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IPCC 2005. Proceedings. International Professional Communication Conference, 2005.
July 10-July 13
ISBN: 0-7803-9027-X
Table of Contents
Papers
C. Yee, New Mexico Inst. of Min.&Technol., Socorro, NM, USA
I. Davidson, New Mexico Inst. of Min.&Technol., Socorro, NM, USA
pp. 20-25
J. Lax, Sch. of Electr.&Comput. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 40-46
J. Watson, Cleveland State Univ., OH, USA
A. Brush, Cleveland State Univ., OH, USA
L. Penkowski, Cleveland State Univ., OH, USA
pp. 122-128
J. Turns, Dept. of Tech. Commun., Univ. of Washington, USA
J. Ramey, Dept. of Tech. Commun., Univ. of Washington, USA
pp. 144-150
S. Allender-Hagedorn, Virginia Univ., Charlottesville, VA, USA
C.W. Ruggiero, Virginia Univ., Charlottesville, VA, USA
pp. 161-175
W. Blokzijl, Inst. of Technol.&Commun., Delft Univ. of Technol., Netherlands
B. Andeweg, Inst. of Technol.&Commun., Delft Univ. of Technol., Netherlands
pp. 288-299
A.O. Bafail, King Abdulaziz Univ., Jeddah, Saudi Arabia
S.A.H. Rizvi, King Abdulaziz Univ., Jeddah, Saudi Arabia
S.I. Ishrat, King Abdulaziz Univ., Jeddah, Saudi Arabia
pp. 300-307
S. Cakir, Dokuz Eylul Univ., Izmir, Turkey
H.H. Basak, Dokuz Eylul Univ., Izmir, Turkey
pp. 318-322
K.T. Rainey, Southern Polytech. State Univ., Atlanta, GA, USA
R.K. Turner, Southern Polytech. State Univ., Atlanta, GA, USA
D. Dayton, Southern Polytech. State Univ., Atlanta, GA, USA
pp. 359-368
J. Mackiewicz, Illinois Inst. of Technol., Chicago, IL, USA
K. Riley, Illinois Inst. of Technol., Chicago, IL, USA
pp. 414-421
P.E. Weiss, Toronto Univ., Ont., Canada
S. McCahan, Toronto Univ., Ont., Canada
M. Hundleby, Toronto Univ., Ont., Canada
K. Woodhouse, Toronto Univ., Ont., Canada
pp. 508-516
C. van Hooijdonk, Tilburg Univ., Netherlands
A. Maes, Tilburg Univ., Netherlands
N. Ummelen, Tilburg Univ., Netherlands
pp. 546-553
E. Cuddihy, Washington Univ., Seattle, WA, USA
C. Wei, Washington Univ., Seattle, WA, USA
A.L. Bartell, Washington Univ., Seattle, WA, USA
J. Barrick, Washington Univ., Seattle, WA, USA
B. Maust, Washington Univ., Seattle, WA, USA
S.S. Leopold, Washington Univ., Seattle, WA, USA
J.H. Spyridakis, Washington Univ., Seattle, WA, USA
pp. 554-561
S. Lloyd, Comput. Lab., Oxford Univ., UK
A. Simpson, Comput. Lab., Oxford Univ., UK
pp. 602-611
S. Feinberg, Dept. of Humanities, Illinois Inst. of Technol., Chicago, IL, USA
L. Batson, Dept. of Humanities, Illinois Inst. of Technol., Chicago, IL, USA
pp. 752-758
M. Eliot, Dept. of Tech. Commun., Washington Univ., St. Louis, MO, USA
R. Neal, Dept. of Tech. Commun., Washington Univ., St. Louis, MO, USA
J. Turns, Dept. of Tech. Commun., Washington Univ., St. Louis, MO, USA
pp. 778-788
Q. Zhou, Dept. of Tech. Commun., Washington Univ., USA
R. DeSantis, Dept. of Tech. Commun., Washington Univ., USA
pp. 789-796
D. Casey, Dept. of Manage. Inf. Syst., Univ. Coll. Dublin, Ireland
C. Brugha, Dept. of Manage. Inf. Syst., Univ. Coll. Dublin, Ireland
pp. 813-828
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