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  • 1995
  • 1995 International Conference on Image Processing (ICIP'95) - Volume 3
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1995 International Conference on Image Processing (ICIP'95) - Volume 3
Washington D.C.
October 23-October 26
ISBN: 0-8186-7310-9
Table of Contents
V. Caselles, Dept. of Math. & Comput. Sci., Universidad les Illes Balears, Palma, Spain
pp. 3009
O. Faugeras, Inst. Nat. de Recherche en Inf. et Autom., Valbonne, France
R. Keriven, Inst. Nat. de Recherche en Inf. et Autom., Valbonne, France
pp. 3013
A. Kumar, Dept. of Aerosp. & Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A. Tannenbaum, Dept. of Aerosp. & Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
G. Balas, Dept. of Aerosp. & Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 3017
S. Soatto, California Inst. of Technol., Pasadena, CA, USA
P. Perona, California Inst. of Technol., Pasadena, CA, USA
pp. 3021
Huy Phan, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
K.D. Sauer, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 3029
N.J. Dusaussoy, Adv. Res. & Applications Corp., Sunnyvale, CA, USA
Qizhi Cao, Adv. Res. & Applications Corp., Sunnyvale, CA, USA
R.N. Yancey, Adv. Res. & Applications Corp., Sunnyvale, CA, USA
J.H. Stanley, Adv. Res. & Applications Corp., Sunnyvale, CA, USA
pp. 3033
R. Gupta, Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA
A. Noble, Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA
R. Hartley, Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA
J. Mundy, Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA
A. Schmitz, Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA
pp. 3037
D. Zhao, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
Y. Chen, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
B. Li, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
C. Zhao, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
X. Wang, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
X. Zhang, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
J. Chen, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
C. Tu, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
pp. 3045
S.M. Pandit, Dept. of Mech. Eng. & Eng. Mech., Michigan Technol. Univ., Houghton, MI, USA
R. Guo, Dept. of Mech. Eng. & Eng. Mech., Michigan Technol. Univ., Houghton, MI, USA
pp. 3049
Qian Huang, Siemens Corp. Res. Inc., Princeton, NJ, USA
B. Dom, Siemens Corp. Res. Inc., Princeton, NJ, USA
pp. 3053
M. Venkatraman, Center of Excellence in Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
V. Govindaraju, Center of Excellence in Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
pp. 3057
M.L.G. Althouse, Edgewood Res. Dev. & Eng. Center, US Army Chem. & Biol. Defense Command, Aberdeen Proving Ground, MD, USA
Chein-I Chang, Edgewood Res. Dev. & Eng. Center, US Army Chem. & Biol. Defense Command, Aberdeen Proving Ground, MD, USA
pp. 3061
T. Shimbashi, Res. Center, Sony Corp., Tokyo, Japan
Y. Kokubo, Res. Center, Sony Corp., Tokyo, Japan
N. Shirota, Res. Center, Sony Corp., Tokyo, Japan
pp. 3065
Yang Wang, Dept. of Comput. Sci. & Eng., Nebraska Univ., Lincoln, NE, USA
P. Bhattacharya, Dept. of Comput. Sci. & Eng., Nebraska Univ., Lincoln, NE, USA
pp. 3069
Xin Cai, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
P.A. Kelly, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
Wei-Bo Gong, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
pp. 3073
H. Jafarkhani, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
N. Farvardin, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 3081
Innho Jee, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
R.A. Haddad, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
pp. 3085
N. Chaddha, Comput. Syst. Lab., Stanford Univ., CA, USA
P.A. Chou, Comput. Syst. Lab., Stanford Univ., CA, USA
T.H.Y. Meng, Comput. Syst. Lab., Stanford Univ., CA, USA
pp. 3089
Xiaolin Wu, Dept. of Comput. Sci., Univ. of Western Ontario, London, Ont., Canada
pp. 3093
N. Memon, Dept. of Comput. Sci., Northern Illinois Univ., DeKalb, IL, USA
K. Sayood, Dept. of Comput. Sci., Northern Illinois Univ., DeKalb, IL, USA
pp. 3097
M. Quweider, Dept. of Electr. Eng., Toledo Univ., OH, USA
E. Salari, Dept. of Electr. Eng., Toledo Univ., OH, USA
pp. 3101
Qi Li, Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA
P.F. Swaszek, Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 3105
R.L. Joshi, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
T.R. Fischer, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
R.H. Bamberger, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 3109
Zhigang Fan, Xerox Corp., Webster, NY, USA
Fu Li, Xerox Corp., Webster, NY, USA
pp. 3113
L. Akarun, Dept. of Comput. Eng., Bogazici Univ., Istanbul, Turkey
Y. Yardimci, Dept. of Comput. Eng., Bogazici Univ., Istanbul, Turkey
A. Enis Cetin, Dept. of Comput. Eng., Bogazici Univ., Istanbul, Turkey
pp. 3125
G. Wolberg, Dept. of Comput. Sci., City Univ. of New York, NY, USA
R.P. Loce, Dept. of Comput. Sci., City Univ. of New York, NY, USA
pp. 3129
K. Kotani, JAIST, Ishikawa, Japan
Q. Gan, JAIST, Ishikawa, Japan
M. Miyahara, JAIST, Ishikawa, Japan
V.R. Algazi, JAIST, Ishikawa, Japan
pp. 3133
Daechul Park, Dept. of Inf. & Commun. Eng., Hannam Univ., Taejeon, South Korea
Kyungtae Kim, Dept. of Inf. & Commun. Eng., Hannam Univ., Taejeon, South Korea
Cheonhee Lee, Dept. of Inf. & Commun. Eng., Hannam Univ., Taejeon, South Korea
Jungyoung Son, Dept. of Inf. & Commun. Eng., Hannam Univ., Taejeon, South Korea
Yongbeom Lee, Dept. of Inf. & Commun. Eng., Hannam Univ., Taejeon, South Korea
pp. 3137
H.D. Cheng, Dept. of Comput. Sci., Utah State Univ., Logan, UT, USA
C.H. Chen, Dept. of Comput. Sci., Utah State Univ., Logan, UT, USA
R.I. Freimanis, Dept. of Comput. Sci., Utah State Univ., Logan, UT, USA
pp. 3141
M.H. Loew, Dept. of Electr. Eng. & Comput. Sci., George Washington Univ., Washington, DC, USA
R.S. Mia, Dept. of Electr. Eng. & Comput. Sci., George Washington Univ., Washington, DC, USA
pp. 3145
P. Sajda, David Sarnoff Res. Center, Princeton, NJ, USA
C. Spence, David Sarnoff Res. Center, Princeton, NJ, USA
J. Pearson, David Sarnoff Res. Center, Princeton, NJ, USA
pp. 3149
H. Yoshida, Dept. of Radiol., Chicago Univ., IL, USA
Wei Zhang, Dept. of Radiol., Chicago Univ., IL, USA
Weidong Cai, Dept. of Radiol., Chicago Univ., IL, USA
K. Doi, Dept. of Radiol., Chicago Univ., IL, USA
R.M. Nishikawa, Dept. of Radiol., Chicago Univ., IL, USA
M.L. Giger, Dept. of Radiol., Chicago Univ., IL, USA
pp. 3152
N. Vujovic, Dept. of Comput. Sci. & Electr. Eng., Lehigh Univ., Bethlehem, PA, USA
D. Brzakovic, Dept. of Comput. Sci. & Electr. Eng., Lehigh Univ., Bethlehem, PA, USA
pp. 3156
R.W. Mackin, Jr., Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
B. Roysam, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
J.N. Turner, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 3160
S.L. Wood, Santa Clara Univ., CA, USA
Gongyuan Qu, Santa Clara Univ., CA, USA
L.W. Roloff, Santa Clara Univ., CA, USA
pp. 3164
P. Thuman-Commike, Program in Structural & Comput. Biol. & Molecular Biophys.,
W. Chiu, Program in Structural & Comput. Biol. & Molecular Biophys.,
pp. 3168
H. Ancin, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
T.E. Dufresne, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
G.M. Ridder, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
J.N. Turner, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
B. Roysam, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 3172
A.H. Delaney, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
Y. Bresler, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 3176
J. Ribas-Corbera, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
D.L. Neuhoff, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3180
W.C. Chung, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
F. Kossentini, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
M.J.T. Smith, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 3184
A. Fuldseth, Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
T.A. Ramstad, Dept. of Telecommun., Norwegian Inst. of Technol., Trondheim, Norway
pp. 3188
L. Vandendorpe, Commun. & Remote Sensing Lab., Catholique Univ. Leuven, Belgium
L. Cuvelier, Commun. & Remote Sensing Lab., Catholique Univ. Leuven, Belgium
B. Maison, Commun. & Remote Sensing Lab., Catholique Univ. Leuven, Belgium
pp. 3192
O. Egger, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
T. Ebrahimi, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 3196
D. Wei, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
J.E. Odegard, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
H. Guo, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
M. Lang, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
C.S. Burrus, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 3200
J.D. Gorman, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
M.J. Horowitz, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
D.L. Neuhoff, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
S.A.S. Werness, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
pp. 3204
Hoon Paek, Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea
Jong-Wook Park, Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea
Sang-Uk Lee, Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea
pp. 3208
D.L. Tull, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
A.K. Katsaggelos, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
pp. 3212
F. Muller, Inst. fur Elektrische Nachrichtentech., Aachen Univ. of Technol., Germany
K. Illgner, Inst. fur Elektrische Nachrichtentech., Aachen Univ. of Technol., Germany
pp. 3216
M. Corvi, Central Res. Dept., Elsag Bailey, Genova, Italy
G. Nicchiotti, Central Res. Dept., Elsag Bailey, Genova, Italy
pp. 3224
P. Thevenaz, Nat. Inst. of Health, Bethesda, MD, USA
U.E. Ruttimann, Nat. Inst. of Health, Bethesda, MD, USA
M. Unser, Nat. Inst. of Health, Bethesda, MD, USA
pp. 3228
I. Koren, Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
A. Laine, Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
F. Taylor, Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
pp. 3232
Hui Li, HNC Inc., San Diego, CA, USA
Yi-Tong Zhou, HNC Inc., San Diego, CA, USA
pp. 3240
Y. Nakazawa, Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
T. Komatsu, Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
T. Saito, Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
pp. 3244
L.J. Chipman, Intergraph Corp., Huntsville, AL, USA
T.M. Orr, Intergraph Corp., Huntsville, AL, USA
L.N. Graham, Intergraph Corp., Huntsville, AL, USA
pp. 3248
T. Kanungo, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
R.M. Haralick, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 3256
K.U. Barthel, Inst. fur Fernmeldetechnik, Tech. Univ. Berlin, Germany
T. Voye, Inst. fur Fernmeldetechnik, Tech. Univ. Berlin, Germany
pp. 3260
D.M. Monro, Sch. of Electron. & Electr. Eng., Bath Univ., UK
J.A. Nicholls, Sch. of Electron. & Electr. Eng., Bath Univ., UK
pp. 3264
Chang-Su Kim, Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea
Rin-Chul Kim, Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea
Sang-Uk Lee, Dept. of Control & Instrum. Eng., Seoul Nat. Univ., South Korea
pp. 3268
S.A. Rizvi, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
N.M. Nasrabadi, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
Lin-Cheng Wang, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 3272
Y. Zhang, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
L.-M. Po, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 3276
B. Hurtgen, Inst. fur Elektrische Nachrichtentechnik, Rheinisch-Westfalische Tech. Hochschule (RWTH) Aachen, Germany
pp. 3280
F. Davoine, Lab. TIMC-IMAG, IAB, La Tronche Cedex, France
J. Svensson, Lab. TIMC-IMAG, IAB, La Tronche Cedex, France
J.-M. Chassery, Lab. TIMC-IMAG, IAB, La Tronche Cedex, France
pp. 3284
S.A. Rizvi, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo,
Lin-Cheng Wang, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo,
N.M. Nasrabadi, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo,
pp. 3296
R.D. Romero, Imaging Syst. Lab., Carnegie Mellon Univ., Pittsburgh, PA, USA
R.H. Tibadeau, Imaging Syst. Lab., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 3300
A.K. Jain, Pattern Recognition & Image Proess. Lab., Michigan State Univ., East
Y. Zhong, Pattern Recognition & Image Proess. Lab., Michigan State Univ., East
pp. 3308
T. Hong, Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
J.J. Hull, Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
pp. 3312
H.P. Graf, AT&T Bell Labs., Holmdel, NJ, USA
C.J.C. Burges, AT&T Bell Labs., Holmdel, NJ, USA
E. Cosatto, AT&T Bell Labs., Holmdel, NJ, USA
C.R. Nohl, AT&T Bell Labs., Holmdel, NJ, USA
pp. 3316
P. Pedrazzi, Elsag Bailey-Finmeccanica S.p.A., Genova, Italy
A.M. Colla, Elsag Bailey-Finmeccanica S.p.A., Genova, Italy
pp. 3320
V. Govindaraju, Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
S.N. Srihari, Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
pp. 3324
Jianchang Mao, IBM Almaden Res. Center, San Jose, CA, USA
K. Mohiuddin, IBM Almaden Res. Center, San Jose, CA, USA
pp. 3328
C. Dorai, Dept. of Comput. Sci., Michigan State Univ., East Lansing, MI, USA
A.K. Jain, Dept. of Comput. Sci., Michigan State Univ., East Lansing, MI, USA
pp. 3340
L. Legrand, Inf. Med., Bourgogne Univ., Dijon, France
K. Khalil, Inf. Med., Bourgogne Univ., Dijon, France
A. Dipanda, Inf. Med., Bourgogne Univ., Dijon, France
pp. 3344
T. Suk, Inst. of Inf. Theory & Autom., Czech Acad. of Sci., Prague, Czech Republic
J. Flusser, Inst. of Inf. Theory & Autom., Czech Acad. of Sci., Prague, Czech Republic
pp. 3348
W. Niblack, IBM Almaden Res. Center, San Jose, CA, USA
J. Yin, IBM Almaden Res. Center, San Jose, CA, USA
pp. 3352
L. Van Gool, ESAT-M12, Katholieke Univ., Leuven, Belgium
T. Moons, ESAT-M12, Katholieke Univ., Leuven, Belgium
M. Proesmans, ESAT-M12, Katholieke Univ., Leuven, Belgium
A. Oosterlinck, ESAT-M12, Katholieke Univ., Leuven, Belgium
pp. 3356
K. Siddiqi, Div. of Eng., Brown Univ., Providence, RI, USA
F. Subrahmonia, Div. of Eng., Brown Univ., Providence, RI, USA
D. Cooper, Div. of Eng., Brown Univ., Providence, RI, USA
B.B. Kimia, Div. of Eng., Brown Univ., Providence, RI, USA
pp. 3360
M. Hatef, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
J. Kittler, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
pp. 3364
J. Ben-Arie, Comput. Vision & Neural Networks Lab., Illinois Inst. of Technol., Chicago, IL, USA
K. Raghunath Rao, Comput. Vision & Neural Networks Lab., Illinois Inst. of Technol., Chicago, IL, USA
Zhiqian Wang, Comput. Vision & Neural Networks Lab., Illinois Inst. of Technol., Chicago, IL, USA
pp. 3368
S. Jaggi, MIT, Cambridge, MA, USA
A.S. Willsky, MIT, Cambridge, MA, USA
W.C. Karl, MIT, Cambridge, MA, USA
S. Mallat, MIT, Cambridge, MA, USA
pp. 3372
K.C. Wong, Sch. of Appl. Sci., Nanyang Technol. Univ., Singapore
H.C. Sim, Sch. of Appl. Sci., Nanyang Technol. Univ., Singapore
J. Kittler, Sch. of Appl. Sci., Nanyang Technol. Univ., Singapore
pp. 3376
M. Khansari, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
M. Vetterli, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 3380
Xiaohong Wang, Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont., Canada
S.D. Blostein, Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont., Canada
pp. 3384
A. Ortega, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
M. Khansari, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 3388
Liang-Jin Lin, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
A. Ortega, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
C.-C.J. Kuo, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 3392
A. Eleftheriadis, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
D. Anastassiou, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
pp. 3396
E. Ayanoglu, AT&T Bell Labs., Holmdel, NJ, USA
P. Pancha, AT&T Bell Labs., Holmdel, NJ, USA
A.R. Reibman, AT&T Bell Labs., Holmdel, NJ, USA
pp. 3400
Y. Nakajima, Visual Commun. Group, KDD Kamifukuoka R&D; Labs., Saitama, Japan
H. Hori, Visual Commun. Group, KDD Kamifukuoka R&D; Labs., Saitama, Japan
T. Kanoh, Visual Commun. Group, KDD Kamifukuoka R&D; Labs., Saitama, Japan
pp. 3408
Ligang Lu, Dept. of Electr., Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
W.A. Pearlman, Dept. of Electr., Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 3412
M. Trumbo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J. Vaisey, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 3416
Tsi-Yi Chao, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Hsueh-Ming Hang, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 3420
Yuk-Hee Chan, Dept. of Electron. Eng., Hong Kong Polytech. Univ., Hong Kong
Wan-Chi Siu, Dept. of Electron. Eng., Hong Kong Polytech. Univ., Hong Kong
pp. 3424
S.L. Wood, Santa Clara Univ., CA, USA
Xiaozhong Yao, Santa Clara Univ., CA, USA
K. Krishnamurthi, Santa Clara Univ., CA, USA
L. Dang, Santa Clara Univ., CA, USA
pp. 3428
S.-L. Leung, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
P.-C. Chee, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
C. Chan, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
Q. Huo, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
pp. 3432
M.H. Shirali-Shahreza, Dept. of Electr. Eng., Amirkabir Univ. of Technol., Tehran, Iran
K. Faez, Dept. of Electr. Eng., Amirkabir Univ. of Technol., Tehran, Iran
A. Khotanzad, Dept. of Electr. Eng., Amirkabir Univ. of Technol., Tehran, Iran
pp. 3436
Y.B. Karasik, Sch. of Comput. Sci., Carleton Univ., Ottawa, Ont., Canada
pp. 3440
V. Valero, Dipartimento de Inf, Escuela Politecnica de Albacete, Spain
F. Cuartero, Dipartimento de Inf, Escuela Politecnica de Albacete, Spain
A. Garrido, Dipartimento de Inf, Escuela Politecnica de Albacete, Spain
F. Quiles, Dipartimento de Inf, Escuela Politecnica de Albacete, Spain
pp. 3448
Jongwoo Bae, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
V.K. Prasanna, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 3452
E. Morimatsu, Fujitsu Labs. Ltd., Kawasaki, Japan
K. Sakai, Fujitsu Labs. Ltd., Kawasaki, Japan
K. Yamashita, Fujitsu Labs. Ltd., Kawasaki, Japan
M. Ohta, Fujitsu Labs. Ltd., Kawasaki, Japan
H. Miyasaka, Fujitsu Labs. Ltd., Kawasaki, Japan
K. Maeda, Fujitsu Labs. Ltd., Kawasaki, Japan
H. Ogura, Fujitsu Labs. Ltd., Kawasaki, Japan
N. Takeshita, Fujitsu Labs. Ltd., Kawasaki, Japan
pp. 3456
R.G. Kermode, Media Lab., MIT, Cambridge, MA, USA
A.B. Lippman, Media Lab., MIT, Cambridge, MA, USA
pp. 3460
Hongche Liu, Div. of Intelligent Syst., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
Tsai-Hong Hong, Div. of Intelligent Syst., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
M. Herman, Div. of Intelligent Syst., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
R. Chellappa, Div. of Intelligent Syst., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
pp. 3464
B. Due, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
P. Schroeter, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
J. Bigun, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 3472
Kui Zhang, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
M. Bober, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
J. Kittler, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
pp. 3476
S.N. Gupta, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
J.L. Prince, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
pp. 3484
M. Maurizot, IRISA, Rennes, France
P. Bouthemy, IRISA, Rennes, France
B. Delyon, IRISA, Rennes, France
A. Juditski, IRISA, Rennes, France
J.M. Odobez, IRISA, Rennes, France
pp. 3488
Jian Feng, Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
Kwok-Tung Lo, Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
H. Mehrpour, Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
A.E. Karbowiak, Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
pp. 3496
D.H. Kil, Signal Process. Center of Technol., Sanders Associates Inc., Nashua, NH, USA
F.B. Shin, Signal Process. Center of Technol., Sanders Associates Inc., Nashua, NH, USA
pp. 3500
P. Lau, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
N.P. Papanikolopoulos, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 3504
Jin Li, University of Southern California
Sungook Kim, University of Southern California
C.-C. Jay Kuo, University of Southern California
pp. 3508
B. Moghaddam, Media Lab., MIT, Cambridge, MA, USA
A. Pentland, Media Lab., MIT, Cambridge, MA, USA
pp. 3512
T. Wagner, Fraunhofer Inst. for Integrated Circuits, Erlangen, Germany
U. Dieckmann, Fraunhofer Inst. for Integrated Circuits, Erlangen, Germany
pp. 3516
Yuanzhong Li, Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
H. Kobatake, Fac. of Technol., Tokyo Univ. of Agric. & Technol., Japan
pp. 3520
T. Nguyen, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
T. Huang, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 3524
J.R. Smith, Center for Telecommun. Res., Columbia Univ., New York, NY, USA
Shih-Fu Chang, Center for Telecommun. Res., Columbia Univ., New York, NY, USA
pp. 3528
C. Toklu, Dept. of Electr. Eng., Rochester Univ., NY, USA
A. Tanju Erdem, Dept. of Electr. Eng., Rochester Univ., NY, USA
M. Ibrahim Sezan, Dept. of Electr. Eng., Rochester Univ., NY, USA
A. Murat Tekalp, Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 3536
Jianhua Xuan, Dept. of Electr. Eng., Maryland Univ., Baltimore, MD, USA
T. Adali, Dept. of Electr. Eng., Maryland Univ., Baltimore, MD, USA
Yue Wang, Dept. of Electr. Eng., Maryland Univ., Baltimore, MD, USA
pp. 3544
T. Geraud, Dept. Images, ENST, Paris, France
J.-F. Mangin, Dept. Images, ENST, Paris, France
I. Bloch, Dept. Images, ENST, Paris, France
H. Maitre, Dept. Images, ENST, Paris, France
pp. 3548
R. Meier, Bielefeld Univ., Germany
F. Ackermann, Bielefeld Univ., Germany
G. Herrmann, Bielefeld Univ., Germany
S. Posch, Bielefeld Univ., Germany
G. Sagerer, Bielefeld Univ., Germany
pp. 3552
R.R. Rao, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 3556
C. Schillo, Bielefeld Univ., Germany
G. Herrmann, Bielefeld Univ., Germany
F. Ackermann, Bielefeld Univ., Germany
S. Posch, Bielefeld Univ., Germany
G. Sagerer, Bielefeld Univ., Germany
pp. 3560
E.A. Ashton, Dept. of Electr. Eng., Rochester Univ., NY, USA
K.J. Parker, Dept. of Electr. Eng., Rochester Univ., NY, USA
M.J. Berg, Dept. of Electr. Eng., Rochester Univ., NY, USA
Chang Wen Chen, Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 3564
S. Krishnamachari, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
R. Chellappa, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 3568
P. Bonnin, Univ. de Paris-Nord, Villetaneuse, France
B. Hoeltzener-Douarin, Univ. de Paris-Nord, Villetaneuse, France
E. Pissaloux, Univ. de Paris-Nord, Villetaneuse, France
pp. 3572
Wanqing Li, Centre for Intelligent Inf. Process. Syst., Western Australia Univ., Nedlands, WA, Australia
M. Morrison, Centre for Intelligent Inf. Process. Syst., Western Australia Univ., Nedlands, WA, Australia
Y. Attikiouzel, Centre for Intelligent Inf. Process. Syst., Western Australia Univ., Nedlands, WA, Australia
pp. 3576
R. Bernardini, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
J. Kovacevic, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 3580
F. Marques, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
B. Llorens, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
A. Gasull, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 3584
L. Torres, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
J.R. Casas, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
J. Campins, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 3588
Tian-Hu Yu, Dept. of Inf. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
pp. 3592
H. Lin, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
A.N. Venetsanopoulos, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
pp. 3596
H.R. Rabiee, Dept. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
R.L. Kashyap, Dept. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
H. Radha, Dept. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 3600
A.S. Khayrallah, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
pp. 3604
S. Moni, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
R.L. Kashyap, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 3608
C.S. Regazzoni, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
G. Foresti, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
A.N. Venetsanopoulos, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 3612
O. Egger, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
M. Kunt, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 3616
G. Sapiro, Hewlett-Packard Labs., Palo Alto, CA, USA
V. Caselles, Hewlett-Packard Labs., Palo Alto, CA, USA
pp. 3632
A.N. Rajagopalan, Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
S. Chaudhuri, Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
pp. 3636
Zhi-Yan Xie, Dept. of Eng. Sci., Oxford Univ., UK
M.J. Brady, Dept. of Eng. Sci., Oxford Univ., UK
pp. 3640
G. Jacovitti, INFOCOM Dept., Rome Univ., Italy
A. Neri, INFOCOM Dept., Rome Univ., Italy
G. Scarano, INFOCOM Dept., Rome Univ., Italy
pp. 3644
D.J. Heeger, Dept. of Psychol., Stanford Univ., CA, USA
J.R. Bergen, Dept. of Psychol., Stanford Univ., CA, USA
pp. 3648
V. Swarnakar, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
R.S. Acharya, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 3652
Xiangmin Zhang, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
S.M. Collins, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
M. Sonka, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
pp. 3656
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