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  • 1995 International Conference on Image Processing (ICIP'95) - Volume 1
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1995 International Conference on Image Processing (ICIP'95) - Volume 1
Washington D.C.
October 23-October 26
ISBN: 0-8186-7310-9
Table of Contents
J.E. Redford, Online Media, Cambridge, UK
K.S. Ruttle, Online Media, Cambridge, UK
T.M. Dobson, Online Media, Cambridge, UK
pp. 1
P. Salama, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
N.B. Shroff, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
E.J. Coyle, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
E.J. Delp, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 9
R.J. Safranek, AT&T Bell Labs., Murray Hill, NJ, USA
C.R. Kalmanek, Jr., AT&T Bell Labs., Murray Hill, NJ, USA
R. Garg, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 13
Wenjun Luo, Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
M. El Zarki, Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 17
Jiann-Jone Chen, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
D.W. Lin, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 21
S. McCanne, Lawrence Berkeley Lab., CA, USA
M. Vetterli, Lawrence Berkeley Lab., CA, USA
pp. 25
R.N. Braithwaite, 3241 N. Green Rd., Oak Harbor, WA, USA
B. Bhanu, 3241 N. Green Rd., Oak Harbor, WA, USA
pp. 33
S. Watanabe, Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
Y. Akimoto, Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
T. Komatsu, Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
T. Saito, Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
pp. 37
G.W. Cook, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
E.J. Delp, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 41
P.W. Fieguth, Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
W.W. Irving, Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
A.S. Willsky, Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
pp. 45
M. Unser, Biomed. Eng. & Instrum. Program, Nat. Inst. of Health, Bethesda, MD, USA
pp. 49
F. Bergeaud, Courant Inst. of Math. Sci., New York Univ., NY, USA
S. Mallat, Courant Inst. of Math. Sci., New York Univ., NY, USA
pp. 53
M.L. Hilton, Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA
P. Panda, Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA
B. Jawerth, Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA
W. Sweldens, Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA
pp. 57
An-Yeu Wu, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
K.J.R. Liu, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
A. Raghupathy, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
Shang-Chieh Liu, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 61
M. Potkonjak, C&C Res. Labs., NEC Res. Inst., Princeton, NJ, USA
A. Chandrakasan, C&C Res. Labs., NEC Res. Inst., Princeton, NJ, USA
pp. 65
G.G. Pechanek, Microelectron. Div., IBM Corp., Research Triangle Park, NC, USA
M. Stojancic, Microelectron. Div., IBM Corp., Research Triangle Park, NC, USA
S. Vassiliadis, Microelectron. Div., IBM Corp., Research Triangle Park, NC, USA
C.J. Glossner, Microelectron. Div., IBM Corp., Research Triangle Park, NC, USA
pp. 69
Huifang Sun, David Sarnoff Res. Center, Princeton, NJ, USA
W. Kwok, David Sarnoff Res. Center, Princeton, NJ, USA
J. Zdepski, David Sarnoff Res. Center, Princeton, NJ, USA
pp. 81
P.J. Morrow, Sch. of Inf. & Software Eng., Ulster Univ., Coleraine, UK
D. Crookes, Sch. of Inf. & Software Eng., Ulster Univ., Coleraine, UK
pp. 89
J.S. McVeigh, Carnegie Mellon Univ., Pittsburgh, PA, USA
S.-W. Wu, Carnegie Mellon Univ., Pittsburgh, PA, USA
M.W. Siegel, Carnegie Mellon Univ., Pittsburgh, PA, USA
A.G. Jordan, Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 93
Z. Mohdyusof, Dept. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
T.R. Fischer, Dept. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 101
Feng Chen, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
Zheng Gao, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
J. Villasenor, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 105
U. Bayazit, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
W.A. Pearlman, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 113
M. Antonini, Lab. I3S URA, Nice Univ., France
P. Raffy, Lab. I3S URA, Nice Univ., France
M. Barlaud, Lab. I3S URA, Nice Univ., France
pp. 121
T.J. Schulz, Dept. of Electr. Eng., Michigan Technol. Univ., Houghton, MI, USA
pp. 133
J.L.H. Webb, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
D.C. Munson, Jr., Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 136
F. Ahmad, Pennsylvania Univ., Philadelphia, PA, USA
S.A. Kassam, Pennsylvania Univ., Philadelphia, PA, USA
pp. 140
N.S. Subotic, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
B.J. Thelen, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
pp. 144
Jung Ah Choi Lee, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
D.C. Munson, Jr., Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 147
G. Ramponi, Dipartimento di Elettrotecnica Elettronica ed Inf., Trieste Univ., Italy
pp. 151
F. Russo, Dipartimento di Elettrotecnica Elettronica ed Inf., Trieste Univ., Italy
G. Ramponi, Dipartimento di Elettrotecnica Elettronica ed Inf., Trieste Univ., Italy
pp. 155
S.-S. Kuo, AT&T Bell Labs., Somerset, NJ, USA
M.V. Ranganath, AT&T Bell Labs., Somerset, NJ, USA
pp. 159
S. Peng, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
L. Lucke, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 163
YoungSik Choi, Dept. of Electr. & Comput. Eng., Missouri Univ., Columbia, MO, USA
R. Krishnapuram, Dept. of Electr. & Comput. Eng., Missouri Univ., Columbia, MO, USA
pp. 167
D.G. Karakos, Inst. of Comput. Sci., Found. for Res. & Technol., Crete, Greece
P.E. Trahanias, Inst. of Comput. Sci., Found. for Res. & Technol., Crete, Greece
pp. 171
A. Buchowicz, Inst. of Radioelectron., Warsaw Univ. of Technol., Poland
pp. 175
H. Greenspan, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
S. Akber, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 179
R. Sucher, Inst. fur Nachrichtentech. und Hochfrequenztech., Tech. Univ. Wien, Austria
pp. 183
Y.S. Yao, Center for Autom. Res., Maryland Univ., College Park, MD, USA
P. Burlina, Center for Autom. Res., Maryland Univ., College Park, MD, USA
R. Chellappa, Center for Autom. Res., Maryland Univ., College Park, MD, USA
T.H. Wu, Center for Autom. Res., Maryland Univ., College Park, MD, USA
pp. 191
Chieh-Min Fan, Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
N.M. Namazi, Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
pp. 195
Wei-Ge Chen, Microsoft Corp., Redmond, WA, USA
N. Nandhakumar, Microsoft Corp., Redmond, WA, USA
W.N. Martin, Microsoft Corp., Redmond, WA, USA
pp. 199
Dam LeQuang, Dept. de Genie Inf., Laval Univ., Que., Canada
A. Zaccarin, Dept. de Genie Inf., Laval Univ., Que., Canada
S. Caron, Dept. de Genie Inf., Laval Univ., Que., Canada
pp. 207
J.C. Brailean, Corp. Res., Motorola Inc., Schaumburg, IL, USA
A.K. Katsaggelos, Corp. Res., Motorola Inc., Schaumburg, IL, USA
pp. 211
Q. Cai, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
A. Mitiche, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
J.K. Aggarwal, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 215
Wei-Ge Chen, Microsoft Corp., Redmond, WA, USA
G.B. Giannakis, Microsoft Corp., Redmond, WA, USA
N. Nandhakumar, Microsoft Corp., Redmond, WA, USA
pp. 219
Ut-Va Koc, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
K.J.R. Liu, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 223
D. Talukdar, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
R. Acharya, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 231
Yung-Sheng Chen, Dept. of Electr. Eng., Yuan-Ze Inst. of Technol., Taoyuan, Taiwan
Hui-Yu Hwang, Dept. of Electr. Eng., Yuan-Ze Inst. of Technol., Taoyuan, Taiwan
Bor-Tow Chen, Dept. of Electr. Eng., Yuan-Ze Inst. of Technol., Taoyuan, Taiwan
pp. 242
Qian Huang, Siemens Corp. Res. Inc., Princeton, NJ, USA
B. Dam, Siemens Corp. Res. Inc., Princeton, NJ, USA
D. Steele, Siemens Corp. Res. Inc., Princeton, NJ, USA
J. Ashley, Siemens Corp. Res. Inc., Princeton, NJ, USA
W. Niblack, Siemens Corp. Res. Inc., Princeton, NJ, USA
pp. 246
J.S. Lerman, Sarnoff Real Time Corp., Princeton, NJ, USA
S.R. Kulkarni, Sarnoff Real Time Corp., Princeton, NJ, USA
pp. 254
S. Lakshmanan, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
A.K. Jain, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
Y. Zhong, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
pp. 258
G.M. Haley, California Microwave Incorp., Woodland Hills, CA, USA
B.S. Manjunath, California Microwave Incorp., Woodland Hills, CA, USA
pp. 262
S.Z. Li, Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
pp. 266
A. Zandi, RICOH, California Res. Center, Menlo Park, CA, USA
D.G. Stork, RICOH, California Res. Center, Menlo Park, CA, USA
J.D. Allen, RICOH, California Res. Center, Menlo Park, CA, USA
pp. 270
M.J. Gormish, Ricoh California Res. Center, Menlo Park, CA, USA
pp. 274
M. Trumbo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J. Vaisey, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 282
Jianping Pan, Wireless Syst., Rockwell Int. Corp., Newport Beach, CA, USA
pp. 286
R.L. de Queiroz, Xerox Webster Res. Center, NY, USA
K.R. Rao, Xerox Webster Res. Center, NY, USA
pp. 290
V.E. DeBrunner, Sch. of Electr. Eng., Oklahoma Univ., Norman, OK, USA
L. Chen, Sch. of Electr. Eng., Oklahoma Univ., Norman, OK, USA
H. Li, Sch. of Electr. Eng., Oklahoma Univ., Norman, OK, USA
pp. 294
Ligang Ke, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
M.W. Marcellin, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 298
D.L. Tull, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
R.J. Safranek, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
pp. 302
F. Dufaux, Media Lab., MIT, Cambridge, MA, USA
F. Moscheni, Media Lab., MIT, Cambridge, MA, USA
A. Lippman, Media Lab., MIT, Cambridge, MA, USA
pp. 306
P. Anandan, David Sarnoff Res. Center, Princeton, NJ, USA
M. Irani, David Sarnoff Res. Center, Princeton, NJ, USA
R. Kumar, David Sarnoff Res. Center, Princeton, NJ, USA
J. Bergen, David Sarnoff Res. Center, Princeton, NJ, USA
pp. 318
H.S. Sawhney, Machine Vision Group, IBM Almaden Res. Center, San Jose, CA, USA
S. Ayer, Machine Vision Group, IBM Almaden Res. Center, San Jose, CA, USA
M. Gorkani, Machine Vision Group, IBM Almaden Res. Center, San Jose, CA, USA
pp. 322
R.K. Srihari, Center for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
pp. 326
A. Akutsu, NTT Human Interface Labs., Kanagawa, Japan
Y. Tonomura, NTT Human Interface Labs., Kanagawa, Japan
H. Hamada, NTT Human Interface Labs., Kanagawa, Japan
pp. 330
L.A. Rowe, Div. of Comput. Sci., California Univ., Berkeley, CA, USA
J.S. Boreczky, Div. of Comput. Sci., California Univ., Berkeley, CA, USA
D.A. Berger, Div. of Comput. Sci., California Univ., Berkeley, CA, USA
D.W. Brubeck, Div. of Comput. Sci., California Univ., Berkeley, CA, USA
J.E. Baldeschwieler, Div. of Comput. Sci., California Univ., Berkeley, CA, USA
pp. 334
M.M. Yeung, Dept. of Electr. Eng., Princeton Univ., NJ, USA
Bede Liu, Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 338
Hsin-Chih Lin, Inst. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Ling-Ling Wang, Inst. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Shi-Nine Yang, Inst. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 342
Yiming Pi, Beijing Univ. of Posts & Telecommun., China
Shunji Huang, Beijing Univ. of Posts & Telecommun., China
pp. 346
Zhi-Ming Chen, Inst. of Comput. Sci. & Inf. Eng., Nat. Central Univ., Chung-Li, Taiwan
Chin-Chuan Han, Inst. of Comput. Sci. & Inf. Eng., Nat. Central Univ., Chung-Li, Taiwan
Kuo-Chin Fan, Inst. of Comput. Sci. & Inf. Eng., Nat. Central Univ., Chung-Li, Taiwan
pp. 350
V. Koivuen, Pennsylvania Univ., Philadelphia, PA, USA
N. Himayat, Pennsylvania Univ., Philadelphia, PA, USA
S.A. Kassam, Pennsylvania Univ., Philadelphia, PA, USA
pp. 354
R.N. Czerwinski, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
D.L. Jones, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
W.D. O'Brien, Jr., Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 358
M. Barni, Dipartimento di Ingegneria Elettronica, Firenze Univ., Italy
F. Bartolini, Dipartimento di Ingegneria Elettronica, Firenze Univ., Italy
F. Buti, Dipartimento di Ingegneria Elettronica, Firenze Univ., Italy
V. Cappellini, Dipartimento di Ingegneria Elettronica, Firenze Univ., Italy
pp. 362
K.E. Barner, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
R.C. Hardie, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
pp. 366
S.K. Basu, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
G.R. Arce, Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
pp. 370
T. Randen, Hogskolen i Stavanger, Norway
J.H. Husoy, Hogskolen i Stavanger, Norway
pp. 374
R. Manduchi, California Inst. of Technol., Pasadena, CA, USA
P. Perona, California Inst. of Technol., Pasadena, CA, USA
pp. 378
K. Anandakumar, Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
S.A. Kassam, Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 382
G. Verghese, Dept. of Comput. Sci., Toronto Univ., Ont., Canada
J.K. Tsotsos, Dept. of Comput. Sci., Toronto Univ., Ont., Canada
pp. 386
A.A. Alatan, Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
L. Onural, Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
pp. 390
A.M. Earnshaw, Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont., Canada
S.D. Blostein, Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont., Canada
pp. 394
E. Boyer, Inst. Nat. de Recherche en Inf. et Autom., Vandoeuvre les Nancy, France
M.O. Berger, Inst. Nat. de Recherche en Inf. et Autom., Vandoeuvre les Nancy, France
pp. 398
J.-L. Sune, CEA, Centre d'Etudes Nucleaires de Grenoble, France
V. Rebuffel, CEA, Centre d'Etudes Nucleaires de Grenoble, France
R. Samy, CEA, Centre d'Etudes Nucleaires de Grenoble, France
pp. 402
Yap-Peng Tan, Dept. of Electr. Eng., Princeton Univ., NJ, USA
S.R. Kulkarni, Dept. of Electr. Eng., Princeton Univ., NJ, USA
P.J. Ramadge, Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 406
Lai-Man Po, Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong
Wing-Chung Ma, Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong
pp. 410
S.S. Skrzypkowiak, Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
V.K. Jain, Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
pp. 418
R.N. Strickland, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Hee Il Hahn, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 422
D.E. Becker, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
J.N. Turner, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
H. Tanenbaum, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
B. Roysam, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 426
S.Y. Kung, Princeton Univ., NJ, USA
M. Fang, Princeton Univ., NJ, USA
S.P. Liou, Princeton Univ., NJ, USA
M.Y. Chiu, Princeton Univ., NJ, USA
J.S. Taur, Princeton Univ., NJ, USA
pp. 430
Yibin Zheng, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
P.C. Doerschuk, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 434
B.M. Cameron, Dept. of Physiol. & Biophys., Mayo Clinic, Rochester, MN, USA
A. Manduca, Dept. of Physiol. & Biophys., Mayo Clinic, Rochester, MN, USA
R.A. Robb, Dept. of Physiol. & Biophys., Mayo Clinic, Rochester, MN, USA
pp. 438
B.D. Cook, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
Soo-Young Lee, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 442
M. Barni, Dept. of Electron. Eng., Florence Univ., Italy
A.W. Mussa, Dept. of Electron. Eng., Florence Univ., Italy
A. Mecocci, Dept. of Electron. Eng., Florence Univ., Italy
V. Cappellini, Dept. of Electron. Eng., Florence Univ., Italy
T.S. Durrani, Dept. of Electron. Eng., Florence Univ., Italy
pp. 450
S. Kreitz, Inst. of Soil Biol., FAL, Braunschweig, Germany
A. Hess, Inst. of Soil Biol., FAL, Braunschweig, Germany
T.-H. Anderson, Inst. of Soil Biol., FAL, Braunschweig, Germany
pp. 454
Zhi-Qiang Liu, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
T.J. Austin, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
D. Moore, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
pp. 458
M. Crouse, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
K. Ramchandran, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 462
D. Schonfeld, Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
Yi Qiao, Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
pp. 466
B. Gunsel, Fac. of Electr. & Electron. Eng., Istanbul Tech. Univ., Turkey
C. Guzelis, Fac. of Electr. & Electron. Eng., Istanbul Tech. Univ., Turkey
pp. 470
Jechang Jeong, Dept. of Electr. Commun. Eng., Hanyang Univ., Seoul, South Korea
Byeungwoo Jeon, Dept. of Electr. Commun. Eng., Hanyang Univ., Seoul, South Korea
pp. 478
M.W. Hansen, David Sarnoff Res. Center, Princeton, NJ, USA
W.E. Higgins, David Sarnoff Res. Center, Princeton, NJ, USA
pp. 482
K.A. Bartels, NDE Sci. & Technol. Div., Southwest Res. Inst., San Antonio, TX, USA
J.L. Fisher, NDE Sci. & Technol. Div., Southwest Res. Inst., San Antonio, TX, USA
pp. 486
N. Herodotou, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
A.N. Venetsanopoulos, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
L. Onural, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
pp. 494
M. Aggarwal, Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
U.B. Desai, Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
pp. 498
J.M. Reinhardt, Coll. of Med., Iowa Univ., Iowa City, IA, USA
W.E. Higgins, Coll. of Med., Iowa Univ., Iowa City, IA, USA
pp. 502
W. Li, Lab. d'Autom., Inst. Nat. des Sci. Appliques, Rennes, France
V. Haese-Coat, Lab. d'Autom., Inst. Nat. des Sci. Appliques, Rennes, France
J. Ronsin, Lab. d'Autom., Inst. Nat. des Sci. Appliques, Rennes, France
pp. 510
K. Sivakumar, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
J. Goutsias, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
pp. 514
N.D. Sidiropoulos, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
J.S. Baras, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
C.A. Berenstein, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 518
F.J. Hampson, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
J.-C. Pesquet, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 522
J.R. Casas, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
P. Salembier, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
L. Torres, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 526
S.D. Servetto, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
K. Ramchandran, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
M.T. Orchard, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 530
P. Brigger, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
M. Kunt, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 534
R.N. Braithwaite, 3241 N. Green Rd., Oak Harbor, WA, USA
B. Bhanu, 3241 N. Green Rd., Oak Harbor, WA, USA
pp. 538
K.E. Matthews, Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
N.M. Namazi, Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
pp. 542
J. Murayama, Res. Center, Sony Corp., Tokyo, Japan
T. Miyauchi, Res. Center, Sony Corp., Tokyo, Japan
N. Shirota, Res. Center, Sony Corp., Tokyo, Japan
pp. 546
F.C.M. Martins, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.M.F. Moura, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 550
Yan Huang, Dept. of Electr. & Comput. Eng., Missouri Univ., Columbia, MO, USA
Xinhua Zhuang, Dept. of Electr. & Comput. Eng., Missouri Univ., Columbia, MO, USA
pp. 554
L. Karam, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
C. Podilchuk, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 562
K. Illgner, Inst. fur Elektrische Nachrichtentech., Tech. Hochschule Aachen, Germany
F. Muller, Inst. fur Elektrische Nachrichtentech., Tech. Hochschule Aachen, Germany
pp. 566
R. Krishnamurthy, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
P. Moulin, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
J. Woods, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 570
J. Yeh, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
M. Vetterli, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
M. Khansari, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 574
Hongsheng Cai, Dept. of Comput. Sci. & Electr. Eng., Vermont Univ., Burlington, VT, USA
G. Mirchandani, Dept. of Comput. Sci. & Electr. Eng., Vermont Univ., Burlington, VT, USA
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B. Zhu, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
M.A. Colestock, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
O.N. Gerek, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.E. Cetin, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
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A. Mazzarri, Signals & Commun. Lab., Brescia Univ., Italy
R. Leonardi, Signals & Commun. Lab., Brescia Univ., Italy
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Jian Lu, Center for Image Process. & Integrated Comput., California Univ., Davis, CA, USA
V.R. Algazi, Center for Image Process. & Integrated Comput., California Univ., Davis, CA, USA
R.R. Estes, Jr., Center for Image Process. & Integrated Comput., California Univ., Davis, CA, USA
pp. 590
Jiebo Luo, Dept. of Electr. Eng., Rochester Univ., NY, USA
Chang Wen Chen, Dept. of Electr. Eng., Rochester Univ., NY, USA
K.J. Parker, Dept. of Electr. Eng., Rochester Univ., NY, USA
T.S. Huang, Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 594
H. Ito, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
N. Farvardin, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 598
Wei-Lien Hsu, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
H. Derin, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
pp. 602
Po-Yuen Cheng, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
Jin Li, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
C.-C. Jay Kuo, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 606
Dong Wei, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
C.S. Burrus, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 610
Zixiang Xiong, Illinois Univ., Urbana, IL, USA
C. Herley, Illinois Univ., Urbana, IL, USA
K. Ramchandran, Illinois Univ., Urbana, IL, USA
M.T. Orchard, Illinois Univ., Urbana, IL, USA
pp. 614
S.S. Furuie, Heart Inst., Sao Paulo Univ., Brazil
G.T. Herman, Heart Inst., Sao Paulo Univ., Brazil
N.D.A. Mascarenhas, Heart Inst., Sao Paulo Univ., Brazil
S. Matej, Heart Inst., Sao Paulo Univ., Brazil
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V. Antonov, St. Petersburg Med. Acad., Russia
S. Dolgobrodov, St. Petersburg Med. Acad., Russia
V. Gusev, St. Petersburg Med. Acad., Russia
pp. 622
H.H. Garnaoui, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 625
Y.M. Kadah, Biomed. Eng. Program, Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik, Biomed. Eng. Program, Minnesota Univ., Minneapolis, MN, USA
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U.E. Ruttimann, Sect. on Brain Electrophysiol. & Imaging, Nat. Inst. of Health, Bethesda, MD, USA
N.F. Ramsey, Sect. on Brain Electrophysiol. & Imaging, Nat. Inst. of Health, Bethesda, MD, USA
D.W. Hommer, Sect. on Brain Electrophysiol. & Imaging, Nat. Inst. of Health, Bethesda, MD, USA
P. Thevenaz, Sect. on Brain Electrophysiol. & Imaging, Nat. Inst. of Health, Bethesda, MD, USA
Chulhee Lee, Sect. on Brain Electrophysiol. & Imaging, Nat. Inst. of Health, Bethesda, MD, USA
M. Unser, Sect. on Brain Electrophysiol. & Imaging, Nat. Inst. of Health, Bethesda, MD, USA
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M. Daniel, MIT, Cambridge, MA, USA
A. Willsky, MIT, Cambridge, MA, USA
D. McLaughlin, MIT, Cambridge, MA, USA
D. Rossi, MIT, Cambridge, MA, USA
pp. 637
S.J. Reeves, Dept. of Electr. Eng., Auburn Univ., AL, USA
R. Hezar, Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 641
Hong Jiang, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
Zhi-Pei Liang, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 645
K. Mino, Fac. of Eng., Tokushima Univ., Japan
N. Niki, Fac. of Eng., Tokushima Univ., Japan
N. Nakasato, Fac. of Eng., Tokushima Univ., Japan
pp. 649
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