ISBN: 0-8186-8183-7

S-F Chang

J. Smith

H. Meng

D.A. Forsyth

M.M. Fleck

Fred Mintzer

Gordon W. Braudaway

Minerva M. Yeung

N. F. Maxemchuk, AT&T Labs - Research

S. Low, University of Melbourne

S. Jacobs

A. Eleftheridis

M. Chapron

C. Kok

T. Chen

E. Dubois, INRS-Telecommunications

J. Konrad, INRS-Telecommunications

Bruce A. Thomas, The University of Arizona

Robin N. Strickland, The University of Arizona

Jeffrey J. Rodriguez, The University of Arizona

Ke Shen, Purdue University

Edward J. Delp, Purdue University

Akira Inoue, NEC Corporation

Johji Tajima, NEC Corporation

Andrew Queisser, Techne Systems

H.J. Trussell, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA

M.J. Vrhel, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA

L. Akarun, Dept. of Comput. Eng., Bogazici Univ., Istanbul, Turkey

D. Ozdemir, Dept. of Comput. Eng., Bogazici Univ., Istanbul, Turkey

E. Alpaydin, Dept. of Comput. Eng., Bogazici Univ., Istanbul, Turkey

Xinquan Shen, Sch. of Electron. & Electr. Eng., Birmingham Univ., UK

M. Spann, Sch. of Electron. & Electr. Eng., Birmingham Univ., UK

R. Morris, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France

X. Descombes, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France

J. Zerubia, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France

J. Luo, Image Res. & Adv. Dev., Eastman Kodak Co., Rochester, NY, USA

R.T. Gray, Image Res. & Adv. Dev., Eastman Kodak Co., Rochester, NY, USA

Hsien-Che Lee, Image Res. & Adv. Dev., Eastman Kodak Co., Rochester, NY, USA

R.R. Schultz, Dept. of Electr. Eng., North Dakota Univ., Grand Forks, ND, USA

R.L. Stevenson, Dept. of Electr. Eng., North Dakota Univ., Grand Forks, ND, USA

M.G. Ramos, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA

S.S. Hemami, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA

M.A. Tamburro, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA

R. de Queiroz

R. Eschbach

M. Niimi

H. Noda

E. Kawaguchi

D. Meyer

J. Denzler

S. Servetto

J. Rosenblatt

K. Ramchandran

C.-C. Chen

T. Chen

H. Man

F. Kossentini

M. Smith

Y. Altunbasak

T.-H. Yu

J. Chen

S. Mitra

Syed A. Rizvi, College of Staten Island of City University of New York

Lin-Cheng Wang, State University of New York at Buffalo

Nasser M. Nasrabadi, US Army Research Laboratory

Jiebo Luo, Eastman Kodak Company,

Hongzhi Li, University of Missouri-Columbia, Columbia, MO 65211

Chang Wen Chen, University of Missouri-Columbia, Columbia, MO 65211

F. Golchin, Sch. of Microelectron. Eng., Griffith Univ., Brisbane, Qld., Australia

K.K. Paliwal, Sch. of Microelectron. Eng., Griffith Univ., Brisbane, Qld., Australia

P. Nunes, Inst. Superior Tecnico, Lisbon, Portugal

F. Pereira, Inst. Superior Tecnico, Lisbon, Portugal

F. Marques, Inst. Superior Tecnico, Lisbon, Portugal

Jasjit S. Suri

Robert M. Haralick

Florence H. Sheehan

K. Wiltschi, Inst. for Comput. Graphics & Vision, Tech. Univ. Graz, Austria

T. Lindeberg, Inst. for Comput. Graphics & Vision, Tech. Univ. Graz, Austria

A. Pinz, Inst. for Comput. Graphics & Vision, Tech. Univ. Graz, Austria

Yuntao Cui, Siemens Corp. Res. Inc., Princeton, NJ, USA

Qian Huang, Siemens Corp. Res. Inc., Princeton, NJ, USA

D. Kundur, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada

D. Hatzinakos, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada

H. Leung, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada

Meir Barzohar

Moshe Cohen

Ilan Ziskind

David Cooper

Lizhi Wang, University of California, Irvine

Glenn Healey, University of California, Irvine

H.B.D. Sorensen, Dept. of Appl. Electron., Tech. Univ. Denmark, Lyngby, Denmark

K.B. Jakobsen, Dept. of Appl. Electron., Tech. Univ. Denmark, Lyngby, Denmark

O. Nymann, Dept. of Appl. Electron., Tech. Univ. Denmark, Lyngby, Denmark

Peter Morguet, Institute for Human-Machine-Communication

Manfred Lang, Institute for Human-Machine-Communication

Kyung Shik Jang

Jonghyon Yi

Jin Young Jung

Jaihie Kim

Kyu Hwan Chang

T.S. Spisz, The Johns Hopkins University

N. D'Costa, The Johns Hopkins University

C.K. Seymour, The Johns Hopkins University

J.H. Hoh, The Johns Hopkins University

R. Reeves, The Johns Hopkins University

I.N. Bankman, The Johns Hopkins University

A. Abu-Naser, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA

N.P. Galatsanos, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA

M.N. Wernick, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA

Zhiqian Wang, Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA

J. Ben-Arie, Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA

Caterina Saraceno, University of Brescia

Riccardo Leonardi, University of Brescia

J. Posl, Lehrstuhl fur Mustererkennung, Erlangen-Nurnberg Univ., Germany

H. Niemann, Lehrstuhl fur Mustererkennung, Erlangen-Nurnberg Univ., Germany

A. Teuner, Fraunhofer Inst. of Microelectron. Circuits & Syst., Duisburg, Germany

O. Pichler, Fraunhofer Inst. of Microelectron. Circuits & Syst., Duisburg, Germany

J.E. Santos Conde, Fraunhofer Inst. of Microelectron. Circuits & Syst., Duisburg, Germany

B.J. Hosticka, Fraunhofer Inst. of Microelectron. Circuits & Syst., Duisburg, Germany

J.-R. Ohm, Image Process. Dept., Heinrich-Hertz-Inst., Germany

Phuong Ma, Image Process. Dept., Heinrich-Hertz-Inst., Germany

Aleksandra Mojsilovic, Faculty of Electrical Engineering, University of Belgrade

Srdjan Markovic, Faculty of Electrical Engineering, University of Belgrade

Miodrag Popovic, Faculty of Electrical Engineering, University of Belgrade

H. Igehy, Dept. of Comput. Sci., Stanford Univ., CA, USA

L. Pereira, Dept. of Comput. Sci., Stanford Univ., CA, USA

Hamzah Arof, University of Wales Swansea

Farzin Deravi, University of Wales Swansea

C. Germain

P. Boylou

S.R. Fountain

T.N Tan

G. Lambert, Inst. of Control Eng., Darmstadt Univ. of Technol., Germany

F. Bock, Inst. of Control Eng., Darmstadt Univ. of Technol., Germany

Lance M. Kaplan, Clark Atlanta University

Romain Murenzi, Clark Atlanta University

Bin Tian, Thomas H. Vonder Haar, and Donald Reinke

Mahmood R. Azimi-Sadjadi, Thomas H. Vonder Haar, and Donald Reinke

T. Hofmann, Massachusetts Institute of Technology

J. Puzicha, University of Bonn

J.M. Buhmann, University of Bonn

R.M. Rangayyan, Dept. of Electr. & Comput. Eng., Calgary Univ., Alta., Canada

A.C.G. Martins, Dept. of Electr. & Comput. Eng., Calgary Univ., Alta., Canada

Lin Yue, Rice University

Haitao Guo, Chromatic Research, Inc.

K. Hassanein

S. Wesolkouski

Stefan Growe, University of Hannover

Ralf Toenjes, University of Hannover

Jose Paumard

Eric Aubourg

Jianhua Xuan, Wendelin Hayes, Matthew T. Freedman, and Seong K. Mun

Yue Wang, Wendelin Hayes, Matthew T. Freedman, and Seong K. Mun

Tulay Adali, Wendelin Hayes, Matthew T. Freedman, and Seong K. Mun

Qinfen Zheng, Wendelin Hayes, Matthew T. Freedman, and Seong K. Mun

Fatih M. Porikli, Polytechnic University

A. El Zaart, Dept. de Math. et d'Inf., Sherbrooke Univ., Que., Canada

D. Ziou, Dept. de Math. et d'Inf., Sherbrooke Univ., Que., Canada

F. Dubeau, Dept. de Math. et d'Inf., Sherbrooke Univ., Que., Canada

Larry Matthies, Jet Propulsion Laboratory

Byron Chen, Bell Labs, Lucent Technologies Inc.

Jon Petrescu, ORINCON Corporation

Martin Lefebure, CEREMADE

Laurent D. Cohen, CEREMADE

C.L. Pagliari, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK

T.J. Dennis, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK

Sang-Hoon Seo, Signal/Image Processing Laboratory

Mahmood R. Azimi-Sadjadi, Signal/Image Processing Laboratory

Bin Tian, Signal/Image Processing Laboratory

Yang Wang, University of Nebraska-Lincoln

Prabir Bhattacharya, University of Nebraska-Lincoln

I. Bloch, Dept. Images, Ecole Nat. Superieure des Telecommun., Paris, France

L. Aurdal, Dept. Images, Ecole Nat. Superieure des Telecommun., Paris, France

D. Bijno, Dept. Images, Ecole Nat. Superieure des Telecommun., Paris, France

J. Muller, Dept. Images, Ecole Nat. Superieure des Telecommun., Paris, France

Z.-P. Liang, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA

H. Pan, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA

R.L. Magin, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA

N. Ahuja, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA

T.S. Huang, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA

A. Marugame, C&C Media Res. Labs., NEC Corp., Kawasaki, Japan

M. Ohta, C&C Media Res. Labs., NEC Corp., Kawasaki, Japan

M. Soumekh, Lincoln Lab., MIT, Lexington, MA, USA

Mathini Sellathurai, Royal Institutet of Technology

Oliver Rockinger, Systems Technology Research, Intelligent Systems Group Daimler Benz AG

Radovan Krtolica, Canon Research Center America, Inc.

N. Boujemaa, Lab. d'Inf., Ecole d'Ingenieurs en Inf. pour l'Ind., Tours, France

G. Roux, Lab. d'Inf., Ecole d'Ingenieurs en Inf. pour l'Ind., Tours, France

J.-P. Asselin de Beauville, Lab. d'Inf., Ecole d'Ingenieurs en Inf. pour l'Ind., Tours, France

B. Vattolo, Lab. d'Inf., Ecole d'Ingenieurs en Inf. pour l'Ind., Tours, France

T. Kurita, Div. of Inf. Sci., Electrotech. Lab., Ibaraki, Japan

Y. Kobayashi, Div. of Inf. Sci., Electrotech. Lab., Ibaraki, Japan

T. Mishima, Div. of Inf. Sci., Electrotech. Lab., Ibaraki, Japan

M. Kampmann, Inst. fur Theor. Nachrichtentech. und Inf., Hannover Univ., Germany

A. Kundu

Yang He

Mou-Yen Chen

L. Wiskott, Inst. fur Neuroinf., Ruhr-Univ., Bochum, Germany

Stuart A. Mills

James P. Karins

R. Barry Dydyk Litton Data Systems

Yuanzhong Li

Hidefumi Kobatake

M.J. Turmon, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA

S. Mukhtar, Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA

Pak-Kwong Wong, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong

Chorkin Chan, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong

L. Zhang

Dibyendu Nandy, University of Illinois at Chicago

Jezekiel Ben-Arie, University of Illinois at Chicago

Takami Satonaka, Computer Systems Laboratory, Stanford University()

Takaaki Baba, Computer Systems Laboratory, Stanford University()

Tatsuo Otsuki, Computer Systems Laboratory, Stanford University()

Takao Chikamura, Computer Systems Laboratory, Stanford University()

Teresa H. Meng, Computer Systems Laboratory, Stanford University()

Kuntal Sengupta, ATR Media Integration and Communications Research Laboratories

Jun Ohya, ATR Media Integration and Communications Research Laboratories

Ravi Kothari, University of Cincinnati

John Bellando, University of Cincinnati

C. Andrew Segall, Oklahoma Imaging Laboratory

Scott T. Acton, Oklahoma Imaging Laboratory

Hairong Qi, Center for Adv. Comput. & Commun., North Carolina State Univ., Raleigh, NC, USA

W.E. Snyder, Center for Adv. Comput. & Commun., North Carolina State Univ., Raleigh, NC, USA

G.L. Bilbro, Center for Adv. Comput. & Commun., North Carolina State Univ., Raleigh, NC, USA

Sridhar Srinivasan, University of Maryland

Rama Chellappa, University of Maryland

L. Ng

V. Solo

Sandeep N. Gupta, The Johns Hopkins University

Jerry L. Prince, The Johns Hopkins University

Stephanos Androutsellis-Theotokis, The Johns Hopkins University

R. Kimmel, University of California, Berkeley

R. Malladi, University of California, Berkeley

N. Sochen, University of California, Berkeley

Gary A. Hewer, Signal Processing Technology Group

Charles S. Kenney, Signal Processing Technology Group

Lawrence A. Peterson, Signal Processing Technology Group

Alan Van Nevel, Signal Processing Technology Group

V. Caselles, Dept. de Math., Univ. de les Illes Balears, Palma de Mallorca, Spain

J.-M. Morel, Dept. de Math., Univ. de les Illes Balears, Palma de Mallorca, Spain

C. Sbert, Dept. de Math., Univ. de les Illes Balears, Palma de Mallorca, Spain

J. Mcelvain

J. Langan

A. J. Heeger

P. Blomgren, Dept. of Math., California Univ., Los Angeles, CA, USA

T.F. Chan, Dept. of Math., California Univ., Los Angeles, CA, USA

P. Mulet, Dept. of Math., California Univ., Los Angeles, CA, USA

C.K. Wong, Dept. of Math., California Univ., Los Angeles, CA, USA

Yu-Li You, DTS Technology

M. Kaveh, University of Minnesota

Kaleem Siddiqi, Yale University

Steven W. Zucker, Yale University

Allen Tannenbaum, University of Minnesota

J. Weickert, Utrecht University Hospital

K.J. Zuiderveld, Utrecht University Hospital

B.M. ter Haar Romeny, Utrecht University Hospital

W.J. Niessen, Utrecht University Hospital

Xuli Zong

Anke Meyer-Baese

Andrew Laine

Robin N. Strickland, University of Arizona

Gregory J. Lukins, University of Arizona

G.L. Foresti, University of Udine

G.G. Pieroni, University of Udine

X.-Y. Cheng, Mitani Sangyo Co.

I. Akiyama1, Mitani Sangyo Co.

K. Itoh, Mitani Sangyo Co.

Y. Wang, Mitani Sangyo Co.

N. Taniguchi, Mitani Sangyo Co.

M. Nakajima, Mitani Sangyo Co.

Tae-Eun Kim, DChung-Ang University

Sun-Ho Lee, DChung-Ang University

Seok-Hyun Ryu, DChung-Ang University

Jong-Soo Choi, DChung-Ang University

X.-Y. Cheng

I. Akiyama

K. Itoh

Y. Wang

N. Tananiguchi

M. Nakajima

S. Kollias, Electr. & Comput. Eng., Nat. Tech. Univ. of Athens, Greece

N. Doulamis, Electr. & Comput. Eng., Nat. Tech. Univ. of Athens, Greece

A. Doulamis, Electr. & Comput. Eng., Nat. Tech. Univ. of Athens, Greece

M. Hanmandlu

K.R. Murali Mohan

Vivek Gupta

A. Fuldseth, Dept. of Telecommun., Norwegian Univ. of Sci. & Technol., Trondheim, Norway

T.A. Ramstad, Dept. of Telecommun., Norwegian Univ. of Sci. & Technol., Trondheim, Norway

Shankar L. Regunathan, University of California, Santa Barbara

Kenneth Rose, University of California, Santa Barbara

A. Polzer, Rheinische Friedrich-Wilhelms-Univ., Bonn, Germany

H. Klock, Rheinische Friedrich-Wilhelms-Univ., Bonn, Germany

J.M. Buhrmann, Rheinische Friedrich-Wilhelms-Univ., Bonn, Germany

P.J.L. Van Beek, University of Rochester

A.M. Tekalp, University of Rochester

A. Puri, University of Rochester

Y. Yemez, Dept. of Electr. & Electron. Eng., Bogazici Univ., Istanbul, Turkey

B. Sankur, Dept. of Electr. & Electron. Eng., Bogazici Univ., Istanbul, Turkey

E. Anarim, Dept. of Electr. & Electron. Eng., Bogazici Univ., Istanbul, Turkey

D. M. Monro, University of Bath

Huijuan Li, University of Bath

J. A. Nicholls, University of Bath

S.S. Pradhan, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA

K. Ramchandran, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA

Gi Hun Lee, Dept. of Electronic Engineering, Sogang University

Joon Ho Song, Dept. of Electronic Engineering, Sogang University

Rae-Hong Park, Dept. of Electronic Engineering, Sogang University

F.-H. Lin, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

W. Gass, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

R.M. Mersereau, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

D.S. Rosario, U.S. Army Res. Lab., Adelphi, MD, USA

R. Meth, Center for Autom. Res., Maryland Univ., College Park, MD, USA

R. Chellappa, Center for Autom. Res., Maryland Univ., College Park, MD, USA

Q.A. Holmes, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA

X. Zhang, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA

D. Zhao, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA

A.O. Hero, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA

C. Guillouet, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA

S.M. Sowelam, Gen. Electr. Corp. Res. & Dev. Center, Niskayuna, NY, USA

A.H. Tewfik, Gen. Electr. Corp. Res. & Dev. Center, Niskayuna, NY, USA

Y. Ricquebourg, IRISA, Rennes, France

P. Bouthemy, IRISA, Rennes, France

S.N. Ngoc, Eur. Molecular Biol. Lab., Heidelberg, Germany

F. Briquet-Laugier, Eur. Molecular Biol. Lab., Heidelberg, Germany

C. Boulin, Eur. Molecular Biol. Lab., Heidelberg, Germany

J.-C. Olivo, Eur. Molecular Biol. Lab., Heidelberg, Germany

Andrew J. Kim

Hamid Krim

Alan S. Willsky

Y.-H. Gu, Dept. of Appl. Electron., Chalmers Univ. of Technol., Goteborg, Sweden

V. Gui, Dept. of Appl. Electron., Chalmers Univ. of Technol., Goteborg, Sweden

T. Tjahjadi, Dept. of Appl. Electron., Chalmers Univ. of Technol., Goteborg, Sweden

Y. Watanabe, Kanazawa Inst. of Technol., Ishikawa, Japan

K. Takahashi, Kanazawa Inst. of Technol., Ishikawa, Japan

M. Nakazawa, Kanazawa Inst. of Technol., Ishikawa, Japan

L. Li, Dept. of Radiol., Univ. of South Florida, Tampa, FL, USA

F. Mao, Dept. of Radiol., Univ. of South Florida, Tampa, FL, USA

W. Qian, Dept. of Radiol., Univ. of South Florida, Tampa, FL, USA

L.P. Clarke, Dept. of Radiol., Univ. of South Florida, Tampa, FL, USA

C.W. Hanna, Sci. Ultrasound Center, Cairo, Egypt

A.B.M. Youssef, Sci. Ultrasound Center, Cairo, Egypt

R.C. Chan, Healt Sci. & Tech., MIT, Cambridge, MA, USA

W.C. Karl, Healt Sci. & Tech., MIT, Cambridge, MA, USA

R.S. Lees, Healt Sci. & Tech., MIT, Cambridge, MA, USA

N. Tsapatsoulis, Div. of Comput. Sci., Nat. Tech. Univ. of Athens, Greece

F. Schnorrenberg, Div. of Comput. Sci., Nat. Tech. Univ. of Athens, Greece

C. Pattichis, Div. of Comput. Sci., Nat. Tech. Univ. of Athens, Greece

S. Kollias, Div. of Comput. Sci., Nat. Tech. Univ. of Athens, Greece

M.S. Brown, Sch. of Med., California Univ., Los Angeles, CA, USA

M.F. McNitt-Gray, Sch. of Med., California Univ., Los Angeles, CA, USA

J.G. Goldin, Sch. of Med., California Univ., Los Angeles, CA, USA

D.R. Aberle, Sch. of Med., California Univ., Los Angeles, CA, USA

H. Jiang, Commun. Res. Lab., Minist. of Posts & Telecommun., Koganei, Japan

W. Tiu, Commun. Res. Lab., Minist. of Posts & Telecommun., Koganei, Japan

S. Yamamoto, Commun. Res. Lab., Minist. of Posts & Telecommun., Koganei, Japan

S.-I. Iisaku, Commun. Res. Lab., Minist. of Posts & Telecommun., Koganei, Japan

C.-M. Chang, Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA

A. Laine, Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA

Y. Kawata, Fac. of Eng., Tokushima Univ., Japan

N. Niki, Fac. of Eng., Tokushima Univ., Japan

H. Ohmatsu, Fac. of Eng., Tokushima Univ., Japan

R. Kakinuma, Fac. of Eng., Tokushima Univ., Japan

K. Eguchi, Fac. of Eng., Tokushima Univ., Japan

M. Kaneko, Fac. of Eng., Tokushima Univ., Japan

N. Moriyama, Fac. of Eng., Tokushima Univ., Japan

K. Mino, Dept. of Opt. Sci., Tokushima Univ., Japan

N. Niki, Dept. of Opt. Sci., Tokushima Univ., Japan

N. Nakasato, Dept. of Opt. Sci., Tokushima Univ., Japan

T. Yoshimoto, Dept. of Opt. Sci., Tokushima Univ., Japan

J. Kim

H. Park

H. Li

K. Liu

S.-C. Lo

Y. Wang

Y.-H. Tseng

J.-N. Hwang

A. Mojsilovic, Fac. of Electr. Eng., Belgrade Univ., Serbia

S. Markovic, Fac. of Electr. Eng., Belgrade Univ., Serbia

M. Popovic, Fac. of Electr. Eng., Belgrade Univ., Serbia

M. Kubo, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan

T. Tozaki, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan

N. Niki, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan

S. Nakagawa, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan

K. Eguchi, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan

M. Kaneko, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan

H. Omatsu, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan

N. Moriyama, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan

N. Yamaguchi, Nat. Cancer Center Res. Inst., Tokushima Univ., Japan

J. Benois-Pineau, Nantes Univ., France

D. Barba, Nantes Univ., France

N. Sarris, Nantes Univ., France

M.G. Strintzis, Nantes Univ., France

J. He, Dept. of Electr. Eng., Notre Dame Univ., IN, USA

D.J. Costello, Jr., Dept. of Electr. Eng., Notre Dame Univ., IN, USA

Y.-F. Huang, Dept. of Electr. Eng., Notre Dame Univ., IN, USA

R.L. Stevenson, Dept. of Electr. Eng., Notre Dame Univ., IN, USA

W.S. Lee, Sch. of Electr. Eng., Australian Defence Force Acad., Canberra, ACT, Australia

M.R. Frater, Sch. of Electr. Eng., Australian Defence Force Acad., Canberra, ACT, Australia

M.R. Pickering, Sch. of Electr. Eng., Australian Defence Force Acad., Canberra, ACT, Australia

J.F. Arnold, Sch. of Electr. Eng., Australian Defence Force Acad., Canberra, ACT, Australia

M. Boliek, RICOH California Res. Center, Menlo Park, CA, USA

M.J. Gormish, RICOH California Res. Center, Menlo Park, CA, USA

E.L. Schwartz, RICOH California Res. Center, Menlo Park, CA, USA

A. Keith, RICOH California Res. Center, Menlo Park, CA, USA

S. Bilato, Dipt. di Elettronica e Inf., Padova Univ., Italy

G. Calvagno, Dipt. di Elettronica e Inf., Padova Univ., Italy

G.A. Mian, Dipt. di Elettronica e Inf., Padova Univ., Italy

R. Rinaldo, Dipt. di Elettronica e Inf., Padova Univ., Italy

Young Huh, Power Telecommun. Team, KERI, Kyungnam, South Korea

K. Panusopone, Power Telecommun. Team, KERI, Kyungnam, South Korea

K.R. Rao, Power Telecommun. Team, KERI, Kyungnam, South Korea

A. Andreadis

G. Benellie

A. Garzelli

S. Susini

W.S. Lee, Australian Defence Force Acad., Canberra, ACT, Australia

M.R. Frater, Australian Defence Force Acad., Canberra, ACT, Australia

M.R. Pickering, Australian Defence Force Acad., Canberra, ACT, Australia

J.F. Arnold, Australian Defence Force Acad., Canberra, ACT, Australia

L. Teixeira, INESC, Porto, Portugal

T. Andrade, INESC, Porto, Portugal

V. Teixeira, INESC, Porto, Portugal

Joon Ho Song, Dept. of Electron. Eng., Sogang Univ., Seoul, South Korea

Gi Hun Lee, Dept. of Electron. Eng., Sogang Univ., Seoul, South Korea

Rae-Hong Park, Dept. of Electron. Eng., Sogang Univ., Seoul, South Korea

M. Park

D. Miller

U.-V. Koc

K. Liu

D.B. Bradshaw, Dept. of Eng., Cambridge Univ., UK

N.G. Kingsbury, Dept. of Eng., Cambridge Univ., UK

A.C. Kokaram, Dept. of Eng., Cambridge Univ., UK

Chok-Kwan Cheung, CityU Image Process. Lab., City Univ. of Hong Kong, Hong Kong

Lai-Man Po, CityU Image Process. Lab., City Univ. of Hong Kong, Hong Kong

Jie-Bin Xu, CityU Image Process. Lab., City Univ. of Hong Kong, Hong Kong

Lai-Man Po, CityU Image Process. Lab., City Univ. of Hong Kong, Hong Kong

Chok-Kwan Cheung, CityU Image Process. Lab., City Univ. of Hong Kong, Hong Kong

Jie Wei, Sch. of Comput. Sci., Simon Fraser Univ., Burnaby, BC, Canada

Ze-Nian Li, Sch. of Comput. Sci., Simon Fraser Univ., Burnaby, BC, Canada

Dong-Il Chang, Lab. of Image Commun., Seoul Nat. Univ., South Korea

Joonhyun Sung, Lab. of Image Commun., Seoul Nat. Univ., South Korea

Choong Woong Lee, Lab. of Image Commun., Seoul Nat. Univ., South Korea

V. Devlaminck

Bo Tao, Dept. of Electr. Eng., Princeton Univ., NJ, USA

M.T. Orchard, Dept. of Electr. Eng., Princeton Univ., NJ, USA

B.W. Dickinson, Dept. of Electr. Eng., Princeton Univ., NJ, USA

E. Kim

J-K. Han

H.-M. Kim

C.D. Creusere, Naval Air Warfare Centre Weapons Div., China Lake, CA, USA

F. Mayer

A. Averbuch

R. Coifman

Jiajun Zhang, Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada

M.O. Ahmad, Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada

M.N.S. Swamy, Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada

Pohsiang Hsu, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA

K.J.R. Liu, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA

T. Chen, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA

P. Ishwar, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA

P. Moulin, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA

M. Horowitz

S. Neuhoff

J. Andrew, Canon Inf. Syst. Res., North Ryde, NSW, Australia