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2011 IEEE 17th International On-Line Testing Symposium
Athens
July 13-July 15
ISBN: 978-1-4577-1053-7
Table of Contents
Papers
S. Khan, Comput. Eng. Lab., Delft Univ. of Technol., Delft, Netherlands
S. Hamdioui, Comput. Eng. Lab., Delft Univ. of Technol., Delft, Netherlands
pp. 1-6
T. Uemura, Fujitsu Semicond. Ltd., Tokyo, Japan
T. Kato, Fujitsu Semicond. Ltd., Tokyo, Japan
H. Matsuyama, Fujitsu Semicond. Ltd., Tokyo, Japan
K. Takahisa, Osaka Univ., Suita, Japan
M. Fukuda, Osaka Univ., Suita, Japan
K. Hatanaka, Osaka Univ., Suita, Japan
pp. 7-12
T. Inoue, Grad. Sch. of Inf. Sci., Hiroshima City Univ., Hiroshima, Japan
H. Henmi, Grad. Sch. of Inf. Sci., Hiroshima City Univ., Hiroshima, Japan
Y. Yoshikawa, Grad. Sch. of Inf. Sci., Hiroshima City Univ., Hiroshima, Japan
H. Ichihara, Grad. Sch. of Inf. Sci., Hiroshima City Univ., Hiroshima, Japan
pp. 13-18
D. Silva, Electr. Eng. Dept., Catholic Univ. - PUCRS, Porto Alegre, Brazil
L. Bolzani, Electr. Eng. Dept., Catholic Univ. - PUCRS, Porto Alegre, Brazil
F. Vargas, Electr. Eng. Dept., Catholic Univ. - PUCRS, Porto Alegre, Brazil
pp. 19-24
J. Abella, Barcelona Supercomput. Center, Barcelona, Spain
E. Quiñones, Barcelona Supercomput. Center, Barcelona, Spain
F. J. Cazorla, Barcelona Supercomput. Center, Barcelona, Spain
M. Valero, Barcelona Supercomput. Center, Barcelona, Spain
Y. Sazeides, Univ. of Cyprus, Nicosia, Cyprus
pp. 25-30
M. Paolieri, Barcelona Supercomput. Center, Barcelona, Spain
R. Mariani, YOGITECH SpA, Pisa, Italy
pp. 31-36
R. R. Ferreira, Inst. de Inf., Univ. Fed. do Rio Grande do Sul, Porto Alegre, Brazil
A. F. Moreira, Inst. de Inf., Univ. Fed. do Rio Grande do Sul, Porto Alegre, Brazil
L. Carro, Inst. de Inf., Univ. Fed. do Rio Grande do Sul, Porto Alegre, Brazil
pp. 37-42
M. Augustin, Comput. Sci. Inst., BTU Cottbus, Cottbus, Germany
M. Gossel, Comput. Sci. Inst., Potsdam Univ., Potsdam, Germany
R. Kraemer, IHP, Frankfurt (Oder), Germany
pp. 43-48
E. Costenaro, iRoC Technol., Grenoble, France
M. Violante, Dipt. di Autom. e Inf. Torino, Politec. di Torino, Torino, Italy
D. Alexandrescu, iRoC Technol., Grenoble, France
pp. 49-54
F. Chaix, Tech. of Inf. & Microelectron. for Integrated Syst. Archit., Grenoble Univ., Grenoble, France
G. Bizot, Tech. of Inf. & Microelectron. for Integrated Syst. Archit., Grenoble Univ., Grenoble, France
M. Nicolaidis, Tech. of Inf. & Microelectron. for Integrated Syst. Archit., Grenoble Univ., Grenoble, France
Nacer-Eddine Zergainoh, Tech. of Inf. & Microelectron. for Integrated Syst. Archit., Grenoble Univ., Grenoble, France
pp. 55-60
R. Rodrigues, Dept. of Electr. & Comput. Eng., Univ. of Massachusetts at Amherst, Amherst, MA, USA
S. Kundu, Dept. of Electr. & Comput. Eng., Univ. of Massachusetts at Amherst, Amherst, MA, USA
pp. 61-66
R. Rodrigues, Dept. of Electr. & Comput. Eng., Univ. of Massachusetts at Amherst, Amherst, MA, USA
S. Kundu, Dept. of Electr. & Comput. Eng., Univ. of Massachusetts at Amherst, Amherst, MA, USA
pp. 67-72
L. Zaourar, SOC Dept., LIP6 Lab., Paris, France
Y. Kieffer, G-SCOP Lab., Grenoble, France
A. Wenzel, STMicroelectronics, Crolles, France
pp. 73-78
A. Fradi, Electron. & Microelectron. Lab., Monastir, Tunisia
M. Nicolaidis, TIMA Lab., UJF, Grenoble, France
L. Anghel, TIMA Lab., UJF, Grenoble, France
pp. 79-85
C. Bolchini, Dipt. di Elettron. e Inf., Politec. di Milano, Milan, Italy
C. Sandionigi, Dipt. di Elettron. e Inf., Politec. di Milano, Milan, Italy
L. Fossati, Eur. Space Agency, Noordwijk, Netherlands
D. M. Codinachs, Eur. Space Agency, Noordwijk, Netherlands
pp. 92-97
J. T. Flaquer, Central CAD & Design Solutions (CCDS), STMicrolectronics, Crolles, France
J. M. Daveau, Central CAD & Design Solutions (CCDS), STMicrolectronics, Crolles, France
L. Naviner, COMELEC Dept., Telecom Paristech, Paris, France
P. Roche, Central CAD & Design Solutions (CCDS), STMicrolectronics, Crolles, France
pp. 98-103
M. Sauer, Albert-Ludwigs-Univ. Freiburg, Freiburg, Germany
A. Czutro, Albert-Ludwigs-Univ. Freiburg, Freiburg, Germany
I. Polian, Univ. of Passau, Passau, Germany
B. Becker, Albert-Ludwigs-Univ. Freiburg, Freiburg, Germany
pp. 104-110
N. Aymerich, Univ. Politec. de Catalunya, Barcelona, Spain
A. Asenov, Univ. of Glasgow, Glasgow, UK
A. Brown, Univ. of Glasgow, Glasgow, UK
R. Canal, Univ. Politec. de Catalunya, Barcelona, Spain
B. Cheng, Univ. of Glasgow, Glasgow, UK
J. Figueras, Univ. Politec. de Catalunya, Barcelona, Spain
A. Gonzalez, Intel, Barcelona, Spain
E. Herrero, Intel, Barcelona, Spain
S. Markov, Univ. of Glasgow, Glasgow, UK
M. Miranda, Imec, Leuven, Belgium
P. Pouyan, Univ. Politec. de Catalunya, Barcelona, Spain
T. Ramirez, Intel, Barcelona, Spain
A. Rubio, Univ. Politec. de Catalunya, Barcelona, Spain
I. Vatajelu, Univ. Politec. de Catalunya, Barcelona, Spain
X. Vera, Intel, Barcelona, Spain
X. Wang, Univ. of Glasgow, Glasgow, UK
P. Zuber, Imec, Leuven, Belgium
pp. 111-114
Zhaobo Zhang, Dept. Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
X. Kavousianos, Dept. Comput. Sci., Univ. of Ioannina, Ioannina, Greece
Y. Tsiatouhas, Dept. Comput. Sci., Univ. of Ioannina, Ioannina, Greece
K. Chakrabarty, Dept. Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
pp. 115-120
R. Alhakim, TIMA Lab., Grenoble Univ., Grenoble, France
E. Simeu, TIMA Lab., Grenoble Univ., Grenoble, France
K. Raoof, GIPSA-Lab., Grenoble Univ., St. Martin d'Heres, France
pp. 121-126
J. Natarajan, Dept. of Electical & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
S. Sen, Dept. of Electical & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
A. Chatterjee, Dept. of Electical & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 127-132
I. Verbauwhede, ESAT/COSIC, K.U. Leuven, Leuven, Belgium
pp. 133
B. Sunar, Dept. of Electr. & Comput. Eng., Worcester Polytech. Inst., Worcester, MA, USA
pp. 138
Y. Shiyanovskii, Case Western Reserve Univ., Cleveland, OH, USA
A. Rajendran, Case Western Reserve Univ., Cleveland, OH, USA
C. Papachristou, Case Western Reserve Univ., Cleveland, OH, USA
pp. 139-144
A. Rajendran, Case Western Reserve Univ., Cleveland, OH, USA
Y. Shiyanovskii, Case Western Reserve Univ., Cleveland, OH, USA
F. Wolff, Case Western Reserve Univ., Cleveland, OH, USA
C. Papachristou, Case Western Reserve Univ., Cleveland, OH, USA
pp. 145-150
S. Yoshimoto, Kobe Univ., Kobe, Japan
T. Amashita, Kobe Univ., Kobe, Japan
D. Kozuwa, Kyushu Univ., Fukuoka, Japan
T. Takata, Kyushu Univ., Fukuoka, Japan
M. Yoshimura, Kyushu Univ., Fukuoka, Japan
Y. Matsunaga, Kyushu Univ., Fukuoka, Japan
H. Yasuura, CREST, JST, Saitama, Japan
H. Kawaguchi, Kobe Univ., Kobe, Japan
M. Yoshimoto, CREST, JST, Saitama, Japan
pp. 151-156
K. Karmarkar, Dept. of Electr. & Comput. Eng., Southern Illinois Univ. at Carbondale, Carbondale, IL, USA
S. Tragoudas, Dept. of Electr. & Comput. Eng., Southern Illinois Univ. at Carbondale, Carbondale, IL, USA
pp. 157-162
V. Prasanth, Comput. Design & Test Lab., Indian Inst. of Sci., Bangalore, India
V. Singh, Comput. Design & Test Lab., Indian Inst. of Sci., Bangalore, India
R. Parekhji, Texas Instrum. (India) Pvt. Ltd., Bangalore, India
pp. 163-168
M. E. Imhof, Inst. of Comput. Archit. & Comput. Eng., Univ. of Stuttgart, Stuttgart, Germany
Hans-Joachim Wunderlich, Inst. of Comput. Archit. & Comput. Eng., Univ. of Stuttgart, Stuttgart, Germany
pp. 169-174
G. Boschi, Yogitech SpA, Pisa, Italy
R. Mariani, Yogitech SpA, Pisa, Italy
S. Lorenzini, Yogitech SpA, Pisa, Italy
pp. 177-178
A. Vaskova, Electron. Technol. Dept., Carlos III Univ. of Madrid, Leganes, Spain
C. Lopez-Ongil, Electron. Technol. Dept., Carlos III Univ. of Madrid, Leganes, Spain
E. S. Millan, Electron. Technol. Dept., Carlos III Univ. of Madrid, Leganes, Spain
A. Jimenez-Horas, Electron. Technol. Dept., Carlos III Univ. of Madrid, Leganes, Spain
L. Entrena, Electron. Technol. Dept., Carlos III Univ. of Madrid, Leganes, Spain
pp. 179-181
M. Sauer, Albert-Ludwigs-Univ., Freiburg, Germany
V. Tomashevich, Univ. of Passau, Passau, Germany
J. Muller, Albert-Ludwigs-Univ., Freiburg, Germany
M. Lewis, Albert-Ludwigs-Univ., Freiburg, Germany
A. Spilla, Albert-Ludwigs-Univ., Freiburg, Germany
I. Polian, Univ. of Passau, Passau, Germany
B. Becker, Albert-Ludwigs-Univ., Freiburg, Germany
W. Burgard, Albert-Ludwigs-Univ., Freiburg, Germany
pp. 182-185
N. Khoshavi, Dept. of Comput. Eng. & Inf. Technol., Amirkabir Univ. of Technol., Tehran, Iran
H. R. Zarandi, Dept. of Comput. Eng. & Inf. Technol., Amirkabir Univ. of Technol., Tehran, Iran
M. Maghsoudloo, Dept. of Comput. Eng. & Inf. Technol., Amirkabir Univ. of Technol., Tehran, Iran
pp. 190-191
O. Keren, Sch. of Eng., Bar Ilan Univ., Ramat Gan, Israel
I. Levin, Sch. of Educ., Tel Aviv Univ., Tel Aviv, Israel
V. Sinelnikov, Sch. of Eng., Bar Ilan Univ., Ramat Gan, Israel
pp. 192-193
R. Salamat, Dept. of Comput. Eng. & Inf. Technol., Amirkabir Univ. of Technol., Tehran, Iran
H. R. Zarandi, Dept. of Comput. Eng. & Inf. Technol., Amirkabir Univ. of Technol., Tehran, Iran
pp. 196-197
V. Gherman, Embedded Syst. Reliability Lab., CEA, Gif-sur-Yvette, France
S. Evain, Embedded Syst. Reliability Lab., CEA, Gif-sur-Yvette, France
N. Seymour, Embedded Syst. Reliability Lab., CEA, Gif-sur-Yvette, France
Y. Bonhomme, Embedded Syst. Reliability Lab., CEA, Gif-sur-Yvette, France
pp. 198-201
J. O. M. Esteves, Dept. of Electr. & Comput. Eng., UTL, Lisbon, Portugal
T. H. Moita, Dept. of Electr. & Comput. Eng., UTL, Lisbon, Portugal
C. B. Almeida, Dept. of Electr. & Comput. Eng., UTL, Lisbon, Portugal
Marcelino B. dos Santos, Dept. of Electr. & Comput. Eng., UTL, Lisbon, Portugal
pp. 202-205
C. Killian, Lab. Interfaces, Sensors & Microelectron., Univ. of Paul Verlaine, Metz, France
C. Tanougast, Lab. Interfaces, Sensors & Microelectron., Univ. of Paul Verlaine, Metz, France
F. Monteiro, Lab. Interfaces, Sensors & Microelectron., Univ. of Paul Verlaine, Metz, France
A. Dandache, Lab. Interfaces, Sensors & Microelectron., Univ. of Paul Verlaine, Metz, France
pp. 206-207
L. Pierce, Dept. of Electr. & Comput. Eng., Southern Illinois Univ., Carbondale, IL, USA
S. Tragoudas, Dept. of Electr. & Comput. Eng., Southern Illinois Univ., Carbondale, IL, USA
pp. 208-209
R. P. Ribas, Univ. of British Columbia, Vancouver, BC, Canada
Yuyang Sun, Univ. of British Columbia, Vancouver, BC, Canada
A. I. Reis, Fed. Univ. of Rio Grande do Sul, Porto Alegre, Brazil
A. Ivanov, Univ. of British Columbia, Vancouver, BC, Canada
pp. 210-213
N. F. Ghalaty, Dept. of Comput. Eng., Sharif Univ. of Technol., Tehran, Iran
M. Fazeli, Dept. of Comput. Eng., Sharif Univ. of Technol., Tehran, Iran
H. I. Rad, Dept. of Comput. Eng., Sharif Univ. of Technol., Tehran, Iran
S. G. Miremadi, Dept. of Comput. Eng., Sharif Univ. of Technol., Tehran, Iran
pp. 214-217
M. Linder, Dept. of Electr. Eng., Univ. of Appl. Sci. Augsburg, Augsburg, Germany
A. Eder, Dept. of Electr. Eng., Univ. of Appl. Sci. Augsburg, Augsburg, Germany
K. Oberlander, Infineon Technol. AG, Neubiberg, Germany
M. Huch, Infineon Technol. AG, Neubiberg, Germany
pp. 218-221
A. Krieg, Inst. for Tech. Inf., Graz Univ. of Technol., Graz, Austria
J. Grinschgl, Inst. for Tech. Inf., Graz Univ. of Technol., Graz, Austria
C. Steger, Inst. for Tech. Inf., Graz Univ. of Technol., Graz, Austria
R. Weiss, Inst. for Tech. Inf., Graz Univ. of Technol., Graz, Austria
J. Haid, Design Center Graz, Infineon Technol. Austria AG, Graz, Austria
pp. 222-227
Honorio Martin, Electron. Technol. Dept., Carlos III Univ. of Madrid, Leganes, Spain
Enrique San Millan, Electron. Technol. Dept., Carlos III Univ. of Madrid, Leganes, Spain
Luis Entrena, Electron. Technol. Dept., Carlos III Univ. of Madrid, Leganes, Spain
Pedro Peris Lopez, Inf. & Commun. Theor. Group, Delft Univ. of Technol., Delft, Netherlands
Julio Cesar Hernandez Castro, Sch. of Comput., Univ. of Portsmouth, Portsmouth, UK
pp. 228-233
Zhen Wang, Reliable Comput. Lab., Boston Univ., Boston, MA, USA
M. Karpovsky, Reliable Comput. Lab., Boston Univ., Boston, MA, USA
pp. 234-239
J. Abella, Barcelona Supercomput. Center (BSC), Barcelona, Spain
F. J. Cazorla, Barcelona Supercomput. Center (BSC), Barcelona, Spain
E. Quinones, Barcelona Supercomput. Center (BSC), Barcelona, Spain
Dimitris Gizopoulos, Dept. of Inf. & Telecommun., Univ. of Athens, Athens, Greece
pp. 240-245
T. Takata, Dept. of Adv. Inf. Technol., Kyushu Univ., Fukuoka, Japan
Y. Matsunaga, Dept. of Adv. Inf. Technol., Kyushu Univ., Fukuoka, Japan
pp. 246-251
D. Sanchez, Dept. of Comput. Eng., Univ. of Murcia, Murcia, Spain
Y. Sazeides, Dept. of Comput. Sci., Univ. of Cyprus, Nicosia, Cyprus
J. L. Aragon, Dept. of Comput. Eng., Univ. of Murcia, Murcia, Spain
J. M. Garcia, Dept. of Comput. Eng., Univ. of Murcia, Murcia, Spain
pp. 252-257
A. Vaskova, Electron. Technol. Dept., Carlos III Univ. of Madrid, Leganes, Spain
C. Lopez-Ongil, Electron. Technol. Dept., Carlos III Univ. of Madrid, Leganes, Spain
M. Garcia-Valderas, Electron. Technol. Dept., Carlos III Univ. of Madrid, Leganes, Spain
M. Portela-Garcia, Electron. Technol. Dept., Carlos III Univ. of Madrid, Leganes, Spain
L. Entrena, Electron. Technol. Dept., Carlos III Univ. of Madrid, Leganes, Spain
pp. 258-263
N. Madalin, Dept. of Syst. Eng., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
L. Miclea, Dept. of Syst. Eng., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
J. Figueras, Dept. of Electron. Eng., Univ. Politec. de Catalunya, Barcelona, Spain
pp. 264-269
P. Bernardi, Dipt. di Autom. e Inf., Politec. di Torino, Torino, Italy
L. Ciganda, Dipt. di Autom. e Inf., Politec. di Torino, Torino, Italy
E. Sanchez, Dipt. di Autom. e Inf., Politec. di Torino, Torino, Italy
M. S. Reorda, Dipt. di Autom. e Inf., Politec. di Torino, Torino, Italy
pp. 270-275
R. Baranowski, Inst. of Comput. Archit. & Comput. Eng., Univ. of Stuttgart, Stuttgart, Germany
H. Wunderlich, Inst. of Comput. Archit. & Comput. Eng., Univ. of Stuttgart, Stuttgart, Germany
pp. 276-281
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