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Image Processing, International Conference on (1995)
Washington D.C.
Oct. 23, 1995 to Oct. 26, 1995
ISBN: 0-8186-7310-9
TABLE OF CONTENTS
G. Sapiro , Hewlett-Packard Labs., Palo Alto, CA, USA
pp. 3001
V. Caselles , Dept. of Math. & Comput. Sci., Universidad les Illes Balears, Palma, Spain
pp. 3009
O. Faugeras , Inst. Nat. de Recherche en Inf. et Autom., Valbonne, France
R. Keriven , Inst. Nat. de Recherche en Inf. et Autom., Valbonne, France
pp. 3013
A. Kumar , Dept. of Aerosp. & Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A. Tannenbaum , Dept. of Aerosp. & Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
G. Balas , Dept. of Aerosp. & Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 3017
S. Soatto , California Inst. of Technol., Pasadena, CA, USA
P. Perona , California Inst. of Technol., Pasadena, CA, USA
pp. 3021
L. Moisan , CEREMADE, Univ. Paris Dauphine, France
pp. 3025
Huy Phan , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
K.D. Sauer , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 3029
N.J. Dusaussoy , Adv. Res. & Applications Corp., Sunnyvale, CA, USA
Qizhi Cao , Adv. Res. & Applications Corp., Sunnyvale, CA, USA
R.N. Yancey , Adv. Res. & Applications Corp., Sunnyvale, CA, USA
J.H. Stanley , Adv. Res. & Applications Corp., Sunnyvale, CA, USA
pp. 3033
R. Gupta , Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA
A. Noble , Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA
R. Hartley , Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA
J. Mundy , Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA
A. Schmitz , Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA
pp. 3037
D. Van Dyck , Antwerp Univ., Belgium
M. Op de Beeck , Antwerp Univ., Belgium
pp. 3041
D. Zhao , Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
Y. Chen , Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
B. Li , Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
C. Zhao , Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
X. Wang , Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
X. Zhang , Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
J. Chen , Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
C. Tu , Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
pp. 3045
S.M. Pandit , Dept. of Mech. Eng. & Eng. Mech., Michigan Technol. Univ., Houghton, MI, USA
R. Guo , Dept. of Mech. Eng. & Eng. Mech., Michigan Technol. Univ., Houghton, MI, USA
pp. 3049
Qian Huang , Siemens Corp. Res. Inc., Princeton, NJ, USA
B. Dom , Siemens Corp. Res. Inc., Princeton, NJ, USA
pp. 3053
M. Venkatraman , Center of Excellence in Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
V. Govindaraju , Center of Excellence in Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
pp. 3057
M.L.G. Althouse , Edgewood Res. Dev. & Eng. Center, US Army Chem. & Biol. Defense Command, Aberdeen Proving Ground, MD, USA
Chein-I Chang , Edgewood Res. Dev. & Eng. Center, US Army Chem. & Biol. Defense Command, Aberdeen Proving Ground, MD, USA
pp. 3061
T. Shimbashi , Res. Center, Sony Corp., Tokyo, Japan
Y. Kokubo , Res. Center, Sony Corp., Tokyo, Japan
N. Shirota , Res. Center, Sony Corp., Tokyo, Japan
pp. 3065
Yang Wang , Dept. of Comput. Sci. & Eng., Nebraska Univ., Lincoln, NE, USA
P. Bhattacharya , Dept. of Comput. Sci. & Eng., Nebraska Univ., Lincoln, NE, USA
pp. 3069
Xin Cai , Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
P.A. Kelly , Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
Wei-Bo Gong , Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
pp. 3073
N. Ichimura , Electrotech. Lab., Ibaraki, Japan
pp. 3077
H. Jafarkhani , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
N. Farvardin , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 3081
Innho Jee , Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
R.A. Haddad , Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
pp. 3085
N. Chaddha , Comput. Syst. Lab., Stanford Univ., CA, USA
P.A. Chou , Comput. Syst. Lab., Stanford Univ., CA, USA
T.H.Y. Meng , Comput. Syst. Lab., Stanford Univ., CA, USA
pp. 3089
Xiaolin Wu , Dept. of Comput. Sci., Univ. of Western Ontario, London, Ont., Canada
pp. 3093
N. Memon , Dept. of Comput. Sci., Northern Illinois Univ., DeKalb, IL, USA
K. Sayood , Dept. of Comput. Sci., Northern Illinois Univ., DeKalb, IL, USA
pp. 3097
M. Quweider , Dept. of Electr. Eng., Toledo Univ., OH, USA
E. Salari , Dept. of Electr. Eng., Toledo Univ., OH, USA
pp. 3101
Qi Li , Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA
P.F. Swaszek , Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 3105
R.L. Joshi , Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
T.R. Fischer , Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
R.H. Bamberger , Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 3109
Zhigang Fan , Xerox Corp., Webster, NY, USA
Fu Li , Xerox Corp., Webster, NY, USA
pp. 3113
Ping Wah Wong , Hewlett Packard Labs., Palo Alto, CA, USA
pp. 3117
L. Akarun , Dept. of Comput. Eng., Bogazici Univ., Istanbul, Turkey
Y. Yardimci , Dept. of Comput. Eng., Bogazici Univ., Istanbul, Turkey
A. Enis Cetin , Dept. of Comput. Eng., Bogazici Univ., Istanbul, Turkey
pp. 3125
G. Wolberg , Dept. of Comput. Sci., City Univ. of New York, NY, USA
R.P. Loce , Dept. of Comput. Sci., City Univ. of New York, NY, USA
pp. 3129
K. Kotani , JAIST, Ishikawa, Japan
Q. Gan , JAIST, Ishikawa, Japan
M. Miyahara , JAIST, Ishikawa, Japan
V.R. Algazi , JAIST, Ishikawa, Japan
pp. 3133
Daechul Park , Dept. of Inf. & Commun. Eng., Hannam Univ., Taejeon, South Korea
Kyungtae Kim , Dept. of Inf. & Commun. Eng., Hannam Univ., Taejeon, South Korea
Cheonhee Lee , Dept. of Inf. & Commun. Eng., Hannam Univ., Taejeon, South Korea
Jungyoung Son , Dept. of Inf. & Commun. Eng., Hannam Univ., Taejeon, South Korea
Yongbeom Lee , Dept. of Inf. & Commun. Eng., Hannam Univ., Taejeon, South Korea
pp. 3137
H.D. Cheng , Dept. of Comput. Sci., Utah State Univ., Logan, UT, USA
C.H. Chen , Dept. of Comput. Sci., Utah State Univ., Logan, UT, USA
R.I. Freimanis , Dept. of Comput. Sci., Utah State Univ., Logan, UT, USA
pp. 3141
M.H. Loew , Dept. of Electr. Eng. & Comput. Sci., George Washington Univ., Washington, DC, USA
R.S. Mia , Dept. of Electr. Eng. & Comput. Sci., George Washington Univ., Washington, DC, USA
pp. 3145
P. Sajda , David Sarnoff Res. Center, Princeton, NJ, USA
C. Spence , David Sarnoff Res. Center, Princeton, NJ, USA
J. Pearson , David Sarnoff Res. Center, Princeton, NJ, USA
pp. 3149
H. Yoshida , Dept. of Radiol., Chicago Univ., IL, USA
Wei Zhang , Dept. of Radiol., Chicago Univ., IL, USA
Weidong Cai , Dept. of Radiol., Chicago Univ., IL, USA
K. Doi , Dept. of Radiol., Chicago Univ., IL, USA
R.M. Nishikawa , Dept. of Radiol., Chicago Univ., IL, USA
M.L. Giger , Dept. of Radiol., Chicago Univ., IL, USA
pp. 3152
N. Vujovic , Dept. of Comput. Sci. & Electr. Eng., Lehigh Univ., Bethlehem, PA, USA
D. Brzakovic , Dept. of Comput. Sci. & Electr. Eng., Lehigh Univ., Bethlehem, PA, USA
pp. 3156
R.W. Mackin, Jr. , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
B. Roysam , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
J.N. Turner , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 3160
S.L. Wood , Santa Clara Univ., CA, USA
Gongyuan Qu , Santa Clara Univ., CA, USA
L.W. Roloff , Santa Clara Univ., CA, USA
pp. 3164
P. Thuman-Commike , Program in Structural & Comput. Biol. & Molecular Biophys.,
W. Chiu , Program in Structural & Comput. Biol. & Molecular Biophys.,
pp. 3168
H. Ancin , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
T.E. Dufresne , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
G.M. Ridder , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
J.N. Turner , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
B. Roysam , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 3172
A.H. Delaney , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
Y. Bresler , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 3176
J. Ribas-Corbera , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
D.L. Neuhoff , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3180
W.C. Chung , Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
F. Kossentini , Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
M.J.T. Smith , Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 3184
A. Fuldseth , Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
T.A. Ramstad , Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
pp. 3188
L. Vandendorpe , Commun. & Remote Sensing Lab., Catholique Univ. Leuven, Belgium
L. Cuvelier , Commun. & Remote Sensing Lab., Catholique Univ. Leuven, Belgium
B. Maison , Commun. & Remote Sensing Lab., Catholique Univ. Leuven, Belgium
pp. 3192
O. Egger , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
T. Ebrahimi , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 3196
D. Wei , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
J.E. Odegard , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
H. Guo , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
M. Lang , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
C.S. Burrus , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 3200
J.D. Gorman , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
M.J. Horowitz , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
D.L. Neuhoff , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
S.A.S. Werness , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
pp. 3204
Hoon Paek , Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea
Jong-Wook Park , Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea
Sang-Uk Lee , Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea
pp. 3208
D.L. Tull , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
A.K. Katsaggelos , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
pp. 3212
F. Muller , Inst. fur Elektrische Nachrichtentech., Aachen Univ. of Technol., Germany
K. Illgner , Inst. fur Elektrische Nachrichtentech., Aachen Univ. of Technol., Germany
pp. 3216
P.D. Fiore , Sanders A Lockheed Martin Co., Nashua NH, USA
pp. 3220
M. Corvi , Central Res. Dept., Elsag Bailey, Genova, Italy
G. Nicchiotti , Central Res. Dept., Elsag Bailey, Genova, Italy
pp. 3224
P. Thevenaz , Nat. Inst. of Health, Bethesda, MD, USA
U.E. Ruttimann , Nat. Inst. of Health, Bethesda, MD, USA
M. Unser , Nat. Inst. of Health, Bethesda, MD, USA
pp. 3228
I. Koren , Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
A. Laine , Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
F. Taylor , Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
pp. 3232
Shang-Hung Lin , Princeton Univ., NJ, USA
S.Y. Kung , Princeton Univ., NJ, USA
pp. 3236
Hui Li , HNC Inc., San Diego, CA, USA
Yi-Tong Zhou , HNC Inc., San Diego, CA, USA
pp. 3240
Y. Nakazawa , Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
T. Komatsu , Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
T. Saito , Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
pp. 3244
L.J. Chipman , Intergraph Corp., Huntsville, AL, USA
T.M. Orr , Intergraph Corp., Huntsville, AL, USA
L.N. Graham , Intergraph Corp., Huntsville, AL, USA
pp. 3248
Y. Chan , Princeton Univ., NJ, USA
S.Y. Kung , Princeton Univ., NJ, USA
pp. 3252
T. Kanungo , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
R.M. Haralick , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 3256
K.U. Barthel , Inst. fur Fernmeldetechnik, Tech. Univ. Berlin, Germany
T. Voye , Inst. fur Fernmeldetechnik, Tech. Univ. Berlin, Germany
pp. 3260
D.M. Monro , Sch. of Electron. & Electr. Eng., Bath Univ., UK
J.A. Nicholls , Sch. of Electron. & Electr. Eng., Bath Univ., UK
pp. 3264
Chang-Su Kim , Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea
Rin-Chul Kim , Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea
Sang-Uk Lee , Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea
pp. 3268
S.A. Rizvi , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
N.M. Nasrabadi , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
Lin-Cheng Wang , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 3272
Y. Zhang , Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
L.-M. Po , Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 3276
B. Hurtgen , Inst. fur Elektrische Nachrichtentechnik, Rheinisch-Westfalische Tech. Hochschule (RWTH) Aachen, Germany
pp. 3280
F. Davoine , Lab. TIMC-IMAG, IAB, La Tronche Cedex, France
J. Svensson , Lab. TIMC-IMAG, IAB, La Tronche Cedex, France
J.-M. Chassery , Lab. TIMC-IMAG, IAB, La Tronche Cedex, France
pp. 3284
F. Cocurullo , DIST, Univ. of Genova, Italy
F. Lavagetto , DIST, Univ. of Genova, Italy
pp. 3288
V. Ricordel , IRISA, Rennes, France
C. Labit , IRISA, Rennes, France
pp. 3292
S.A. Rizvi , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo,
Lin-Cheng Wang , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo,
N.M. Nasrabadi , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo,
pp. 3296
R.D. Romero , Imaging Syst. Lab., Carnegie Mellon Univ., Pittsburgh, PA, USA
R.H. Tibadeau , Imaging Syst. Lab., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 3300
M.D. Garris , Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
pp. 3304
A.K. Jain , Pattern Recognition & Image Proess. Lab., Michigan State Univ., East
Y. Zhong , Pattern Recognition & Image Proess. Lab., Michigan State Univ., East
pp. 3308
T. Hong , Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
J.J. Hull , Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
pp. 3312
H.P. Graf , AT&T Bell Labs., Holmdel, NJ, USA
C.J.C. Burges , AT&T Bell Labs., Holmdel, NJ, USA
E. Cosatto , AT&T Bell Labs., Holmdel, NJ, USA
C.R. Nohl , AT&T Bell Labs., Holmdel, NJ, USA
pp. 3316
P. Pedrazzi , Elsag Bailey-Finmeccanica S.p.A., Genova, Italy
A.M. Colla , Elsag Bailey-Finmeccanica S.p.A., Genova, Italy
pp. 3320
V. Govindaraju , Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
S.N. Srihari , Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
pp. 3324
Jianchang Mao , IBM Almaden Res. Center, San Jose, CA, USA
K. Mohiuddin , IBM Almaden Res. Center, San Jose, CA, USA
pp. 3328
Chinching Yen , AT&T Bell Labs., Somerset, NJ, USA
Shyh-Shiaw Kuo , AT&T Bell Labs., Somerset, NJ, USA
pp. 3332
S.P. Wang , Northeastern Univ., Boston, MA, USA
pp. 3336
C. Dorai , Dept. of Comput. Sci., Michigan State Univ., East Lansing, MI, USA
A.K. Jain , Dept. of Comput. Sci., Michigan State Univ., East Lansing, MI, USA
pp. 3340
L. Legrand , Inf. Med., Bourgogne Univ., Dijon, France
K. Khalil , Inf. Med., Bourgogne Univ., Dijon, France
A. Dipanda , Inf. Med., Bourgogne Univ., Dijon, France
pp. 3344
T. Suk , Inst. of Inf. Theory & Autom., Czech Acad. of Sci., Prague, Czech Republic
J. Flusser , Inst. of Inf. Theory & Autom., Czech Acad. of Sci., Prague, Czech Republic
pp. 3348
W. Niblack , IBM Almaden Res. Center, San Jose, CA, USA
J. Yin , IBM Almaden Res. Center, San Jose, CA, USA
pp. 3352
L. Van Gool , ESAT-M12, Katholieke Univ., Leuven, Belgium
T. Moons , ESAT-M12, Katholieke Univ., Leuven, Belgium
M. Proesmans , ESAT-M12, Katholieke Univ., Leuven, Belgium
A. Oosterlinck , ESAT-M12, Katholieke Univ., Leuven, Belgium
pp. 3356
K. Siddiqi , Div. of Eng., Brown Univ., Providence, RI, USA
F. Subrahmonia , Div. of Eng., Brown Univ., Providence, RI, USA
D. Cooper , Div. of Eng., Brown Univ., Providence, RI, USA
B.B. Kimia , Div. of Eng., Brown Univ., Providence, RI, USA
pp. 3360
M. Hatef , Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
J. Kittler , Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
pp. 3364
J. Ben-Arie , Comput. Vision & Neural Networks Lab., Illinois Inst. of Technol., Chicago, IL, USA
K. Raghunath Rao , Comput. Vision & Neural Networks Lab., Illinois Inst. of Technol., Chicago, IL, USA
Zhiqian Wang , Comput. Vision & Neural Networks Lab., Illinois Inst. of Technol., Chicago, IL, USA
pp. 3368
S. Jaggi , MIT, Cambridge, MA, USA
A.S. Willsky , MIT, Cambridge, MA, USA
W.C. Karl , MIT, Cambridge, MA, USA
S. Mallat , MIT, Cambridge, MA, USA
pp. 3372
K.C. Wong , Sch. of Appl. Sci., Nanyang Technol. Univ., Singapore
H.C. Sim , Sch. of Appl. Sci., Nanyang Technol. Univ., Singapore
J. Kittler , Sch. of Appl. Sci., Nanyang Technol. Univ., Singapore
pp. 3376
M. Khansari , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
M. Vetterli , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 3380
Xiaohong Wang , Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont., Canada
S.D. Blostein , Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont., Canada
pp. 3384
A. Ortega , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
M. Khansari , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 3388
Liang-Jin Lin , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
A. Ortega , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
C.-C.J. Kuo , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 3392
A. Eleftheriadis , Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
D. Anastassiou , Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
pp. 3396
E. Ayanoglu , AT&T Bell Labs., Holmdel, NJ, USA
P. Pancha , AT&T Bell Labs., Holmdel, NJ, USA
A.R. Reibman , AT&T Bell Labs., Holmdel, NJ, USA
pp. 3400
Y. Nakajima , Visual Commun. Group, KDD Kamifukuoka R&D; Labs., Saitama, Japan
H. Hori , Visual Commun. Group, KDD Kamifukuoka R&D; Labs., Saitama, Japan
T. Kanoh , Visual Commun. Group, KDD Kamifukuoka R&D; Labs., Saitama, Japan
pp. 3408
Ligang Lu , Dept. of Electr., Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
W.A. Pearlman , Dept. of Electr., Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 3412
M. Trumbo , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J. Vaisey , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 3416
Tsi-Yi Chao , Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Hsueh-Ming Hang , Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 3420
Yuk-Hee Chan , Dept. of Electron. Eng., Hong Kong Polytech. Univ., Hong Kong
Wan-Chi Siu , Dept. of Electron. Eng., Hong Kong Polytech. Univ., Hong Kong
pp. 3424
S.L. Wood , Santa Clara Univ., CA, USA
Xiaozhong Yao , Santa Clara Univ., CA, USA
K. Krishnamurthi , Santa Clara Univ., CA, USA
L. Dang , Santa Clara Univ., CA, USA
pp. 3428
S.-L. Leung , Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
P.-C. Chee , Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
C. Chan , Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
Q. Huo , Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
pp. 3432
M.H. Shirali-Shahreza , Dept. of Electr. Eng., Amirkabir Univ. of Technol., Tehran, Iran
K. Faez , Dept. of Electr. Eng., Amirkabir Univ. of Technol., Tehran, Iran
A. Khotanzad , Dept. of Electr. Eng., Amirkabir Univ. of Technol., Tehran, Iran
pp. 3436
Y.B. Karasik , Sch. of Comput. Sci., Carleton Univ., Ottawa, Ont., Canada
pp. 3440
E.P. Simoncelli , GRASP Lab., Philadelphia, PA, USA
W.T. Freeman , GRASP Lab., Philadelphia, PA, USA
pp. 3444
V. Valero , Dipartimento de Inf, Escuela Politecnica de Albacete, Spain
F. Cuartero , Dipartimento de Inf, Escuela Politecnica de Albacete, Spain
A. Garrido , Dipartimento de Inf, Escuela Politecnica de Albacete, Spain
F. Quiles , Dipartimento de Inf, Escuela Politecnica de Albacete, Spain
pp. 3448
Jongwoo Bae , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
V.K. Prasanna , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 3452
E. Morimatsu , Fujitsu Labs. Ltd., Kawasaki, Japan
K. Sakai , Fujitsu Labs. Ltd., Kawasaki, Japan
K. Yamashita , Fujitsu Labs. Ltd., Kawasaki, Japan
M. Ohta , Fujitsu Labs. Ltd., Kawasaki, Japan
H. Miyasaka , Fujitsu Labs. Ltd., Kawasaki, Japan
K. Maeda , Fujitsu Labs. Ltd., Kawasaki, Japan
H. Ogura , Fujitsu Labs. Ltd., Kawasaki, Japan
N. Takeshita , Fujitsu Labs. Ltd., Kawasaki, Japan
pp. 3456
R.G. Kermode , Media Lab., MIT, Cambridge, MA, USA
A.B. Lippman , Media Lab., MIT, Cambridge, MA, USA
pp. 3460
Hongche Liu , Div. of Intelligent Syst., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
Tsai-Hong Hong , Div. of Intelligent Syst., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
M. Herman , Div. of Intelligent Syst., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
R. Chellappa , Div. of Intelligent Syst., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
pp. 3464
S.A. Niyogi , Media Lab., MIT, Cambridge, MA, USA
pp. 3468
B. Due , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
P. Schroeter , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
J. Bigun , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 3472
Kui Zhang , Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
M. Bober , Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
J. Kittler , Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
pp. 3476
Jungwoo Lee , David Sarnoff Res. Center, Princeton, NJ, USA
pp. 3480
S.N. Gupta , Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
J.L. Prince , Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
pp. 3484
M. Maurizot , IRISA, Rennes, France
P. Bouthemy , IRISA, Rennes, France
B. Delyon , IRISA, Rennes, France
A. Juditski , IRISA, Rennes, France
J.M. Odobez , IRISA, Rennes, France
pp. 3488
Thomas S. Denney Jr. , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 3492
Jian Feng , Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
Kwok-Tung Lo , Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
H. Mehrpour , Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
A.E. Karbowiak , Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
pp. 3496
D.H. Kil , Signal Process. Center of Technol., Sanders Associates Inc., Nashua, NH, USA
F.B. Shin , Signal Process. Center of Technol., Sanders Associates Inc., Nashua, NH, USA
pp. 3500
P. Lau , Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
N.P. Papanikolopoulos , Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 3504
Jin Li , University of Southern California
Sungook Kim , University of Southern California
C.-C. Jay Kuo , University of Southern California
pp. 3508
B. Moghaddam , Media Lab., MIT, Cambridge, MA, USA
A. Pentland , Media Lab., MIT, Cambridge, MA, USA
pp. 3512
T. Wagner , Fraunhofer Inst. for Integrated Circuits, Erlangen, Germany
U. Dieckmann , Fraunhofer Inst. for Integrated Circuits, Erlangen, Germany
pp. 3516
Yuanzhong Li , Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
H. Kobatake , Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
pp. 3520
T. Nguyen , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
T. Huang , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 3524
J.R. Smith , Center for Telecommun. Res., Columbia Univ., New York, NY, USA
Shih-Fu Chang , Center for Telecommun. Res., Columbia Univ., New York, NY, USA
pp. 3528
A. Broggi , Dipartimento di Ingegneria dell'Inf., Parma Univ., Italy
pp. 3532
C. Toklu , Dept. of Electr. Eng., Rochester Univ., NY, USA
A. Tanju Erdem , Dept. of Electr. Eng., Rochester Univ., NY, USA
M. Ibrahim Sezan , Dept. of Electr. Eng., Rochester Univ., NY, USA
A. Murat Tekalp , Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 3536
A.B. Dobrzeniecki , Harvard Med. Sch., Cambridge, MA, USA
N.D. Levitt , Harvard Med. Sch., Cambridge, MA, USA
pp. 3540
Jianhua Xuan , Dept. of Electr. Eng., Maryland Univ., Baltimore, MD, USA
T. Adali , Dept. of Electr. Eng., Maryland Univ., Baltimore, MD, USA
Yue Wang , Dept. of Electr. Eng., Maryland Univ., Baltimore, MD, USA
pp. 3544
T. Geraud , Dept. Images, ENST, Paris, France
J.-F. Mangin , Dept. Images, ENST, Paris, France
I. Bloch , Dept. Images, ENST, Paris, France
H. Maitre , Dept. Images, ENST, Paris, France
pp. 3548
R. Meier , Bielefeld Univ., Germany
F. Ackermann , Bielefeld Univ., Germany
G. Herrmann , Bielefeld Univ., Germany
S. Posch , Bielefeld Univ., Germany
G. Sagerer , Bielefeld Univ., Germany
pp. 3552
R.R. Rao , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 3556
C. Schillo , Bielefeld Univ., Germany
G. Herrmann , Bielefeld Univ., Germany
F. Ackermann , Bielefeld Univ., Germany
S. Posch , Bielefeld Univ., Germany
G. Sagerer , Bielefeld Univ., Germany
pp. 3560
E.A. Ashton , Dept. of Electr. Eng., Rochester Univ., NY, USA
K.J. Parker , Dept. of Electr. Eng., Rochester Univ., NY, USA
M.J. Berg , Dept. of Electr. Eng., Rochester Univ., NY, USA
Chang Wen Chen , Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 3564
S. Krishnamachari , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
R. Chellappa , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 3568
P. Bonnin , Univ. de Paris-Nord, Villetaneuse, France
B. Hoeltzener-Douarin , Univ. de Paris-Nord, Villetaneuse, France
E. Pissaloux , Univ. de Paris-Nord, Villetaneuse, France
pp. 3572
Wanqing Li , Centre for Intelligent Inf. Process. Syst., Western Australia Univ., Nedlands, WA, Australia
M. Morrison , Centre for Intelligent Inf. Process. Syst., Western Australia Univ., Nedlands, WA, Australia
Y. Attikiouzel , Centre for Intelligent Inf. Process. Syst., Western Australia Univ., Nedlands, WA, Australia
pp. 3576
R. Bernardini , Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
J. Kovacevic , Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 3580
F. Marques , Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
B. Llorens , Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
A. Gasull , Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 3584
L. Torres , Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
J.R. Casas , Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
J. Campins , Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 3588
Tian-Hu Yu , Dept. of Inf. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
pp. 3592
H. Lin , Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
A.N. Venetsanopoulos , Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
pp. 3596
H.R. Rabiee , Dept. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
R.L. Kashyap , Dept. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
H. Radha , Dept. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 3600
A.S. Khayrallah , Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
pp. 3604
S. Moni , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
R.L. Kashyap , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 3608
C.S. Regazzoni , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
G. Foresti , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
A.N. Venetsanopoulos , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 3612
O. Egger , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
M. Kunt , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 3616
A.J. Abrantes , INESC, Lisbon, Portugal
J.S. Marques , INESC, Lisbon, Portugal
pp. 3624
J.-M. Odobez , IRISA/INRIA, Rennes, France
P. Bouthemy , IRISA/INRIA, Rennes, France
pp. 3628
G. Sapiro , Hewlett-Packard Labs., Palo Alto, CA, USA
V. Caselles , Hewlett-Packard Labs., Palo Alto, CA, USA
pp. 3632
A.N. Rajagopalan , Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
S. Chaudhuri , Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
pp. 3636
Zhi-Yan Xie , Dept. of Eng. Sci., Oxford Univ., UK
M.J. Brady , Dept. of Eng. Sci., Oxford Univ., UK
pp. 3640
G. Jacovitti , INFOCOM Dept., Rome Univ., Italy
A. Neri , INFOCOM Dept., Rome Univ., Italy
G. Scarano , INFOCOM Dept., Rome Univ., Italy
pp. 3644
D.J. Heeger , Dept. of Psychol., Stanford Univ., CA, USA
J.R. Bergen , Dept. of Psychol., Stanford Univ., CA, USA
pp. 3648
V. Swarnakar , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
R.S. Acharya , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 3652
Xiangmin Zhang , Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
S.M. Collins , Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
M. Sonka , Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
pp. 3656
pp. 3661
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