- I
- ICIP
- 1997
- 1997 International Conference on Image Processing (ICIP'97) - Volume 1
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1997 International Conference on Image Processing (ICIP'97) - Volume 1 Washington, DC October 26-October 29 ISBN: 0-8186-8183-7 Table of Contents
 | MA01 Digital Video Innovation Oral |
Boon-Lock Yeo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.M. Yeung, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA pp. 1
Li-Cheng Tai, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
Ramesh Jain, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA pp. 9
Di Zhong, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
Shih-Fu Chang, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA pp. 21
| MA02:Wavelet/Multiresolution Oral Processing |
A.M. Murching, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
J.W. Woods, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA pp. 33
I. Hontsch, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
L.J. Karam, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
R.J. Safranek, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA pp. 41
Jin Li, Sharp Labs. of America, Camas, WA, USA pp. 45
H. Balasingham, Dept. of Telcommun., Norwegian Univ. of Sci. & Technol., Norway
A. Fuldseth, Dept. of Telcommun., Norwegian Univ. of Sci. & Technol., Norway
T.A. Ramstad, Dept. of Telcommun., Norwegian Univ. of Sci. & Technol., Norway pp. 49
T. Frajka, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
P.G. Sherwood, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
K. Zeger, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA pp. 53
Jiankun Li, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
C.-C.J. Kuo, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA pp. 57
Y. Hui, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
C.W. Kok, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
T.Q. Nguyen, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA pp. 61
Haitao Guo, Chromatic Res. Inc., Sunnyvale, CA, USA pp. 65
| MA03: Motion Estimation I Oral |
Y. Altunbasak, Broadband Inf. Syst. Labs., Hewlett-Packard Labs., Palo Alto, CA, USA
R. Oten, Broadband Inf. Syst. Labs., Hewlett-Packard Labs., Palo Alto, CA, USA pp. 69
P. Csillag, KFKI Res. Inst. for Meas. & Comput. Tech., Budapest, Hungary
L. Boroczky, KFKI Res. Inst. for Meas. & Comput. Tech., Budapest, Hungary pp. 73
P. Salembier, Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
H. Sanson, Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain pp. 77
Yan Yang, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
S.S. Hemami, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA pp. 81
Xuguang Yang, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
K. Ramchandran, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA pp. 85
C. Morimoto, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
P. Burlina, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
R. Chellappa, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA pp. 89
T.R. Reed, Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA pp. 93
F. Bartolini, Dept. of Electron. Eng., Florence Univ., Italy
L. Tucci, Dept. of Electron. Eng., Florence Univ., Italy pp. 97
M.Z. Coban, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA pp. 101
| MA04: Human Machine Interfaces Oral |
C. Kotropoulos, Dept. of Inf., Aristotelian Univ. of Thessaloniki, Greece
I. Pitas, Dept. of Inf., Aristotelian Univ. of Thessaloniki, Greece pp. 105
Lijun Yin, Dept. of Comput. Sci., Alberta Univ., Edmonton, Alta., Canada
A. Basu, Dept. of Comput. Sci., Alberta Univ., Edmonton, Alta., Canada pp. 109
C. Toklu, Dept. of Electr. Eng., Rochester Univ., NY, USA
A.M. Tekalp, Dept. of Electr. Eng., Rochester Univ., NY, USA
A.T. Erdem, Dept. of Electr. Eng., Rochester Univ., NY, USA pp. 113
V.I. Pavlovic, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
G.A. Berry, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
T.S. Huang, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA pp. 121
M. Braun, MAZ Brandenburg, Werder, Germany
M. Hahn, MAZ Brandenburg, Werder, Germany
M. Talmi, MAZ Brandenburg, Werder, Germany pp. 125
L. Wiskott, Inst. fur Neuroinf., Ruhr-Univ., Bochum, Germany
N. Kruger, Inst. fur Neuroinf., Ruhr-Univ., Bochum, Germany pp. 129
Jia-Ching Cheng, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.M.F. Moura, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA pp. 137
| MA05: Image Reconstruction Poster |
J.-I. Park, ATR Media Integration & Commun. Res. Labs., Kyoto, Japan
S. Inoue, ATR Media Integration & Commun. Res. Labs., Kyoto, Japan pp. 149
J.Q. Ni, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
K.L. Ho, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
K.W. Tse, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
J.S. Ni, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
M.H. Shen, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong pp. 157
Sifen Zhong, Stat. & Oper. Res., Princeton Univ., NJ, USA pp. 161
A. Mohammad-Djafari, Lab. des Signaux et Syst., Ecole Superieure d'Electr., Gif-sur-Yvette, France
K. Sauer, Lab. des Signaux et Syst., Ecole Superieure d'Electr., Gif-sur-Yvette, France
Y. Khagu, Lab. des Signaux et Syst., Ecole Superieure d'Electr., Gif-sur-Yvette, France
E. Cano, Lab. des Signaux et Syst., Ecole Superieure d'Electr., Gif-sur-Yvette, France pp. 165
A. Lorette, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France
H. Shekarforoush, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France
J. Zerubia, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France pp. 169
W. Chiu, Dept. of Comput. & Appl. Math., Rice Univ., Houston, TX, USA pp. 173
R.J. Holt, Bell Labs., Lucent Technol., Murray Hill, NJ, USA pp. 177
C. Miller, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
B.R. Hunt, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
M.A. Neifeld, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
M.W. Marcellin, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA pp. 181
J.A. Fessler, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA pp. 185
I.G. Kazantsev, Image Process. Group, Comput. Center, Novosibirsk, Russia pp. 189
Wenwu Zhu, Dept. of Electr. Eng., Polytech. Univ., Brooklyn, NY, USA
Yao Wang, Dept. of Electr. Eng., Polytech. Univ., Brooklyn, NY, USA
Jun Zhang, Dept. of Electr. Eng., Polytech. Univ., Brooklyn, NY, USA pp. 192
| MA06: Image Segmentation Poster |
N. Strobel, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Chung-Sheng Li, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
V. Castelli, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA pp. 196
O. Cuisenaire, Lab. of Telecommun. & Remote Sensing, Univ. Catholique de Louvain, Belgium
B. Macq, Lab. of Telecommun. & Remote Sensing, Univ. Catholique de Louvain, Belgium pp. 200
A. Utsumi, ATR Media Integration & Commun. Res. Labs., Kyoto, Japan
J. Oyha, ATR Media Integration & Commun. Res. Labs., Kyoto, Japan pp. 208
M. Makhtari, Dept. of Electr. & Comput. Eng., Laval Univ., Que., Canada
R. Bergevin, Dept. of Electr. & Comput. Eng., Laval Univ., Que., Canada pp. 212
T. Meier, Dept. of Electr. & Electron. Eng., Western Australia Univ., Nedlands, WA, Australia
K.N. Ngan, Dept. of Electr. & Electron. Eng., Western Australia Univ., Nedlands, WA, Australia
G. Crebbin, Dept. of Electr. & Electron. Eng., Western Australia Univ., Nedlands, WA, Australia pp. 216
M.D. Desai, Div. of Eng., Texas Univ., San Antonio, TX, USA pp. 224
J. Hsieh, Appl. Sci. Lab., GE Med. Syst., Milwaukee, WI, USA pp. 231
Chun-Shien Lu, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Wen-Liang Hwang, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Pau-Choo Chung, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan pp. 235
Hee Soo Yang, Real Time Vision Lab., Seoul Nat. Univ., South Korea
Sang Uk Lee, Real Time Vision Lab., Seoul Nat. Univ., South Korea pp. 239
S. Rachid, Dept. of Opt. Sci., Tokushima Univ., Japan
N. Niki, Dept. of Opt. Sci., Tokushima Univ., Japan
S. Nakamura, Dept. of Opt. Sci., Tokushima Univ., Japan
S. Mori, Dept. of Opt. Sci., Tokushima Univ., Japan pp. 243
T.C.M. Lee, Dept. of Stat., Macquarie Univ., North Ryde, NSW, Australia pp. 247
A. Betti, Dipt. di Ingegneria Elettronica, Florence Univ., Italy
M. Barni, Dipt. di Ingegneria Elettronica, Florence Univ., Italy
A. Mecocci, Dipt. di Ingegneria Elettronica, Florence Univ., Italy pp. 251
| MA07: Image/Video Enhancement Poster |
B.R. Calder, Image Analysis Res. Group, Heriot-Watt Univ., Edinburgh, UK
L.M. Linnett, Image Analysis Res. Group, Heriot-Watt Univ., Edinburgh, UK
D.R. Carmichael, Image Analysis Res. Group, Heriot-Watt Univ., Edinburgh, UK pp. 259
M. Black, Xerox Palo Alto Res. Center, CA, USA
G. Sapiro, Xerox Palo Alto Res. Center, CA, USA
D. Heeger, Xerox Palo Alto Res. Center, CA, USA pp. 263
A. Polesel, Dipt. di Elettrotecnica Elettronica ed Inf., Trieste Univ., Italy
G. Ramponi, Dipt. di Elettrotecnica Elettronica ed Inf., Trieste Univ., Italy
V.J. Mathews, Dipt. di Elettrotecnica Elettronica ed Inf., Trieste Univ., Italy pp. 267
Mungi Choi, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
Yongyi Yang, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
N.P. Galatsanos, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA pp. 271
G. Heising, Inst. fur Nachrichtentech. und Theor. Elektrotech., Tech. Univ. Berlin, Germany
K.U. Barthel, Inst. fur Nachrichtentech. und Theor. Elektrotech., Tech. Univ. Berlin, Germany
W. Johannsen, Inst. fur Nachrichtentech. und Theor. Elektrotech., Tech. Univ. Berlin, Germany
C. Steinbach, Inst. fur Nachrichtentech. und Theor. Elektrotech., Tech. Univ. Berlin, Germany pp. 275
S.J.P. Westen, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
E.L. Lagendijk, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
J. Biemond, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands pp. 279
I. Rabinovitch, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada pp. 283
R. Bernstein, Inst. for Telecommun., Erlangen-Nurnberg Univ., Germany
M. Moore, Inst. for Telecommun., Erlangen-Nurnberg Univ., Germany
S. Mitra, Inst. for Telecommun., Erlangen-Nurnberg Univ., Germany pp. 287
F. Dufaux, Media Lab., MIT, Cambridge, MA, USA pp. 291
S. Suthaharan, Sch. of Comput. & Inf. Technol., Monash Univ., Clayton, Vic., Australia
Zhongwei Zhang, Sch. of Comput. & Inf. Technol., Monash Univ., Clayton, Vic., Australia pp. 295
O. Verscheure, Telecommun. Services Group, Fed. Inst. of Technol., Lausanne, Switzerland pp. 298
O. Verscheure, Signal Process. Lab., Fed. Inst. of Technol., Lausanne, Switzerland
J. Urbain, Signal Process. Lab., Fed. Inst. of Technol., Lausanne, Switzerland
F. Tassin, Signal Process. Lab., Fed. Inst. of Technol., Lausanne, Switzerland pp. 302
G. Boccignone, Dipt. di Ingegneria dell'Inf. e Ingegneria Elettrica, Salerno Univ., Italy pp. 306
V. Barakat, Commissariat a l'Energie Atom., Bruyeres-Le-Chatel, France
B. Guilpart, Commissariat a l'Energie Atom., Bruyeres-Le-Chatel, France
R. Goutte, Commissariat a l'Energie Atom., Bruyeres-Le-Chatel, France
R. Prost, Commissariat a l'Energie Atom., Bruyeres-Le-Chatel, France pp. 310
V. Caselles, Univ. de les Illes Balears, Palma de Mallorca, Spain
J.L. Lisani, Univ. de les Illes Balears, Palma de Mallorca, Spain
J.I. Morel, Univ. de les Illes Balears, Palma de Mallorca, Spain
G. Sapiro, Univ. de les Illes Balears, Palma de Mallorca, Spain pp. 314
| MA08: Video Coding I Poster |
H.R. Rabiee, Media & Interconnect Technol. Lab., Intel Corp., Hillsboro, OR, USA
R.L. Kashyap, Media & Interconnect Technol. Lab., Intel Corp., Hillsboro, OR, USA pp. 318
D.T. Hoang, Digital Video Syst. Inc., Santa Clara, CA, USA
J.S. Vitter, Digital Video Syst. Inc., Santa Clara, CA, USA
E.L. Linzer, Digital Video Syst. Inc., Santa Clara, CA, USA pp. 322
U. Hafner, Dept. of Comput. Sci., Wurzburg Univ., Germany pp. 326
M. Mattavelli, Integrated Syst. Center, Swiss Fed. Inst. of Technol., EL-Ecublens, Switzerland
S. Brunetton, Integrated Syst. Center, Swiss Fed. Inst. of Technol., EL-Ecublens, Switzerland
D. Mlynek, Integrated Syst. Center, Swiss Fed. Inst. of Technol., EL-Ecublens, Switzerland pp. 330
A. Yeung, Dept. of Inf. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
S.C. Liew, Dept. of Inf. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong pp. 334
Bo Tao, Dept. of Electr. Eng., Princeton Univ., NJ, USA pp. 338
Chang-Su Kim, Inst. of New Media & Commun., Seoul Nat. Univ., South Korea
Rin-Chul Kim, Inst. of New Media & Commun., Seoul Nat. Univ., South Korea
Sang-Uk Lee, Inst. of New Media & Commun., Seoul Nat. Univ., South Korea pp. 342
D. Saupe, Inst. fur Inf., Freiburg Univ., Germany
B. Butz, Inst. fur Inf., Freiburg Univ., Germany pp. 357
Yuk Ying Chung, Space Centre for Satellite Navigation, Queensland Univ. of Technol., Brisbane, Qld., Australia
N.W. Bergmann, Space Centre for Satellite Navigation, Queensland Univ. of Technol., Brisbane, Qld., Australia pp. 361
D.T. Hoang, Digital Video Syst. Inc., Santa Clara, CA, USA
J.S. Vitter, Digital Video Syst. Inc., Santa Clara, CA, USA pp. 369
R. Cohen, Philips Res., Briarcliff Manor, NY, USA pp. 377
| MA09: Nonlinear/Adaptive Filter Poster |
B. Aiazzi, Res. Inst. on Electromagnet. Wave, CNR, Florence, Italy
S. Baronti, Res. Inst. on Electromagnet. Wave, CNR, Florence, Italy
L. Alparone, Res. Inst. on Electromagnet. Wave, CNR, Florence, Italy pp. 381
Min-Cheol Hong, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
T. Stathaki, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
A.K. Katsaggelos, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA pp. 385
G. Ramponi, Dipt. di Elettrotecnica Elettronica ed Inf., Trieste Univ., Italy
S. Carrato, Dipt. di Elettrotecnica Elettronica ed Inf., Trieste Univ., Italy pp. 389
I. Sonka, Dept. of Electr. Eng., Stanford Univ., CA, USA pp. 393
A. Restrepo, Dept. Ingenieria Electrica, Los Andes Univ., Merida, Venezuela
L.F. Zuluaga, Dept. Ingenieria Electrica, Los Andes Univ., Merida, Venezuela
H. Ortiz, Dept. Ingenieria Electrica, Los Andes Univ., Merida, Venezuela
V. Ojeda, Dept. Ingenieria Electrica, Los Andes Univ., Merida, Venezuela pp. 397
I. Tabus, Signal Process. Lab., Tampere Univ. of Technol., Finland
J. Rissanen, Signal Process. Lab., Tampere Univ. of Technol., Finland
J. Astola, Signal Process. Lab., Tampere Univ. of Technol., Finland pp. 401
W.K. Kreb, Naval Postgraduate Sch., Monterey, CA, USA pp. 405
O.V. Sarca, Signal Process. Lab., Tampere Univ. of Technol., Finland
I. Tabus, Signal Process. Lab., Tampere Univ. of Technol., Finland
J. Astola, Signal Process. Lab., Tampere Univ. of Technol., Finland pp. 409
Yuan Zou, Sch. of Math., New South Wales Univ., Kensington, NSW, Australia
W.T.M. Dunsmuir, Sch. of Math., New South Wales Univ., Kensington, NSW, Australia pp. 417
B. Liang, Dept. of Electr. Eng., Polytech. Univ., Brooklyn, NY, USA
S.U. Pillai, Dept. of Electr. Eng., Polytech. Univ., Brooklyn, NY, USA pp. 424
Yuan Zou, Sch. of Math., New South Wales Univ., Sydney, NSW, Australia
W.T.M. Dunsmuir, Sch. of Math., New South Wales Univ., Sydney, NSW, Australia pp. 428
M.C. Robini, CREATIS, Inst. Nat. des Sci. Appliquees, Villeurbanne, France
T. Rastello, CREATIS, Inst. Nat. des Sci. Appliquees, Villeurbanne, France
D. Vray, CREATIS, Inst. Nat. des Sci. Appliquees, Villeurbanne, France
I.E. Magnin, CREATIS, Inst. Nat. des Sci. Appliquees, Villeurbanne, France pp. 432
P. Gamba, Dipartimento di Elettronica, Pavia Univ., Italy
M. Lilla, Dipartimento di Elettronica, Pavia Univ., Italy
A. Mecocci, Dipartimento di Elettronica, Pavia Univ., Italy pp. 436
D.G. Bailey, Dept. of Phys., Massey Univ., Palmerston North, New Zealand pp. 440
| MA10A: 3D Model Based Coding Poster |
Chun-Jen Tsai, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
P. Eisert, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
B. Girod, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
A.K. Katsaggelos, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA pp. 444
S.P. Oswald, Dept. of Electr. & Comput. Eng., Illinois Univ., Champaign, IL, USA
K. Ramchandran, Dept. of Electr. & Comput. Eng., Illinois Univ., Champaign, IL, USA
T.S. Huang, Dept. of Electr. & Comput. Eng., Illinois Univ., Champaign, IL, USA pp. 448
M. Yazdi, Dept. of Electr. & Comput. Eng., Laval Univ., Que., Canada
A. Zaccarin, Dept. of Electr. & Comput. Eng., Laval Univ., Que., Canada pp. 456
D. Tzovaras, Dept. of Electr. & Comput. Eng., Aristotelian Univ. of Thessaloniki, Greece
I. Kompatsiaris, Dept. of Electr. & Comput. Eng., Aristotelian Univ. of Thessaloniki, Greece
M.G. Strintzis, Dept. of Electr. & Comput. Eng., Aristotelian Univ. of Thessaloniki, Greece pp. 460
E. Steinbach, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany
S. Chaudhuri, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany
B. Girod, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany pp. 464
J.M. Hannah, Dept. of Electr. Eng., Edinburgh Univ., UK
P.M. Grant, Dept. of Electr. Eng., Edinburgh Univ., UK pp. 468
| MA10B: Computed Tomography Poster |
H. Lee, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
S.D. Kent, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA pp. 472
N.F. Osman, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
J.L. Prince, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA pp. 476
T. Isernia, Dipt. di Ingegneria Elettronica, Univ. di Napoli Federico II, Italy
V. Pascazio, Dipt. di Ingegneria Elettronica, Univ. di Napoli Federico II, Italy
R. Pierri, Dipt. di Ingegneria Elettronica, Univ. di Napoli Federico II, Italy pp. 480
Jiang Hsieh, Appl. Sci. Lab., G.E. Med. Syst., Milwaukee, WI, USA pp. 484
C. Biswas, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
H. Na, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA pp. 488
I. Dauty, Centre d'etudes de Vaujours, Courtry, France
R. Azencott, Centre d'etudes de Vaujours, Courtry, France pp. 492
| MP01: Shape Coding Oral |
T. Ida, Res. & Dev. Center, Toshiba Corp., Japan pp. 504
Shi Hwa Lee, Signal Process. Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea
Dae-Sung Cho, Signal Process. Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea
Yu-Shin Cho, Signal Process. Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea
Sehoon Son, Signal Process. Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea
E.S. Jang, Signal Process. Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea
Jae-Seob Shin, Signal Process. Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea
Yang Seok Seo, Signal Process. Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea pp. 508
F. Bossen, Signal Process. Lab., Fed. Inst. of Technol., Lausanne, Switzerland
T. Ebrahimi, Signal Process. Lab., Fed. Inst. of Technol., Lausanne, Switzerland pp. 512
F.H.P. Spaan, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
R.L. Lagendijk, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
J. Biermond, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands pp. 516
| MP02: Water Marking Oral |
A. Piva, Dipt. di Ingegneria Elettronica, Univ. di Firenze, Italy
M. Barni, Dipt. di Ingegneria Elettronica, Univ. di Firenze, Italy
F. Bartolini, Dipt. di Ingegneria Elettronica, Univ. di Firenze, Italy
V. Cappellini, Dipt. di Ingegneria Elettronica, Univ. di Firenze, Italy pp. 520
G.W. Braudaway, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, US pp. 524
F. Hartung, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany
B. Girod, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany pp. 528
D.J. Fleet, Dept. of Comput. Sci., Queen's Univ., Kingston, Ont., Canada
D.J. Heeger, Dept. of Comput. Sci., Queen's Univ., Kingston, Ont., Canada pp. 532
S. Craver, Northern Illinois Univ., DeKalb, IL, USA
N. Memon, Northern Illinois Univ., DeKalb, IL, USA
M.M. Yeung, Northern Illinois Univ., DeKalb, IL, USA pp. 540
Xiang-Gen Xia, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
C.G. Boncelet, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
G.R. Arce, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA pp. 548
| MP03: Content Based Retrieval I Oral |
H. Samet, COPPE, Univ. Fed. do Rio de Janeiro, Brazil pp. 556
S. Berretti, Dipt. di Sistemi e Inf., Univ. di Firenze, Italy
A. Del Bimbo, Dipt. di Sistemi e Inf., Univ. di Firenze, Italy
P. Pala, Dipt. di Sistemi e Inf., Univ. di Firenze, Italy pp. 560
S. Santini, Visual Comput. Lab., California Univ., San Diego, La Jolla, CA, USA
R. Jain, Visual Comput. Lab., California Univ., San Diego, La Jolla, CA, USA pp. 564
W.Y. Ma, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
B.S. Manjunath, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA pp. 568
Kai-Chieh Liang, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
C.-C.J. Kuo, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA pp. 572
Chung-Sheng Li, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
V. Castelli, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA pp. 576
| MP04: Image Coding I Oral |
J.W. Owens, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
M.W. Marcellin, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
B.R. Hunt, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
M. Kleine, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA pp. 592
G. Davis, Math., Comput. Sci. Depts., Dartmouth Coll., Hanover, NH, USA
S. Chawla, Math., Comput. Sci. Depts., Dartmouth Coll., Hanover, NH, USA pp. 600
S.G. Chang, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
B. Yu, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
M. Vetterli, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA pp. 604
F. Amato, Dipt. di Ingegneria Elettronica, Univ. Federico II di Napoli, Italy
C. Galdi, Dipt. di Ingegneria Elettronica, Univ. Federico II di Napoli, Italy
G. Poggi, Dipt. di Ingegneria Elettronica, Univ. Federico II di Napoli, Italy pp. 612
M. Effros, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA pp. 616
| MP05: Wavelets Poster |
L.L. Winger, Electr. & Comput. Eng., Toronto Univ., Ont., Canada pp. 620
B.S. Krongold, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
K. Ramchandran, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
D.J. Jones, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA pp. 628
N. Strobel, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
S.K. Mitra, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
B.S. Manjunath, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA pp. 925
M.A.M. Rodrigues, Centro de Pesquisas de Energia Electr., CEPEL, Rio de Janeiro, Brazil
E.A.B. da Silva, Centro de Pesquisas de Energia Electr., CEPEL, Rio de Janeiro, Brazil
P.S.R. Diniz, Centro de Pesquisas de Energia Electr., CEPEL, Rio de Janeiro, Brazil pp. 636
Yue Wang, Med. Center, Georgetown Univ., Washington, DC, USA
Huao Li, Med. Center, Georgetown Univ., Washington, DC, USA
Jianhua Xuan, Med. Center, Georgetown Univ., Washington, DC, USA
S.-C.B. Lo, Med. Center, Georgetown Univ., Washington, DC, USA
S.K. Mun, Med. Center, Georgetown Univ., Washington, DC, USA pp. 644
HyungJun Kim, Coll. of Eng., California Univ., Riverside, CA, USA pp. 648
N. Polyak, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
W.A. Pearlman, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA pp. 660
W. Philips, Dept. of Electron. & Inf. Syst., Ghent Univ., Belgium
K. Denecker, Dept. of Electron. & Inf. Syst., Ghent Univ., Belgium pp. 667
| MP06: Imaging Algorithms Poster |
P.C. Teo, Dept. of Comput. Sci., Stanford Univ., CA, USA
G. Sapiro, Dept. of Comput. Sci., Stanford Univ., CA, USA
B.A. Wandell, Dept. of Comput. Sci., Stanford Univ., CA, USA pp. 675
T.J. Schulz, Dept. of Electr. Eng., Michigan Technol. Univ., Houghton, MI, USA pp. 679
P. Rockett, Chung-Chen Inst. of Technol., Tao-Yuan, Taiwan pp. 687
J.M.N. Vieira, Dept. de Electron. e Telecoms, Aveiro Univ., Portugal pp. 691
L. Lucchese, Dept. of Electron. & Inf., Padova Univ., Italy pp. 699
T.L. Marzetta, Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA
L.A. Shepp, Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA pp. 703
S. Kamata, Graduate Sch. of Inf. Sci., Kyushu Univ., Fukuoka, Japan
Y. Bandoh, Graduate Sch. of Inf. Sci., Kyushu Univ., Fukuoka, Japan pp. 707
| MP07: Video Signal Processing Poster |
D. Barba, IRESTE-SEI-IVC, Nantes, France pp. 719
P.E. Eren, Dept. of Electr. Eng., Rochester Univ., NY, USA
C. Toklu, Dept. of Electr. Eng., Rochester Univ., NY, USA
A.M. Tekalp, Dept. of Electr. Eng., Rochester Univ., NY, USA pp. 723
K. Kawaguchi, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
S.K. Mitra, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA pp. 727
P.A.A. Assuncao, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
I. Ghanbari, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK pp. 739
J.W. Woods, Center for Image Process. Res., Troy, NY, USA pp. 747
J. Hall, Comput. Film Co. Inc., Los Angeles, CA, USA
G.A. Jones, Comput. Film Co. Inc., Los Angeles, CA, USA pp. 751
Sang Hwa Lee, Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
Nam Su Moon, Sch. of Electr. Eng., Seoul Nat. Univ., South Korea pp. 755
A. Vetro, Adv. Technol. Lab., Mitsubishi Electr. ITA, Japan
H. Sun, Adv. Technol. Lab., Mitsubishi Electr. ITA, Japan
J. Bao, Adv. Technol. Lab., Mitsubishi Electr. ITA, Japan
T. Poon, Adv. Technol. Lab., Mitsubishi Electr. ITA, Japan pp. 763
K. Jinzenji, NTT Human Interface Labs., Kanagawa, Japan
H. Kotera, NTT Human Interface Labs., Kanagawa, Japan pp. 767
| MP08A: Display and Printing Poster |
D.J. Lieberman, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
J.P. Allebach, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA pp. 775
Byonghyo Shim, Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
Wonyong Sung, Sch. of Electr. Eng., Seoul Nat. Univ., South Korea pp. 779
N.T. Thao, Dept. of EEE, Hong Kong Univ. of Sci. & Technol., Kowloon, Hong Kong pp. 783
D.F. Dunn, Dept. of Comput. Sci., Wyoming Univ., Laramie, WY, USA
N.E. Mathew, Dept. of Comput. Sci., Wyoming Univ., Laramie, WY, USA pp. 787
C.B. Atkins, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
J.P. Allebach, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
C.A. Bouman, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA pp. 791
A. Makur, Dept. of Electr. Commun. Eng., Indian Inst. of Sci., Bangalore, India
A. Kumar, Dept. of Electr. Commun. Eng., Indian Inst. of Sci., Bangalore, India pp. 795
T.D. Kite, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
B.L. Evans, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
A.C. Bovik, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
T.L. Sculley, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA pp. 799
J. Shu, EPSON Palo Alto Lab., Palo Alto, CA, USA
J. Li, EPSON Palo Alto Lab., Palo Alto, CA, USA pp. 803
| MP08B: Color Images Poster |
B. Thai, Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
G. Healey, Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA pp. 807
Qiang Lu, Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
R.W. Conners, Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
D.E. Kline, Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
P. Araman, Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA pp. 822
P.R. Bakic, Dept. of Electron. Eng. & Comput. Sci., Lehigh Univ., Bethlehem, PA, USA
D.P. Brzakovic, Dept. of Electron. Eng. & Comput. Sci., Lehigh Univ., Bethlehem, PA, USA pp. 826
E. Rendon, ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
L. Salgado, ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
J.M. Menendez, ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
N. Garcia, ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain pp. 830
H. Tao, Beckman Inst., Illinois Univ., Urbana, IL, USA
T.S. Huang, Beckman Inst., Illinois Univ., Urbana, IL, USA pp. 834
| MP09A: Radar Poster |
P.C. Smits, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy pp. 837
M. Cetin, Dept. of Electr. & Comput. Eng., Boston Univ., MA, USA
W.C. Karl, Dept. of Electr. & Comput. Eng., Boston Univ., MA, USA pp. 845
V. Pascazio, I.T.T.O.E.M., Ist. Univ. Navale, Napoli, Italy
G. Schirinzi, I.T.T.O.E.M., Ist. Univ. Navale, Napoli, Italy pp. 849
Bing Ma, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
S. Lakshmanan, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
A.O. Hero, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA pp. 857
N.E. Doren, Sandia Nat. Labs., Albuquerque, NM, USA
D.E. Wahl, Sandia Nat. Labs., Albuquerque, NM, USA pp. 861
J.J. Green, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
B.R. Hunt, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA pp. 865
| MP09B: Automatic Target Recognition Poster |
D. Kottke, Sanders Associates Inc., Nashua, NH, USA
P.D. Fiore, Sanders Associates Inc., Nashua, NH, USA pp. 869
V. Murino, Dept. of Math. & Comput. Sci., Udine Univ., Italy
G.L. Foresti, Dept. of Math. & Comput. Sci., Udine Univ., Italy
A. Trucco, Dept. of Math. & Comput. Sci., Udine Univ., Italy pp. 873
J. Matas, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
L.M. Soh, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
J. Kittler, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK pp. 877
S. Der, State Univ. of New York, Amherst, NY, USA pp. 881
S. Procter, Sch. of Electron. Eng., Inf. Technol. & Math., Surrey Univ., Guildford, UK
J. Illingworth, Sch. of Electron. Eng., Inf. Technol. & Math., Surrey Univ., Guildford, UK pp. 889
P.M. Jorge, Inst. Superior Tecnico, Lisbon, Portugal pp. 893
| MP10: Image Interpolation Poster |
W. Knox Carey, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
D.B. Chuang, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
S.S. Hemami, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA pp. 901
C. Herley, Hewlett-Packard Co., Palo Alto, CA, USA pp. 905
G. Wolberg, Dept. of Comput. Sci., City Coll. of New York, NY, USA pp. 909
D.M. Monro, Sch. of Electron. & Electr. Eng., Bath Univ., UK pp. 913
T.J. Connolly, Dept. of Electr. & Electron. Eng., Canterbury Univ., Christchurch, New Zealand
R.G. Lane, Dept. of Electr. & Electron. Eng., Canterbury Univ., Christchurch, New Zealand pp. 917 Usage of this product signifies your acceptance of the Terms of Use.
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