- I
- ICASSP
- 2001
- Acoustics, Speech, and Signal Processing, 2001 Vol 6. 2001 IEEE International Conference on
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Acoustics, Speech, and Signal Processing, 2001 Vol 6. 2001 IEEE International Conference on
Salt Lake City, UT, USA
May 07-May 11
ISBN: 0-7803-7041-4
Table of Contents
N. Bilgutay, Dept. of Electr. & Comput Eng., Drexel Univ., Philadelphia, PA, USA
pp. 3393-3396
S.A. Mandayam, Dept. of Electr. & Comput. Eng., Rowan Univ., Glassboro, NJ, USA
pp. 3397-3400
K.D. Donohue, Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA
pp. 3401-3404
U. Qidwai, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Dartmouth, MA, USA
pp. 3405-3408
M.J. Coates, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 3409-3412
Xueshi Yang, ECE Dept., Drexel Univ., Philadelphia, PA, USA
pp. 3413-3416
Meng-Fu Shih, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3421-3424
S. Roux, Ecole Normale Superieure de Lyon, France
pp. 3425-3428
V.J. Ribeiro, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 3429-3432
D.J. Anderson, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3433-3436
V. Solo, Sch. of Electr. Eng., New South Wales Univ., Sydney, NSW, Australia
pp. 3441-3444
K.A. Moxon, Sch. of Biomed. Eng., Drexel Univ., Philadelphia, PA, USA
pp. 3445-3448
D.K. Eddington, Cochlear Implant Res. Lab., Massachusetts Eye & Ear Infirmary, Boston, MA, USA
pp. 3449-3452
J.P. Fitch, Lawrence Livermore Nat. Lab., California Univ., Livermore, CA, USA
pp. 3453-3456
J.H. Kotecha, Dept. of Electr. & Comput. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 3465-3468
A.T. Ihler, Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
pp. 3473-3476
C. Pantaleon, Dpto. Ing. Comunicaciones, ETSII y Telecom, Cantabria Univ., Santander, Spain
pp. 3477-3480
D. Dimitriadis, Dept. of Electr. & Comput. Eng., Nat. Tech. Univ. of Athens, Greece
pp. 3481-3484
S. Oraintara, Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
pp. 3485-3488
M.H. Costa, Escola de Engenharia e Arquitetura, Univ. Catolica de Pelotas, Brazil
pp. 3489-3492
I.R. Krcmar, Fac. of Electr. Eng., Banjaluka Univ., Bosnia-Herzegovina
pp. 3493-3496
S. Kinoshita, Dept. of Electron., Kansai Univ., Osaka, Japan
pp. 3497-3500
R. Foxall, Sch. of Inf. Syst., East Anglia Univ., Norwich, UK
pp. 3505-3508
Y. Nakada, Dept. of Electr., Electron. & Comput. Eng., Waseda Univ., Tokyo, Japan
pp. 3509-3512
A. Taleb, Sch. of Electr. & Comput. Eng., Curtin Univ. of Technol., Perth, WA, Australia
pp. 3513-3516
V. Ivanovic, Elektrotech. Fakultet, Montenegro Univ., Podgorica, Yugoslavia
pp. 3521-3524
A. Akan, Dept. of Electron. Eng., Istanbul Univ., Turkey
pp. 3529-3532
D.S. Roberts, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 3533-3536
Feng Zhang, Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
pp. 3537-3540
Soo-Chang Pei, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 3545-3548
S. Aviyente, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3549-3552
A.K. Ozdemir, Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
pp. 3553-3556
V. Sicic, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 3557-3560
B. Barkat, Sch. of Electr. & Comput. Eng., Curtin Univ. of Technol., Perth, WA, Australia
pp. 3561-3564
D. Barchiesi, Lab. LNIO, Univ. de Technol. de Troyes, France
pp. 3565-3568
Dong Enqing, Sch. of Electron. & Inf. Eng., Xi'an Jiaotong Univ., China
pp. 3569-3572
Xiang-Gen Xia, Dept. of Electr. & Comput. Eng., Delaware Univ., Newark, DE, USA
pp. 3573-3576
Weifeng Mu, Dept. of Electr. & Comput. Eng., Villanova Univ., PA, USA
pp. 3577-3580
Y. Larsen, Dept. of Phys., Tromso Univ., Norway
pp. 3581-3584
YongJune Shin, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 3585-3588
M. Ostendorf, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 3589-3592
S. Pon Varma, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 3593-3596
Linh-Trung Nguyen, Signal Process. Res. Centre, Queensland Univ., Brisbane, Qld., Australia
pp. 3597-3600
D. Marelli, Dept. of Electr. & Comput. Eng., Newcastle Univ., NSW, Australia
pp. 3601-3604
A. Mertins, Dept. of Electr. Comput. & Tele. Eng., Wollongong Univ., NSW, Australia
pp. 3605-3608
A. Hjorungnes, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 3609-3612
K. Attakitmongcol, Sch. of Electr. Eng., Suranaree Univ. of Technol., Nakhon Rachasima, Thailand
pp. 3613-3616
T. Saramaki, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 3617-3620
P.S.R. Diniz, Program de Engenharia Eletrica, Univ. Federal de Rio de Janeiro, Brazil
pp. 3621-3624
A. Viholainen, Telecommun. Lab., Tampere Univ. of Technol., Finland
pp. 3625-3628
C. Popeea, Dept. of Control & Comput., Bucharest Politechnica Univ., Romania
pp. 3629-3632
J.M. De Haan, Dept. of Telecommun. & Signal Process., Blekinge Inst. of Technol., Ronneby, Sweden
pp. 3633-3636
B. Vrcelj, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 3637-3640
M.N. Do, Lab. for Audio-Visual Commun., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 3641-3644
N.F. Law, Dept. of Electron. & Inf. Eng., Hong Kong Polytech. Univ., China
pp. 3649-3652
S. Akkarakaran, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 3661-3664
H. Ozkaramanli, Dept. of Electr. & Electron. Eng., Eastern Mediterranean Univ., Mersin, Turkey
pp. 3665-3668
G. Parker, Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 3669-3672
D. Babic, Telecommun. Lab., Tampere Univ. of Technol., Finland
pp. 3677-3680
F.G. Meyer, Dept. of Electr. Eng., Colorado Univ., Boulder, CO, USA
pp. 3681-3684
S. Durand, CMLA, Ecole Normale Superieure de Cachan, France
pp. 3685-3688
R. Gandhi, Motorola Broadband Comm. Sector, San Diego, CA, USA
pp. 3689-3692
I.W. Selesnick, Dept. of Electr. & Electron. Eng., Hong Kong Univ., China
pp. 3697-3700
B.W. Gillespie, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 3701-3704
D.A.F. Florencio, Dept. Eng. Eletrica, Inst. Militar de Engenharia, Rio de Janeiro, Brazil
pp. 3705-3708
J.D. Griesbach, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 3709-3712
A. Oakman, Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3717-3720
W.H. Neo, Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore
pp. 3721-3724
I. Yamada, Dept. of Commun. & Integrated Syst., Tokyo Inst. of Technol., Japan
pp. 3725-3728
L.S. Resende, Univ. Federal de Santa Catarina, Florianopolis, Brazil
pp. 3729-3732
P.M. Djuric, Dept. of Electr. & Comput. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 3733-3736
J. Okello, Fac. of Eng., Tottori Univ., Japan
pp. 3737-3740
N. Tokui, Graduate Sch. of Natural Sci. & Technol., Kanazawa Univ., Japan
pp. 3741-3744
S. Werner, Lab. of Signal Process., Helsinki Univ. of Technol., Espoo, Finland
pp. 3745-3748
B.E. Dunne, Tellabs Res. Center, Mishawaka, IN, USA
pp. 3757-3760
K. Kusaba, Inf. Technol. R&D Center, Mitsubishi Electr. Corp., Kamakura, Japan
pp. 3761-3764
O. Vainio, Dept. of Inf. Technol., Tampere Univ. of Technol., Finland
pp. 3765-3768
Yuexian Zou, Dept. of Electr. & Electron. Eng., Hong Kong Univ., China
pp. 3769-3772
S.H. Leung, Dept. of Electron. Eng., City Univ. of Hong Kong, China
pp. 3777-3780
Zhi Tian, Dept. of Electr. Eng., Michigan Technol. Univ., Houghton, MI, USA
pp. 3781-3784
R. Merched, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3789-3792
J.J. Tapia, DSP Lab., Packet Video Corp., Hoffman Estates, IL, USA
pp. 3797-3800
W. Lertniphonphun, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 3801-3804
R. Ito, Fac. of Eng., Sci. Univ. of Tokyo, Japan
pp. 3805-3808
N.C. Griswold, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 3809-3812
T.N. Davidson, Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 3813-3816
Chengshan Xiao, Dept. of Electr. Eng., Missouri Univ., Columbia, MO, USA
pp. 3817-3820
B. Alkire, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3821-3824
R. Niemisto, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 3825-3828
R.A. Vargas, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 3829-3832
K.C. Haddad, Div. of Microelectron., AT&T Bell Labs., Holmdel, NJ, USA
pp. 3833-3836
N.J. Bershad, Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
pp. 3837-3840
H. Sakai, Dept. of Syst. Sci., Kyoto Univ., Japan
pp. 3841-3844
C. Guimaraes Lopes, Dept. of Electr. Eng., Univ. Federal de Santa Catarina, Florianapolis, Brazil
pp. 3845-3848
M. Godavarti, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3857-3860
A.H. Sayed, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3873-3876
Fan Xu, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3881-3884
N. Persson, Dept. of Electr. Eng., Linkoping Univ., Sweden
pp. 3885-3888
S. Shetty, Arizona State Univ., Tempe, AZ, USA
pp. 3889-3892
M. Vetterli, LCAV, Ecole Polytech. Federale de Lausanne, Switzerland
pp. 3893-3896
P.P. Vaidyanathan, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 3897-3900
B. Beferull-Lozano, Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
pp. 3901-3904
N.A. Fraser, Dept. of Electr. & Comput. Eng., Alberta Univ., Edmonton, Alta., Canada
pp. 3909-3912
A. Kalyuzhny, Scientific-Production Enterprise DELTA, Kiev, Ukraine
pp. 3917-3920
A. Burian, Tampere Univ. of Technol., Finland
pp. 3921-3924
M.J. Borran, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 3925-3928
V. Solo, Sch. of Electr. Eng., New South Wales Univ., Sydney, NSW, Australia
pp. 3929-3932
S.F. Cotter, Dept. of Comput. Sci. & Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 3933-3936
K. Nishi, Univ. of Electro-Commun., Chofu, Japan
pp. 3937-3940
E. Blanco, LAGEP, Univ. Claude Bernard, Villeurbanne, France
pp. 3941-3944
G. Matz, Inst. of Commun. & Radio-Frequency Eng., Tech. Univ. Wien, Austria
pp. 3945-3948
T. Fabricius, Dept. for Math. Modelling, Tech. Univ. Denmark, Lyngby, Denmark
pp. 3957-3960
N. Boston, Dept. of Math., Illinois Univ., Urbana, IL, USA
pp. 3965-3967
Seungsin Lee, Dept. of Electr. Eng., Rochester Inst. of Technol., NY, USA
pp. 3969-3972
V. Krishnamurthy, Dept. of Electr. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 3973-3976
T.K. Moon, Dept. of Electr. & Comput. Eng., Utah State Univ., Logan, UT, USA
pp. 3977-3980
J.A. Gubner, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 3981-3984
D. Kouame, LUSSI, GIP Ultrasons, Tours, France
pp. 3989-3992
W. Fong, Signal Process. Group, Cambridge Univ., UK
pp. 3997-4000
J.H. Manton, Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 4001-4004
M. Hawkes, Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
pp. 4005-4008
S. Attallah, Centre for Wireless Commun., Nat. Univ. of Singapore, Singapore
pp. 4009-4012
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