ISBN: 0-8186-7310-9

G. Sapiro, Hewlett-Packard Labs., Palo Alto, CA, USA

F.L. Bookstein, Michigan Univ., Ann Arbor, MI, USA

V. Caselles, Dept. of Math. & Comput. Sci., Universidad les Illes Balears, Palma, Spain

O. Faugeras, Inst. Nat. de Recherche en Inf. et Autom., Valbonne, France

R. Keriven, Inst. Nat. de Recherche en Inf. et Autom., Valbonne, France

A. Kumar, Dept. of Aerosp. & Electr. Eng., Minnesota Univ., Minneapolis, MN, USA

A. Tannenbaum, Dept. of Aerosp. & Electr. Eng., Minnesota Univ., Minneapolis, MN, USA

G. Balas, Dept. of Aerosp. & Electr. Eng., Minnesota Univ., Minneapolis, MN, USA

S. Soatto, California Inst. of Technol., Pasadena, CA, USA

P. Perona, California Inst. of Technol., Pasadena, CA, USA

L. Moisan, CEREMADE, Univ. Paris Dauphine, France

Huy Phan, Dept. of Electr. Eng., Notre Dame Univ., IN, USA

K.D. Sauer, Dept. of Electr. Eng., Notre Dame Univ., IN, USA

N.J. Dusaussoy, Adv. Res. & Applications Corp., Sunnyvale, CA, USA

Qizhi Cao, Adv. Res. & Applications Corp., Sunnyvale, CA, USA

R.N. Yancey, Adv. Res. & Applications Corp., Sunnyvale, CA, USA

J.H. Stanley, Adv. Res. & Applications Corp., Sunnyvale, CA, USA

R. Gupta, Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA

A. Noble, Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA

R. Hartley, Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA

J. Mundy, Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA

A. Schmitz, Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA

D. Van Dyck, Antwerp Univ., Belgium

M. Op de Beeck, Antwerp Univ., Belgium

D. Zhao, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA

Y. Chen, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA

B. Li, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA

C. Zhao, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA

X. Wang, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA

X. Zhang, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA

J. Chen, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA

C. Tu, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA

S.M. Pandit, Dept. of Mech. Eng. & Eng. Mech., Michigan Technol. Univ., Houghton, MI, USA

R. Guo, Dept. of Mech. Eng. & Eng. Mech., Michigan Technol. Univ., Houghton, MI, USA

Qian Huang, Siemens Corp. Res. Inc., Princeton, NJ, USA

B. Dom, Siemens Corp. Res. Inc., Princeton, NJ, USA

M. Venkatraman, Center of Excellence in Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA

V. Govindaraju, Center of Excellence in Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA

M.L.G. Althouse, Edgewood Res. Dev. & Eng. Center, US Army Chem. & Biol. Defense Command, Aberdeen Proving Ground, MD, USA

Chein-I Chang, Edgewood Res. Dev. & Eng. Center, US Army Chem. & Biol. Defense Command, Aberdeen Proving Ground, MD, USA

T. Shimbashi, Res. Center, Sony Corp., Tokyo, Japan

Y. Kokubo, Res. Center, Sony Corp., Tokyo, Japan

N. Shirota, Res. Center, Sony Corp., Tokyo, Japan

Yang Wang, Dept. of Comput. Sci. & Eng., Nebraska Univ., Lincoln, NE, USA

P. Bhattacharya, Dept. of Comput. Sci. & Eng., Nebraska Univ., Lincoln, NE, USA

Xin Cai, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA

P.A. Kelly, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA

Wei-Bo Gong, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA

N. Ichimura, Electrotech. Lab., Ibaraki, Japan

H. Jafarkhani, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA

N. Farvardin, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA

Innho Jee, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA

R.A. Haddad, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA

N. Chaddha, Comput. Syst. Lab., Stanford Univ., CA, USA

P.A. Chou, Comput. Syst. Lab., Stanford Univ., CA, USA

T.H.Y. Meng, Comput. Syst. Lab., Stanford Univ., CA, USA

Xiaolin Wu, Dept. of Comput. Sci., Univ. of Western Ontario, London, Ont., Canada

N. Memon, Dept. of Comput. Sci., Northern Illinois Univ., DeKalb, IL, USA

K. Sayood, Dept. of Comput. Sci., Northern Illinois Univ., DeKalb, IL, USA

M. Quweider, Dept. of Electr. Eng., Toledo Univ., OH, USA

E. Salari, Dept. of Electr. Eng., Toledo Univ., OH, USA

Qi Li, Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA

P.F. Swaszek, Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA

R.L. Joshi, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA

T.R. Fischer, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA

R.H. Bamberger, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA

Zhigang Fan, Xerox Corp., Webster, NY, USA

Fu Li, Xerox Corp., Webster, NY, USA

Ping Wah Wong, Hewlett Packard Labs., Palo Alto, CA, USA

J. Shu, EPSON Palo Alto Lab., CA, USA

L. Akarun, Dept. of Comput. Eng., Bogazici Univ., Istanbul, Turkey

Y. Yardimci, Dept. of Comput. Eng., Bogazici Univ., Istanbul, Turkey

A. Enis Cetin, Dept. of Comput. Eng., Bogazici Univ., Istanbul, Turkey

G. Wolberg, Dept. of Comput. Sci., City Univ. of New York, NY, USA

R.P. Loce, Dept. of Comput. Sci., City Univ. of New York, NY, USA

K. Kotani, JAIST, Ishikawa, Japan

Q. Gan, JAIST, Ishikawa, Japan

M. Miyahara, JAIST, Ishikawa, Japan

V.R. Algazi, JAIST, Ishikawa, Japan

Daechul Park, Dept. of Inf. & Commun. Eng., Hannam Univ., Taejeon, South Korea

Kyungtae Kim, Dept. of Inf. & Commun. Eng., Hannam Univ., Taejeon, South Korea

Cheonhee Lee, Dept. of Inf. & Commun. Eng., Hannam Univ., Taejeon, South Korea

Jungyoung Son, Dept. of Inf. & Commun. Eng., Hannam Univ., Taejeon, South Korea

Yongbeom Lee, Dept. of Inf. & Commun. Eng., Hannam Univ., Taejeon, South Korea

H.D. Cheng, Dept. of Comput. Sci., Utah State Univ., Logan, UT, USA

C.H. Chen, Dept. of Comput. Sci., Utah State Univ., Logan, UT, USA

R.I. Freimanis, Dept. of Comput. Sci., Utah State Univ., Logan, UT, USA

M.H. Loew, Dept. of Electr. Eng. & Comput. Sci., George Washington Univ., Washington, DC, USA

R.S. Mia, Dept. of Electr. Eng. & Comput. Sci., George Washington Univ., Washington, DC, USA

P. Sajda, David Sarnoff Res. Center, Princeton, NJ, USA

C. Spence, David Sarnoff Res. Center, Princeton, NJ, USA

J. Pearson, David Sarnoff Res. Center, Princeton, NJ, USA

H. Yoshida, Dept. of Radiol., Chicago Univ., IL, USA

Wei Zhang, Dept. of Radiol., Chicago Univ., IL, USA

Weidong Cai, Dept. of Radiol., Chicago Univ., IL, USA

K. Doi, Dept. of Radiol., Chicago Univ., IL, USA

R.M. Nishikawa, Dept. of Radiol., Chicago Univ., IL, USA

M.L. Giger, Dept. of Radiol., Chicago Univ., IL, USA

N. Vujovic, Dept. of Comput. Sci. & Electr. Eng., Lehigh Univ., Bethlehem, PA, USA

D. Brzakovic, Dept. of Comput. Sci. & Electr. Eng., Lehigh Univ., Bethlehem, PA, USA

R.W. Mackin, Jr., Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA

B. Roysam, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA

J.N. Turner, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA

S.L. Wood, Santa Clara Univ., CA, USA

Gongyuan Qu, Santa Clara Univ., CA, USA

L.W. Roloff, Santa Clara Univ., CA, USA

P. Thuman-Commike, Program in Structural & Comput. Biol. & Molecular Biophys.,

W. Chiu, Program in Structural & Comput. Biol. & Molecular Biophys.,

H. Ancin, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA

T.E. Dufresne, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA

G.M. Ridder, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA

J.N. Turner, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA

B. Roysam, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA

A.H. Delaney, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA

Y. Bresler, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA

J. Ribas-Corbera, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA

D.L. Neuhoff, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA

W.C. Chung, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA

F. Kossentini, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA

M.J.T. Smith, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA

A. Fuldseth, Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway

T.A. Ramstad, Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway

L. Vandendorpe, Commun. & Remote Sensing Lab., Catholique Univ. Leuven, Belgium

L. Cuvelier, Commun. & Remote Sensing Lab., Catholique Univ. Leuven, Belgium

B. Maison, Commun. & Remote Sensing Lab., Catholique Univ. Leuven, Belgium

O. Egger, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland

T. Ebrahimi, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland

D. Wei, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA

J.E. Odegard, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA

H. Guo, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA

M. Lang, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA

C.S. Burrus, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA

J.D. Gorman, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA

M.J. Horowitz, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA

D.L. Neuhoff, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA

S.A.S. Werness, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA

Hoon Paek, Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea

Jong-Wook Park, Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea

Sang-Uk Lee, Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea

D.L. Tull, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA

A.K. Katsaggelos, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA

F. Muller, Inst. fur Elektrische Nachrichtentech., Aachen Univ. of Technol., Germany

K. Illgner, Inst. fur Elektrische Nachrichtentech., Aachen Univ. of Technol., Germany

P.D. Fiore, Sanders A Lockheed Martin Co., Nashua NH, USA

M. Corvi, Central Res. Dept., Elsag Bailey, Genova, Italy

G. Nicchiotti, Central Res. Dept., Elsag Bailey, Genova, Italy

P. Thevenaz, Nat. Inst. of Health, Bethesda, MD, USA

U.E. Ruttimann, Nat. Inst. of Health, Bethesda, MD, USA

M. Unser, Nat. Inst. of Health, Bethesda, MD, USA

I. Koren, Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA

A. Laine, Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA

F. Taylor, Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA

Shang-Hung Lin, Princeton Univ., NJ, USA

S.Y. Kung, Princeton Univ., NJ, USA

Hui Li, HNC Inc., San Diego, CA, USA

Yi-Tong Zhou, HNC Inc., San Diego, CA, USA

Y. Nakazawa, Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan

T. Komatsu, Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan

T. Saito, Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan

L.J. Chipman, Intergraph Corp., Huntsville, AL, USA

T.M. Orr, Intergraph Corp., Huntsville, AL, USA

L.N. Graham, Intergraph Corp., Huntsville, AL, USA

Y. Chan, Princeton Univ., NJ, USA

S.Y. Kung, Princeton Univ., NJ, USA

T. Kanungo, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA

R.M. Haralick, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA

K.U. Barthel, Inst. fur Fernmeldetechnik, Tech. Univ. Berlin, Germany

T. Voye, Inst. fur Fernmeldetechnik, Tech. Univ. Berlin, Germany

D.M. Monro, Sch. of Electron. & Electr. Eng., Bath Univ., UK

J.A. Nicholls, Sch. of Electron. & Electr. Eng., Bath Univ., UK

Chang-Su Kim, Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea

Rin-Chul Kim, Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea

Sang-Uk Lee, Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea

S.A. Rizvi, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA

N.M. Nasrabadi, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA

Lin-Cheng Wang, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA

Y. Zhang, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong

L.-M. Po, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong

B. Hurtgen, Inst. fur Elektrische Nachrichtentechnik, Rheinisch-Westfalische Tech. Hochschule (RWTH) Aachen, Germany

F. Davoine, Lab. TIMC-IMAG, IAB, La Tronche Cedex, France

J. Svensson, Lab. TIMC-IMAG, IAB, La Tronche Cedex, France

J.-M. Chassery, Lab. TIMC-IMAG, IAB, La Tronche Cedex, France

F. Cocurullo, DIST, Univ. of Genova, Italy

F. Lavagetto, DIST, Univ. of Genova, Italy

V. Ricordel, IRISA, Rennes, France

C. Labit, IRISA, Rennes, France

S.A. Rizvi, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo,

Lin-Cheng Wang, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo,

N.M. Nasrabadi, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo,

R.D. Romero, Imaging Syst. Lab., Carnegie Mellon Univ., Pittsburgh, PA, USA

R.H. Tibadeau, Imaging Syst. Lab., Carnegie Mellon Univ., Pittsburgh, PA, USA

M.D. Garris, Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA

A.K. Jain, Pattern Recognition & Image Proess. Lab., Michigan State Univ., East

Y. Zhong, Pattern Recognition & Image Proess. Lab., Michigan State Univ., East

T. Hong, Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA

J.J. Hull, Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA

H.P. Graf, AT&T Bell Labs., Holmdel, NJ, USA

C.J.C. Burges, AT&T Bell Labs., Holmdel, NJ, USA

E. Cosatto, AT&T Bell Labs., Holmdel, NJ, USA

C.R. Nohl, AT&T Bell Labs., Holmdel, NJ, USA

P. Pedrazzi, Elsag Bailey-Finmeccanica S.p.A., Genova, Italy

A.M. Colla, Elsag Bailey-Finmeccanica S.p.A., Genova, Italy

V. Govindaraju, Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA

S.N. Srihari, Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA

Jianchang Mao, IBM Almaden Res. Center, San Jose, CA, USA

K. Mohiuddin, IBM Almaden Res. Center, San Jose, CA, USA

Chinching Yen, AT&T Bell Labs., Somerset, NJ, USA

Shyh-Shiaw Kuo, AT&T Bell Labs., Somerset, NJ, USA

S.P. Wang, Northeastern Univ., Boston, MA, USA

C. Dorai, Dept. of Comput. Sci., Michigan State Univ., East Lansing, MI, USA

A.K. Jain, Dept. of Comput. Sci., Michigan State Univ., East Lansing, MI, USA

L. Legrand, Inf. Med., Bourgogne Univ., Dijon, France

K. Khalil, Inf. Med., Bourgogne Univ., Dijon, France

A. Dipanda, Inf. Med., Bourgogne Univ., Dijon, France

T. Suk, Inst. of Inf. Theory & Autom., Czech Acad. of Sci., Prague, Czech Republic

J. Flusser, Inst. of Inf. Theory & Autom., Czech Acad. of Sci., Prague, Czech Republic

W. Niblack, IBM Almaden Res. Center, San Jose, CA, USA

J. Yin, IBM Almaden Res. Center, San Jose, CA, USA

L. Van Gool, ESAT-M12, Katholieke Univ., Leuven, Belgium

T. Moons, ESAT-M12, Katholieke Univ., Leuven, Belgium

M. Proesmans, ESAT-M12, Katholieke Univ., Leuven, Belgium

A. Oosterlinck, ESAT-M12, Katholieke Univ., Leuven, Belgium

K. Siddiqi, Div. of Eng., Brown Univ., Providence, RI, USA

F. Subrahmonia, Div. of Eng., Brown Univ., Providence, RI, USA

D. Cooper, Div. of Eng., Brown Univ., Providence, RI, USA

B.B. Kimia, Div. of Eng., Brown Univ., Providence, RI, USA

M. Hatef, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK

J. Kittler, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK

J. Ben-Arie, Comput. Vision & Neural Networks Lab., Illinois Inst. of Technol., Chicago, IL, USA

K. Raghunath Rao, Comput. Vision & Neural Networks Lab., Illinois Inst. of Technol., Chicago, IL, USA

Zhiqian Wang, Comput. Vision & Neural Networks Lab., Illinois Inst. of Technol., Chicago, IL, USA

S. Jaggi, MIT, Cambridge, MA, USA

A.S. Willsky, MIT, Cambridge, MA, USA

W.C. Karl, MIT, Cambridge, MA, USA

S. Mallat, MIT, Cambridge, MA, USA

K.C. Wong, Sch. of Appl. Sci., Nanyang Technol. Univ., Singapore

H.C. Sim, Sch. of Appl. Sci., Nanyang Technol. Univ., Singapore

J. Kittler, Sch. of Appl. Sci., Nanyang Technol. Univ., Singapore

M. Khansari, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA

M. Vetterli, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA

Xiaohong Wang, Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont., Canada

S.D. Blostein, Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont., Canada

A. Ortega, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA

M. Khansari, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA

Liang-Jin Lin, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA

A. Ortega, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA

C.-C.J. Kuo, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA

A. Eleftheriadis, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA

D. Anastassiou, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA

E. Ayanoglu, AT&T Bell Labs., Holmdel, NJ, USA

P. Pancha, AT&T Bell Labs., Holmdel, NJ, USA

A.R. Reibman, AT&T Bell Labs., Holmdel, NJ, USA

N. Chaddha, Comput. Syst. Lab., Stanford Univ., CA, USA

Y. Nakajima, Visual Commun. Group, KDD Kamifukuoka R&D; Labs., Saitama, Japan

H. Hori, Visual Commun. Group, KDD Kamifukuoka R&D; Labs., Saitama, Japan

T. Kanoh, Visual Commun. Group, KDD Kamifukuoka R&D; Labs., Saitama, Japan

Ligang Lu, Dept. of Electr., Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA

W.A. Pearlman, Dept. of Electr., Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA

M. Trumbo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA

J. Vaisey, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA

Tsi-Yi Chao, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan

Hsueh-Ming Hang, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan

Yuk-Hee Chan, Dept. of Electron. Eng., Hong Kong Polytech. Univ., Hong Kong

Wan-Chi Siu, Dept. of Electron. Eng., Hong Kong Polytech. Univ., Hong Kong

S.L. Wood, Santa Clara Univ., CA, USA

Xiaozhong Yao, Santa Clara Univ., CA, USA

K. Krishnamurthi, Santa Clara Univ., CA, USA

L. Dang, Santa Clara Univ., CA, USA

S.-L. Leung, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong

P.-C. Chee, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong

C. Chan, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong

Q. Huo, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong

M.H. Shirali-Shahreza, Dept. of Electr. Eng., Amirkabir Univ. of Technol., Tehran, Iran

K. Faez, Dept. of Electr. Eng., Amirkabir Univ. of Technol., Tehran, Iran

A. Khotanzad, Dept. of Electr. Eng., Amirkabir Univ. of Technol., Tehran, Iran

Y.B. Karasik, Sch. of Comput. Sci., Carleton Univ., Ottawa, Ont., Canada

E.P. Simoncelli, GRASP Lab., Philadelphia, PA, USA

W.T. Freeman, GRASP Lab., Philadelphia, PA, USA

V. Valero, Dipartimento de Inf, Escuela Politecnica de Albacete, Spain

F. Cuartero, Dipartimento de Inf, Escuela Politecnica de Albacete, Spain

A. Garrido, Dipartimento de Inf, Escuela Politecnica de Albacete, Spain

F. Quiles, Dipartimento de Inf, Escuela Politecnica de Albacete, Spain

Jongwoo Bae, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA

V.K. Prasanna, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA

E. Morimatsu, Fujitsu Labs. Ltd., Kawasaki, Japan

K. Sakai, Fujitsu Labs. Ltd., Kawasaki, Japan

K. Yamashita, Fujitsu Labs. Ltd., Kawasaki, Japan

M. Ohta, Fujitsu Labs. Ltd., Kawasaki, Japan

H. Miyasaka, Fujitsu Labs. Ltd., Kawasaki, Japan

K. Maeda, Fujitsu Labs. Ltd., Kawasaki, Japan

H. Ogura, Fujitsu Labs. Ltd., Kawasaki, Japan

N. Takeshita, Fujitsu Labs. Ltd., Kawasaki, Japan

R.G. Kermode, Media Lab., MIT, Cambridge, MA, USA

A.B. Lippman, Media Lab., MIT, Cambridge, MA, USA

Hongche Liu, Div. of Intelligent Syst., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA

Tsai-Hong Hong, Div. of Intelligent Syst., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA

M. Herman, Div. of Intelligent Syst., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA

R. Chellappa, Div. of Intelligent Syst., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA

S.A. Niyogi, Media Lab., MIT, Cambridge, MA, USA

B. Due, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland

P. Schroeter, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland

J. Bigun, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland

Kui Zhang, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK

M. Bober, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK

J. Kittler, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK

Jungwoo Lee, David Sarnoff Res. Center, Princeton, NJ, USA

S.N. Gupta, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA

J.L. Prince, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA

M. Maurizot, IRISA, Rennes, France

P. Bouthemy, IRISA, Rennes, France

B. Delyon, IRISA, Rennes, France

A. Juditski, IRISA, Rennes, France

J.M. Odobez, IRISA, Rennes, France

Thomas S. Denney Jr., Dept. of Electr. Eng., Auburn Univ., AL, USA

Jian Feng, Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia

Kwok-Tung Lo, Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia

H. Mehrpour, Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia

A.E. Karbowiak, Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia

D.H. Kil, Signal Process. Center of Technol., Sanders Associates Inc., Nashua, NH, USA

F.B. Shin, Signal Process. Center of Technol., Sanders Associates Inc., Nashua, NH, USA

P. Lau, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA

N.P. Papanikolopoulos, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA

Jin Li, University of Southern California

Sungook Kim, University of Southern California

C.-C. Jay Kuo, University of Southern California

B. Moghaddam, Media Lab., MIT, Cambridge, MA, USA

A. Pentland, Media Lab., MIT, Cambridge, MA, USA

T. Wagner, Fraunhofer Inst. for Integrated Circuits, Erlangen, Germany

U. Dieckmann, Fraunhofer Inst. for Integrated Circuits, Erlangen, Germany

Yuanzhong Li, Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan

H. Kobatake, Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan

T. Nguyen, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA

T. Huang, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA

J.R. Smith, Center for Telecommun. Res., Columbia Univ., New York, NY, USA

Shih-Fu Chang, Center for Telecommun. Res., Columbia Univ., New York, NY, USA

A. Broggi, Dipartimento di Ingegneria dell'Inf., Parma Univ., Italy

C. Toklu, Dept. of Electr. Eng., Rochester Univ., NY, USA

A. Tanju Erdem, Dept. of Electr. Eng., Rochester Univ., NY, USA

M. Ibrahim Sezan, Dept. of Electr. Eng., Rochester Univ., NY, USA

A. Murat Tekalp, Dept. of Electr. Eng., Rochester Univ., NY, USA

A.B. Dobrzeniecki, Harvard Med. Sch., Cambridge, MA, USA

N.D. Levitt, Harvard Med. Sch., Cambridge, MA, USA

Jianhua Xuan, Dept. of Electr. Eng., Maryland Univ., Baltimore, MD, USA

T. Adali, Dept. of Electr. Eng., Maryland Univ., Baltimore, MD, USA

Yue Wang, Dept. of Electr. Eng., Maryland Univ., Baltimore, MD, USA

T. Geraud, Dept. Images, ENST, Paris, France

J.-F. Mangin, Dept. Images, ENST, Paris, France

I. Bloch, Dept. Images, ENST, Paris, France

H. Maitre, Dept. Images, ENST, Paris, France

R. Meier, Bielefeld Univ., Germany

F. Ackermann, Bielefeld Univ., Germany

G. Herrmann, Bielefeld Univ., Germany

S. Posch, Bielefeld Univ., Germany

G. Sagerer, Bielefeld Univ., Germany

R.R. Rao, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

R.M. Mersereau, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

C. Schillo, Bielefeld Univ., Germany

G. Herrmann, Bielefeld Univ., Germany

F. Ackermann, Bielefeld Univ., Germany

S. Posch, Bielefeld Univ., Germany

G. Sagerer, Bielefeld Univ., Germany

E.A. Ashton, Dept. of Electr. Eng., Rochester Univ., NY, USA

K.J. Parker, Dept. of Electr. Eng., Rochester Univ., NY, USA

M.J. Berg, Dept. of Electr. Eng., Rochester Univ., NY, USA

Chang Wen Chen, Dept. of Electr. Eng., Rochester Univ., NY, USA

S. Krishnamachari, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA

R. Chellappa, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA

P. Bonnin, Univ. de Paris-Nord, Villetaneuse, France

B. Hoeltzener-Douarin, Univ. de Paris-Nord, Villetaneuse, France

E. Pissaloux, Univ. de Paris-Nord, Villetaneuse, France

Wanqing Li, Centre for Intelligent Inf. Process. Syst., Western Australia Univ., Nedlands, WA, Australia

M. Morrison, Centre for Intelligent Inf. Process. Syst., Western Australia Univ., Nedlands, WA, Australia

Y. Attikiouzel, Centre for Intelligent Inf. Process. Syst., Western Australia Univ., Nedlands, WA, Australia

R. Bernardini, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA

J. Kovacevic, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA

F. Marques, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain

B. Llorens, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain

A. Gasull, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain

L. Torres, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain

J.R. Casas, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain

J. Campins, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain

Tian-Hu Yu, Dept. of Inf. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong

H. Lin, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada

A.N. Venetsanopoulos, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada

H.R. Rabiee, Dept. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA

R.L. Kashyap, Dept. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA

H. Radha, Dept. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA

A.S. Khayrallah, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA

S. Moni, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA

R.L. Kashyap, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA

C.S. Regazzoni, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy

G. Foresti, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy

A.N. Venetsanopoulos, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy

O. Egger, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland

M. Kunt, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland

M. Bichsel

A.J. Abrantes, INESC, Lisbon, Portugal

J.S. Marques, INESC, Lisbon, Portugal

J.-M. Odobez, IRISA/INRIA, Rennes, France

P. Bouthemy, IRISA/INRIA, Rennes, France

G. Sapiro, Hewlett-Packard Labs., Palo Alto, CA, USA

V. Caselles, Hewlett-Packard Labs., Palo Alto, CA, USA

A.N. Rajagopalan, Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India

S. Chaudhuri, Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India

Zhi-Yan Xie, Dept. of Eng. Sci., Oxford Univ., UK

M.J. Brady, Dept. of Eng. Sci., Oxford Univ., UK

G. Jacovitti, INFOCOM Dept., Rome Univ., Italy

A. Neri, INFOCOM Dept., Rome Univ., Italy

G. Scarano, INFOCOM Dept., Rome Univ., Italy

D.J. Heeger, Dept. of Psychol., Stanford Univ., CA, USA

J.R. Bergen, Dept. of Psychol., Stanford Univ., CA, USA

V. Swarnakar, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA

R.S. Acharya, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA

Xiangmin Zhang, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA

S.M. Collins, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA

M. Sonka, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA