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2008 IEEE/ACM International Conference on Computer-Aided Design
San Jose, CA, USA
November 10-November 13
ISBN: 978-1-4244-2819-9
Table of Contents
Papers
Dmitri Chklovskii, Janelia Farm, Howard Hughes Medical Institute, Ashburn, VA, USA
pp. x
Subhasish Mitra, Stanford Univ., CA, USA
Ravishankar K. Iyer, Univ. of Illinois, Urbana-Champaign, USA
Kishor Trivedi, Duke Univ., Durham, NC, USA
James W. Tschanz, Intel Corp., Hillsboro, OR, USA
pp. xi
Joel Phillips, Cadence Research Labs, Berkeley, CA, USA
Kurt Keutzer, Univ. of California, Berkeley, USA
Michael Wrinn, Intel Corp., Hillsboro, OR, USA
pp. xi
Chao Wang, NEC Labs America, Princeton, NJ, USA
Malay Ganai, NEC Labs America, Princeton, NJ, USA
Shuvendu Lahiri, Microsoft Corp., Redmond, WA, USA
Daniel Kroening, Oxford Univ., United Kingdom
pp. xii
David Z. Pan, Univ. of Texas, Austin, USA
Stephen Renwick, Nikon Precision, Inc., Belmont, CA, USA
Vivek Singh, Intel Corp., San Jose, CA, USA
Judy Huckabay, Cadence Design Systems, Inc., San Jose, CA, USA
pp. xii
Dan Bailey, Advanced Micro Devices, Inc., Austin, TX, USA
Eric Soenen, Taiwan Semiconductor Mfg. Co., Austin, TX, USA
Puneet Gupta, Univ. of California, Los Angeles, USA
Paul Villarrubia, IBM Corp., Austin, TX, USA
Sang Dhong, IBM Corp., Sunnyvale, CA, USA
pp. xiii
Henry Chang, Designer¿s Guide Consulting, Los Altos, CA, USA
William Walker, Fujitsu Labs, Ltd., Sunnyvale, CA, USA
John G. Maneatis, True Circuits, Inc., Los Altos, CA, USA
John Croix, Nascentric, Inc., Austin, TX, USA
pp. xiii
Andreas Kuehlmann, Cadence Design System, Berkeley, CA, USA
Rob Aitken, ARM, Sunnyvale, CA, USA
Jerry Bautista, Intel Corp., Santa Clara, CA, USA
Wojceich Maly, Carnegie Mellon Univ., Pittsburgh, PA, USA
Jan Rabaey, Univ. of California, Berkeley, CA, USA
pp. xiii
Author index (PDF)
pp. xxvi-xxxiv
Qiang Ma, Department of Computer Science and Engineering, The Chinese University of Hong Kong, China
Evangeline F. Y. Young, Department of Computer Science and Engineering, The Chinese University of Hong Kong, China
pp. 1-8
Jia Wang, Electrical and Computer Engineering, Illinois Institute of Technology, Chicago, 60616, USA
Hai Zhou, Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208, USA
pp. 9-15
Ou He, Dept. of Computer Science&Technology, Tsinghua University, Beijing, China, 100084
Sheqin Dong, Dept. of Computer Science&Technology, Tsinghua University, Beijing, China, 100084
Jinian Bian, Dept. of Computer Science&Technology, Tsinghua University, Beijing, China, 100084
Satoshi Goto, Information Production and Systems, Waseda University, Kitakyushu, Japan, 808-0135
Chung-Kuan Cheng, Dept. of Computer Science&Engineering, University of California, San Diego, La Jolla, 92093-0404, USA
pp. 16-23
Michal Karczmarek, Computer Science and Artificial Intelligence Lab, Massachusetts Institute of Technology, Cambridge, 02139, USA
Arvind, Computer Science and Artificial Intelligence Lab, Massachusetts Institute of Technology, Cambridge, 02139, USA
pp. 24-31
Hsuan-Po Lin, Department of Electrical Engineering/Graduate Institute of Electronics Engineering, National Taiwan University, Taipei 10617, Taiwan
Jie-Hong R. Jiang, Department of Electrical Engineering/Graduate Institute of Electronics Engineering, National Taiwan University, Taipei 10617, Taiwan
Ruei-Rung Lee, Department of Electrical Engineering/Graduate Institute of Electronics Engineering, National Taiwan University, Taipei 10617, Taiwan
pp. 32-37
Alan Mishchenko, Department of EECS, University of California, Berkeley, USA
Robert Brayton, Department of EECS, University of California, Berkeley, USA
Satrajit Chatterjee, Intel Corporation, Strategic CAD Labs, Hillsboro, OR, USA
pp. 38-44
Tsutomu Sasao, Department of Computer Science and Electronics, Kyushu Institute of Technology, Iizuka 820-8502, Japan
pp. 45-51
Kohei Miyase, Kyushu Institute of Technology, Iizuka, Japan
Kenji Noda, STARC, Yokohama, Japan
Hideaki Ito, STARC, Yokohama, Japan
Kazumi Hatayama, STARC, Yokohama, Japan
Takashi Aikyo, STARC, Yokohama, Japan
Yuta Yamato, Kyushu Institute of Technology, Iizuka, Japan
Hiroshi Furukawa, Kyushu Institute of Technology, Iizuka, Japan
Xiaoqing Wen, Kyushu Institute of Technology, Iizuka, Japan
Seiji Kajihara, Kyushu Institute of Technology, Iizuka, Japan
pp. 52-58
David R. Bild, EECS Department, Northwestern University, Evanston, IL 60208, USA
Sanchit Misra, CSE Department, University of Notre Dame, IN 46556, USA
Thidapat Chantemy, CSE Department, University of Notre Dame, IN 46556, USA
Prabhat Kumar, EECS Department, Northwestern University, Evanston, IL 60208, USA
Robert P. Dick, EECS Department, Northwestern University, Evanston, IL 60208, USA
X. Sharon Huy, CSE Department, University of Notre Dame, IN 46556, USA
Li Shangz, ECE Department, University of Colorado at Boulder, 80305, USA
Alok Choudhary, EECS Department, Northwestern University, Evanston, IL 60208, USA
pp. 59-66
Jia Li, Key Laboratory of Computer System and Architecture, ICT, CAS, Beijing, China
Xiao Liu, CUhk REliable computing laboratory (CURE), Deptartment of Computer Science&Engineering, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong
Yubin Zhang, CUhk REliable computing laboratory (CURE), Deptartment of Computer Science&Engineering, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong
Yu Hu, Key Laboratory of Computer System and Architecture, ICT, CAS, Beijing, China
Xiaowei Li, Key Laboratory of Computer System and Architecture, ICT, CAS, Beijing, China
Qiang Xu, CUhk REliable computing laboratory (CURE), Deptartment of Computer Science&Engineering, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong
pp. 67-72
Xiaoji Ye, Department of ECE, Texas A&M University, College Station, 77843, USA
Wei Dong, Department of ECE, Texas A&M University, College Station, 77843, USA
Peng Li, Department of ECE, Texas A&M University, College Station, 77843, USA
Sani Nassif, IBM Austin Research Laboratory, Austin, TX 78758, USA
pp. 73-78
Guo Yu, Department of Electrical and Computer Engineering, Texas A&M University, College Station, 77843, USA
Peng Li, Department of Electrical and Computer Engineering, Texas A&M University, College Station, 77843, USA
pp. 79-84
Chenjie Gu, ECE Department, University of Minnesota, Twin Cities, USA
Jaijeet Roychowdhury, ECE Department, University of Minnesota, Twin Cities, USA
pp. 85-92
Huan Ren, Dept. of ECE, University of Illinois-Chicago, USA
Shantanu Dutt, Dept. of ECE, University of Illinois-Chicago, USA
pp. 93-100
Yifang Liu, Department of ECE, Texas A&M University, College Station, USA
Rupesh S. Shelar, Technology&Manufacturing Group, Intel Corporation Hillsboro, OR, USA
Jiang Hu, Department of ECE, Texas A&M University, College Station, USA
pp. 101-106
Tai-Hsuan Wu, Department of Electrical and Computer Engineering, University of Wisconsin-Madison, 1415 Engineering Dr., 53706, USA
Azadeh Davoodi, Department of Electrical and Computer Engineering, University of Wisconsin-Madison, 1415 Engineering Dr., 53706, USA
pp. 107-111
Shiyan Hu, Dept. of Electrical and Computer Engineering, Michigan Technological University, Houghton, 49931 USA
Zhuo Li, IBM Austin Research Laboratory, 11501 Burnet Road, Texas 78758 USA
Charles J. Alpert, IBM Austin Research Laboratory, 11501 Burnet Road, Texas 78758 USA
pp. 112-115
Jae-sun Seo, Department of EECS, University of Michigan, Ann Arbor, 48109, USA
Igor L. Markov, Department of EECS, University of Michigan, Ann Arbor, 48109, USA
Dennis Sylvester, Department of EECS, University of Michigan, Ann Arbor, 48109, USA
David Blaauw, Department of EECS, University of Michigan, Ann Arbor, 48109, USA
pp. 116-121
Neal Tew, ECE Dept., University of Utah, Salt Lake City, USA
Priyank Kalla, ECE Dept., University of Utah, Salt Lake City, USA
Namrata Shekhar, Synopsys Inc., Marlborough MA, USA
Sivaram Gopalakrishnan, ECE Dept., University of Utah, Salt Lake City, USA
pp. 122-128
G. Cabodi, Dipartimento di Automatica ed Informatica, Politecnico di Torino, Italy
P. Camurati, Dipartimento di Automatica ed Informatica, Politecnico di Torino, Italy
M. Murciano, Dipartimento di Automatica ed Informatica, Politecnico di Torino, Italy
pp. 129-136
Brian Keng, 1University of Toronto, ECE Department, ON M5S 3G4 Canada
Hratch Mangassarian, 1University of Toronto, ECE Department, ON M5S 3G4 Canada
Andreas Veneris, 1University of Toronto, ECE Department, ON M5S 3G4 Canada
pp. 137-142
John Backes, Department of Electrical and Computer Engineering, University of Minnesota, 200 Union St. S.E., Minneapolis, 55455, USA
Brian Fett, Department of Electrical and Computer Engineering, University of Minnesota, 200 Union St. S.E., Minneapolis, 55455, USA
Marc D. Riedel, Department of Electrical and Computer Engineering, University of Minnesota, 200 Union St. S.E., Minneapolis, 55455, USA
pp. 143-148
Youngjin Cho, Dept. of EECS, Seoul National University, Korea
Younghyun Kim, Dept. of EECS, Seoul National University, Korea
Sangyoung Park, Dept. of EECS, Seoul National University, Korea
Naehyuck Chang, Dept. of EECS, Seoul National University, Korea
pp. 149-154
Mohammad Ghasemazar, University of Southern California, Department of Electrical Engineering, Los Angeles, 90089 U.S.A.
Massoud Pedram, University of Southern California, Department of Electrical Engineering, Los Angeles, 90089 U.S.A.
pp. 155-160
Hao Xu, Department of Electrical and Computer Engineering, University of Cincinnati, Ohio 45221-0030, USA
Wen-Ben Jone, Department of Electrical and Computer Engineering, University of Cincinnati, Ohio 45221-0030, USA
Ranga Vemuri, Department of Electrical and Computer Engineering, University of Cincinnati, Ohio 45221-0030, USA
pp. 161-168
Yongho Lee, School of Electrical Engineering and Computer Science, Seoul National University, Korea
Deog-Kyoon Jeong, School of Electrical Engineering and Computer Science, Seoul National University, Korea
Taewhan Kim, School of Electrical Engineering and Computer Science, Seoul National University, Korea
pp. 169-172
Khaled R. Heloue, Department of ECE, University of Toronto, Ontario, Canada
Sari Onaissi, Department of ECE, University of Toronto, Ontario, Canada
Farid N. Najm, Department of ECE, University of Toronto, Ontario, Canada
pp. 173-180
Lin Xie, Department of Electrical and Computer Engineering, University of Wisconsin, Madison, 53706 USA
Azadeh Davoodi, Department of Electrical and Computer Engineering, University of Wisconsin, Madison, 53706 USA
Jun Zhang, Department of Statistics, University of Wisconsin, Madison, 53706 USA
Tai-Hsuan Wu, Department of Electrical and Computer Engineering, University of Wisconsin, Madison, 53706 USA
pp. 181-184
Farinaz Koushanfar, ECE and CS Depts, Rice University, USA
Petros Boufounos, ECE Dept, Rice University, USA
Davood Shamsi, ECE Dept, Rice University, USA
pp. 185-189
Amith Singhee, IBM T J Watson Research Center, NY, USA
Sonia Singhal, Synopsys Inc., CA, USA
Rob A. Rutenbar, Carnegie Mellon University, PA, USA
pp. 190-195
Javid Jaffari, Spry Design Automation, Waterloo, ON, Canada N2J 4P9
Mohab Anis, Spry Design Automation, Waterloo, ON, Canada N2J 4P9
pp. 196-203
Tao Luo, Magma Design Automation / Austin, TX 78759, USA
David A. Papa, University of Michigan / EECS Department / Ann Arbor, 48109, USA
Zhuo Li, IBM Austin Research Lab / 11501 Burnet Rd., TX 78758, USA
C. N. Sze, IBM Austin Research Lab / 11501 Burnet Rd., TX 78758, USA
Charles J. Alpert, IBM Austin Research Lab / 11501 Burnet Rd., TX 78758, USA
David Z. Pan, University of Texas at Austin / Department of ECE, 78712, USA
pp. 204-211
Kalliopi Tsota, School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47907-2035 USA
Cheng-Kok Koh, School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47907-2035 USA
Venkataramanan Balakrishnan, School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47907-2035 USA
pp. 212-217
Hsin-Chen Chen, Department of Electrical Engineering, National Taiwan University, Taipei 106, Taiwan
Yi-Lin Chuang, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei 106, Taiwan
Yao-Wen Chang, Department of Electrical Engineering, National Taiwan University, Taipei 106, Taiwan
Yung-Chung Chang, Genesys Logic, Inc., Shindian City, Taipei County 231, Taiwan
pp. 218-223
Hyein Lee, Department of Electrical Engineering, KAIST, Daejeon 305-701, Korea
Seungwhun Paik, Department of Electrical Engineering, KAIST, Daejeon 305-701, Korea
Youngsoo Shin, Department of Electrical Engineering, KAIST, Daejeon 305-701, Korea
pp. 224-229
Yu-Min Kuo, Department of CS, National Tsing Hua University, Hsinchu, Taiwan
Shih-Hung Weng, Department of CS, National Tsing Hua University, Hsinchu, Taiwan
Shih-Chieh Chang, Department of CS, National Tsing Hua University, Hsinchu, Taiwan
pp. 230-233
Alan Mishchenko, Department of EECS, University of California, Berkeley, USA
Michael Case, Department of EECS, University of California, Berkeley, USA
Robert Brayton, Department of EECS, University of California, Berkeley, USA
Stephen Jang, Xilinx Inc., San Jose, CA, USA
pp. 234-241
Sushu Zhang, Department of Computer Science and Engineering, Arizona State University, Tempe, 85287, USA
Karam S. Chatha, Department of Computer Science and Engineering, Arizona State University, Tempe, 85287, USA
pp. 242-249
Ayse Kivilcim Coskun, University of California, San Diego, USA
Tajana Simunic Rosing, University of California, San Diego, USA
Kenny C. Gross, Sun Microsystems, San Diego, USA
pp. 250-257
Omer Khan, Department of Electrical and Computer Engineering, University of Massachusetts Amherst, 01002, USA
Sandip Kundu, Department of Electrical and Computer Engineering, University of Massachusetts Amherst, 01002, USA
pp. 258-263
Wooyoung Jang, Department of Electrical and Computer Engineering, University of Texas at Austin, 78712, USA
Duo Ding, Department of Electrical and Computer Engineering, University of Texas at Austin, 78712, USA
David Z. Pan, Department of Electrical and Computer Engineering, University of Texas at Austin, 78712, USA
pp. 264-269
Hamed Dadgour, Department of Electrical and Computer Engineering, University of California, Santa Barbara, 93106, USA
Vivek De, Circuit Research Lab, Intel Corporation, Hillsboro, OR 97124, USA
Kaustav Banerjee, Department of Electrical and Computer Engineering, University of California, Santa Barbara, 93106, USA
pp. 270-277
Yiming Li, Department of Communication Engineering, National Chiao Tung University, Hsinchu 300, Taiwan
Chih-Hong Hwang, Department of Communication Engineering, National Chiao Tung University, Hsinchu 300, Taiwan
Ta-Ching Yeh, Department of Communication Engineering, National Chiao Tung University, Hsinchu 300, Taiwan
Tien-Yeh Li, Department of Communication Engineering, National Chiao Tung University, Hsinchu 300, Taiwan
pp. 278-285
Kuen-Yu Tsai, Department of Electrical Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Rd., Taipei 106, Taiwan, R. O. C.
Meng-Fu You, Department of Electrical Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Rd., Taipei 106, Taiwan, R. O. C.
Yi-Chang Lu, Department of Electrical Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Rd., Taipei 106, Taiwan, R. O. C.
Philip C. W. Ng, Department of Electrical Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Rd., Taipei 106, Taiwan, R. O. C.
pp. 286-291
Victoria Wang, University of California, Los Angeles, USA
Dejan Markovic, University of California, Los Angeles, USA
pp. 292-296
Tao Xu, Department of Electrical and Computer Engineering, Duke University, Durham, NC 27708, USA
Krishnendu Chakrabarty, Department of Electrical and Computer Engineering, Duke University, Durham, NC 27708, USA
Vamsee K. Pamula, Advanced Liquid Logic, Inc., Research Triangle Park, NC 27560, USA
pp. 297-301
Hushrav D. Mogal, Department of Electrical and Computer Engineering, University of Minnesota, USA
Kia Bazargan, Department of Electrical and Computer Engineering, University of Minnesota, USA
pp. 302-305
Martin Strasser, Institute for Electronic Design Automation, Technische Universität München, Germany
Michael Eick, Institute for Electronic Design Automation, Technische Universität München, Germany
Helmut Grab, Institute for Electronic Design Automation, Technische Universität München, Germany
Ulf Schlichtmann, Institute for Electronic Design Automation, Technische Universität München, Germany
Frank M. Johannes, Institute for Electronic Design Automation, Technische Universität München, Germany
pp. 306-313
Ranko Sredojevic, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, 02139, USA
Vladimir Stojanovic, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, 02139, USA
pp. 314-321
Lara Dolecek, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, 02139, USA
Masood Qazi, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, 02139, USA
Devavrat Shah, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, 02139, USA
Anantha Chandrakasan, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, 02139, USA
pp. 322-329
Aida Todri, UCSB, ECE Department, USA
Malgorzata Marek-Sadowska, UCSB, ECE Department, USA
Joseph Kozhaya, IBM TJ Watson Research Center, USA
pp. 330-337
Yen-Jung Chang, Department of Computer Science, National Tsing Hua University, Hsinchu, Taiwan 30013
Yu-Ting Lee, Department of Computer Science, National Tsing Hua University, Hsinchu, Taiwan 30013
Ting-Chi Wang, Department of Computer Science, National Tsing Hua University, Hsinchu, Taiwan 30013
pp. 338-343
Yanheng Zhang, Department of Electrical and Computer Engineering, Iowa State University, Ames, 50011 USA
Yue Xu, Department of Electrical and Computer Engineering, Iowa State University, Ames, 50011 USA
Chris Chu, Department of Electrical and Computer Engineering, Iowa State University, Ames, 50011 USA
pp. 344-349
Chin-Hsiung Hsu, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan
Huang-Yu Chen, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan
Yao-Wen Chang, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan
pp. 350-355
Nicolas Blanc, ETH Zurich, Switzerland
Daniel Kroening, Oxford University, Computing Laboratory, UK
pp. 356-363
Jason Cong, Computer Science Department, University of California, Los Angeles, 90095, USA
Karthik Gururaj, Computer Science Department, University of California, Los Angeles, 90095, USA
Guoling Han, Computer Science Department, University of California, Los Angeles, 90095, USA
Adam Kaplan, Computer Science Department, University of California, Los Angeles, 90095, USA
Mishali Naik, Computer Science Department, University of California, Los Angeles, 90095, USA
Glenn Reinman, Computer Science Department, University of California, Los Angeles, 90095, USA
pp. 364-371
Fu-Ching Yang, Department of Computer Science and Engineering, National Sun Yat-sen University, Kaohsiung 80424, Taiwan
Jing-Kun Zhong, Department of Computer Science and Engineering, National Sun Yat-sen University, Kaohsiung 80424, Taiwan
Ing-Jer Huang, Department of Computer Science and Engineering, National Sun Yat-sen University, Kaohsiung 80424, Taiwan
pp. 372-377
Wei Dong, Department of ECE, Texas A&M University, College Station, 77843 USA
Peng Li, Department of ECE, Texas A&M University, College Station, 77843 USA
Garng M. Huang, Department of ECE, Texas A&M University, College Station, 77843 USA
pp. 378-385
Jaeha Kim, Rambus, Inc., 4440 El Camino Real, Los Altos, CA 94022, USA
Brian S. Leibowitz, Rambus, Inc., 4440 El Camino Real, Los Altos, CA 94022, USA
Metha Jeeradit, Rambus, Inc., 4440 El Camino Real, Los Altos, CA 94022, USA
pp. 386-391
Trent McConaghy, ESAT-MICAS, K. U. Leuven, Kasteelpark Arenberg 10, Belgium
Pieter Palmers, ESAT-MICAS, K. U. Leuven, Kasteelpark Arenberg 10, Belgium
Georges Gielen, ESAT-MICAS, K. U. Leuven, Kasteelpark Arenberg 10, Belgium
Michiel Steyaert, ESAT-MICAS, K. U. Leuven, Kasteelpark Arenberg 10, Belgium
pp. 392-395
Peng Gao, ESAT-MICAS, K. U. Leuven, Kasteelpark Arenberg 10, Belgium
Trent McConaghy, ESAT-MICAS, K. U. Leuven, Kasteelpark Arenberg 10, Belgium
Georges Gielen, ESAT-MICAS, K. U. Leuven, Kasteelpark Arenberg 10, Belgium
pp. 396-399
Azad Naeemi, Georgia Institute of Technology, 791 Atlantic Dr. Atlanta, 30332 USA
James D. Meindl, Georgia Institute of Technology, 791 Atlantic Dr. Atlanta, 30332 USA
pp. 400-405
K. L. Shepard, Department of Electrical Engineering, Columbia University, New York, 10027 USA
I. Meric, Department of Electrical Engineering, Columbia University, New York, 10027 USA
P. Kim, Department of Physics, Columbia University, New York, 10027 USA
pp. 406-411
Kartik Mohanram, Department of Electrical and Computer Engineering, Rice University, Houston, USA
Jing Guo, Department of Electrical and Computer Engineering, University of Florida, Gainesville, USA
pp. 412-415
Yesin Ryu, School of Electrical Engineering and Computer Science, Seoul National University, Korea
Taewhan Kim, School of Electrical Engineering and Computer Science, Seoul National University, Korea
pp. 416-419
Takashi Enami, Dept. Information Systems Engineering, Osaka University, 1-5 Yamadaoka, Suita, Japan
Masanori Hashimoto, Dept. Information Systems Engineering, Osaka University, 1-5 Yamadaoka, Suita, Japan
Takashi Sato, Integrated Research Institute, Tokyo Institute of Technology, 4259-R2-17, Nagatsuta, Midori-ku, Yokohama, Japan
pp. 420-425
Po-Yuan Chen, Department of Computer Science, National Tsing Hua University, HsinChu, Taiwan 300
Che-Yu Liu, Department of Computer Science, National Tsing Hua University, HsinChu, Taiwan 300
TingTing Hwang, Department of Computer Science, National Tsing Hua University, HsinChu, Taiwan 300
pp. 426-429
Timothy Kam, Strategic CAD Labs, Intel Corp., Hillsboro, Oregon, USA
Michael Kishinevsky, Strategic CAD Labs, Intel Corp., Hillsboro, Oregon, USA
Jordi Cortadella, Universitat Politècnica de Catalunya, Barcelona, Spain
Marc Galceran-Oms, Universitat Politècnica de Catalunya, Barcelona, Spain
pp. 434-441
Dmitry Bufistov, Univ. Politècnica de Catalunya, Barcelona, Spain
Jorge Julvez, Univ. Politècnica de Catalunya, Barcelona, Spain
Jordi Cortadella, Univ. Politècnica de Catalunya, Barcelona, Spain
pp. 442-448
Gennette Gill, Dept. of Computer Science, Univ. of North Carolina, Chapel Hill, 27599, USA
Vishal Gupta, Dept. of Computer Science, Univ. of North Carolina, Chapel Hill, 27599, USA
Montek Singh, Dept. of Computer Science, Univ. of North Carolina, Chapel Hill, 27599, USA
pp. 449-456
Myong Hyon Cho, Massachusetts Institute of Technology, USA
Chih-Chi Cheng, National Taiwan University, Taiwan
Michel Kinsy, Massachusetts Institute of Technology, USA
G. Edward Suh, Cornell University, USA
Srinivas Devadas, Massachusetts Institute of Technology, USA
pp. 457-464
Andrew B. Kahng, CSE Department, UC San Diego, La Jolla, CA, USA
Chul-Hong Park, ECE Department, UC San Diego, La Jolla, CA, USA
Xu Xu, Blaze DFM, Inc., Sunnyvale, CA, USA
Hailong Yao, CSE Department, UC San Diego, La Jolla, CA, USA
pp. 465-472
Shayak Banerjee, Department of Electrical and Computer Engineering, The University of Texas at Austin, USA
Praveen Elakkumanan, IBM Corp., Hopewell Junction, NY, USA
Lars W. Liebmann, IBM Corp., Hopewell Junction, NY, USA
Michael Orshansky, Department of Electrical and Computer Engineering, The University of Texas at Austin, USA
pp. 473-479
Jinyu Zhang, Institute of Microelectronics, Tsinghua University, Beijing, China, 100084
Wei Xiong, Institute of Microelectronics, Tsinghua University, Beijing, China, 100084
Yan Wang, Institute of Microelectronics, Tsinghua University, Beijing, China, 100084
Zhiping Yu, Institute of Microelectronics, Tsinghua University, Beijing, China, 100084
Min-Chun Tsai, Advanced Technology Group, Synopsys Inc., Mountain View, CA, 94043, USA
pp. 480-487
Jae-Seok Yang, Dept. of ECE, The University of Texas at Austin, 78712, USA
David Z. Pan, Dept. of ECE, The University of Texas at Austin, 78712, USA
pp. 488-493
Alexey Lvov, IBM T.J.Watson Res. Center, 1101 Kitchawan Rd. (rt. 134) 34-159, Yorktown Heights, NY, 10598 USA
Ulrich Finkler, IBM T.J.Watson Res. Center, 1101 Kitchawan Rd. (rt. 134) 34-159, Yorktown Heights, NY, 10598 USA
pp. 494-498
Tan Yan, Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, USA
Martin D. F. Wong, Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, USA
pp. 499-505
Minsik Cho, Dept. of ECE, The University of Texas at Austin, 78712, USA
Yongchan Ban, Dept. of ECE, The University of Texas at Austin, 78712, USA
David Z. Pan, Dept. of ECE, The University of Texas at Austin, 78712, USA
pp. 506-511
Jia-Wei Fang, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei 106, Taiwan
Kuan-Hsien Ho, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei 106, Taiwan
Yao-Wen Chang, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei 106, Taiwan
pp. 512-517
Jia-Wei Fang, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei 106, Taiwan
Yao-Wen Chang, Graduate Institute of Electronics Engineering, National Taiwan University, Taipei 106, Taiwan
pp. 518-522
Liang Li, Department of Computer Science and Engineering, The Chinese University of Hong Kong, China
Evangeline F. Y. Young, Department of Computer Science and Engineering, The Chinese University of Hong Kong, China
pp. 523-528
Kevin Brownell, School of Engineering and Applied Sciences Harvard University, Cambridge, MA 01238 USA
Gu-Yeon Wei, School of Engineering and Applied Sciences Harvard University, Cambridge, MA 01238 USA
David Brooks, School of Engineering and Applied Sciences Harvard University, Cambridge, MA 01238 USA
pp. 529-536
Ravishankar Rao, Department of Computer Science and Engineering, Arizona State University, Tempe, 85281, USA
Sarma Vrudhula, Department of Computer Science and Engineering, Arizona State University, Tempe, 85281, USA
pp. 537-542
Mohammad Abdullah Al Faruque, University of Karlsruhe, Chair for Embedded Systems, Germany
Thomas Ebi, University of Karlsruhe, Chair for Embedded Systems, Germany
Jorg Henkel, University of Karlsruhe, Chair for Embedded Systems, Germany
pp. 543-548
Talal Bonny, University of Karlsruhe, Chair for Embedded Systems, Germany
Jorg Henkel, University of Karlsruhe, Chair for Embedded Systems, Germany
pp. 549-554
Yi Zhu, Department of Computer Science and Engineering, University of California, San Diego, 9500 Gilman Dr., La Jolla, 92093-0404, U.S.A.
Michael Taylor, Department of Computer Science and Engineering, University of California, San Diego, 9500 Gilman Dr., La Jolla, 92093-0404, U.S.A.
Scott B. Baden, Department of Computer Science and Engineering, University of California, San Diego, 9500 Gilman Dr., La Jolla, 92093-0404, U.S.A.
Chung-Kuan Cheng, Department of Computer Science and Engineering, University of California, San Diego, 9500 Gilman Dr., La Jolla, 92093-0404, U.S.A.
pp. 555-558
B. V. N. Silpa, Department of Computer Science and Engineering, Indian Institute of Technology Delhi, Hauz Khas, New Delhi 110016, India
Anjul Patney, Department of Electrical Engineering, Indian Institute of Technology Delhi, Hauz Khas, New Delhi 110016, India
Tushar Krishna, Department of Electrical Engineering, Indian Institute of Technology Delhi, Hauz Khas, New Delhi 110016, India
Preeti Ranjan Panda, Department of Computer Science and Engineering, Indian Institute of Technology Delhi, Hauz Khas, New Delhi 110016, India
G. S. Visweswaran, Department of Electrical Engineering, Indian Institute of Technology Delhi, Hauz Khas, New Delhi 110016, India
pp. 559-564
Taylan Yemliha, Syracuse University, Syracuse, NY, USA
Shekhar Srikantaiah, Pennsylvania State University, University Park, USA
Mahmut Kandemir, Pennsylvania State University, University Park, USA
Ozcan Ozturk, Bilkent University, Ankara, Turkey
pp. 565-569
Sanjit A. Seshia, EECS Department, UC Berkeley, USA
Alexander Rakhlin, EECS Department, UC Berkeley, USA
pp. 575-582
Taylan Yemliha, Syracuse University, NY. USA
Shekhar Srikantaiah, Pennsylvania State University, University Park, PA. USA
Mahmut Kandemir, Pennsylvania State University, University Park, PA. USA
Mustafa Karakoy, Imperial College, London. UK
Mary Jane Irwin, Pennsylvania State University, University Park, PA. USA
pp. 583-588
Somnath Paul, Department of EECS, Case Western Reserve University, Cleveland, OH, USA
Saibal Mukhopadhyay, Department of ECE, Georgia Institute of Technology, Atlanta, USA
Swarup Bhunia, Department of EECS, Case Western Reserve University, Cleveland, OH, USA
pp. 589-592
Tamer Ragheb, Electrical and Computer Engineering Department, Rice University, Houston TX 77005 USA
Yehia Massoud, Electrical and Computer Engineering Department, Rice University, Houston TX 77005 USA
pp. 593-597
Igor Loi, DEIS, University of Bologna, Italy
Subhasish Mitra, Stanford University, California, Usa
Thomas H. Lee, Stanford University, California, Usa
Shinobu Fujita, Toshiba, Japan
Luca Benini, DEIS, University of Bologna, Italy
pp. 598-602
Nicholas Allec, ECE Department, Queen¿s University, Kingston, ON K7L 3N6, Canada
Zyad Hassan, ECE Department, University of Colorado at Boulder, 80309, U.S.A
Li Shang, ECE Department, University of Colorado at Boulder, 80309, U.S.A
Robert P. Dick, EECS Department, Northwestern University, Evanston, IL 60208, U.S.A
Ronggui Yang, ME Department, University of Colorado at Boulder, 80309, U.S.A
pp. 603-610
Duo Li, Dept. of Electrical Engineering, University of California, Riverside, 92521 USA
Sheldon X.-D. Tan, Dept. of Electrical Engineering, University of California, Riverside, 92521 USA
Eduardo H. Pacheco, Intel Corporation, 2200 Mission College Blvd, Santa Clara, CA 95052 USA
Murli Tirumala, Intel Corporation, 2200 Mission College Blvd, Santa Clara, CA 95052 USA
pp. 611-617
Ramkumar Jayaseelan, Department of Computer Science, National University of Singapore, Singapore
Tulika Mitra, Department of Computer Science, National University of Singapore, Singapore
pp. 618-623
Vladimir Zolotov, IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598 USA
Jinjun Xiong, IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598 USA
Hanif Fatemi, Synopsys Inc., Mountain View, CA 94043 USA
Chandu Visweswariah, IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598 USA
pp. 624-631
Reza M. Rad, Department of CSEE, Univ. of Maryland, Baltimore Campus, USA
Xiaoxiao Wang, Department of Electrical and Computer Engineering, Univ. of Connecticut, USA
Mohammad Tehranipoor, Department of Electrical and Computer Engineering, Univ. of Connecticut, USA
Jim Plusquellic, Department of Electrical and Computer Engineering, Univ. of New Mexico, USA
pp. 632-639
Xiaoxiao Wang, Dept. of ECE, University of Connecticut, USA
Mohammad Tehranipoor, Dept. of ECE, University of Connecticut, USA
Ramyanshu Datta, Texas Instruments, USA
pp. 640-646
Zhuo Feng, Department of Electrical and Computer Engineering, Texas A&M University, College Station, 77843 USA
Peng Li, Department of Electrical and Computer Engineering, Texas A&M University, College Station, 77843 USA
pp. 647-654
Rui Shi, Department of Computer Science and Engineering, UC San Diego, La Jolla, CA, 92093, USA
Wenjian Yu, Department of Computer Science and Technology, Tsinghua University, Beijing, 100084, China
Yi Zhu, Department of Computer Science and Engineering, UC San Diego, La Jolla, CA, 92093, USA
Chung-Kuan Cheng, Department of Computer Science and Engineering, UC San Diego, La Jolla, CA, 92093, USA
Ernest S. Kuh, Department of Electrical Engineering and Computer Science, UC Berkeley, CA, 94720, USA
pp. 655-661
Tarek A. El-Moselhy, Research Lab in Electronics, Massachusetts Institute of Technology, USA
Ibrahim M. Elfadel, Systems&Technology Group, IBM Corporation, USA
Luca Daniel, Research Lab in Electronics, Massachusetts Institute of Technology, USA
pp. 662-669
Mehrdad Majzoobi, Electrical and Computer Engineering Department, Rice University, 6100 Main, MS380, Houston, TX 77005 USA
Farinaz Koushanfar, Electrical and Computer Engineering Department, Rice University, 6100 Main, MS380, Houston, TX 77005 USA
Miodrag Potkonjak, Computer Science Department, University of California, Los Angeles, 3532G Boelter Hall, 90095 USA
pp. 670-673
Rajat Subhra Chakraborty, Dept. of Electrical Engineering and Computer Science, Case Western Reserve University, Cleveland, Ohio 44106, USA
Swarup Bhunia, Dept. of Electrical Engineering and Computer Science, Case Western Reserve University, Cleveland, Ohio 44106, USA
pp. 674-677
Jude Angelo Ambrose, School of Computer Science and Engineering, University of New South Wales, Sydney, Australia
Sri Parameswaran, School of Computer Science and Engineering, University of New South Wales, Sydney, Australia
Aleksandar Ignjatovic, School of Computer Science and Engineering, University of New South Wales, Sydney, Australia
pp. 678-684
Natasa Miskov-Zivanov, Electrical and Computer Engineering Department, Carnegie Mellon University, USA
Kai-Chiang Wu, Electrical and Computer Engineering Department, Carnegie Mellon University, USA
Diana Marculescu, Electrical and Computer Engineering Department, Carnegie Mellon University, USA
pp. 685-690
Brian T. Cline, Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, USA
Vivek Joshi, Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, USA
Dennis Sylvester, Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, USA
David Blaauw, Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, USA
pp. 691-697
Kaviraj Chopra, Department of Electrical Engineering&Computer Science, University of Michigan, Ann Arbor, 48109 USA
Cheng Zhuo, Department of Electrical Engineering&Computer Science, University of Michigan, Ann Arbor, 48109 USA
David Blaauw, Department of Electrical Engineering&Computer Science, University of Michigan, Ann Arbor, 48109 USA
Dennis Sylvester, Department of Electrical Engineering&Computer Science, University of Michigan, Ann Arbor, 48109 USA
pp. 698-705
Yu Hu, Electrical Engineering Department, University of California, Los Angeles, USA
Zhe Feng, Electrical Engineering Department, University of California, Los Angeles, USA
Lei He, Electrical Engineering Department, University of California, Los Angeles, USA
Rupak Majumdar, Computer Science Department, University of California, Los Angeles, USA
pp. 706-713
Amit Agarwal, Department of Computer Science, University of California at Los Angeles, USA
Jason Cong, Department of Computer Science, University of California at Los Angeles, USA
Brian Tagiku, Department of Computer Science, University of California at Los Angeles, USA
pp. 714-721
Prasanth Mangalagiri, Department of Computer Science and Engineering, Pennsylvania State Universiy, State College, PA 16802, USA
Sungmin Bae, Department of Computer Science and Engineering, Pennsylvania State Universiy, State College, PA 16802, USA
Ramakrishnan Krishnan, Department of Computer Science and Engineering, Pennsylvania State Universiy, State College, PA 16802, USA
Yuan Xie, Department of Computer Science and Engineering, Pennsylvania State Universiy, State College, PA 16802, USA
Vijaykrishnan Narayanan, Department of Computer Science and Engineering, Pennsylvania State Universiy, State College, PA 16802, USA
pp. 722-727
Bradley N. Bond, Research Laboratory in Electronics, Massachusetts Institute of Technology, USA
Luca Daniel, Research Laboratory in Electronics, Massachusetts Institute of Technology, USA
pp. 728-735
Zuochang Ye, Cadence Research Laboratories, USA
Dmitry Vasilyev, Massachusetts Institute of Technology, USA
Zhenhai Zhu, Cadence Research Laboratories, USA
Joel R. Phillips, Cadence Research Laboratories, USA
pp. 736-743
Boyuan Yan, Department of Electrical Engineering, University of California, Riverside, 92521, USA
Sheldon X.-D. Tan, Department of Electrical Engineering, University of California, Riverside, 92521, USA
Gengsheng Chen, ASIC&System State-Key-Lab, Microelectronics Dept., Fudan Univeristy, Shanghai, China, 200433
Lifeng Wu, Cadence Design Systems Inc., San Jose, CA 95134, USA
pp. 744-749
Fred Chen, Department of EECS, Massachusetts Institute of Technology, Cambridge, 02139, USA
Hei Kam, Department of EECS, University of California, Berkeley, 94720, USA
Dejan Markovic, EE Department, University of California, Los Angeles, 90095, USA
Tsu-Jae King Liu, Department of EECS, University of California, Berkeley, 94720, USA
Vladimir Stojanovic, Department of EECS, Massachusetts Institute of Technology, Cambridge, 02139, USA
Elad Alon, Department of EECS, University of California, Berkeley, 94720, USA
pp. 750-757
Brian Fett, Department of Electrical and Computer Engineering, University of Minnesota, 200 Union St. S.E., Minneapolis, 55455, USA
Marc D. Riedel, Department of Electrical and Computer Engineering, University of Minnesota, 200 Union St. S.E., Minneapolis, 55455, USA
pp. 758-764
Arthur Nieuwoudt, Department of Electrical and Computer Engineering, Rice University, Houston, Texas, USA
Jamil Kawa, Department of Electrical and Computer Engineering, Rice University, Houston, Texas, USA
Yehia Massoud, Department of Electrical and Computer Engineering, Rice University, Houston, Texas, USA
pp. 765-770
Chandramouli Kashyap, Intel Corporation, Hillsboro, OR, USA
Pouria Bastani, University of California - Santa Barbara, USA
Kip Killpack, Intel Corporation, Hillsboro, OR, USA
Chirayu Amin, Intel Corporation, Hillsboro, OR, USA
pp. 778-782
Debjit Sinha, IBM Systems and Technology Group, EDA, Hopewell Jn, NY 12533, USA
Gregory Schaeffer, IBM Systems and Technology Group, EDA, Hopewell Jn, NY 12533, USA
Soroush Abbaspour, IBM Systems and Technology Group, EDA, Hopewell Jn, NY 12533, USA
Alex Rubin, IBM Systems and Technology Group, EDA, Hopewell Jn, NY 12533, USA
Frank Borkam, IBM Systems and Technology Group, EDA, Hopewell Jn, NY 12533, USA
pp. 790-796
Weiqing Guo, Silicon design CAD, Advanced Micro Devices, Sunnyvale, CA, 94085, USA
Yu Zhong, Dept. of Electrical and Computer Engineering, Univ. of Illinois at Urbana-Champaign, 61801, USA
Tom Burd, Silicon design CAD, Advanced Micro Devices, Sunnyvale, CA, 94085, USA
pp. 797-802
M.M. Gourary, IPPM, Russian Academy of Sciences, Moscow, Russian Federation
S.G. Rusakov, IPPM, Russian Academy of Sciences, Moscow, Russian Federation
S.L. Ulyanov, IPPM, Russian Academy of Sciences, Moscow, Russian Federation
M.M. Zharov, IPPM, Russian Academy of Sciences, Moscow, Russian Federation
B.J. Mulvaney, Freescale Semiconductor Inc., Austin, Texas, USA
K.K. Gullapalli, Freescale Semiconductor Inc., Austin, Texas, USA
pp. 807-814
Prateek Bhansali, Department of Electrical and Computer Engineering, University of Minnesota, USA
Shweta Srivastava, Department of Electrical and Computer Engineering, University of Minnesota, USA
Xiaolue Lai, Department of Electrical and Computer Engineering, University of Minnesota, USA
Jaijeet Roychowdhury, Department of Electrical and Computer Engineering, University of Minnesota, USA
pp. 815-820
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