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Image Processing, International Conference on (1995)
Washington D.C.
Oct. 23, 1995 to Oct. 26, 1995
ISBN: 0-8186-7310-9
TABLE OF CONTENTS
J.E. Redford , Online Media, Cambridge, UK
K.S. Ruttle , Online Media, Cambridge, UK
T.M. Dobson , Online Media, Cambridge, UK
pp. 1
H. Kanakia , AT&T Bell Labs., USA
P.P. Mishra , AT&T Bell Labs., USA
pp. 5
P. Salama , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
N.B. Shroff , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
E.J. Coyle , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
E.J. Delp , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 9
R.J. Safranek , AT&T Bell Labs., Murray Hill, NJ, USA
C.R. Kalmanek, Jr. , AT&T Bell Labs., Murray Hill, NJ, USA
R. Garg , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 13
Wenjun Luo , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
M. El Zarki , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 17
Jiann-Jone Chen , Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
D.W. Lin , Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 21
S. McCanne , Lawrence Berkeley Lab., CA, USA
M. Vetterli , Lawrence Berkeley Lab., CA, USA
pp. 25
M. Balakrishnan , Philips Lab., Briarcliff Manor, NY, USA
pp. 29
R.N. Braithwaite , 3241 N. Green Rd., Oak Harbor, WA, USA
B. Bhanu , 3241 N. Green Rd., Oak Harbor, WA, USA
pp. 33
S. Watanabe , Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
Y. Akimoto , Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
T. Komatsu , Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
T. Saito , Dept. of Electr. Eng., Kanagawa Univ., Yokohama, Japan
pp. 37
G.W. Cook , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
E.J. Delp , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 41
P.W. Fieguth , Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
W.W. Irving , Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
A.S. Willsky , Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
pp. 45
M. Unser , Biomed. Eng. & Instrum. Program, Nat. Inst. of Health, Bethesda, MD, USA
pp. 49
F. Bergeaud , Courant Inst. of Math. Sci., New York Univ., NY, USA
S. Mallat , Courant Inst. of Math. Sci., New York Univ., NY, USA
pp. 53
M.L. Hilton , Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA
P. Panda , Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA
B. Jawerth , Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA
W. Sweldens , Dept. of Comput. Sci., South Carolina Univ., Columbia, SC, USA
pp. 57
An-Yeu Wu , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
K.J.R. Liu , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
A. Raghupathy , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
Shang-Chieh Liu , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 61
M. Potkonjak , C&C Res. Labs., NEC Res. Inst., Princeton, NJ, USA
A. Chandrakasan , C&C Res. Labs., NEC Res. Inst., Princeton, NJ, USA
pp. 65
G.G. Pechanek , Microelectron. Div., IBM Corp., Research Triangle Park, NC, USA
M. Stojancic , Microelectron. Div., IBM Corp., Research Triangle Park, NC, USA
S. Vassiliadis , Microelectron. Div., IBM Corp., Research Triangle Park, NC, USA
C.J. Glossner , Microelectron. Div., IBM Corp., Research Triangle Park, NC, USA
pp. 69
S. Muller , Dept. Appl. of Prod. Tech., MAZ Microelectron. Appl. Center Hamburg GmbH, Germany
pp. 73
Huifang Sun , David Sarnoff Res. Center, Princeton, NJ, USA
W. Kwok , David Sarnoff Res. Center, Princeton, NJ, USA
J. Zdepski , David Sarnoff Res. Center, Princeton, NJ, USA
pp. 81
H. Singh , Aware Inc., Bedford, MA, USA
P.N. Heller , Aware Inc., Bedford, MA, USA
pp. 85
P.J. Morrow , Sch. of Inf. & Software Eng., Ulster Univ., Coleraine, UK
D. Crookes , Sch. of Inf. & Software Eng., Ulster Univ., Coleraine, UK
pp. 89
J.S. McVeigh , Carnegie Mellon Univ., Pittsburgh, PA, USA
S.-W. Wu , Carnegie Mellon Univ., Pittsburgh, PA, USA
M.W. Siegel , Carnegie Mellon Univ., Pittsburgh, PA, USA
A.G. Jordan , Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 93
H. Senane , IRESTE/SEI, Nantes, France
A. Saadane , IRESTE/SEI, Nantes, France
D. Barba , IRESTE/SEI, Nantes, France
pp. 97
Z. Mohdyusof , Dept. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
T.R. Fischer , Dept. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 101
Feng Chen , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
Zheng Gao , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
J. Villasenor , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 105
V.J. Mathews , Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
pp. 109
U. Bayazit , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
W.A. Pearlman , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 113
P. Onno , CCETT, Cesson Sevigne, France
C. Guillemot , CCETT, Cesson Sevigne, France
pp. 117
M. Antonini , Lab. I3S URA, Nice Univ., France
P. Raffy , Lab. I3S URA, Nice Univ., France
M. Barlaud , Lab. I3S URA, Nice Univ., France
pp. 121
O. Ikeda , Fac. of Eng., Takushoku Univ., Tokyo, Japan
pp. 125
M. Soumekh , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 129
T.J. Schulz , Dept. of Electr. Eng., Michigan Technol. Univ., Houghton, MI, USA
pp. 133
J.L.H. Webb , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
D.C. Munson, Jr. , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 136
F. Ahmad , Pennsylvania Univ., Philadelphia, PA, USA
S.A. Kassam , Pennsylvania Univ., Philadelphia, PA, USA
pp. 140
N.S. Subotic , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
B.J. Thelen , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
pp. 144
Jung Ah Choi Lee , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
D.C. Munson, Jr. , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 147
G. Ramponi , Dipartimento di Elettrotecnica Elettronica ed Inf., Trieste Univ., Italy
pp. 151
F. Russo , Dipartimento di Elettrotecnica Elettronica ed Inf., Trieste Univ., Italy
G. Ramponi , Dipartimento di Elettrotecnica Elettronica ed Inf., Trieste Univ., Italy
pp. 155
S.-S. Kuo , AT&T Bell Labs., Somerset, NJ, USA
M.V. Ranganath , AT&T Bell Labs., Somerset, NJ, USA
pp. 159
S. Peng , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
L. Lucke , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 163
YoungSik Choi , Dept. of Electr. & Comput. Eng., Missouri Univ., Columbia, MO, USA
R. Krishnapuram , Dept. of Electr. & Comput. Eng., Missouri Univ., Columbia, MO, USA
pp. 167
D.G. Karakos , Inst. of Comput. Sci., Found. for Res. & Technol., Crete, Greece
P.E. Trahanias , Inst. of Comput. Sci., Found. for Res. & Technol., Crete, Greece
pp. 171
A. Buchowicz , Inst. of Radioelectron., Warsaw Univ. of Technol., Poland
pp. 175
H. Greenspan , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
S. Akber , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 179
R. Sucher , Inst. fur Nachrichtentech. und Hochfrequenztech., Tech. Univ. Wien, Austria
pp. 183
A. Kundu , US West Adv. Technol., Boulder, CO, USA
pp. 187
Y.S. Yao , Center for Autom. Res., Maryland Univ., College Park, MD, USA
P. Burlina , Center for Autom. Res., Maryland Univ., College Park, MD, USA
R. Chellappa , Center for Autom. Res., Maryland Univ., College Park, MD, USA
T.H. Wu , Center for Autom. Res., Maryland Univ., College Park, MD, USA
pp. 191
Chieh-Min Fan , Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
N.M. Namazi , Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
pp. 195
Wei-Ge Chen , Microsoft Corp., Redmond, WA, USA
N. Nandhakumar , Microsoft Corp., Redmond, WA, USA
W.N. Martin , Microsoft Corp., Redmond, WA, USA
pp. 199
H. Sanson , Centre Commun d'Etudes de Telediffusion et Telecommun., Cesson-Sevigne Cedex, France
pp. 203
Dam LeQuang , Dept. de Genie Inf., Laval Univ., Que., Canada
A. Zaccarin , Dept. de Genie Inf., Laval Univ., Que., Canada
S. Caron , Dept. de Genie Inf., Laval Univ., Que., Canada
pp. 207
J.C. Brailean , Corp. Res., Motorola Inc., Schaumburg, IL, USA
A.K. Katsaggelos , Corp. Res., Motorola Inc., Schaumburg, IL, USA
pp. 211
Q. Cai , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
A. Mitiche , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
J.K. Aggarwal , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 215
Wei-Ge Chen , Microsoft Corp., Redmond, WA, USA
G.B. Giannakis , Microsoft Corp., Redmond, WA, USA
N. Nandhakumar , Microsoft Corp., Redmond, WA, USA
pp. 219
Ut-Va Koc , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
K.J.R. Liu , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 223
B.G. Mobasseri , Dept. of Electr. & Comput. Eng., Villanova Univ., PA, USA
pp. 227
D. Talukdar , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
R. Acharya , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 231
D. Pasquignon , CEREMADE, Univ. de Paris IX Dauphine, Paris, France
pp. 239
Yung-Sheng Chen , Dept. of Electr. Eng., Yuan-Ze Inst. of Technol., Taoyuan, Taiwan
Hui-Yu Hwang , Dept. of Electr. Eng., Yuan-Ze Inst. of Technol., Taoyuan, Taiwan
Bor-Tow Chen , Dept. of Electr. Eng., Yuan-Ze Inst. of Technol., Taoyuan, Taiwan
pp. 242
Qian Huang , Siemens Corp. Res. Inc., Princeton, NJ, USA
B. Dam , Siemens Corp. Res. Inc., Princeton, NJ, USA
D. Steele , Siemens Corp. Res. Inc., Princeton, NJ, USA
J. Ashley , Siemens Corp. Res. Inc., Princeton, NJ, USA
W. Niblack , Siemens Corp. Res. Inc., Princeton, NJ, USA
pp. 246
N.B. Ebi , Dept. of Software Dev., Poppenhaeger GRIPS Ltd., Neunkirchen, Germany
pp. 250
J.S. Lerman , Sarnoff Real Time Corp., Princeton, NJ, USA
S.R. Kulkarni , Sarnoff Real Time Corp., Princeton, NJ, USA
pp. 254
S. Lakshmanan , Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
A.K. Jain , Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
Y. Zhong , Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
pp. 258
G.M. Haley , California Microwave Incorp., Woodland Hills, CA, USA
B.S. Manjunath , California Microwave Incorp., Woodland Hills, CA, USA
pp. 262
S.Z. Li , Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
pp. 266
A. Zandi , RICOH, California Res. Center, Menlo Park, CA, USA
D.G. Stork , RICOH, California Res. Center, Menlo Park, CA, USA
J.D. Allen , RICOH, California Res. Center, Menlo Park, CA, USA
pp. 270
M.J. Gormish , Ricoh California Res. Center, Menlo Park, CA, USA
pp. 274
B. Simon , Lab. de Telecommun., Univ. Catholique de Louvain, Belgium
pp. 278
M. Trumbo , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J. Vaisey , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 282
Jianping Pan , Wireless Syst., Rockwell Int. Corp., Newport Beach, CA, USA
pp. 286
R.L. de Queiroz , Xerox Webster Res. Center, NY, USA
K.R. Rao , Xerox Webster Res. Center, NY, USA
pp. 290
V.E. DeBrunner , Sch. of Electr. Eng., Oklahoma Univ., Norman, OK, USA
L. Chen , Sch. of Electr. Eng., Oklahoma Univ., Norman, OK, USA
H. Li , Sch. of Electr. Eng., Oklahoma Univ., Norman, OK, USA
pp. 294
Ligang Ke , Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
M.W. Marcellin , Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 298
D.L. Tull , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
R.J. Safranek , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
pp. 302
F. Dufaux , Media Lab., MIT, Cambridge, MA, USA
F. Moscheni , Media Lab., MIT, Cambridge, MA, USA
A. Lippman , Media Lab., MIT, Cambridge, MA, USA
pp. 306
R.W. Picard , Media Lab., MIT, Cambridge, MA, USA
pp. 310
Shih-Fu Chang , Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
pp. 314
P. Anandan , David Sarnoff Res. Center, Princeton, NJ, USA
M. Irani , David Sarnoff Res. Center, Princeton, NJ, USA
R. Kumar , David Sarnoff Res. Center, Princeton, NJ, USA
J. Bergen , David Sarnoff Res. Center, Princeton, NJ, USA
pp. 318
H.S. Sawhney , Machine Vision Group, IBM Almaden Res. Center, San Jose, CA, USA
S. Ayer , Machine Vision Group, IBM Almaden Res. Center, San Jose, CA, USA
M. Gorkani , Machine Vision Group, IBM Almaden Res. Center, San Jose, CA, USA
pp. 322
R.K. Srihari , Center for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
pp. 326
A. Akutsu , NTT Human Interface Labs., Kanagawa, Japan
Y. Tonomura , NTT Human Interface Labs., Kanagawa, Japan
H. Hamada , NTT Human Interface Labs., Kanagawa, Japan
pp. 330
L.A. Rowe , Div. of Comput. Sci., California Univ., Berkeley, CA, USA
J.S. Boreczky , Div. of Comput. Sci., California Univ., Berkeley, CA, USA
D.A. Berger , Div. of Comput. Sci., California Univ., Berkeley, CA, USA
D.W. Brubeck , Div. of Comput. Sci., California Univ., Berkeley, CA, USA
J.E. Baldeschwieler , Div. of Comput. Sci., California Univ., Berkeley, CA, USA
pp. 334
M.M. Yeung , Dept. of Electr. Eng., Princeton Univ., NJ, USA
Bede Liu , Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 338
Hsin-Chih Lin , Inst. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Ling-Ling Wang , Inst. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Shi-Nine Yang , Inst. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 342
Yiming Pi , Beijing Univ. of Posts & Telecommun., China
Shunji Huang , Beijing Univ. of Posts & Telecommun., China
pp. 346
Zhi-Ming Chen , Inst. of Comput. Sci. & Inf. Eng., Nat. Central Univ., Chung-Li, Taiwan
Chin-Chuan Han , Inst. of Comput. Sci. & Inf. Eng., Nat. Central Univ., Chung-Li, Taiwan
Kuo-Chin Fan , Inst. of Comput. Sci. & Inf. Eng., Nat. Central Univ., Chung-Li, Taiwan
pp. 350
V. Koivuen , Pennsylvania Univ., Philadelphia, PA, USA
N. Himayat , Pennsylvania Univ., Philadelphia, PA, USA
S.A. Kassam , Pennsylvania Univ., Philadelphia, PA, USA
pp. 354
R.N. Czerwinski , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
D.L. Jones , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
W.D. O'Brien, Jr. , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 358
M. Barni , Dipartimento di Ingegneria Elettronica, Firenze Univ., Italy
F. Bartolini , Dipartimento di Ingegneria Elettronica, Firenze Univ., Italy
F. Buti , Dipartimento di Ingegneria Elettronica, Firenze Univ., Italy
V. Cappellini , Dipartimento di Ingegneria Elettronica, Firenze Univ., Italy
pp. 362
K.E. Barner , Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
R.C. Hardie , Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
pp. 366
S.K. Basu , Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
G.R. Arce , Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
pp. 370
T. Randen , Hogskolen i Stavanger, Norway
J.H. Husoy , Hogskolen i Stavanger, Norway
pp. 374
R. Manduchi , California Inst. of Technol., Pasadena, CA, USA
P. Perona , California Inst. of Technol., Pasadena, CA, USA
pp. 378
K. Anandakumar , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
S.A. Kassam , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 382
G. Verghese , Dept. of Comput. Sci., Toronto Univ., Ont., Canada
J.K. Tsotsos , Dept. of Comput. Sci., Toronto Univ., Ont., Canada
pp. 386
A.A. Alatan , Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
L. Onural , Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
pp. 390
A.M. Earnshaw , Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont., Canada
S.D. Blostein , Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont., Canada
pp. 394
E. Boyer , Inst. Nat. de Recherche en Inf. et Autom., Vandoeuvre les Nancy, France
M.O. Berger , Inst. Nat. de Recherche en Inf. et Autom., Vandoeuvre les Nancy, France
pp. 398
J.-L. Sune , CEA, Centre d'Etudes Nucleaires de Grenoble, France
V. Rebuffel , CEA, Centre d'Etudes Nucleaires de Grenoble, France
R. Samy , CEA, Centre d'Etudes Nucleaires de Grenoble, France
pp. 402
Yap-Peng Tan , Dept. of Electr. Eng., Princeton Univ., NJ, USA
S.R. Kulkarni , Dept. of Electr. Eng., Princeton Univ., NJ, USA
P.J. Ramadge , Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 406
Lai-Man Po , Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong
Wing-Chung Ma , Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong
pp. 410
A.K. Dalmia , Datacube Inc., Danvers, MA, USA
M.M. Trivedi , Datacube Inc., Danvers, MA, USA
pp. 414
S.S. Skrzypkowiak , Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
V.K. Jain , Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
pp. 418
R.N. Strickland , Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Hee Il Hahn , Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 422
D.E. Becker , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
J.N. Turner , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
H. Tanenbaum , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
B. Roysam , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 426
S.Y. Kung , Princeton Univ., NJ, USA
M. Fang , Princeton Univ., NJ, USA
S.P. Liou , Princeton Univ., NJ, USA
M.Y. Chiu , Princeton Univ., NJ, USA
J.S. Taur , Princeton Univ., NJ, USA
pp. 430
Yibin Zheng , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
P.C. Doerschuk , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 434
B.M. Cameron , Dept. of Physiol. & Biophys., Mayo Clinic, Rochester, MN, USA
A. Manduca , Dept. of Physiol. & Biophys., Mayo Clinic, Rochester, MN, USA
R.A. Robb , Dept. of Physiol. & Biophys., Mayo Clinic, Rochester, MN, USA
pp. 438
B.D. Cook , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
Soo-Young Lee , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 442
P. Delagnes , SEI-IRESTE, Nantes, France
D. Barba , SEI-IRESTE, Nantes, France
pp. 446
M. Barni , Dept. of Electron. Eng., Florence Univ., Italy
A.W. Mussa , Dept. of Electron. Eng., Florence Univ., Italy
A. Mecocci , Dept. of Electron. Eng., Florence Univ., Italy
V. Cappellini , Dept. of Electron. Eng., Florence Univ., Italy
T.S. Durrani , Dept. of Electron. Eng., Florence Univ., Italy
pp. 450
S. Kreitz , Inst. of Soil Biol., FAL, Braunschweig, Germany
A. Hess , Inst. of Soil Biol., FAL, Braunschweig, Germany
T.-H. Anderson , Inst. of Soil Biol., FAL, Braunschweig, Germany
pp. 454
Zhi-Qiang Liu , Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
T.J. Austin , Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
D. Moore , Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
pp. 458
M. Crouse , Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
K. Ramchandran , Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 462
D. Schonfeld , Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
Yi Qiao , Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
pp. 466
B. Gunsel , Fac. of Electr. & Electron. Eng., Istanbul Tech. Univ., Turkey
C. Guzelis , Fac. of Electr. & Electron. Eng., Istanbul Tech. Univ., Turkey
pp. 470
L. Blanc-Feraud , Nice Univ., France
P. Charbonnier , Nice Univ., France
G. Aubert , Nice Univ., France
M. Barlaud , Nice Univ., France
pp. 474
Jechang Jeong , Dept. of Electr. Commun. Eng., Hanyang Univ., Seoul, South Korea
Byeungwoo Jeon , Dept. of Electr. Commun. Eng., Hanyang Univ., Seoul, South Korea
pp. 478
M.W. Hansen , David Sarnoff Res. Center, Princeton, NJ, USA
W.E. Higgins , David Sarnoff Res. Center, Princeton, NJ, USA
pp. 482
K.A. Bartels , NDE Sci. & Technol. Div., Southwest Res. Inst., San Antonio, TX, USA
J.L. Fisher , NDE Sci. & Technol. Div., Southwest Res. Inst., San Antonio, TX, USA
pp. 486
N. Herodotou , Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
A.N. Venetsanopoulos , Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
L. Onural , Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
pp. 494
M. Aggarwal , Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
U.B. Desai , Dept. of Electr. Eng., Indian Inst. of Technol., Bombay, India
pp. 498
J.M. Reinhardt , Coll. of Med., Iowa Univ., Iowa City, IA, USA
W.E. Higgins , Coll. of Med., Iowa Univ., Iowa City, IA, USA
pp. 502
Demin Wang , IRISA, Rennes, France
C. Labit , IRISA, Rennes, France
pp. 506
W. Li , Lab. d'Autom., Inst. Nat. des Sci. Appliques, Rennes, France
V. Haese-Coat , Lab. d'Autom., Inst. Nat. des Sci. Appliques, Rennes, France
J. Ronsin , Lab. d'Autom., Inst. Nat. des Sci. Appliques, Rennes, France
pp. 510
K. Sivakumar , Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
J. Goutsias , Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
pp. 514
N.D. Sidiropoulos , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
J.S. Baras , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
C.A. Berenstein , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 518
F.J. Hampson , Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
J.-C. Pesquet , Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 522
J.R. Casas , Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
P. Salembier , Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
L. Torres , Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 526
S.D. Servetto , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
K. Ramchandran , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
M.T. Orchard , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 530
P. Brigger , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
M. Kunt , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 534
R.N. Braithwaite , 3241 N. Green Rd., Oak Harbor, WA, USA
B. Bhanu , 3241 N. Green Rd., Oak Harbor, WA, USA
pp. 538
K.E. Matthews , Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
N.M. Namazi , Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
pp. 542
J. Murayama , Res. Center, Sony Corp., Tokyo, Japan
T. Miyauchi , Res. Center, Sony Corp., Tokyo, Japan
N. Shirota , Res. Center, Sony Corp., Tokyo, Japan
pp. 546
F.C.M. Martins , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.M.F. Moura , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 550
Yan Huang , Dept. of Electr. & Comput. Eng., Missouri Univ., Columbia, MO, USA
Xinhua Zhuang , Dept. of Electr. & Comput. Eng., Missouri Univ., Columbia, MO, USA
pp. 554
U.Y. Desai , Dept. of Electr. Eng., MIT, Cambridge, MA, USA
pp. 558
L. Karam , Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
C. Podilchuk , Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 562
K. Illgner , Inst. fur Elektrische Nachrichtentech., Tech. Hochschule Aachen, Germany
F. Muller , Inst. fur Elektrische Nachrichtentech., Tech. Hochschule Aachen, Germany
pp. 566
R. Krishnamurthy , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
P. Moulin , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
J. Woods , Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 570
J. Yeh , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
M. Vetterli , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
M. Khansari , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 574
Hongsheng Cai , Dept. of Comput. Sci. & Electr. Eng., Vermont Univ., Burlington, VT, USA
G. Mirchandani , Dept. of Comput. Sci. & Electr. Eng., Vermont Univ., Burlington, VT, USA
pp. 578
B. Zhu , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
M.A. Colestock , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
O.N. Gerek , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.E. Cetin , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 582
A. Mazzarri , Signals & Commun. Lab., Brescia Univ., Italy
R. Leonardi , Signals & Commun. Lab., Brescia Univ., Italy
pp. 586
Jian Lu , Center for Image Process. & Integrated Comput., California Univ., Davis, CA, USA
V.R. Algazi , Center for Image Process. & Integrated Comput., California Univ., Davis, CA, USA
R.R. Estes, Jr. , Center for Image Process. & Integrated Comput., California Univ., Davis, CA, USA
pp. 590
Jiebo Luo , Dept. of Electr. Eng., Rochester Univ., NY, USA
Chang Wen Chen , Dept. of Electr. Eng., Rochester Univ., NY, USA
K.J. Parker , Dept. of Electr. Eng., Rochester Univ., NY, USA
T.S. Huang , Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 594
H. Ito , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
N. Farvardin , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 598
Wei-Lien Hsu , Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
H. Derin , Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
pp. 602
Po-Yuen Cheng , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
Jin Li , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
C.-C. Jay Kuo , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 606
Dong Wei , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
C.S. Burrus , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 610
Zixiang Xiong , Illinois Univ., Urbana, IL, USA
C. Herley , Illinois Univ., Urbana, IL, USA
K. Ramchandran , Illinois Univ., Urbana, IL, USA
M.T. Orchard , Illinois Univ., Urbana, IL, USA
pp. 614
S.S. Furuie , Heart Inst., Sao Paulo Univ., Brazil
G.T. Herman , Heart Inst., Sao Paulo Univ., Brazil
N.D.A. Mascarenhas , Heart Inst., Sao Paulo Univ., Brazil
S. Matej , Heart Inst., Sao Paulo Univ., Brazil
pp. 618
V. Antonov , St. Petersburg Med. Acad., Russia
S. Dolgobrodov , St. Petersburg Med. Acad., Russia
V. Gusev , St. Petersburg Med. Acad., Russia
pp. 622
H.H. Garnaoui , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 625
Y.M. Kadah , Biomed. Eng. Program, Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik , Biomed. Eng. Program, Minnesota Univ., Minneapolis, MN, USA
pp. 629
U.E. Ruttimann , Sect. on Brain Electrophysiol. & Imaging, Nat. Inst. of Health, Bethesda, MD, USA
N.F. Ramsey , Sect. on Brain Electrophysiol. & Imaging, Nat. Inst. of Health, Bethesda, MD, USA
D.W. Hommer , Sect. on Brain Electrophysiol. & Imaging, Nat. Inst. of Health, Bethesda, MD, USA
P. Thevenaz , Sect. on Brain Electrophysiol. & Imaging, Nat. Inst. of Health, Bethesda, MD, USA
Chulhee Lee , Sect. on Brain Electrophysiol. & Imaging, Nat. Inst. of Health, Bethesda, MD, USA
M. Unser , Sect. on Brain Electrophysiol. & Imaging, Nat. Inst. of Health, Bethesda, MD, USA
pp. 633
M. Daniel , MIT, Cambridge, MA, USA
A. Willsky , MIT, Cambridge, MA, USA
D. McLaughlin , MIT, Cambridge, MA, USA
D. Rossi , MIT, Cambridge, MA, USA
pp. 637
S.J. Reeves , Dept. of Electr. Eng., Auburn Univ., AL, USA
R. Hezar , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 641
Hong Jiang , Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
Zhi-Pei Liang , Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 645
K. Mino , Fac. of Eng., Tokushima Univ., Japan
N. Niki , Fac. of Eng., Tokushima Univ., Japan
N. Nakasato , Fac. of Eng., Tokushima Univ., Japan
pp. 649
pp. 653
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