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2009 Digest of Technical Papers International Conference on Consumer Electronics
Las Vegas, NV, USA
January 10-January 14
ISBN: 978-1-4244-2558-7
Table of Contents
Papers
Hyuk Lee, Division of Electronics and Computer Engineering, Hanyang University, Korea
Soonjong Jin, Division of Electronics and Computer Engineering, Hanyang University, Korea
Jechang Jeong, Division of Electronics and Computer Engineering, Hanyang University, Korea
pp. 1-2
Young-Guk Ha, Department of Computer Science and Engineering, Konkuk University, Seoul, Korea
pp. 1-2
Mathieu Robart, AST, STMicroelectronics, Bristol, UK
Steve Hill, AST, STMicroelectronics, Bristol, UK
pp. 1-2
Saraju P. Mohanty, VLSI Design and CAD Laboratory (VDCL), University of North Texas, Denton, 76207, USA
Dhruva Ghai, VLSI Design and CAD Laboratory (VDCL), University of North Texas, Denton, 76207, USA
Elias Kougianos, VLSI Design and CAD Laboratory (VDCL), University of North Texas, Denton, 76207, USA
Priyadarsan Patra, Validation Research Lab, Intel Corporation, Hillsboro, OR 97124, USA
pp. 1-2
Chung-Yen Su, National Taiwan Normal University, Taipei, Taiwan, R.O.C.
Gen-Hau Fan, National Taiwan Normal University, Taipei, Taiwan, R.O.C.
Yi-Shien Lin, National Taiwan Normal University, Taipei, Taiwan, R.O.C.
pp. 1-2
Martin Lopez-Nores, Telematics Engineering Dept., University of Vigo (Spain)
Jose J. Pazos-Arias, Telematics Engineering Dept., University of Vigo (Spain)
Jorge Garcia-Duque, Telematics Engineering Dept., University of Vigo (Spain)
Yolanda Blanco-Fernandez, Telematics Engineering Dept., University of Vigo (Spain)
Manuel Ramos-Cabrer, Telematics Engineering Dept., University of Vigo (Spain)
pp. 1-2
E.B. Bellers, NXP Semiconductors, San Jose, CA, USA
J.G.W.M. Janssen, NXP Semiconductors, San Jose, CA, USA
M. Penners, NXP Semiconductors, San Jose, CA, USA
pp. 1-2
Saraju P. Mohanty, Dept. of Computer Science and Engineering, University of North Texas, 76207, USA
pp. 1-2
Haiyan He, NXP Semiconductors, San Jose, USA
Johan G. Janssen, NXP Semiconductors, San Jose, USA
Erwin Bellers, NXP Semiconductors, San Jose, USA
pp. 1-2
Katsuyuki Nakamura, Embedded System Platform Research Lab., Hitachi Ltd., Kanagawa, Japan
Shohei Saito, Embedded System Platform Research Lab., Hitachi Ltd., Kanagawa, Japan
Toru Yokoyama, Embedded System Platform Research Lab., Hitachi Ltd., Kanagawa, Japan
Seiji Mochizuki, Renesas Technology Corp., Tokyo, Japan
Tetsuya Shibayama, Renesas Technology Corp., Tokyo, Japan
Kenichi Iwata, Renesas Technology Corp., Tokyo, Japan
pp. 1-2
Atsushi Katayama, National Institute of Informatics, Japan
Ryo Kitahara, Nippon Telegraph and Telephone Corporation, Japan
Harumi Kawamura, Nippon Telegraph and Telephone Corporation, Japan
Hideki Koike, Nippon Telegraph and Telephone Corporation, Japan
pp. 1-2
T. Imagawa, Advanced Technology Research Laboratories, Panasonic Corporation, Kyoto, Japan
T. Azuma, Advanced Technology Research Laboratories, Panasonic Corporation, Kyoto, Japan
K. Nobori, Advanced Technology Research Laboratories, Panasonic Corporation, Kyoto, Japan
H. Motomura, Advanced Technology Research Laboratories, Panasonic Corporation, Kyoto, Japan
pp. 1-2
Chua-Chin Wang, Department of Electrical Engineering, National Sun Yat-Sen University, 80424, Taiwan
Gang-Neng Sung, Department of Electrical Engineering, National Sun Yat-Sen University, 80424, Taiwan
Ching-Lin Wang, Department of Electrical Engineering, National Sun Yat-Sen University, 80424, Taiwan
Po-Cheng Chen, Department of Electrical Engineering, National Sun Yat-Sen University, 80424, Taiwan
pp. 1-2
Shinichi Yoshizawa, Panasonic Corporation, 1006, Kadoma, Kadoma City, Osaka, 571-8501, Japan
Yoshihisa Nakatoh, Panasonic Corporation, 1006, Kadoma, Kadoma City, Osaka, 571-8501, Japan
pp. 1-2
Ali Al Ghouwayel, SUPELEC - IETR, Avenue de la Boulaie - CS 47601, 35576 Cesson-Sévigné cedex, France
Yves Louet, SUPELEC - IETR, Avenue de la Boulaie - CS 47601, 35576 Cesson-Sévigné cedex, France
pp. 1-2
Yafei Hou, Research Center for Information and Communication Systems, Ryukoku Univ. Japan
Tomohiro Hase, Research Center for Information and Communication Systems, Ryukoku Univ. Japan
pp. 1-2
Kohei Ito, Pioneer Corporation, Japan
Naohiko Ichihara, Pioneer Corporation, Japan
Hiroto Inoue, Pioneer Corporation, Japan
Ryujiro Fujita, Pioneer Corporation, Japan
Mitsuo Yasushi, Pioneer Corporation, Japan
pp. 1-2
M. T. Pourazad, Electrical and Computer Engineering Department, University of British Columbia, Canada
P. Nasiopoulos, Electrical and Computer Engineering Department, University of British Columbia, Canada
R. K. Ward, Electrical and Computer Engineering Department, University of British Columbia, Canada
pp. 1-2
Jim S. Jimmy Li, School of Computer Science, Engineering and Mathematics, Flinders University, GPO Box 2100, Adelaide SA 5001, Australia
Sharmil Randhawa, School of Computer Science, Engineering and Mathematics, Flinders University, GPO Box 2100, Adelaide SA 5001, Australia
pp. 1-2
Yan Liu, Graduate University, Chinese Academy of Sciences, Beijing, China
Mouyan Zou, Graduate University, Chinese Academy of Sciences, Beijing, China
pp. 1-2
Ralph van Dinther, Philips Research Laboratories, Eindhoven, The Netherlands
Martin F. McKinney, Philips Research Laboratories, Eindhoven, The Netherlands
Hong R. Li, NXP Research, Eindhoven, The Netherlands
pp. 1-2
Toshiyasu Higuma, Living Environment System Laboratory MITSUBISHI ELECTRIC CORP., Japan
Noriyuki Kushiro, Living Environment System Laboratory MITSUBISHI ELECTRIC CORP., Japan
Takuya Mukai, Living Environment System Laboratory MITSUBISHI ELECTRIC CORP., Japan
Makoto Katsukura, Living Environment System Laboratory MITSUBISHI ELECTRIC CORP., Japan
pp. 1-2
Hitoshi Yamada, AV Core Technology Development Center, Panasonic Co., Ltd. Kadoma, Japan
Masayuki Kimura, AV Core Technology Development Center, Panasonic Co., Ltd. Kadoma, Japan
Jun Ohmiya, AV Core Technology Development Center, Panasonic Co., Ltd. Kadoma, Japan
Jun'ichi Tagawa, AV Core Technology Development Center, Panasonic Co., Ltd. Kadoma, Japan
Trung Ngo Thanh, The Institute of Scientific and Industrial Research, Osaka University, Japan
Yasuhiro Mukaigawa, The Institute of Scientific and Industrial Research, Osaka University, Japan
Yasushi Yagi, The Institute of Scientific and Industrial Research, Osaka University, Japan
pp. 1-2
Jae Kwang Lim, School of Electrical Engineering and Computer Science, Kyungpook National University, Daegu, 702-701, Korea
Heung-Sik Tae, School of Electrical Engineering and Computer Science, Kyungpook National University, Daegu, 702-701, Korea
Dong-Ho Lee, School of Electrical Engineering and Computer Science, Kyungpook National University, Daegu, 702-701, Korea
Su Jin Kim, Plasma Display Panel Division, Samsung SDI Company, Ltd., Cheonan City 330-300, Korea
Kazuhiro Ito, Plasma Display Panel Division, Samsung SDI Company, Ltd., Cheonan City 330-300, Korea
Jung Pil Park, Plasma Display Panel Division, Samsung SDI Company, Ltd., Cheonan City 330-300, Korea
Nam Sung Jung, Plasma Display Panel Division, Samsung SDI Company, Ltd., Cheonan City 330-300, Korea
pp. 1-2
F. J. Lopez-Martinez, Communication Engineering Department, University of Málaga, Spain
E. del Castillo-Sanchez, Communication Engineering Department, University of Málaga, Spain
E. Martos-Naya, Communication Engineering Department, University of Málaga, Spain
J. T. Entrambasaguas, Communication Engineering Department, University of Málaga, Spain
pp. 1-2
Mirko Guarnera, STMicroelectronics, Imaging Team, AST Catania Lab, Italy
Giuseppe Messina, STMicroelectronics, Imaging Team, AST Catania Lab, Italy
Edoardo Ardizzone, Dept. of Computer Engineering, University of Palermo, Italy
Leonardo Agro, Dept. of Computer Engineering, University of Palermo, Italy
pp. 1-2
Giuseppe Spampinato, STMicroelectronics, Advanced System Technology, Imaging Group, Catania Lab, Italy
Alfio Castorina, STMicroelectronics, Advanced System Technology, Imaging Group, Catania Lab, Italy
Arcangelo Bruna, STMicroelectronics, Advanced System Technology, Imaging Group, Catania Lab, Italy
Alessandro Capra, STMicroelectronics, Advanced System Technology, Imaging Group, Catania Lab, Italy
pp. 1-2
Jianbai Wang, Pixel Development, Digital Light Processing (DLP¿), Texas Instruments Inc., USA
James Huffman, Pixel Development, Digital Light Processing (DLP¿), Texas Instruments Inc., USA
Paulo Pinheiro, Pixel Development, Digital Light Processing (DLP¿), Texas Instruments Inc., USA
James Hall, Pixel Development, Digital Light Processing (DLP¿), Texas Instruments Inc., USA
pp. 1-2
Dongkyun Jeong, SAIT, Samsung Electronics, Suwon, Korea
Kamalneet, SISO, Samsung Electronics, Bangalore, India
Namin Kim, Telecommunication R&D Center, Samsung Electronics, Suwon, Korea
Soochan Lim, Telecommunication R&D Center, Samsung Electronics, Suwon, Korea
pp. 1-2
Tatsuya Hirai, Central Research Laboratory, Hitachi, Ltd., Japan
Yukihide Inagaki, Central Research Laboratory, Hitachi, Ltd., Japan
pp. 1-2
Shuichi Aoki, NHK (Japan Broadcasting Corporation), Tokyo, Japan
Katsunori Aoki, NHK (Japan Broadcasting Corporation), Tokyo, Japan
pp. 1-2
Kiyomi Sakamoto, Panasonic Corporation, Japan
Shoichi Aoyama, Panasonic Corporation, Japan
Shigeo Asahara, Panasonic Corporation, Japan
Kuniko Yamashita, Osaka City University, Japan
Akira Okada, Osaka City University, Japan
pp. 1-2
Heechul Han, Digital Media R&D Center, Samsung Electronics, Korea
Kwanghoon Sohn, School of Electrical&Electronic Engineering, Yonsei University, Korea
pp. 1-2
Toru Yamada, Common Platform Software Research Laboratories, NEC Corporation, Japan
Yoshihiro Miyamoto, Common Platform Software Research Laboratories, NEC Corporation, Japan
Masahiro Serizawa, Common Platform Software Research Laboratories, NEC Corporation, Japan
pp. 1-2
Masato Tsukada, Common Platform Software Research Labs., NEC Corporation, Japan
Chisato Funayama, Common Platform Software Research Labs., NEC Corporation, Japan
Masato Toda, Common Platform Software Research Labs., NEC Corporation, Japan
Ryota Oami, Common Platform Software Research Labs., NEC Corporation, Japan
Masatoshi Arai, NEC Informatec Systems, Ltd., Japan
Akira Inoue, Common Platform Software Research Labs., NEC Corporation, Japan
pp. 1-2
Ryozo Kiyohara, Information technology R&D Center, Mitsubishi Electric Corporation, Japan
Satoshi Mii, Information technology R&D Center, Mitsubishi Electric Corporation, Japan
Mitsuhiro Matsumoto, Graduate School of Information Science and Technology, Osaka University, Japan
Masayuki Numao, Institute of Scientific and Industrial Research, Osaka University, Japan
Satoshi Kurihara, Institute of Scientific and Industrial Research, Osaka University, Japan
pp. 1-2
Chang Su Han, Digital Media R&D Center, Samsung Electronics Co, Ltd., Korea
Jae Hun Lee, Digital Media R&D Center, Samsung Electronics Co, Ltd., Korea
pp. 1-2
Makoto Katsukura, Living and Environment System Laboratory, MITSUBISHI ELECTRIC CORP., Japan
Masanori Nakata, Living and Environment System Laboratory, MITSUBISHI ELECTRIC CORP., Japan
Yoshiaki Itou, Living and Environment System Laboratory, MITSUBISHI ELECTRIC CORP., Japan
Noriyuki Kushiro, Living and Environment System Laboratory, MITSUBISHI ELECTRIC CORP., Japan
pp. 1-2
Seong-Jun Kim, Korea Electronics Technology Institute, Seoul, Korea
Kyung-Won Park, Korea Electronics Technology Institute, Seoul, Korea
Se-Ho Park, Korea Electronics Technology Institute, Seoul, Korea
Ki-Won Kwon, Korea Electronics Technology Institute, Seoul, Korea
Jong-Ho Paik, Korea Electronics Technology Institute, Seoul, Korea
pp. 1-2
Ana Fernandez Vilas, Dept. of Telematics Engineering. University of Vigo. 36310 Spain
Rebeca Diaz Redondo, Dept. of Telematics Engineering. University of Vigo. 36310 Spain
Jose Pazos Arias, Dept. of Telematics Engineering. University of Vigo. 36310 Spain
Alberto Gil Solla, Dept. of Telematics Engineering. University of Vigo. 36310 Spain
Jorge Garcia Duque, Dept. of Telematics Engineering. University of Vigo. 36310 Spain
pp. 1-2
Rebeca P. Diaz Redondo, Dept. of Telematics Engineering, University of Vigo, 36200, Spain
Ana Fernandez Vilas, Dept. of Telematics Engineering, University of Vigo, 36200, Spain
Jose J. Pazos Arias, Dept. of Telematics Engineering, University of Vigo, 36200, Spain
Alberto Gil Solla, Dept. of Telematics Engineering, University of Vigo, 36200, Spain
Manuel Ramos Cabrer, Dept. of Telematics Engineering, University of Vigo, 36200, Spain
pp. 1-2
Yoshio Nakadai, NTT Cyber solutions Laboratories, NTT Corporation, Japan
Toshiharu Morizumi, NTT Cyber solutions Laboratories, NTT Corporation, Japan
Ushio Shibusawa, NTT Cyber solutions Laboratories, NTT Corporation, Japan
Youichi Takashima, NTT Cyber solutions Laboratories, NTT Corporation, Japan
Masanobu Abe, NTT Cyber solutions Laboratories, NTT Corporation, Japan
pp. 1-2
Rebeca P. Diaz Redondo, Dept. of Telematics Engineering, University of Vigo, 36200, Spain
Ana Fernandez Vilas, Dept. of Telematics Engineering, University of Vigo, 36200, Spain
Jose J. Pazos Arias, Dept. of Telematics Engineering, University of Vigo, 36200, Spain
Manuel Ramos Cabrer, Dept. of Telematics Engineering, University of Vigo, 36200, Spain
Jorge Garcia Duque, Dept. of Telematics Engineering, University of Vigo, 36200, Spain
pp. 1-2
Harksoo-Kim, Multimedia Signal Processing Lab. Korea Polytechnic University, Siheung, KOREA
Moon-Cheol Kim, Multimedia Signal Processing Lab. Korea Polytechnic University, Siheung, KOREA
Kyoungwon-Lim, Digital TV Lab. LG Electronics. Inc., Seoul, KOREA
Eung-Tae Kim, Multimedia Signal Processing Lab. Korea Polytechnic University, Siheung, KOREA
pp. 1-2
P. Ferre, University of Bristol, UK
P. Hill, University of Bristol, UK
D. Halls, University of Bristol, UK
J. Chung-How, Provision Communications, UK
A. Nix, University of Bristol, UK
D. Bull, University of Bristol, UK
pp. 1-2
Ana Belen Barragans Martinez, Telematic Engineering Department, University of Vigo. 36310, Spain
Jose J. Pazos Arias, Telematic Engineering Department, University of Vigo. 36310, Spain
Ana Fernandez Vilas, Telematic Engineering Department, University of Vigo. 36310, Spain
Jorge Garcia Duque, Telematic Engineering Department, University of Vigo. 36310, Spain
Martin Lopez Nores, Telematic Engineering Department, University of Vigo. 36310, Spain
pp. 1-2
Masahiro Fukui, NTT Cyber Space Laboratories, NTT Corporation, Tokyo 180-8585, Japan
Akira Nakagawa, NTT Cyber Space Laboratories, NTT Corporation, Tokyo 180-8585, Japan
Suehiro Shimauchi, NTT Cyber Space Laboratories, NTT Corporation, Tokyo 180-8585, Japan
Yoichi Haneda, NTT Cyber Space Laboratories, NTT Corporation, Tokyo 180-8585, Japan
Akitoshi Kataoka, Faculty of Science and Technology, Ryukoku University, Shiga 520-2914, Japan
pp. 1-2
Istvan Papp, Faculty of Technical Sciences, Novi Sad, Serbia
Nemanja Lukic, Faculty of Technical Sciences, Novi Sad, Serbia
Zoran Marceta, Faculty of Technical Sciences, Novi Sad, Serbia
Nikola Teslic, Faculty of Technical Sciences, Novi Sad, Serbia
Markus Schu, Micronas Gmbh, Munich, Germany
pp. 1-2
Hiroyuki Kondo, Renesas Technology Corporation, Japan
Osamu Yamamoto, Renesas Technology Corporation, Japan
Sugako Otani, Renesas Technology Corporation, Japan
Naoto Sugai, Mitsubishi Electric Corp. Information Technology R&D Center, Kanagawa, Japan
Toru Shimizu, Renesas Technology Corporation, Japan
pp. 1-2
Yu-Jui Lin, Dept. of Electrical Engineering, National Taiwan University, Taipei, Taiwan 106, R.O.C.
Chih-Tsung Shen, Academia Sinica, Taipei, Taiwan
Chun-Cheng Lin, Dept. of Electrical Engineering, National Taiwan University, Taipei, Taiwan 106, R.O.C.
Hsu-Chun Yen, Dept. of Electrical Engineering, National Taiwan University, Taipei, Taiwan 106, R.O.C.
pp. 1-2
Akitsugu Baba, NHK (Japan Broadcasting Corporation), Tokyo, Japan
Masaru Takechi, NHK (Japan Broadcasting Corporation), Tokyo, Japan
Haruo Hoshino, NHK (Japan Broadcasting Corporation), Tokyo, Japan
Yoshiaki Shishikui, NHK (Japan Broadcasting Corporation), Tokyo, Japan
pp. 1-2
Laurent Pasquier, ST-NXP Wireless, Image and Video Innovation Center, Suresnes, France
Jean Gobert, ST-NXP Wireless, Image and Video Innovation Center, Suresnes, France
pp. 1-2
Felix Jesus Villanueva, School of Computer Science, University of Castilla-La Mancha, Spain
David Villa, School of Computer Science, University of Castilla-La Mancha, Spain
Maria Jose Santofimia, School of Computer Science, University of Castilla-La Mancha, Spain
Francisco Moya, School of Computer Science, University of Castilla-La Mancha, Spain
Juan Carlos Lopez, School of Computer Science, University of Castilla-La Mancha, Spain
pp. 1-2
Wonjung Yoon, Dankook University, Yongin-si, Korea
Kyusik Park, Dankook University, Yongin-si, Korea
pp. 1-2
Masanobu Abe, NTT Cyber Solution Laboratories, NTT Corporation, Japan
Yuji Morinishi, NTT Cyber Solution Laboratories, NTT Corporation, Japan
Atsuhiko Maeda, NTT Cyber Solution Laboratories, NTT Corporation, Japan
Masakastu Aoki, NTT Cyber Solution Laboratories, NTT Corporation, Japan
Hirohito Inagaki, NTT Cyber Solution Laboratories, NTT Corporation, Japan
pp. 1-2
Hyun-Seung Lee, Multi-Media Platform Lab., Digital Media Research and Development Center, Samsung Electronics, Co., Ltd., Korea
Rae-Hong Park, Dept. of EE, Sogang Univ., C.P.O. Box 1142, Seoul 100-611, Korea
Sung Hee Kim, Digital Media R&D Center, Samsung Electronics Co., Ltd., Suwon, Korea
pp. 1-2
Yongtae Kim, Advanced Integrated Systems Lab., Korea University, Seoul, Korea
Junyoung Song, Advanced Integrated Systems Lab., Korea University, Seoul, Korea
Woonhyung Heo, Advanced Integrated Systems Lab., Korea University, Seoul, Korea
Chulwoo Kim, Advanced Integrated Systems Lab., Korea University, Seoul, Korea
pp. 1-2
H. Li, NXP Research, Eindhoven, The Netherlands
B. Guayrin, ENSEIRB, Bordeaux, France
R. van Dinther, Philips Research Laboratories, Eindhoven, The Netherlands
pp. 1-2
Jun Ho Cho, Digital Media R&D Center, Samsung Electronics Co., Ltd., South Korea
Tae Gyoung Ahn, Digital Media R&D Center, Samsung Electronics Co., Ltd., South Korea
Jae Hun Lee, Digital Media R&D Center, Samsung Electronics Co., Ltd., South Korea
pp. 1-2
Mi-Kyung Oh, Electronics and Telecommunications Research Institute (ETRI), Daejeon, Korea
Jae-Young Kim, Electronics and Telecommunications Research Institute (ETRI), Daejeon, Korea
pp. 1-2
Chu Yu, Department of Electronic Engineering, National ILan University, Yilan, Taiwan, R.O.C.
Mao-Hsu Yen, Department of Computer Science and Engineering, National Taiwan Ocean University, Keelung, Taiwan, R.O.C.
Pao-Ann Hsiung, Department of Computer Science and Information Engineering, National Chung Cheng University, Chiayi, Taiwan, R.O.C.
Sao-Jie Chen, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan, R.O.C.
pp. 1-2
Jinyong Ahn, Digital Media R&D Center, Samsung Electronics, Korea
Keumyong Oh, Digital Media R&D Center, Samsung Electronics, Korea
pp. 1-2
Eun Chang Choi, Electronics and Telecommunications Research Institute, Korea
Jae Doo Huh, Electronics and Telecommunications Research Institute, Korea
Seog Geun Kang, School of Electrical and Electronic Engineering, Gyeongsang National University, Korea
pp. 1-2
Zhenxing Chen, School of Electrical and Electronic Engineering, Gyeongsang National University, Korea
Seog Geun Kang, School of Electrical and Electronic Engineering, Gyeongsang National University, Korea
Eun Chang Choi, Electronics and Telecommunications Research Institute, Korea
Jae Doo Huh, Electronics and Telecommunications Research Institute, Korea
pp. 1-2
Haechul Choi, Broadcasting&Telecommunications Media Research Division, Electronics and Telecommunication Research Institute (ETRI), Korea
Il Hong Shin, Broadcasting&Telecommunications Media Research Division, Electronics and Telecommunication Research Institute (ETRI), Korea
Jong-Soo Lim, Broadcasting&Telecommunications Media Research Division, Electronics and Telecommunication Research Institute (ETRI), Korea
Jin Woo Hong, Broadcasting&Telecommunications Media Research Division, Electronics and Telecommunication Research Institute (ETRI), Korea
pp. 1-2
David Halls, Centre for Communication Research, University of Bristol, Woodland Road, BS8 1UB, U.K.
Pierre Ferre, Centre for Communication Research, University of Bristol, Woodland Road, BS8 1UB, U.K.
George Zaggoulos, Centre for Communication Research, University of Bristol, Woodland Road, BS8 1UB, U.K.
Andrew Nix, Centre for Communication Research, University of Bristol, Woodland Road, BS8 1UB, U.K.
Mark Beach, Centre for Communication Research, University of Bristol, Woodland Road, BS8 1UB, U.K.
pp. 1-2
Tae-Jung Kim, Dept. of Electronics Engineering, Chungbuk National University, Cheong-ju, Korea
Jang-Eui Hong, Dept. of Electronics Engineering, Chungbuk National University, Cheong-ju, Korea
Jae-Won Suh, Dept. of Electronics Engineering, Chungbuk National University, Cheong-ju, Korea
pp. 1-2
Jiseong Son, Dept. of Computer Science&Radio Communications, Korea University, Seoul, Republic of Korea
Dongwon Jeong, Dept. of Informatics and Statistics, Kunsan National University, Gunsan, Republic of Korea
Doo-Kwon Baik, Dept. of Computer Science&Radio Communications, Korea University, Seoul, Republic of Korea
pp. 1-2
Bahman Zafarifar, NXP Semiconductors, The Netherlands
Peter H. N. de With, Eindhoven University of Technology, The Netherlands
pp. 1-2
Jinwoo Kim, Advanced Integrated Systems Lab., Korea University, Seoul, Korea
Moo-Young Kim, Advanced Integrated Systems Lab., Korea University, Seoul, Korea
Ho-Kyu Lee, Advanced Integrated Systems Lab., Korea University, Seoul, Korea
Inhwa Jung, Advanced Integrated Systems Lab., Korea University, Seoul, Korea
Chulwoo Kim, Advanced Integrated Systems Lab., Korea University, Seoul, Korea
pp. 1-2
Seok-Han Lee, Graduate School of Advanced Imaging Science, Multimedia, and Film, Chung-Ang University, Seoul, Korea
Tae-Eun Kim, Department of Multimedia, Namseoul University, Chonan, Korea
Jong-Soo Choi, Graduate School of Advanced Imaging Science, Multimedia, and Film, Chung-Ang University, Seoul, Korea
pp. 1-2
Jun Hee Jang, School of Information and Communication Engineering, Sungkyunkwan University, Suwon, Korea
Jung Su Han, School of Information and Communication Engineering, Sungkyunkwan University, Suwon, Korea
Sung Soo Kim, Telecommunication R&D Center, Samsung Electronics, CO., LTD, Korea
Hyung-Jin Choi, School of Information and Communication Engineering, Sungkyunkwan University, Suwon, Korea
pp. 1-2
Cristian M. Albina, Gesellschaft für Mikroelektronik Entwicklungen mbH, Unterhaching, 82008 Germany
Mohit Berry, Infineon Technologies AG, Am Campeon 1-12, Neubiberg 85579, Germany
Michael Flath, Infineon Technologies AG, Am Campeon 1-12, Neubiberg 85579, Germany
Herbert Stockinger, Infineon Technologies AG, Am Campeon 1-12, Neubiberg 85579, Germany
pp. 1-2
Jaehyun Park, Korea Advanced Institute of Science and Technology, Daejeon, South Korea
Joohwan Chun, Korea Advanced Institute of Science and Technology, Daejeon, South Korea
pp. 1-2
Takashi Okubo, Department of Applied Electronics, Tokyo University of Science, Japan
Makoto Itami, Department of Applied Electronics, Tokyo University of Science, Japan
pp. 1-2
Jinho Lee, Korea University of Science and Technology (UST), Daejeon, South Korea
Jin Soo Choi, Electronics and Telecommunication Research Institute (ETRI), Daejeon, South Korea
Jinwoo Hong, Electronics and Telecommunication Research Institute (ETRI), Daejeon, South Korea
Haechul Choi, Electronics and Telecommunication Research Institute (ETRI), Daejeon, South Korea
pp. 1-2
Sehyung Park, Korea Institute of Science and Technology, Korea
Laehyun Kim, Korea Institute of Science and Technology, Korea
Sungdo Ha, Korea Institute of Science and Technology, Korea
Hyunchul Cho, Korea Institute of Science and Technology, Korea
Soo Yong Lee, Hongik University, Korea
pp. 1-2
Carsten Dolar, Dortmund University of Technology, Germany
Martin M. Richter, Dortmund University of Technology, Germany
Hartmut Schroder, Dortmund University of Technology, Germany
Oliver Erdler, Sony Deutschland, Stuttgart, Germany
Piergiorgio Sartor, Sony Deutschland, Stuttgart, Germany
pp. 1-2
Kenji Tsunashima, Mitsubishi Electric Corporation, Advanced Technology R&D Center, Kyoto, Japan
Tetsuro Shida, Mitsubishi Electric Corporation, Advanced Technology R&D Center, Kyoto, Japan
Hideki Kawano, Mitsubishi Electric Corporation, Advanced Technology R&D Center, Kyoto, Japan
Toshimitsu Sato, Mitsubishi Electric Corporation, Advanced Technology R&D Center, Kyoto, Japan
Hideaki Kosaka, Mitsubishi Electric Corporation, Advanced Technology R&D Center, Kyoto, Japan
pp. 1-2
Yoon-Jong Kim, Multimedia Signal Processing Lab, Korea Polytechnic Univ., Siheung, KOREA
Jung-Jae Oh, Multimedia Signal Processing Lab, Korea Polytechnic Univ., Siheung, KOREA
Byung-Tae Choi, DTV Lab, LG Electronics Inc., Seoul, KOREA
Seung-Jong Choi, DTV Lab, LG Electronics Inc., Seoul, KOREA
Eung-Tae Kim, Multimedia Signal Processing Lab, Korea Polytechnic Univ., Siheung, KOREA
pp. 1-2
Eunjeong Ko, Dept. of Advanced Technology Fusion iIT, Konkuk Univ., Seoul, South Korea
Jin Sun Ju, Dept. of Advanced Technology Fusion iIT, Konkuk Univ., Seoul, South Korea
Eun Yi Kim, Dept. of Advanced Technology Fusion iIT, Konkuk Univ., Seoul, South Korea
Nam Seo Goo, Dept. of Advance Technology Fusion MS, Konkuk Univ., Seoul South Korea
pp. 1-2
Cyril Concolato, Institut TELECOM; TELECOM ParisTech; CNRS LTCI; ParisTech, France
Jean Le Feuvre, Institut TELECOM; TELECOM ParisTech; CNRS LTCI; ParisTech, France
KyungMo Park, SAMSUNG Electronics Co., Ltd - Seoul, Korea
pp. 1-2
Tomoki Oku, SANYO Electric Co., Ltd., Osaka, Japan
Kazuma Hara, SANYO Electric Co., Ltd., Osaka, Japan
Masahiro Yoshida, SANYO Electric Co., Ltd., Osaka, Japan
Makoto Yamanaka, SANYO Electric Co., Ltd., Osaka, Japan
Haruhiko Murata, SANYO Electric Co., Ltd., Osaka, Japan
pp. 1-2
Leehter Yao, Dept. of Electrical Engr., National Taipei University of Technology, Taiwan
Chun-Kai Huang, Dept. of Electrical Engr., National Taipei University of Technology, Taiwan
Yi-Hong Chen, Dept. of Electrical Engr., National Taipei University of Technology, Taiwan
pp. 1-2
Om Prakash Gangwal, NXP Research, High Tech Campus, Eindhoven, The Netherlands
Robert-Paul Berretty, Philips Research, High Tech Campus, Eindhoven, The Netherlands
pp. 1-2
Tanaphol Thaipanich, Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, 90089-2564, USA
Ping-Hao Wu, Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, 90089-2564, USA
C.-C. Jay Kuo, Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, 90089-2564, USA
pp. 1-2
Donghyung Kim, School of Information&Communication, Broadcasting Engineering, Halla University, Korea
Seyoon Jeong, Electronics and Telecommunication Research Institute (ETRI), Korea
Jin-Soo Choi, Electronics and Telecommunication Research Institute (ETRI), Korea
pp. 1-2
Young-Su Lee, Chungbuk National University, Cheongju, Korea
Bo-Seok Seo, Chungbuk National University, Cheongju, Korea
pp. 1-2
Chuntao Wang, Department of Electronics Engineering, Korea University, Seoul, Korea
Jin-Hyung Kim, Department of Electronics Engineering, Korea University, Seoul, Korea
Keun-Yung Byun, Department of Electronics Engineering, Korea University, Seoul, Korea
Sung-Jea Ko, Department of Electronics Engineering, Korea University, Seoul, Korea
pp. 1-2
Min-Cheol Jeon, Chungbuk National University, Cheongju, Korea
Jun-Sil Chang, Chungbuk National University, Cheongju, Korea
Bo-Seok Seo, Chungbuk National University, Cheongju, Korea
pp. 1-2
Yun-Kyung Lee, Chungbuk National University, Cheongju, Korea
Oh-Wook Kwon, Chungbuk National University, Cheongju, Korea
pp. 1-2
Young-Su Kwon, SoC Research Department, Electronics and Telecommunications Research Institute, 138 Gajeongno, Yuseonggu, Daejeon, Korea
Bon-Tae Koo, SoC Research Department, Electronics and Telecommunications Research Institute, 138 Gajeongno, Yuseonggu, Daejeon, Korea
Nak-Woong Eum, SoC Research Department, Electronics and Telecommunications Research Institute, 138 Gajeongno, Yuseonggu, Daejeon, Korea
pp. 1-2
Hiromasa Yanagihara, KDDI R&D Laboratories Inc. Saitama, JAPAN
Tomohiro Tsuji, KDDI R&D Laboratories Inc. Saitama, JAPAN
Akio Yoneyama, KDDI R&D Laboratories Inc. Saitama, JAPAN
Masayuki Tanimoto, Nagoya University, Aichi, JAPAN
pp. 1-2
Danilo Pau, Advanced System Technology, STMicroelectronics, Agrate, Italy
Francesco Mariotti, Advanced System Technology, STMicroelectronics, Agrate, Italy
Marco Orlandini, Advanced System Technology, STMicroelectronics, Agrate, Italy
Luca Pezzoni, Advanced System Technology, STMicroelectronics, Agrate, Italy
pp. 1-2
Istvan Papp, Faculty of Technical Sciences, Novi Sad, Serbia
Zoran Saric, Faculty of Technical Sciences, Novi Sad, Serbia
Sasa Vukosavljev, Faculty of Technical Sciences, Novi Sad, Serbia
Nikola Teslic, Faculty of Technical Sciences, Novi Sad, Serbia
Miodrag Temerinac, Faculty of Technical Sciences, Novi Sad, Serbia
pp. 1-2
Jin Ho Kim, Department of Computer Engineering, Kyung Hee University, Korea
Byung Goo Choi, Department of Computer Engineering, Kyung Hee University, Korea
Jihyuk Heo, Department of Computer Engineering, Kyung Hee University, Korea
Choong Seon Hong, Department of Computer Engineering, Kyung Hee University, Korea
pp. 1-2
Choong Bum Park, Department of Computer Engineering, Chungnam National University, Korea
Hoon Choi, Department of Computer Engineering, Chungnam National University, Korea
Paul Kim, School of Education, Stanford University, USA
pp. 1-2
J. L. Martinez, Instituto de Investigación en Informática de Albacete. Universidad de Castilla-La Mancha, Spain
G. Fernandez-Escribano, Instituto de Investigación en Informática de Albacete. Universidad de Castilla-La Mancha, Spain
H. Kalva, Department of Computer Science and Engineering. Florida Atlantic University, Boca Raton, USA
W.A.C. Fernando, Center Communications Systems Research, University of Surrey, GU2 7XH, United Kingdom
A. Garrido, Instituto de Investigación en Informática de Albacete. Universidad de Castilla-La Mancha, Spain
pp. 1-2
Se-Ho Kim, Dept. of Electronics Engineering, Chungbuk National University, Cheong-ju, Korea
Seonki Kim, LG Electronics, Inc., Seoul, Korea
Jea-Won Suh, Dept. of Electronics Engineering, Chungbuk National University, Cheong-ju, Korea
pp. 1-2
Yong-Suk Park, Korea Electronics Technology Institute and Yonsei University, Seoul, Korea
Se-Ho Park, Korea Electronics Technology Institute and Yonsei University, Seoul, Korea
Kyung-Taek Lee, Korea Electronics Technology Institute and Yonsei University, Seoul, Korea
Jong-Ho Paik, Korea Electronics Technology Institute and Yonsei University, Seoul, Korea
Jong-Moon Chung, Korea Electronics Technology Institute and Yonsei University, Seoul, Korea
pp. 1-2
Akihiko Sugiyama, Common Platform Software Research Laboratories, NEC Corporation, Japan
Osamu Hoshuyama, Common Platform Software Research Laboratories, NEC Corporation, Japan
Osamu Shimada, Common Platform Software Research Laboratories, NEC Corporation, Japan
Toshiyuki Nomura, Common Platform Software Research Laboratories, NEC Corporation, Japan
Masanori Kato, Common Platform Software Research Laboratories, NEC Corporation, Japan
Masahiro Serizawa, Common Platform Software Research Laboratories, NEC Corporation, Japan
pp. 1-2
K. Ugur, Nokia Research Center, Tampere, Finland
D. Rusanovksyy, Tampere University of Technology, Finland
A. Hallapuro, Nokia Research Center, Tampere, Finland
J. Lainema, Nokia Research Center, Tampere, Finland
M. Gabbouj, Tampere University of Technology, Finland
pp. 1-2
Samuel H. Russ, University of South Alabama in Mobile, USA
Sasan Haghani, University of South Alabama in Mobile, USA
pp. 1-2
Haruo Hatanaka, SANYO Electric Co., Ltd., Osaka, Japan
Shimpei Fukumoto, SANYO Electric Co., Ltd., Osaka, Japan
Hiroshi Kano, SANYO Electric Co., Ltd., Osaka, Japan
Haruhiko Murata, SANYO Electric Co., Ltd., Osaka, Japan
pp. 1-2
Akihito Suzuki, Shibaura Institute of Technology, Saitama, Japan
Kenta Senda, Shibaura Institute of Technology, Saitama, Japan
Masahiro Inoue, Shibaura Institute of Technology, Saitama, Japan
pp. 1-2
Hokuto Nawasaki, Shibaura Institute of Technology, Saitama, Japan
Hiroyuki Oono, Shibaura Institute of Technology, Saitama, Japan
Masahiro Inoue, Shibaura Institute of Technology, Saitama, Japan
pp. 1-2
Victoria Sgardoni, Centre for Communication Research, University of Bristol, Woodland Road, BS8 1UB, U.K.
Pierre Ferre, Centre for Communication Research, University of Bristol, Woodland Road, BS8 1UB, U.K.
Andrew Nix, Centre for Communication Research, University of Bristol, Woodland Road, BS8 1UB, U.K.
David Bull, Centre for Communication Research, University of Bristol, Woodland Road, BS8 1UB, U.K.
pp. 1-2
DaeYoub Kim, SAIT, Samsung Electronics, South Korea
MiSuk Huh, SAIT, Samsung Electronics, South Korea
pp. 1-2
Takeshi Ogata, Consumer Electronics Laboratory, Hitachi, Ltd., 292 Yoshida-cho, Totsuka-ku, Yokohama, Japan
Hideki Maruyama, Consumer Electronics Laboratory, Hitachi, Ltd., 292 Yoshida-cho, Totsuka-ku, Yokohama, Japan
Kouji Fujita, Consumer Electronics Laboratory, Hitachi, Ltd., 292 Yoshida-cho, Totsuka-ku, Yokohama, Japan
pp. 1-2
Byeongcheol Choi, Electronics and Telecommunications Research Institute, Dajeon, Korea
Jeongnyeo Kim, Electronics and Telecommunications Research Institute, Dajeon, Korea
Jeacheol Ryou, Electronics and Telecommunications Research Institute, Dajeon, Korea
pp. 1-2
Jung-Sik Sung, U-Computing Department, IT Convergence Technology Laboratory, ETRI, Daejeon, Korea
Seung Ho Baek, U-Computing Department, IT Convergence Technology Laboratory, ETRI, Daejeon, Korea
Jaedoo Huh, U-Computing Department, IT Convergence Technology Laboratory, ETRI, Daejeon, Korea
pp. 1-2
Le Thanh Ha, Department of Electronics Engineering, Korea University, Seoul, Korea
Hye-Soo Kim, Department of Electronics Engineering, Korea University, Seoul, Korea
Chun-Su Park, Department of Electronics Engineering, Korea University, Seoul, Korea
Jae-Yun Jeong, Department of Electronics Engineering, Korea University, Seoul, Korea
Sung-Jea Ko, Department of Electronics Engineering, Korea University, Seoul, Korea
pp. 1-2
JeongEun Lim, VSS Team, Digital Media Business, SAMSUNG ELECTRONICS CO., LTD. South Korea
Dal Ho Lee, Division of Electronic Engineering, College of IT, Kyungwon University, South Korea
Kwanghoon Sohn, Department of Electrical and Electronic Engineering, Yonsei University, South Korea
pp. 1-2
Xu Zheng, Beijing University of Posts and Telecommunications, China
Bo Yang, Beijing University of Posts and Telecommunications, China
Yawen Liu, Beijing University of Posts and Telecommunications, China
Guangjian Shi, PowerLayer Microsystems (Beijing), China
pp. 1-2
Lorena F. Maia, Embedded Systems and Pervasive Computing Laboratory, Department of Electrical Engineering, Federal University of Campina Grande, C.P. 10105 - 58109-970 - PB - Brazil
Danilo F. S. Santos, Embedded Systems and Pervasive Computing Laboratory, Department of Electrical Engineering, Federal University of Campina Grande, C.P. 10105 - 58109-970 - PB - Brazil
Hyggo O. Almeida, Embedded Systems and Pervasive Computing Laboratory, Department of Electrical Engineering, Federal University of Campina Grande, C.P. 10105 - 58109-970 - PB - Brazil
Angelo Perkusich, Embedded Systems and Pervasive Computing Laboratory, Department of Electrical Engineering, Federal University of Campina Grande, C.P. 10105 - 58109-970 - PB - Brazil
pp. 1-2
Seung-Won Jung, Department of Electronics Engineering, Korea University, Seoul, Korea
Chun-Su Park, Department of Electronics Engineering, Korea University, Seoul, Korea
Haechul Choi, Electronics and Telecommunications Research Institute, Daejeon, Korea
Aldo W. Morales, Department of Electrical Engineering, Penn State University, Harrisburg, USA
Sung-Jea Ko, Department of Electronics Engineering, Korea University, Seoul, Korea
pp. 1-2
Jangwon Kim, Dept. of Computer Science&Radio Communications, Korea University, Seoul, Republic of Korea
Dongwon Jeong, Dept. of Informatics and Statistics, Kunsan National University, Gunsan, Republic of Korea
Doo-Kwon Baik, Dept. of Computer Science&Radio Communications, Korea University, Seoul, Republic of Korea
pp. 1-2
Bongjun Kim, Department of Industrial Engineering, Graduate School of Ajou University, Suwon, Korea
Kiejin Park, Division of Industrial and Information Systems Engineering, Ajou University, Suwon, Korea
pp. 1-2
Seung-Jin Baek, Department of Electrical Engineering, Korea University, Seoul, Korea
Chun-Su Park, Department of Electrical Engineering, Korea University, Seoul, Korea
Seung-Won Jung, Department of Electrical Engineering, Korea University, Seoul, Korea
Byoung-Kyu Dan, Department of Electrical Engineering, Korea University, Seoul, Korea
Sung-Jea Ko, Department of Electrical Engineering, Korea University, Seoul, Korea
pp. 1-2
M. Haraguchi, SANYO Electric Co., Ltd., Osaka, Japan
T. Abe, SANYO Electric Co., Ltd., Osaka, Japan
S. Tanase, SANYO Electric Co., Ltd., Osaka, Japan
M. Inoue, SANYO Electric Co., Ltd., Osaka, Japan
H. Kanayama, SANYO Electric Co., Ltd., Osaka, Japan
pp. 1-2
Sunnam Lee, Samsung Electronics DM Research Center, Suwon, Korea
Haksoo Ju, Samsung Electronics DM Research Center, Suwon, Korea
Bongseon Kim, Samsung Electronics DM Research Center, Suwon, Korea
pp. 1-2
Jong-Woo Han, Department of Electronic Engineering, Korea University, Seoul, Korea
Tae-Shick Wang, Department of Electronic Engineering, Korea University, Seoul, Korea
Jun-Hyung Kim, Department of Electronic Engineering, Korea University, Seoul, Korea
Min-Cheol Hwang, Department of Electronic Engineering, Korea University, Seoul, Korea
Sung-Jea Ko, Department of Electronic Engineering, Korea University, Seoul, Korea
pp. 1-2
Chang-Eun Lee, U-computing Research Department, IT Convergence Technology Research Laboratory, ETRI, Korea
Kyeong-Deok Moon, U-computing Research Department, IT Convergence Technology Research Laboratory, ETRI, Korea
pp. 1-2
Hyeong-Min Nam, Department of Electrical Engineering, Korea University, Seoul, Korea
Kyung-Seok Shin, Department of Electrical Engineering, Korea University, Seoul, Korea
Jae-Yun Jeong, Department of Electrical Engineering, Korea University, Seoul, Korea
Hye-Soo Kim, Department of Electrical Engineering, Korea University, Seoul, Korea
Sung-Jea Ko, Department of Electrical Engineering, Korea University, Seoul, Korea
pp. 1-2
Shilin Xu, Huazhong University of Science and Technology, Wuhan, China
Weisi Lin, Nanyang Technological University, Singapore, Singapore
C.-C. Jay Kuo, University of Southern California, Los Angeles, USA
pp. 1-2
Won-Ik Park, Dept. C. E., Chungnam University, Daejeon, Korea
Sanggil Kang, Dept. of C. E., Inha University, Incheon, Korea
Miseon Choi, Human Resource Development Consortium for Next Generation Software in Information Tech., Chungnam University, Daejeon, Korea
Young-Kuk Kim, Dept. C. E., Chungnam University, Daejeon, Korea
pp. 1-2
Sang Oh Park, Chung-Ang University, Seoul, KOREA
Sung Jo Kim, Chung-Ang University, Seoul, KOREA
pp. 1-2
K. Arai, SANYO Electric Co., Ltd., Osaka, Japan
M. Maeda, SANYO Electric Co., Ltd., Osaka, Japan
K. Mashitani, SANYO Electric Co., Ltd., Osaka, Japan
H. Kanayama, SANYO Electric Co., Ltd., Osaka, Japan
pp. 1-2
A (Abstract)
Pang-Chieh Wang, Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan
Cheng-Liang Lin, Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan
Chieh-Chuan Kung, Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan
Jhan-Hao Rao, Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan
Ting-Wei Hou, Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan
pp. 1-2
Seunghyun Jang, Electronic and Telecommunications Research Institute (ETRI), Korea
Bonghyuk Park, Electronic and Telecommunications Research Institute (ETRI), Korea
Seungsik Lee, Electronic and Telecommunications Research Institute (ETRI), Korea
Sangsung Choi, Electronic and Telecommunications Research Institute (ETRI), Korea
pp. 1-2
Changseok Bae, ETRI, 161 Gajeong Dong, Yuseong Gu, Daejeon, Korea
Jongho Won, ETRI, 161 Gajeong Dong, Yuseong Gu, Daejeon, Korea
Dongwan Ryoo, ETRI, 161 Gajeong Dong, Yuseong Gu, Daejeon, Korea
pp. 1-2
Linxiang Gao, School of Computer Science, Fudan University, Shanghai, 200433, China
Jiawu Zhong, School of Computer Science, Fudan University, Shanghai, 200433, China
Lingjie Yu, School of Computer Science, Fudan University, Shanghai, 200433, China
Jin Zhao, School of Computer Science, Fudan University, Shanghai, 200433, China
Xin Wang, School of Computer Science, Fudan University, Shanghai, 200433, China
pp. 1-2
Rafael Sotelo, University of Montevideo, Uruguay
Yolanda Blanco, University of Vigo, Spain
Martin Lopez, University of Vigo, Spain
Alberto Gil, University of Vigo, Spain
Jose Pazos, University of Vigo, Spain
pp. 1-2
Seung-Hoon Chae, Dept. of Information and Communication Engineering, Chosun Univ., Korea
Jong Ku Kim, Dept. of Information and Communication Engineering, Chosun Univ., Korea
Sung Jin Lim, Dept. of Information and Communication Engineering, Chosun Univ., Korea
Sung Bum Pan, Dept. of Information and Communication Engineering, Chosun Univ., Korea
Daesung Moon, Biometrics Technology Research Team, ETRI, Korea
Yongwha Chung, Dept. of Computer and Information Science, Korea Univ., Korea
pp. 1-2
Goran Miljkovic, MicronasNIT, Novi Sad, Serbia
Velibor Mihic, MicronasNIT, Novi Sad, Serbia
Nikola Teslic, Faculty of Technical Sciences, Novi Sad, Serbia
Miodrag Temerinac, Faculty of Technical Sciences, Novi Sad, Serbia
pp. 1-2
Manjunath Ramachandra, Philips innovation campus, Bangalore, India
Narendranatha Udupa, Philips innovation campus, Bangalore, India
pp. 1-2
Om Prakash Gangwal, NXP Research, High Tech Campus, Eindhoven, The Netherlands
Etienne Coezijn, Philips Consumer Lifestyle, High Tech Campus, Eindhoven, The Netherlands
Robert-Paul Berretty, Philips Research, High Tech Campus, Eindhoven, The Netherlands
pp. 1-2
Chia-Hung Lien, Department of Computer science and Information Engineering, Lee-Ming Institute of Technology, 243, R.O.C.
Ying-Wen Bai, Department of Electronic Engineering, Fu Jen Catholic University, Taipei, Taiwan, 242, R.O.C
Hsien-Chung Chen, Department of Electronic Engineering, Fu Jen Catholic University, Taipei, Taiwan, 242, R.O.C
Chi-Huang Hung, Department of Electronic Engineering, Fu Jen Catholic University, Taipei, Taiwan, 242, R.O.C
pp. 1-2
Seongho Cho, Samsung Electronics Co. Ltd., South Korea
Hyoungshick Kim, Samsung Electronics Co. Ltd., South Korea
Dongshin Jung, Samsung Electronics Co. Ltd., South Korea
Hoyeon Park, Samsung Electronics Co. Ltd., South Korea
pp. 1-2
Injae Lee, Broadcasting&Telecommunications Media Research Department, ETRI, Korea
Jihun Cha, Broadcasting&Telecommunications Media Research Department, ETRI, Korea
Hankyu Lee, Broadcasting&Telecommunications Media Research Department, ETRI, Korea
Jinwoo Hong, Broadcasting&Telecommunications Media Research Department, ETRI, Korea
pp. 1-2
Stefan Schiemenz, Brandenburg University of Technology, Cottbus, Germany
Christian Hentschel, Brandenburg University of Technology, Cottbus, Germany
pp. 1-2
Sang-Jun Kim, Dept. of Electrical Engineering, Korea University, Seoul, Korea
Min-Soo Jang, Dept. of Electrical Engineering, Korea University, Seoul, Korea
Gwi-Tae Park, Dept. of Electrical Engineering, Korea University, Seoul, Korea
pp. 1-2
Jung-Sik Cho, Chung-Ang University, Seoul, KOREA
Sung Kwon Kim, Chung-Ang University, Seoul, KOREA
pp. 1-2
You-Shin Park, GSAIM, Chung-ang University, 221 Heukseok-Dong, Dongjak-Gu, Seoul, Korea
Yong-In Yun, GSAIM, Chung-ang University, 221 Heukseok-Dong, Dongjak-Gu, Seoul, Korea
Jong-Soo Choi, GSAIM, Chung-ang University, 221 Heukseok-Dong, Dongjak-Gu, Seoul, Korea
pp. 1-2
Jinyoung Moon, Electronics and Telecommunications Research Institute, Daejeon, Republic of Korea
Jungtae Kim, Electronics and Telecommunications Research Institute, Daejeon, Republic of Korea
Jongyoul Park, Electronics and Telecommunications Research Institute, Daejeon, Republic of Korea
Euihyun Paik, Electronics and Telecommunications Research Institute, Daejeon, Republic of Korea
Kwangroh Park, Electronics and Telecommunications Research Institute, Daejeon, Republic of Korea
pp. 1-2
Wonwoo Jang, Dept. of Electronic Engineering, Dong-A University, Busan, South Korea
Boodong Kwak, SAMSUNG Electro-Mechanics Co. Ltd., Suwon, South Korea
Joohyun Kim, SAMSUNG Electro-Mechanics Co. Ltd., Suwon, South Korea
Bongsoon Kang, Dept. of Electronic Engineering, Dong-A University, Busan, South Korea
pp. 1-2
Chao-Chung Cheng, Graduate Institute of Electronics Engineering, National Taiwan University, Taiwan, R.O.C.
Chung-Te Li, Graduate Institute of Electronics Engineering, National Taiwan University, Taiwan, R.O.C.
Po-Sen Huang, Graduate Institute of Electronics Engineering, National Taiwan University, Taiwan, R.O.C.
Tsung-Kai Lin, Graduate Institute of Electronics Engineering, National Taiwan University, Taiwan, R.O.C.
Yi-Min Tsai, Graduate Institute of Electronics Engineering, National Taiwan University, Taiwan, R.O.C.
Liang-Gee Chen, Graduate Institute of Electronics Engineering, National Taiwan University, Taiwan, R.O.C.
pp. 1-2
Wen-Chung Kao, Dept. of Applied Electronics Technology, National Taiwan Normal University, Taiwan
Jia-An Ye, Dept. of Applied Electronics Technology, National Taiwan Normal University, Taiwan
Fong-Shou Lin, SiPix Technology Inc. Taiwan
Craig Lin, SiPix Imaging Inc. U.S.A
Robert Sprague, SiPix Imaging Inc. U.S.A
pp. 1-2
Ho-Sung Han, Department of Electronic Engineering, Sogang Univ., C.P.O. Box 1142, Seoul 100-611, Korea
Dong-O Kim, Department of Electronic Engineering, Sogang Univ., C.P.O. Box 1142, Seoul 100-611, Korea
Rae-Hong Park, Department of Electronic Engineering, Sogang Univ., C.P.O. Box 1142, Seoul 100-611, Korea
pp. 1-2
Dong-woo Lee, u-Computing Research Department, Electronics and Telecommunications Research Institute, Daejeon, Korea
Jeong-mook Lim, u-Computing Research Department, Electronics and Telecommunications Research Institute, Daejeon, Korea
John Sunwoo, u-Computing Research Department, Electronics and Telecommunications Research Institute, Daejeon, Korea
Bae-sun Kim, u-Computing Research Department, Electronics and Telecommunications Research Institute, Daejeon, Korea
Cheol-hoon Lee, Dept. of Computer Engineering, Chungnam National University, Daejeon, Korea
pp. 1-2
Takuya Kojiya, SANYO Electric Co., Ltd., Osaka, Japan
Tomohisa Wada, University of the Ryukyus, Okinawa, Japan
Takashi Iida, SANYO Electric Co., Ltd., Osaka, Japan
Yoshikazu Kita, SANYO Electric Co., Ltd., Osaka, Japan
Atsushi Suyama, SANYO Electric Co., Ltd., Osaka, Japan
Sadanori Sakaguchi, Magna Design Net Inc., Okinawa, Japan
Hirokazu Asato, Magna Design Net Inc., Okinawa, Japan
Hiroyuki Mizutani, Magna Design Net Inc., Okinawa, Japan
Atsushi Shimizu, SANYO Electric Co., Ltd., Osaka, Japan
pp. 1-2
Junseok Kim, Department of Electronic Engineering, Konkuk University, Korea
Younggoo Kwon, Department of Electronic Engineering, Konkuk University, Korea
pp. 1-2
Jinsoo Han, U-Computing Department, ETRI, Daejeon, Korea
Haeryong Lee, U-Computing Department, ETRI, Daejeon, Korea
Kwang-Roh Park, U-Computing Department, ETRI, Daejeon, Korea
pp. 1-2
Jeong Ho Lee, Dept. of Computer Science and Engineering, Hanyang Univ., Ansan, South Korea
Ki Tae Park, Samsung Electronics Co., Ltd., Suwon, South Korea
Young Shik Moon, Dept. of Computer Science and Engineering, Hanyang Univ., Ansan, South Korea
pp. 1-2
Jong-Hoon Lee, U-Computing Research Department, ETRI, Korea
Jung-Tae Kim, U-Computing Research Department, ETRI, Korea
Eui-Hyun Paik, U-Computing Research Department, ETRI, Korea
Intark Han, U-Computing Research Department, ETRI, Korea
Kwang-Roh Park, U-Computing Research Department, ETRI, Korea
pp. 1-2
Young-Bae Kong, Department of Electronic Engineering, Korea University, Seoul, Korea
Young-Goo Kwon, Department of Electronic Engineering, Konkuk University, Seoul, Korea
Gwi-Tae Park, Department of Electronic Engineering, Korea University, Seoul, Korea
pp. 1-2
K. Balasubramanian, European University of Lefke, Turkish Republic of Northern Cyprus, Mersin-10, Turkey
A. Cellatoglu, European University of Lefke, Turkish Republic of Northern Cyprus, Mersin-10, Turkey
pp. 1-2
Dietmar Hepper, RWTH Aachen, IPI, Germany
Xiao-Ming Chen, RWTH Aachen, IPI, Germany
Stephan Knappmann, RWTH Aachen, IPI, Germany
Gael Pilard, RWTH Aachen, IPI, Germany
Hartmut Richter, RWTH Aachen, IPI, Germany
Oliver Theis, RWTH Aachen, IPI, Germany
Matthias Wuttig, RWTH Aachen, IPI, Germany
pp. 1-2
Wen-Chung Kao, Dept. of Applied Electronics Technology, National Taiwan Normal University, Taiwan
Jia-An Ye, Dept. of Applied Electronics Technology, National Taiwan Normal University, Taiwan
Craig Lin, SiPix Imaging Inc., U.S.A.
pp. 1-2
Michio Yamashita, TOSHIBA Corporation, JAPAN
Ryuji Sakai, TOSHIBA Corporation, JAPAN
Akira Tanaka, TOSHIBA Corporation, JAPAN
Kei Imada, TOSHIBA Corporation, JAPAN
Yukie Takahashi, TOSHIBA Corporation, JAPAN
Takashi Ida, TOSHIBA Corporation, JAPAN
Nobuyuki Matsumoto, TOSHIBA Corporation, JAPAN
Nobuhiro Kato, TOSHIBA Corporation, JAPAN
pp. 1-2
Rafiullah Chamlawi, Department of Computer Science, University of Warwick, CV4 7AL, UK
Chang-Tsun Li, Department of Computer Science, University of Warwick, CV4 7AL, UK
Imran Usman, DCIS, Pakistan Institute of Engineering and Applied Sciences, Nilore-45650, Islamabad, Pakistan
Asifullah Khan, DCIS, Pakistan Institute of Engineering and Applied Sciences, Nilore-45650, Islamabad, Pakistan
pp. 1-2
Jihyun Park, Electronics and Telecommunications Research Institute, Korea
Kisong Yoon, Electronics and Telecommunications Research Institute, Korea
Jaecheol Ryou, Electronics and Telecommunications Research Institute, Korea
pp. 1-2
O-Hoon Kwon, Digital Media R&D Center, Samsung Electronics, Korea
Sung-Bin Im, Digital Media R&D Center, Samsung Electronics, Korea
Sang-Kwon Lee, Digital Media R&D Center, Samsung Electronics, Korea
Guanhua Zhang, Digital Media R&D Center, Samsung Electronics, Korea
Xiaofei Liao, Huazhong University of Science and Technology, China
pp. 1-2
JaeKwan Yun, Electronics and Telecommunications Research Institute, South Korea
HaeRyong Lee, Electronics and Telecommunications Research Institute, South Korea
KwangRo Park, Electronics and Telecommunications Research Institute, South Korea
pp. 1-2
Chris Holder, Department of Computer Science and Engineering, Florida Atlantic University, Boca Raton, USA
Tao Pin, Department of Computer Science and Technology, Tsinghua University, Beijing, 100084, China
Hari Kalva, Department of Computer Science and Engineering, Florida Atlantic University, Boca Raton, USA
pp. 1-2
Youngrae Kim, Dept. of Advanced Technology Fusion, Konkuk Univ., Seoul, South Korea
Yunhee Shin, Dept. of Advanced Technology Fusion, Konkuk Univ., Seoul, South Korea
So-jung Kim, Dept. of Advanced Technology Fusion, Konkuk Univ., Seoul, South Korea
Eun Yi Kim, Dept. of Advanced Technology Fusion, Konkuk Univ., Seoul, South Korea
Hyoseop Shin, Dept. of Advanced Technology Fusion, Konkuk Univ., Seoul, South Korea
pp. 1-2
Shang-Hsiu Tseng, Electrical Engineering Program, Penn State University at Harrisburg, Middletown, PA 17057, USA
Aldo Morales, Electrical Engineering Program, Penn State University at Harrisburg, Middletown, PA 17057, USA
pp. 1-2
Daniel Diaz-Sanchez, Universidad Carlos III de Madrid, Avda. de la Universidad 30, 28911, Leganés, Spain
Andres Marin, Instituto Pedro Juan de Lastanosa, Universidad Carlos III de Madrid, Spain
Florina Almenarez, Universidad Carlos III de Madrid, Avda. de la Universidad 30, 28911, Leganés, Spain
Alberto Cortes, Universidad Carlos III de Madrid, Avda. de la Universidad 30, 28911, Leganés, Spain
Ingenieria Telematica, Universidad Carlos III de Madrid, Avda. de la Universidad 30, 28911, Leganés, Spain
pp. 1-2
M. Ali Akber Dewan, Kyung Hee University, South Korea
M. Julius Hossain, Dublin City University, Ireland
Oksam Chae, Kyung Hee University, South Korea
pp. 1-2
Jin-Hwan Jeong, Electronics and Telecommunications Research Institute, Korea
Yong-Ju Lee, Electronics and Telecommunications Research Institute, Korea
Hag-Young Kim, Electronics and Telecommunications Research Institute, Korea
pp. 1-2
F. Pescador, Universidad Politécnica de Madrid. Ctra. de Valencia, Km 7. 28031, (Spain)
G. Maturana, Universidad Politécnica de Madrid. Ctra. de Valencia, Km 7. 28031, (Spain)
M.J. Garrido, Universidad Politécnica de Madrid. Ctra. de Valencia, Km 7. 28031, (Spain)
E. Juarez, Universidad Politécnica de Madrid. Ctra. de Valencia, Km 7. 28031, (Spain)
C. Sanz, Universidad Politécnica de Madrid. Ctra. de Valencia, Km 7. 28031, (Spain)
pp. 1-2
Jelena Kovacevic, Faculty of Technical Sciences, University of Novi Sad, Trg Dositeja Obradovica 6, 21000, Serbia
Dragan Samardzija, Bell Laboratories, Alcatel-Lucent, L-273, 791 Holmdel-Keyport Road Holmdel, NJ 07733, USA
Miodrag Temerinac, Micronas GmbH, Hans-Bunte Strasse 19 D-79108 Freiburg, Germany
pp. 1-2
Md. Hasanul Kabir, Kyung Hee University, South Korea
M. Abdullah-Al-Wadud, Kyung Hee University, South Korea
Oksam Chae, Kyung Hee University, South Korea
pp. 1-2
S.L.P. Yasakethu, Centre for Communications Systems Research (CCSR), University of Surrey, Guildford, GU2 7XH UK
W.A.C. Fernando, Centre for Communications Systems Research (CCSR), University of Surrey, Guildford, GU2 7XH UK
S. Adedoyin, Centre for Communications Systems Research (CCSR), University of Surrey, Guildford, GU2 7XH UK
A. Kondoz, Centre for Communications Systems Research (CCSR), University of Surrey, Guildford, GU2 7XH UK
pp. 1-2
Ki Tae Park, Samsung Electronics Co., Ltd., Suwon, South Korea
Jeong Ho Lee, Dept. of Computer Science and Engineering, Hanyang Univ., Ansan, South Korea
Young Shik Moon, Dept. of Computer Science and Engineering, Hanyang Univ., Ansan, South Korea
pp. 1-2
Kyu Ho Park, Graduate School of Advanced Imaging Science, Multimedia&Film, Chung-Ang Univ., 221 Huksuk-Dong, Dongjak-Gu, Seoul, 156-756, Korea
Tae Yong Kim, Graduate School of Advanced Imaging Science, Multimedia&Film, Chung-Ang Univ., 221 Huksuk-Dong, Dongjak-Gu, Seoul, 156-756, Korea
pp. 1-2
I-Cheng Chang, Department of Computer Science and Information Engineering, National Dong Hwa University, Hualien, Taiwan
Jiun-Wei Yu, Department of Computer Science and Information Engineering, National Dong Hwa University, Hualien, Taiwan
Jia-Hong Yang, Department of Computer Science and Information Engineering, National Dong Hwa University, Hualien, Taiwan
pp. 1-2
Inhwa Choi, Div. of Quality Control, iSET Co. Ltd. Korea
Minjoo Cho, College of Media and Information, Seoul Woman's University, Korea
Duknyun Kim, Dept of Communication Eng, Myongji University, Korea
Jun Hwang, College of Media and Information, Seoul Woman's University, Korea
Taikyeong Jeong, Dept of Communication Eng, Myongji University, Korea
pp. 1-2
M.C. Ionita, Department of Elecronic Engineering, National University of Ireland, Galway, Ireland
P. Corcoran, Department of Elecronic Engineering, National University of Ireland, Galway, Ireland
I. Bacivarov, Department of Elecronic Engineering, National University of Ireland, Galway, Ireland
pp. 1-2
Weilun Lao, Eindhoven University of Technology, P.O.Box 513, 5600MB, The Netherlands
Jungong Han, Eindhoven University of Technology, P.O.Box 513, 5600MB, The Netherlands
Peter H.N. de With, Eindhoven University of Technology, P.O.Box 513, 5600MB, The Netherlands
pp. 1-2
Jin-Yong Choi, Department of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea
Min-Sung Hur, Department of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea
Young-Woo Suh, Broadcasting Technical Research Institute, KBS, Seoul, Korea
Jong-Soo Seo, Department of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea
pp. 1-2
Lara Garcia, Universidad Politécnica de Madrid (GATV), Spain
Laura Arnaiz, Universidad Politécnica de Madrid (GATV), Spain
Federico Alvarez, Universidad Politécnica de Madrid (GATV), Spain
Theodore Zahariadis, Synelixis, Greece
pp. 1-2
Meng-En Lee, Department of Physics, National Kaohsiung Normal University, Taiwan
Chien-Feng Chen, Department of Physics, National Kaohsiung Normal University, Taiwan
Tsung-Nan Lin, Department of Electrical Engineering, National Taiwan University, Taipei, Taiwan
Chun-Nan Chen, Department of Physics, Tamkang University, Taipei, Taiwan
pp. 1-2
S. A. Ryan, STMicroelectronics, Bristol, UK
A.M. Jones, STMicroelectronics, Bristol, UK
R.H. Deaves, STMicroelectronics, Bristol, UK
pp. 1-2
Felipe Gil-Castineira, Departamento de Enxeñerí Telemática - Universidade de Vigo, ETSE Telecomunicación, Campus, 36310, Spain
David Chaves-Dieguez, Departamento de Enxeñerí Telemática - Universidade de Vigo, ETSE Telecomunicación, Campus, 36310, Spain
Javier Gonzalez-Castano, Departamento de Enxeñerí Telemática - Universidade de Vigo, ETSE Telecomunicación, Campus, 36310, Spain
Enrique Costa-Montenegro, Departamento de Enxeñerí Telemática - Universidade de Vigo, ETSE Telecomunicación, Campus, 36310, Spain
pp. 1-2
Remi Bosman, Technische Universiteit Eindhoven, P.O.Box 513, 5600MB, The Netherlands
Johan Lukkien, Technische Universiteit Eindhoven, P.O.Box 513, 5600MB, The Netherlands
Richard Verhoeven, Technische Universiteit Eindhoven, P.O.Box 513, 5600MB, The Netherlands
pp. 1-2
Krzysztof Kepa, BIRC Group, Dept. of Electronic Engineering, NUI Galway, Ireland
Fearghal Morgan, BIRC Group, Dept. of Electronic Engineering, NUI Galway, Ireland
Krzysztof Kosiuszkiewicz, BIRC Group, Dept. of Electronic Engineering, NUI Galway, Ireland
pp. 1-2
Young-Woo Suh, Broadcast Technical Research Institute, KBS, Seoul, Korea
Sang-Hun Kim, Broadcast Technical Research Institute, KBS, Seoul, Korea
Man-Sik Kim, Broadcast Technical Research Institute, KBS, Seoul, Korea
Jin-Yong Choi, Yonsei University, Seoul, Korea
Jong-Soo Seo, Yonsei University, Seoul, Korea
pp. 1-2
Waqar Aslam, Eindhoven University of Technology, P.O. Box 513, 5600MB, The Netherlands
Johan Lukkien, Eindhoven University of Technology, P.O. Box 513, 5600MB, The Netherlands
Igor Radovanovic, Eindhoven University of Technology, P.O. Box 513, 5600MB, The Netherlands
pp. 1-2
Ji Won Lee, Department of Electronic Engineering, Sogang Univ., C.P.O. Box 1142, Seoul 100-611, Korea
Rae-Hong Park, Department of Electronic Engineering, Sogang Univ., C.P.O. Box 1142, Seoul 100-611, Korea
pp. 1-2
Seong Hoon Kim, Dept. of Electronic and Telecommunication Engineering, Kangwon National University, Korea
Jeong Seok Kang, Dept. of Electronic and Telecommunication Engineering, Kangwon National University, Korea
Hong Seong Park, Dept. of Electronic and Telecommunication Engineering, Kangwon National University, Korea
pp. 1-2
Chang Yeon Cho, Department of Electronic Engineering, Konkuk Univ., Seoul, Korea
Jun Heo, School of Electrical Engineering, Korea University, Korea
Joon Tae Kim, Department of Electronic Engineering, Konkuk Univ., Seoul, Korea
pp. 1-2
Kwangseok Noh, School of Electrical Engineering, Korea University, Seoul 136-701, Korea
Sungroh Yoon, School of Electrical Engineering, Korea University, Seoul 136-701, Korea
Jun Heo, School of Electrical Engineering, Korea University, Seoul 136-701, Korea
pp. 1-2
Nobufumi Ueno, SANYO Electric Co., Ltd., Osaka, Japan
Masayuki Yoshinaga, SANYO Electric Co., Ltd., Osaka, Japan
Toshiya Iwasaki, SANYO Electric Co., Ltd., Osaka, Japan
Atsushi Shimizu, SANYO Electric Co., Ltd., Osaka, Japan
pp. 1-2
Seung-Kyun Kim, Department of Electronic Engineering, Korea University, Seoul, Korea
Dongni Zhang, Department of Electronic Engineering, Korea University, Seoul, Korea
Dae-Hwan Kim, Department of Electronic Engineering, Korea University, Seoul, Korea
Sang-Hee Park, Department of Electronic Engineering, Korea University, Seoul, Korea
Sung-Jea Ko, Department of Electronic Engineering, Korea University, Seoul, Korea
pp. 1-2
Xiaochen Zhang, School of Computer Science, Fudan University, Shanghai, 200433, China
Xiaogang Chen, School of Computer Science, Fudan University, Shanghai, 200433, China
Ning Ren, School of Computer Science, Fudan University, Shanghai, 200433, China
Jin Zhao, School of Computer Science, Fudan University, Shanghai, 200433, China
Xin Wang, School of Computer Science, Fudan University, Shanghai, 200433, China
pp. 1-2
Young-Jin Kim, Department of Computer Science and Engineering, Sun Moon University, Asan, Korea
Jihong Kim, School of Computer Science and Engineering, Seoul National University, Korea
pp. 1-2
Mateus A. M. Lima, Embedded Systems and Pervasive Computing Laboratory - Embedded, UFCG, Brazil
Gutemberg G. Santos, Embedded Systems and Pervasive Computing Laboratory - Embedded, UFCG, Brazil
Marcos R. A. Morais, Embedded Systems and Pervasive Computing Laboratory - Embedded, UFCG, Brazil
Kyller C. Gorgonio, Embedded Systems and Pervasive Computing Laboratory - Embedded, UFCG, Brazil
Angelo Perkusich, Embedded Systems and Pervasive Computing Laboratory - Embedded, UFCG, Brazil
pp. 1-2
Fernando M. Matsubara, Information Technology R&D Center, Mitsubishi Electric Corporation, Kamakura, 247-8501 Japan
Takehiko Hanada, Information Technology R&D Center, Mitsubishi Electric Corporation, Kamakura, 247-8501 Japan
Shigeru Imai, Information Technology R&D Center, Mitsubishi Electric Corporation, Kamakura, 247-8501 Japan
Shin Miura, Information Technology R&D Center, Mitsubishi Electric Corporation, Kamakura, 247-8501 Japan
Shinji Akatsu, Information Technology R&D Center, Mitsubishi Electric Corporation, Kamakura, 247-8501 Japan
pp. 1-2
Hyong-Shik Kim, Chungnam National University, Daejeon, Korea
Jin-Hyong Ryu, Chungnam National University, Daejeon, Korea
Jae-Kook Lee, Chungnam National University, Daejeon, Korea
pp. 1-2
Sergio Guillen, Fraunhofer IPMS, Germany
M. Duzynski, TU-Dresden, Germany
M. Scholles, Fraunhofer IPMS, Germany
M. Forster, Fraunhofer IPMS, Germany
P. Nauber, Fraunhofer IPMS, Germany
U. Schelinski, Fraunhofer IPMS, Germany
J. Toledo, Universidad Politécnica de Valencia, Spain
pp. 1-2
Kwang-deok Seo, Computer and Telecommunications Engineering Division, Yonsei University, Gangwon, Korea
Seong Jun Park, School of Electrical and Computer Engineering, Purdue University, Indiana, USA
Soon-heung Jung, Convergence Media Research Team, ETRI, Daejeon, Korea
pp. 1-2
KyuSik Chang, GASIM, Chung-Ang University, the Republic of Korea
ChunHo Yi, GASIM, Chung-Ang University, the Republic of Korea
TaeYong Kim, GASIM, Chung-Ang University, the Republic of Korea
pp. 1-2
Haibin Song, Beijing University of Posts and Telecommunications, China
Aidong Men, Beijing University of Posts and Telecommunications, China
Guangjian Shi, PowerLayer Microsystems (Beijing), China
pp. 1-2
A. Sleman, Automation and Process Control Engineering, University of Wuppertal, Germany
M. Alafandi, Automation and Process Control Engineering, University of Wuppertal, Germany
R. Moeller, Automation and Process Control Engineering, University of Wuppertal, Germany
pp. 1-2
Frontmatter (PDF)
pp. I-XVIII
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