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2009 IEEE International Conference on Acoustics, Speech and Signal Processing
Taipei, Taiwan
April 19-April 24
ISBN: 978-1-4244-2353-8
Table of Contents
Papers
M. Neuendorf, Fraunhofer IIS, Erlangen, Germany
P. Gournay, University of Sherbrooke, Canada
M. Multrus, Fraunhofer IIS, Erlangen, Germany
J. Lecomte, Fraunhofer IIS, Erlangen, Germany
B. Bessette, University of Sherbrooke, Canada
R. Geiger, Fraunhofer IIS, Erlangen, Germany
S. Bayer, Fraunhofer IIS, Erlangen, Germany
G. Fuchs, Fraunhofer IIS, Erlangen, Germany
J. Hilpert, Fraunhofer IIS, Erlangen, Germany
N. Rettelbach, Fraunhofer IIS, Erlangen, Germany
R. Salami, VoiceAge Corp., Montréal, Canada
G. Schuller, Fraunhofer IDMT, Ilmenau, Germany
R. Lefebvre, University of Sherbrooke, Canada
B. Grill, Fraunhofer IIS, Erlangen, Germany
pp. 1-4
Stefan Wabnik, Fraunhofer IDMT, Institute for Digital Media Technology, Ehrenbergstr. 31, 98693 Ilmenau, Germany
Gerald Schuller, Fraunhofer IDMT, Institute for Digital Media Technology, Ehrenbergstr. 31, 98693 Ilmenau, Germany
Ferenc Kraemer, Technical University of Ilmenau, Institute for Media Technology, Helmholtzplatz 2, 98693, Germany
pp. 5-8
Sanjeev Mehrotra, Microsoft Research, Microsoft Corporation, One Microsoft Way, Redmond, WA, 98052, USA
Wei-ge Chen, Microsoft Research, Microsoft Corporation, One Microsoft Way, Redmond, WA, 98052, USA
Kishore Kotteri, Microsoft Research, Microsoft Corporation, One Microsoft Way, Redmond, WA, 98052, USA
pp. 9-12
Martin Holters, Helmut Schmidt University - University of the Federal Armed Forces, Department of Signal Processing and Communications, Hamburg, Germany
Udo Zolzer, Helmut Schmidt University - University of the Federal Armed Forces, Department of Signal Processing and Communications, Hamburg, Germany
pp. 13-16
Vinay Melkote, Department of Electrical and Computer Engineering, University of California, Santa Barbara, 93106, USA
Kenneth Rose, Department of Electrical and Computer Engineering, University of California, Santa Barbara, 93106, USA
pp. 17-20
Jan Ostergaard, Department of Electronic Systems, Aalborg University, Denmark
Daniel E. Quevedo, School of Electrical Engineering and Computer Science, The University of Newcastle, Australia
Jesper Jensen, Oticon, Copenhagen, Denmark
pp. 21-24
Jacob Benesty, INRS-EMT, University of Quebec, Montreal, H5A 1K6, Canada
Jingdong Chen, Bell Labs, Alcatel-Lucent, Murray Hill, NJ 07974, USA
Yiteng Huang, WeVoice, Inc., Bridgewater, NJ 08807, USA
pp. 25-28
Mahdi Triki, Digital Signal Processing Group, Philips Research Laboratories, Eindhoven, The Netherlands
Kees Janse, Digital Signal Processing Group, Philips Research Laboratories, Eindhoven, The Netherlands
pp. 29-32
Shoko Araki, NTT Communication Science Laboratories, NTT Corporation, 2-4 Hikaridai, Seika-cho, Soraku-gun, Kyoto 619-0237, Japan
Tomohiro Nakatani, NTT Communication Science Laboratories, NTT Corporation, 2-4 Hikaridai, Seika-cho, Soraku-gun, Kyoto 619-0237, Japan
Hiroshi Sawada, NTT Communication Science Laboratories, NTT Corporation, 2-4 Hikaridai, Seika-cho, Soraku-gun, Kyoto 619-0237, Japan
Shoji Makino, NTT Communication Science Laboratories, NTT Corporation, 2-4 Hikaridai, Seika-cho, Soraku-gun, Kyoto 619-0237, Japan
pp. 33-36
Andrew Nesbit, Electronic Engineering&Computer Science, Queen Mary, University of London, Mile End Road, E1 4NS, United Kingdom
Emmanuel Vincent, METISS Group, IRISA-INRIA, Campus de Beaulieu, 35042 Rennes Cedex, France
Mark D. Plumbley, Electronic Engineering&Computer Science, Queen Mary, University of London, Mile End Road, E1 4NS, United Kingdom
pp. 37-40
Banu Gunel, I-Lab/CCSR, University of Surrey, Guildford, GU2 7XH, UK
Huseyin Hacihabiboglu, CDSPR, King's College London, Strand, WC2R 2LS, UK
Ahmet M. Kondoz, I-Lab/CCSR, University of Surrey, Guildford, GU2 7XH, UK
pp. 41-44
Hirokazu Kameoka, NTT Communication Science Laboratories, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198, Japan
Tomohiro Nakatani, NTT Communication Science Laboratories, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198, Japan
Takuya Yoshioka, NTT Communication Science Laboratories, NTT Corporation, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198, Japan
pp. 45-48
Ricardo Scholz, METISS Project Team - IRISA / INRIA / CNRS, Campus de Beaulieu - 35042 Rennes Cedex - France
Emmanuel Vincent, METISS Project Team - IRISA / INRIA / CNRS, Campus de Beaulieu - 35042 Rennes Cedex - France
Frederic Bimbot, METISS Project Team - IRISA / INRIA / CNRS, Campus de Beaulieu - 35042 Rennes Cedex - France
pp. 53-56
Yuxiang Liu, Department of Computer Science&Technology, Tsinghua University, Beijing, China
Qiaoliang Xiang, School of Computing, National University of Singapore, Singapore
Ye Wang, School of Computing, National University of Singapore, Singapore
Lianhong Cai, Department of Computer Science&Technology, Tsinghua University, Beijing, China
pp. 57-60
Yu Liu, School of Electrical Engineering and INMC, Seoul National University, 151-742, Korea
Kiho Cho, School of Electrical Engineering and INMC, Seoul National University, 151-742, Korea
Hwan Sik Yun, School of Electrical Engineering and INMC, Seoul National University, 151-742, Korea
Jong Won Shin, School of Electrical Engineering and INMC, Seoul National University, 151-742, Korea
Nam Soo Kim, School of Electrical Engineering and INMC, Seoul National University, 151-742, Korea
pp. 61-64
Theodoros Giannakopoulos, Dept. of Informatics and Telecommunications, University of Athens, Greece
Aggelos Pikrakis, Dept. of Informatics and Telecommunications, University of Athens, Greece
Sergios Theodoridis, Dept. of Informatics and Telecommunications, University of Athens, Greece
pp. 65-68
Xiaodan Zhuang, Dept. of ECE, University of Illinois at Urbana-Champaign, USA
Jing Huang, IBM T.J. Watson Research Center, Yorktown Heights, New York, USA
Gerasimos Potamianos, IBM T.J. Watson Research Center, Yorktown Heights, New York, USA
Mark Hasegawa-Johnson, Dept. of ECE, University of Illinois at Urbana-Champaign, USA
pp. 69-72
Gary W. Elko, mh acoustics, 25A Summit Ave, NJ 07901, USA
Jens Meyer, mh acoustics, 25A Summit Ave, NJ 07901, USA
pp. 73-76
Edwin Mabande, University of Erlangen-Nuremberg, Multimedia Communications and Signal Processing, Cauerstraße 7, 91058, Germany
Adrian Schad, University of Erlangen-Nuremberg, Multimedia Communications and Signal Processing, Cauerstraße 7, 91058, Germany
Walter Kellermann, University of Erlangen-Nuremberg, Multimedia Communications and Signal Processing, Cauerstraße 7, 91058, Germany
pp. 77-80
Thushara D. Abhayapala, Applied Signal Processing Group, Department of Information Engineering, RSISE, CECS, The Australian National University ACT 0200, Canberra, Australia
Aastha Gupta, Applied Signal Processing Group, Department of Information Engineering, RSISE, CECS, The Australian National University ACT 0200, Canberra, Australia
pp. 81-84
Dmitry N. Zotkin, Perceptual Interfaces and Reality Lab, Institute for Advanced Computer Studies (UMIACS), University of Maryland, College Park, 20742, USA
Ramani Duraiswami, Perceptual Interfaces and Reality Lab, Institute for Advanced Computer Studies (UMIACS), University of Maryland, College Park, 20742, USA
pp. 85-88
T. Betlehem, Industrial Research Limited, 69 Gracefield Road, Lower Hutt, New Zealand
M.A. Poletti, Industrial Research Limited, 69 Gracefield Road, Lower Hutt, New Zealand
pp. 89-92
Yan Jennifer Wu, Applied Signal Processing Group, Dept of Information Engineering, Research School of Information Sciences&Engineering, CECS, The Australian National University, Australia
Thushara D. Abhayapala, Applied Signal Processing Group, Dept of Information Engineering, Research School of Information Sciences&Engineering, CECS, The Australian National University, Australia
pp. 93-96
Michael Stark, Signal Processing and Speech Communication Laboratory, Graz University of Technology, Austria
Franz Pernkopf, Signal Processing and Speech Communication Laboratory, Graz University of Technology, Austria
pp. 97-100
Mathieu Parvaix, Grenoble Lab. of Images, Speech, Signal and Automation (GIPSA-lab, DPC), CNRS UMR 5216 , Grenoble Institute of Technology, France
Laurent Girin, Grenoble Lab. of Images, Speech, Signal and Automation (GIPSA-lab, DPC), CNRS UMR 5216 , Grenoble Institute of Technology, France
Jean-Marc Brossier, Grenoble Lab. of Images, Speech, Signal and Automation (GIPSA-lab, DIS), CNRS UMR 5216 , Grenoble Institute of Technology, France
pp. 101-104
Jean-Louis Durrieu, Institut TELECOM, TELECOM ParisTech, CNRS LTCI, 46, rue Barrault - 75634 Cedex 13 - France
Gael Richard, Institut TELECOM, TELECOM ParisTech, CNRS LTCI, 46, rue Barrault - 75634 Cedex 13 - France
Bertrand David, Institut TELECOM, TELECOM ParisTech, CNRS LTCI, 46, rue Barrault - 75634 Cedex 13 - France
pp. 105-108
Srikanth Vishnubhotla, Institute for Systems Research&Department of Electrical&Computer Engineering, University of Maryland, College Park, USA
Carol Y. Espy-Wilson, Institute for Systems Research&Department of Electrical&Computer Engineering, University of Maryland, College Park, USA
pp. 109-112
Ron J. Weiss, LabROSA, Dept. of Electrical Engineering, Columbia University, New York 10027 USA
Daniel P. W. Ellis, LabROSA, Dept. of Electrical Engineering, Columbia University, New York 10027 USA
pp. 113-116
Benedikt Loesch, Chair of System Theory and Signal Processing, University of Stuttgart, Germany
Bin Yang, Chair of System Theory and Signal Processing, University of Stuttgart, Germany
pp. 117-120
T. Hiekata, Kobe Steel, Ltd., 651-2271, Japan
T. Morita, Kobe Steel, Ltd., 651-2271, Japan
Y. Ikeda, Kobe Steel, Ltd., 651-2271, Japan
H. Hashimoto, Kobe Steel, Ltd., 651-2271, Japan
R. Zhang, Feng Co., Ltd., Himeji, 670-0995, Japan
Y. Takahashi, Nara Institute of Science and Technology, 630-0192, Japan
H. Saruwatari, Nara Institute of Science and Technology, 630-0192, Japan
K. Shikano, Nara Institute of Science and Technology, 630-0192, Japan
pp. 121-124
S. M. Naqvi, Advanced Signal Processing Group, Department of Electronic and Electrical Engineering, Loughborough University, LE11 3TU, UK
Y. Zhang, Advanced Signal Processing Group, Department of Electronic and Electrical Engineering, Loughborough University, LE11 3TU, UK
J. A. Chambers, Advanced Signal Processing Group, Department of Electronic and Electrical Engineering, Loughborough University, LE11 3TU, UK
pp. 125-128
Bram Cornelis, Katholieke Universiteit Leuven, Dept. of Electrical Engineering (ESAT-SCD), Kasteelpark Arenberg 10, 3001, Belgium
Marc Moonen, Katholieke Universiteit Leuven, Dept. of Electrical Engineering (ESAT-SCD), Kasteelpark Arenberg 10, 3001, Belgium
Jan Wouters, Katholieke Universiteit Leuven, Dept. of Neurosciences, ExpORL, Herestraat 49/721, 3000, Belgium
pp. 129-132
Masahito Togami, Central Research Laboratory, Hitachi Ltd., 1-280, Higashi-koigakubo Kokubunji-shi, Tokyo 185-8601, Japan
Yohei Kawaguchi, Central Research Laboratory, Hitachi Ltd., 1-280, Higashi-koigakubo Kokubunji-shi, Tokyo 185-8601, Japan
Yasunari Obuchi, Central Research Laboratory, Hitachi Ltd., 1-280, Higashi-koigakubo Kokubunji-shi, Tokyo 185-8601, Japan
pp. 133-136
Tomohiro Nakatani, NTT Communication Science Labs., NTT Corporation, Kyoto, Japan
Takuya Yoshioka, NTT Communication Science Labs., NTT Corporation, Kyoto, Japan
Keisuke Kinoshita, NTT Communication Science Labs., NTT Corporation, Kyoto, Japan
Masato Miyoshi, NTT Communication Science Labs., NTT Corporation, Kyoto, Japan
Biing-Hwang Juang, NTT Communication Science Labs., NTT Corporation, Kyoto, Japan
pp. 137-140
Mehrez Souden, INRS- ÉMT, 800, de la Gauchetière Ouest, Suite 6900, Montréal, H5A 1K6, Qc, Canada
Jacob Benesty, INRS- ÉMT, 800, de la Gauchetière Ouest, Suite 6900, Montréal, H5A 1K6, Qc, Canada
Sofiene Affes, INRS- ÉMT, 800, de la Gauchetière Ouest, Suite 6900, Montréal, H5A 1K6, Qc, Canada
pp. 141-144
Frederik Nagel, Fraunhofer Institute for Integrated Circuits (IIS), Am Wolfsmantel 33, 91058 Erlangen, Germany
Sascha Disch, Leibniz Universität Hannover, Schneiderberg 32, 30167, Germany
pp. 145-148
Te Li, Institute for Infocomm Research, A*STAR, Singapore
Susanto Rahardja, Institute for Infocomm Research, A*STAR, Singapore
pp. 149-152
Cees Taal, Delft University of Technology, Dept. of Mediamatics, 2628 CD, The Netherlands
Richard Heusdens, Delft University of Technology, Dept. of Mediamatics, 2628 CD, The Netherlands
pp. 153-156
Mikko Tammi, Nokia Research Center, Tampere, Finland
Lasse Laaksonen, Nokia Research Center, Tampere, Finland
Anssi Ramo, Nokia Research Center, Tampere, Finland
Henri Toukomaa, Nokia Research Center, Tampere, Finland
pp. 161-164
Stavros Ntalampiras, Department of Electrical and Computer Engineering, University of Patras, Greece
Ilyas Potamitis, Department of Music Technology and Acoustics, Technological Educational Institute of Crete, Greece
Nikos Fakotakis, Department of Electrical and Computer Engineering, University of Patras, Greece
pp. 165-168
Soo-Chang Pei, Graduate Institute of Communication Engineering, National Taiwan University, Taiwan, R.O.C.
Nien-Teh Hsu, Graduate Institute of Communication Engineering, National Taiwan University, Taiwan, R.O.C.
pp. 169-172
Juan Jose Burred, Analysis/Synthesis Team, IRCAM - CNRS STMS, 75004 Paris, France
Axel Robel, Analysis/Synthesis Team, IRCAM - CNRS STMS, 75004 Paris, France
Thomas Sikora, Communication Systems Group, Technical University of Berlin, 10587, Germany
pp. 173-176
Huy Dat Tran, Institute for Infocomm Research, A*STAR, 1 FusionopolisWay, Singapore 138632
Haizhou Li, Institute for Infocomm Research, A*STAR, 1 FusionopolisWay, Singapore 138632
pp. 177-180
Maria M. Ruxanda, Department of Computer Science, Aalborg University, Denmark
Bee Yong Chua, Department of Computer Science, Aalborg University, Denmark
Alexandros Nanopoulos, Information Systems and Machine Learning Lab, University of Hildesheim, Germany
Christian S. Jensen, Department of Computer Science, Aalborg University, Denmark
pp. 181-184
Emiru Tsunoo, Graduate School of Information Science and Technology, The University of Tokyo, 7-3-1 Hongo, Bunkyou-ku, 113-8656, Japan
Nobutaka Ono, Graduate School of Information Science and Technology, The University of Tokyo, 7-3-1 Hongo, Bunkyou-ku, 113-8656, Japan
Shigeki Sagayama, Graduate School of Information Science and Technology, The University of Tokyo, 7-3-1 Hongo, Bunkyou-ku, 113-8656, Japan
pp. 185-188
Isabel Barbancho, E.T.S.I. Telecomunicación, Dpt. Ingeniería de Comunicaciones, Universidad de Málaga, Campus de Teatinos s/n, 29071, Spain
Cristina de la Bandera, E.T.S.I. Telecomunicación, Dpt. Ingeniería de Comunicaciones, Universidad de Málaga, Campus de Teatinos s/n, 29071, Spain
Ana M. Barbancho, E.T.S.I. Telecomunicación, Dpt. Ingeniería de Comunicaciones, Universidad de Málaga, Campus de Teatinos s/n, 29071, Spain
Lorenzo J. Tardon, E.T.S.I. Telecomunicación, Dpt. Ingeniería de Comunicaciones, Universidad de Málaga, Campus de Teatinos s/n, 29071, Spain
pp. 189-192
Luis A. Azpicueta-Ruiz, Department of Signal Theory and Communications, Universidad Carlos III de Madrid, 28911 Leganés-Madrid, Spain
Marcus Zeller, Multimedia Communications and Signal Processing, University of Erlangen-Nuremberg Cauerstr. 7, 91058, Germany
Jeronimo Arenas-Garcia, Department of Signal Theory and Communications, Universidad Carlos III de Madrid, 28911 Leganés-Madrid, Spain
Walter Kellermann, Multimedia Communications and Signal Processing, University of Erlangen-Nuremberg Cauerstr. 7, 91058, Germany
pp. 193-196
Qin Li, Microsoft Research, One Microsoft Way, Redmond, WA 98052, USA
Wei-Ge Chen, Microsoft Research, One Microsoft Way, Redmond, WA 98052, USA
Chao He, Microsoft Research, One Microsoft Way, Redmond, WA 98052, USA
Henrique S. Malvar, Microsoft Research, One Microsoft Way, Redmond, WA 98052, USA
pp. 197-200
Jianming Liu, Institute of Microelectronics of Tsinghua University, Beijing, 100084, China
Weiqian Liang, Department of Electronic Engineering, Tsinghua University, Beijing, 100084, China
Runsheng Liu, Department of Electronic Engineering, Tsinghua University, Beijing, 100084, China
pp. 205-208
Guilin Ma, GN ReSound A/S, Lautrupbjerg 9, 2750 Ballerup, Denmark
Fredrik Gran, GN ReSound A/S, Lautrupbjerg 9, 2750 Ballerup, Denmark
Finn Jacobsen, Acoustic Technology, Department of Electrical Engineering, Technical University of Denmark, Oersteds Plads, Building 352 DK-2800 Kgs. Lyngby, Denmark
Finn Agerkvist, Acoustic Technology, Department of Electrical Engineering, Technical University of Denmark, Oersteds Plads, Building 352 DK-2800 Kgs. Lyngby, Denmark
pp. 209-212
Tao Yu, CRSS: Center of Robust Speech Systems, University of Texas at Dallas, 800 West Campbell Road, Richardson, 75080, USA
John H.L. Hansen, CRSS: Center of Robust Speech Systems, University of Texas at Dallas, 800 West Campbell Road, Richardson, 75080, USA
pp. 213-216
Markus Kallinger, Fraunhofer Institute for Integrated Circuits IIS, Am Wolfsmantel 33, 91058 Erlangen, Germany
Giovanni Del Galdo, Fraunhofer Institute for Integrated Circuits IIS, Am Wolfsmantel 33, 91058 Erlangen, Germany
Fabian Kuech, Fraunhofer Institute for Integrated Circuits IIS, Am Wolfsmantel 33, 91058 Erlangen, Germany
Dirk Mahne, Fraunhofer Institute for Integrated Circuits IIS, Am Wolfsmantel 33, 91058 Erlangen, Germany
Richard Schultz-Amling, Fraunhofer Institute for Integrated Circuits IIS, Am Wolfsmantel 33, 91058 Erlangen, Germany
pp. 217-220
Markus Buck, Harman/Becker Automotive Systems, Acoustic Speech Enhancement - Research, 89077 Ulm, Germany
Tobias Wolff, Harman/Becker Automotive Systems, Acoustic Speech Enhancement - Research, 89077 Ulm, Germany
Tim Haulick, Harman/Becker Automotive Systems, Acoustic Speech Enhancement - Research, 89077 Ulm, Germany
Gerhard Schmidt, Harman/Becker Automotive Systems, Acoustic Speech Enhancement - Research, 89077 Ulm, Germany
pp. 221-224
Mahdi Triki, Digital Signal Processing Group, Philips Research Laboratories, Eindhoven, The Netherlands
pp. 225-228
Yu Takahashi, Nara Institute of Science and Technology, 630-0192 Japan
Yoshihisa Uemura, Nara Institute of Science and Technology, 630-0192 Japan
Hiroshi Saruwatari, Nara Institute of Science and Technology, 630-0192 Japan
Kiyorhiro Shikano, Nara Institute of Science and Technology, 630-0192 Japan
Kazunobu Kondo, SA Group, Center for Advanced Sound Technologies, Yamaha Corp., Shizuoka, 438-0192 Japan
pp. 229-232
Anthony Lombard, Multimedia Communications and Signal Processing, University of Erlangen-Nuremberg, Cauerstr. 7, 91058, Germany
Tobias Rosenkranz, Multimedia Communications and Signal Processing, University of Erlangen-Nuremberg, Cauerstr. 7, 91058, Germany
Herbert Buchner, Deutsche Telekom Laboratories, Technical University Berlin, Ernst-Reuter-Platz 7, 10587, Germany
Walter Kellermann, Multimedia Communications and Signal Processing, University of Erlangen-Nuremberg, Cauerstr. 7, 91058, Germany
pp. 233-236
Gordon Wichern, Arts, Media, and Engineering, Arizona State University, Tempe, 85281 USA
Harvey Thornburg, Arts, Media, and Engineering, Arizona State University, Tempe, 85281 USA
Andreas Spanias, Arts, Media, and Engineering, Arizona State University, Tempe, 85281 USA
pp. 237-240
Steven M. Schimmel, Laboratory for Experimental Audiology, University of Zurich, CH-8091, Switzerland
Martin F. Muller, Laboratory for Experimental Audiology, University of Zurich, CH-8091, Switzerland
Norbert Dillier, Laboratory for Experimental Audiology, University of Zurich, CH-8091, Switzerland
pp. 241-244
Masahiro Kida, Kansai University, Faculty of Engineering Science, Yamate-cho, Suita-shi, Osaka, 564-8680, Japan
Ryotaro Hirayama, Kansai University, Faculty of Engineering Science, Yamate-cho, Suita-shi, Osaka, 564-8680, Japan
Yoshinobu Kajikawa, Kansai University, Faculty of Engineering Science, Yamate-cho, Suita-shi, Osaka, 564-8680, Japan
Toru Tani, Shiga University of Medical Science, Tsukinowa-cho, Seta, Otsu-shi, 520-2192, Japan
Yoshimasa Kurumi, Shiga University of Medical Science, Tsukinowa-cho, Seta, Otsu-shi, 520-2192, Japan
pp. 245-248
Maciej Niedzwiecki, Faculty of Electronics, Telecommunications and Computer Science, Department of Automatic Control, Gda¿sk University of Technology, ul. Narutowicza 11/12, Poland
Michal Meller, Faculty of Electronics, Telecommunications and Computer Science, Department of Automatic Control, Gda¿sk University of Technology, ul. Narutowicza 11/12, Poland
pp. 249-252
F. Yang, Vibration and Acoustics Center, Northern Illinois University, DeKalb, 60115, USA
A. Gupta, Vibration and Acoustics Center, Northern Illinois University, DeKalb, 60115, USA
S. M. Kuo, Vibration and Acoustics Center, Northern Illinois University, DeKalb, 60115, USA
pp. 253-256
Felix Albu, Faculty of Electronics and Telecommunications, ¿Politehnica¿ University of Bucharest, 1-3 Iuliu Maniu, Romania
Yuriy Zakharov, Electronics Department, University of York, Heslington, YO10 5DD, U.K.
Constantin Paleologu, Faculty of Electronics and Telecommunications, ¿Politehnica¿ University of Bucharest, 1-3 Iuliu Maniu, Romania
pp. 257-260
Muhammad Tahir Akhtar, The Education and Research Center for Frontier Science and Engineering, University for Electro-Communications, 1-5-1 Chofugaoka, Chofu, Tokyo 182-8585, JAPAN
Wataru Mitsuhashi, Department of Information and Communication Engineering, University for Electro-Communications, 1-5-1 Chofugaoka, Chofu, Tokyo 182-8585, JAPAN
pp. 261-264
Giovanni Del Galdo, Fraunhofer IIS, Audio Department, Am Wolfsmantel 33, 91058 Erlangen, Germany
Fabian Kuech, Fraunhofer IIS, Audio Department, Am Wolfsmantel 33, 91058 Erlangen, Germany
Markus Kallinger, Fraunhofer IIS, Audio Department, Am Wolfsmantel 33, 91058 Erlangen, Germany
Richard Schultz-Amling, Fraunhofer IIS, Audio Department, Am Wolfsmantel 33, 91058 Erlangen, Germany
pp. 265-268
Erik Hellerud, Centre for Quantifiable Quality of Service in Communication Systems, Norwegian University of Science and Technology, Trondheim, Norway
Audun Solvang, Centre for Quantifiable Quality of Service in Communication Systems, Norwegian University of Science and Technology, Trondheim, Norway
U. Peter Svensson, Centre for Quantifiable Quality of Service in Communication Systems, Norwegian University of Science and Technology, Trondheim, Norway
pp. 269-272
Jens Ahrens, Deutsche Telekom Laboratories, Technische Universität Berlin, Ernst-Reuter-Platz 7, 10587, Germany
Sascha Spors, Deutsche Telekom Laboratories, Technische Universität Berlin, Ernst-Reuter-Platz 7, 10587, Germany
pp. 273-276
Yoko Yamakata, National Institute of Information and Communications Technology, Universal Media Research Center, 4-2-1 Nukui-Kitamachi, Koganei, Tokyo 184-8795, Japan
Michiaki Katsumoto, National Institute of Information and Communications Technology, Universal Media Research Center, 4-2-1 Nukui-Kitamachi, Koganei, Tokyo 184-8795, Japan
Toshiyuki Kimura, National Institute of Information and Communications Technology, Universal Media Research Center, 4-2-1 Nukui-Kitamachi, Koganei, Tokyo 184-8795, Japan
pp. 277-280
Qinghua Huang, School of Communication and Information Engineering, Shanghai University, China
Kai Liu, School of Communication and Information Engineering, Shanghai University, China
pp. 281-284
Wen Zhang, Applied Signal Processing Group, Department of Information Engineering, RSISE, The Australian National University, Australia
Thushara D. Abhayapala, Applied Signal Processing Group, Department of Information Engineering, RSISE, The Australian National University, Australia
Rodney A. Kennedy, Applied Signal Processing Group, Department of Information Engineering, RSISE, The Australian National University, Australia
Ramani Duraiswami, Perceptual Interfaces and Reality Laboratory, UMIACS University of Maryland, College Park, USA
pp. 285-288
Mark Sterling, University of Rochester, Electrical and Computer Engineering, NY, 14627 USA
Xiaoxiao Dong, University of Rochester, Electrical and Computer Engineering, NY, 14627 USA
Mark Bocko, University of Rochester, Electrical and Computer Engineering, NY, 14627 USA
pp. 289-292
Joseph Timoney, Sound and Digital Music Technology Research Group, NUI Maynooth, Co.Kildare, Ireland
Victor Lazzarini, Sound and Digital Music Technology Research Group, NUI Maynooth, Co.Kildare, Ireland
Jussi Pekonen, Dept. of Signal Processing and Acoustics, TKK Helsinki University of Technology, Espoo, Finland
Vesa Valimaki, Dept. of Signal Processing and Acoustics, TKK Helsinki University of Technology, Espoo, Finland
pp. 293-296
Wasim Ahmad, I-Lab/CCSR, University of Surrey, Guildford, GU2 7XH, United Kingdom
Huseyin Hacihabiboglu, CDSPR, King's College London, Strand, WC2R 2LS, United Kingdom
Ahmet M. Kondoz, I-Lab/CCSR, University of Surrey, Guildford, GU2 7XH, United Kingdom
pp. 297-300
Harish Krishnamoorthi, Department of Electrical Engineering, SenSIP Center, Arizona State University, Tempe, 85287-5706, USA
Visar Berisha, Department of Electrical Engineering, SenSIP Center, Arizona State University, Tempe, 85287-5706, USA
Andreas Spanias, Department of Electrical Engineering, SenSIP Center, Arizona State University, Tempe, 85287-5706, USA
Homin Kwon, Department of Electrical Engineering, SenSIP Center, Arizona State University, Tempe, 85287-5706, USA
pp. 301-304
Mahdi Triki, Philips Research Laboratories, Eindhoven, The Netherlands
Dirk T.M. Slock, Eurecom, Sophia Antipolis, France
pp. 305-308
Johan Xi Zhang, Dept. of Electronic Systems (ES-MISP), Aalborg University, Denmark
Mads Graesboll Christensen, Dept. of Electronic Systems (ES-MISP), Aalborg University, Denmark
Joachim Dahl, Dept. of Electronic Systems (ES-MISP), Aalborg University, Denmark
Soren Holdt Jensen, Dept. of Electronic Systems (ES-MISP), Aalborg University, Denmark
Marc Moonen, Dept. of Electrical Engineering (ESAT-SCD), Katholieke Universiteit Leuven, Belgium
pp. 309-312
Gautham J. Mysore, Center for Computer Research in Music and Acoustics, Stanford University, USA
Paris Smaragdis, Advanced Technology Labs, Adobe Systems Inc., USA
pp. 313-316
Rainer Martin, Institute of Communication Acoustics, Ruhr-Universität Bochum, Germany
Anil Nagathil, Institute of Communication Acoustics, Ruhr-Universität Bochum, Germany
pp. 321-324
Volker Gnann, Institut für Nachrichtentechnik, RWTH Aachen University, D-52056, Germany
Martin Spiertz, Institut für Nachrichtentechnik, RWTH Aachen University, D-52056, Germany
pp. 325-328
Mikel Gainza, Audio Research Group, Dublin Institute of Technology, Ireland
pp. 329-332
Zhe Chen, Neuroscience Statistics Research Laboratory, Massachusetts General Hospital, Harvard Medical School, Boston, 02114, USA
Patrick L. Purdon, Neuroscience Statistics Research Laboratory, Massachusetts General Hospital, Harvard Medical School, Boston, 02114, USA
Eric T. Pierce, Neuroscience Statistics Research Laboratory, Massachusetts General Hospital, Harvard Medical School, Boston, 02114, USA
Grace Harrell, Neuroscience Statistics Research Laboratory, Massachusetts General Hospital, Harvard Medical School, Boston, 02114, USA
Emery N. Brown, Neuroscience Statistics Research Laboratory, Massachusetts General Hospital, Harvard Medical School, Boston, 02114, USA
Riccardo Barbieri, Neuroscience Statistics Research Laboratory, Massachusetts General Hospital, Harvard Medical School, Boston, 02114, USA
pp. 333-336
Hamid R. Mohseni, Schools of Engineering and Psychology, Cardiff University, Wales, UK
Foad Ghaderi, Schools of Engineering and Psychology, Cardiff University, Wales, UK
Edward E. Wilding, Schools of Engineering and Psychology, Cardiff University, Wales, UK
Saeid Sanei, Schools of Engineering and Psychology, Cardiff University, Wales, UK
pp. 337-340
Julien Oster, IADI, Nancy University, Inserm ERI 13, CHU Nancy Brabois, France
Olivier Pietquin, IADI, Nancy University, Inserm ERI 13, CHU Nancy Brabois, France
Roger Abacherli, Schiller AG, Baar, Switzerland
Michel Kraemer, Schiller Médical SAS, Wissembourg, France
Jacques Felblinger, IADI, Nancy University, Inserm ERI 13, CHU Nancy Brabois, France
pp. 341-344
Xinyi Yong, Department of Electrical and Computer Engineering, University of British Columbia, 2332 Main Mall, Vancouver, Canada V6T 1Z4
Rabab K. Ward, Department of Electrical and Computer Engineering, University of British Columbia, 2332 Main Mall, Vancouver, Canada V6T 1Z4
Gary E. Birch, Department of Electrical and Computer Engineering, University of British Columbia, 2332 Main Mall, Vancouver, Canada V6T 1Z4
pp. 345-348
Martin Weis, Ilmenau University of Technology, Communications Research Laboratory, D-98684, Germany
Florian Romer, Ilmenau University of Technology, Communications Research Laboratory, D-98684, Germany
Martin Haardt, Ilmenau University of Technology, Communications Research Laboratory, D-98684, Germany
Dunja Jannek, Ilmenau University of Technology, Biosignal Processing Group, D-98684, Germany
Peter Husar, Ilmenau University of Technology, Biosignal Processing Group, D-98684, Germany
pp. 349-352
Yuki Saito, Department of Electrical and Electronic Engineering, Tokyo University of Agriculture and Technology (TUAT), 2-24-16, Nakacho, Koganei-shi, 184-8588, Japan
Toshihisa Tanaka, Department of Electrical and Electronic Engineering, Tokyo University of Agriculture and Technology (TUAT), 2-24-16, Nakacho, Koganei-shi, 184-8588, Japan
Hiroshi Higashi, Department of Electrical and Electronic Engineering, Tokyo University of Agriculture and Technology (TUAT), 2-24-16, Nakacho, Koganei-shi, 184-8588, Japan
pp. 353-356
Futoshi Asano, Honda Research Institute Japan (HRI-JP), Japan
Masahiro Kimura, Honda Research Institute Japan (HRI-JP), Japan
Tatsuhiko Sekiguchi, Honda Research Institute Japan (HRI-JP), Japan
Yukiyasu Kamitani, Advanced Telecommunications Research Institute International (ATR-CNS), Japan
pp. 357-360
Y.K. Alp, Bilkent University, Electrical and Electronics Engineering, Ankara, Turkey
O. Arikan, Bilkent University, Electrical and Electronics Engineering, Ankara, Turkey
S. Karakas, Hacettepe University, Conjuitive Psychophysiology Research Unit, Ankara, Turkey
pp. 365-368
Talha Jamal Ahmad, National University of Sciences&Technology, Pakistan
Hussnain Ali, National University of Sciences&Technology, Pakistan
Muhammad Asim Ajaz, National University of Sciences&Technology, Pakistan
Shoab A. Khan, National University of Sciences&Technology, Pakistan
pp. 369-372
Tomasz M. Rutkowski, Brain Science Institute RIKEN, Saitama, Japan
Andrzej Cichocki, Brain Science Institute RIKEN, Saitama, Japan
Toshihisa Tanaka, Tokyo University of Agriculture and Technology, Japan
Danilo P. Mandic, Imperial College London, UK
Jianting Cao, Saitama Institute of Technology, Japan
Anca L. Ralescu, University of Cincinnati, OH, USA
pp. 373-376
Foad Ghaderi, Centre of Digital Signal Processing, School of Engineering, Cardiff University, UK
Hamid R. Mohseni, Centre of Digital Signal Processing, School of Engineering, Cardiff University, UK
John G. McWhirter, Centre of Digital Signal Processing, School of Engineering, Cardiff University, UK
Saeid Sanei, Centre of Digital Signal Processing, School of Engineering, Cardiff University, UK
pp. 377-380
Jack Tzeng, University of California, San Diego, Electrical and Computer Engineering, La Jolla, 92092, USA
Truong Nguyen, University of California, San Diego, Electrical and Computer Engineering, La Jolla, 92092, USA
pp. 381-384
Nicolle M. Correa, University of Maryland, Baltimore County, Department of CSEE, 21250, USA
Yi-Ou Li, University of Maryland, Baltimore County, Department of CSEE, 21250, USA
Tulay Adali, University of Maryland, Baltimore County, Department of CSEE, 21250, USA
Vince D. Calhoun, The MIND Research Network and University of New Mexico, Department of ECE, Albuquerque, 87131, USA
pp. 385-388
Yoon-Chul Kim, Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, USA
Shrikanth S. Narayanan, Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, USA
Krishna S. Nayak, Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, USA
pp. 389-392
Chenlu Qiu, Dept. of Electrical and Computer Engineering, Iowa State University, Ames, USA
Wei Lu, Dept. of Electrical and Computer Engineering, Iowa State University, Ames, USA
Namrata Vaswani, Dept. of Electrical and Computer Engineering, Iowa State University, Ames, USA
pp. 393-396
Ronald W. K. So, Lo Kwee-Seong Medical Image Analysis Laboratory, Department of Computer Science and Engineering, The Hong Kong University of Science and Technology, Hong Kong
Albert C. S. Chung, Lo Kwee-Seong Medical Image Analysis Laboratory, Department of Computer Science and Engineering, The Hong Kong University of Science and Technology, Hong Kong
pp. 397-400
Ying Piao, Chungnam National University, Korea
Ik-Soo Lim, Bangor University, United Kingdom
Hyewon Seo, Chungnam National University, Korea
pp. 401-404
Ramin Eslami, Department of Biomedical Engineering, University of Rochester, NY 14627, USA
Mathews Jacob, Department of Biomedical Engineering, University of Rochester, NY 14627, USA
pp. 405-408
Armando J. Pinho, Signal Processing Lab, DETI / IEETA, University of Aveiro, 3810-193, Portugal
Antonio J. R. Neves, Signal Processing Lab, DETI / IEETA, University of Aveiro, 3810-193, Portugal
pp. 409-412
Yuanqing Li, School of Automation, Southchina University of Technology, Guangzhou, 510640, China
Zhuliang Yu, School of Automation, Southchina University of Technology, Guangzhou, 510640, China
Praneeth Namburi, School of Electrical and Electronic Eng., Nanyang Technological University, Singapore 639689
Cuntai Guan, Institute for Infocomm Research, Singapore 119613
pp. 413-416
Ping-Feng Chen, North Carolina State University, Department of Electrical and Computer Engineering, USA
R. Grant Steen, Medical Communications Consultants, LLC, USA
Anthony Yezzi, Georgia Institute of Technology, School of Electrical and Computer Engineering, USA
Hamid Krim, North Carolina State University, Department of Electrical and Computer Engineering, USA
pp. 417-420
Alp Kucukelbir, The Edward S. Rogers Sr. Dept. of Electrical&Computer Engineering, University of Toronto, Canada
Azadeh Kushki, The Edward S. Rogers Sr. Dept. of Electrical&Computer Engineering, University of Toronto, Canada
Konstantinos N. Plataniotis, The Edward S. Rogers Sr. Dept. of Electrical&Computer Engineering, University of Toronto, Canada
pp. 421-424
Ronny K. Ibrahim, School of Electrical Engineering, University of New South Wales, Sydney, 2052, Australia
Eliathamby Ambikairajah, School of Electrical Engineering, University of New South Wales, Sydney, 2052, Australia
Branko G. Celler, School of Electrical Engineering, University of New South Wales, Sydney, 2052, Australia
Nigel H. Lovell, Graduate School of Biomedical Engineering, University of New South Wales, Sydney, 2052, Australia
pp. 425-428
P. Ye, Department of Electrical and Computer Engineering, University of Delaware, Newark, 19716, USA
J. L. Paredes, Department of Electrical and Computer Engineering, University of Delaware, Newark, 19716, USA
G. R. Arce, Department of Electrical and Computer Engineering, University of Delaware, Newark, 19716, USA
Y. Wu, Department of Electrical and Computer Engineering, University of Delaware, Newark, 19716, USA
C. Chen, Department of Electrical and Computer Engineering, University of Delaware, Newark, 19716, USA
D. W. Prather, Department of Electrical and Computer Engineering, University of Delaware, Newark, 19716, USA
pp. 429-432
Philippe Ciuciu, NeuroSpin/CEA, F-91191 Gif-sur-Yvette, France
Stephane Sockeel, NeuroSpin/CEA, F-91191 Gif-sur-Yvette, France
Thomas Vincent, NeuroSpin/CEA, F-91191 Gif-sur-Yvette, France
Jerome Idier, IRCCyN/CNRS, 1 rue de la Noë 44300 Nantes, France
pp. 433-436
Paul Liu, Saset (Chengdu) Inc., China
Dong Liu, College of Computer Science, Sichuan University, Chengdu, China
pp. 437-440
Archana Venkataraman, MIT Computer Science and Artificial Intelligence Laboratory (CSAIL), Cambridge, MA, USA
Koene R.A. Van Dijk, Department of Psychology, Harvard University, Cambridge, MA, USA
Randy L. Buckner, Department of Psychology, Harvard University, Cambridge, MA, USA
Polina Golland, MIT Computer Science and Artificial Intelligence Laboratory (CSAIL), Cambridge, MA, USA
pp. 441-444
Anne-Laure Fouque, NeuroSpin/CEA, F-91191 Gif-sur-Yvette, France
Philippe Ciuciu, NeuroSpin/CEA, F-91191 Gif-sur-Yvette, France
Laurent Risser, NeuroSpin/CEA, F-91191 Gif-sur-Yvette, France
pp. 445-448
Izumi Ito, Graduate School of System Design, Tokyo Metropolitan University, 6-6 Asahigaoka, Hino-shi, Japan
Hitoshi Kiya, Graduate School of System Design, Tokyo Metropolitan University, 6-6 Asahigaoka, Hino-shi, Japan
pp. 449-452
Yu Guo, CReSTIC-Université de Reims, IUT de Troyes, France
Su Ruan, CReSTIC-Université de Reims, IUT de Troyes, France
Gilles Millon, CReSTIC-Université de Reims, IUT de Troyes, France
Jean-Marc Constans, CHU de Caen, France
pp. 453-456
Joyce Chiang, University of British Columbia, Dept. of Electrical and Computer Engineering, Vancouver, Canada
Z. Jane Wang, University of British Columbia, Dept. of Electrical and Computer Engineering, Vancouver, Canada
Martin J. McKeown, University of British Columbia, Pacific Parkinson's Research Centre, Vancouver, Canada
pp. 457-460
Md. Abdullah Arafat, Bangladesh University of Engineering and Technology, Bangladesh
Md. Kamrul Hasan, Bangladesh University of Engineering and Technology, Bangladesh
pp. 461-464
B. Mailhe, Projet METISS, INRIA, IRISA, Campus de Beaulieu, F-35042 Rennes Cedex, France
R. Gribonval, Projet METISS, INRIA, IRISA, Campus de Beaulieu, F-35042 Rennes Cedex, France
F. Bimbot, Projet METISS, INRIA, IRISA, Campus de Beaulieu, F-35042 Rennes Cedex, France
M. Lemay, Signal Processing Laboratories, School of Engineering, EPFL Station 11, CH - 1015 Lausanne, Switzerland
P. Vandergheynst, Signal Processing Laboratories, School of Engineering, EPFL Station 11, CH - 1015 Lausanne, Switzerland
J.-M. Vesin, Signal Processing Laboratories, School of Engineering, EPFL Station 11, CH - 1015 Lausanne, Switzerland
pp. 465-468
Maryam Amirmazlaghani, Amirkabir University of Technology, Tehran, Iran
Hamidreza Amindavar, Amirkabir University of Technology, Tehran, Iran
pp. 469-472
Glen Colby, BAE Systems - Advanced Information Technologies, Burlington, MA, USA, USA
James T. Heaton, Center for Laryngeal Surgery&Voice Rehabilitation, Mass. General Hospital, Boston, MA, USA
L. Donald Gilmore, Altec, Inc., Boston, MA, USA
Jason Sroka, BAE Systems - Advanced Information Technologies, Burlington, MA, USA, USA
Yunbin Deng, BAE Systems - Advanced Information Technologies, Burlington, MA, USA, USA
Joao Cabrera, BAE Systems - Advanced Information Technologies, Burlington, MA, USA, USA
Serge Roy, Altec, Inc., Boston, MA, USA
Carlo J. De Luca, Altec, Inc., Boston, MA, USA
Geoffrey S. Meltzner, BAE Systems - Advanced Information Technologies, Burlington, MA, USA, USA
pp. 473-476
Phil Sung, Massachusetts Institute of Technology, USA
Zeeshan Syed, Massachusetts Institute of Technology, USA
John Guttag, Massachusetts Institute of Technology, USA
pp. 477-480
Yonghong Huang, Oregon Health&Science University, Department of Science&Engineering, USA
Deniz Erdogmus, Oregon Health&Science University, Department of Science&Engineering, USA
Misha Pavel, Oregon Health&Science University, Department of Science&Engineering, USA
Kenneth E. Hild, Oregon Health&Science University, Department of Science&Engineering, USA
Santosh Mathan, Honeywell Laboratories, Human Centered Systems Group, Redmond, WA 98052, USA
pp. 481-484
A. Kachenoura, INSERM, U642, Rennes, F-35000, France
F. Poree, INSERM, U642, Rennes, F-35000, France
G. Carrault, INSERM, U642, Rennes, F-35000, France
A.I. Hernandez, INSERM, U642, Rennes, F-35000, France
pp. 485-488
Yuan-Pin Lin, Department of Electrical Engineering, National Taiwan University, Taiwan
Chi-Hong Wang, Cardinal Tien Hospital, Yung-Ho Branch, Taiwan
Tien-Lin Wu, Department of Electrical Engineering, National Taiwan University, Taiwan
Shyh-Kang Jeng, Department of Electrical Engineering, National Taiwan University, Taiwan
Jyh-Horng Chen, Department of Electrical Engineering, National Taiwan University, Taiwan
pp. 489-492
Georg Kail, Institute of Communications and Radio-Frequency Engineering, Vienna University of Technology, Gusshausstrasse 25/389, A-1040, Austria
Clemens Novak, Institute of Communications and Radio-Frequency Engineering, Vienna University of Technology, Gusshausstrasse 25/389, A-1040, Austria
Bernd Hofer, School of Optometry&Vision Sciences, Cardiff University, Mandy Road, CF24 4LU, Wales, UK
Franz Hlawatsch, Institute of Communications and Radio-Frequency Engineering, Vienna University of Technology, Gusshausstrasse 25/389, A-1040, Austria
pp. 493-496
I.Y.H. Gu, Dept. of Signals and Systems, Chalmers University of Technology, Gothenburg, Sweden
M. Billeter, Dept. of Chemistry, University of Gothenburg, Sweden
M.R. Sharafy, Dept. of Signals and Systems, Chalmers University of Technology, Gothenburg, Sweden
V.A. Sorkhabi, Dept. of Signals and Systems, Chalmers University of Technology, Gothenburg, Sweden
J. Fredriksson, Dept. of Chemistry, University of Gothenburg, Sweden
D.K. Staykova, Dept. of Chemistry, University of Gothenburg, Sweden
pp. 497-500
Abdullah K. Alqallaf, Department of Electrical and Computer Engineering, University of Minnesota, 200 Union Street. SE, Minneapolis, 55455, USA
Ahmed H. Tewfik, Department of Electrical and Computer Engineering, University of Minnesota, 200 Union Street. SE, Minneapolis, 55455, USA
pp. 501-504
Hsun-Hsien Chang, Children's Hospital Informatics Program, Harvard Medical School, Boston, MA, USA
pp. 505-508
Chunqi Chang, Electrical and Electronic Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong
Yeung Sam Hung, Electrical and Electronic Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong
Zhi Ding, Electrical and Computer Engineering, University of California, Davis, CA95616, USA
pp. 509-512
Branko Ristic, DSTO, Australia
Alex Skvortsov, DSTO, Australia
Mark Morelande, The University of Melbourne, Australia
pp. 513-516
Shoichi Matsunaga, Department of Computer and Information Sciences, Nagasaki University, JAPAN
Katsuya Yamauchi, Department of Computer and Information Sciences, Nagasaki University, JAPAN
Masaru Yamashita, Department of Computer and Information Sciences, Nagasaki University, JAPAN
Sueharu Miyahara, Department of Computer and Information Sciences, Nagasaki University, JAPAN
pp. 517-520
Bau-Cheng Shen, Institute of Information Science, Academia Sinica, Taipei, Taiwan
Chu-Song Chen, Institute of Information Science, Academia Sinica, Taipei, Taiwan
Hui-Huang Hsu, Department of Computer Science and Information Engineering, Tamkang University, Taipei, Taiwan
pp. 521-524
Qibin Zhao, Department of Computer Science and Engineering, Shanghai Jiao Tong University, China
Liqing Zhang, Department of Computer Science and Engineering, Shanghai Jiao Tong University, China
Andrzej Cichocki, Lab for Advanced Brain Signal Processing, RIKEN Brain Science Institute, Japan
pp. 525-528
Farhad Faradji, Department of Electrical&Computer Engineering, University of British Columbia, Canada
Rabab K. Ward, Department of Electrical&Computer Engineering, University of British Columbia, Canada
Gary E. Birch, Department of Electrical&Computer Engineering, University of British Columbia, Canada
pp. 529-532
Linwei Wang, Computational Biomedicine Lab, Rochester Institute of Technology, NY, USA
Heye Zhang, Bioengineering Institute, University of Auckland, New Zealand
Ken C.L. Wong, Computational Biomedicine Lab, Rochester Institute of Technology, NY, USA
Pengcheng Shi, Computational Biomedicine Lab, Rochester Institute of Technology, NY, USA
pp. 533-536
Ram Bilas Pachori, International Institute of Information Technology, Hyderabad-500032, India
D. Hewson, ICD/LM2S, University of Technology of Troyes, 10000, France
H. Snoussi, ICD/LM2S, University of Technology of Troyes, 10000, France
J. Duchene, ICD/LM2S, University of Technology of Troyes, 10000, France
pp. 537-540
S. Le Cam, LSIIT UMR CNRS 7005, Université Strasbourg 1 (ULP), France
A. Belghith, LSIIT UMR CNRS 7005, Université Strasbourg 1 (ULP), France
Ch. Collet, LSIIT UMR CNRS 7005, Université Strasbourg 1 (ULP), France
F. Salzenstein, Laboratoire INESS, UMR CNRS 7163, Université Strasbourg 1 (ULP), France
pp. 541-544
Walter Huang, Georgia Institute of Technology, School of Electrical and Computer Engineering, Atlanta, 30332-0250 USA
David V. Anderson, Georgia Institute of Technology, School of Electrical and Computer Engineering, Atlanta, 30332-0250 USA
pp. 545-548
Franz Franchetti, Carnegie Mellon University, Department of Electrical and Computer Engineering, Pittsburgh, PA, United States
Markus Puschel, Carnegie Mellon University, Department of Electrical and Computer Engineering, Pittsburgh, PA, United States
pp. 549-552
Markus Myllyla, Centre for Wireless Communications, FIN-90014 University of Oulu, Finland
Markku Juntti, Centre for Wireless Communications, FIN-90014 University of Oulu, Finland
Joseph R. Cavallaro, Dept. of Electrical&Computer Engineering, Rice University, Houston, TX 77251, USA
pp. 553-556
Young-kyu Choi, LG Electronics, Korea
Kisun You, School of Electrical Engineering, Seoul National University, Korea
Jungwook Choi, School of Electrical Engineering, Seoul National University, Korea
Wonyong Sung, School of Electrical Engineering, Seoul National University, Korea
pp. 557-560
Saeed Sharifi Tehrani, Department of Electrical and Computer Engineering, McGill University, Montreal, Quebec, Canada
Ali Naderi, Department of Electrical and Computer Engineering, McGill University, Montreal, Quebec, Canada
Guy-Armand Kamendje, Department of Electrical and Computer Engineering, McGill University, Montreal, Quebec, Canada
Shie Mannor, Department of Electrical and Computer Engineering, McGill University, Montreal, Quebec, Canada
Warren J. Gross, Department of Electrical and Computer Engineering, McGill University, Montreal, Quebec, Canada
pp. 561-564
Ruirui Gu, Department of Electrical and Computer Engineering, University of Maryland, College Park, 20742, USA
Jorn W. Janneck, Xilinx, Inc. San Jose, CA, USA
Mickael Raulet, IETR Laboratory, UMR CNRS 6164, Image and Remote Sensing Group, 35043 RENNES Cedex, FRANCE
Shuvra S. Bhattacharyya, Department of Electrical and Computer Engineering, University of Maryland, College Park, 20742, USA
pp. 565-568
Srdjan Jovanovski, University of Montenegro, Dept. of Electrical Engineering, 81000 Podgorica, MONTENEGRO
Veselin N. Ivanovic, University of Montenegro, Dept. of Electrical Engineering, 81000 Podgorica, MONTENEGRO
pp. 569-572
Tse-Wei Chen, Media IC and System Lab, Graduate Institute of Electronics Engineering and Department of Electrical Engineering, National Taiwan University, BL-421, No. 1, Sec. 4, Roosevelt Rd., T
Shao-Yi Chien, Media IC and System Lab, Graduate Institute of Electronics Engineering and Department of Electrical Engineering, National Taiwan University, BL-421, No. 1, Sec. 4, Roosevelt Rd., T
pp. 573-576
Brian Gestner, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, 30332 USA
Wei Zhang, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, 30332 USA
Xiaoli Ma, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, 30332 USA
David V. Anderson, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, 30332 USA
pp. 577-580
Haw-Jing Lo, Center for Signal and Image Processing, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, 30332 USA
David V. Anderson, Center for Signal and Image Processing, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, 30332 USA
pp. 581-584
Jeoong Sung Park, Department of Computer Engineering, Santa Clara University, CA 95053, USA
Tokunbo Ogunfunmi, Department of Computer Engineering, Santa Clara University, CA 95053, USA
pp. 585-588
Alireza Aminlou, Multimedia Processing Laboratory, School of Electrical and Computer Engineering, University of Tehran, Iran
Fatemeh Refan, Multimedia Processing Laboratory, School of Electrical and Computer Engineering, University of Tehran, Iran
M.R. Hashemi, Multimedia Processing Laboratory, School of Electrical and Computer Engineering, University of Tehran, Iran
Omid Fatemi, Multimedia Processing Laboratory, School of Electrical and Computer Engineering, University of Tehran, Iran
Saeed Safari, Multimedia Processing Laboratory, School of Electrical and Computer Engineering, University of Tehran, Iran
pp. 589-592
Teemu Pitkanen, Tampere University of Technology, Department of Computer Systems, P.O.Box 553, FIN-33101, Finland
Jarmo Takala, Tampere University of Technology, Department of Computer Systems, P.O.Box 553, FIN-33101, Finland
pp. 593-596
Lien-Fei Chen, Department of Electrical Engineering, National Chung Hsing University, No. 250, Kuo Kuang Road, Taichung, Taiwan
Shin-Ping Yang, Department of Electrical Engineering, National Chung Hsing University, No. 250, Kuo Kuang Road, Taichung, Taiwan
Yeong-Kang Lai, Department of Electrical Engineering, National Chung Hsing University, No. 250, Kuo Kuang Road, Taichung, Taiwan
pp. 597-600
Jung Gap Kuk, Seoul National University, School of Electrical Engineering, 151-744, Korea
Se Yoon Kim, Seoul National University, School of Electrical Engineering, 151-744, Korea
Nam Ik Cho, Seoul National University, School of Electrical Engineering, 151-744, Korea
pp. 605-608
Carl-Inge Colombo Nilsen, Department of Informatics, University of Oslo, Norway
pp. 609-612
Fang-Li Yuan, Graduate Institute of Electronics Engineering and Department of Electrical Engineering, National Taiwan University, Taipei, Taiwan
Chin-Hsien Lin, Graduate Institute of Electronics Engineering and Department of Electrical Engineering, National Taiwan University, Taipei, Taiwan
Yi-Hsien Lin, Graduate Institute of Electronics Engineering and Department of Electrical Engineering, National Taiwan University, Taipei, Taiwan
Chih-Feng Wu, Graduate Institute of Electronics Engineering and Department of Electrical Engineering, National Taiwan University, Taipei, Taiwan
Chorng-Kuang Wang, Graduate Institute of Electronics Engineering and Department of Electrical Engineering, National Taiwan University, Taipei, Taiwan
pp. 617-620
Kisun You, School of Electrical Engineering, Seoul National University, San 56-1, Shillim-dong, Kwanak-gu, 151-744 Korea
Youngjoon Lee, School of Electrical Engineering, Seoul National University, San 56-1, Shillim-dong, Kwanak-gu, 151-744 Korea
Wonyong Sung, School of Electrical Engineering, Seoul National University, San 56-1, Shillim-dong, Kwanak-gu, 151-744 Korea
pp. 621-624
Peng L, Dept. of Electrical and Computer Engineering, University of Minnesota, Duluth, 55812, USA
Hua Tang, Dept. of Electrical and Computer Engineering, University of Minnesota, Duluth, 55812, USA
Weiqian Liang, Dept. of Electronic Engineering, Tsinghua University, Beijing, 10084, China
pp. 625-628
Florin Balasa, Dept. of Computer Science, Southern Utah University, Cedar City, USA
Ilie I. Luican, Dept. of Computer Science, University of Illinois at Chicago, Chicago, USA
Hongwei Zhu, ARM, Inc., Sunnyvale, CA, USA
Doru V. Nasui, American Int. Radio, Inc., Rolling Meadows, IL, USA
pp. 629-632
Shogo Muramatsu, Department of Electrical and Electronic Eng., Niigata University, 8050 Ikarashi 2-no-cho, Nishi-ku, 950-2181, Japan
Hidenori Watanabe, Department of Electrical and Electronic Eng., Niigata University, 8050 Ikarashi 2-no-cho, Nishi-ku, 950-2181, Japan
pp. 633-636
Xiang Li, Multimedia Communications and Signal Processing, University of Erlangen-Nuremberg, Germany
Peter Amon, Siemens Corporate Technology, Information&Communications, Munich, Germany
Andreas Hutter, Siemens Corporate Technology, Information&Communications, Munich, Germany
Andre Kaup, Multimedia Communications and Signal Processing, University of Erlangen-Nuremberg, Germany
pp. 637-640
Yongjin Cho, Ming Hsieh Department of EE, University of Southern California, Los Angeles, 90089, USA
Jiaying Liu, Institute of Computer Science and Technology, Peking University, Beijing, China 100871
Do-Kyoung Kwon, Texas Instruments, 12500 TI Blvd., 72543, USA
C.-C. Jay Kuo, Ming Hsieh Department of EE, University of Southern California, Los Angeles, 90089, USA
pp. 641-644
Meng-Ping Kao, University of California, San Diego, Department of ECE, USA
Truong Nguyen, University of California, San Diego, Department of ECE, USA
pp. 645-648
Jui-Chiu Chiang, Department of Electrical Engineering, National Chung Cheng University, Chia-Yi, 621, Taiwan, ROC
Wen-Ting Kuo, Department of Electrical Engineering, National Chung Cheng University, Chia-Yi, 621, Taiwan, ROC
pp. 649-652
Baochun Bai, Department of Computing Science, University of Alberta, Edmonton, Canada
Yang Yang, Department of Electrical and Computer Engineering, Texas A&M University, College Station, USA
Cheng Lei, Department of Computing Science, University of Alberta, Edmonton, Canada
Pierre Boulanger, Department of Computing Science, University of Alberta, Edmonton, Canada
Janelle Harms, Department of Computing Science, University of Alberta, Edmonton, Canada
pp. 653-656
Dinei Florencio, Microsoft Research, One Microsoft Way, Redmond, WA 98052, USA
Cha Zhang, Microsoft Research, One Microsoft Way, Redmond, WA 98052, USA
pp. 657-660
Liang Zhang, College of Computer, Sichuan University, Chengdu, 610065, China
Jian-Zhou Zhang, College of Computer, Sichuan University, Chengdu, 610065, China
pp. 661-664
T. Popkin, Multimedia and Vision Group, Queen Mary, University of London, E1 4NS, UK
A. Cavallaro, Multimedia and Vision Group, Queen Mary, University of London, E1 4NS, UK
D. Hands, British Telecommunications PLC, Martlesham Heath, IP5 3RE, UK
pp. 665-668
T. Popkin, Multimedia and Vision Group, Queen Mary, University of London, E1 4NS, UK
A. Cavallaro, Multimedia and Vision Group, Queen Mary, University of London, E1 4NS, UK
D. Hands, British Telecommunications PLC, Martlesham Heath, IP5 3RE, UK
pp. 669-672
Yingsong Zhang, Signal Processing&Communication Group, Dept. of Engineering, University of Cambridge, CB2 1PZ, UK
Nick Kingsbury, Signal Processing&Communication Group, Dept. of Engineering, University of Cambridge, CB2 1PZ, UK
pp. 681-684
Patrick L. Combettes, UPMC Université Paris 06, Laboratoire Jacques-Louis Lions - UMR 7598, 75005, France
Jean-Christophe Pesquet, Université Paris-Est, Institut Gaspard Monge - UMR 8049, 77454 Marne la Vallée Cedex 2, France
pp. 685-688
Brendt Wohlberg, T-7 Mathematical Modeling and Analysis, Los Alamos National Laboratory, NM 87545, USA
pp. 689-692
Amir Beck, Faculty of Industrial Engineering and Management, Technion - Israel Institute of Technology, Haifa 32000, Israel
Marc Teboulle, School of Mathematical Sciences, Tel-Aviv University, Ramat-Aviv 69978, Israel
pp. 693-696
Bin Shen, Tsinghua National Laboratory for Information Science and Technology, Department of Electronic Engineering, Tsinghua University, Beijing 100084, China
Wei Hu, Intel China Research Center, Beijing, China
Yimin Zhang, Intel China Research Center, Beijing, China
Yu-Jin Zhang, Tsinghua National Laboratory for Information Science and Technology, Department of Electronic Engineering, Tsinghua University, Beijing 100084, China
pp. 697-700
Nelly Pustelnik, Université Paris-Est, Institut Gaspard Monge, UMR CNRS 8049, 77454 Marne-la-Vallée Cedex, France
Caroline Chaux, Université Paris-Est, Institut Gaspard Monge, UMR CNRS 8049, 77454 Marne-la-Vallée Cedex, France
Jean-Christophe Pesquet, Université Paris-Est, Institut Gaspard Monge, UMR CNRS 8049, 77454 Marne-la-Vallée Cedex, France
pp. 701-704
Adam Scholefield, Communications and Signal Processing Group, Electrical and Electronic Engineering, Imperial College London, Exhibition Road, SW7 2AZ, England
Pier Luigi Dragotti, Communications and Signal Processing Group, Electrical and Electronic Engineering, Imperial College London, Exhibition Road, SW7 2AZ, England
pp. 705-708
Nikos Deligiannis, Department of Electronics and Informatics (ETRO) - Interdisciplinary Institute for Broadband Technology (IBBT), Vrije Universiteit Brussel (VUB), Pleinlaan 2, 1050, Belgium
Adrian Munteanu, Department of Electronics and Informatics (ETRO) - Interdisciplinary Institute for Broadband Technology (IBBT), Vrije Universiteit Brussel (VUB), Pleinlaan 2, 1050, Belgium
Tom Clerckx, Department of Electronics and Informatics (ETRO) - Interdisciplinary Institute for Broadband Technology (IBBT), Vrije Universiteit Brussel (VUB), Pleinlaan 2, 1050, Belgium
Jan Cornelis, Department of Electronics and Informatics (ETRO) - Interdisciplinary Institute for Broadband Technology (IBBT), Vrije Universiteit Brussel (VUB), Pleinlaan 2, 1050, Belgium
Peter Schelkens, Department of Electronics and Informatics (ETRO) - Interdisciplinary Institute for Broadband Technology (IBBT), Vrije Universiteit Brussel (VUB), Pleinlaan 2, 1050, Belgium
pp. 709-712
Ankur Saxena, Department of Electrical&Computer Engineering, University of California, Santa Barbara, CA-93106, USA
Kenneth Rose, Department of Electrical&Computer Engineering, University of California, Santa Barbara, CA-93106, USA
pp. 713-716
Nantheera Anantrasirichai, Department of Electrical&Electronic Engineering, University of Bristol, BS8 IUB, UK
Dimitris Agrafiotis, Department of Electrical&Electronic Engineering, University of Bristol, BS8 IUB, UK
Dave Bull, Department of Electrical&Electronic Engineering, University of Bristol, BS8 IUB, UK
pp. 717-720
Wei Liu, Computer Science Department, University of Missouri, Columbia, 65211, USA
Lina Dong, Computer Science Department, University of Missouri, Columbia, 65211, USA
Wenjun Zeng, Computer Science Department, University of Missouri, Columbia, 65211, USA
pp. 721-724
Qiuming Yao, Computer Science Department, University of Missouri, Columbia, 65211, USA
Wenjun Zeng, Computer Science Department, University of Missouri, Columbia, 65211, USA
Wei Liu, Computer Science Department, University of Missouri, Columbia, 65211, USA
pp. 725-728
Manoranjan Paul, Gippsland School of Information Technology, Monash University, Churchill, Vic-3842, Australia
Manzur Murshed, Gippsland School of Information Technology, Monash University, Churchill, Vic-3842, Australia
pp. 729-732
Jiangbo Lu, Department of Electrical Engineering, Katholieke Universiteit Leuven, Belgium
Ke Zhang, Department of Electrical Engineering, Katholieke Universiteit Leuven, Belgium
Gauthier Lafruit, Multimedia Group, IMEC, Kapeldreef 75, B-3001, Leuven, Belgium
Francky Catthoor, Department of Electrical Engineering, Katholieke Universiteit Leuven, Belgium
pp. 733-736
Vikas Ramachandra, CALIT2, University of California, San Diego, 92093, USA
Matthias Zwicker, CALIT2, University of California, San Diego, 92093, USA
Truong Q. Nguyen, CALIT2, University of California, San Diego, 92093, USA
pp. 737-740
Wided Miled, TELECOM ParisTech, Signal and Image Processing Department, 46 rue Barrault, 75634 Cédex 13, France
Beatrice Pesquet-Popescu, TELECOM ParisTech, Signal and Image Processing Department, 46 rue Barrault, 75634 Cédex 13, France
Wael Cherif, TELECOM ParisTech, Signal and Image Processing Department, 46 rue Barrault, 75634 Cédex 13, France
pp. 741-744
Chao-Chung Cheng, Graduate Institute of Electronics Engineering, National Taiwan University, Taiwan
Chia-Kai Liang, Graduate Institute of Communication Engineering, National Taiwan University, Taiwan
Yen-Chieh Lai, Department of Electrical Engineering, National Taiwan University, Taiwan
Homer H. Chen, Graduate Institute of Communication Engineering, National Taiwan University, Taiwan
Liang-Gee Chen, Graduate Institute of Electronics Engineering, National Taiwan University, Taiwan
pp. 745-748
R. Ferreira, Instituto de Sistemas e Robótica, Instituto Superior Técnico, Av. Rovisco Pais, 1049-001 Lisboa, Portugal
J. Xavier, Instituto de Sistemas e Robótica, Instituto Superior Técnico, Av. Rovisco Pais, 1049-001 Lisboa, Portugal
J. Costeira, Instituto de Sistemas e Robótica, Instituto Superior Técnico, Av. Rovisco Pais, 1049-001 Lisboa, Portugal
pp. 749-752
Mannan Saeed Muhammad, Signal and Image Processing Lab, School of Information and Mechatronics, Gwangju Institute of Science and Technology, 261 Cheomdan-gwagiro, Buk Gu, 500712, Korea
Muhammad Tariq Mahamood, Signal and Image Processing Lab, School of Information and Mechatronics, Gwangju Institute of Science and Technology, 261 Cheomdan-gwagiro, Buk Gu, 500712, Korea
Tae-Sun Choi, Signal and Image Processing Lab, School of Information and Mechatronics, Gwangju Institute of Science and Technology, 261 Cheomdan-gwagiro, Buk Gu, 500712, Korea
pp. 753-756
Oswald Lanz, FBK-irst, Via Sommarive 18, 38100 Povo (TN), Italy
pp. 757-760
Rahul Thota, Siemens Corporate Technology India, Siemens Information Systems Limited, No.84 Keonics Electronics City, Bangalore, India
Archana Kalyansundar, Siemens Corporate Technology India, Siemens Information Systems Limited, No.84 Keonics Electronics City, Bangalore, India
Amit Kale, Siemens Corporate Technology India, Siemens Information Systems Limited, No.84 Keonics Electronics City, Bangalore, India
pp. 761-764
Yi Wu, Institute of Automation, Chinese Academy of Sciences, Beijing, China
Jinqiao Wang, Institute of Automation, Chinese Academy of Sciences, Beijing, China
Hanqing Lu, Institute of Automation, Chinese Academy of Sciences, Beijing, China
pp. 765-768
Jia-Bin Huang, Academia Sinica, Institute of Information Science, Taipei, Taiwan, R.O.C.
Chu-Song Chen, Academia Sinica, Institute of Information Science, Taipei, Taiwan, R.O.C.
pp. 769-772
Muhammad Shoaib, Institut für Informationsverarbeitung, Leibniz Universität Hannover, Germany
Ralf Dragon, Institut für Informationsverarbeitung, Leibniz Universität Hannover, Germany
Jorn Ostermann, Institut für Informationsverarbeitung, Leibniz Universität Hannover, Germany
pp. 773-776
Patrick Ndjiki-Nya, Image Communication Group, Image Processing Department, Fraunhofer Institute for Telecommunications - Heinrich-Hertz-Institut, Berlin, Germany
Sebastian Gerke, Image Communication Group, Image Processing Department, Fraunhofer Institute for Telecommunications - Heinrich-Hertz-Institut, Berlin, Germany
Thomas Wiegand, Image Communication Group, Image Processing Department, Fraunhofer Institute for Telecommunications - Heinrich-Hertz-Institut, Berlin, Germany
pp. 777-780
Ting-Lan Lin, Dept. of ECE, UCSD, USA
Yuan Zhi, Dept. of ECE, UCSD, USA
Sandeep Kanumuri, DoCoMo Communications Laboratories USA, Inc., USA
Pamela C. Cosman, Dept. of ECE, UCSD, USA
Amy R. Reibman, AT&T Labs Research, USA
pp. 781-784
Chuohao Yeo, University of California, Berkeley, Dept. of EECS, 94720, USA
Wai-Tian Tan, Hewlett-Packard Laboratories, Palo Alto, MCNL, CA 94304, USA
Debargha Mukherjee, Hewlett-Packard Laboratories, Palo Alto, MCNL, CA 94304, USA
pp. 785-788
Fatih Kamisli, Research Laboratory of Electronics, Massachusetts Institute of Technology, USA
Jae S. Lim, Research Laboratory of Electronics, Massachusetts Institute of Technology, USA
pp. 789-792
Malavika Bhaskaranand, Department of Electrical and Computer Engineering, University of California, Santa Barbara, 93106 USA
Jerry D. Gibson, Department of Electrical and Computer Engineering, University of California, Santa Barbara, 93106 USA
pp. 793-796
J. Christian Schmidt, Department of Electrical and Computer Engineering, University of California, Santa Barbara, 93106-9560 USA
Kenneth Rose, Department of Electrical and Computer Engineering, University of California, Santa Barbara, 93106-9560 USA
pp. 797-800
Ghazaleh R. Esmaili, Department of Electrical and Computer Engineering, University of California, San Diego, La Jolla, 92093-0407 USA
Pamela C. Cosman, Department of Electrical and Computer Engineering, University of California, San Diego, La Jolla, 92093-0407 USA
pp. 801-804
Raman Arora, University of Wisconsin-Madison, Department of Electrical and Computer Engg., 1415 Engineering Drive, 53706 USA
Yu Hen Hu, University of Wisconsin-Madison, Department of Electrical and Computer Engg., 1415 Engineering Drive, 53706 USA
Charles Dyer, University of Wisconsin-Madison, Department of Computer Sciences, 1210 W. Dayton St., 53706 USA
pp. 805-808
Chuohao Yeo, Dept. of EECS, University of California, Berkeley, 94720, USA
Parvez Ahammad, Janelia Farm Research Campus, Howard Hughes Medical Institute, Ashburn, VA 20147, USA
Hao Zhang, Dept. of EECS, University of California, Berkeley, 94720, USA
Kannan Ramchandran, Janelia Farm Research Campus, Howard Hughes Medical Institute, Ashburn, VA 20147, USA
pp. 809-812
Youlu Wang, University of Nebraska-Lincoln, Dept. of Electrical Engineering, 209N WSEC, 68588 USA
Senem Velipasalar, University of Nebraska-Lincoln, Dept. of Electrical Engineering, 209N WSEC, 68588 USA
pp. 813-816
E. Baudrier, LSIIT UMR CNRS 7005, University of Strasbourg, FRANCE
V. Rosselli, XLIM-SIC UMR CNRS 6172, University of Poitiers, FRANCE
M. C. Larabi, XLIM-SIC UMR CNRS 6172, University of Poitiers, FRANCE
pp. 817-820
Mina Makar, Information Systems Laboratory, Department of Electrical Engineering, Stanford University, USA
Chuo-Ling Chang, Information Systems Laboratory, Department of Electrical Engineering, Stanford University, USA
David Chen, Information Systems Laboratory, Department of Electrical Engineering, Stanford University, USA
Sam S. Tsai, Information Systems Laboratory, Department of Electrical Engineering, Stanford University, USA
Bernd Girod, Information Systems Laboratory, Department of Electrical Engineering, Stanford University, USA
pp. 821-824
Bingbing Ni, Department of Electrical and Computer Engineering, National University of Singapore, Singapore
Shuicheng Yan, Department of Electrical and Computer Engineering, National University of Singapore, Singapore
Ashraf Kassim, Department of Electrical and Computer Engineering, National University of Singapore, Singapore
pp. 825-828
Zafer Arican, Signal Processing Laboratory (LTS4), Ecole Polytechnique Fédérale de Lausanne (EPFL), 1015 - Switzerland
Pascal Frossard, Signal Processing Laboratory (LTS4), Ecole Polytechnique Fédérale de Lausanne (EPFL), 1015 - Switzerland
pp. 829-832
Osama A. Omer, Department of Electrical and Electronic Engineering, Tokyo University of Agriculture and Technology, Japan
Toshihisa Tanaka, Department of Electrical and Electronic Engineering, Tokyo University of Agriculture and Technology, Japan
pp. 833-836
Karl Ni, The University of California at San Diego, USA
Truong Q. Nguyen, The University of California at San Diego, USA
pp. 837-840
Xiqun Lu, College of Computer Science, Zhejiang University, China
Hidetomo Sakaino, College of Computer Science, Zhejiang University, China
pp. 841-844
Haiqiang Zuo, National Laboratory of Pattern Recognition, Institute of Automation, CAS, Beijing, China
Xi Li, National Laboratory of Pattern Recognition, Institute of Automation, CAS, Beijing, China
Ou Wu, National Laboratory of Pattern Recognition, Institute of Automation, CAS, Beijing, China
Weiming Hu, National Laboratory of Pattern Recognition, Institute of Automation, CAS, Beijing, China
Guan Luo, National Laboratory of Pattern Recognition, Institute of Automation, CAS, Beijing, China
pp. 849-852
Olivier Barnich, University of Liège, Montefiore Institute, INTELSIG Group, Belgium
Marc Van Droogenbroeck, University of Liège, Montefiore Institute, INTELSIG Group, Belgium
pp. 853-856
Wen-Sheng Chen, College of Mathematics&Computational Science, Shenzhen University, China, 518060
Pong C. Yuen, Department of Computer Science, Hong Kong Baptist University, Hong Kong
pp. 857-860
A. Majumdar, Department of Electrical and Computer Engineering, University of British Columbia, Canada
R. K. Ward, Department of Electrical and Computer Engineering, University of British Columbia, Canada
pp. 861-864
Xin Geng, School of Engineering and Information Technology, Deakin University, Australia
Kate Smith-Miles, School of Engineering and Information Technology, Deakin University, Australia
pp. 865-868
Wen-Shiung Chen, VIP-CCLab., Dept. of Electrical Engineering, National Chi Nan University, Taiwan
Chi-An Chuan, VIP-CCLab., Dept. of Electrical Engineering, National Chi Nan University, Taiwan
Sheng-Wen Shih, Dept. of Computer Science and Information Engineering, National Chi Nan University, Taiwan
Shun-Hsun Chang, VIP-CCLab., Dept. of Electrical Engineering, National Chi Nan University, Taiwan
pp. 869-872
Shan Du, Department of Electrical and Computer Engineering, The University of British Columbia, Vancouver, Canada
Rabab Ward, Department of Electrical and Computer Engineering, The University of British Columbia, Vancouver, Canada
pp. 873-876
Jiwen Lu, School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore
Yap-Peng Tan, School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore
pp. 877-880
Jie Lin, Institute of ECIT, Queen's University Belfast, BT7 1NN, UK
Ji Ming, Institute of ECIT, Queen's University Belfast, BT7 1NN, UK
Danny Crookes, Institute of ECIT, Queen's University Belfast, BT7 1NN, UK
pp. 881-884
Yongjin Wang, University of Toronto, The Edward S. Rogers Sr. Department of Electrical and Computer Engineering, 10 King's College Road, ON, Canada, M5S 3G4
Dimitrios Hatzinakos, University of Toronto, The Edward S. Rogers Sr. Department of Electrical and Computer Engineering, 10 King's College Road, ON, Canada, M5S 3G4
pp. 885-888
Liting Wang, Department of Electronic Engineering, Tsinghua University, Beijing, China
Liu Ding, Department of Electronic Engineering, Tsinghua University, Beijing, China
Xiaoqing Ding, Department of Electronic Engineering, Tsinghua University, Beijing, China
Chi Fang, Department of Electronic Engineering, Tsinghua University, Beijing, China
pp. 889-892
Wei-Chang Wang, VIP-CCLab., Dept. of Electrical Engineering, National Chi Nan University, Taiwan
Wen-Shiung Chen, VIP-CCLab., Dept. of Electrical Engineering, National Chi Nan University, Taiwan
Sheng-Wen Shih, Dept. of Computer Science and Information Engineering, National Chi Nan University, Taiwan
pp. 893-896
Huoding Li, IBM STG Development Lab, 2F, Bldg.10, No.399, Ke Yuan Road, Zhang Jiang High Tech Park, Shanghai 200131, China
Rong Yan, IBM China Research Lab, Diamond Building, Zhongguancun Software Park, Beijing 100193, China
Xing Liu, IBM STG Development Lab, 2F, Bldg.10, No.399, Ke Yuan Road, Zhang Jiang High Tech Park, Shanghai 200131, China
Yu Yuan, IBM China Research Lab, Diamond Building, Zhongguancun Software Park, Beijing 100193, China
Sheng Xu, IBM STG Development Lab, 2F, Bldg.10, No.399, Ke Yuan Road, Zhang Jiang High Tech Park, Shanghai 200131, China
pp. 897-900
Zhe Yuan, Department of Electronic Engineering, Shanghai Jiao Tong University, 200240, China
Hongkai Xiong, Department of Electronic Engineering, Shanghai Jiao Tong University, 200240, China
Yuan F. Zheng, Department of Electronic Engineering, Shanghai Jiao Tong University, 200240, China
pp. 901-904
Cixun Zhang, Tampere University of Technology, Finland
Kemal Ugur, Nokia Research Center, Tampere, Finland
Jani Lainema, Nokia Research Center, Tampere, Finland
Moncef Gabbouj, Tampere University of Technology, Finland
pp. 905-908
Xiaopeng Fan, Hong Kong University of Science and Technology, Electronic and Computer Engineering, Clear Water Bay, Hong Kong
Oscar C. Au, Hong Kong University of Science and Technology, Electronic and Computer Engineering, Clear Water Bay, Hong Kong
Mengyao Ma, Hong Kong University of Science and Technology, Electronic and Computer Engineering, Clear Water Bay, Hong Kong
Ling Hou, Hong Kong University of Science and Technology, Electronic and Computer Engineering, Clear Water Bay, Hong Kong
Jiantao Zhou, Hong Kong University of Science and Technology, Electronic and Computer Engineering, Clear Water Bay, Hong Kong
Ngai Man Cheung, Hong Kong University of Science and Technology, Electronic and Computer Engineering, Clear Water Bay, Hong Kong
pp. 909-912
Olivier Crave, IRISA / INRIA - Campus Universitaire de Beaulieu, 35042 Rennes Cedex, FRANCE
Christine Guillemot, IRISA / INRIA - Campus Universitaire de Beaulieu, 35042 Rennes Cedex, FRANCE
Beatrice Pesquet-Popescu, TELECOM ParisTech, Signal and Image Proc. Dept. - 46, rue Barrault, 75634 Cedex 13, FRANCE
pp. 913-916
Rony Darazi, Communications and Remote Sensing laboratory, Université catholique de Louvain, 2 Place du Levant, B-1348, Louvain-la-Neuve, Belgium
Annabelle Gouze, Communications and Remote Sensing laboratory, Université catholique de Louvain, 2 Place du Levant, B-1348, Louvain-la-Neuve, Belgium
Benoit Macq, Communications and Remote Sensing laboratory, Université catholique de Louvain, 2 Place du Levant, B-1348, Louvain-la-Neuve, Belgium
pp. 917-920
Xin Huang, DTU Fotonik, Technical University of Denmark, Building 343, Lyngby 2800, Denmark
Soren Forchhammer, DTU Fotonik, Technical University of Denmark, Building 343, Lyngby 2800, Denmark
pp. 921-924
Avin Kumar Kannur, Department of Computer Engineering, Arizona State University, USA
Baoxin Li, Department of Computer Engineering, Arizona State University, USA
pp. 925-928
Jongmin Hahm, School of Electrical and Computer Engineering&Computer Science, Division of Electrical Engineering, Korea Advanced Institute of Science and Technology, Korea
Jaemoon Kim, School of Electrical and Computer Engineering&Computer Science, Division of Electrical Engineering, Korea Advanced Institute of Science and Technology, Korea
Chong-Min Kyung, School of Electrical and Computer Engineering&Computer Science, Division of Electrical Engineering, Korea Advanced Institute of Science and Technology, Korea
pp. 929-932
Abharana Bhat, The Robert Gordon University, Aberdeen, United Kingdom
Iain Richardson, The Robert Gordon University, Aberdeen, United Kingdom
Sampath Kannangara, The Robert Gordon University, Aberdeen, United Kingdom
pp. 933-936
Javier Ruiz-Hidalgo, Universitat Politècnica de Catalunya, Barcelona, Spain
Philippe Salembier, Universitat Politècnica de Catalunya, Barcelona, Spain
pp. 941-944
Olivier Barnich, University of Liège, Montefiore Institute, INTELSIG Group, Belgium
Marc Van Droogenbroeck, University of Liège, Montefiore Institute, INTELSIG Group, Belgium
pp. 945-948
Norihiro Kakukou, Graduate School of Information Science and Technology, Hokkaido University, Kita 14, Nishi 9, Kita-ku, Sapporo, 060-0814, Japan
Takahiro Ogawa, Graduate School of Information Science and Technology, Hokkaido University, Kita 14, Nishi 9, Kita-ku, Sapporo, 060-0814, Japan
Miki Haseyama, Graduate School of Information Science and Technology, Hokkaido University, Kita 14, Nishi 9, Kita-ku, Sapporo, 060-0814, Japan
pp. 949-952
Dong Sik Kim, School of Electronics and Information Engineering, Hankuk University of Foreign Studies, Gyonggi-do, 449-791, Korea
pp. 953-956
Christian Kas, LaBRI, University of Bordeaux 1, 351, Cours de la Libération, 33405 Talence Cedex, France
Henri Nicolas, LaBRI, University of Bordeaux 1, 351, Cours de la Libération, 33405 Talence Cedex, France
pp. 957-960
Didier Auroux, Institut de Mathématiques de Toulouse, Université Paul Sabatier Toulouse 3, 31062 cedex 9, France
pp. 961-964
Chung-Cheng Chiu, Department of Electrical and Electronic Engineering, Chung Cheng Institute of Technology, National Defense University, No. 190, Sanyuan 1st St., Dashi Jen, Taoyuan, 335 Taiwan, R.O
Wen-Chung Chen, Department of Electrical and Electronic Engineering, Chung Cheng Institute of Technology, National Defense University, No. 190, Sanyuan 1st St., Dashi Jen, Taoyuan, 335 Taiwan, R.O
Min-Yu Ku, Department of Electrical and Electronic Engineering, Chung Cheng Institute of Technology, National Defense University, No. 190, Sanyuan 1st St., Dashi Jen, Taoyuan, 335 Taiwan, R.O
Yuh-Jiun Liu, Department of Electrical and Electronic Engineering, Chung Cheng Institute of Technology, National Defense University, No. 190, Sanyuan 1st St., Dashi Jen, Taoyuan, 335 Taiwan, R.O
pp. 965-968
Georgios Tzimiropoulos, Imperial College London, SW7 2AZ, UK
Vasileios Argyriou, University of East London, E16 2RD, UK
Tania Stathaki, Imperial College London, SW7 2AZ, UK
pp. 969-972
Felipe Calderero, Department of Signal Theory and Communications, Technical University of Catalonia (UPC), Barcelona, Spain
Ferran Marques, Department of Signal Theory and Communications, Technical University of Catalonia (UPC), Barcelona, Spain
pp. 973-976
Jiangbo Lu, Department of Electrical Engineering, Katholieke Universiteit Leuven, Belgium
Qiong Yang, Department of Electrical Engineering, Katholieke Universiteit Leuven, Belgium
Gauthier Lafruit, Multimedia Group, IMEC, Kapeldreef 75, B-3001, Leuven, Belgium
pp. 977-980
Jean-Baptiste Autheserre, IMS Laboratory, UMR 5218 CNRS, University of Bordeaux, 33405 Talence, France
Remi Megret, IMS Laboratory, UMR 5218 CNRS, University of Bordeaux, 33405 Talence, France
Yannick Berthoumieu, IMS Laboratory, UMR 5218 CNRS, University of Bordeaux, 33405 Talence, France
pp. 981-984
Yi Wang, Department of Electrical Engineering, University of North Dakota, USA
Richard R. Schultz, Department of Electrical Engineering, University of North Dakota, USA
Ronald A. Fevig, Department of Space Studies, University of North Dakota, USA
pp. 985-988
Srenivas Varadarajan, Department of Electrical Engineering, Arizona State University, Tempe, 85287-5706, USA
Lina J. Karam, Department of Electrical Engineering, Arizona State University, Tempe, 85287-5706, USA
Dinei Florencio, Microsoft Research, One Microsoft Way, Redmond, WA 98052, USA
pp. 989-992
Hong Pan, School of Automation, Southeast University, Nanjing, China, 210096
Li-Zuo Jin, School of Automation, Southeast University, Nanjing, China, 210096
Xiao-Hui Yuan, School of Automation, Southeast University, Nanjing, China, 210096
Si-Yu Xia, School of Automation, Southeast University, Nanjing, China, 210096
Jiu-Xian Li, School of Automation, Southeast University, Nanjing, China, 210096
Liang-Zheng Xia, School of Automation, Southeast University, Nanjing, China, 210096
pp. 993-996
Dung Trung Vo, Video Processing Laboratory, UC San Diego. 9300 Gilman Drive, La Jolla, CA 92092, USA
Joel Sole, Thomson Corporate Research. 2 Independence Way, Princeton, NJ 08540, USA
Peng Yin, Thomson Corporate Research. 2 Independence Way, Princeton, NJ 08540, USA
Cristina Gomila, Thomson Corporate Research. 2 Independence Way, Princeton, NJ 08540, USA
Truong Nguyen, Video Processing Laboratory, UC San Diego. 9300 Gilman Drive, La Jolla, CA 92092, USA
pp. 997-1000
Nagisa Sugiyama, The University of Kitakyushu, Dpt. of Information and Media Sciences, University of Brescia, Dpt. of Electronic for the Automation, Japan
Hironori Kaida, The University of Kitakyushu, Dpt. of Information and Media Sciences, University of Brescia, Dpt. of Electronic for the Automation, Japan
Xinwei Xue, The University of Kitakyushu, Dpt. of Information and Media Sciences, University of Brescia, Dpt. of Electronic for the Automation, Japan
Takao Jinno, The University of Kitakyushu, Dpt. of Information and Media Sciences, University of Brescia, Dpt. of Electronic for the Automation, Japan
Nicola Adami, The University of Kitakyushu, Dpt. of Information and Media Sciences, University of Brescia, Dpt. of Electronic for the Automation, Japan
Masahiro Okuda, The University of Kitakyushu, Dpt. of Information and Media Sciences, University of Brescia, Dpt. of Electronic for the Automation, Japan
pp. 1001-1004
Xu Chen, University of Illinois at Chicago, Electrical and Computer Engineering, USA
Pascal Frossard, Ecole Polytechnique Fédérale de Lausanne (EPFL), Signal Processing Laboratory (LTS4), China
pp. 1005-1008
Joachim Dahl, Anybody Technology A/S, Niels Jernesvej 12, Aalborg, Denmark
Jan Ostergaard, Aalborg University, Department of Electronic Systems, Niels Jernesvej 12, Denmark
Tobias Lindstrom Jensen, Aalborg University, Department of Electronic Systems, Niels Jernesvej 12, Denmark
Soren Holdt Jensen, Aalborg University, Department of Electronic Systems, Niels Jernesvej 12, Denmark
pp. 1009-1012
Ling Li, Institute of Computing Technology, Beijing, China
Zhensong Wang, Institute of Computing Technology, Beijing, China
pp. 1013-1016
Doru C. Balcan, Computer Science Department, Carnegie Mellon University, Pittsburgh, PA, USA
Michael S. Lewicki, Electrical Engineering and Computer Science Dept., Case Western Reserve University, Cleveland, OH, USA
pp. 1021-1024
Julio C. Rolon, Technical University of Catalonia (UPC), Dept. of Signal Theory and Communications, Spain
Antonio Ortega, University of Southern California (USC), Signal and Image Processing Institute, USA
Philippe Salembier, Technical University of Catalonia (UPC), Dept. of Signal Theory and Communications, Spain
pp. 1025-1028
Yu-Ming Lee, Department of Communication Engineering, National Central University, Taiwan 32054, R.O.C.
Jyun-De Wu, Department of Communication Engineering, National Central University, Taiwan 32054, R.O.C.
Yinyi Lin, Department of Communication Engineering, National Central University, Taiwan 32054, R.O.C.
pp. 1029-1032
Ziyuan Zhu, VLSI Lab., Tongji University, Shanghai 200092, China
Tao Lin, VLSI Lab., Tongji University, Shanghai 200092, China
pp. 1033-1036
Li-Li Wang, Department of Electronic and Information Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong
Wan-Chi Siu, Department of Electronic and Information Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong
pp. 1037-1040
El Hadji S. Diop, Groupe ASM, Ecole Navale, IRENav / E3I2-EA3876, ENSIETA, Ecole Navale, Lanvéoc-Poulmic, 29240 Brest-Armées, France
A. O. Boudraa, Groupe ASM, Ecole Navale, IRENav / E3I2-EA3876, ENSIETA, Ecole Navale, Lanvéoc-Poulmic, 29240 Brest-Armées, France
Fabien Salzenstein, Laboratoire Iness, CNRS/STIC-UPR, Université Louis Pasteur, 23 rue du Loess, BP 20 CR, 67037 Strasbourg Cedex 2, France
pp. 1041-1044
Youssef Stitou, IMS- Group Signal, UMR 5218 CNRS, ENSEIRB - Université de Bordeaux, France
N. Lasmar, IMS- Group Signal, UMR 5218 CNRS, ENSEIRB - Université de Bordeaux, France
Yannick Berthoumieu, IMS- Group Signal, UMR 5218 CNRS, ENSEIRB - Université de Bordeaux, France
pp. 1045-1048
Shu-Fan Wang, Department of Computer Science, National Tsing Hua University, HsinChu, Taiwan 300 R.O.C
Shang-Hong Lai, Department of Computer Science, National Tsing Hua University, HsinChu, Taiwan 300 R.O.C
pp. 1049-1052
Sevinc Bayram, Polytechnic Institute of NYU, ECE Dept., Brooklyn, NY, USA
Husrev Taha Sencar, TOBB University of Economics&Technology, Comp. Engineering Dept., Ankara, TURKEY
Nasir Memon, Polytechnic Insitute of NYU, CIS Dept., Brooklyn, NY, USA
pp. 1053-1056
Takumi Kobayashi, National Institute of Advanced Industrial Science and Technology, Tsukuba, 1-1-1 Umezono, Japan
Nobuyuki Otsu, National Institute of Advanced Industrial Science and Technology, Tsukuba, 1-1-1 Umezono, Japan
pp. 1057-1060
Rittavee Matungka, Dept. of Electrical and Computer Engineering, The Ohio State University, Columbus, 43212, USA
Yuan F. Zheng, Dept. of Electrical and Computer Engineering, The Ohio State University, Columbus, 43212, USA
Robert L. Ewing, Air Force Research Laboratory/IFTA, Wright Patterson AFB, Ohio 4543, USA
pp. 1061-1064
Li Lu, Institute of Image Processing and Pattern Recognition, Shanghai Jiaotong University, China
Pengfei Shi, Institute of Image Processing and Pattern Recognition, Shanghai Jiaotong University, China
pp. 1065-1068
I. Qazi, Laboratory XLIM Department SIC, University of Poitiers, bat. SP2MI, av. Marie et Pierre Curie, 86960, Chasseneuil-Futuroscope Cedex, France
O. Alata, Laboratory XLIM Department SIC, University of Poitiers, bat. SP2MI, av. Marie et Pierre Curie, 86960, Chasseneuil-Futuroscope Cedex, France
C. F. Maloigne, Laboratory XLIM Department SIC, University of Poitiers, bat. SP2MI, av. Marie et Pierre Curie, 86960, Chasseneuil-Futuroscope Cedex, France
J. C. Burie, Laboratory L3I, University of La Rochelle, avenue Michel Crepeau, 17042, Cedex 1, France
pp. 1069-1072
Marie-Cecile Peron, CNRS, IMS Laboratory, Groupe signal, UMR 5218, 33405 Talence, France
Jean-Pierre Da Costa, CNRS, IMS Laboratory, Groupe signal, UMR 5218, 33405 Talence, France
Youssef Stitou, CNRS, IMS Laboratory, Groupe signal, UMR 5218, 33405 Talence, France
Christian Germain, CNRS, IMS Laboratory, Groupe signal, UMR 5218, 33405 Talence, France
Yannick Berthoumieu, CNRS, IMS Laboratory, Groupe signal, UMR 5218, 33405 Talence, France
pp. 1073-1076
Muntaseer Salahuddin, School of Computing Science, Simon Fraser University, Burnaby, British Columbia, Canada, V5A 1S6
Mark S. Drew, School of Computing Science, Simon Fraser University, Burnaby, British Columbia, Canada, V5A 1S6
Ze-Nian Li, School of Computing Science, Simon Fraser University, Burnaby, British Columbia, Canada, V5A 1S6
pp. 1077-1080
Zengguo Sun, School of Electronic and Information Engineering, Xi'an Jiaotong University, Shaanxi, China
Chongzhao Han, School of Electronic and Information Engineering, Xi'an Jiaotong University, Shaanxi, China
pp. 1081-1084
Zhijie Mao, National Lab of Radar Signal Processing, Xidian Univ., Xi'an710071, China
Guisheng Liao, National Lab of Radar Signal Processing, Xidian Univ., Xi'an710071, China
Zhiwei Yang, National Lab of Radar Signal Processing, Xidian Univ., Xi'an710071, China
Xiangyang Liu, National Lab of Radar Signal Processing, Xidian Univ., Xi'an710071, China
pp. 1085-1088
Tsung-Han Chan, Inst. Commun. Eng., National Tsinghua Univ., Hsinchu, Taiwan
Chong-Yung Chi, Inst. Commun. Eng., National Tsinghua Univ., Hsinchu, Taiwan
Yu-Min Huang, Inst. Commun. Eng., National Tsinghua Univ., Hsinchu, Taiwan
Wing-Kin Ma, Inst. Commun. Eng., National Tsinghua Univ., Hsinchu, Taiwan
pp. 1089-1092
Luciano Sbaiz, LCAV - School of Computer and Communication Sciences, Ecole Polytechnique Fédérale de Lausanne (EPFL), CH-1015 Lausanne, Switzerland
Feng Yang, LCAV - School of Computer and Communication Sciences, Ecole Polytechnique Fédérale de Lausanne (EPFL), CH-1015 Lausanne, Switzerland
Edoardo Charbon, AQUA - School of Computer and Communication Sciences, Ecole Polytechnique Fédérale de Lausanne (EPFL), CH-1015 Lausanne, Switzerland
Sabine Susstrunk, LCAV - School of Computer and Communication Sciences, Ecole Polytechnique Fédérale de Lausanne (EPFL), CH-1015 Lausanne, Switzerland
Martin Vetterli, LCAV - School of Computer and Communication Sciences, Ecole Polytechnique Fédérale de Lausanne (EPFL), CH-1015 Lausanne, Switzerland
pp. 1093-1096
Jonathan D. Coker, University of Minnesota, Department of Electrical and Computer Engineering, USA
Ahmed H. Tewfik, University of Minnesota, Department of Electrical and Computer Engineering, USA
pp. 1097-1100
Ihsan ul Haq, School of Electronic and Information Engineering, Beijing University of Aeronautics and Astronautics, 100191, China
Xiaojian Xu, School of Electronic and Information Engineering, Beijing University of Aeronautics and Astronautics, 100191, China
Aamir Shahzad, School of Electronic and Information Engineering, Beijing University of Aeronautics and Astronautics, 100191, China
pp. 1101-1104
Jin-Jun, Dept. of Electrical and Computer Engineering, University of Minnesota, Twin Cities, USA
Zhi-Quan, Dept. of Electrical and Computer Engineering, University of Minnesota, Twin Cities, USA
Ming Jiang, School of Mathematics, Peking University, Beijing, China
pp. 1105-1108
Zheng Xiang, Department of Electronic Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Min Hang, China
Xingzhao Liu, Department of Electronic Engineering, Shanghai Jiao Tong University, 800 Dongchuan Road, Min Hang, China
pp. 1109-1112
L. Jacques, Signal Processing Laboratory (LTS2), Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland
P. Vandergheynst, Signal Processing Laboratory (LTS2), Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland
A. Bibet, Microelectronic Systems Laboratory (LSM), Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland
V. Majidzadeh, Microelectronic Systems Laboratory (LSM), Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland
A. Schmid, Microelectronic Systems Laboratory (LSM), Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland
Y. Leblebici, Microelectronic Systems Laboratory (LSM), Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland
pp. 1113-1116
Junjie Wu, School of Electronic Engineering, University of Electronic Science and Technology of China, Sichuan, China 610054
Jianyu Yang, School of Electronic Engineering, University of Electronic Science and Technology of China, Sichuan, China 610054
Haiguang Yang, School of Electronic Engineering, University of Electronic Science and Technology of China, Sichuan, China 610054
Yulin Huang, School of Electronic Engineering, University of Electronic Science and Technology of China, Sichuan, China 610054
pp. 1117-1120