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  • 1997 International Conference on Image Processing (ICIP'97) - Volume 1
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1997 International Conference on Image Processing (ICIP'97) - Volume 1
Washington, DC
October 26-October 29
ISBN: 0-8186-8183-7
Table of Contents
MA01 Digital Video Innovation Oral
Boon-Lock Yeo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.M. Yeung, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 1
Li-Cheng Tai, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
Ramesh Jain, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 9
HongJiang Zhang, Hewlett-Packard Co., Palo Alto, CA, USA
J.Y.A. Wang, Hewlett-Packard Co., Palo Alto, CA, USA
Y. Altunbasak, Hewlett-Packard Co., Palo Alto, CA, USA
pp. 13
Di Zhong, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
Shih-Fu Chang, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
pp. 21
MA02:Wavelet/Multiresolution Oral Processing
A.M. Murching, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
J.W. Woods, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 33
I. Hontsch, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
L.J. Karam, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
R.J. Safranek, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 41
Jin Li, Sharp Labs. of America, Camas, WA, USA
C.-C.J. Kuo, Sharp Labs. of America, Camas, WA, USA
pp. 45
H. Balasingham, Dept. of Telcommun., Norwegian Univ. of Sci. & Technol., Norway
A. Fuldseth, Dept. of Telcommun., Norwegian Univ. of Sci. & Technol., Norway
T.A. Ramstad, Dept. of Telcommun., Norwegian Univ. of Sci. & Technol., Norway
pp. 49
T. Frajka, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
P.G. Sherwood, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
K. Zeger, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 53
Jiankun Li, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
C.-C.J. Kuo, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 57
Y. Hui, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
C.W. Kok, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
T.Q. Nguyen, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 61
MA03: Motion Estimation I Oral
Y. Altunbasak, Broadband Inf. Syst. Labs., Hewlett-Packard Labs., Palo Alto, CA, USA
R. Oten, Broadband Inf. Syst. Labs., Hewlett-Packard Labs., Palo Alto, CA, USA
R.J.P. de Figueiredo, Broadband Inf. Syst. Labs., Hewlett-Packard Labs., Palo Alto, CA, USA
pp. 69
P. Csillag, KFKI Res. Inst. for Meas. & Comput. Tech., Budapest, Hungary
L. Boroczky, KFKI Res. Inst. for Meas. & Comput. Tech., Budapest, Hungary
pp. 73
P. Salembier, Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
H. Sanson, Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 77
Yan Yang, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
S.S. Hemami, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 81
Xuguang Yang, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
K. Ramchandran, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 85
C. Morimoto, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
P. Burlina, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
R. Chellappa, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 89
F. Bartolini, Dept. of Electron. Eng., Florence Univ., Italy
V. Cappellini, Dept. of Electron. Eng., Florence Univ., Italy
L. Tucci, Dept. of Electron. Eng., Florence Univ., Italy
pp. 97
M.Z. Coban, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 101
MA04: Human Machine Interfaces Oral
C. Kotropoulos, Dept. of Inf., Aristotelian Univ. of Thessaloniki, Greece
I. Pitas, Dept. of Inf., Aristotelian Univ. of Thessaloniki, Greece
pp. 105
Lijun Yin, Dept. of Comput. Sci., Alberta Univ., Edmonton, Alta., Canada
A. Basu, Dept. of Comput. Sci., Alberta Univ., Edmonton, Alta., Canada
pp. 109
C. Toklu, Dept. of Electr. Eng., Rochester Univ., NY, USA
A.M. Tekalp, Dept. of Electr. Eng., Rochester Univ., NY, USA
A.T. Erdem, Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 113
V.I. Pavlovic, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
G.A. Berry, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
T.S. Huang, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 121
M. Braun, MAZ Brandenburg, Werder, Germany
M. Hahn, MAZ Brandenburg, Werder, Germany
J.-R. Ohm, MAZ Brandenburg, Werder, Germany
M. Talmi, MAZ Brandenburg, Werder, Germany
pp. 125
L. Wiskott, Inst. fur Neuroinf., Ruhr-Univ., Bochum, Germany
J.-M. Fellous, Inst. fur Neuroinf., Ruhr-Univ., Bochum, Germany
N. Kruger, Inst. fur Neuroinf., Ruhr-Univ., Bochum, Germany
C. von der Malsburg, Inst. fur Neuroinf., Ruhr-Univ., Bochum, Germany
pp. 129
Jia-Ching Cheng, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.M.F. Moura, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 137
MA05: Image Reconstruction Poster
J.-I. Park, ATR Media Integration & Commun. Res. Labs., Kyoto, Japan
S. Inoue, ATR Media Integration & Commun. Res. Labs., Kyoto, Japan
pp. 149
J.Q. Ni, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
K.L. Ho, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
K.W. Tse, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
J.S. Ni, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
M.H. Shen, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
pp. 157
A. Mohammad-Djafari, Lab. des Signaux et Syst., Ecole Superieure d'Electr., Gif-sur-Yvette, France
K. Sauer, Lab. des Signaux et Syst., Ecole Superieure d'Electr., Gif-sur-Yvette, France
Y. Khagu, Lab. des Signaux et Syst., Ecole Superieure d'Electr., Gif-sur-Yvette, France
E. Cano, Lab. des Signaux et Syst., Ecole Superieure d'Electr., Gif-sur-Yvette, France
pp. 165
A. Lorette, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France
H. Shekarforoush, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France
J. Zerubia, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France
pp. 169
P. Thuman-Commike, Dept. of Comput. & Appl. Math., Rice Univ., Houston, TX, USA
W. Chiu, Dept. of Comput. & Appl. Math., Rice Univ., Houston, TX, USA
pp. 173
A.M. Bruckstein, Bell Labs., Lucent Technol., Murray Hill, NJ, USA
R.J. Holt, Bell Labs., Lucent Technol., Murray Hill, NJ, USA
A.N. Netravali, Bell Labs., Lucent Technol., Murray Hill, NJ, USA
pp. 177
C. Miller, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
B.R. Hunt, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
M.A. Neifeld, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
M.W. Marcellin, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 181
J.A. Fessler, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 185
I.G. Kazantsev, Image Process. Group, Comput. Center, Novosibirsk, Russia
pp. 189
Wenwu Zhu, Dept. of Electr. Eng., Polytech. Univ., Brooklyn, NY, USA
Yao Wang, Dept. of Electr. Eng., Polytech. Univ., Brooklyn, NY, USA
N.P. Galatsanos, Dept. of Electr. Eng., Polytech. Univ., Brooklyn, NY, USA
Jun Zhang, Dept. of Electr. Eng., Polytech. Univ., Brooklyn, NY, USA
pp. 192
MA06: Image Segmentation Poster
N. Strobel, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Chung-Sheng Li, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
V. Castelli, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 196
O. Cuisenaire, Lab. of Telecommun. & Remote Sensing, Univ. Catholique de Louvain, Belgium
B. Macq, Lab. of Telecommun. & Remote Sensing, Univ. Catholique de Louvain, Belgium
pp. 200
A. Utsumi, ATR Media Integration & Commun. Res. Labs., Kyoto, Japan
J. Oyha, ATR Media Integration & Commun. Res. Labs., Kyoto, Japan
pp. 208
M. Makhtari, Dept. of Electr. & Comput. Eng., Laval Univ., Que., Canada
R. Bergevin, Dept. of Electr. & Comput. Eng., Laval Univ., Que., Canada
pp. 212
T. Meier, Dept. of Electr. & Electron. Eng., Western Australia Univ., Nedlands, WA, Australia
K.N. Ngan, Dept. of Electr. & Electron. Eng., Western Australia Univ., Nedlands, WA, Australia
G. Crebbin, Dept. of Electr. & Electron. Eng., Western Australia Univ., Nedlands, WA, Australia
pp. 216
Xiao-Ping Zhang, Div. of Eng., Texas Univ., San Antonio, TX, USA
M.D. Desai, Div. of Eng., Texas Univ., San Antonio, TX, USA
pp. 224
Chun-Shien Lu, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Wen-Liang Hwang, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Pau-Choo Chung, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 235
Hee Soo Yang, Real Time Vision Lab., Seoul Nat. Univ., South Korea
Sang Uk Lee, Real Time Vision Lab., Seoul Nat. Univ., South Korea
pp. 239
S. Rachid, Dept. of Opt. Sci., Tokushima Univ., Japan
N. Niki, Dept. of Opt. Sci., Tokushima Univ., Japan
H. Nishitani, Dept. of Opt. Sci., Tokushima Univ., Japan
S. Nakamura, Dept. of Opt. Sci., Tokushima Univ., Japan
S. Mori, Dept. of Opt. Sci., Tokushima Univ., Japan
pp. 243
T.C.M. Lee, Dept. of Stat., Macquarie Univ., North Ryde, NSW, Australia
pp. 247
A. Betti, Dipt. di Ingegneria Elettronica, Florence Univ., Italy
M. Barni, Dipt. di Ingegneria Elettronica, Florence Univ., Italy
A. Mecocci, Dipt. di Ingegneria Elettronica, Florence Univ., Italy
pp. 251
Z.B. Sbeh, CEREMADE, Univ. Paris 9, France
L.D. Cohen, CEREMADE, Univ. Paris 9, France
G. Mimoun, CEREMADE, Univ. Paris 9, France
G. Coscas, CEREMADE, Univ. Paris 9, France
G. Soubrane, CEREMADE, Univ. Paris 9, France
pp. 255
MA07: Image/Video Enhancement Poster
B.R. Calder, Image Analysis Res. Group, Heriot-Watt Univ., Edinburgh, UK
L.M. Linnett, Image Analysis Res. Group, Heriot-Watt Univ., Edinburgh, UK
D.R. Carmichael, Image Analysis Res. Group, Heriot-Watt Univ., Edinburgh, UK
pp. 259
M. Black, Xerox Palo Alto Res. Center, CA, USA
G. Sapiro, Xerox Palo Alto Res. Center, CA, USA
D. Marimont, Xerox Palo Alto Res. Center, CA, USA
D. Heeger, Xerox Palo Alto Res. Center, CA, USA
pp. 263
A. Polesel, Dipt. di Elettrotecnica Elettronica ed Inf., Trieste Univ., Italy
G. Ramponi, Dipt. di Elettrotecnica Elettronica ed Inf., Trieste Univ., Italy
V.J. Mathews, Dipt. di Elettrotecnica Elettronica ed Inf., Trieste Univ., Italy
pp. 267
Mungi Choi, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
Yongyi Yang, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
N.P. Galatsanos, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 271
G. Heising, Inst. fur Nachrichtentech. und Theor. Elektrotech., Tech. Univ. Berlin, Germany
K.U. Barthel, Inst. fur Nachrichtentech. und Theor. Elektrotech., Tech. Univ. Berlin, Germany
W. Johannsen, Inst. fur Nachrichtentech. und Theor. Elektrotech., Tech. Univ. Berlin, Germany
C. Steinbach, Inst. fur Nachrichtentech. und Theor. Elektrotech., Tech. Univ. Berlin, Germany
pp. 275
S.J.P. Westen, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
E.L. Lagendijk, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
J. Biemond, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 279
I. Rabinovitch, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
A.N. Venetsanopoulos, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
pp. 283
R. Bernstein, Inst. for Telecommun., Erlangen-Nurnberg Univ., Germany
M. Moore, Inst. for Telecommun., Erlangen-Nurnberg Univ., Germany
S. Mitra, Inst. for Telecommun., Erlangen-Nurnberg Univ., Germany
pp. 287
N. Vasconcelos, Media Lab., MIT, Cambridge, MA, USA
F. Dufaux, Media Lab., MIT, Cambridge, MA, USA
pp. 291
S. Suthaharan, Sch. of Comput. & Inf. Technol., Monash Univ., Clayton, Vic., Australia
Zhongwei Zhang, Sch. of Comput. & Inf. Technol., Monash Univ., Clayton, Vic., Australia
pp. 295
O. Verscheure, Telecommun. Services Group, Fed. Inst. of Technol., Lausanne, Switzerland
C.J. van den Branden Lambrecht, Telecommun. Services Group, Fed. Inst. of Technol., Lausanne, Switzerland
pp. 298
C.J. van den Branden Lambrecht, Signal Process. Lab., Fed. Inst. of Technol., Lausanne, Switzerland
O. Verscheure, Signal Process. Lab., Fed. Inst. of Technol., Lausanne, Switzerland
J. Urbain, Signal Process. Lab., Fed. Inst. of Technol., Lausanne, Switzerland
F. Tassin, Signal Process. Lab., Fed. Inst. of Technol., Lausanne, Switzerland
pp. 302
G. Boccignone, Dipt. di Ingegneria dell'Inf. e Ingegneria Elettrica, Salerno Univ., Italy
pp. 306
V. Barakat, Commissariat a l'Energie Atom., Bruyeres-Le-Chatel, France
B. Guilpart, Commissariat a l'Energie Atom., Bruyeres-Le-Chatel, France
R. Goutte, Commissariat a l'Energie Atom., Bruyeres-Le-Chatel, France
R. Prost, Commissariat a l'Energie Atom., Bruyeres-Le-Chatel, France
pp. 310
V. Caselles, Univ. de les Illes Balears, Palma de Mallorca, Spain
J.L. Lisani, Univ. de les Illes Balears, Palma de Mallorca, Spain
J.I. Morel, Univ. de les Illes Balears, Palma de Mallorca, Spain
G. Sapiro, Univ. de les Illes Balears, Palma de Mallorca, Spain
pp. 314
MA08: Video Coding I Poster
H.R. Rabiee, Media & Interconnect Technol. Lab., Intel Corp., Hillsboro, OR, USA
R.L. Kashyap, Media & Interconnect Technol. Lab., Intel Corp., Hillsboro, OR, USA
pp. 318
D.T. Hoang, Digital Video Syst. Inc., Santa Clara, CA, USA
J.S. Vitter, Digital Video Syst. Inc., Santa Clara, CA, USA
E.L. Linzer, Digital Video Syst. Inc., Santa Clara, CA, USA
pp. 322
M. Mattavelli, Integrated Syst. Center, Swiss Fed. Inst. of Technol., EL-Ecublens, Switzerland
S. Brunetton, Integrated Syst. Center, Swiss Fed. Inst. of Technol., EL-Ecublens, Switzerland
D. Mlynek, Integrated Syst. Center, Swiss Fed. Inst. of Technol., EL-Ecublens, Switzerland
pp. 330
A. Yeung, Dept. of Inf. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
S.C. Liew, Dept. of Inf. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
pp. 334
Bo Tao, Dept. of Electr. Eng., Princeton Univ., NJ, USA
H.A. Peterson, Dept. of Electr. Eng., Princeton Univ., NJ, USA
B.W. Dickinson, Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 338
Chang-Su Kim, Inst. of New Media & Commun., Seoul Nat. Univ., South Korea
Rin-Chul Kim, Inst. of New Media & Commun., Seoul Nat. Univ., South Korea
Sang-Uk Lee, Inst. of New Media & Commun., Seoul Nat. Univ., South Korea
pp. 342
D. Saupe, Inst. fur Inf., Freiburg Univ., Germany
B. Butz, Inst. fur Inf., Freiburg Univ., Germany
pp. 357
Yuk Ying Chung, Space Centre for Satellite Navigation, Queensland Univ. of Technol., Brisbane, Qld., Australia
N.W. Bergmann, Space Centre for Satellite Navigation, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 361
D.T. Hoang, Digital Video Syst. Inc., Santa Clara, CA, USA
J.S. Vitter, Digital Video Syst. Inc., Santa Clara, CA, USA
pp. 369
Wei-Ge Chen, Microsoft Corp., Redmond, WA, USA
Chuang Gu, Microsoft Corp., Redmond, WA, USA
Ming-Chieh Lee, Microsoft Corp., Redmond, WA, USA
pp. 373
M. Balakrishnan, Philips Res., Briarcliff Manor, NY, USA
R. Cohen, Philips Res., Briarcliff Manor, NY, USA
pp. 377
MA09: Nonlinear/Adaptive Filter Poster
B. Aiazzi, Res. Inst. on Electromagnet. Wave, CNR, Florence, Italy
S. Baronti, Res. Inst. on Electromagnet. Wave, CNR, Florence, Italy
L. Alparone, Res. Inst. on Electromagnet. Wave, CNR, Florence, Italy
pp. 381
Min-Cheol Hong, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
T. Stathaki, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
A.K. Katsaggelos, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
pp. 385
G. Ramponi, Dipt. di Elettrotecnica Elettronica ed Inf., Trieste Univ., Italy
S. Carrato, Dipt. di Elettrotecnica Elettronica ed Inf., Trieste Univ., Italy
pp. 389
Chaohuang Zeng, Dept. of Electr. Eng., Stanford Univ., CA, USA
I. Sonka, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 393
A. Restrepo, Dept. Ingenieria Electrica, Los Andes Univ., Merida, Venezuela
L.F. Zuluaga, Dept. Ingenieria Electrica, Los Andes Univ., Merida, Venezuela
H. Ortiz, Dept. Ingenieria Electrica, Los Andes Univ., Merida, Venezuela
V. Ojeda, Dept. Ingenieria Electrica, Los Andes Univ., Merida, Venezuela
pp. 397
I. Tabus, Signal Process. Lab., Tampere Univ. of Technol., Finland
J. Rissanen, Signal Process. Lab., Tampere Univ. of Technol., Finland
J. Astola, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 401
C.W. Therrien, Naval Postgraduate Sch., Monterey, CA, USA
J.W. Scrofani, Naval Postgraduate Sch., Monterey, CA, USA
W.K. Kreb, Naval Postgraduate Sch., Monterey, CA, USA
pp. 405
O.V. Sarca, Signal Process. Lab., Tampere Univ. of Technol., Finland
I. Tabus, Signal Process. Lab., Tampere Univ. of Technol., Finland
J. Astola, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 409
Yuan Zou, Sch. of Math., New South Wales Univ., Kensington, NSW, Australia
W.T.M. Dunsmuir, Sch. of Math., New South Wales Univ., Kensington, NSW, Australia
pp. 417
B. Liang, Dept. of Electr. Eng., Polytech. Univ., Brooklyn, NY, USA
S.U. Pillai, Dept. of Electr. Eng., Polytech. Univ., Brooklyn, NY, USA
pp. 424
Yuan Zou, Sch. of Math., New South Wales Univ., Sydney, NSW, Australia
W.T.M. Dunsmuir, Sch. of Math., New South Wales Univ., Sydney, NSW, Australia
pp. 428
M.C. Robini, CREATIS, Inst. Nat. des Sci. Appliquees, Villeurbanne, France
T. Rastello, CREATIS, Inst. Nat. des Sci. Appliquees, Villeurbanne, France
D. Vray, CREATIS, Inst. Nat. des Sci. Appliquees, Villeurbanne, France
I.E. Magnin, CREATIS, Inst. Nat. des Sci. Appliquees, Villeurbanne, France
pp. 432
P. Gamba, Dipartimento di Elettronica, Pavia Univ., Italy
M. Lilla, Dipartimento di Elettronica, Pavia Univ., Italy
A. Mecocci, Dipartimento di Elettronica, Pavia Univ., Italy
pp. 436
MA10A: 3D Model Based Coding Poster
Chun-Jen Tsai, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
P. Eisert, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
B. Girod, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
A.K. Katsaggelos, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
pp. 444
S.P. Oswald, Dept. of Electr. & Comput. Eng., Illinois Univ., Champaign, IL, USA
K. Ramchandran, Dept. of Electr. & Comput. Eng., Illinois Univ., Champaign, IL, USA
T.S. Huang, Dept. of Electr. & Comput. Eng., Illinois Univ., Champaign, IL, USA
pp. 448
M. Yazdi, Dept. of Electr. & Comput. Eng., Laval Univ., Que., Canada
A. Zaccarin, Dept. of Electr. & Comput. Eng., Laval Univ., Que., Canada
pp. 456
D. Tzovaras, Dept. of Electr. & Comput. Eng., Aristotelian Univ. of Thessaloniki, Greece
I. Kompatsiaris, Dept. of Electr. & Comput. Eng., Aristotelian Univ. of Thessaloniki, Greece
M.G. Strintzis, Dept. of Electr. & Comput. Eng., Aristotelian Univ. of Thessaloniki, Greece
pp. 460
E. Steinbach, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany
S. Chaudhuri, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany
B. Girod, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany
pp. 464
P.M. Antoszczyszyn, Dept. of Electr. Eng., Edinburgh Univ., UK
J.M. Hannah, Dept. of Electr. Eng., Edinburgh Univ., UK
P.M. Grant, Dept. of Electr. Eng., Edinburgh Univ., UK
pp. 468
MA10B: Computed Tomography Poster
H. Lee, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
S.D. Kent, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 472
N.F. Osman, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
J.L. Prince, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
pp. 476
T. Isernia, Dipt. di Ingegneria Elettronica, Univ. di Napoli Federico II, Italy
V. Pascazio, Dipt. di Ingegneria Elettronica, Univ. di Napoli Federico II, Italy
R. Pierri, Dipt. di Ingegneria Elettronica, Univ. di Napoli Federico II, Italy
pp. 480
C. Biswas, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
H. Na, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 488
J.M. Lagrange, Centre d'etudes de Vaujours, Courtry, France
I. Dauty, Centre d'etudes de Vaujours, Courtry, France
R. Azencott, Centre d'etudes de Vaujours, Courtry, France
pp. 492
MP01: Shape Coding Oral
N. Yamaguchi, Res. & Dev. Center, Toshiba Corp., Japan
T. Ida, Res. & Dev. Center, Toshiba Corp., Japan
T. Watanabe, Res. & Dev. Center, Toshiba Corp., Japan
pp. 504
Shi Hwa Lee, Signal Process. Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea
Dae-Sung Cho, Signal Process. Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea
Yu-Shin Cho, Signal Process. Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea
Sehoon Son, Signal Process. Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea
E.S. Jang, Signal Process. Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea
Jae-Seob Shin, Signal Process. Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea
Yang Seok Seo, Signal Process. Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea
pp. 508
C. Le Buhan Jordan, Signal Process. Lab., Fed. Inst. of Technol., Lausanne, Switzerland
F. Bossen, Signal Process. Lab., Fed. Inst. of Technol., Lausanne, Switzerland
T. Ebrahimi, Signal Process. Lab., Fed. Inst. of Technol., Lausanne, Switzerland
pp. 512
F.H.P. Spaan, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
R.L. Lagendijk, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
J. Biermond, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 516
MP02: Water Marking Oral
A. Piva, Dipt. di Ingegneria Elettronica, Univ. di Firenze, Italy
M. Barni, Dipt. di Ingegneria Elettronica, Univ. di Firenze, Italy
F. Bartolini, Dipt. di Ingegneria Elettronica, Univ. di Firenze, Italy
V. Cappellini, Dipt. di Ingegneria Elettronica, Univ. di Firenze, Italy
pp. 520
F. Hartung, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany
B. Girod, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany
pp. 528
D.J. Fleet, Dept. of Comput. Sci., Queen's Univ., Kingston, Ont., Canada
D.J. Heeger, Dept. of Comput. Sci., Queen's Univ., Kingston, Ont., Canada
pp. 532
S. Craver, Northern Illinois Univ., DeKalb, IL, USA
N. Memon, Northern Illinois Univ., DeKalb, IL, USA
Boon-Lock Yeo, Northern Illinois Univ., DeKalb, IL, USA
M.M. Yeung, Northern Illinois Univ., DeKalb, IL, USA
pp. 540
Xiang-Gen Xia, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
C.G. Boncelet, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
G.R. Arce, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
pp. 548
MP03: Content Based Retrieval I Oral
C. Esperanca, COPPE, Univ. Fed. do Rio de Janeiro, Brazil
H. Samet, COPPE, Univ. Fed. do Rio de Janeiro, Brazil
pp. 556
S. Berretti, Dipt. di Sistemi e Inf., Univ. di Firenze, Italy
A. Del Bimbo, Dipt. di Sistemi e Inf., Univ. di Firenze, Italy
P. Pala, Dipt. di Sistemi e Inf., Univ. di Firenze, Italy
pp. 560
S. Santini, Visual Comput. Lab., California Univ., San Diego, La Jolla, CA, USA
R. Jain, Visual Comput. Lab., California Univ., San Diego, La Jolla, CA, USA
pp. 564
W.Y. Ma, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
B.S. Manjunath, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 568
Kai-Chieh Liang, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
C.-C.J. Kuo, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 572
Chung-Sheng Li, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
V. Castelli, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 576
T. Randen, Hogskolen i Stavanger, Norway
J.H. Husoy, Hogskolen i Stavanger, Norway
pp. 580
MP04: Image Coding I Oral
J.W. Owens, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
M.W. Marcellin, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
B.R. Hunt, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
M. Kleine, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 592
G. Davis, Math., Comput. Sci. Depts., Dartmouth Coll., Hanover, NH, USA
S. Chawla, Math., Comput. Sci. Depts., Dartmouth Coll., Hanover, NH, USA
pp. 600
S.G. Chang, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
B. Yu, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
M. Vetterli, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 604
F. Amato, Dipt. di Ingegneria Elettronica, Univ. Federico II di Napoli, Italy
C. Galdi, Dipt. di Ingegneria Elettronica, Univ. Federico II di Napoli, Italy
G. Poggi, Dipt. di Ingegneria Elettronica, Univ. Federico II di Napoli, Italy
pp. 612
M. Effros, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 616
MP05: Wavelets Poster
L.L. Winger, Electr. & Comput. Eng., Toronto Univ., Ont., Canada
A.N. Venetsanopoulos, Electr. & Comput. Eng., Toronto Univ., Ont., Canada
pp. 620
B.S. Krongold, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
K. Ramchandran, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
D.J. Jones, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 628
M.E. Zervakis, Tech. Univ. of Crete, Chania, Greece
V. Sundararajan, Tech. Univ. of Crete, Chania, Greece
K.K. Parhi, Tech. Univ. of Crete, Chania, Greece
pp. 632
N. Strobel, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
S.K. Mitra, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
B.S. Manjunath, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 925
M.A.M. Rodrigues, Centro de Pesquisas de Energia Electr., CEPEL, Rio de Janeiro, Brazil
E.A.B. da Silva, Centro de Pesquisas de Energia Electr., CEPEL, Rio de Janeiro, Brazil
P.S.R. Diniz, Centro de Pesquisas de Energia Electr., CEPEL, Rio de Janeiro, Brazil
pp. 636
E.P. Simoncelli, Courant Inst. of Math. Sci., New York Univ., NY, USA
R.T. Buccigrossi, Courant Inst. of Math. Sci., New York Univ., NY, USA
pp. 640
Yue Wang, Med. Center, Georgetown Univ., Washington, DC, USA
Huao Li, Med. Center, Georgetown Univ., Washington, DC, USA
Jianhua Xuan, Med. Center, Georgetown Univ., Washington, DC, USA
S.-C.B. Lo, Med. Center, Georgetown Univ., Washington, DC, USA
S.K. Mun, Med. Center, Georgetown Univ., Washington, DC, USA
pp. 644
N. Polyak, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
W.A. Pearlman, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 660
W. Philips, Dept. of Electron. & Inf. Syst., Ghent Univ., Belgium
K. Denecker, Dept. of Electron. & Inf. Syst., Ghent Univ., Belgium
pp. 667
MP06: Imaging Algorithms Poster
P.C. Teo, Dept. of Comput. Sci., Stanford Univ., CA, USA
G. Sapiro, Dept. of Comput. Sci., Stanford Univ., CA, USA
B.A. Wandell, Dept. of Comput. Sci., Stanford Univ., CA, USA
pp. 675
Wan-Ching Chen, Chung-Chen Inst. of Technol., Tao-Yuan, Taiwan
P. Rockett, Chung-Chen Inst. of Technol., Tao-Yuan, Taiwan
pp. 687
P.J.S.G. Ferreira, Dept. de Electron. e Telecoms, Aveiro Univ., Portugal
J.M.N. Vieira, Dept. de Electron. e Telecoms, Aveiro Univ., Portugal
pp. 691
L. Lucchese, Dept. of Electron. & Inf., Padova Univ., Italy
G.M. Cortelazzo, Dept. of Electron. & Inf., Padova Univ., Italy
pp. 699
T.L. Marzetta, Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA
L.A. Shepp, Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 703
S. Kamata, Graduate Sch. of Inf. Sci., Kyushu Univ., Fukuoka, Japan
Y. Bandoh, Graduate Sch. of Inf. Sci., Kyushu Univ., Fukuoka, Japan
pp. 707
MP07: Video Signal Processing Poster
F. Morier, IRESTE-SEI-IVC, Nantes, France
J. Benois-Pineau, IRESTE-SEI-IVC, Nantes, France
D. Barba, IRESTE-SEI-IVC, Nantes, France
H. Sanson, IRESTE-SEI-IVC, Nantes, France
pp. 719
P.E. Eren, Dept. of Electr. Eng., Rochester Univ., NY, USA
C. Toklu, Dept. of Electr. Eng., Rochester Univ., NY, USA
A.M. Tekalp, Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 723
K. Kawaguchi, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
S.K. Mitra, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 727
P.A.A. Assuncao, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
I. Ghanbari, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
pp. 739
J. Hall, Comput. Film Co. Inc., Los Angeles, CA, USA
D. Greenhill, Comput. Film Co. Inc., Los Angeles, CA, USA
G.A. Jones, Comput. Film Co. Inc., Los Angeles, CA, USA
pp. 751
Sang Hwa Lee, Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
Nam Su Moon, Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
Choong Woong Lee, Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
pp. 755
A. Vetro, Adv. Technol. Lab., Mitsubishi Electr. ITA, Japan
H. Sun, Adv. Technol. Lab., Mitsubishi Electr. ITA, Japan
J. Bao, Adv. Technol. Lab., Mitsubishi Electr. ITA, Japan
T. Poon, Adv. Technol. Lab., Mitsubishi Electr. ITA, Japan
pp. 763
K. Jinzenji, NTT Human Interface Labs., Kanagawa, Japan
S. Ishibashi, NTT Human Interface Labs., Kanagawa, Japan
H. Kotera, NTT Human Interface Labs., Kanagawa, Japan
pp. 767
MP08A: Display and Printing Poster
D.J. Lieberman, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
J.P. Allebach, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 775
Byonghyo Shim, Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
Wonyong Sung, Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
pp. 779
N.T. Thao, Dept. of EEE, Hong Kong Univ. of Sci. & Technol., Kowloon, Hong Kong
pp. 783
D.F. Dunn, Dept. of Comput. Sci., Wyoming Univ., Laramie, WY, USA
N.E. Mathew, Dept. of Comput. Sci., Wyoming Univ., Laramie, WY, USA
pp. 787
C.B. Atkins, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
J.P. Allebach, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
C.A. Bouman, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 791
A. Makur, Dept. of Electr. Commun. Eng., Indian Inst. of Sci., Bangalore, India
A. Kumar, Dept. of Electr. Commun. Eng., Indian Inst. of Sci., Bangalore, India
pp. 795
T.D. Kite, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
B.L. Evans, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
A.C. Bovik, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
T.L. Sculley, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 799
J. Shu, EPSON Palo Alto Lab., Palo Alto, CA, USA
J. Li, EPSON Palo Alto Lab., Palo Alto, CA, USA
A. Pascovici, EPSON Palo Alto Lab., Palo Alto, CA, USA
pp. 803
MP08B: Color Images Poster
B. Thai, Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
G. Healey, Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
pp. 807
C.T. Swain, AT&T Labs., Red Bank, NJ, USA
B.G. Haskell, AT&T Labs., Red Bank, NJ, USA
pp. 815
Qiang Lu, Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
R.W. Conners, Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
D.E. Kline, Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
P. Araman, Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
pp. 822
P.R. Bakic, Dept. of Electron. Eng. & Comput. Sci., Lehigh Univ., Bethlehem, PA, USA
D.P. Brzakovic, Dept. of Electron. Eng. & Comput. Sci., Lehigh Univ., Bethlehem, PA, USA
pp. 826
E. Rendon, ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
L. Salgado, ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
J.M. Menendez, ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
N. Garcia, ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
pp. 830
H. Tao, Beckman Inst., Illinois Univ., Urbana, IL, USA
T.S. Huang, Beckman Inst., Illinois Univ., Urbana, IL, USA
pp. 834
MP09A: Radar Poster
P.C. Smits, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
S.G. Dellepiane, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 837
M. Cetin, Dept. of Electr. & Comput. Eng., Boston Univ., MA, USA
W.C. Karl, Dept. of Electr. & Comput. Eng., Boston Univ., MA, USA
pp. 845
V. Pascazio, I.T.T.O.E.M., Ist. Univ. Navale, Napoli, Italy
G. Schirinzi, I.T.T.O.E.M., Ist. Univ. Navale, Napoli, Italy
pp. 849
M.W. Castelloe, Voice Syst., Hughes Network Syst., San Diego, CA, USA
D.C. Munson, Jr., Voice Syst., Hughes Network Syst., San Diego, CA, USA
pp. 853
Bing Ma, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
S. Lakshmanan, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
A.O. Hero, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 857
N.E. Doren, Sandia Nat. Labs., Albuquerque, NM, USA
C.V. Jakowatz, Jr., Sandia Nat. Labs., Albuquerque, NM, USA
D.E. Wahl, Sandia Nat. Labs., Albuquerque, NM, USA
P.A. Thompson, Sandia Nat. Labs., Albuquerque, NM, USA
pp. 861
J.J. Green, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
B.R. Hunt, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 865
MP09B: Automatic Target Recognition Poster
D. Kottke, Sanders Associates Inc., Nashua, NH, USA
P.D. Fiore, Sanders Associates Inc., Nashua, NH, USA
pp. 869
V. Murino, Dept. of Math. & Comput. Sci., Udine Univ., Italy
G.L. Foresti, Dept. of Math. & Comput. Sci., Udine Univ., Italy
A. Trucco, Dept. of Math. & Comput. Sci., Udine Univ., Italy
pp. 873
J. Matas, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
L.M. Soh, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
J. Kittler, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
pp. 877
Lin-Cheng Wang, State Univ. of New York, Amherst, NY, USA
LipChen Chan, State Univ. of New York, Amherst, NY, USA
N.M. Nasrabadi, State Univ. of New York, Amherst, NY, USA
S. Der, State Univ. of New York, Amherst, NY, USA
pp. 881
S. Mathieu-Marni, INRIA, Sophia-Antipolis, France
S. Kuttikkad, INRIA, Sophia-Antipolis, France
R. Chellappa, INRIA, Sophia-Antipolis, France
pp. 885
S. Procter, Sch. of Electron. Eng., Inf. Technol. & Math., Surrey Univ., Guildford, UK
J. Illingworth, Sch. of Electron. Eng., Inf. Technol. & Math., Surrey Univ., Guildford, UK
pp. 889
A.L.N. Fred, Inst. Superior Tecnico, Lisbon, Portugal
J.S. Marques, Inst. Superior Tecnico, Lisbon, Portugal
P.M. Jorge, Inst. Superior Tecnico, Lisbon, Portugal
pp. 893
MP10: Image Interpolation Poster
W. Knox Carey, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
D.B. Chuang, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
S.S. Hemami, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 901
Ping Wah Wong, Hewlett-Packard Co., Palo Alto, CA, USA
C. Herley, Hewlett-Packard Co., Palo Alto, CA, USA
pp. 905
D.M. Monro, Sch. of Electron. & Electr. Eng., Bath Univ., UK
P.D. Wakefield, Sch. of Electron. & Electr. Eng., Bath Univ., UK
pp. 913
T.J. Connolly, Dept. of Electr. & Electron. Eng., Canterbury Univ., Christchurch, New Zealand
R.G. Lane, Dept. of Electr. & Electron. Eng., Canterbury Univ., Christchurch, New Zealand
pp. 917
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