- I
- ICDM
- 2004
- Fourth IEEE International Conference on Data Mining (ICDM'04)
| | This Publication | | | | | | | |
| | | | Bibliographic References | | | |
| | | | |
Fourth IEEE International Conference on Data Mining (ICDM'04) Brighton, United Kingdom November 01-November 04 ISBN: 0-7695-2142-8 Table of Contents
 | null |
 | Regular Papers |
Xiaoyong Chai, Hong Kong University of Science and Technology, China
Lin Deng, Hong Kong University of Science and Technology, China
Qiang Yang, Hong Kong University of Science and Technology, China pp. 51-58
Yun Chi, University of California, Los Angeles
Haixun Wang, IBM Thomas J. Watson Research Center, Hawthorne, NY
Philip S. Yu, IBM Thomas J. Watson Research Center, Hawthorne, NY pp. 59-66
Kun Liu, University of Maryland Baltimore County, Baltimore, MD
Todd Olsen, University of Maryland Baltimore County, Baltimore, MD pp. 67-74
Z. Huang, University of Wisconsin-Madison
L. Chen, University of Wisconsin-Madison
J-Y. Cai, University of Wisconsin-Madison pp. 122-129
B. Shekar, Indian Institute of Management Bangalore pp. 194-201
Roberto Amato, Universit? Federico II di Napoli and INFN Napoli Unit, Italy
Giuseppe Longo, Universit? Federico II di Napoli and INFN Napoli Unit, Italy
Ciro Donalek, Universit? Federico II di Napoli and INFN Napoli Unit, Italy
Gennaro Miele, Universit? Federico II di Napoli and INFN Napoli Unit, Italy pp. 202-208
Pei Sun, University of Sydney, Australia pp. 209-216
Ana L. Fred, Instituto Superior Tecnico, Lisbon, Portugal pp. 225-232
Wai Lam, The Chinese University of Hong Kong, Shatin pp. 257-264
Gang Wu, University of California, Santa Barbara pp. 265-272
Dou Shen, TsingHua University, Beijing, P.R. China
Qiang Yang, Hong Kong University of Science and Technology
Zheng Chen, Microsoft Research Asia, Beijing, P.R. China
Yong Yu, Shanghai Jiao-Tong University, P.R. China
WenSi Xi, Virginia Polytechnic Institute and State University
Wei-Ying Ma, Microsoft Research Asia, Beijing, P.R. China pp. 273-280
Feng Zhang, Texas A&M University, College Station, Texas pp. 281-288
Ying Yang, University of Vermont, Burlington VT pp. 305-312
 | Short Papers |
Yi Chen, Chinese Academy of Sciences pp. 343-346
Fang Chu, University of California, Los Angeles pp. 351-354
Gao Cong, National University of Singapore
Feng Pan, National University of Singapore pp. 363-366
Bi-Ru Dai, National Taiwan University, Taipei pp. 367-370
Yu Meng, Southern Methodist University, Dallas, Texas
Jie Huang, The University of Texas Southwestern, Dallas, Texas pp. 371-374
Wei Fan, IBM T. J. Watson Research, Hawthorne, NY
Yi-an Huang, Georgia Institute of Technology, Atlanta, GA pp. 379-382
Yiqiu Han, The Chinese University of Hong Kong
Wai Lam, The Chinese University of Hong Kong pp. 399-402
Chenyong Hu, Institute of Software, CAS, Beijing, P.R. China
Qiang Yang, Hong Kong University of Science and Technology
Jun Yan, LMAM, Peking University, Beijing, P.R. China pp. 407-410
Toshihiro Kamishima, National Institute of Advanced Industrial Science and Technology (AIST), Japan
Shotaro Akaho, National Institute of Advanced Industrial Science and Technology (AIST), Japan pp. 423-426
Chih Lai, University of St. Thomas, St. Paul, MN pp. 443-446
Tao Li, Florida International University, Miami, FL
Sheng Ma, IBM T. J. Watson Research Center, Hawthorne, NY pp. 451-454
Jinze Liu, University of North Carolina, Chapel Hill
Wei Wang, University of North Carolina, Chapel Hill pp. 463-466
Daoying Ma, State University of New York at Buffalo pp. 467-470
Xi Ma, National University of Singapore pp. 471-474
San-Yih Hwang, National Sun-Yat-Sen University, Kaohsiung, Taiwan pp. 475-478
D. Meng, Washington State University, Pullman, WA pp. 487-490
Qiang Yang, Hong Kong Univ. of Sci. & Technology, Hong Kong pp. 519-522
Jiang Su, University of New Brunswick, Canada pp. 531-534
Ping Sun, The University of Birmingham, UK pp. 539-542
Wei Wang, University of North Carolina at Chapel Hill pp. 559-562
Hwanjo Yu, University of Illinois at Urbana-Champaign
Xiaolei Li, University of Illinois at Urbana-Champaign
Jiawei Han, University of Illinois at Urbana-Champaign pp. 563-566
Ning Zhong, Maebashi Institute of Technology, Japan pp. 575-578 Usage of this product signifies your acceptance of the Terms of Use.
| | | | | | | |