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  • 1998 International Conference on Image Processing (ICIP'98) - Volume 1
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1998 International Conference on Image Processing (ICIP'98) - Volume 1
Chicago, Illinois
October 04-October 07
ISBN: 0-8186-8821-1
Table of Contents
MA0: 50 years of elevision: From Nipkow Disk to HDTV
null
MA1: Digital Television Products and Technologies
Mike Tsinberg, Toshiba America Consumer Products
Craig Eggers, Toshiba America Consumer Products
pp. 2
Wayne C. Luplow, Zenith Electronics Corporation
pp. 3
MA2: Computed Imaging I
null
Cedric L. Logan, Massachusetts Institute of Technology
Hamid Krim, North Carolina State University
Alan S. Willsky, Massachusetts Institute of Technology
pp. 9
Nail C., University of Illinois, Urababa, IL, 61801
Catherine H. Frazier, University of Illinois, Urababa, IL, 61801
David C. Munson, Jr., University of Illinois, Urababa, IL, 61801
William D. O'Brien, Jr., University of Illinois, Urababa, IL, 61801
pp. 14
C. P. Hess, University of Illinois at Urbana-Champaign
Z.-P. Liang, University of Illinois at Urbana-Champaign
A. G. Webb, University of Illinois at Urbana-Champaign
P. C. Lauterbur, University of Illinois at Urbana-Champaign
pp. 19
MA3: Texture Analysis and Classification
null
Vivek Swarnakar, Department of Radiology University of California San Francisco
Raj Acharya, Department of Electrical Engineering State University of New York at Buffalo
pp. 49
Eero P. Simoncelli, Center for Neural Science, and Courant Institute of Mathematical Sciences New York University
Javier Portilla, Instituto de Optica
pp. 62
Patrizio Campisi, Universita Degli Studi Di roms Tre
Alessandro Neri, Universita Degli Studi Di roms Tre
Gaetano Scarano, Universita degli Studi Di Roma
pp. 67
S. Ji, Dept. of Electrical Ingineering Korea Advanced Institute of Science and Technology.
H.W. Park, Dept. of Electrical Ingineering Korea Advanced Institute of Science and Technology.
pp. 80
MA4: Wavelet Coding
null
E. Atsumi, Inf. Technol. R&D Center, Mitsubishi Electr. Corp
N. Farvardin, Inf. Technol. R&D Center, Mitsubishi Electr. Corp
pp. 87
M.K. Mihcak, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
M. Ramchandran, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
P. Moulin, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
pp. 92
C. Weidmann, Dept. of Electr. Eng., Fed. Inst. of Technol., Lausanne
J. Lebrun, Dept. of Electr. Eng., Fed. Inst. of Technol., Lausanne
M. Vetterli, Dept. of Electr. Eng., Fed. Inst. of Technol., Lausanne
pp. 97
Roh Jeongjin, Dept. of Electr. Eng., Pennsylvania State Univ., University Park, PA
D.J. Miller, Dept. of Electr. Eng., Pennsylvania State Univ., University Park, PA
pp. 102
D. Mukherjee, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA
S.K. Mitra, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA
pp. 107
Wennjun Zeng, Sharp Labs. of America Inc., Camas, WA
Jin Li, Sharp Labs. of America Inc., Camas, WA
Shawmin Lei, Sharp Labs. of America Inc., Camas, WA
pp. 112
J.E. Fowler, Dept. of Electr. & Comput. Eng., Mississippi State Univ., MS
pp. 117
MA5: Face Detection and Recognition
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C. Kotropoulos, Dept. of Inf., Aristotelian Univ. of Thessaloniki
A. Tefas, Dept. of Inf., Aristotelian Univ. of Thessaloniki
I. Pitas, Dept. of Inf., Aristotelian Univ. of Thessaloniki
pp. 122
Yang Ming-Hsuan, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
N. Ahuja, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
pp. 127
R.J. Qian, Sharp Labs. of America, Camas, WA
M.I. Sezan, Sharp Labs. of America, Camas, WA
K.E Matthews, Sharp Labs. of America, Camas, WA
pp. 131
O. Bernier, France Telecom, CNET, Lannion
M. Collobert, France Telecom, CNET, Lannion
R. Feraud, France Telecom, CNET, Lannion
V. Lemaire, France Telecom, CNET, Lannion
J.E. Viallet, France Telecom, CNET, Lannion
D. Collobert, France Telecom, CNET, Lannion
pp. 136
A.V. Nefian, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
M.H. Hayes, III, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
pp. 141
A.C. Loui, Imaging Res. & Adv. Dev., Eastman Kodak Co., Rochester, NY
C.N. Judice, Imaging Res. & Adv. Dev., Eastman Kodak Co., Rochester, NY
Liu Sheng, Imaging Res. & Adv. Dev., Eastman Kodak Co., Rochester, NY
pp. 146
Liu Chengjun, Dept. of Comput. Sci., George Mason Univ., Fairfax, VA
H. Wechsler, Dept. of Comput. Sci., George Mason Univ., Fairfax, VA
pp. 151
Y. Yan, Dept. of Product Dev., Intelligent Med. Imaging Inc., Palm Beach Gardens, FL
J. Zhang, Dept. of Product Dev., Intelligent Med. Imaging Inc., Palm Beach Gardens, FL
pp. 156
MA6: Color Emaging
null
D. Paulus, Lehrstuhl fur Mustererkennung, Erlangen-Nurnberg Univ.
L. Csink, Lehrstuhl fur Mustererkennung, Erlangen-Nurnberg Univ.
H. Niemann, Lehrstuhl fur Mustererkennung, Erlangen-Nurnberg Univ.
pp. 161
N. Sochen, Fac. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa
Y.Y. Zeevi, Fac. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa
pp. 166
N. Vandenbroucke, Ecole des Mines de Douai
L. Macaire, Ecole des Mines de Douai
J.-G Postaire, Ecole des Mines de Douai
pp. 176
M.J. Vrhel, Color Savvy Syst Ltd., Springboro, OH
H.J Trussell, Color Savvy Syst Ltd., Springboro, OH
pp. 181
D. Kacker, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
A. Ufak Agar, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
J.P. Allebach, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
B.J. Lucier, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
pp. 186
M. Uysal, Dept. of Comput. Eng., Middle East Tech. Univ., Ankara
F.T. Yarman-Vural, Dept. of Comput. Eng., Middle East Tech. Univ., Ankara
pp. 191
Kyeong-Man Kim, Sch. of Electron. & Electron. Eng., Kyungpook Nat. Univ., Taegu
Chae-Soo Lee, Sch. of Electron. & Electron. Eng., Kyungpook Nat. Univ., Taegu
Cheol-Hee Lee, Sch. of Electron. & Electron. Eng., Kyungpook Nat. Univ., Taegu
Yeong-Ho Ha, Sch. of Electron. & Electron. Eng., Kyungpook Nat. Univ., Taegu
pp. 201
H. Celebi, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC
H.J Trussell, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC
pp. 206
MA7: Preprocessing and Features Extraction
null
D. Nandy, Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL
J. Ben-Arie, Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL
pp. 211
P. Sukanya, Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama
R. Takamatsu, Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama
M. Sato, Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama
pp. 221
K. Nakamura, Media Process. Lab., Sony Corp., Tokyo
M. Ohki, Media Process. Lab., Sony Corp., Tokyo
T. Totsuka, Media Process. Lab., Sony Corp., Tokyo
pp. 226
S. Ambellouis, Inst. Nat. de Recherche sur les Transp. et Leur Securite, Villeneuve d'Ascq
F. Cabestaing, Inst. Nat. de Recherche sur les Transp. et Leur Securite, Villeneuve d'Ascq
J.-G. Postaire, Inst. Nat. de Recherche sur les Transp. et Leur Securite, Villeneuve d'Ascq
pp. 231
F. Angella, ENSERB, CNRS, Talence
O. Lavialle, ENSERB, CNRS, Talence
P Baylou, ENSERB, CNRS, Talence
pp. 241
O. Gallet, Groupe Neurocybern., ENSEA, Cergy
P. Gaussier, Groupe Neurocybern., ENSEA, Cergy
J.-P. Cocquerez, Groupe Neurocybern., ENSEA, Cergy
pp. 246
MA8: Shape and Region-Based Coding
null
G. Melnikov, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL
G.M. Schuster, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL
A.K Katsaggelos, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL
pp. 256
L. Labelle, INRS-Telecommun., Inst. Nat. de la Recherche Sci., Verdun, Que
D. Lauzon, INRS-Telecommun., Inst. Nat. de la Recherche Sci., Verdun, Que
J. Konrad, INRS-Telecommun., Inst. Nat. de la Recherche Sci., Verdun, Que
E. Dubois, INRS-Telecommun., Inst. Nat. de la Recherche Sci., Verdun, Que
pp. 261
R. Nygaard, Dept. of Electr. & Comput. Eng., Stavanger Univ., Norway
J. Hakon Husoy, Dept. of Electr. & Comput. Eng., Stavanger Univ., Norway
D. Haugland, Dept. of Electr. & Comput. Eng., Stavanger Univ., Norway
pp. 266
T. Yoshida, Fac. of Eng., Tokyo Inst. of Technol
T. Asami, Fac. of Eng., Tokyo Inst. of Technol
Y. Sakai, Fac. of Eng., Tokyo Inst. of Technol
pp. 276
Lee Jae-Beom, Dept. of Electr. Eng., Columbia Univ., New York, NY
Cho Jin-Soo, Dept. of Electr. Eng., Columbia Univ., New York, NY
A. Eleftheriadis, Dept. of Electr. Eng., Columbia Univ., New York, NY
pp. 290
L. Salgado, ETSI Telecomunicacion, Univ. Politecnica de Madrid
N. Garcia, ETSI Telecomunicacion, Univ. Politecnica de Madrid
J.M. Menendez, ETSI Telecomunicacion, Univ. Politecnica de Madrid
E. Rendon, ETSI Telecomunicacion, Univ. Politecnica de Madrid
pp. 299
MA9: Source Channel Coding II/Audio Visual Processing
null
E. Rodriguez-Marek, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA
T.R Fischer, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA
pp. 314
A. Aydin Alatan, Center for Image Processing Res., Rensselaer Polytech. Inst., Troy, NY
J.W Woods, Center for Image Processing Res., Rensselaer Polytech. Inst., Troy, NY
pp. 319
P.G. Sherwood, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA
K. Zeger, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA
pp. 324
Huang Yih-Fang, Dept. of Electr. Eng., Notre Dame Univ., IN
D.J. Costello, Dept. of Electr. Eng., Notre Dame Univ., IN
R.L. Stevenson, Dept. of Electr. Eng., Notre Dame Univ., IN
pp. 329
Xiong Zixiang, Dept. of Electr. Eng., Hawaii Univ., Honolulu, HI
Kim Beong-Jo, Dept. of Electr. Eng., Hawaii Univ., Honolulu, HI
W.A. Pearlman, Dept. of Electr. Eng., Hawaii Univ., Honolulu, HI
pp. 334
V. Pavlovic, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
pp. 343
D. Mukherjee, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA
Jin Chae Jong, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA
S.K. Mitra, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA
pp. 348
J. Nam, Dept. of Electr. & Comput. Sci., Minnesota Univ., Minneapolis, MN
M. Alghoniemy, Dept. of Electr. & Comput. Sci., Minnesota Univ., Minneapolis, MN
A.H Tewfik, Dept. of Electr. & Comput. Sci., Minnesota Univ., Minneapolis, MN
pp. 353
C. Saraceno, Dept. of Electron. for Autom., Brescia Univ
R. Leonardi, Dept. of Electron. for Autom., Brescia Univ
pp. 363
H. Pan, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
Z.-P. Liang, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
T.J. Anastasio, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
T.S. Huang, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
pp. 368
MA10: Post-Processing of Compressed Image and Video
null
Chou Jim, Syst. Eng., TRW Inc., Redondo Beach, CA
M. Crouse, Syst. Eng., TRW Inc., Redondo Beach, CA
K. Ramchandran, Syst. Eng., TRW Inc., Redondo Beach, CA
pp. 377
Tse Fu-Wing, Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin
Cham Wai-Kuen, Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin
pp. 386
Yang Yongyi, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL
Choi Mungi, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL
N.P. Galatsanos, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL
pp. 391
J. Mateos, Dept. de Ciencias de la Comput. e Inteligencia Artificial, Granada Univ.
C. Ilia, Dept. de Ciencias de la Comput. e Inteligencia Artificial, Granada Univ.
B. Jimenez, Dept. de Ciencias de la Comput. e Inteligencia Artificial, Granada Univ.
R. Molina, Dept. de Ciencias de la Comput. e Inteligencia Artificial, Granada Univ.
pp. 401
P.D. Wakefield, Sch. of Electron. & Electr. Eng., Bath Univ.
D.M. Monro, Sch. of Electron. & Electr. Eng., Bath Univ.
pp. 406
J. Jung, Univ. de Nice-Sophia Antipolis, Valbonne
M. Antonini, Univ. de Nice-Sophia Antipolis, Valbonne
M. Barlaud, Univ. de Nice-Sophia Antipolis, Valbonne
pp. 410
Yang Seungjoon, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI
Hu Yu-Hen, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI
pp. 415
G.L. Fan, Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin
W.K. Cham, Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin
pp. 420
MA11: Watermarking I
null
T. Kalker, Philips Res., Eindhoven
J.-P. Linnartz, Philips Res., Eindhoven
M. van Dijk, Philips Res., Eindhoven
pp. 425
S. Bhattacharjee, Signal Process. Lab., Fed. Inst. of Technol., Lausanne
M. Kutter, Signal Process. Lab., Fed. Inst. of Technol., Lausanne
pp. 435
R.B. Wolfgang, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN
C.I. Podilchuk, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN
E.J. Delp, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN
pp. 440
S.D. Servetto, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
C.I. Podilchuk, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
K. Ramchandran, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
pp. 445
F. Bartolini, Dipt. di Ingegneria Elettronica, Univ. di Firenze
M. Barni, Dipt. di Ingegneria Elettronica, Univ. di Firenze
V. Cappellini, Dipt. di Ingegneria Elettronica, Univ. di Firenze
A. Piva, Dipt. di Ingegneria Elettronica, Univ. di Firenze
pp. 450
J.J. Chae, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA
D. Mukherjee, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA
B.S Manjunath, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA
pp. 460
Zhu Wenwu, AT&T Bell Labs., Holmdel, NJ
Xiong Zixiang, AT&T Bell Labs., Holmdel, NJ
Zhang Ya-Qin, AT&T Bell Labs., Holmdel, NJ
pp. 465
P. Bas, UMR CNRS TIMC, La Tronche
J.-M. Chassery, UMR CNRS TIMC, La Tronche
F. Davoine, UMR CNRS TIMC, La Tronche
pp. 469
Meng Jianhao, Dept. of Electr. Eng., Columbia Univ., New York, NY
Chang Shih-Fu, Dept. of Electr. Eng., Columbia Univ., New York, NY
pp. 474
MP0: Optical signal and image processing: from analog systems to digital pipeline smart pixels
MP1: Smart Sensors and Imaging Systems
null
Y. Ohtsuka, Dept. of Electr. Eng., Tokyo Univ
T. Hamamoto, Dept. of Electr. Eng., Tokyo Univ
K. Aizawa, Dept. of Electr. Eng., Tokyo Univ
M. Hatori, Dept. of Electr. Eng., Tokyo Univ
pp. 483
T. Hamamoto, Dept. of Electr. Eng., Tokyo Univ
Y. Ohtsuka, Dept. of Electr. Eng., Tokyo Univ
K. Aizawa, Dept. of Electr. Eng., Tokyo Univ
pp. 493
MP2: Lossless Coding I
null
J.C. Kieffer, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN
T.H. Park, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN
Y. Xu, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN
S. Yakowitz, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN
pp. 498
N. Memon, Polytech. Univ., Brooklyn, NY
D. Neuhoff, Polytech. Univ., Brooklyn, NY
S. Shende, Polytech. Univ., Brooklyn, NY
pp. 503
D. Greene, Xerox Palo Alto Res. Center, CA
F. Yao, Xerox Palo Alto Res. Center, CA
Zhang Tong, Xerox Palo Alto Res. Center, CA
pp. 508
R. Iordache, Signal Process. Lab., Tampere Univ. of Technol.
I. Tabus, Signal Process. Lab., Tampere Univ. of Technol.
J Astola, Signal Process. Lab., Tampere Univ. of Technol.
pp. 512
Joung Hwayong, Dept. of Comput. Sci., Polytech. Univ., Brooklyn, NY
E.K. Wong, Dept. of Comput. Sci., Polytech. Univ., Brooklyn, NY
Chen Yu, Dept. of Comput. Sci., Polytech. Univ., Brooklyn, NY
S.P. Kim, Dept. of Comput. Sci., Polytech. Univ., Brooklyn, NY
pp. 530
MP3: Wavelet Based Image Restoration
null
S.G. Chang, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA
Yu Bin, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA
M. Vetterli, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA
pp. 535
K.J. Han, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN
A.H. Tewfik, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN
pp. 540
S.G. Chang, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA
Yu Bin, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA
M Vetterli, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA
pp. 545
Li Wenzhe, Lehrstuhl fur Allgemeine und Theor. Elektrotech., Erlangen-Nurnberg Univ
Lin Ji-Nan, Lehrstuhl fur Allgemeine und Theor. Elektrotech., Erlangen-Nurnberg Univ
R. Unbehauen, Lehrstuhl fur Allgemeine und Theor. Elektrotech., Erlangen-Nurnberg Univ
pp. 550
Liu Juan, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
P. Moulin, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
pp. 555
J. Kalifa, Centre de Math. Appliquees, Ecole Polytech., Palaiseau
S. Mallat, Centre de Math. Appliquees, Ecole Polytech., Palaiseau
B Rouge, Centre de Math. Appliquees, Ecole Polytech., Palaiseau
pp. 565
MP4: Segmentation for Remote Sensing
null
Wu Shuguang, Div. of Eng., Texas Univ., San Antonio, TX
M.D. Desai, Div. of Eng., Texas Univ., San Antonio, TX
pp. 570
A. Banerjee, Dept. of Electr. Eng., Maryland Univ., College Park, MD
P. Burlina, Dept. of Electr. Eng., Maryland Univ., College Park, MD
R. Chellappa, Dept. of Electr. Eng., Maryland Univ., College Park, MD
R. Kapoo, Dept. of Electr. Eng., Maryland Univ., College Park, MD
pp. 578
W. Phillips, Electron. Sensors & Syst. Div., Northrop-Grumman Corp., Baltimore, MD
S. DeGraaf, Electron. Sensors & Syst. Div., Northrop-Grumman Corp., Baltimore, MD
R. Chellappa, Electron. Sensors & Syst. Div., Northrop-Grumman Corp., Baltimore, MD
pp. 583
M. Cetin, Dept. of Electron. & Comput. Eng., Boston Univ., MA
W.C. Karl, Dept. of Electron. & Comput. Eng., Boston Univ., MA
pp. 587
E.G. Huot, Inst. Nat. de Recherche en Inf. et Autom., Le Chesnay
I.L. Herlin, Inst. Nat. de Recherche en Inf. et Autom., Le Chesnay
pp. 592
S. Haker, Minnesota Univ., Minneapolis, MN
G. Sapiro, Minnesota Univ., Minneapolis, MN
A. Tannenbaum, Minnesota Univ., Minneapolis, MN
pp. 597
MP5: Image Modeling
null
J.P. Havlicek, Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK
J.W. Havlicek, Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK
N.D. Mamuya, Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK
A.C. Bovik, Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK
pp. 602
Cheng Hui, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
C.A. Bouman, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
pp. 610
A. Bosson, Sch. of Inf. Syst., East Anglia Univ., Norwich
R.W. Harvey, Sch. of Inf. Syst., East Anglia Univ., Norwich
pp. 615
R.D. Nowak, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI
K.E. Timmermann, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI
pp. 620
A. Banerji, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD
J. Goutsias, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD
pp. 625
P.W. Fieguth, Dept. of Syst. Design Eng., Waterloo Univ., Ont.
pp. 635
MP6: Error-Resillent Source Coding
null
J.C. Woods, Dept. of Electron. Syst. Eng., Essex Univ., Colchester
S. Ramanan, Dept. of Electron. Syst. Eng., Essex Univ., Colchester
D.E. Pearson, Dept. of Electron. Syst. Eng., Essex Univ., Colchester
pp. 639
Li Hongzhi, Dept. of Electr. Eng., Missouri Univ., Columbia, MO
Chen Chang Wen, Dept. of Electr. Eng., Missouri Univ., Columbia, MO
pp. 644
R. Chandramouli, Center for Microelectron. Res., Univ. of South Florida, Tampa, FL
S. Kumar, Center for Microelectron. Res., Univ. of South Florida, Tampa, FL
N. Ranganathan, Center for Microelectron. Res., Univ. of South Florida, Tampa, FL
pp. 649
Yang Xuguang, Hewlett-Packard Co., Palo Alto, CA
K. Ramchandran, Hewlett-Packard Co., Palo Alto, CA
pp. 654
S.D. Servetto, Servetto, S.D. Ramchandran, K. Vaishampayan, V. Nahrstedt, K.
K. Ramchandran, Servetto, S.D. Ramchandran, K. Vaishampayan, V. Nahrstedt, K.
V. Vaishampayan, Servetto, S.D. Ramchandran, K. Vaishampayan, V. Nahrstedt, K.
pp. 659
Doo-Man Chung, Dept. of Electr. Eng., Polytech. Univ., Brooklyn, NY
Wang Yae, Dept. of Electr. Eng., Polytech. Univ., Brooklyn, NY
pp. 664
H. Jafarkhani, Res. Labs., AT&T, Red Bank, NJ
V. Tarokh, Res. Labs., AT&T, Red Bank, NJ
pp. 669
V.K. Goyal, California Univ., Berkeley, CA
J. Kovacevic, California Univ., Berkeley, CA
R. Arean, California Univ., Berkeley, CA
M. Vetterli, California Univ., Berkeley, CA
pp. 674
Wang Yao, Polytech. Univ., Brooklyn, NY
M.T. Orchard, Polytech. Univ., Brooklyn, NY
A.R Reibman, Polytech. Univ., Brooklyn, NY
pp. 679
M. Srinivasan, Dept. of Electr. Eng., Maryland Univ., College Park, MD
R. Chellappa, Dept. of Electr. Eng., Maryland Univ., College Park, MD
pp. 684
MP7: Medical Image Processing I
null
T.D. Nguyen, Dept. of Electr. Eng., Auburn Univ., AL
S.J. Reeves, Dept. of Electr. Eng., Auburn Univ., AL
T. Denney, Jr., Dept. of Electr. Eng., Auburn Univ., AL
pp. 694
W.S. Kerwin, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD
J.L. Prince, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD
pp. 699
N.F. Osman, Image Anal. and Commun. Lab., Johns Hopkins Univ., Baltimore, MD
J.L. Prince, Image Anal. and Commun. Lab., Johns Hopkins Univ., Baltimore, MD
pp. 704
Z. Fu, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
Y. Hui, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
Z.-P. Liang, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
pp. 709
V. Solo, Dept. of Stat., Macquarie Univ., North Ryde, NSW
P. Purdon, Dept. of Stat., Macquarie Univ., North Ryde, NSW
E. Brown, Dept. of Stat., Macquarie Univ., North Ryde, NSW
R. Weisskoff, Dept. of Stat., Macquarie Univ., North Ryde, NSW
pp. 714
Fan Li, Dept. of Electrr. Eng., Missouri Univ., Columbia, MO
Wen Chen Chang, Dept. of Electrr. Eng., Missouri Univ., Columbia, MO
pp. 717
I. Koren, Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL
A. Laine, Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL
F. Taylor, Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL
pp. 722
Liu Sheng, VIPER, Purdue Univ., West Lafayette, IN
C.F. Babbs, VIPER, Purdue Univ., West Lafayette, IN
E.J. Delp, VIPER, Purdue Univ., West Lafayette, IN
pp. 727
Huang Jiantao, CVIA Lab., Washington Univ. Sch. of Med., St. Louis, MO
A.A. Amini, CVIA Lab., Washington Univ. Sch. of Med., St. Louis, MO
pp. 732
MP8: Fractals and Matching Pursuits
null
D. Saupe, Inst. fur Inf., Leipzig Univ.
M. Ruhl, Inst. fur Inf., Leipzig Univ.
R. Hamzaoui, Inst. fur Inf., Leipzig Univ.
L. Grandi, Inst. fur Inf., Leipzig Univ.
pp. 737
Ho Noh Yun, Display Product Res. Lab., LG Electron. Inc., Kumi
Hyun Kim Sang, Display Product Res. Lab., LG Electron. Inc., Kumi
Chul Kim Nam, Display Product Res. Lab., LG Electron. Inc., Kumi
pp. 751
De Oliveira, Univ. Fed. do Rio de Janeiro
J.F.L. Mendonca, Univ. Fed. do Rio de Janeiro
G.V. Dias, Univ. Fed. do Rio de Janeiro
pp. 756
G. Mercier, Dept. ITI, Ecole Nat. Superieure des Telecommun. de Bretagne, Brest
M.-C. Mouchot, Dept. ITI, Ecole Nat. Superieure des Telecommun. de Bretagne, Brest
G. Cazuguel, Dept. ITI, Ecole Nat. Superieure des Telecommun. de Bretagne, Brest
pp. 760
C. De Vleeschouwer, Lab. de Telecommun. & Teledetection, Univ. Catholique de Louvain
C. Macq, Lab. de Telecommun. & Teledetection, Univ. Catholique de Louvain
pp. 764
D.W. Redmill, Centre for Commun. Res., Bristol Univ.
D.R. Bull, Centre for Commun. Res., Bristol Univ.
P. Czerepinki, Centre for Commun. Res., Bristol Univ.
pp. 769
H.R. Rabiee, Media & Interconnect Technol. Lab., Intel Corp., Hillsboro, OR
S.R. Safavian, Media & Interconnect Technol. Lab., Intel Corp., Hillsboro, OR
R.L. Kashap, Media & Interconnect Technol. Lab., Intel Corp., Hillsboro, OR
M. Saeed, Media & Interconnect Technol. Lab., Intel Corp., Hillsboro, OR
pp. 774
M. Gharavi-Aikhansari, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL
pp. 778
R. Neff, Dept. of Electr. Eng., California Univ., Berkeley, CA
T. Nomura, Dept. of Electr. Eng., California Univ., Berkeley, CA
A. Zakhor, Dept. of Electr. Eng., California Univ., Berkeley, CA
pp. 783
D. Endo, Fac. of Eng., Tokai Univ., Kanagawa
T. Hiyane, Fac. of Eng., Tokai Univ., Kanagawa
K. Atsduta, Fac. of Eng., Tokai Univ., Kanagawa
S. Kondo, Fac. of Eng., Tokai Univ., Kanagawa
pp. 788
MP9: Matching, Registration, and Mosaicing
null
M. Gabrani, Drexel Univ., Philadelphia, PA
O.J. Treiak, Drexel Univ., Philadelphia, PA
pp. 793
S. Sainath, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL
S. Sarkar, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL
pp. 798
C.A. Kapoutsis, Dept. of Inf., Thessaloniki Univ.
C.P. Vavoulidis, Dept. of Inf., Thessaloniki Univ.
I. Pitas, Dept. of Inf., Thessaloniki Univ.
pp. 808
G.M. Cortelazzo, Dipt. di Elettronica e Inf., Padova Univ.
G. Doretto, Dipt. di Elettronica e Inf., Padova Univ.
L. Lucchese, Dipt. di Elettronica e Inf., Padova Univ.
pp. 813
S. Gumustekin, Dept. of Electr. Eng., Pittsburgh Univ., PA
R.W. Hall, Dept. of Electr. Eng., Pittsburgh Univ., PA
pp. 818
P.M.Q. Aguiar, Inst. Superior Tecnico, Lisbon
J.M.F Moura, Inst. Superior Tecnico, Lisbon
pp. 823
Sun Zhaohui, Dept. of Electr. Eng., Rochester Univ., NY
A.M. Tekalp, Dept. of Electr. Eng., Rochester Univ., NY
pp. 828
C. Nikou, CNRS, Univ. Louis Pasteur, Strasbourg
F. Heitz, CNRS, Univ. Louis Pasteur, Strasbourg
J.P Armspach, CNRS, Univ. Louis Pasteur, Strasbourg
pp. 838
Zhiyong Yang, Div. of Appl. Math., Brown Univ., Providence, RI
pp. 843
You Jiangsheng, Dept. of Radiol., State Univ. of New York, Stony Brook, NY
Lu Weiguo, Dept. of Radiol., State Univ. of New York, Stony Brook, NY
Li Jian, Dept. of Radiol., State Univ. of New York, Stony Brook, NY
Gindi Gene, Dept. of Radiol., State Univ. of New York, Stony Brook, NY
Liang Zhengrong, Dept. of Radiol., State Univ. of New York, Stony Brook, NY
pp. 847
MP10: Video Scene Classification
null
Shen Bo, Hewlett-Packard Co., Palo Alto, CA
I.K. Sethi, Hewlett-Packard Co., Palo Alto, CA
V. Bhaskaran, Hewlett-Packard Co., Palo Alto, CA
pp. 857
Zhuang Yueting, Dept. of Comput. Sci., Illinois Univ., Urbana, IL
Rui Yong, Dept. of Comput. Sci., Illinois Univ., Urbana, IL
T.S. Huang, Dept. of Comput. Sci., Illinois Univ., Urbana, IL
Mehrotra S., Dept. of Comput. Sci., Illinois Univ., Urbana, IL
pp. 866
T. Kawashima, Dept. of Inf. Eng., Hokkaido Univ., Sapporo
K. Tateyama, Dept. of Inf. Eng., Hokkaido Univ., Sapporo
T. Iijima, Dept. of Inf. Eng., Hokkaido Univ., Sapporo
Y. Aoki, Dept. of Inf. Eng., Hokkaido Univ., Sapporo
pp. 871
N.D. Doulamis, Dept. of Electr. & Comput. Eng., Nat. Tech. Univ. of Athens
A.D. Doulamis, Dept. of Electr. & Comput. Eng., Nat. Tech. Univ. of Athens
Y.S. Avrithis, Dept. of Electr. & Comput. Eng., Nat. Tech. Univ. of Athens
S.D. Kollias, Dept. of Electr. & Comput. Eng., Nat. Tech. Univ. of Athens
pp. 875
M. Balakrishnan, Philips Res., Briarcliff Manor, NY
C. Caron, Philips Res., Briarcliff Manor, NY
pp. 880
M.R. Naphade, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL
R. Mehrotra, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL
A.M. Ferman, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL
J. Warnick, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL
T.S. Huang, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL
A.M. Tekalp, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL
pp. 884
M. Sugano, KDD Kamifukuoka R&D Labs., Saitama
Y. Nakajima, KDD Kamifukuoka R&D Labs., Saitama
H. Yanagihara, KDD Kamifukuoka R&D Labs., Saitama
A. Yoneyama, KDD Kamifukuoka R&D Labs., Saitama
pp. 888
Wu Min, Dept. of Electr. Eng., Princeton Univ., NJ
W. Wolf, Dept. of Electr. Eng., Princeton Univ., NJ
B. Liu, Dept. of Electr. Eng., Princeton Univ., NJ
pp. 893
T. Bebie, Inst. of Comput. Sci. & Appl. Math., Bern Univ
H. Bieri, Inst. of Comput. Sci. & Appl. Math., Bern Univ
pp. 898
T. Naemura, Dept. of Inf. & Commun. Eng., Tokyo Univ
M. Kaneko, Dept. of Inf. & Commun. Eng., Tokyo Univ
H. Harashima, Dept. of Inf. & Commun. Eng., Tokyo Univ
pp. 903
MP11: 3D Motion Estimation/Video Object Segmentation and Depth Estimation
null
Tae Kim Eung, Dept. of Electr. Eng., Korea Adv. Inst. of Sci. &Technol., Taejou
Kim Hyung-Myung, Dept. of Electr. Eng., Korea Adv. Inst. of Sci. &Technol., Taejou
pp. 913
N.L. Chang, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA
A. Zakhor, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA
pp. 918
K.I. Diamantaras, Dept. of Inf., Technol. Educ. Inst., Thessaloniki
T. Papadimitriou, Dept. of Inf., Technol. Educ. Inst., Thessaloniki
M.G. Strintzis, Dept. of Inf., Technol. Educ. Inst., Thessaloniki
M. Roumeliotis, Dept. of Inf., Technol. Educ. Inst., Thessaloniki
pp. 923
Wang Zhiqian, Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL
J. Ben-Arie, Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL
pp. 928
R. Balasubramanian, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL
D.B. Goldgof, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL
C. Kambhamettu, Dept. of Comput. Sci. & Eng., Univ. of South Florida, Tampa, FL
pp. 933
R. Castagno, Signal Process. Lab., Fed. Inst. of Technol., Lausanne
A. Sodomaco, Signal Process. Lab., Fed. Inst. of Technol., Lausanne
pp. 938
J. Shi, Div. of Comput. Sci., California Inst. of Technol., Pasadena, CA
S. Belongie, Div. of Comput. Sci., California Inst. of Technol., Pasadena, CA
T. Leung, Div. of Comput. Sci., California Inst. of Technol., Pasadena, CA
J. Malik, Div. of Comput. Sci., California Inst. of Technol., Pasadena, CA
pp. 943
F. X. Martinez, Polytechnical University of Catalania, Barcelona, Spain
J. Benois-Pineau, SEI/IVC IRESTE
D. Barba, SEI/IVC IRESTE
pp. 948
J. Vass, Dept. of Comput. Eng. & Comput. Sci., Missouri Univ., Columbia, MO
K. Palaniappan, Dept. of Comput. Eng. & Comput. Sci., Missouri Univ., Columbia, MO
Zhuang Xinhua, Dept. of Comput. Eng. & Comput. Sci., Missouri Univ., Columbia, MO
pp. 958
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