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IC / Package Design Integration, IEEE Symposium on (1998)
Santa Cruz, California
Feb. 2, 1998 to Feb. 3, 1998
ISBN: 0-8186-8433-X
TABLE OF CONTENTS
Invited Overview
Session I: Logic and Memory
Session II: Interconnections
Session III: High-Level Design Methodologies
Session IV: Flip-Chip
Session V: RF-Wireless
Session VI: Package Design
Session VII: Modeling and Analysis
Author Index (PDF)
pp. 149
6 ms
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