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IEEE International. 2005 Proceedings of the IEEE Workload Characterization Symposium, 2005.
Austin, TX, USA
October 06-October 08
ISBN: 0-7803-9461-5
Table of Contents
Papers
C. Isci, Dept. of Electr. Eng., Princeton Univ., NJ, USA
M. Martonosi, Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 13-23
M. Alvarez, Eur. Network of Excellence on High-Performance Embedded Archit.&Compilation, Univ. Politecnica de Catalunya, Barcelona, Spain
E. Salami, Eur. Network of Excellence on High-Performance Embedded Archit.&Compilation, Univ. Politecnica de Catalunya, Barcelona, Spain
A. Ramirez, Eur. Network of Excellence on High-Performance Embedded Archit.&Compilation, Univ. Politecnica de Catalunya, Barcelona, Spain
M. Valero, Eur. Network of Excellence on High-Performance Embedded Archit.&Compilation, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 24-33
null Man-Lap Li, Dept. of Comput. Sci., Illinois Univ., Urbana-Champaign, IL, USA
R. Sasanka, Dept. of Comput. Sci., Illinois Univ., Urbana-Champaign, IL, USA
S.V. Adve, Dept. of Comput. Sci., Illinois Univ., Urbana-Champaign, IL, USA
pp. 34-45
null Xiaofeng Gao, San Diego Supercomput. Center, La Jolla, CA, USA
M. Laurenzano, San Diego Supercomput. Center, La Jolla, CA, USA
B. Simon, San Diego Supercomput. Center, La Jolla, CA, USA
A. Snavely, San Diego Supercomput. Center, La Jolla, CA, USA
pp. 46-55
R. Morin, Intel Corp., Santa Clara, CA, USA
A. Kumar, Intel Corp., Santa Clara, CA, USA
E. Ilyina, Intel Corp., Santa Clara, CA, USA
pp. 67-75
F. Sanchez, HiPEAC Eur. Network of Excellence, Univ. Politecnica de Catalunya, Barcelona, Spain
E. Salami, HiPEAC Eur. Network of Excellence, Univ. Politecnica de Catalunya, Barcelona, Spain
A. Ramirez, HiPEAC Eur. Network of Excellence, Univ. Politecnica de Catalunya, Barcelona, Spain
M. Valero, HiPEAC Eur. Network of Excellence, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 99-108
null Zhongbo Cao, Dept. of Electr.&Comput. Eng., Iowa State Univ., Ames, IA, USA
null Wei Huang, Dept. of Electr.&Comput. Eng., Iowa State Univ., Ames, IA, USA
J.M. Chang, Dept. of Electr.&Comput. Eng., Iowa State Univ., Ames, IA, USA
pp. 119-128
B. Maron, IBM Corp., Austin, TX, USA
T. Chen, IBM Corp., Austin, TX, USA
D. Vianney, IBM Corp., Austin, TX, USA
B. Olszewski, IBM Corp., Austin, TX, USA
S. Kunkel, IBM Corp., Austin, TX, USA
A. Mericas, IBM Corp., Austin, TX, USA
pp. 129-136
D. Skinner, Nat. Energy Res. Sci. Comput. Center, Lawrence Berkeley Nat. Lab., USA
W. Kramer, Nat. Energy Res. Sci. Comput. Center, Lawrence Berkeley Nat. Lab., USA
pp. 137-149
T.S. Munson, Div. of Math.&Comput. Sci., Argonne Nat. Lab., IL, USA
P.D. Hovland, Div. of Math.&Comput. Sci., Argonne Nat. Lab., IL, USA
pp. 150-154
S. Daniel, Network Appliance, Inc., Sunnyvale, CA, USA
R.E. Faith, Network Appliance, Inc., Sunnyvale, CA, USA
pp. 174-177
S. Kamil, CRD/NERSC, Lawrence Berkeley Nat. Lab., CA, USA
J. Shalf, CRD/NERSC, Lawrence Berkeley Nat. Lab., CA, USA
L. Oliker, CRD/NERSC, Lawrence Berkeley Nat. Lab., CA, USA
D. Skinner, CRD/NERSC, Lawrence Berkeley Nat. Lab., CA, USA
pp. 178-187
L. Nazhandali, Michigan Univ., Ann Arbor, MI, USA
M. Minuth, Michigan Univ., Ann Arbor, MI, USA
T. Austin, Michigan Univ., Ann Arbor, MI, USA
pp. 197-203
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