311-314
Aida Todri, University of California Santa Barbara, Santa Barbara, CA, USA
Malgorzata Marek-Sadowska, University of California Santa Barbara, Santa Barbara, CA, USA
pp. 315-318
Feng Luo, The University of Arizona, Tucson, AZ, USA
Rajdeep Bondade, The University of Arizona, Tucson, AZ, USA
Dongsheng Ma, The University of Arizona, Tucson, AZ, USA
pp. 319-322
A novel 0.5 V 15 (Abstract)
Dominic Maurath, Chair of Microelectronics, Department of Microsystems Engineering (IMTEK), Freiburg, Germany
Charalambos Andreou, Chair of Microelectronics, Department of Microsystems Engineering (IMTEK), Freiburg, Germany
Yiannos Manoli, Chair of Microelectronics, Department of Microsystems Engineering (IMTEK), Freiburg, Germany
pp. 323-326
Joseph Nayfach-Battilana, UC Santa Cruz, Santa Cruz, CA, USA
Jose Renau, UC Santa Cruz, Santa Cruz, CA, USA
pp. 327-330
Yousra Alkabani, Rice University, Houston, TX, USA
Farinaz Koushanfar, Rice University, Houston, TX, USA
Miodrag Potkonjak, UCLA, Los Angeles, CA, USA
pp. 331-334
Seungrok Jung, SOC Platform Development Team, System LSI Division, Device Solution Business, Samsung Electronics, Yongin, South Korea
Jungsoo Kim, Dept. of EECS, Korea Advanced Institute of Science and Technology, Daejeon, South Korea
Sangkwon Na, Dept. of EECS, Korea Advanced Institute of Science and Technology, Daejeon, South Korea
Chong-Min Kyung, Dept. of EECS, Korea Advanced Institute of Science and Technology, Daejeon, South Korea
pp. 335-338
Mian Dong, Rice University, Houston, TX, USA
Yung-Seok Kevin Choi, Rice University, Houston, TX, USA
Lin Zhong, Rice University, Houston, TX, USA
pp. 339-342
Jongmin Lee, Korea Advanced Institute of Science and Technology, Daejoen, South Korea
Soontae Kim, Korea Advanced Institute of Science and Technology, Daejoen, South Korea
pp. 343-346
Se Hun Kim, Georgia Institute of Technology, Atlanta, GA, USA
Saibal Mukohopadhyay, Georgia Institute of Technology, Atlanta, GA, USA
Wayne Wolf, Georgia Institute of Technology, Atlanta, GA, USA
pp. 347-350
Yuwen Sun, University of Pittsburgh, Pittsburgh, PA, USA
Shimeng Huang, University of Pittsburgh, Pittsburgh, PA, USA
Joseph Oresko, University of Pittsburgh, Pittsburgh, PA, USA
John Krais, University of Pittsburgh, Pittsburgh, PA, USA
Allen C. Cheng, University of Pittsburgh, Pittsburgh, PA, USA
pp. 351-354
Sonali Chouhan, Indian Institute of Technology Delhi, New Delhi, India
M. Balakrishnan, Indian Institute of Technology Delhi, New Delhi, India
Ranjan Bose, Indian Institute of Technology Delhi, New Delhi, India
pp. 355-358
Soheil Modirzadeh, Cadence, San Jose, USA
Brian Fuller, Editor, Corte Madera, USA
Sandeep Mirchandani, Broadcom, San Jose, USA
Jon McDonald, Mentor, San Jose, USA
Ran Avinun, Cadence, San Jose, USA
Camille Kokozaki, IDT, San Jose, USA
pp. 359-360
Joo-Young Kim, Korea Advanced Institute of Science and Technology, Daejeon, South Korea
Seungjin Lee, Korea Advanced Institute of Science and Technology, Daejeon, South Korea
Jinwook Oh, Korea Advanced Institute of Science and Technology, Daejeon, South Korea
Minsu Kim, Korea Advanced Institute of Science and Technology, Daejeon, South Korea
Hoi-Jun Yoo, Korea Advanced Institute of Science and Technology, Daejeon, South Korea
pp. 365-370
Michael J. Lyons, Harvard University, Cambridge, MA, USA
David Brooks, Harvard University, Cambridge, MA, USA
pp. 371-376
Anita Lungu, Duke University, Durham, NC, USA
Pradip Bose, IBM, Yorktown Heights, NY, USA
Alper Buyuktosunoglu, IBM, Yorktown Heights, NY, USA
Daniel J. Sorin, Duke University, Durham, NC, USA
pp. 377-382
Madhu Saravana Sibi Govindan, University of Texas at Austin, Austin, TX, USA
Stephen W. Keckler, University of Texas at Austin, Austin, TX, USA
Doug Burger, Microsoft, Redmond, WA, USA
pp. 383-388
Satendra Kumar Maurya, Arizona State University, Tempe, AZ, USA
Lawrence T. Clark, Arizona State University, Tempe, AZ, USA
pp. 389-394
Guihai Yan, Institute of Computing Technology, Chinese Academy of Sciences, Beijing, China
Yinhe Han, Institute of Computing Technology, Chinese Academy of Sciences, Beijing, China
Hui Liu, Institute of Computing Technology, Chinese Academy of Sciences, Beijing, China
Xiaoyao Liang, NVIDIA Corporation, Santa Clara, CA, USA
Xiaowei Li, Institute of Computing Technology, Chinese Academy of Sciences, Beijing, China
pp. 395-400
Hang Yu, Rice University, Houston, TX, USA
Lin Zhong, Rice University, Houston, TX, USA
Ashutosh Sabharwal, Rice University, Houston, TX, USA
pp. 401-406
Jinsik Kim, University of California, Irvine, Irvine, CA, USA
Pai H. Chou, University of California, Irvine, Irvine, CA, USA
pp. 407-412
Clemens Moser, ETH, Zurich, Switzerland
Jian-Jia Chen, ETH, Zurich, Switzerland
Lothar Thiele, ETH, Zurich, Switzerland
pp. 413-418
Zainul Charbiwala, University of California, Los Angeles, Los Angeles, CA, USA
Younghun Kim, University of California, Los Angeles, Los Angeles, CA, USA
Sadaf Zahedi, University of California, Los Angeles, Los Angeles, CA, USA
Jonathan Friedman, University of California, Los Angeles, Los Angeles, CA, USA
Mani B. Srivastava, University of California, Los Angeles, Los Angeles, CA, USA
pp. 419-424
Kaushik Roy, Purdue University, , USA
pp. 425-426
Norm Jouppi, HP Labs, , USA
Yuan Xie, Pennsylvania State University, , USA
pp. 427-428
Suman Datta, Pennsylvania State University, University Park, USA
Vijaykrishnan Narayanan, Pennsylvania State University, University Park, USA
pp. 429-430
Vijay Raghunathan, Purdue University, West Lafayette, IN, USA
pp. 431-432
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