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  • 1997 International Conference on Image Processing (ICIP'97) - Volume 2
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1997 International Conference on Image Processing (ICIP'97) - Volume 2
Washington, DC
October 26-October 29
ISBN: 0-8186-8183-7
Table of Contents
TAO1: Emerging Techniques in Oral Rate-Distortion Based Image and Video Coding
J.R. Morros, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
F. Marques, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 1
S. Servetto, Illinois Univ., Urbana, IL, USA
K. Ramchandran, Illinois Univ., Urbana, IL, USA
K. Nahrstedt, Illinois Univ., Urbana, IL, USA
A. Ortega, Illinois Univ., Urbana, IL, USA
pp. 5
F.W. Meier, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
G.M. Schuster, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
A.K. Katsaggelos, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
pp. 9
S.L. Regunathan, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
K. Rose, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 21
TA02: Video Coding II Oral
K. Stuhlmuller, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany
B. Girod, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany
pp. 49
Liang-Jin Lin, Div. of Res. & Dev., Ulead Syst. Inc., Torrance, CA, USA
A. Ortega, Div. of Res. & Dev., Ulead Syst. Inc., Torrance, CA, USA
pp. 57
G.J. Conklin, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
S.S. Hemami, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 61
Jiangtao Wen, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
J.D. Villasenor, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 65
Chun-Ho Cheung, Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong
Lai-Man Po, Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong
pp. 69
TA03: Robust Video Oral
M. Budagavi, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
J.D. Gibson, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 89
Joon-Ho Chang, Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
Jeong-Kwon Kim, Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
Choong Woong Lee, Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
pp. 93
R. Llados-Bernaus, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
R.L. Stevenson, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 97
P. Salama, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
N. Shroff, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
E.J. Delp, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 101
Mei-Juan Chen, Inst. of Electr. Eng., Nat. Dong Hwa Univ., Hualien, Taiwan
Liang-Gee Chen, Inst. of Electr. Eng., Nat. Dong Hwa Univ., Hualien, Taiwan
Ruei-Xi Chen, Inst. of Electr. Eng., Nat. Dong Hwa Univ., Hualien, Taiwan
pp. 105
TA04: Medical Image Analysis I Oral
Sheng Liu, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
E.J. Delp, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 109
V. Solo, Dept. of Stat., Macquarie Univ., Sydney, NSW, Australia
E. Brown, Dept. of Stat., Macquarie Univ., Sydney, NSW, Australia
R. Weisskoff, Dept. of Stat., Macquarie Univ., Sydney, NSW, Australia
pp. 121
TA05: Motion Tracking/Estimation Poster
N. Paragios, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France
R. Deriche, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France
pp. 183
TA06: Image Analysis Poster
A. Massmann, AG Angewandte Inf., Bielefeld Univ., Germany
S. Posch, AG Angewandte Inf., Bielefeld Univ., Germany
G. Sagerer, AG Angewandte Inf., Bielefeld Univ., Germany
D. Schluter, AG Angewandte Inf., Bielefeld Univ., Germany
pp. 207
R.G. Lane, Dept. of Electr. & Electron. Eng., Canterbury Univ., Christchurch, New Zealand
R. Irwan, Dept. of Electr. & Electron. Eng., Canterbury Univ., Christchurch, New Zealand
pp. 242
Dong Wei, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
B.L. Evans, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
A.C. Bovik, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 246
D. Sow, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
A. Eleftheriadis, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
pp. 250
K. Aizawa, Dept. of Electr. Eng., Tokyo Univ., Japan
T. Hamamoto, Dept. of Electr. Eng., Tokyo Univ., Japan
Y. Ohtsuka, Dept. of Electr. Eng., Tokyo Univ., Japan
M. Hatori, Dept. of Electr. Eng., Tokyo Univ., Japan
M. Abe, Dept. of Electr. Eng., Tokyo Univ., Japan
pp. 258
TA07A: Lossless Image Coding Poster
F. Golchin, Sch. of Microelectron. Eng., Griffith Univ., Brisbane, Qld., Australia
K.K. Paliwal, Sch. of Microelectron. Eng., Griffith Univ., Brisbane, Qld., Australia
pp. 262
J.D. Pfefferman, Fac. de Ingenieria, Buenos Aires Univ., Argentina
H.J. Gonzalez, Fac. de Ingenieria, Buenos Aires Univ., Argentina
B. Cernuschi-Frias, Fac. de Ingenieria, Buenos Aires Univ., Argentina
pp. 270
Ho-Youl Jung, Inst. Nat. des Sci. Appliquees, Villeurbanne, France
R. Prost, Inst. Nat. des Sci. Appliquees, Villeurbanne, France
pp. 274
V.N. Ramaswamy, Center for Microelectron. Res., Univ. of South Florida, Tampa, FL, USA
K.R. Namuduri, Center for Microelectron. Res., Univ. of South Florida, Tampa, FL, USA
N. Ranganathan, Center for Microelectron. Res., Univ. of South Florida, Tampa, FL, USA
pp. 278
M.D. Reavy, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
C.G. Boncelet, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
pp. 282
S. Marusic, Sch. of Electron. Eng., La Trobe Univ., Bundoora, Vic., Australia
Guang Deng, Sch. of Electron. Eng., La Trobe Univ., Bundoora, Vic., Australia
pp. 286
TA07B: Fractal Image Coding Poster
O.C. Au, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
M.L. Liou, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
L.K. Ma, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
pp. 298
S. Asgari, Western Digital Corp., Rochester, MN, USA
T.Q. Nguyen, Western Digital Corp., Rochester, MN, USA
W.A. Sethares, Western Digital Corp., Rochester, MN, USA
pp. 302
H. Honda, Sch. of Eng., Hokkaido Univ. Sapporo, Japan
M. Haseyama, Sch. of Eng., Hokkaido Univ. Sapporo, Japan
H. Kitajima, Sch. of Eng., Hokkaido Univ. Sapporo, Japan
S. Matsumoto, Sch. of Eng., Hokkaido Univ. Sapporo, Japan
pp. 306
M. Ruhl, Inst. fur Inf., Freiburg Univ., Germany
H. Hartenstein, Inst. fur Inf., Freiburg Univ., Germany
D. Saupe, Inst. fur Inf., Freiburg Univ., Germany
pp. 310
D.M. Bethel, Sch. of Electron. & Electr. Eng., Bath Univ., UK
D.M. Monro, Sch. of Electron. & Electr. Eng., Bath Univ., UK
pp. 318
TA08: Image/Video Enhancement II Poster
M. Saeed, Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
H.R. Rabiee, Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
W.C. Karl, Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
T.Q. Nguyen, Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
pp. 322
V. Bhasharan, Hewlett-Packard Co., Palo Alto, CA, USA
K. Konstantinides, Hewlett-Packard Co., Palo Alto, CA, USA
G. Beretta, Hewlett-Packard Co., Palo Alto, CA, USA
pp. 326
B. Solaiman, Telecom Bretagne, Brest, France
R. Pyndiah, Telecom Bretagne, Brest, France
O. Aitsab, Telecom Bretagne, Brest, France
Ch. Roux, Telecom Bretagne, Brest, France
pp. 330
S.S.O. Choy, Dept. of Electron. Eng., Hong Kong Polytech., Kowloon, Hong Kong
Yuk-Hee Chan, Dept. of Electron. Eng., Hong Kong Polytech., Kowloon, Hong Kong
Wan-Chi Siu, Dept. of Electron. Eng., Hong Kong Polytech., Kowloon, Hong Kong
pp. 342
Kwok-Wai Cheung, Dept. of Electron. Eng., City Univ. of Hong Kong, Hong Kong
Lai-Man Po, Dept. of Electron. Eng., City Univ. of Hong Kong, Hong Kong
pp. 350
Jung-Jae Chao, Inst. of Maritime Technol., Ocean Univ., Taiwan, China
Chyi-Chyng Lin, Inst. of Maritime Technol., Ocean Univ., Taiwan, China
pp. 354
Juan Liu, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
P. Moulin, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 370
S.G. Chang, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
M. Vetterli, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 374
TA09: Image Features Poster
A.O. Hero, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
J. O'Neill, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
W.J. Williams, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 378
J.M. Nash, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
J.N. Carter, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
M.S. Nixon, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 386
M.M. Perez, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, U
T.J. Dennis, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, U
pp. 394
H.R. Tizhoosh, Inst. for Meas. Technol. & Electron., Magdeburg Univ. of Technol., Germany
G. Krell, Inst. for Meas. Technol. & Electron., Magdeburg Univ. of Technol., Germany
B. Michaelis, Inst. for Meas. Technol. & Electron., Magdeburg Univ. of Technol., Germany
pp. 398
F.G. Lorca, CNRS-ENSEA/UCP, Cergy Pontoise, France
L. Kessal, CNRS-ENSEA/UCP, Cergy Pontoise, France
D. Demigny, CNRS-ENSEA/UCP, Cergy Pontoise, France
pp. 406
P. Eisert, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany
B. Girod, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany
pp. 418
P. Gamba, Dipt. di Elettronica, Pavia Univ., Italy
M. Lilla, Dipt. di Elettronica, Pavia Univ., Italy
A. Mecocci, Dipt. di Elettronica, Pavia Univ., Italy
pp. 422
V.V. Anh, Centre in Stat. Sci. & Ind. Math., Queensland Univ. of Technol., Brisbane, Qld., Australia
Q. Tieng, Centre in Stat. Sci. & Ind. Math., Queensland Univ. of Technol., Brisbane, Qld., Australia
T.D. Bui, Centre in Stat. Sci. & Ind. Math., Queensland Univ. of Technol., Brisbane, Qld., Australia
G. Chen, Centre in Stat. Sci. & Ind. Math., Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 430
TA10: Image/Video Representation Poster
O. Yanez-Suarez, Dept. of Electr. Eng., Colorado State Univ., Fort Collins, CO, USA
M.R. Azimi-Sadjadi, Dept. of Electr. Eng., Colorado State Univ., Fort Collins, CO, USA
pp. 438
O. Alata, GDR-ISIS, CNRS, Talence, France
P. Baylou, GDR-ISIS, CNRS, Talence, France
M. Najim, GDR-ISIS, CNRS, Talence, France
pp. 442
The analytic image (Abstract)
J.P. Havlicek, Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK, USA
J.W. Havlicek, Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK, USA
A.C. Bovik, Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK, USA
pp. 446
P. Komprobst, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France
R. Deriche, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France
G. Aubert, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France
pp. 458
A. Teschioni, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
C.S. Regazzoni, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
E. Stringa, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 462
U.A. Al-Suwailem, Dept. of Electr. Eng., King Fahd Univ. of Pet. & Miner., Dhahran, Saudi Arabia
J. Keller, Dept. of Electr. Eng., King Fahd Univ. of Pet. & Miner., Dhahran, Saudi Arabia
pp. 466
S. Teboul, Lab. I3S, Nice Univ., Valbonne, France
L. Blanc-Feraud, Lab. I3S, Nice Univ., Valbonne, France
G. Aubert, Lab. I3S, Nice Univ., Valbonne, France
M. Barlaud, Lab. I3S, Nice Univ., Valbonne, France
pp. 470
Min-Cheol Hong, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
Moon Gi Kang, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
A.K. Katsaggelos, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
pp. 474
Xinquan Shen, Dept. of Electron. & Electr. Eng., Birmingham Univ., UK
M. Spann, Dept. of Electron. & Electr. Eng., Birmingham Univ., UK
pp. 478
TP02: Image/Video Segmentation Oral
P. de Smet, Dept. for Telecommun. & Inf. Process., Ghent Univ., Belgium
D. de Vleeschauwer, Dept. for Telecommun. & Inf. Process., Ghent Univ., Belgium
pp. 490
J. Yu, Dept. of Electr. Eng., Princeton Univ., NJ, US
G. Bozdagi, Dept. of Electr. Eng., Princeton Univ., NJ, US
S. Harrington, Dept. of Electr. Eng., Princeton Univ., NJ, US
pp. 498
B. Gunsel, Dept. of Electr. Eng., Rochester Univ., NY, USA
A. Murat Tekalp, Dept. of Electr. Eng., Rochester Univ., NY, USA
P.J.L. van Beek, Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 502
J. Kaufhold, BME Dept., Boston Univ., MA, USA
M. Schneider, BME Dept., Boston Univ., MA, USA
W.C. Karl, BME Dept., Boston Univ., MA, USA
A. Willsky, BME Dept., Boston Univ., MA, USA
pp. 506
Seung Chul Yoon, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
K. Ratakonda, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
N. Ahuja, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 510
B.K. Low, Dept. of Electron. & Electr. Eng., De Monfort Univ., Leicester, UK
M.K. Ibrahim, Dept. of Electron. & Electr. Eng., De Monfort Univ., Leicester, UK
pp. 518
A. Aydm Alatan, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
E. Tuncel, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
L. Onural, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 522
TP03: Multimedia Database Oral
E. Sahouria, Dept. of Electr. Eng., California Univ., Berkeley, CA, USA
A. Zakhor, Dept. of Electr. Eng., California Univ., Berkeley, CA, USA
pp. 526
Jenq-Neng Hwang, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
Jeongnam Youn, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
S. Deshpande, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
Ming-Ting Sun, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 530
K.J. Han, Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik, Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 538
N. Vasconcelos, Media Lab., MIT, Cambridge, MA, USA
A. Lippman, Media Lab., MIT, Cambridge, MA, USA
pp. 542
J. Nam, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A. Enis Cetin, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 550
TP04: Image Processing Oral Hardware/Paralell Algorithms
S.L. Wood, Dept. of Electr. Eng., Santa Clara Univ., CA, USA
pp. 566
D. Schmidradler, Inst. of Flexible Autom., Wien Univ. of Technol., Austria
W. Van Dyck, Inst. of Flexible Autom., Wien Univ. of Technol., Austria
K. Furst, Inst. of Flexible Autom., Wien Univ. of Technol., Austria
H. Hufnagl, Inst. of Flexible Autom., Wien Univ. of Technol., Austria
pp. 590
TP05: Subband/Wavelet Coding Poster
H. Boelcskei, INTHFT, Vienna University of Technology
T. Stranz, INTHFT, Vienna University of Technology
F. Hlawatsch, INTHFT, Vienna University of Technology
R. Sucher, INTHFT, Vienna University of Technology
pp. 594
Innho Jee, Sch. of Electron., Electr. & Comput. Eng., Hongik Univ., Chungnam, South Korea
pp. 602
V. Areekul, Dept. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
R.H. Bamberger, Dept. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 606
A.M. Murching, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
J.W. Woods, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 613
M. Iwahashi, Dept. of Electr. Eng., Nagaoka Univ. of Technol., Niigata, Japan
S. Fukuma, Dept. of Electr. Eng., Nagaoka Univ. of Technol., Niigata, Japan
A. Hosotani, Dept. of Electr. Eng., Nagaoka Univ. of Technol., Niigata, Japan
N. Kambayashi, Dept. of Electr. Eng., Nagaoka Univ. of Technol., Niigata, Japan
pp. 633
Bing-Bing Chai, University of Missouri-Columbia
Jozsef Vass, University of Missouri-Columbia
Xinhua Zhuang, University of Missouri-Columbia
pp. 637
Arild Fuldseth, Norwegian University of Science and Technology
Ilangko Balasingham, Norwegian University of Science and Technology
Tor A. Ramstad, Norwegian University of Science and Technology
pp. 649
TP06: Applications Poster
Zhong-yu Chen, Div. of Eng., Texas Univ., San Antonio, TX, USA
M. Desai, Div. of Eng., Texas Univ., San Antonio, TX, USA
Xiao-Ping Zhang, Div. of Eng., Texas Univ., San Antonio, TX, USA
pp. 653
G.R. Rajugopal, Dept. of Syst. & Comput. Eng., Carleton Univ., Ottawa, Ont., Canada
R.H.M. Hafez, Dept. of Syst. & Comput. Eng., Carleton Univ., Ottawa, Ont., Canada
pp. 657
G. Poulalion, CEA/CESTA, Le Barp, France
O. Flous, CEA/CESTA, Le Barp, France
S. Morvan, CEA/CESTA, Le Barp, France
M. Najim, CEA/CESTA, Le Barp, France
pp. 661
Mitchell D. Swanson, University of Minnesota
Bin Zhu, University of Minnesota
Ahmed H. Tewfik, University of Minnesota
pp. 676
Minerva M. Yeung, IBM T. J. Watson Research Center,
Fred Mintzer, IBM T. J. Watson Research Center,
pp. 680
T. Martin, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
J. Idier, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 684
Claudio Weidmann, Swiss Federal Institute of Technology StateZip:
Martin Vetterli, Swiss Federal Institute of Technology StateZip:
Antonio Ortega, University of Southern California
Fabio Carignano, University of Southern California
pp. 696
TP07: Image Boundary, Curves and Poster Surfaces
S. Mahmoodi, Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ., UK
B.S. Sharif, Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ., UK
E.G. Chester, Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ., UK
pp. 708
In Kyu Park, Real Time Vision Lab., Seoul Nat. Univ., South Korea
Sang Uk Lee, Real Time Vision Lab., Seoul Nat. Univ., South Korea
pp. 712
Hsi-Hsing Liu, National Chiao Tung University
Jeng-Hong Twu, National Chiao Tung University
Sheng-Jyh Wang, National Chiao Tung University
pp. 720
B. Kamgar-Parsi, Div. of Inf. Technol., Naval Res. Lab., Washington, DC, USA
B. Kamgar-Parsi, Div. of Inf. Technol., Naval Res. Lab., Washington, DC, USA
A. Rosenfeld, Div. of Inf. Technol., Naval Res. Lab., Washington, DC, USA
pp. 728
N. Eua-Anant, Dept. of Electr. Eng. & Comput. Eng., Iowa State Univ., Ames, IA, USA
L. Upda, Dept. of Electr. Eng. & Comput. Eng., Iowa State Univ., Ames, IA, USA
pp. 732
John Albert Horst, National Institute of Standards and Technology (NIST) USA
Isabel Beichl, National Institute of Standards and Technology (NIST) USA
pp. 744
Garry N. Newsam, Defence Science and Technology Organization
Nicholas J. Redding, Defence Science and Technology Organization
pp. 752
A.R. Mirhosseini, Dept. of Electr. Eng., Sydney Univ., NSW, Australia
C. Chen, Dept. of Electr. Eng., Sydney Univ., NSW, Australia
K.M. Lam, Dept. of Electr. Eng., Sydney Univ., NSW, Australia
H. Yan, Dept. of Electr. Eng., Sydney Univ., NSW, Australia
pp. 756
S. Yin, Dept. of Mech. & Ind. Eng., Toronto Univ., Ont., Canada
J.G. Balchen, Dept. of Mech. & Ind. Eng., Toronto Univ., Ont., Canada
pp. 760
X. Cufi, Inst. of Inf. & Appl., Univ. of Girona, Spain
A. Casals, Inst. of Inf. & Appl., Univ. of Girona, Spain
J. Batlle, Inst. of Inf. & Appl., Univ. of Girona, Spain
pp. 764
TP08: Video Coding III Poster
Tien-ying Kuo, University of Southern California
C.-C.Jay Kuo, University of Southern California
pp. 795
Yuen-Wen Lee, Dept. of Electr. Eng., British Columbia Univ., Vancouver, BC, Canada
F. Kossentini, Dept. of Electr. Eng., British Columbia Univ., Vancouver, BC, Canada
R. Ward, Dept. of Electr. Eng., British Columbia Univ., Vancouver, BC, Canada
pp. 803
Sheu-Chih Cheng, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Hsueh-Ming Hang, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 807
TP09A: Content Based Retrieval II Poster
Y. Rui, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
T.S. Huang, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
S. Mehrotra, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 815
R.J. Qian, Sharp Lab. of America, Camas, WA, USA
M.I. Sezan, Sharp Lab. of America, Camas, WA, USA
pp. 819
TP09B: Stochastic Image Models Poster
J. Bennett, Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
A. Khotanzad, Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
pp. 839
Keng-Pang Lim, Nanyang Technological University
Man-Nang Chong, Nanyang Technological University
Amitabha Das, Nanyang Technological University
pp. 843
B. Bhanu, Coll. of Eng., California Univ., Riverside, CA, USA
B. Tian, Coll. of Eng., California Univ., Riverside, CA, USA
pp. 847
K. Sivakumar, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
J. Goutsias, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
pp. 851
Jzau-Sheng Lin, Dept. of Electron. Eng., Nat. Chin-Yi Inst. of Technol., Taichung, Taiwan
R.M. Chen, Dept. of Electron. Eng., Nat. Chin-Yi Inst. of Technol., Taichung, Taiwan
Y.M. Huang, Dept. of Electron. Eng., Nat. Chin-Yi Inst. of Technol., Taichung, Taiwan
pp. 855
U.S. Ranjan, Dept. of Electr. Eng., Indian Inst. of Sci., Bangalore, Indi
M. Satyaranjan, Dept. of Electr. Eng., Indian Inst. of Sci., Bangalore, Indi
pp. 859
S.N. Kalitzin, Image Sci. Inst., Utrecht Univ., Netherlands
B. ter Haar Romeny, Image Sci. Inst., Utrecht Univ., Netherlands
M. Viergever, Image Sci. Inst., Utrecht Univ., Netherlands
pp. 863
Pei-hsiu Suen, University of California, Irvine
Glenn Healey, University of California, Irvine
pp. 867
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