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  • 1995 International Conference on Image Processing (ICIP'95) - Volume 2
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1995 International Conference on Image Processing (ICIP'95) - Volume 2
Washington D.C.
October 23-October 26
ISBN: 0-8186-7310-9
Table of Contents
E. Cordonnier, CERIUM Fac. of Med., Rennes I Univ., France
M. Eichelberg, CERIUM Fac. of Med., Rennes I Univ., France
J. Piqueras, CERIUM Fac. of Med., Rennes I Univ., France
C. Treguier, CERIUM Fac. of Med., Rennes I Univ., France
J.-F. Heautot, CERIUM Fac. of Med., Rennes I Univ., France
pp. 2001
R.M. Gray, Dept. of Electr. Eng., Stanford Univ., CA, USA
R.A. Olshen, Dept. of Electr. Eng., Stanford Univ., CA, USA
D. Ikeda, Dept. of Electr. Eng., Stanford Univ., CA, USA
P.C. Cosman, Dept. of Electr. Eng., Stanford Univ., CA, USA
S. Perlmutter, Dept. of Electr. Eng., Stanford Univ., CA, USA
C. Nash, Dept. of Electr. Eng., Stanford Univ., CA, USA
K. Perlmutter, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 2005
S.-C.B. Lo, ISIS Centre, Georgetown Univ., Washington, DC, USA
Huai Li, ISIS Centre, Georgetown Univ., Washington, DC, USA
B.H. Krasner, ISIS Centre, Georgetown Univ., Washington, DC, USA
M.T. Freedman, ISIS Centre, Georgetown Univ., Washington, DC, USA
S.K. Mun, ISIS Centre, Georgetown Univ., Washington, DC, USA
pp. 2009
B.J. Sullivan, Ameritech, Hoffman Estates, IL, USA
R. Ansari, Ameritech, Hoffman Estates, IL, USA
M.L. Giger, Ameritech, Hoffman Estates, IL, USA
H. MacMahon, Ameritech, Hoffman Estates, IL, USA
pp. 2013
M.T. Orchard, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
A. Nosratinia, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
R. Rajagopalan, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 2017
H.S. Wong, Dept. of Electr. Eng., Sydney Univ., NSW, Australia
L. Guan, Dept. of Electr. Eng., Sydney Univ., NSW, Australia
H. Hong, Dept. of Electr. Eng., Sydney Univ., NSW, Australia
pp. 2021
P.L. Combettes, Dept. of Electr. Eng., City Univ. of New York, NY, USA
pp. 2025
M. Muneyasu, Fac. of Eng., Hiroshima Univ., Japan
K. Yamamoto, Fac. of Eng., Hiroshima Univ., Japan
T. Hinamoto, Fac. of Eng., Hiroshima Univ., Japan
pp. 2033
H. Ahn, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
A.E. Yagle, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2037
M.K. Ng, Comput. Sci. Lab., Australian Nat. Univ., Canberra, ACT, Australia
pp. 2041
P.K. Nanda, Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
K. Sunil Kumar, Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
S. Ghokale, Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
U.B. Desai, Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
pp. 2045
P. Richardson, Dept. of Electr. & Comput. Syst. Eng., Monash Univ., Clayton, Vic., Australia
D. Suter, Dept. of Electr. & Comput. Syst. Eng., Monash Univ., Clayton, Vic., Australia
pp. 2049
F. Alajaji, Dept. of Math. & Stat., Queen's Univ., Kingston, Ont., Canada
P. Burlina, Dept. of Math. & Stat., Queen's Univ., Kingston, Ont., Canada
pp. 2053
H. Aydinoglu, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
F. Kossentini, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Qin Jiang, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.H. Hayes, III, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2057
M. Effros, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
P.A. Chou, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 2061
T.P. O'Rourke, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
R.L. Stevenson, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
Yih-Fang Huang, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
D.J. Costello, Jr., Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2065
S.J.P. Westen, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
R.L. Lagendijk, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
J. Biemond, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 2069
Chia-Yuan Teng, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
D.L. Neuhoff, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2073
M.J. Ruf, Inst. for Commun. Technol., German Aerosp. Res. Establ., Wessling, Germany
J.W. Modestino, Inst. for Commun. Technol., German Aerosp. Res. Establ., Wessling, Germany
pp. 2077
R.A. Vander Kam, Dept. of Electr. Eng., Stanford Univ., CA, USA
Ping Wah Wong, Dept. of Electr. Eng., Stanford Univ., CA, USA
R.M. Gray, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 2081
B. Belzer, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
J.D. Villasenor, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
B. Girod, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 2085
P. Liu, Sch. of Appl. Sci., Nanyang Technol. Univ., Singapore
M.N. Chong, Sch. of Appl. Sci., Nanyang Technol. Univ., Singapore
W.B. Goh, Sch. of Appl. Sci., Nanyang Technol. Univ., Singapore
pp. 2089
K.D. Sauer, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
S. Borman, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
C.A. Bouman, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2093
R.W. Hall, Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
Chih-Yuan Hu, Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
pp. 2097
A. Moga, Signal Process. Lab., Tampere Univ. of Technol., Finland
B. Cramariuc, Signal Process. Lab., Tampere Univ. of Technol., Finland
M. Gabbouj, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 2101
N. Steffensen, Motorola Inc., Phoenix, AZ, USA
N. Bourbakis, Motorola Inc., Phoenix, AZ, USA
pp. 2109
B. Olstad, Div. of Comput. Syst. & Telematics, Norwegian Inst. of Technol., Trondheim, Norway
E. Steen, Div. of Comput. Syst. & Telematics, Norwegian Inst. of Technol., Trondheim, Norway
A. Halaas, Div. of Comput. Syst. & Telematics, Norwegian Inst. of Technol., Trondheim, Norway
pp. 2113
Kyung Sub Joo, Dept. of Electr. Eng., Colorado Univ., Denver, CO, USA
T. Bose, Dept. of Electr. Eng., Colorado Univ., Denver, CO, USA
pp. 2117
KyungHi Chang, Electron. & Telecommun. Res. Inst., Taejon, South Korea
XuDuan Lin, Electron. & Telecommun. Res. Inst., Taejon, South Korea
pp. 2121
R. Oten, Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
R.J.P. de Figueiredo, Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
pp. 2125
Yiu-Fai Wong, Div. of Eng., Texas Univ., San Antonio, TX, USA
E. Viscito, Div. of Eng., Texas Univ., San Antonio, TX, USA
E. Linzer, Div. of Eng., Texas Univ., San Antonio, TX, USA
pp. 2129
Young-Ho Lee, Graduate Sch. of Inf. Sci., Tohoku Univ., Sendai, Japan
M. Kawamata, Graduate Sch. of Inf. Sci., Tohoku Univ., Sendai, Japan
T. Higuchi, Graduate Sch. of Inf. Sci., Tohoku Univ., Sendai, Japan
pp. 2133
Yuping Wang, Sch. of Electron. & Inf. Eng., Xi'an Jiaotong Univ., China
Yuanlong Cai, Sch. of Electron. & Inf. Eng., Xi'an Jiaotong Univ., China
pp. 2145
M. Das, Dept. of Electr. & Syst. Eng., Oakland Univ., Rochester, MI, USA
J. Anand, Dept. of Electr. & Syst. Eng., Oakland Univ., Rochester, MI, USA
pp. 2149
Zhiqian Wang, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
K. Raghunath Rao, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
J. Ben-Arie, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 2153
N. Nikolaidis, Dept. of Electr. Comput. Eng., Thessaloniki Univ., Greece
I. Pitas, Dept. of Electr. Comput. Eng., Thessaloniki Univ., Greece
pp. 2157
Hui Li, HNC Software Inc., San Diego, CA, USA
Yi-Tong Zhou, HNC Software Inc., San Diego, CA, USA
pp. 2161
S.S. Ganugapati, Fac. of Eng. & Appl. Sci., Memorial Univ. of Newfoundland, St. John's, Nfld., Canada
C.R. Moloney, Fac. of Eng. & Appl. Sci., Memorial Univ. of Newfoundland, St. John's, Nfld., Canada
pp. 2165
D. Demigny, ENSEA-UCP, Cergy Pontoise, France
F.G. Lorca, ENSEA-UCP, Cergy Pontoise, France
L. Kessal, ENSEA-UCP, Cergy Pontoise, France
pp. 2169
A. Restrepo, Univ. de Los Andes, Bogota, Colombia
A. Naranjo, Univ. de Los Andes, Bogota, Colombia
M. Valderrama, Univ. de Los Andes, Bogota, Colombia
M. Daniels, Univ. de Los Andes, Bogota, Colombia
R. de la Vega, Univ. de Los Andes, Bogota, Colombia
pp. 2173
M. Sun, Dept. of Neurology, Pittsburgh Univ., PA, USA
R.J. Sclabassi, Dept. of Neurology, Pittsburgh Univ., PA, USA
pp. 2177
Y. Wang, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
X.-M. Hsieh, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
J.-H. Hu, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
O. Lee, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
pp. 2185
V.-N. Dang, INRS Telecommun., Ile des Soeurs, Que., Canada
A.-R. Mansouri, INRS Telecommun., Ile des Soeurs, Que., Canada
J. Konrad, INRS Telecommun., Ile des Soeurs, Que., Canada
pp. 2189
J.L. Barron, Dept. of Comput. Sci., Univ. of Western Ontario, London, Ont., Canada
R. Eagleson, Dept. of Comput. Sci., Univ. of Western Ontario, London, Ont., Canada
pp. 2193
M. Karczewicz, Signal Process. Lab., Tampere Univ. of Technol., Finland
J. Nieweglowski, Signal Process. Lab., Tampere Univ. of Technol., Finland
P. Haavisto, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 2197
N. Vasconcelos, Media Lab., MIT, Cambridge, MA, USA
A. Lippman, Media Lab., MIT, Cambridge, MA, USA
pp. 2201
Y. Wong, Integrated Syst. Lab., Texas Instrum. Inc., Dallas, TX, USA
pp. 2205
Yiu-Hung Fok, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
O.C. Au, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
R.D. Murch, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
pp. 2209
S.N. Efstratiadis, Inform. Process. Lab., Aristotelian Univ. of Thessaloniki, Greece
M.G. Strintzis, Inform. Process. Lab., Aristotelian Univ. of Thessaloniki, Greece
A.K. Katsaggelos, Inform. Process. Lab., Aristotelian Univ. of Thessaloniki, Greece
pp. 2213
A.N. Delopoulos, Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
A.G. Constantinides, Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 2217
T.J. Hebert, Dept. of Electr. & Comput. Eng., Houston Univ., TX, USA
X. Yang, Dept. of Electr. & Comput. Eng., Houston Univ., TX, USA
pp. 2221
S. Sista, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
C.A. Bouman, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
J.P. Allebach, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2225
R.S. Jasinschi, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.M.F. Moura, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 2229
L. Vandendorpe, UCL Telecommun. & Remote Sensing Lab., Louvain-la-Neuve, Belgium
P. Delogne, UCL Telecommun. & Remote Sensing Lab., Louvain-la-Neuve, Belgium
D. Boucquey, UCL Telecommun. & Remote Sensing Lab., Louvain-la-Neuve, Belgium
pp. 2237
B.K. Natarajan, Hewlett-Packard Co., Palo Alto, CA, USA
B. Vasudev, Hewlett-Packard Co., Palo Alto, CA, USA
pp. 2241
T. Mitsunaga, Sony Corp., Tokyo, Japan
T. Yokoyama, Sony Corp., Tokyo, Japan
T. Totsuka, Sony Corp., Tokyo, Japan
pp. 2248
K. Shen, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
E.J. Delp, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2252
W.Y. Ma, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
B.S. Manjunath, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 2256
B.-L. Yeo, Dept. of Electr. Eng., Princeton Univ., NJ, USA
B. Liu, Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 2260
C. Stiller, INRS Telecommun., Ile des Soeurs, Que., Canada
J. Konrad, INRS Telecommun., Ile des Soeurs, Que., Canada
pp. 2264
Y.-L. You, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
W. Xu, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
M. Kaveh, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A. Tannenbaum, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2268
T. Tjahjadi, Dept. of Eng., Warwick Univ., Coventry, UK
D. Litwin, Dept. of Eng., Warwick Univ., Coventry, UK
Y.-H. Yang, Dept. of Eng., Warwick Univ., Coventry, UK
pp. 2272
J.M. Francos, Dept. of Electr. & Comput. Eng., Ben-Gurion Univ. of the Negev, Beer-Sheva, Israel
B. Friedlander, Dept. of Electr. & Comput. Eng., Ben-Gurion Univ. of the Negev, Beer-Sheva, Israel
pp. 2276
J.P. Havlicek, Lab. for Vision Syst., Texas Univ., Austin, TX, USA
D.S. Harding, Lab. for Vision Syst., Texas Univ., Austin, TX, USA
A.C. Bovik, Lab. for Vision Syst., Texas Univ., Austin, TX, USA
pp. 2280
Z. Zhou, Dept. Electr. Eng., Signal & Image Process. Inst., Los Angeles, CA, USA
R. Leahy, Dept. Electr. Eng., Signal & Image Process. Inst., Los Angeles, CA, USA
pp. 2284
T. Kanungo, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
D.M. Gay, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
R.M. Haralick, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 2292
S.Z. Li, Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
Y.H. Huang, Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
J.S. Fu, Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
pp. 2296
H. Shekarforoush, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France
M. Berthod, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France
J. Zerubia, Inst. Nat. de Recherche en Inf. et Autom., Sophia Antipolis, France
pp. 2300
M.D. Gross, Coll. of Archit. & Planning, Colorado Univ., Boulder, CO, USA
E.Y.-L. Do, Coll. of Archit. & Planning, Colorado Univ., Boulder, CO, USA
pp. 2308
G. Stockman, Dept. of Comput. Sci., Michigan State Univ., East Lansing, MI, USA
J. Weng, Dept. of Comput. Sci., Michigan State Univ., East Lansing, MI, USA
pp. 2315
M. Wolski, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
C.A. Bouman, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
J.P. Allebach, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
E. Walowit, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2323
R. Balasubramanian, Xerox Digital Imaging Technol. Center, Webster, NY, USA
pp. 2327
Qian Lin, Hewlett-Packard Co., Palo Alto, CA, USA
pp. 2331
A. Sherstinsky, Media Lab., MIT, Cambridge, MA, USA
R.W. Picard, Media Lab., MIT, Cambridge, MA, USA
pp. 2335
J.R. Alford, Dept. of Electr. Eng. & Comput. Eng., Iowa State Univ., Ames, IA, USA
T. Mitsa, Dept. of Electr. Eng. & Comput. Eng., Iowa State Univ., Ames, IA, USA
pp. 2339
D.J. Heeger, Dept. of Psychol., Stanford Univ., CA, USA
P.C. Teo, Dept. of Psychol., Stanford Univ., CA, USA
pp. 2343
Je-Ho Lee, Div. of Electron. & Inf. Technol., Korea Inst. of Sci. & Technol., Seoul, South Korea
Yong-Moo Kwon, Div. of Electron. & Inf. Technol., Korea Inst. of Sci. & Technol., Seoul, South Korea
Hyoung-Gon Kim, Div. of Electron. & Inf. Technol., Korea Inst. of Sci. & Technol., Seoul, South Korea
pp. 2346
G.L. Grard, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
H.J. Trussell, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 2350
Tae-Eun Kim, Dept. of Electron. Eng., Chung-Ang Univ., Seoul, South Korea
Jong-Soo Choi, Dept. of Electron. Eng., Chung-Ang Univ., Seoul, South Korea
pp. 2354
F. Pedersini, Dipartimento di Elettronica e Inf., Politecnico di Milano, Italy
A. Sarti, Dipartimento di Elettronica e Inf., Politecnico di Milano, Italy
S. Tubaro, Dipartimento di Elettronica e Inf., Politecnico di Milano, Italy
pp. 2358
A.S. Bedekar, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
R.M. Haralick, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 2362
I.J. Cox, NEC Res. Inst., Princeton, NJ, USA
S. Roy, NEC Res. Inst., Princeton, NJ, USA
S.L. Hingorani, NEC Res. Inst., Princeton, NJ, USA
pp. 2366
P. Pochec, Fac. of Comput. Sci., New Brunswick Univ., Fredericton, NB, Canada
pp. 2370
M. Accame, Dept. of Electr. Eng., Genoa Univ., Italy
F.G.B. De Natale, Dept. of Electr. Eng., Genoa Univ., Italy
D.D. Giusto, Dept. of Electr. Eng., Genoa Univ., Italy
pp. 2374
B.L. Tseng, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
D. Anastassiou, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
pp. 2378
N. Grammalidis, Inf. Processing Lab., Aristotelian Univ. of Thessaloniki, Greece
D. Tzovarns, Inf. Processing Lab., Aristotelian Univ. of Thessaloniki, Greece
M.G. Strintzis, Inf. Processing Lab., Aristotelian Univ. of Thessaloniki, Greece
pp. 2382
B. Thomas, Naval Sci. & Technol., Visakhapatnam, India
B. Yegnanarayana, Naval Sci. & Technol., Visakhapatnam, India
S. Das, Naval Sci. & Technol., Visakhapatnam, India
pp. 2386
K. Schroder, Lehrstuhl fur Nachrichtentech., Dortmund Univ., Germany
R. Mech, Lehrstuhl fur Nachrichtentech., Dortmund Univ., Germany
pp. 2390
Y. Altunbasak, Dept. of Electr. Eng., Rochester Univ., NY, USA
A. Murat Tekalp, Dept. of Electr. Eng., Rochester Univ., NY, USA
G. Bozdagi, Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 2394
T. Saito, Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
T. Komatsu, Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
Y. Akimoto, Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
pp. 2402
L. Wu, La Chantrerie, Nantes, France
J. Benois-Pineau, La Chantrerie, Nantes, France
D. Barba, La Chantrerie, Nantes, France
pp. 2406
Xiaonong Ran, Nat. Semicond. Corp., Santa Clara, CA, USA
C.Y. Choo, Nat. Semicond. Corp., Santa Clara, CA, USA
pp. 2410
A. Eleftheriadis, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
A. Jacquin, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
pp. 2418
G. Caleagno, Dipartimento di Elettronica e Inf., Padova Univ., Italy
R. Rinaldo, Dipartimento di Elettronica e Inf., Padova Univ., Italy
pp. 2422
J.G. Apostolopoulos, Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.S. Lim, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 2426
B. Hall, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
H. Na, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
pp. 2433
E. Sutton, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
H. Na, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
pp. 2437
S.D. Booth, Dept. of Electr. Eng., Michigan Univ., Ann Arbor, MI, USA
J.A. Fessler, Dept. of Electr. Eng., Michigan Univ., Ann Arbor, MI, USA
pp. 2441
F. Rashid-Farrokhi, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
K.J.R. Liu, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
C.A. Berenstein, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
D. Walnut, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 2445
Chi-hsin Wu, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
P.C. Doerschuk, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2449
J.M.N. Leitao, Dept. de Engenharia Electrotecnica e de Comput., Inst. Superior Tecnico, Lisbon, Portugal
M.A.T. Figueiredo, Dept. de Engenharia Electrotecnica e de Comput., Inst. Superior Tecnico, Lisbon, Portugal
pp. 2453
J.M. Silkaitis, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
H. Lee, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 2457
A.E. Yagle, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2461
O. Monga, Inst. Nat. de Recherche en Inf. et Autom., Le Chesnay, France
N. Armande, Inst. Nat. de Recherche en Inf. et Autom., Le Chesnay, France
P. Montesinos, Inst. Nat. de Recherche en Inf. et Autom., Le Chesnay, France
pp. 2468
Y. Hode, FORENAP, Rouffach, France
A. Deruyver, FORENAP, Rouffach, France
B. Bendriem, FORENAP, Rouffach, France
N. Volkow, FORENAP, Rouffach, France
pp. 2472
R. Wasserman, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
R. Acharya, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
C. Sibata, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
K.H. Shin, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 2476
L.H. Staib, Dept. of Diagnostic Radiol., Yale Univ., New Haven, CT, USA
A. Sinusas, Dept. of Diagnostic Radiol., Yale Univ., New Haven, CT, USA
pp. 2480
R. Sammouda, Dept. of Inf. Sci., Tokushima Univ., Japan
N. Niki, Dept. of Inf. Sci., Tokushima Univ., Japan
H. Nishitani, Dept. of Inf. Sci., Tokushima Univ., Japan
pp. 2484
F.S. Cohen, Imaging & Comput. Vision Center, Drexel Univ., Philadelphia, PA, USA
G. Georgiou, Imaging & Comput. Vision Center, Drexel Univ., Philadelphia, PA, USA
pp. 2488
P. Clarysse, CREATIS, Inst. Nat. des Sci. Appliquees, Villeurbanne, France
F. Poupon, CREATIS, Inst. Nat. des Sci. Appliquees, Villeurbanne, France
B. Barbier, CREATIS, Inst. Nat. des Sci. Appliquees, Villeurbanne, France
I.E. Magnin, CREATIS, Inst. Nat. des Sci. Appliquees, Villeurbanne, France
pp. 2492
J.C. McEachen, II, Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
A. Nehorai, Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
J.S. Duncan, Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
pp. 2496
Y. Kawata, Dept. of Opt. Sci., Tokushima Univ., Japan
N. Niki, Dept. of Opt. Sci., Tokushima Univ., Japan
T. Kumazaki, Dept. of Opt. Sci., Tokushima Univ., Japan
pp. 2500
A. Mojsilovic, Fac. of Electr. Eng., Belgrade Univ., Serbia
M. Popovic, Fac. of Electr. Eng., Belgrade Univ., Serbia
A. Popovic, Fac. of Electr. Eng., Belgrade Univ., Serbia
A. Neskovic, Fac. of Electr. Eng., Belgrade Univ., Serbia
V. Obradovic, Fac. of Electr. Eng., Belgrade Univ., Serbia
pp. 2504
D. Keightley, Div. of Inf. Technol., CSIRO, Canberra, ACT, Australia
B.R. Hunt, Div. of Inf. Technol., CSIRO, Canberra, ACT, Australia
pp. 2508
V.Z. Mesarovic, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
N.P. Galatsanos, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
M.N. Wernick, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 2512
M. Vrhel, Nat. Centre for Res. Resources, Nat. Inst. of Health, Bethesda, MD, USA
B.L. Trus, Nat. Centre for Res. Resources, Nat. Inst. of Health, Bethesda, MD, USA
pp. 2516
A. Stajniak, Inst. of Control & Ind. Electron., Warsaw Univ. of Technol., Poland
J. Szostakowski, Inst. of Control & Ind. Electron., Warsaw Univ. of Technol., Poland
pp. 2520
Sung-Wai Hong, Dept. of Electron. Eng., Hong Kong Polytech. Univ., Hong Kong
Yuk-Hee Chan, Dept. of Electron. Eng., Hong Kong Polytech. Univ., Hong Kong
Wan-Chi Siu, Dept. of Electron. Eng., Hong Kong Polytech. Univ., Hong Kong
pp. 2523
Kook Yeon Kwak, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
R.A. Haddad, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
pp. 2527
Beng-Heok Tan, Sch. of Appl. Sci., Nanyang Technol. Univ., Singapore
A. Wahah, Sch. of Appl. Sci., Nanyang Technol. Univ., Singapore
Eng-Chong Tan, Sch. of Appl. Sci., Nanyang Technol. Univ., Singapore
pp. 2531
Jia-Guu Leu, Dept. of Stat., Nat. Chung-Hsing Univ., Taichung, Taiwan
pp. 2535
B.C. Tom, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
A.K. Katsaggelos, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
pp. 2539
G. Keesman, Philips Res. Lab., Eindhoven, Netherlands
A. Cotton, Philips Res. Lab., Eindhoven, Netherlands
D. Kessler, Philips Res. Lab., Eindhoven, Netherlands
J. De Lameillieure, Philips Res. Lab., Eindhoven, Netherlands
J.-P. Henot, Philips Res. Lab., Eindhoven, Netherlands
A. Nicoulin, Philips Res. Lab., Eindhoven, Netherlands
D. Kalivas, Philips Res. Lab., Eindhoven, Netherlands
pp. 2543
Fu-Huei Lin, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2547
Jia-Bao Cheng, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Hsueh-Ming Hang, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 2551
J. Katto, Inf. Technol. Res. Labs., NEC Corp., Kanagawa, Japan
M. Ohta, Inf. Technol. Res. Labs., NEC Corp., Kanagawa, Japan
pp. 2555
T. Wiegand, Centre for Inf. Process. Res., California Univ., Santa Barbara, CA, USA
M. Lightstone, Centre for Inf. Process. Res., California Univ., Santa Barbara, CA, USA
T.G. Campbell, Centre for Inf. Process. Res., California Univ., Santa Barbara, CA, USA
S.K. Mitra, Centre for Inf. Process. Res., California Univ., Santa Barbara, CA, USA
pp. 2559
A. Nosratinia, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
M.T. Orchard, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 2563
G. Lilienfield, Centre for Image Process. Res., Rensselaer Polytech. Inst., Troy, NY, USA
J.W. Woods, Centre for Image Process. Res., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 2567
Tihao Chiang, David Sarnoff Res. Centre, SRI Int., Princeton, NJ, USA
Huifang Sun, David Sarnoff Res. Centre, SRI Int., Princeton, NJ, USA
J.W. Zdepski, David Sarnoff Res. Centre, SRI Int., Princeton, NJ, USA
pp. 2571
M. Nakamura, Dept. of Inf. Network Eng., Aichi Inst. of Technol., Toyota, Japan
K. Sawada, Dept. of Inf. Network Eng., Aichi Inst. of Technol., Toyota, Japan
pp. 2575
Tsuhan Chen, AT&T Bell Labs., Holmdel, NJ, USA
H.P. Graf, AT&T Bell Labs., Holmdel, NJ, USA
B. Haskell, AT&T Bell Labs., Holmdel, NJ, USA
E. Petajan, AT&T Bell Labs., Holmdel, NJ, USA
Yao Wang, AT&T Bell Labs., Holmdel, NJ, USA
H. Chen, AT&T Bell Labs., Holmdel, NJ, USA
Wu Chou, AT&T Bell Labs., Holmdel, NJ, USA
pp. 2579
Jiebo Luo, Dept. of Electr. Eng., Rochester Univ., NY, USA
Chang Wen Chen, Dept. of Electr. Eng., Rochester Univ., NY, USA
K.J. Parker, Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 2583
L. Strub, Dept. of Syst. Design Eng., Waterloo Univ., Ont., Canada
J. Robinson, Dept. of Syst. Design Eng., Waterloo Univ., Ont., Canada
pp. 2587
Tsuhan Chen, AT&T Bell Labs., Holmdel, NJ, USA
Yao Wang, AT&T Bell Labs., Holmdel, NJ, USA
H.P. Graf, AT&T Bell Labs., Holmdel, NJ, USA
C. Swain, AT&T Bell Labs., Holmdel, NJ, USA
pp. 2591
D.L. Swets, Michigan State Univ., East Lansing, MI, USA
B. Punch, Michigan State Univ., East Lansing, MI, USA
J. Weng, Michigan State Univ., East Lansing, MI, USA
pp. 2595
R. Lopez, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
T.S. Huang, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 2599
G. Galicia, California Univ., Berkeley, CA, USA
A. Zakhor, California Univ., Berkeley, CA, USA
pp. 2603
L.C. de Silva, Fac. of Eng., Tokyo Univ., Japan
M. Tahara, Fac. of Eng., Tokyo Univ., Japan
K. Aizawa, Fac. of Eng., Tokyo Univ., Japan
M. Hatori, Fac. of Eng., Tokyo Univ., Japan
pp. 2607
Chung-Lin Huang, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Wen-Yi Huang, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Cheng-Chang Lien, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 2611
Jun Zhang, Dept. of Electr. Eng. & Comput. Sci., Wisconsin Univ., Milwaukee, WI, USA
Jianhua Lin, Dept. of Electr. Eng. & Comput. Sci., Wisconsin Univ., Milwaukee, WI, USA
pp. 2615
A. Deruyver, Dept. d'Inf, IUT Strasbourg Sud, Illkirch, France
Y. Hode, Dept. d'Inf, IUT Strasbourg Sud, Illkirch, France
pp. 2619
G.C. Lai, Lab. for Machine Intelligence, Vision, & Neural Comput., California Univ., Irvine, CA, USA
R.J.P. De Figueiredo, Lab. for Machine Intelligence, Vision, & Neural Comput., California Univ., Irvine, CA, USA
pp. 2623
M.H. Davis, Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
A. Khotanzad, Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
D.P. Flamig, Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
S.E. Harms, Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
pp. 2627
D. Nair, Comput. & Vision Res. Center, Texas Univ., Austin, TX, USA
A. Mitiche, Comput. & Vision Res. Center, Texas Univ., Austin, TX, USA
J.K. Aggarwal, Comput. & Vision Res. Center, Texas Univ., Austin, TX, USA
pp. 2631
Zhibin Lei, Div. of Eng., Brown Univ., Providence, RI, USA
D. Keren, Div. of Eng., Brown Univ., Providence, RI, USA
D. Cooper, Div. of Eng., Brown Univ., Providence, RI, USA
pp. 2635
J. You, Sch. of Comput. & Inf. Sci., Univ. of South Australia, The Levels, SA, Australia
H.A. Cohen, Sch. of Comput. & Inf. Sci., Univ. of South Australia, The Levels, SA, Australia
E. Pissaloux, Sch. of Comput. & Inf. Sci., Univ. of South Australia, The Levels, SA, Australia
pp. 2639
Quang Minh Tieng, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
W.W. Boles, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
M. Deriche, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 2643
S. Sull, NASA Ames Res. Center, Moffett Field, CA, USA
B. Sridhar, NASA Ames Res. Center, Moffett Field, CA, USA
pp. 2647
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