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  • 1997 International Conference on Image Processing (ICIP'97) - Volume 3
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1997 International Conference on Image Processing (ICIP'97) - Volume 3
Washington, DC
October 26-October 29
ISBN: 0-8186-8183-7
Table of Contents
WP05: Medical Image Analysis II Poster
WP06: Image/Video Transmission Poster
WP07: Motion Compensation Poster
WA01: Image Technology for WWW Oral
N. F. Maxemchuk, AT&T Labs - Research
S. Low, University of Melbourne
pp. 13
WA02: Color Image Processing Oral
H.J. Trussell, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
M.J. Vrhel, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 710
L. Akarun, Dept. of Comput. Eng., Bogazici Univ., Istanbul, Turkey
D. Ozdemir, Dept. of Comput. Eng., Bogazici Univ., Istanbul, Turkey
E. Alpaydin, Dept. of Comput. Eng., Bogazici Univ., Istanbul, Turkey
pp. 46
WA03: Image Segmentation II Oral
Xinquan Shen, Sch. of Electron. & Electr. Eng., Birmingham Univ., UK
M. Spann, Sch. of Electron. & Electr. Eng., Birmingham Univ., UK
pp. 50
R. Morris, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France
X. Descombes, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France
J. Zerubia, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France
pp. 54
J. Luo, Image Res. & Adv. Dev., Eastman Kodak Co., Rochester, NY, USA
R.T. Gray, Image Res. & Adv. Dev., Eastman Kodak Co., Rochester, NY, USA
Hsien-Che Lee, Image Res. & Adv. Dev., Eastman Kodak Co., Rochester, NY, USA
pp. 58
R.R. Schultz, Dept. of Electr. Eng., North Dakota Univ., Grand Forks, ND, USA
R.L. Stevenson, Dept. of Electr. Eng., North Dakota Univ., Grand Forks, ND, USA
pp. 62
M.G. Ramos, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
S.S. Hemami, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
M.A. Tamburro, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 66
WA04: Image Coding II Oral
Syed A. Rizvi, College of Staten Island of City University of New York
Lin-Cheng Wang, State University of New York at Buffalo
Nasser M. Nasrabadi, US Army Research Laboratory
pp. 102
Jiebo Luo, Eastman Kodak Company,
Hongzhi Li, University of Missouri-Columbia, Columbia, MO 65211
Chang Wen Chen, University of Missouri-Columbia, Columbia, MO 65211
pp. 106
F. Golchin, Sch. of Microelectron. Eng., Griffith Univ., Brisbane, Qld., Australia
K.K. Paliwal, Sch. of Microelectron. Eng., Griffith Univ., Brisbane, Qld., Australia
pp. 110
P. Nunes, Inst. Superior Tecnico, Lisbon, Portugal
F. Pereira, Inst. Superior Tecnico, Lisbon, Portugal
F. Marques, Inst. Superior Tecnico, Lisbon, Portugal
pp. 114
WA05: Image Recognition Poster
K. Wiltschi, Inst. for Comput. Graphics & Vision, Tech. Univ. Graz, Austria
T. Lindeberg, Inst. for Comput. Graphics & Vision, Tech. Univ. Graz, Austria
A. Pinz, Inst. for Comput. Graphics & Vision, Tech. Univ. Graz, Austria
pp. 122
Yuntao Cui, Siemens Corp. Res. Inc., Princeton, NJ, USA
Qian Huang, Siemens Corp. Res. Inc., Princeton, NJ, USA
pp. 126
D. Kundur, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
D. Hatzinakos, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
H. Leung, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
pp. 130
H.B.D. Sorensen, Dept. of Appl. Electron., Tech. Univ. Denmark, Lyngby, Denmark
K.B. Jakobsen, Dept. of Appl. Electron., Tech. Univ. Denmark, Lyngby, Denmark
O. Nymann, Dept. of Appl. Electron., Tech. Univ. Denmark, Lyngby, Denmark
pp. 142
Peter Morguet, Institute for Human-Machine-Communication
Manfred Lang, Institute for Human-Machine-Communication
pp. 146
T.S. Spisz, The Johns Hopkins University
N. D'Costa, The Johns Hopkins University
C.K. Seymour, The Johns Hopkins University
J.H. Hoh, The Johns Hopkins University
R. Reeves, The Johns Hopkins University
I.N. Bankman, The Johns Hopkins University
pp. 154
A. Abu-Naser, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
N.P. Galatsanos, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
M.N. Wernick, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 158
Zhiqian Wang, Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
J. Ben-Arie, Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
pp. 162
J. Posl, Lehrstuhl fur Mustererkennung, Erlangen-Nurnberg Univ., Germany
H. Niemann, Lehrstuhl fur Mustererkennung, Erlangen-Nurnberg Univ., Germany
pp. 170
WA06: Image Texture Analysis Poster
A. Teuner, Fraunhofer Inst. of Microelectron. Circuits & Syst., Duisburg, Germany
O. Pichler, Fraunhofer Inst. of Microelectron. Circuits & Syst., Duisburg, Germany
J.E. Santos Conde, Fraunhofer Inst. of Microelectron. Circuits & Syst., Duisburg, Germany
B.J. Hosticka, Fraunhofer Inst. of Microelectron. Circuits & Syst., Duisburg, Germany
pp. 174
J.-R. Ohm, Image Process. Dept., Heinrich-Hertz-Inst., Germany
Phuong Ma, Image Process. Dept., Heinrich-Hertz-Inst., Germany
pp. 178
Aleksandra Mojsilovic, Faculty of Electrical Engineering, University of Belgrade
Srdjan Markovic, Faculty of Electrical Engineering, University of Belgrade
Miodrag Popovic, Faculty of Electrical Engineering, University of Belgrade
pp. 182
H. Igehy, Dept. of Comput. Sci., Stanford Univ., CA, USA
L. Pereira, Dept. of Comput. Sci., Stanford Univ., CA, USA
pp. 186
G. Lambert, Inst. of Control Eng., Darmstadt Univ. of Technol., Germany
F. Bock, Inst. of Control Eng., Darmstadt Univ. of Technol., Germany
pp. 201
R.M. Rangayyan, Dept. of Electr. & Comput. Eng., Calgary Univ., Alta., Canada
A.C.G. Martins, Dept. of Electr. & Comput. Eng., Calgary Univ., Alta., Canada
pp. 217
WA07: Stereo/Registration Poster
Jianhua Xuan, Wendelin Hayes, Matthew T. Freedman, and Seong K. Mun
Yue Wang, Wendelin Hayes, Matthew T. Freedman, and Seong K. Mun
Tulay Adali, Wendelin Hayes, Matthew T. Freedman, and Seong K. Mun
Qinfen Zheng, Wendelin Hayes, Matthew T. Freedman, and Seong K. Mun
pp. 236
A. El Zaart, Dept. de Math. et d'Inf., Sherbrooke Univ., Que., Canada
D. Ziou, Dept. de Math. et d'Inf., Sherbrooke Univ., Que., Canada
F. Dubeau, Dept. de Math. et d'Inf., Sherbrooke Univ., Que., Canada
pp. 244
Larry Matthies, Jet Propulsion Laboratory
Byron Chen, Bell Labs, Lucent Technologies Inc.
Jon Petrescu, ORINCON Corporation
pp. 248
C.L. Pagliari, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
T.J. Dennis, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
pp. 256
Sang-Hoon Seo, Signal/Image Processing Laboratory
Mahmood R. Azimi-Sadjadi, Signal/Image Processing Laboratory
Bin Tian, Signal/Image Processing Laboratory
pp. 260
I. Bloch, Dept. Images, Ecole Nat. Superieure des Telecommun., Paris, France
L. Aurdal, Dept. Images, Ecole Nat. Superieure des Telecommun., Paris, France
D. Bijno, Dept. Images, Ecole Nat. Superieure des Telecommun., Paris, France
J. Muller, Dept. Images, Ecole Nat. Superieure des Telecommun., Paris, France
pp. 268
Z.-P. Liang, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
H. Pan, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
R.L. Magin, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
N. Ahuja, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
T.S. Huang, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 272
A. Marugame, C&C Media Res. Labs., NEC Corp., Kawasaki, Japan
M. Ohta, C&C Media Res. Labs., NEC Corp., Kawasaki, Japan
pp. 276
Oliver Rockinger, Systems Technology Research, Intelligent Systems Group Daimler Benz AG
pp. 288
WA08: Character, Pattern, and Face Poster Recognition
N. Boujemaa, Lab. d'Inf., Ecole d'Ingenieurs en Inf. pour l'Ind., Tours, France
G. Roux, Lab. d'Inf., Ecole d'Ingenieurs en Inf. pour l'Ind., Tours, France
J.-P. Asselin de Beauville, Lab. d'Inf., Ecole d'Ingenieurs en Inf. pour l'Ind., Tours, France
B. Vattolo, Lab. d'Inf., Ecole d'Ingenieurs en Inf. pour l'Ind., Tours, France
pp. 296
T. Kurita, Div. of Inf. Sci., Electrotech. Lab., Ibaraki, Japan
Y. Kobayashi, Div. of Inf. Sci., Electrotech. Lab., Ibaraki, Japan
T. Mishima, Div. of Inf. Sci., Electrotech. Lab., Ibaraki, Japan
pp. 722
L. Wiskott, Inst. fur Neuroinf., Ruhr-Univ., Bochum, Germany
pp. 308
M.J. Turmon, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
S. Mukhtar, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
pp. 320
Pak-Kwong Wong, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
Chorkin Chan, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
pp. 324
Takami Satonaka, Computer Systems Laboratory, Stanford University()
Takaaki Baba, Computer Systems Laboratory, Stanford University()
Tatsuo Otsuki, Computer Systems Laboratory, Stanford University()
Takao Chikamura, Computer Systems Laboratory, Stanford University()
Teresa H. Meng, Computer Systems Laboratory, Stanford University()
pp. 336
Kuntal Sengupta, ATR Media Integration and Communications Research Laboratories
Jun Ohya, ATR Media Integration and Communications Research Laboratories
pp. 340
WA09: Optical Flow and Diffusion Poster
C. Andrew Segall, Oklahoma Imaging Laboratory
Scott T. Acton, Oklahoma Imaging Laboratory
pp. 348
Hairong Qi, Center for Adv. Comput. & Commun., North Carolina State Univ., Raleigh, NC, USA
W.E. Snyder, Center for Adv. Comput. & Commun., North Carolina State Univ., Raleigh, NC, USA
G.L. Bilbro, Center for Adv. Comput. & Commun., North Carolina State Univ., Raleigh, NC, USA
pp. 352
Sandeep N. Gupta, The Johns Hopkins University
Jerry L. Prince, The Johns Hopkins University
Stephanos Androutsellis-Theotokis, The Johns Hopkins University
pp. 364
R. Kimmel, University of California, Berkeley
R. Malladi, University of California, Berkeley
N. Sochen, University of California, Berkeley
pp. 368
WP01: PDE and Image Diffusion Oral
Gary A. Hewer, Signal Processing Technology Group
Charles S. Kenney, Signal Processing Technology Group
Lawrence A. Peterson, Signal Processing Technology Group
Alan Van Nevel, Signal Processing Technology Group
pp. 372
V. Caselles, Dept. de Math., Univ. de les Illes Balears, Palma de Mallorca, Spain
J.-M. Morel, Dept. de Math., Univ. de les Illes Balears, Palma de Mallorca, Spain
C. Sbert, Dept. de Math., Univ. de les Illes Balears, Palma de Mallorca, Spain
pp. 376
P. Blomgren, Dept. of Math., California Univ., Los Angeles, CA, USA
T.F. Chan, Dept. of Math., California Univ., Los Angeles, CA, USA
P. Mulet, Dept. of Math., California Univ., Los Angeles, CA, USA
C.K. Wong, Dept. of Math., California Univ., Los Angeles, CA, USA
pp. 384
Kaleem Siddiqi, Yale University
Steven W. Zucker, Yale University
Allen Tannenbaum, University of Minnesota
pp. 392
J. Weickert, Utrecht University Hospital
K.J. Zuiderveld, Utrecht University Hospital
B.M. ter Haar Romeny, Utrecht University Hospital
W.J. Niessen, Utrecht University Hospital
pp. 396
WP02: Fuzzy and Neural Image Oral Processing
X.-Y. Cheng, Mitani Sangyo Co.
I. Akiyama1, Mitani Sangyo Co.
K. Itoh, Mitani Sangyo Co.
Y. Wang, Mitani Sangyo Co.
N. Taniguchi, Mitani Sangyo Co.
M. Nakajima, Mitani Sangyo Co.
pp. 412
Tae-Eun Kim, DChung-Ang University
Sun-Ho Lee, DChung-Ang University
Seok-Hyun Ryu, DChung-Ang University
Jong-Soo Choi, DChung-Ang University
pp. 416
S. Kollias, Electr. & Comput. Eng., Nat. Tech. Univ. of Athens, Greece
N. Doulamis, Electr. & Comput. Eng., Nat. Tech. Univ. of Athens, Greece
A. Doulamis, Electr. & Comput. Eng., Nat. Tech. Univ. of Athens, Greece
pp. 424
WP03: Video Coding IV Oral
A. Fuldseth, Dept. of Telecommun., Norwegian Univ. of Sci. & Technol., Trondheim, Norway
T.A. Ramstad, Dept. of Telecommun., Norwegian Univ. of Sci. & Technol., Trondheim, Norway
pp. 428
Shankar L. Regunathan, University of California, Santa Barbara
Kenneth Rose, University of California, Santa Barbara
pp. 432
A. Polzer, Rheinische Friedrich-Wilhelms-Univ., Bonn, Germany
H. Klock, Rheinische Friedrich-Wilhelms-Univ., Bonn, Germany
J.M. Buhrmann, Rheinische Friedrich-Wilhelms-Univ., Bonn, Germany
pp. 436
Y. Yemez, Dept. of Electr. & Electron. Eng., Bogazici Univ., Istanbul, Turkey
B. Sankur, Dept. of Electr. & Electron. Eng., Bogazici Univ., Istanbul, Turkey
E. Anarim, Dept. of Electr. & Electron. Eng., Bogazici Univ., Istanbul, Turkey
pp. 444
S.S. Pradhan, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
K. Ramchandran, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 452
Gi Hun Lee, Dept. of Electronic Engineering, Sogang University
Joon Ho Song, Dept. of Electronic Engineering, Sogang University
Rae-Hong Park, Dept. of Electronic Engineering, Sogang University
pp. 456
F.-H. Lin, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
W. Gass, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 460
WP04: Target Tracking Oral
R. Meth, Center for Autom. Res., Maryland Univ., College Park, MD, USA
R. Chellappa, Center for Autom. Res., Maryland Univ., College Park, MD, USA
pp. 464
Q.A. Holmes, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
X. Zhang, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
D. Zhao, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
pp. 468
A.O. Hero, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
C. Guillouet, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 472
S.M. Sowelam, Gen. Electr. Corp. Res. & Dev. Center, Niskayuna, NY, USA
A.H. Tewfik, Gen. Electr. Corp. Res. & Dev. Center, Niskayuna, NY, USA
pp. 476
S.N. Ngoc, Eur. Molecular Biol. Lab., Heidelberg, Germany
F. Briquet-Laugier, Eur. Molecular Biol. Lab., Heidelberg, Germany
C. Boulin, Eur. Molecular Biol. Lab., Heidelberg, Germany
J.-C. Olivo, Eur. Molecular Biol. Lab., Heidelberg, Germany
pp. 484
Y.-H. Gu, Dept. of Appl. Electron., Chalmers Univ. of Technol., Goteborg, Sweden
V. Gui, Dept. of Appl. Electron., Chalmers Univ. of Technol., Goteborg, Sweden
T. Tjahjadi, Dept. of Appl. Electron., Chalmers Univ. of Technol., Goteborg, Sweden
pp. 492
Y. Watanabe, Kanazawa Inst. of Technol., Ishikawa, Japan
K. Takahashi, Kanazawa Inst. of Technol., Ishikawa, Japan
M. Nakazawa, Kanazawa Inst. of Technol., Ishikawa, Japan
pp. 496
L. Li, Dept. of Radiol., Univ. of South Florida, Tampa, FL, USA
F. Mao, Dept. of Radiol., Univ. of South Florida, Tampa, FL, USA
W. Qian, Dept. of Radiol., Univ. of South Florida, Tampa, FL, USA
L.P. Clarke, Dept. of Radiol., Univ. of South Florida, Tampa, FL, USA
pp. 500
C.W. Hanna, Sci. Ultrasound Center, Cairo, Egypt
A.B.M. Youssef, Sci. Ultrasound Center, Cairo, Egypt
pp. 504
R.C. Chan, Healt Sci. & Tech., MIT, Cambridge, MA, USA
W.C. Karl, Healt Sci. & Tech., MIT, Cambridge, MA, USA
R.S. Lees, Healt Sci. & Tech., MIT, Cambridge, MA, USA
pp. 508
N. Tsapatsoulis, Div. of Comput. Sci., Nat. Tech. Univ. of Athens, Greece
F. Schnorrenberg, Div. of Comput. Sci., Nat. Tech. Univ. of Athens, Greece
C. Pattichis, Div. of Comput. Sci., Nat. Tech. Univ. of Athens, Greece
S. Kollias, Div. of Comput. Sci., Nat. Tech. Univ. of Athens, Greece
pp. 512
M.S. Brown, Sch. of Med., California Univ., Los Angeles, CA, USA
M.F. McNitt-Gray, Sch. of Med., California Univ., Los Angeles, CA, USA
J.G. Goldin, Sch. of Med., California Univ., Los Angeles, CA, USA
D.R. Aberle, Sch. of Med., California Univ., Los Angeles, CA, USA
pp. 516
H. Jiang, Commun. Res. Lab., Minist. of Posts & Telecommun., Koganei, Japan
W. Tiu, Commun. Res. Lab., Minist. of Posts & Telecommun., Koganei, Japan
S. Yamamoto, Commun. Res. Lab., Minist. of Posts & Telecommun., Koganei, Japan
S.-I. Iisaku, Commun. Res. Lab., Minist. of Posts & Telecommun., Koganei, Japan
pp. 520
C.-M. Chang, Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
A. Laine, Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
pp. 524
Y. Kawata, Fac. of Eng., Tokushima Univ., Japan
N. Niki, Fac. of Eng., Tokushima Univ., Japan
H. Ohmatsu, Fac. of Eng., Tokushima Univ., Japan
R. Kakinuma, Fac. of Eng., Tokushima Univ., Japan
K. Eguchi, Fac. of Eng., Tokushima Univ., Japan
M. Kaneko, Fac. of Eng., Tokushima Univ., Japan
N. Moriyama, Fac. of Eng., Tokushima Univ., Japan
pp. 528
A. Mojsilovic, Fac. of Electr. Eng., Belgrade Univ., Serbia
S. Markovic, Fac. of Electr. Eng., Belgrade Univ., Serbia
M. Popovic, Fac. of Electr. Eng., Belgrade Univ., Serbia
pp. 547
M. Kubo, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan
T. Tozaki, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan
N. Niki, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan
S. Nakagawa, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan
K. Eguchi, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan
M. Kaneko, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan
H. Omatsu, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan
N. Moriyama, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan
N. Yamaguchi, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan
pp. 551
J. He, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
D.J. Costello, Jr., Dept. of Electr. Eng., Notre Dame Univ., IN, USA
Y.-F. Huang, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
R.L. Stevenson, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 559
W.S. Lee, Sch. of Electr. Eng., Australian Defence Force Acad., Canberra, ACT, Australia
M.R. Frater, Sch. of Electr. Eng., Australian Defence Force Acad., Canberra, ACT, Australia
M.R. Pickering, Sch. of Electr. Eng., Australian Defence Force Acad., Canberra, ACT, Australia
J.F. Arnold, Sch. of Electr. Eng., Australian Defence Force Acad., Canberra, ACT, Australia
pp. 563
S. Bilato, Dipt. di Elettronica e Inf., Padova Univ., Italy
G. Calvagno, Dipt. di Elettronica e Inf., Padova Univ., Italy
G.A. Mian, Dipt. di Elettronica e Inf., Padova Univ., Italy
R. Rinaldo, Dipt. di Elettronica e Inf., Padova Univ., Italy
pp. 571
Young Huh, Power Telecommun. Team, KERI, Kyungnam, South Korea
K. Panusopone, Power Telecommun. Team, KERI, Kyungnam, South Korea
K.R. Rao, Power Telecommun. Team, KERI, Kyungnam, South Korea
pp. 575
W.S. Lee, Australian Defence Force Acad., Canberra, ACT, Australia
M.R. Frater, Australian Defence Force Acad., Canberra, ACT, Australia
M.R. Pickering, Australian Defence Force Acad., Canberra, ACT, Australia
J.F. Arnold, Australian Defence Force Acad., Canberra, ACT, Australia
pp. 582
L. Teixeira, INESC, Porto, Portugal
T. Andrade, INESC, Porto, Portugal
V. Teixeira, INESC, Porto, Portugal
pp. 586
Joon Ho Song, Dept. of Electron. Eng., Sogang Univ., Seoul, South Korea
Gi Hun Lee, Dept. of Electron. Eng., Sogang Univ., Seoul, South Korea
Rae-Hong Park, Dept. of Electron. Eng., Sogang Univ., Seoul, South Korea
pp. 590
D.B. Bradshaw, Dept. of Eng., Cambridge Univ., UK
N.G. Kingsbury, Dept. of Eng., Cambridge Univ., UK
A.C. Kokaram, Dept. of Eng., Cambridge Univ., UK
pp. 602
Chok-Kwan Cheung, CityU Image Process. Lab., City Univ. of Hong Kong, Hong Kong
Lai-Man Po, CityU Image Process. Lab., City Univ. of Hong Kong, Hong Kong
pp. 606
Jie-Bin Xu, CityU Image Process. Lab., City Univ. of Hong Kong, Hong Kong
Lai-Man Po, CityU Image Process. Lab., City Univ. of Hong Kong, Hong Kong
Chok-Kwan Cheung, CityU Image Process. Lab., City Univ. of Hong Kong, Hong Kong
pp. 610
Jie Wei, Sch. of Comput. Sci., Simon Fraser Univ., Burnaby, BC, Canada
Ze-Nian Li, Sch. of Comput. Sci., Simon Fraser Univ., Burnaby, BC, Canada
pp. 614
Dong-Il Chang, Lab. of Image Commun., Seoul Nat. Univ., South Korea
Joonhyun Sung, Lab. of Image Commun., Seoul Nat. Univ., South Korea
Choong Woong Lee, Lab. of Image Commun., Seoul Nat. Univ., South Korea
pp. 618
Bo Tao, Dept. of Electr. Eng., Princeton Univ., NJ, USA
M.T. Orchard, Dept. of Electr. Eng., Princeton Univ., NJ, USA
B.W. Dickinson, Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 626
Jiajun Zhang, Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
M.O. Ahmad, Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
M.N.S. Swamy, Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
pp. 642
Pohsiang Hsu, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
K.J.R. Liu, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
T. Chen, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 646
P. Ishwar, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
P. Moulin, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 650
WP08: Image Coding III Poster
J. Andrew, Canon Inf. Syst. Res., North Ryde, NSW, Australia
pp. 658
N. Memon, Dept. of Comput. Sci., Northern Illinois Univ., DeKalb, IL, USA
N. Moayeri, Dept. of Comput. Sci., Northern Illinois Univ., DeKalb, IL, USA
pp. 662
J.-L. Dugelay, Dept. of Multimedia Commun., Inst. EURECOM, Sophia Antipolis, France
A. Gersho, Dept. of Multimedia Commun., Inst. EURECOM, Sophia Antipolis, France
pp. 726
J.A. Bloom, Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA
T.R. Reed, Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA
pp. 670
Wen Jiang, Dept. of Inf. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Xiaolin Wu, Dept. of Inf. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Wai Yin Ng, Dept. of Inf. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
pp. 678
A. Tremeau, Equipe Ingenierie de la Vision, Univ. Jean Monnet, Saint-Etienne, France
C. Charrier, Equipe Ingenierie de la Vision, Univ. Jean Monnet, Saint-Etienne, France
H. Cherifi, Equipe Ingenierie de la Vision, Univ. Jean Monnet, Saint-Etienne, France
pp. 682
T.J. Klausutis, Centre for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
V.K. Madisetti, Centre for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 686
O.E. Kia, Lab. of Inf. Technol., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
D.S. Doermann, Lab. of Inf. Technol., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
pp. 690
J.R. Smith, IBM Thomas J. Watson Res. Center, Hawthorne, NY, USA
Shih-Fu Chang, IBM Thomas J. Watson Res. Center, Hawthorne, NY, USA
pp. 702
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