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2008 IEEE 14th International Mixed-Signals, Sensors, and Systems Test Workshop
Vancouver, BC, Canada
June 18-June 20
ISBN: 978-1-4244-2395-8
Table of Contents
Papers
Kuldip N. Modha, SiOS Labs, Applied Optics Group, School of Electrical/Electronic Engineering, University of Nottingham, NG7 2RD, UK
Ian M. Stockford, SiOS Labs, Applied Optics Group, School of Electrical/Electronic Engineering, University of Nottingham, NG7 2RD, UK
Roger Light, SiOS Labs, Applied Optics Group, School of Electrical/Electronic Engineering, University of Nottingham, NG7 2RD, UK
Matt Clark, SiOS Labs, Applied Optics Group, School of Electrical/Electronic Engineering, University of Nottingham, NG7 2RD, UK
Mark Pitter, SiOS Labs, Applied Optics Group, School of Electrical/Electronic Engineering, University of Nottingham, NG7 2RD, UK
Barrie Hayes-Gill, SiOS Labs, Applied Optics Group, School of Electrical/Electronic Engineering, University of Nottingham, NG7 2RD, UK
pp. 1-4
Xiao Zhang, Testable Design and Test of Integrated Systems Group, CTIT University of Twente, Enschede, the Netherlands
Frits van Proosdij, Testable Design and Test of Integrated Systems Group, CTIT University of Twente, Enschede, the Netherlands
Hans G. Kerkhoff, Testable Design and Test of Integrated Systems Group, CTIT University of Twente, Enschede, the Netherlands
pp. 1-7
Daniel Davids, Department of Electrical and Computer Engineering, University of North Carolina at Charlotte, 28223, USA
Bharat Joshi, Department of Electrical and Computer Engineering, University of North Carolina at Charlotte, 28223, USA
Arindam Mukherjee, Department of Electrical and Computer Engineering, University of North Carolina at Charlotte, 28223, USA
Arun Ravindran, Department of Electrical and Computer Engineering, University of North Carolina at Charlotte, 28223, USA
pp. 1-4
Zhao Lu, NanoRobotics Laboratory, Department of Computer and Software Engineering, Canada
Jaouad El-Fouladi, NanoRobotics Laboratory, Department of Computer and Software Engineering, Canada
Sylvain Martel, NanoRobotics Laboratory, Department of Computer and Software Engineering, Canada
Yvon Savaria, Department of Electric Engineering, École Polytechnique de Montréal, Campus of the University of Montréal, QC, CANADA
pp. 1-7
Abhilash Goyal, Georgia Institute of Technology, Department of Electrical and Computer Engineering, Atlanta, USA
Madhavan Swaminathan, Georgia Institute of Technology, Department of Electrical and Computer Engineering, Atlanta, USA
pp. 1-5
Chun Wei Lin, Department of Electronic Engineering, National Yunlin University of Science&Technology, Douliou, Taiwan
Sheng Feng Lin, Department of Electronic Engineering, National Yunlin University of Science&Technology, Douliou, Taiwan
Shih Fen Luo, Department of Electronic Engineering, National Yunlin University of Science&Technology, Douliou, Taiwan
pp. 1-5
Z. Xu, Centre for Microsystems Engineering, Engineering Department, Lancaster University, LA1 4YR, UK
D. Koltsov, Centre for Microsystems Engineering, Engineering Department, Lancaster University, LA1 4YR, UK
S. Saha, Centre for Microsystems Engineering, Engineering Department, Lancaster University, LA1 4YR, UK
A. Richardson, Centre for Microsystems Engineering, Engineering Department, Lancaster University, LA1 4YR, UK
A. Sutherland, Ultra Electronics ¿ BCF, Phoenix House, Phoenix Way, Cirencester, GL7 1QG, UK
pp. 1-4
Adam Osseiran, National Networked TeleTest Facility, Edith Cowan University, Joondalup, WA, 6027 Australia
pp. 1-5
Stone Cheng, Department of Mechanical Engineering, National Chiao-Tung University, Hsinchu , China
Po-Chien Chou, Department of Mechanical Engineering, National Chiao-Tung University, Hsinchu , China
pp. 1-6
Reik Muller, Institute for Traffic Communications Engineering, Dresden University of Technology, Germany
Carsten Wegener, Infineon Technologies AG, Munich, Germany
Hans-Joachim Jentschel, Institute for Traffic Communications Engineering, Dresden University of Technology, Germany
pp. 1-6
Xueyi Yu, Department of Electronics Engineering, Tsinghua University, Beijing, China 100084
Guolin Li, Department of Electronics Engineering, Tsinghua University, Beijing, China 100084
Lingwei Zhang, Institute of Microelectronics, Tsinghua University, Beijing, China 100084
Zhihua Wang, Institute of Microelectronics, Tsinghua University, Beijing, China 100084
pp. 1-5
Ebrahim Ghafar-Zadeh, Polystim Neurotechnologies Laboratory, Ecole Polytechnque de Montréal, Canada
Mohamad Sawan, Polystim Neurotechnologies Laboratory, Ecole Polytechnque de Montréal, Canada
Arghavan Shabani, Biosensor devision, Biophage Pharma Inc., Canada
Mohammed Zourob, Biosensor devision, Biophage Pharma Inc., Canada
Vamsy Chodavarapu, Electrical Engineering Department, McGill University, Canada
pp. 1-4
V. L. Geurkov, Ryerson University, ELCE, 350 Victoria Street, Toronto, ON M5B 2K3 Canada
pp. 1-4
Xuan-Lun Huang, Graduate Institute of Electronics Engineering, Department of Electrical Engineering, National Taiwan University, Taipei 106, Taiwan
Yuan-Chi Yu, Graduate Institute of Electronics Engineering, Department of Electrical Engineering, National Taiwan University, Taipei 106, Taiwan
Jiun-Lang Huang, Graduate Institute of Electronics Engineering, Department of Electrical Engineering, National Taiwan University, Taipei 106, Taiwan
pp. 1-6
Sachin Dasnurkar, Computer Engineering Research Center, The University of Texas at Austin, 78712 U.S.A.
Jacob Abraham, Computer Engineering Research Center, The University of Texas at Austin, 78712 U.S.A.
pp. 1-6
Benjamin Mustin, Technische Universität Dresden, George-Bähr-Str. 3, 01069, Germany
Boris Stoeber, The University of British Columbia, 2054-6250 Applied Science Lane, Vancouver, B.C. V6T 1Z4, Canada
pp. 1-6
Zhongcheng Gong, Institute for Micromanufacturing, Louisiana Tech University, USA
Tae-Woo Lee, Center for Computation&Technology, Louisiana State University, USA
Long Que, Institute for Micromanufacturing, Louisiana Tech University, USA
pp. 1-6
Jasbir N. Patel, School of Engineering Science, Simon Fraser University, Burnaby, BC, Canada
Bozena Kaminska, School of Engineering Science, Simon Fraser University, Burnaby, BC, Canada
Bonnie L. Gray, School of Engineering Science, Simon Fraser University, Burnaby, BC, Canada
Byron D. Gates, Department of Chemistry, Simon Fraser University, Burnaby, BC, Canada
pp. 1-5
Sumanjit Singh Lubana, Dept. of Electrical and Computer Engineering, University of Waterloo, Canada, N2L 3G1
Hossein Sarbishaei, Dept. of Electrical and Computer Engineering, University of Waterloo, Canada, N2L 3G1
Manoj Sachdev, Dept. of Electrical and Computer Engineering, University of Waterloo, Canada, N2L 3G1
pp. 1-6
Deuk Lee, School of ECE, Georgia Tech, USA
Rajarajan Senguttuvan, School of ECE, Georgia Tech, USA
Abhijit Chatterjee, School of ECE, Georgia Tech, USA
pp. 1-5
Ahcene Bounceur, TIMA Laboratory, 46, Avenue Félix Viallet, 38031 Grenoble Cedex, France
Salvador Mir, TIMA Laboratory, 46, Avenue Félix Viallet, 38031 Grenoble Cedex, France
pp. 1-6
N. Dumas, Laboratoire d¿Informatique, de Robotique et de Microélectronique de Montpellier (LIRMM), Université Montpellier II / CNRS, 161 Rue Ada, 34392 Cedex 5, France
F. Azais, Laboratoire d¿Informatique, de Robotique et de Microélectronique de Montpellier (LIRMM), Université Montpellier II / CNRS, 161 Rue Ada, 34392 Cedex 5, France
F. Mailly, Laboratoire d¿Informatique, de Robotique et de Microélectronique de Montpellier (LIRMM), Université Montpellier II / CNRS, 161 Rue Ada, 34392 Cedex 5, France
P. Nouet, Laboratoire d¿Informatique, de Robotique et de Microélectronique de Montpellier (LIRMM), Université Montpellier II / CNRS, 161 Rue Ada, 34392 Cedex 5, France
pp. 1-6
Xiaoqin Sheng, Testable Design and Testing of Integrated Systems Group, CTIT, University of Twente, Enschede, the Netherlands
Hans Kerkhoff, Testable Design and Testing of Integrated Systems Group, CTIT, University of Twente, Enschede, the Netherlands
Amir Zjajo, NXP Semiconductors, HighTech Campus 37, 5656 AE Eindhoven, the Netherlands
Guido Gronthoud, NXP Semiconductors, HighTech Campus 37, 5656 AE Eindhoven, the Netherlands
pp. 1-7
Wael M. El-Medany, Department of Communications and Electrical Engineering, Faculty of Engineering, Fayoum University, Egypt
pp. 1-4
Yang Zhao, Department of Electrical and Computer Engineering, Duke University, Durham, NC 27708, USA
Krishnendu Chakrabarty, Department of Electrical and Computer Engineering, Duke University, Durham, NC 27708, USA
pp. 1-6
T.O. Myers, Department of Engineering, University of Hull, UK
I.M. Bell, Department of Engineering, University of Hull, UK
pp. 1-6
Samar Haroun, Department of Chemistry, Simon Fraser University, Burnaby, BC, V5A 1S6, Canada
Paul C.H. Li, Department of Chemistry, Simon Fraser University, Burnaby, BC, V5A 1S6, Canada
pp. 1-6
Bernard Courtois, CMP, 46 avenue Felix Viallet, 38031 Grenoble Cedex, France
Benoit Charlot, IES/MITEA, Université Montpellier II, place E. Bataillon, 34095 cedex 5, France
Gregory Di Pendina, CMP, 46 avenue Felix Viallet, 38031 Grenoble Cedex, France
Libor Rufer, TIMA Laboratory, 46 avenue Felix Viallet, 38031 Grenoble, France
pp. 1-4
Jonas Flueckiger, Department of Electrical&Computer Engineering, University of British Columbia, Vancouver, Canada
Karen C. Cheung, Department of Electrical&Computer Engineering, University of British Columbia, Vancouver, Canada
pp. 1-6
Bonnie L. Gray, Microinstrumentation Lab, School of Engineering Science, Simon Fraser University, Burnaby, BC V5A1S6, Canada
Seema Jaffer, Microinstrumentation Lab, School of Engineering Science, Simon Fraser University, Burnaby, BC V5A1S6, Canada
Derek G. Sahota, Department of Engineering Physics, McMaster University, Hamilton, ON L8S 4L7, Canada
Stephanie M. Westwood, Microinstrumentation Lab, School of Engineering Science, Simon Fraser University, Burnaby, BC V5A1S6, Canada
pp. 1-5
A. Asquini, STMicroelectronics ¿ Crolles, France
Franck Badets, STMicroelectronics ¿ Crolles, France
Salvador Mir, TIMA Laboratory ¿ Grenoble, France
Jean-Louis Carbonero, STMicroelectronics ¿ Crolles, France
Laroussi Bouzaida, STMicroelectronics ¿ Crolles, France
pp. 1-5
D.C. Keezer, Georgia Institute of Technology, Atlanta, USA
D. Minier, IBM, Bromont, Canada
P. Ducharme, IBM, Bromont, Canada
pp. 1-6
O. Ginez, Université de Provence (Aix-Marseille I), L2MP-UMR CNRS 6137, 13451 Cedex 20, France
J.M. Portal, Université de Provence (Aix-Marseille I), L2MP-UMR CNRS 6137, 13451 Cedex 20, France
H. Aziza, Université de Provence (Aix-Marseille I), L2MP-UMR CNRS 6137, 13451 Cedex 20, France
pp. 1-6
A. Nojeh, Department of Electrical and Computer Engineering, University of British Columbia, 2332 Main Mall, Vancouver, Canada
P. Pande, School of Electrical Engineering and Computer Science, Washington State University, PO Box 642752, Pullman, USA
A. Ganguly, School of Electrical Engineering and Computer Science, Washington State University, PO Box 642752, Pullman, USA
S. Sheikhaei, Department of Electrical and Computer Engineering, University of British Columbia, 2332 Main Mall, Vancouver, Canada
B. Belzer, School of Electrical Engineering and Computer Science, Washington State University, PO Box 642752, Pullman, USA
A. Ivanov, Department of Electrical and Computer Engineering, University of British Columbia, 2332 Main Mall, Vancouver, Canada
pp. 1-6
Yuchun Chen, Department of Chemistry, Simon Fraser University, Burnaby, BC, V5A1S6, Canada
Paul C.H. Li, Department of Chemistry, Simon Fraser University, Burnaby, BC, V5A1S6, Canada
pp. 1-5
Andrew Labun, School of Engineering, University of British Columbia Okanagan, 3333 University Way, Kelowna, V1V 1V7, Canada
pp. 1-5
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