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2003 IEEE International Conference on Computer Design (ICCD'03)
Physical Design of the "2.5D" Stacked System
San Jose, California
October 13-October 15
ISBN: 0-7695-2025-1
ASCII Text
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Yangdong (Steven) Deng, Wojciech Maly, "Physical Design of the "2.5D" Stacked System," 2012 IEEE 30th International Conference on Computer Design (ICCD), pp. 211, 2003 IEEE International Conference on Computer Design (ICCD'03), 2003.
 
 
BibTex
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@article{ 10.1109/ICCD.2003.1240897,
author = {Yangdong (Steven) Deng and Wojciech Maly},
title = {Physical Design of the "2.5D" Stacked System},
journal ={2012 IEEE 30th International Conference on Computer Design (ICCD)},
volume = {0},
year = {2003},
issn = {1063-6404},
pages = {211},
doi = {http://doi.ieeecomputersociety.org/10.1109/ICCD.2003.1240897},
publisher = {IEEE Computer Society},
address = {Los Alamitos, CA, USA},
}
 
 
RefWorks Procite/RefMan/Endnote
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TY - CONF
JO - 2012 IEEE 30th International Conference on Computer Design (ICCD)
TI - Physical Design of the "2.5D" Stacked System
SN - 1063-6404
SP
EP
A1 - Yangdong (Steven) Deng,
A1 - Wojciech Maly,
PY - 2003
KW - null
VL - 0
JA - 2012 IEEE 30th International Conference on Computer Design (ICCD)
ER -
 
Yangdong (Steven) Deng, Carnegie Mellon University, Pittsburgh, PA
Wojciech Maly, Carnegie Mellon University, Pittsburgh, PA
Excessive on-chip wire length and fast increasing fabrication cost have been the main factors impairing the effectiveness of monolithic System-on-Chip. This paper investigates a die stacking based system integration strategy (2.5D system integration) to address these problems. The new scheme is design-tools-enabled rather than technology-driven. We developed a layout design framework, which is able to floorplan, place and route a VLSI design into stacked chips. Our results show that this new scheme has a potential to outperform its monolithic equivalent.
Citation:
Yangdong (Steven) Deng, Wojciech Maly, "Physical Design of the "2.5D" Stacked System," iccd, pp.211, 2003 IEEE International Conference on Computer Design (ICCD'03), 2003
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