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  • 1998
  • IEEE Symposium on IC/Package Design Integration
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IEEE Symposium on IC/Package Design Integration
Santa Cruz, California
February 02-February 03
ISBN: 0-8186-8433-X
Table of Contents
Invited Overview
Session I: Logic and Memory
Session II: Interconnections
Session III: High-Level Design Methodologies
Session IV: Flip-Chip
Session V: RF-Wireless
Session VI: Package Design
Session VII: Modeling and Analysis
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