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  • 2003 International Conference on Multimedia and Expo - Volume 2 (ICME '03)
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2003 International Conference on Multimedia and Expo - Volume 2 (ICME '03)
Baltimore, MD, USA
July 06-July 09
ISBN: 0-7803-7965-9
Table of Contents
Icme
J. Jachalsky, Inst. of Microelectron. Syst., Hannover Univ., Germany
M. Wahler, Inst. of Microelectron. Syst., Hannover Univ., Germany
P. Pirsch, Inst. of Microelectron. Syst., Hannover Univ., Germany
pp. 1-4
W. Wolf, Dept. of Electr. Eng., Princeton Univ., NJ, USA
B. Ozer, Dept. of Electr. Eng., Princeton Univ., NJ, USA
T. Lv, Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 5-8
K.S. Huang, Comput. Vision & Robotics Res. Lab., California Univ., San Diego, CA, USA
M.M. Trivedi, Comput. Vision & Robotics Res. Lab., California Univ., San Diego, CA, USA
pp. 9-12
M.M. Trivedi, Artificial Intelligence Lab., Massachusetts Inst. of Technol., Cambridge, MA, USA
T. Darrell, Artificial Intelligence Lab., Massachusetts Inst. of Technol., Cambridge, MA, USA
pp. 13-16
Eye Society (Abstract)
J. Mallett, Media Lab., MIT, Cambridge, MA, USA
J. Mallett, Media Lab., MIT, Cambridge, MA, USA
pp. 17-20
Feng Jing, State Key Lab of Intelligent Technol. & Syst., Beijing, China
Mingjing Li, Media Lab., MIT, Cambridge, MA, USA
Hong-Jiang Zhang, Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 21-24
C. Parker, Carnegie Mellon Univ., Pittsburgh, PA, USA
Tsuhan Chen, Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 29-32
Joo-Hwee Lim, Inst. for Infocomm Res., Singapore
P. Mulhem, Carnegie Mellon Univ., Pittsburgh, PA, USA
Qi Tian, Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 33-36
Bo Feng, Dept. of Comput. Eng. & Inf. Technol., City Univ. of Hong Kong, China
Qing Li, Dept. of Comput. Eng. & Inf. Technol., City Univ. of Hong Kong, China
Jun Yang, Dept. of Comput. Eng. & Inf. Technol., City Univ. of Hong Kong, China
pp. 37-40
Hui Cheng, Sarnoff Corp., Princeton, NJ, USA
Hui Cheng, Dept. of Comput. Eng. & Inf. Technol., City Univ. of Hong Kong, China
Y.Q. Shi, Dept. of Comput. Eng. & Inf. Technol., City Univ. of Hong Kong, China
pp. 41-44
N. Franchi, CEFRIEL, Politecnico di Milano, Milan, Italy
M. Fumagalli, CEFRIEL, Politecnico di Milano, Milan, Italy
R. Lancini, CEFRIEL, Politecnico di Milano, Milan, Italy
pp. 45-48
A. Matthur, Dept. of Comput. Sci. & Electr. Eng., Maryland Univ., Baltimore, MD, USA
P. Mundur, Dept. of Comput. Sci. & Electr. Eng., Maryland Univ., Baltimore, MD, USA
pp. 53-56
Hongliang Li, Sch. of Electron. & Information Eng., Xi'an Jiaotong Univ., China
Guizhong Liu, Sch. of Electron. & Information Eng., Xi'an Jiaotong Univ., China
Yonhli Li, Sch. of Electron. & Information Eng., Xi'an Jiaotong Univ., China
Zhongwei Zhang, Sch. of Electron. & Information Eng., Xi'an Jiaotong Univ., China
pp. 57-60
O. Schreer, Heinrich-Hertz-Inst., Fraunhofer-Inst. fur Nachrichtentechnik, Berlin, Germany
N. Atzpadin, Heinrich-Hertz-Inst., Fraunhofer-Inst. fur Nachrichtentechnik, Berlin, Germany
S. Askar, Heinrich-Hertz-Inst., Fraunhofer-Inst. fur Nachrichtentechnik, Berlin, Germany
P. Kauff, Heinrich-Hertz-Inst., Fraunhofer-Inst. fur Nachrichtentechnik, Berlin, Germany
pp. 61-64
J.C. Beyer, Dept. of Comput. Sci. & Eng., Minnesota Univ., Minneapolis, MN, USA
D.H.C. Du, Dept. of Comput. Sci. & Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 65-68
Wei Shu, New Mexico Univ., Albuquerque, NM, USA
Min-You Wu, New Mexico Univ., Albuquerque, NM, USA
pp. II69-72
K. Karpouzis, Image, Video & Multimedia Syst. Lab., Athens Nat. Tech. Univ., Greece
A. Raouzaiou, Image, Video & Multimedia Syst. Lab., Athens Nat. Tech. Univ., Greece
P. Tzouveli, Image, Video & Multimedia Syst. Lab., Athens Nat. Tech. Univ., Greece
S. Iaonnou, Image, Video & Multimedia Syst. Lab., Athens Nat. Tech. Univ., Greece
S. Kollias, Image, Video & Multimedia Syst. Lab., Athens Nat. Tech. Univ., Greece
pp. 81-84
T. Kawanishi, NTT Commun. Sci. Labs., NTT Corp., Japan
M. Tsuchida, NTT Commun. Sci. Labs., NTT Corp., Japan
S. Takagi, NTT Commun. Sci. Labs., NTT Corp., Japan
H. Murase, NTT Commun. Sci. Labs., NTT Corp., Japan
pp. 85-88
H. Kanda, Graduate Sch. of Global Inf. & Telecommun. Studies, Waseda Univ., Tokyo, Japan
J. Ohya, Graduate Sch. of Global Inf. & Telecommun. Studies, Waseda Univ., Tokyo, Japan
pp. 89-92
J. Ohya, Nat. Univ. of Singapore, Singapore
K. Sengupta, Graduate Sch. of Global Inf. & Telecommun. Studies, Waseda Univ., Tokyo, Japan
R. Sharma, NTT Commun. Sci. Labs., NTT Corp., Japan
pp. 93-96
Lijun Jiang, Inst. for Infocomm Res., Singapore, Singapore
Shiqian Wu, Inst. for Infocomm Res., Singapore, Singapore
Dajun Wu, Inst. for Infocomm Res., Singapore, Singapore
EePing Ong, Inst. for Infocomm Res., Singapore, Singapore
S. Rahardja, Inst. for Infocomm Res., Singapore, Singapore
pp. 97-9100
A.M.K. Siu, Dept. of Comput. Sci., City Univ. of Hong Kong, China
R.W.H. Lau, Dept. of Comput. Sci., City Univ. of Hong Kong, China
pp. 101-104
R.L. Gomes, LAAS-CNRS, Toulouse, France
G.J. Hoyos-Rivera, LAAS-CNRS, Toulouse, France
J.-P. Courtiat, LAAS-CNRS, Toulouse, France
pp. 105-108
Hyunjoo Kim, Sch. of Comput. Sci. & Eng., Seoul Nat. Univ., South Korea
Sooyong Kang, LAAS-CNRS, Toulouse, France
H.Y. Yeom, LAAS-CNRS, Toulouse, France
pp. 117-120
T.H. Yeo, Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore
W.C. Wong, LAAS-CNRS, Toulouse, France
D.Y. Huang, LAAS-CNRS, Toulouse, France
pp. 121-124
Fan Zhai, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
R. Beryy, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
T.N. Pappas, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
A.K. Katsaggelos, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
pp. 125-128
S.S. Karande, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
H. Radha, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
pp. 129-132
G. Agarwal, Motorola India Electron. Ltd., India
A. Anbu, Motorola India Electron. Ltd., India
A. Sinha, Motorola India Electron. Ltd., India
pp. 133-136
A. Sinha, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
K. Nahrstedt, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
Wanghong Yuan, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
pp. 137-140
T.K. Shih, Dept. of CS & IE, Tamkang Univ., Tamsui, Taiwan
L.H. Lin, Dept. of CS & IE, Tamkang Univ., Tamsui, Taiwan
Jen-Shiun Chiang, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
pp. 141-144
Wei-Ying Kung, Integrated Media Syst. Center, Univ. of Southern California, Los Angeles, CA, USA
Chang-Su Kim, Integrated Media Syst. Center, Univ. of Southern California, Los Angeles, CA, USA
C.C.J. Kuo, Integrated Media Syst. Center, Univ. of Southern California, Los Angeles, CA, USA
pp. 145-148
P. Bourdon, Poitiers Univ., France
B. Augereau, Poitiers Univ., France
C. Olivier, Poitiers Univ., France
C. Chatellier, Poitiers Univ., France
pp. 149-152
Zhe Xiang, Microsoft Res., Beijing, China
Qian Zhang, Microsoft Res., Beijing, China
Wenwu Zhu, Microsoft Res., Beijing, China
Zhensheng Zhang, Microsoft Res., Beijing, China
pp. 153-156
D. Doermann, Lab. for Language & Media Process., Maryland Univ., College Park, MD, USA
A. Karunanidhi, Lab. for Language & Media Process., Maryland Univ., College Park, MD, USA
N. Parkeh, Lab. for Language & Media Process., Maryland Univ., College Park, MD, USA
M.A. Khan, Microsoft Res., Beijing, China
S. Chen, Inst. for Infocomm Res., Singapore, Singapore
pp. 161-164
K.P. Lim, Inst. for Infocomm Res., Singapore, Singapore
D. Wu, Inst. for Infocomm Res., Singapore, Singapore
S. Wu, Inst. for Infocomm Res., Singapore, Singapore
R. Susanto, Inst. for Infocomm Res., Singapore, Singapore
X. Lin, Inst. for Infocomm Res., Singapore, Singapore
L. Jiang, Inst. for Infocomm Res., Singapore, Singapore
R. Yu, Inst. for Infocomm Res., Singapore, Singapore
F. Pan, Inst. for Infocomm Res., Singapore, Singapore
Z. Li, Inst. for Infocomm Res., Singapore, Singapore
S. Yao, Inst. for Infocomm Res., Singapore, Singapore
G. Feng, Inst. for Infocomm Res., Singapore, Singapore
pp. 169-172
Q. Ma, Graduate Sch. of Informatics, Kyoto Univ., Japan
K. Tanaka, Graduate Sch. of Informatics, Kyoto Univ., Japan
pp. 173-176
Y. Watanabe, Dept. of Electron. & Informatics, Ryukoku Univ., Shiga, Japan
K. Sono, Dept. of Electron. & Informatics, Ryukoku Univ., Shiga, Japan
K. Yokomizo, Dept. of Electron. & Informatics, Ryukoku Univ., Shiga, Japan
Y. Okada, Dept. of Electron. & Informatics, Ryukoku Univ., Shiga, Japan
pp. 177-180
M. Lazarescu, Sch. of Comput., Curtin Univ. of Technol., Perth, WA, Australia
S. Venkatesh, Sch. of Comput., Curtin Univ. of Technol., Perth, WA, Australia
pp. 181-184
Hangzai Luo, Dept. of Comput. Sci., North Carolina Univ., Charlotte, NC, USA
Jianping Fan, Dept. of Comput. Sci., North Carolina Univ., Charlotte, NC, USA
Jing Xiao, Dept. of Comput. Sci., North Carolina Univ., Charlotte, NC, USA
Xingquan Zhu, Dept. of Electron. & Informatics, Ryukoku Univ., Shiga, Japan
pp. 189-192
S. Moncrieff, Dept. of Comput. Sci., Curtin Univ. of Technol., Perth, WA, Australia
S. Venkatesh, Dept. of Comput. Sci., Curtin Univ. of Technol., Perth, WA, Australia
C. Dorai, Dept. of Comput. Sci., North Carolina Univ., Charlotte, NC, USA
pp. 193-196
B. Barry, Media Lab., MIT, Cambridge, MA, USA
G. Davenport, Media Lab., MIT, Cambridge, MA, USA
pp. 197-200
Yan Sun, Dept. of Electr. & Comput. Eng., Maryland Univ., College Park, MD, USA
K.J.R. Liu, Dept. of Electr. & Comput. Eng., Maryland Univ., College Park, MD, USA
pp. 205-208
Qibin Sun, Inst. for Infocomm Res., Singapore, Singapore
Dajun He, Inst. for Infocomm Res., Singapore, Singapore
Zhishou Zhang, Inst. for Infocomm Res., Singapore, Singapore
Qi Tian, Inst. for Infocomm Res., Singapore, Singapore
pp. 209-212
Dekun Zou, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
Dekun Zou, Inst. for Infocomm Res., Singapore, Singapore
Guorong Xuan, Inst. for Infocomm Res., Singapore, Singapore
Y.Q. Shi, Inst. for Infocomm Res., Singapore, Singapore
pp. 213-216
Z.J. Wang, Dept. of Electr & Comput. Eng., Maryland Univ., College Park, MD, USA
Min Wu, Dept. of Electr & Comput. Eng., Maryland Univ., College Park, MD, USA
W. Trappe, Inst. for Infocomm Res., Singapore, Singapore
K.J.R. Liu, Inst. for Infocomm Res., Singapore, Singapore
pp. 217-220
A. Datta, Dept. of Comput. Sci., Central Florida Univ., Orlando, FL, USA
N.D.V. Lobo, Dept. of Comput. Sci., Central Florida Univ., Orlando, FL, USA
J.J. Leeson, Dept. of Comput. Sci., Central Florida Univ., Orlando, FL, USA
pp. 221-224
Shan Liu, Samsung Inf. Syst. America, Irvine, CA, USA
C.-C.J. Kuo, Dept. of Comput. Sci., Central Florida Univ., Orlando, FL, USA
pp. 225-228
C.-C.J. Kuo, Multimedia Commun. Lab, Georgia Inst. of Technol., Atlanta, GA, USA
N. Jayant, Multimedia Commun. Lab, Georgia Inst. of Technol., Atlanta, GA, USA
pp. 229-232
Hua Yang, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
K. Rose, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 233-236
Cheng-Yu Pai, Concordia Univ., Montreal, Que., Canada
W.E. Lynch, Concordia Univ., Montreal, Que., Canada
pp. 241-244
Haohong Wang, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
G.M. Schuster, Concordia Univ., Montreal, Que., Canada
A.K. Katsaggelos, Dept. of Comput. Sci., Central Florida Univ., Orlando, FL, USA
pp. 245-248
Min Shao, Dept. of Electr. & Comput. Eng., Delaware Univ., Newark, DE, USA
K.E. Barner, Dept. of Electr. & Comput. Eng., Delaware Univ., Newark, DE, USA
pp. 249-252
Yibin Yang, Philips Res. USA, Briarcliff Manor, NY, USA
L. Boroczky, Philips Res. USA, Briarcliff Manor, NY, USA
pp. 253-256
Haohong Wang, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
G.M. Schuster, Philips Res. USA, Briarcliff Manor, NY, USA
A.K. Katsaggelos, Dept. of Comput. Sci., Central Florida Univ., Orlando, FL, USA
pp. 257-260
Z. Pan, New Industry Creation Hatchery Center, Tohoku Univ., Japan
K. Kotani, Philips Res. USA, Briarcliff Manor, NY, USA
T. Ohmi, Dept. of Comput. Sci., Central Florida Univ., Orlando, FL, USA
pp. 261-264
Xinguo Yu, Infocomm Res. Inst., Singapore, Singapore
Qi Tian, Infocomm Res. Inst., Singapore, Singapore
Qi Tian, Infocomm Res. Inst., Singapore, Singapore
pp. 265-268
Ying Li, IBM Thomas J. Watson Res. Center, Hawthorne, NY, USA
Yu-Fei Ma, Infocomm Res. Inst., Singapore, Singapore
Hong-Jiang Zhang, Infocomm Res. Inst., Singapore, Singapore
pp. 269-272
Xinguo Yu, Infocomm Res. Inst., Heng Mui Keng Terrace, Singapore
Changshen Xu, Infocomm Res. Inst., Heng Mui Keng Terrace, Singapore
Qi Tian, Infocomm Res. Inst., Heng Mui Keng Terrace, Singapore
Qi Tian, Inst. for Infocomm Res., Singapore, Singapore
pp. 273-276
R. Lienhart, Microcomput. Res. Labs, Intel Corp., Santa Clara, CA, USA
Luhong Liang, Microcomput. Res. Labs, Intel Corp., Santa Clara, CA, USA
A. Kuranov, Microcomput. Res. Labs, Intel Corp., Santa Clara, CA, USA
pp. 277-280
Min Xu, Infocomm Res. Inst., Heng Mui Keng Terrace, Singapore, Singapore
N.C. Maddage, Infocomm Res. Inst., Heng Mui Keng Terrace, Singapore, Singapore
Changsheng Xu, Infocomm Res. Inst., Heng Mui Keng Terrace, Singapore, Singapore
M. Kankanhalli, Infocomm Res. Inst., Heng Mui Keng Terrace, Singapore, Singapore
Qi Tian, Infocomm Res. Inst., Heng Mui Keng Terrace, Singapore, Singapore
pp. 281-284
Rong Jin, Carnegie Mellon Univ., Pittsburgh, PA, USA
A.G. Hauptmann, Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 293-296
Yang Ran, Center for Autom. Res., Maryland Univ., College Park, MD, USA
Qinfen Zheng, Center for Autom. Res., Maryland Univ., College Park, MD, USA
pp. 297-300
Z. Cernekova, Dept. of Informatics, Aristotelian Univ. of Thessaloniki, Greece
C. Kotropoulos, Dept. of Informatics, Aristotelian Univ. of Thessaloniki, Greece
I. Pitas, Dept. of Informatics, Aristotelian Univ. of Thessaloniki, Greece
pp. 301-304
Hai Jin, Huazhong Univ. of Sci. & Technol., Wuhan, China
Dafu Deng, Huazhong Univ. of Sci. & Technol., Wuhan, China
pp. 305-308
Zhen Li, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Guobin Shen, Huazhong Univ. of Sci. & Technol., Wuhan, China
Shipeng Li, Dept. of Informatics, Aristotelian Univ. of Thessaloniki, Greece
E.J. Delp, Infocomm Res. Inst., Heng Mui Keng Terrace, Singapore, Singapore
pp. 309-312
Chen-Lung Chan, Dept. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Shih-Yu Huang, Huazhong Univ. of Sci. & Technol., Wuhan, China
Jia-Shung Wang, Dept. of Informatics, Aristotelian Univ. of Thessaloniki, Greece
pp. 313-316
T. Ahmed, CNRS, Versailles, France
A. Mehaoua, CNRS, Versailles, France
V. Lecuire, Dept. of Informatics, Aristotelian Univ. of Thessaloniki, Greece
pp. 317-320
L.J. Latecki, Dept. of Comput. & Inf. Sci., Temple Univ., Philadelphia, PA, USA
K. Kulkarni, Dept. of Comput. & Inf. Sci., Temple Univ., Philadelphia, PA, USA
J. Mulik, Dept. of Comput. & Inf. Sci., Temple Univ., Philadelphia, PA, USA
pp. 321-324
Xuxian Jiang, Dept. of Comput. Sci., Purdue Univ., West Lafayette, IN, USA
Yu Dong, Dept. of Comput. Sci., Purdue Univ., West Lafayette, IN, USA
Dongyan Xu, Dept. of Comput. Sci., Purdue Univ., West Lafayette, IN, USA
B. Bhargava, Dept. of Comput. Sci., Purdue Univ., West Lafayette, IN, USA
pp. 325-328
Jun Guo, Dept. of Electr. & Electron. Eng., Melbourne Univ., Vic., Australia
P. Taylor, Dept. of Electr. & Electron. Eng., Melbourne Univ., Vic., Australia
M. Zukerman, Dept. of Electr. & Electron. Eng., Melbourne Univ., Vic., Australia
S. Chan, Dept. of Comput. Sci., Purdue Univ., West Lafayette, IN, USA
K.S. Tang, Infocomm Res. Inst., Heng Mui Keng Terrace, Singapore, Singapore
E.W.M. Wong, Inst. for Infocomm Res., Singapore, Singapore
pp. 329-332
M. Harville, Streaming Media Syst. Group, Palo Alto, CA, USA
M. Covell, Streaming Media Syst. Group, Palo Alto, CA, USA
S. Wee, Streaming Media Syst. Group, Palo Alto, CA, USA
pp. 333-336
S. Wee, Dept. of Comput. Sci., Kwangwoon Univ., Seoul, South Korea
S. Wee, Dept. of Comput. Sci., Kwangwoon Univ., Seoul, South Korea
pp. 337-340
Woosaeng Kim, Dept. of Comput. Eng., Kwangwoon Univ., Seoul, South Korea
Woosaeng Kim, Dept. of Comput. Eng., Kwangwoon Univ., Seoul, South Korea
pp. 341-344
X. Gibert, Language & Media Process. Lab., Maryland Univ., College Park, MD, USA
Huiping Li, Language & Media Process. Lab., Maryland Univ., College Park, MD, USA
D. Doermann, Language & Media Process. Lab., Maryland Univ., College Park, MD, USA
pp. 345-348
Shaohua Zhou, Center for Autom. Res., Maryland Univ., College Park, MD, USA
R. Chellappa, Center for Autom. Res., Maryland Univ., College Park, MD, USA
B. Moghaddam, Center for Autom. Res., Maryland Univ., College Park, MD, USA
pp. 349-352
Hwajeong Lee, Dept. of Comput. Sci. & Eng., Pohang Univ. of Sci. & Technol., South Korea
Daehwan Kim, Dept. of Comput. Sci. & Eng., Pohang Univ. of Sci. & Technol., South Korea
Daijin Kim, Dept. of Comput. Sci. & Eng., Pohang Univ. of Sci. & Technol., South Korea
Daijin Kim, Dept. of Comput. Sci. & Eng., Pohang Univ. of Sci. & Technol., South Korea
pp. 353-356
Junqiang Lan, Dept. of Comput. Eng. & Comput. Sci., Missouri Univ., USA
Xinhua Zhuang, Dept. of Comput. Eng. & Comput. Sci., Missouri Univ., USA
pp. 357-360
Jian Zhou, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
Huairong Shao, Dept. of Comput. Eng. & Comput. Sci., Missouri Univ., USA
Chia Shen, Dept. of Comput. Sci. & Eng., Pohang Univ. of Sci. & Technol., South Korea
Ming-Ting Sun, Dept. of Comput. Sci. & Eng., Pohang Univ. of Sci. & Technol., South Korea
pp. 361-364
A. Aner-Wolf, Dept. of Comput. Sci. & Appl. Math, Weizmann Inst. of Sci., Rehovot, Israel
pp. 365-368
M.A. Zaveri, Dept. of Electr. Eng., IIT, Bombay, India
U.B. Desai, Dept. of Electr. Eng., IIT, Bombay, India
S.N. Merchant, Dept. of Electr. Eng., IIT, Bombay, India
pp. 369-372
P. Muneesawang, Dept. of Electr. & Comput. Eng., Naresuan Univ., Phisanulok, Thailand
L. Guan, Dept. of Electr. Eng., IIT, Bombay, India
pp. 373-376
M. Haseyama, Sch. of Eng., Hokkaido Univ., Sapporo, Japan
I. Kondo, Sch. of Eng., Hokkaido Univ., Sapporo, Japan
pp. 377-380
Jiqiang Song, Dept. Comput. Sci. & Eng., Chinese Univ. of Hong Kong, China
Min Cai, Dept. Comput. Sci. & Eng., Chinese Univ. of Hong Kong, China
M.R. Lyu, Dept. Comput. Sci. & Eng., Chinese Univ. of Hong Kong, China
pp. 385-388
A. Kimura, NTT Commun. Sci. Labs., NTT Corp., Kanagawa, Japan
K. Kashino, NTT Commun. Sci. Labs., NTT Corp., Kanagawa, Japan
T. Kurozumi, NTT Commun. Sci. Labs., NTT Corp., Kanagawa, Japan
H. Murase, NTT Commun. Sci. Labs., NTT Corp., Kanagawa, Japan
pp. 389-392
M. Haseyama, Sch. of Eng., Hokkaido Univ., Sapporo, Japan
A. Matsumura, Sch. of Eng., Hokkaido Univ., Sapporo, Japan
pp. 393-396
Sangoh Jeong, Dept. of Electr. Eng., Stanford Univ., CA, USA
Sangoh Jeong, Dept. of Electr. Eng., Stanford Univ., CA, USA
R.M. Gray, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 397-400
Qixiang Ye, Dept. of Comput. Sci. & Technol., Chinese Acad. of Sci., China
Wen Gao, Dept. of Comput. Sci. & Technol., Chinese Acad. of Sci., China
Wei Zeng, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 401-404
B.T. Truong, Dept. of Comput. Sci., Curtin Univ. of Technol., Perth, WA, Australia
S. Venkatesh, Dept. of Comput. Sci., Curtin Univ. of Technol., Perth, WA, Australia
C. Dorai, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 405-408
N. Peyrard, Campus Univ. de Beaulieu, IRISA/INRIA, Rennes, France
P. Bouthemy, Campus Univ. de Beaulieu, IRISA/INRIA, Rennes, France
pp. 409-412
H. Winston, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
H.-M. Hsu, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
Shih-Fu Chang, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
pp. 413-416
A. Vetro, Mitsubishi Electr. Res. Labs., Murray Hill, NJ, USA
T. Haga, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
K. Sumi, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
H. Sun, NTT Commun. Sci. Labs., NTT Corp., Kanagawa, Japan
pp. 417-420
M. Bertini, DSI, Firenze Univ., Italy
R. Cucchiara, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
A. Del Bimbo, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
A. Prati, NTT Commun. Sci. Labs., NTT Corp., Kanagawa, Japan
pp. 421-424
S.A. Khayam, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
S. Karande, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
M. Krappel, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
H. Radha, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
pp. 425-428
Fan Yang, Dept. of Comput. Sci., Nanjing Univ., China
Qian Zhang, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
Wenwu Zhu, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
Ya-Qin Zhang, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
pp. 429-432
Zhijun Lei, Sch. of Inf. Technol. & Eng., Ottawa Univ., Ont., Canada
N.D. Georganas, Sch. of Inf. Technol. & Eng., Ottawa Univ., Ont., Canada
pp. 433-436
Yong Pei, Dept. of Electr. & Comput. Eng., Miami Univ., Coral Gables, FL, USA
J.W. Modestino, Dept. of Electr. & Comput. Eng., Miami Univ., Coral Gables, FL, USA
pp. 437-440
A. Miu, Laboratory for Comput. Sci., Massachusetts Inst. of Technol., Cambridge, MA, USA
J.G. Apostolopoulos, Dept. of Electr. & Comput. Eng., Miami Univ., Coral Gables, FL, USA
Wai-tian Tan, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
M. Trott, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
pp. 441-444
J.R. Smith, IBM Thomas J. Watson Res. Center, Hawthorne, NY, USA
M. Naphade, IBM Thomas J. Watson Res. Center, Hawthorne, NY, USA
A. Natsev, IBM Thomas J. Watson Res. Center, Hawthorne, NY, USA
pp. 445-448
A. Natsev, Sch. of Comput., Curtin Univ. of Technol., Perth, WA, Australia
S. Venkatesh, Sch. of Comput., Curtin Univ. of Technol., Perth, WA, Australia
C. Dorai, IBM Thomas J. Watson Res. Center, Hawthorne, NY, USA
pp. 449-449
B. Adams, Dept. of Comput. Sci., Curtin Univ. of Technol., Perth, WA, Australia
C. Dorai, Sch. of Comput., Curtin Univ. of Technol., Perth, WA, Australia
S. Venkatesh, IBM Thomas J. Watson Res. Center, Hawthorne, NY, USA
H.H. Bui, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
pp. 453-456
Jiebo Luo, Eastman Kodak Co., Oakdale, MN, USA
A. Singhal, Eastman Kodak Co., Oakdale, MN, USA
Weiyu Zhu, IBM Thomas J. Watson Res. Center, Hawthorne, NY, USA
pp. 457-460
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