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  • Third International Conference on Document Analysis and Recognition (ICDAR'95) - Volume 2
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Third International Conference on Document Analysis and Recognition (ICDAR'95) - Volume 2
Montr?al, Canada
August 14-August 15
ISBN: 0-8186-7128-9
Table of Contents
Session 2.4-P: Poster Papers I
F. Parmentier, CRIN-INRIA Lorraine, Vandoeuvre-les-Nancy, France
A. Belaid, CRIN-INRIA Lorraine, Vandoeuvre-les-Nancy, France
pp. 532
R. Sivaramakrishnan, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
I.T. Phillips, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
J. Ha, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
S. Subramanium, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
R.M. Haralick, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 541
R. Hoch, German Res. Center for Artificial Intelligence, Kaiserslautern, Germany
pp. 549
Shih-Shien You, Basic Res. Lab., Telecommun. Labs., Taoyuan, Taiwan
Gan-How Chang, Basic Res. Lab., Telecommun. Labs., Taoyuan, Taiwan
Pao-Chung Chang, Basic Res. Lab., Telecommun. Labs., Taoyuan, Taiwan
Bing-Shan Chien, Basic Res. Lab., Telecommun. Labs., Taoyuan, Taiwan
pp. 553
Hyuk-Chul Kwon, Dept. of Comput. Sci., Pusan Nat. Univ., South Korea
Ho-Jeong Hwang, Dept. of Comput. Sci., Pusan Nat. Univ., South Korea
Min-Jung Kim, Dept. of Comput. Sci., Pusan Nat. Univ., South Korea
Seong-Whan Lee, Dept. of Comput. Sci., Pusan Nat. Univ., South Korea
pp. 557
S.L. Taylor, Gov. Syst. Group, Unisys Corp., Paoli, PA, USA
M. Lipshutz, Gov. Syst. Group, Unisys Corp., Paoli, PA, USA
R.W. Nilson, Gov. Syst. Group, Unisys Corp., Paoli, PA, USA
pp. 563
Y.Y. Tang, Center for Pattern Recognition & Machine Intelligence, Concordia Univ., Montreal, Que., Canada
Hong Ma, Center for Pattern Recognition & Machine Intelligence, Concordia Univ., Montreal, Que., Canada
Xiaogang Mao, Center for Pattern Recognition & Machine Intelligence, Concordia Univ., Montreal, Que., Canada
Dan Liu, Center for Pattern Recognition & Machine Intelligence, Concordia Univ., Montreal, Que., Canada
C.Y. Suen, Center for Pattern Recognition & Machine Intelligence, Concordia Univ., Montreal, Que., Canada
pp. 567
Y.Y. Tang, Center for Pattern Recognition, Concordia Univ., Montreal, Que., Canada
Hong Ma, Center for Pattern Recognition, Concordia Univ., Montreal, Que., Canada
Dihua Xi, Center for Pattern Recognition, Concordia Univ., Montreal, Que., Canada
Yi Cheng, Center for Pattern Recognition, Concordia Univ., Montreal, Que., Canada
C.Y. Suen, Center for Pattern Recognition, Concordia Univ., Montreal, Que., Canada
pp. 571
G. Butler, Dept. of Comput. Sci., Concordia Univ., Montreal, Que., Canada
P. Grogono, Dept. of Comput. Sci., Concordia Univ., Montreal, Que., Canada
R. Shinghal, Dept. of Comput. Sci., Concordia Univ., Montreal, Que., Canada
I. Tjandra, Dept. of Comput. Sci., Concordia Univ., Montreal, Que., Canada
pp. 575
Jinhui Liu, Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
Xiaoqing Ding, Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
Youshou Wu, Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
pp. 579
A. Dengel, German Res. Center for Artificial Intelligence, Kaiserslautern, Germany
F. Dubiel, German Res. Center for Artificial Intelligence, Kaiserslautern, Germany
pp. 587
L. Wiedenhifer, German Res. Center for Artificial Intelligence, Kaiserslautern, Germany
H.-G. Hein, German Res. Center for Artificial Intelligence, Kaiserslautern, Germany
A. Dengel, German Res. Center for Artificial Intelligence, Kaiserslautern, Germany
pp. 592
Y.H. Liu-Gong, Compiegne Technol. Univ., France
B. Dubuisson, Compiegne Technol. Univ., France
H.N. Pham, Compiegne Technol. Univ., France
pp. 597
S. Fischer, Sch. of Comput. Sci. & Eng., New South Wales Univ., Sydney, NSW, Australia
A. Amin, Sch. of Comput. Sci. & Eng., New South Wales Univ., Sydney, NSW, Australia
D. Drivas, Sch. of Comput. Sci. & Eng., New South Wales Univ., Sydney, NSW, Australia
pp. 605
D. Drivas, Sch. of Comput. Sci. & Eng., New South Wales Univ., Kensington, NSW, Australia
A. Amin, Sch. of Comput. Sci. & Eng., New South Wales Univ., Kensington, NSW, Australia
pp. 610
D. Sylwester, Dept. of Comput. Sci., Concordia Coll., Seward, NE, USA
S. Seth, Dept. of Comput. Sci., Concordia Coll., Seward, NE, USA
pp. 615
Kuo-Chin Fan, Inst. of Comput. Sci. & Inf. Eng., Nat. Central Univ., Chung-Li, Taiwan
Jeng-Ming Lu, Inst. of Comput. Sci. & Inf. Eng., Nat. Central Univ., Chung-Li, Taiwan
Jing-Yuh Wang, Inst. of Comput. Sci. & Inf. Eng., Nat. Central Univ., Chung-Li, Taiwan
pp. 623
Kuo-Chin Fan, Inst. of Comput. Sci. & Inf. Eng., Nat. Central Univ., Chung-Li, Taiwan
Den-Fong Chen, Inst. of Comput. Sci. & Inf. Eng., Nat. Central Univ., Chung-Li, Taiwan
Ming-Gang Wen, Inst. of Comput. Sci. & Inf. Eng., Nat. Central Univ., Chung-Li, Taiwan
pp. 627
D. Doermann, Center for Autom. Res., Maryland Univ., College Park, MD, USA
O. Kia, Center for Autom. Res., Maryland Univ., College Park, MD, USA
pp. 632
Moon-Soo Chang, Dept. of Electron. Eng., Korea Univ., Seoul, South Korea
Sun-Mee Kang, Dept. of Electron. Eng., Korea Univ., Seoul, South Korea
Woo-Sik Rho, Dept. of Electron. Eng., Korea Univ., Seoul, South Korea
Heok-Gu Kim, Dept. of Electron. Eng., Korea Univ., Seoul, South Korea
Duck-Jin Kim, Dept. of Electron. Eng., Korea Univ., Seoul, South Korea
pp. 636
A. Braun, Dept. of Text Understanding, Daimler-Benz Res. Center, Ulm, Germany
T. Caesar, Dept. of Text Understanding, Daimler-Benz Res. Center, Ulm, Germany
J.M. Gloger, Dept. of Text Understanding, Daimler-Benz Res. Center, Ulm, Germany
E. Mandler, Dept. of Text Understanding, Daimler-Benz Res. Center, Ulm, Germany
pp. 640
H. Hontani, Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
S. Shimotsuji, Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
pp. 644
Yi Lu, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
A.C. Tisler, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
pp. 648
N. Nakamura, NTT Human Interface Labs., Kanagawa, Japan
K. Hosaka, NTT Human Interface Labs., Kanagawa, Japan
M. Nagura, NTT Human Interface Labs., Kanagawa, Japan
pp. 652
K. Toraichi, Inst. of Inf. Sci. & Electron., Tsukuba Univ., Ibaraki, Japan
T. Horiuchi, Inst. of Inf. Sci. & Electron., Tsukuba Univ., Ibaraki, Japan
R. Haruki, Inst. of Inf. Sci. & Electron., Tsukuba Univ., Ibaraki, Japan
pp. 656
Wen Gao, Artificial Intelligence Lab., MIT, Cambridge, MA, USA
Shengfu Dong, Artificial Intelligence Lab., MIT, Cambridge, MA, USA
Xilin Chen, Artificial Intelligence Lab., MIT, Cambridge, MA, USA
pp. 660
Ching-Yung Yang, Inst. of Comput. & Inf. Sci., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Ja-Chen Lin, Inst. of Comput. & Inf. Sci., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 669
Din-Chang Tseng, Inst. of Comput. Sci. & Inf. Eng., Nat. Central Univ., Chung-Li, Taiwan
Yao-Fu Li, Inst. of Comput. Sci. & Inf. Eng., Nat. Central Univ., Chung-Li, Taiwan
Cheng-Tan Tung, Inst. of Comput. Sci. & Inf. Eng., Nat. Central Univ., Chung-Li, Taiwan
pp. 673
Myoung-Young Yoon, Dept. of Comput. Sci., Chungcheong Coll., Chungbuk, South Korea
Seong-Whan Lee, Dept. of Comput. Sci., Chungcheong Coll., Chungbuk, South Korea
Ju-Sung Kim, Dept. of Comput. Sci., Chungcheong Coll., Chungbuk, South Korea
pp. 677
Ming-Jing Li, Inst. of Autom., Acad. Sinica, Beijing, China
Ru-Wei Dai, Inst. of Autom., Acad. Sinica, Beijing, China
pp. 689
B. Bontempi, Dipartimento di Inf. e Sistemistica, Univ. di Napoli Federico II, Italy
A. Marcelli, Dipartimento di Inf. e Sistemistica, Univ. di Napoli Federico II, Italy
pp. 694
H. Takahashi, Yamato Lab., IBM Japan Ltd., Yamato, Japan
K.M. Mohiuddin, Yamato Lab., IBM Japan Ltd., Yamato, Japan
pp. 698
Gi-Chul Yang, Dept. of Comput. Sci., Mokpo Nat. Univ., South Korea
Key-Sun Choi, Dept. of Comput. Sci., Mokpo Nat. Univ., South Korea
pp. 702
A.C. Downton, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
S.J. Hanlon, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
A. Amiri, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
pp. 707
R. Bippus, Inst. fur Nachrichtentech., Tech. Univ. Braunschweig, Germany
V. Märgner, Inst. fur Nachrichtentech., Tech. Univ. Braunschweig, Germany
pp. 711
Young-Joon Kim, Tech. Lab., BIT Comput. Co. Ltd., Seoul, South Korea
Seong-Whan Lee, Tech. Lab., BIT Comput. Co. Ltd., Seoul, South Korea
Myung-Won Kim, Tech. Lab., BIT Comput. Co. Ltd., Seoul, South Korea
pp. 715
Session 3.1 -A: Shape Models
G. Srikantan, Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
Dar-Shyang Lee, Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
J.T. Favata, Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
pp. 719
T. Pavlidis, Dept. of Comput. Sci., State Univ. of New York, Stony Brook, NY, USA
W.J. Sakoda, Dept. of Comput. Sci., State Univ. of New York, Stony Brook, NY, USA
H. Shi, Dept. of Comput. Sci., State Univ. of New York, Stony Brook, NY, USA
pp. 729
T. Kanungo, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
R.M. Haralick, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
H.S. Baird, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 734
A. Zramdini, Inst. of Inf., Fribourg Univ., Switzerland
R. Ingold, Inst. of Inf., Fribourg Univ., Switzerland
pp. 740
Session 3.1 -B: Item Extraction
Y. Belaïd, CRIN-INRIA Lorraine, Vandoeuvre-les-Nancy, France
A. Belaïl, CRIN-INRIA Lorraine, Vandoeuvre-les-Nancy, France
E. Turolla, CRIN-INRIA Lorraine, Vandoeuvre-les-Nancy, France
pp. 744
A. Agarwal, Sloan Sch. of Manage., MIT, Cambridge, MA, USA
L. Granowetter, Sloan Sch. of Manage., MIT, Cambridge, MA, USA
K. Hussein, Sloan Sch. of Manage., MIT, Cambridge, MA, USA
A. Gupta, Sloan Sch. of Manage., MIT, Cambridge, MA, USA
P.S.P. Wang, Sloan Sch. of Manage., MIT, Cambridge, MA, USA
pp. 748
Jianxing Yuan, Center for Pattern Recognition & Machine Intelligence, Concordia Univ., Montreal, Que., Canada
Y.Y. Tang, Center for Pattern Recognition & Machine Intelligence, Concordia Univ., Montreal, Que., Canada
C.Y. Suen, Center for Pattern Recognition & Machine Intelligence, Concordia Univ., Montreal, Que., Canada
pp. 752
Jenchyou Lii, Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
S.N. Srihari, Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
pp. 756
Session 3.1 -C: Document Segmentation
Su Chen, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
R.M. Haralick, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
I.T. Phillips, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 761
I. Leplumey, Inst. Nat. des Sci. Appliques, Rennes, France
J. Camillerapp, Inst. Nat. des Sci. Appliques, Rennes, France
C. Queguiner, Inst. Nat. des Sci. Appliques, Rennes, France
pp. 765
L. Likforman-Sulem, Ecole Nat. Superieure des Telecommun., Paris, France
A. Hanimyan, Ecole Nat. Superieure des Telecommun., Paris, France
C. Faure, Ecole Nat. Superieure des Telecommun., Paris, France
pp. 774
P. Stubberud, Dept. of Electr. & Comput. Eng., Nevada Univ., Las Vegas, NV, USA
J. Kanai, Dept. of Electr. & Comput. Eng., Nevada Univ., Las Vegas, NV, USA
V. Kalluri, Dept. of Electr. & Comput. Eng., Nevada Univ., Las Vegas, NV, USA
pp. 778
Sesson 3.1 -D: Diagram/Drawing Understanding
R.P. Futrelle, Coll. of Comput. Sci., Northeastern Univ., Boston, MA, USA
N. Nikolakis, Coll. of Comput. Sci., Northeastern Univ., Boston, MA, USA
pp. 782
Yuhong Yu, Legent Corp., Naperville, IL, USA
A. Samal, Legent Corp., Naperville, IL, USA
S.C. Seth, Legent Corp., Naperville, IL, USA
pp. 791
J.F. Arias, Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA
R. Kasturi, Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA
A. Chhabra, Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 795
Bin Yu, Inst. of Inf. Sci., Northern Jiaotong Univ., Beijing, China
pp. 803
Session 3.2-P: Poster Papers II
J.-P. Drouhard, Ecole de Technol. Superieure, Montreal, Que., Canada
R. Sabourin, Ecole de Technol. Superieure, Montreal, Que., Canada
M. Godbout, Ecole de Technol. Superieure, Montreal, Que., Canada
pp. 807
K. Kuhnke, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
L. Simoncini, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
Zs.M. Kovacs-V, Dipartimento di Elettronica, Inf. e Sistemistica, Bologna Univ., Italy
pp. 811
Choonsuk Oh, Dept. of Electron. Eng., Sun Moon Univ., Chunan, South Korea
Woo Sung Kim, Dept. of Electron. Eng., Sun Moon Univ., Chunan, South Korea
pp. 815
Y. Hamamoto, Fac. of Eng., Yamaguchi Univ., Ube, Japan
S. Uchimura, Fac. of Eng., Yamaguchi Univ., Ube, Japan
K. Masamizu, Fac. of Eng., Yamaguchi Univ., Ube, Japan
S. Tomita, Fac. of Eng., Yamaguchi Univ., Ube, Japan
pp. 819
Fu Chang, Inst. of Inf. Sci., Acad. Sinica, Taipei, Taiwan
Yung-Ping Cheng, Inst. of Inf. Sci., Acad. Sinica, Taipei, Taiwan
Yao-Sheng Huang, Inst. of Inf. Sci., Acad. Sinica, Taipei, Taiwan
pp. 824
Xin-Lun Zhou, Dept. of Electron. Eng., Fudan Univ., Shanghai, China
Xing-Cheng Hua, Dept. of Electron. Eng., Fudan Univ., Shanghai, China
Feng Li, Dept. of Electron. Eng., Fudan Univ., Shanghai, China
pp. 833
R. Audouin, Domaine de la Merci, Inst. Albert Boniot, La Tronche, France
L. Shastri, Domaine de la Merci, Inst. Albert Boniot, La Tronche, France
pp. 837
A. Malaviya, German Nat. Res. Center for Comput. Sci., St. Augustin, Germany
L. Peters, German Nat. Res. Center for Comput. Sci., St. Augustin, Germany
pp. 841
A. Filatov, Offline Recognition Dept., Paragraph Int., Sunnyvale, CA, USA
A. Gitis, Offline Recognition Dept., Paragraph Int., Sunnyvale, CA, USA
I. Kil, Offline Recognition Dept., Paragraph Int., Sunnyvale, CA, USA
pp. 845
Gwo-En Wang, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Jhing-Fa Wang, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 849
G. Congedo, Dipt. di Inf., Bari Univ., Italy
G. Dimauro, Dipt. di Inf., Bari Univ., Italy
S. Impedovo, Dipt. di Inf., Bari Univ., Italy
G. Pirlo, Dipt. di Inf., Bari Univ., Italy
pp. 853
A. Weigel, German Res. Center for Artificial Intelligence, Kaiserslautern, Germany
S. Baumann, German Res. Center for Artificial Intelligence, Kaiserslautern, Germany
J. Rohrschneider, German Res. Center for Artificial Intelligence, Kaiserslautern, Germany
pp. 857
Weimin Huang, Dept. of Autom., Tsinghua Univ., Beijing, China
Gang Rong, Dept. of Autom., Tsinghua Univ., Beijing, China
Zhaoqi Bian, Dept. of Autom., Tsinghua Univ., Beijing, China
pp. 861
B.A. Najoua, Ecole Nationale d'Ingenieurs de Monastir, Tunisia
E. Noureddine, Ecole Nationale d'Ingenieurs de Monastir, Tunisia
pp. 865
M.R. Hashemi, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
O. Fatemi, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
R. Safavi, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 869
K. Romeo-Pakker, La3i, Rouen Univ., Mont-Saint-Aignan, France
H. Miled, La3i, Rouen Univ., Mont-Saint-Aignan, France
Y. Lecourtier, La3i, Rouen Univ., Mont-Saint-Aignan, France
pp. 874
H. Wehbi, LERISS, Paris XII Univ., Val-de-Marne, France
H. Oulhadj, LERISS, Paris XII Univ., Val-de-Marne, France
J. Lemoine, LERISS, Paris XII Univ., Val-de-Marne, France
E. Petit, LERISS, Paris XII Univ., Val-de-Marne, France
pp. 878
Seong Hoon Kim, Dept. of Electron. Eng., Yonsei Univ., Seoul, South Korea
Myoung Soo Park, Dept. of Electron. Eng., Yonsei Univ., Seoul, South Korea
Jaihie Kim, Dept. of Electron. Eng., Yonsei Univ., Seoul, South Korea
pp. 882
Seung-Ho Lee, Dept. of Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
Hyunkyu Lee, Dept. of Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
J.H. Kim, Dept. of Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
pp. 886
Ke Han, Dept. of Comput. Sci., Wayne State Univ., Detroit, MI, USA
I.K. Sethi, Dept. of Comput. Sci., Wayne State Univ., Detroit, MI, USA
pp. 894
S. Tsuruoka, Dept. of Electr. & Electron. Eng., Mie Univ., Tsu, Japan
N. Watanabe, Dept. of Electr. & Electron. Eng., Mie Univ., Tsu, Japan
N. Minamide, Dept. of Electr. & Electron. Eng., Mie Univ., Tsu, Japan
F. Kimura, Dept. of Electr. & Electron. Eng., Mie Univ., Tsu, Japan
Y. Miyake, Dept. of Electr. & Electron. Eng., Mie Univ., Tsu, Japan
M. Shridhar, Dept. of Electr. & Electron. Eng., Mie Univ., Tsu, Japan
pp. 902
F. Kimura, Fac. of Eng., Mie Univ., Tsu, Japan
Y. Miyake, Fac. of Eng., Mie Univ., Tsu, Japan
M. Shridhar, Fac. of Eng., Mie Univ., Tsu, Japan
pp. 906
S. Madhvanath, CEDAR, State Univ. of New York, Buffalo, NY, USA
V. Govindaraju, CEDAR, State Univ. of New York, Buffalo, NY, USA
pp. 911
T. Caesar, Text Understanding Dept., Daimler-Benz AG, Ulm, Germany
J.M. Gloger, Text Understanding Dept., Daimler-Benz AG, Ulm, Germany
E. Mandler, Text Understanding Dept., Daimler-Benz AG, Ulm, Germany
pp. 915
Chien-Huei Chen, Inf., Telecommun., & Autom. Div., SRI Int., Menlo Park, CA, USA
pp. 919
O.D. Trier, Dept. of Inf., Oslo Univ., Norway
T. Taxt, Dept. of Inf., Oslo Univ., Norway
A.K. Jain, Dept. of Inf., Oslo Univ., Norway
pp. 923
L. Eikvil, Norwegian Comput. Center, Oslo, Norway
K. Aas, Norwegian Comput. Center, Oslo, Norway
H. Koren, Norwegian Comput. Center, Oslo, Norway
pp. 927
J.S. Shieh, Dept. of Comput. Sci., Memorial Univ. of Newfoundland, St. John's, Nfld., Canada
pp. 931
O. Shiku, Sasebo Coll. of Technol., Japan
A. Nakamura, Sasebo Coll. of Technol., Japan
M. Anegawa, Sasebo Coll. of Technol., Japan
H. Takahira, Sasebo Coll. of Technol., Japan
H. Kuroda, Sasebo Coll. of Technol., Japan
pp. 936
M. Anegawa, Dept. of Electr. Eng. & Comput. Sci., Nagasaki Univ., Japan
O. Shiku, Dept. of Electr. Eng. & Comput. Sci., Nagasaki Univ., Japan
A. Nakamura, Dept. of Electr. Eng. & Comput. Sci., Nagasaki Univ., Japan
T. Ohyamat, Dept. of Electr. Eng. & Comput. Sci., Nagasaki Univ., Japan
H. Kuroda, Dept. of Electr. Eng. & Comput. Sci., Nagasaki Univ., Japan
pp. 940
P.K. Rhee, Dept. of Comput. Sci. & Eng., Inha Univ., Inchon, South Korea
J.S. Park, Dept. of Comput. Sci. & Eng., Inha Univ., Inchon, South Korea
Y.G. Kang, Dept. of Comput. Sci. & Eng., Inha Univ., Inchon, South Korea
pp. 944
Jiing-Yuh Wang, Dept. of Inf. & Electron. Eng., Nat. Central Univ., Chung-Li, Taiwan
Liang-Hua Chen, Dept. of Inf. & Electron. Eng., Nat. Central Univ., Chung-Li, Taiwan
Kuo-Chin Fan, Dept. of Inf. & Electron. Eng., Nat. Central Univ., Chung-Li, Taiwan
Hong-Yuan Mark Liao, Dept. of Inf. & Electron. Eng., Nat. Central Univ., Chung-Li, Taiwan
pp. 948
Jaekyu Ha, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
R.M. Haralick, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
I.T. Phillips, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 952
Jaekyu Ha, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
R.M. Haralick, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
I.T. Phillips, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 956
K. Kise, Dept. of Comput. & Syst. Sci., Osaka Prefecture Univ., Japan
N. Yoneda, Dept. of Comput. & Syst. Sci., Osaka Prefecture Univ., Japan
S. Takamatsu, Dept. of Comput. & Syst. Sci., Osaka Prefecture Univ., Japan
K. Fukunaga, Dept. of Comput. & Syst. Sci., Osaka Prefecture Univ., Japan
pp. 960
K. Ryall, Harvard Univ., Cambridge, MA, USA
S. Shieber, Harvard Univ., Cambridge, MA, USA
J. Marks, Harvard Univ., Cambridge, MA, USA
M. Mazer, Harvard Univ., Cambridge, MA, USA
pp. 964
Tun-Wen Pai, Basic Res. Lab., Telecommun. Labs., Taiwan
Tieh-Ming Wu, Basic Res. Lab., Telecommun. Labs., Taiwan
Gan-How Chang, Basic Res. Lab., Telecommun. Labs., Taiwan
Pei-Yih Ting, Basic Res. Lab., Telecommun. Labs., Taiwan
pp. 974
Hong Guo, Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
Xiaoqing Ding, Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
Zhong Zhang, Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
Fanxia Guo, Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
Youshou Wu, Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
pp. 978
F. Chin, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
F. Wu, Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
pp. 982
Jeong-Hun Jang, Dept. of Electr. Eng., Pohang Inst. of Sci. & Technol., South Korea
Jeong-Hoe Ku, Dept. of Electr. Eng., Pohang Inst. of Sci. & Technol., South Korea
Ki-Sang Hong, Dept. of Electr. Eng., Pohang Inst. of Sci. & Technol., South Korea
Jae-Ho Kim, Dept. of Electr. Eng., Pohang Inst. of Sci. & Technol., South Korea
pp. 986
H. Samet, Dept. of Comput. Sci., Maryland Univ., College Park, MD, USA
A. Soffer, Dept. of Comput. Sci., Maryland Univ., College Park, MD, USA
pp. 992
D. Bouchaffra, Lab. d'Analyse Cognitive de l'Inf., UQAM, Canada
J.G. Meunier, Lab. d'Analyse Cognitive de l'Inf., UQAM, Canada
pp. 997
Session 3.3-A: Word and Character Recognition
T.M. Ha, Inst. fur Inf. und Angewandte Math., Berne Univ., Switzerland
D. Niggeler, Inst. fur Inf. und Angewandte Math., Berne Univ., Switzerland
H. Bunke, Inst. fur Inf. und Angewandte Math., Berne Univ., Switzerland
pp. 1003
Seong-Whan Lee, Dept. of Comput. Sci., Korea Univ., Seoul, South Korea
Young-Joon Kim, Dept. of Comput. Sci., Korea Univ., Seoul, South Korea
pp. 1010
T. Hisamitsu, Adv. Res. Lab., Hitachi Ltd., Saitama, Japan
K. Marukawa, Adv. Res. Lab., Hitachi Ltd., Saitama, Japan
Y. Shima, Adv. Res. Lab., Hitachi Ltd., Saitama, Japan
H. Fujisawa, Adv. Res. Lab., Hitachi Ltd., Saitama, Japan
Y. Nitta, Adv. Res. Lab., Hitachi Ltd., Saitama, Japan
pp. 1014
M. Cullen, Pitney Bowes Inc., Shelton, CT, USA
L. Pintsov, Pitney Bowes Inc., Shelton, CT, USA
B. Romansky, Pitney Bowes Inc., Shelton, CT, USA
pp. 1018
A. El Yacoubi, Service de Recherche Tech. de La Poste, La Poste, Nantes, France
J.-M. Bertille, Service de Recherche Tech. de La Poste, La Poste, Nantes, France
M. Gilloux, Service de Recherche Tech. de La Poste, La Poste, Nantes, France
pp. 1024
Session 3.3-B: Segmentation II
R.G. Casey, IBM Almaden Res. Center, San Jose, CA, USA
E. Lecolinet, IBM Almaden Res. Center, San Jose, CA, USA
pp. 1028
A. Negi, Dept. of Comput. & Inf. Sci., Hyderabad Univ., India
K.S. Swaroop, Dept. of Comput. & Inf. Sci., Hyderabad Univ., India
A. Agarwal, Dept. of Comput. & Inf. Sci., Hyderabad Univ., India
pp. 1034
G. Congedo, Dipartimento di Inf., Univ. degli Studi di Bari, Italy
G. Dimauro, Dipartimento di Inf., Univ. degli Studi di Bari, Italy
S. Impedovo, Dipartimento di Inf., Univ. degli Studi di Bari, Italy
G. Pirlo, Dipartimento di Inf., Univ. degli Studi di Bari, Italy
pp. 1038
S. Liang, Windsor Univ., Ont., Canada
M. Ahmadi, Windsor Univ., Ont., Canada
M. Shridhar, Windsor Univ., Ont., Canada
pp. 1042
C.M. Privitera, Dept. de Genie Electr., Ecole Polytech. de Montreal, Que., Canada
R. Plamondon, Dept. de Genie Electr., Ecole Polytech. de Montreal, Que., Canada
pp. 1047
Session 3.3-C: On-Line Recognition II
Byung Hwan Jun, Dept. of Electron. Eng., Yonsei Univ., Seoul, South Korea
Moo Young Kim, Dept. of Electron. Eng., Yonsei Univ., Seoul, South Korea
Chang Soo Kim, Dept. of Electron. Eng., Yonsei Univ., Seoul, South Korea
Woo Seong Kim, Dept. of Electron. Eng., Yonsei Univ., Seoul, South Korea
Jaihie Kim, Dept. of Electron. Eng., Yonsei Univ., Seoul, South Korea
pp. 1051
T. Wakahara, NTT Human Interface Labs., Kanagawa, Japan
A. Suzuki, NTT Human Interface Labs., Kanagawa, Japan
N. Nakajima, NTT Human Interface Labs., Kanagawa, Japan
S. Miyahara, NTT Human Interface Labs., Kanagawa, Japan
K. Odaka, NTT Human Interface Labs., Kanagawa, Japan
pp. 1059
P.K. Rhee, Comput. Sci. & Eng., Inha Univ., Inchon, South Korea
T. Fujisaki, Comput. Sci. & Eng., Inha Univ., Inchon, South Korea
pp. 1065
Session 3.3-D: Theoretical Approach and Music Recognition
H. Miyao, Fac. of Eng., Shinshu Univ., Nagano, Japan
Y. Nakano, Fac. of Eng., Shinshu Univ., Nagano, Japan
pp. 1074
S. Baumann, German Res. Center for Artificial Intelligence, Kaiserslautern, Germany
pp. 1080
Session 3.4-A: Learning
T. Matsunaga, NTT Data Commun. Syst. Corp., Kanagawa, Japan
H. Kida, NTT Data Commun. Syst. Corp., Kanagawa, Japan
pp. 1103
Dz-Mou Jung, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
G. Nagy, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 1115
Session 3.4-B: Layout Analysis
Jaekyu Ha, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
R.M. Haralick, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
I.T. Phillips, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 1119
A. Azokly, Inst. of Inf., Fribourg Univ., Switzerland
R. Ingold, Inst. of Inf., Fribourg Univ., Switzerland
pp. 1123
A. Antonacopoulos, Dept. of Comput., Univ. of Manchester Inst. of Sci. & Technol., UK
R.T. Ritchings, Dept. of Comput., Univ. of Manchester Inst. of Sci. & Technol., UK
pp. 1132
F. Cesarini, Dept. of Syst. & Inf., Florence Univ., Italy
M. Gori, Dept. of Syst. & Inf., Florence Univ., Italy
S. Marinai, Dept. of Syst. & Inf., Florence Univ., Italy
G. Soda, Dept. of Syst. & Inf., Florence Univ., Italy
pp. 1136
Session 3.4-C: Skew Detection and Processing
N. Rondel, Thomson Broadband Syst., Cesson-Sevigne, France
G. Burel, Thomson Broadband Syst., Cesson-Sevigne, France
pp. 1141
Chiu L. Yu, Center for Pattern Recognition & Machine Intelligence, Concordia Univ., Montreal, Que., Canada
Yuan Y. Tang, Center for Pattern Recognition & Machine Intelligence, Concordia Univ., Montreal, Que., Canada
Ching Y. Suen, Center for Pattern Recognition & Machine Intelligence, Concordia Univ., Montreal, Que., Canada
pp. 1149
Su Chen, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
R.M. Haralick, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
I.T. Phillips, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 1153
I.S.I. Abuhaiba, Dept. of Comput. Eng., King Saud Univ., Riyadh, Saudi Arabia
S. Datta, Dept. of Comput. Eng., King Saud Univ., Riyadh, Saudi Arabia
M.J.J. Holt, Dept. of Comput. Eng., King Saud Univ., Riyadh, Saudi Arabia
pp. 1157
Session 3.4-D: Storage and Retrieval
R.K. Srihari, Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
pp. 1165
Chin Lu, Dept. of Comput. Sci., Chinese Univ. of Hong Kong, Shatin, Hong Kong
K.H. Lee, Dept. of Comput. Sci., Chinese Univ. of Hong Kong, Shatin, Hong Kong
H.Y. Chen, Dept. of Comput. Sci., Chinese Univ. of Hong Kong, Shatin, Hong Kong
pp. 1169
Iconic paper (Abstract)
M. Peairs, Res. Center, Ricoh, CA, USA
pp. 1174
M. Worring, Fac. of Math. & Comput. Sci., Amsterdam Univ., Netherlands
R. van den Boomgaard, Fac. of Math. & Comput. Sci., Amsterdam Univ., Netherlands
A.W.M. Smeulders, Fac. of Math. & Comput. Sci., Amsterdam Univ., Netherlands
pp. 1180
G. Leedham, Sch. of Appl. Sci., Nanyang Technol. Inst., Singapore
D. Monger, Sch. of Appl. Sci., Nanyang Technol. Inst., Singapore
pp. 1185
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