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2003 International Conference on Multimedia and Expo - Volume 1 (ICME '03)
Baltimore, MD, USA
July 06-July 09
ISBN: 0-7803-7965-9
Table of Contents
Icme
T. Nguyen, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
P. Mehra, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
A. Zakhor, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 1-4
S. Wee, Streaming Media Syst. Group, HP Labs, Palo Alto, CA, USA
J. Apostolopoulos, Streaming Media Syst. Group, HP Labs, Palo Alto, CA, USA
Wai-tian Tan, Streaming Media Syst. Group, HP Labs, Palo Alto, CA, USA
S. Roy, Streaming Media Syst. Group, HP Labs, Palo Alto, CA, USA
pp. 5-8
J. Chakareski, Dept. of Electr. Eng., Stanford Univ., CA, USA
E. Setton, Dept. of Electr. Eng., Stanford Univ., CA, USA
Y. Liang, Dept. of Electr. Eng., Stanford Univ., CA, USA
B. Girod, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 9-12
M. Fumagalli, CEFRIEL, Milan, Italy
P. Sagetong, Dept. of Electr. Eng., Stanford Univ., CA, USA
A. Ortega, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 13-16
R. Ronfard, INRIA Rhone Alpes, Montbonnot, France
T.T. Thuong, INRIA Rhone Alpes, Montbonnot, France
pp. 21-24
Xiaofei He, Microsoft Res. Asia, Beijing, China
Wei-Ying Ma, INRIA Rhone Alpes, Montbonnot, France
Hongjiang Zhang, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 25-28
A. Berenzweig, LabROSA, Columbia Univ., New York, NY, USA
D.P.W. Ellis, LabROSA, Columbia Univ., New York, NY, USA
S. Lawrence, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 29-32
Tong Zhang, Hewlett-Packard Labs., Palo Alto, CA, USA
pp. 33-36
M. Bautell, Dept. of Comput. Sci., Rochester Univ., NY, USA
J. Luo, LabROSA, Columbia Univ., New York, NY, USA
R.T. Gray, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 37-40
R.T. Gray, Dept. of Comput. & Math., Nottingham Trent Univ., UK
N. Sherkat, Dept. of Comput. & Math., Nottingham Trent Univ., UK
T. Allen, Dept. of Comput. & Math., Nottingham Trent Univ., UK
pp. 41-44
Y. Sawahata, Dept. of Frontier Informatics, Tokyo Univ., Japan
K. Aizawa, Dept. of Frontier Informatics, Tokyo Univ., Japan
pp. 45-48
T.T.H. Chen, Human Commun. Technol. Lab., British Columbia Univ., Vancouver, BC, Canada
S. Pels, Human Commun. Technol. Lab., British Columbia Univ., Vancouver, BC, Canada
S.S. Min, Human Commun. Technol. Lab., British Columbia Univ., Vancouver, BC, Canada
pp. 49-52
Xin Fan, Microsoft Res. Asia, Hefei, China
Xing Xie, Human Commun. Technol. Lab., British Columbia Univ., Vancouver, BC, Canada
Wei-Ying Ma, Human Commun. Technol. Lab., British Columbia Univ., Vancouver, BC, Canada
Hong-Jiang Zhang, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 53-56
B. Schuller, Inst. for Human-Computer Commun., Technische Univ. Munchen, Germany
M. Zobl, Inst. for Human-Computer Commun., Technische Univ. Munchen, Germany
G. Rigoll, Inst. for Human-Computer Commun., Technische Univ. Munchen, Germany
M. Lang, Inst. for Human-Computer Commun., Technische Univ. Munchen, Germany
pp. 57-60
Hsuan-Huei Shih, Integrated Media Syst. Center, Southern California Univ., Los Angeles, CA, USA
S.S. Narayanan, Integrated Media Syst. Center, Southern California Univ., Los Angeles, CA, USA
C.-C.J. Kuo, Integrated Media Syst. Center, Southern California Univ., Los Angeles, CA, USA
pp. 61-64
R. Yu, Inst. for Infocomm Res., Heng Mui Keng Terrace, Singapore
X. Lin, Inst. for Infocomm Res., Heng Mui Keng Terrace, Singapore
S. Rahardja, Inst. for Infocomm Res., Heng Mui Keng Terrace, Singapore
C.C. Ko, Inst. for Human-Computer Commun., Technische Univ. Munchen, Germany
pp. 65-68
S. Lucey, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Tsuhan Chen, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 69-72
M.J. Reyes-Gomez, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
D.P.W. Ellis, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
pp. 73-76
Chih-Kai Yang, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Sou-Gee Chen, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 77-80
Yongmin Li, BTexact Technol., Ipswich, UK
Li-Qun Xu, BTexact Technol., Ipswich, UK
G. Morrison, BTexact Technol., Ipswich, UK
C. Nightingale, BTexact Technol., Ipswich, UK
J. Morphett, BTexact Technol., Ipswich, UK
pp. 81-84
Z.J. Chen, Dept. of Electr. & Comput. Eng., Western Ontario Univ., London, Ont., Canada
J. Samaranbandu, Dept. of Electr. & Comput. Eng., Western Ontario Univ., London, Ont., Canada
pp. 89-92
S.H. Srinivasan, Dept. of Comput. Sci., Nat. Univ. of Singapore, Singapore
M. Kankanhalli, Dept. of Comput. Sci., Nat. Univ. of Singapore, Singapore
pp. 93-96
Wei-Qi Yan, Dept. of Comput. Sci., Nat. Univ. of Singapore, Singapore
M.S. Kankanhalli, Dept. of Comput. Sci., Nat. Univ. of Singapore, Singapore
pp. 97-9100
H.F. Ates, Dept. of Electr. Eng., Princeton Univ., NJ, USA
M.T. Orchard, Dept. of Comput. Sci., Nat. Univ. of Singapore, Singapore
pp. 101-104
Andy Chang, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., China
O.C. Au, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., China
Y.M. Yeung, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., China
pp. 105-108
G. Caner, Dept. of Electr. & Comput. Eng., Rochester Univ., NY, USA
A.M. Tekalp, Dept. of Electr. & Comput. Eng., Rochester Univ., NY, USA
W. Heinzelman, Dept. of Electr. & Comput. Eng., Rochester Univ., NY, USA
pp. 109-112
W. Heinzelman, Dept. Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
R.A. Sambhare, Dept. Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 113-116
N. Bellas, Multimedia Archit. Lab., Motorola Inc., Schaumburg, IL, USA
M. Dwyer, Multimedia Archit. Lab., Motorola Inc., Schaumburg, IL, USA
pp. 117-120
Tay-Jyi Lin, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Chi-Chi Chang, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Tsung-Hsun Yang, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Yu-Ming Chang, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Chien-Hung Lin, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Chen-Chia Lee, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Hung-Yueh Lin, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Chein-Wei Jen, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 121-124
Tay-Jyi Lin, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Tsung-Hsun Yang, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Chein-Wei Jen, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 125-128
S. Nishiguchi, Graduate Sch. of Law, Kyoto Univ., Japan
K. Higashi, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Y. Kameda, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
M. Minoh, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 129-132
Tsung-Han Tsai, Dept. of Electr. Eng., Nat. Central Univ., Chung-li, Taiwan
Wen-Cheng Chen, Dept. of Electr. Eng., Nat. Central Univ., Chung-li, Taiwan
Chun-Nan Liu, Dept. of Electr. Eng., Nat. Central Univ., Chung-li, Taiwan
pp. 133-136
Hung-Chi Fang, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Tu-Chih Wang, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Yu-Wei Chang, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Ya-Yun Shih, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Liang-Gee Chen, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 137-140
Jongmyon Kim, Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
D.S. Wills, Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 141-144
M. Yan, Siemens Corp. Res. Inc., Princeton, NJ, USA
J. Shaw, Siemens Corp. Res. Inc., Princeton, NJ, USA
V. Khamsi, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Shih-Ping Liou, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 145-148
S. Kobayashi, Graduate Sch. of Eng. Sci., Osaka Univ., Japan
K. Mita, Graduate Sch. of Eng. Sci., Osaka Univ., Japan
Y. Takeuchi, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
M. Imai, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 149-152
I. Andreou, Dept. of Technol. Educ. & Digital Syst., Piraeus, Karoli & Dimitriou Univ., Piraeus, Greece
N.M. Sgouros, Dept. of Technol. Educ. & Digital Syst., Piraeus, Karoli & Dimitriou Univ., Piraeus, Greece
pp. 153-156
M.H. Lee, Math. & Inf. Sci., CSIRO, North Ryde, NSW, Australia
S. Nepal, Math. & Inf. Sci., CSIRO, North Ryde, NSW, Australia
U. Srinivasan, Math. & Inf. Sci., CSIRO, North Ryde, NSW, Australia
pp. 157-160
G.C. Stein, One Res. Circle, GE Global Res., NY, USA
J. Rittscher, One Res. Circle, GE Global Res., NY, USA
A. Hoogs, One Res. Circle, GE Global Res., NY, USA
pp. 161-164
H. Nagano, NTT Commun. Sci. Labs., NTT Corp., Kanagawa, Japan
K. Kashino, NTT Commun. Sci. Labs., NTT Corp., Kanagawa, Japan
H. Murase, NTT Commun. Sci. Labs., NTT Corp., Kanagawa, Japan
pp. 165-168
A. Ekin, Dept. of Electr. & Comput. Eng., Rochester Univ., NY, USA
M. Tekalp, Dept. of Electr. & Comput. Eng., Rochester Univ., NY, USA
pp. 169-172
A. Chakraborty, Siemens Corp. Res. Inc., Princeton, NJ, USA
P. Liu, Siemens Corp. Res. Inc., Princeton, NJ, USA
L. Hsu, Siemens Corp. Res. Inc., Princeton, NJ, USA
pp. 173-176
Lijun Yin, Dept. of Comput. Sci., SUNY, Binghamton, NY, USA
S. Royt, Dept. of Comput. Sci., SUNY, Binghamton, NY, USA
M.T. Yourst, Siemens Corp. Res. Inc., Princeton, NJ, USA
A. Basu, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 177-180
F. Quek, Dept. of Comput. & Sci. Eng., Wright State Univ., Dayton, OH, USA
Yingen Xiong, Dept. of Comput. & Sci. Eng., Wright State Univ., Dayton, OH, USA
pp. 181-184
J.R. Taal, Dept. of Comput. Sci., Delft Univ. of Technol., Netherlands
I. Haratcherev, Dept. of Comput. Sci., Delft Univ. of Technol., Netherlands
K. Langendoen, Dept. of Comput. Sci., Delft Univ. of Technol., Netherlands
R. Lagendijk, Dept. of Comput. Sci., Delft Univ. of Technol., Netherlands
pp. 189-192
Jie Chen, Div. of Eng., Brown Univ., Providence, RI, USA
S. Hsia, Div. of Eng., Brown Univ., Providence, RI, USA
pp. 197-200
T.P.-c. Chen, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Tsuhan Chen, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 201-204
Hong Zhao, Dept. of Electr. & Comput. Eng., Maryland Univ., College Park, MD, USA
Min Wu, Dept. of Electr. & Comput. Eng., Maryland Univ., College Park, MD, USA
Z.J. Wang, Dept. of Electr. & Comput. Eng., Maryland Univ., College Park, MD, USA
K.J.R. Liu, Dept. of Electr. & Comput. Eng., Maryland Univ., College Park, MD, USA
pp. 205-208
A. Giannoula, Dept. of Informatics, Aristotelian Univ. of Thessaloniki, Greece
A. Tefas, Dept. of Informatics, Aristotelian Univ. of Thessaloniki, Greece
N. Nikolaidis, Dept. of Informatics, Aristotelian Univ. of Thessaloniki, Greece
I. Pitas, Dept. of Informatics, Aristotelian Univ. of Thessaloniki, Greece
pp. 209-212
I. Pitas, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., China
O.C. Au, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., China
pp. 213-216
N. Cvejic, Center for Wireless Commun., Oulu Univ., Finland
D. Tujkovic, Center for Wireless Commun., Oulu Univ., Finland
T. Seppanen, Center for Wireless Commun., Oulu Univ., Finland
pp. 217-220
J. Foote, FX PaIo Alto Lab. Inc.,, Palo Alto, CA, USA
J. Adcock, FX PaIo Alto Lab. Inc.,, Palo Alto, CA, USA
A. Girgensohn, FX PaIo Alto Lab. Inc.,, Palo Alto, CA, USA
pp. 221-224
S.P. Mallick, Dept. of Electr. & Comput. Eng., California Univ., San Diego, CA, USA
M. Trivedi, Dept. of Electr. & Comput. Eng., California Univ., San Diego, CA, USA
pp. 225-228
I. Rodriguez, Dept. of Comput. Eng., Alcala Univ., Madrid, Spain
M. Peinado, Dept. of Comput. Eng., Alcala Univ., Madrid, Spain
R. Boulic, FX PaIo Alto Lab. Inc.,, Palo Alto, CA, USA
D. Meziat, Dept. of Informatics, Aristotelian Univ. of Thessaloniki, Greece
pp. 229-232
Cha Zhang, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Tsuhan Chen, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 233-236
Yuzhong Shen, Dept. of Electr. & Comput. Eng., Delaware Univ., Newark, DE, USA
K.E. Barner, Dept. of Electr. & Comput. Eng., Delaware Univ., Newark, DE, USA
pp. 237-240
Yoon Yong-In, Chungang Univ., Seoul, South Korea
Jang-Hwan Im, Chungang Univ., Seoul, South Korea
Dae-Hyun Kim, Chungang Univ., Seoul, South Korea
Jong-Soo Choi, Chungang Univ., Seoul, South Korea
pp. 241-244
Wende Zhang, Carnegie Mellon Univ., Pittsburgh, PA, USA
Tsuhan Chen, Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 245-248
T.V. Nguyen, Sch. of Comput. Eng., Nanyang Technol. Univ., Singapore
J.C. Patra, Sch. of Comput. Eng., Nanyang Technol. Univ., Singapore
Ee-Luang Ang, Sch. of Comput. Eng., Nanyang Technol. Univ., Singapore
pp. 249-252
Wei Wang, Dept. of Comput. Sci. & Eng., New York State Univ., Buffalo, NY, USA
Aidong Zhang, Dept. of Comput. Sci. & Eng., New York State Univ., Buffalo, NY, USA
Yuqing Song, Sch. of Comput. Eng., Nanyang Technol. Univ., Singapore
pp. 253-256
S. Palanivel, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
B.S. Venkatesh, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
B. Yegnanarayana, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
pp. 257-257
Dong-Wan Kang, Graduate Sch. of Global Inf. & Telecommun. Studies, Waseda Univ., Tokyo, Japan
J. Ohya, Graduate Sch. of Global Inf. & Telecommun. Studies, Waseda Univ., Tokyo, Japan
pp. 261-264
Wei Wang, Dept. of Comput. Sci. & Eng., Hong Kong Chinese Univ., China
M.R. Lyu, Dept. of Comput. Sci. & Eng., Hong Kong Chinese Univ., China
pp. 265-268
S. Nepal, CSlRO Math. & Inf. Sci., North Ryde, NSW, Australia
U. Srinivasan, CSlRO Math. & Inf. Sci., North Ryde, NSW, Australia
pp. 269-272
D. Trossen, Nokia Res. Center Boston, Burlington, MA, USA
H. Chaskar, Nokia Res. Center Boston, Burlington, MA, USA
pp. 273-276
Shengjie Zhao, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
Zixiang Xiong, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
Xiaodong Wang, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
pp. 277-280
A. Bhatkar, Dept. of Electr. & Comput. Eng., Stevens Inst. of Technol., Hoboken, NJ, USA
R. Chandramouli, Dept. of Electr. & Comput. Eng., Stevens Inst. of Technol., Hoboken, NJ, USA
N. Vijaykrishnan, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
M.J. Irwin, Chungang Univ., Seoul, South Korea
pp. 281-284
Wen Xu, Sch. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY, USA
S.S. Hemami, Sch. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY, USA
pp. 285-288
Wanghong Yuan, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
K. Nahrstedt, Dept. of Comput. Sci., Illinois Univ., Urbana, IL, USA
pp. 289-292
Jiancong Chen, Dept. of Comput. Sci., Hong Kong Univ. of Sci. & Technol., Kowloon, China
S.-H.G. Chan, Dept. of Comput. Sci., Hong Kong Univ. of Sci. & Technol., Kowloon, China
Qian Zhang, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
Wen-Wu Zhu, Chungang Univ., Seoul, South Korea
Jin Chen, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 293-296
Jieh Hsiang, Comput. Sci. & Inf. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Wen-Jun Liu, Comput. Sci. & Inf. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Bee-Chung Chen, Comput. Sci. & Inf. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Hsieh-Chang Tu, Comput. Sci. & Inf. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 297-300
J. Assfalg, Dipt. di Sistemi e Inf., Firenze Univ., Italy
A. Del Bimbo, Dipt. di Sistemi e Inf., Firenze Univ., Italy
P. Pala, Dipt. di Sistemi e Inf., Firenze Univ., Italy
pp. 301-304
Xiangdong Zhou, Fudan Univ., Shanghai, China
Qi Zhang, Fudan Univ., Shanghai, China
Lan Lin, Dipt. di Sistemi e Inf., Firenze Univ., Italy
Ailin Deng, Comput. Sci. & Inf. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Gang Wu, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 305-308
Jun Gao, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
G. Tzanetakis, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
P. Steenkiste, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 309-312
Lei Zhang, Microsoft Res. Asia, Beijing, China
Fang Qian, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
Mingjing Li, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
Hong-Jiang Zhang, Comput. Sci. & Inf. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 313-316
Yu-Xin Peng, Inst. of Comput. Sci. & Technol., Peking Univ., Beijing, China
Chong-Wah Ngo, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
Qing-Jie Dong, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
Zong-Ming Guo, Comput. Sci. & Inf. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Jian-Guo Xiao, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 317-320
Xin Hunag, Sch. of Comput. Sci., Florida Int. Univ., Miami, FL, USA
Shu-Ching Chen, Sch. of Comput. Sci., Florida Int. Univ., Miami, FL, USA
Mei-Ling Shyu, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 321-324
M. Pi, Dept. of Electr. & Comput. Eng., Alberta Univ., Edmonton, Alta., Canada
M. Mandal, Dept. of Electr. & Comput. Eng., Alberta Univ., Edmonton, Alta., Canada
A. Basu, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 325-328
G. Iyengar, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
H.J. Nock, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
C. Neti, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 329-332
Min Xu, Inst. for Infocomm Res., Singapore, Singapore
Ling-Yu Duan, Inst. for Infocomm Res., Singapore, Singapore
Chang-Sheng Xu, Inst. for Infocomm Res., Singapore, Singapore
Qi Tian, Inst. for Infocomm Res., Singapore, Singapore
pp. 333-336
Ching-Yeh Chen, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Shao-Yi Chien, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Yi-Hau Chen, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Yu-Wen Huang, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Liang-Gee Chen, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 337-340
A.J. Pinho, Dep. Electron. e Telecomunicacoes, Aveiro Univ., Portugal
A.J.R. Neves, Dep. Electron. e Telecomunicacoes, Aveiro Univ., Portugal
pp. 341-344
N. Kamaci, Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
Y. Altunbasak, Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 345-348
Xiaodong Gu, Microsoft Res. Asia, Beijing, China
Hongjiang Zhang, Microsoft Res. Asia, Beijing, China
pp. 349-352
Yung-Gi Wu, Inst. of Appl. Inf., Leader Univ., Tainan, Taiwan
Ming-Zhi Huang, Inst. of Appl. Inf., Leader Univ., Tainan, Taiwan
Yu-Ling Wen, Inst. of Appl. Inf., Leader Univ., Tainan, Taiwan
pp. 353-356
M. Boliek, Ricoh Innovations, Menlo Park, CA, USA
G.K. Wu, Ricoh Innovations, Menlo Park, CA, USA
pp. 357-360
Yuhuan Ding, Sch. of Electr. Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
G.J. Vachtsevanos, Sch. of Electr. Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
G.J. Vachtsevanos, Sch. of Electr. Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
W. Daley, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
B.S. Heck-Ferri, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 369-372
B. Girod, Dept. of Electr. Eng., Stanford Univ., CA, USA
Chuo-Ling Chang, Dept. of Electr. Eng., Stanford Univ., CA, USA
P. Ramanathan, Dept. of Electr. Eng., Stanford Univ., CA, USA
Xiaoqing Zhu, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 373-376
C.H. Ritz, Whisper Labs, Wollongong Univ., NSW, Australia
I.S. Burnett, Whisper Labs, Wollongong Univ., NSW, Australia
J. Lukasiak, Whisper Labs, Wollongong Univ., NSW, Australia
pp. 377-380
H. Zarrinkoub, Inst. Nat. de la Recherche Sci., Quebec Univ., Montreal, Que., Canada
P. Mermelstein, Inst. Nat. de la Recherche Sci., Quebec Univ., Montreal, Que., Canada
pp. 381-384
O. Deshmukh, Dept. of Electron. Comput. Eeng., Maryland Univ., College Park, MD, USA
C.E. Wilson, Dept. of Electron. Comput. Eeng., Maryland Univ., College Park, MD, USA
pp. 385-388
K.S. Rao, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
B. Yegnanarayana, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
pp. 389-392
A. Kumar, Centre for Appl. Res. in Electron., Indian Inst. of Technol., New Delhi, India
A. Verma, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
pp. 393-396
Xiaodong He, Dept. of Comput. Eng. & Comput. Sci., Missouri Univ., USA
Wu Chou, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
pp. 397-400
B. Schuller, Inst. for Human-Comput. Commun., Technische Univ. Munchen, Germany
G. Rigoll, Inst. for Human-Comput. Commun., Technische Univ. Munchen, Germany
M. Lang, Inst. for Human-Comput. Commun., Technische Univ. Munchen, Germany
pp. 401-404
Dong Wang, Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
Lie Lu, Inst. for Human-Comput. Commun., Technische Univ. Munchen, Germany
Hong-Jiang Zhang, Inst. for Human-Comput. Commun., Technische Univ. Munchen, Germany
pp. 405-408
J. Pinquier, Inst. de Recherche en Informatique de Toulouse, CNRS, Toulouse, France
J.-L. Rouas, Inst. de Recherche en Informatique de Toulouse, CNRS, Toulouse, France
R. Andre-Obrecht, Inst. de Recherche en Informatique de Toulouse, CNRS, Toulouse, France
pp. 409-412
M. Chalil, Network Syst. & Technol. Ltd, Trivandrum, India
K.P. Sreekumar, Network Syst. & Technol. Ltd, Trivandrum, India
M. Sankar, Network Syst. & Technol. Ltd, Trivandrum, India
pp. 413-416
A. Raouzaiou, Image, Video & Multimedia Syst. Lab., Nat. Tech. Univ. of Athens, Greece
K. Karpouzis, Image, Video & Multimedia Syst. Lab., Nat. Tech. Univ. of Athens, Greece
S. Kollias, Image, Video & Multimedia Syst. Lab., Nat. Tech. Univ. of Athens, Greece
pp. 417-420
G. Al-Regib, Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
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A.H. Tewfik, Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 809-812
Chow-Sing Lin, Dept. of Inf. Manage., Southern Taiwan Univ. of Technol., Tainan, Taiwan
Tzong-Yao Chang, Dept. of Inf. Manage., Southern Taiwan Univ. of Technol., Tainan, Taiwan
Jin-Ru Hsieh, Dept. of Inf. Manage., Southern Taiwan Univ. of Technol., Tainan, Taiwan
pp. 817-820
D.S. Turuga, Wireless Commun. & Networking, Philips Res. USA, Briarcliff Manor, NY, USA
M. van der Schaar, Wireless Commun. & Networking, Philips Res. USA, Briarcliff Manor, NY, USA
pp. 821-824
Zhizhong Zhe, Sch. of Comput. Sci. & Software Eng., Monash Univ., Clayton, Vic., Australia
Zhizhong Zhe, Sch. of Comput. Sci. & Software Eng., Monash Univ., Clayton, Vic., Australia
Zhenghua Yu, Dept. of Inf. Manage., Southern Taiwan Univ. of Technol., Tainan, Taiwan
T. Ferguson, Fraunhofer Inst. for Commun. Syst., Munich, Germany
D. Tan, NTT Data Corp., Tokyo, Japan
pp. 825-828
A.B. Hamza, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
H. Krim, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
B. Karacali, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 829-832
H.R. Abutalebi, Dept. of Electr. Eng., Amirkabir Univ. of Technol., Tehran, Iran
H. Sheikhzadeh, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
R.L. Brennan, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
G.H. Freeman, Fraunhofer Inst. for Commun. Syst., Munich, Germany
pp. 833-836
State-space RLS (Abstract)
M.B. Malik, Coll. of Electr. & Mech. Eng., Nat. Univ. of Sci. & Technol., Pakistan
pp. 837-840
B. Nowrouzian, Dept. of Electr. & Comput. Eng., Alberta Univ., Edmonton, Alta., Canada
A.T.G. Fuller, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
M.N.S. Swamy, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 841-844
K. Hazaveh, Dept. of Electr. & Comput. Eng., Ryerson Univ., Toronto, Ont., Canada
K. Raahemifar, Dept. of Electr. & Comput. Eng., Ryerson Univ., Toronto, Ont., Canada
pp. 849-852
P.P. Vaidyanathan, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
Byung-Jun Yoon, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 853-856
A. Tkacenko, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
P.P. Vaidyanathan, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 857-860
J.M. Peterson, SIPI, Univ. of Southern California, Los Angeles, CA, USA
S. Kadambe, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 861-864
Jie Liang, Dept. of Electr. Comput. Eng.,, Johns Hopkins Univ., Baltimore, MD, USA
Lu Gan, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
Chengjie Tu, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
T.D. Tran, Fraunhofer Inst. for Commun. Syst., Munich, Germany
Kai-Kuang Ma, NTT Data Corp., Tokyo, Japan
pp. 865-868
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