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2001 IEEE International Conference on Acoustics, Speech, and Signal Processing. Proceedings (2001)
Salt Lake City, UT, USA
May 7, 2001 to May 11, 2001
ISBN: 0-7803-7041-4
TABLE OF CONTENTS
N. Bilgutay , Dept. of Electr. & Comput Eng., Drexel Univ., Philadelphia, PA, USA
pp. 3393-3396
S.A. Mandayam , Dept. of Electr. & Comput. Eng., Rowan Univ., Glassboro, NJ, USA
pp. 3397-3400
K.D. Donohue , Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA
pp. 3401-3404
U. Qidwai , Dept. of Electr. & Comput. Eng., Massachusetts Univ., Dartmouth, MA, USA
pp. 3405-3408
M.J. Coates , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 3409-3412
Xueshi Yang , ECE Dept., Drexel Univ., Philadelphia, PA, USA
pp. 3413-3416
Meng-Fu Shih , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3421-3424
S. Roux , Ecole Normale Superieure de Lyon, France
pp. 3425-3428
V.J. Ribeiro , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 3429-3432
D.J. Anderson , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3433-3436
V. Solo , Sch. of Electr. Eng., New South Wales Univ., Sydney, NSW, Australia
pp. 3441-3444
K.A. Moxon , Sch. of Biomed. Eng., Drexel Univ., Philadelphia, PA, USA
pp. 3445-3448
D.K. Eddington , Cochlear Implant Res. Lab., Massachusetts Eye & Ear Infirmary, Boston, MA, USA
pp. 3449-3452
J.P. Fitch , Lawrence Livermore Nat. Lab., California Univ., Livermore, CA, USA
pp. 3453-3456
Ching-Hsiang Tseng , Dept. of Electr. Eng., Nat. Taiwan Ocean Univ., Keelung, Taiwan
pp. 3457-3460
R. Van der Merwe , Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. 3461-3464
J.H. Kotecha , Dept. of Electr. & Comput. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 3465-3468
R.L. De Queiroz , Xerox Webster Res. Center, NY, USA
pp. 3469-3472
A.T. Ihler , Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
pp. 3473-3476
C. Pantaleon , Dpto. Ing. Comunicaciones, ETSII y Telecom, Cantabria Univ., Santander, Spain
pp. 3477-3480
D. Dimitriadis , Dept. of Electr. & Comput. Eng., Nat. Tech. Univ. of Athens, Greece
pp. 3481-3484
S. Oraintara , Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
pp. 3485-3488
M.H. Costa , Escola de Engenharia e Arquitetura, Univ. Catolica de Pelotas, Brazil
pp. 3489-3492
I.R. Krcmar , Fac. of Electr. Eng., Banjaluka Univ., Bosnia-Herzegovina
pp. 3493-3496
N. Kalouptsidis , Dept. of Inf., Athens Univ., Greece
pp. 3501-3504
R. Foxall , Sch. of Inf. Syst., East Anglia Univ., Norwich, UK
pp. 3505-3508
Y. Nakada , Dept. of Electr., Electron. & Comput. Eng., Waseda Univ., Tokyo, Japan
pp. 3509-3512
A. Taleb , Sch. of Electr. & Comput. Eng., Curtin Univ. of Technol., Perth, WA, Australia
pp. 3513-3516
I. Djurovic , Montenegro Univ., Podgorica, Yugoslavia
pp. 3517-3520
V. Ivanovic , Elektrotech. Fakultet, Montenegro Univ., Podgorica, Yugoslavia
pp. 3521-3524
A. Akan , Dept. of Electron. Eng., Istanbul Univ., Turkey
pp. 3529-3532
D.S. Roberts , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 3533-3536
Harmonic transform (Abstract)
Feng Zhang , Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
pp. 3537-3540
A.J. Brodzik , Scientific Software, Woburn, MA, USA
pp. 3541-3544
Soo-Chang Pei , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 3545-3548
S. Aviyente , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3549-3552
A.K. Ozdemir , Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
pp. 3553-3556
V. Sicic , Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 3557-3560
B. Barkat , Sch. of Electr. & Comput. Eng., Curtin Univ. of Technol., Perth, WA, Australia
pp. 3561-3564
D. Barchiesi , Lab. LNIO, Univ. de Technol. de Troyes, France
pp. 3565-3568
Dong Enqing , Sch. of Electron. & Inf. Eng., Xi'an Jiaotong Univ., China
pp. 3569-3572
Weifeng Mu , Dept. of Electr. & Comput. Eng., Villanova Univ., PA, USA
pp. 3577-3580
Y. Larsen , Dept. of Phys., Tromso Univ., Norway
pp. 3581-3584
YongJune Shin , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 3585-3588
M. Ostendorf , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 3589-3592
S. Pon Varma , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 3593-3596
Linh-Trung Nguyen , Signal Process. Res. Centre, Queensland Univ., Brisbane, Qld., Australia
pp. 3597-3600
D. Marelli , Dept. of Electr. & Comput. Eng., Newcastle Univ., NSW, Australia
pp. 3601-3604
A. Mertins , Dept. of Electr. Comput. & Tele. Eng., Wollongong Univ., NSW, Australia
pp. 3605-3608
A. Hjorungnes , Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 3609-3612
K. Attakitmongcol , Sch. of Electr. Eng., Suranaree Univ. of Technol., Nakhon Rachasima, Thailand
pp. 3613-3616
P.S.R. Diniz , Program de Engenharia Eletrica, Univ. Federal de Rio de Janeiro, Brazil
pp. 3621-3624
C. Popeea , Dept. of Control & Comput., Bucharest Politechnica Univ., Romania
pp. 3629-3632
J.M. De Haan , Dept. of Telecommun. & Signal Process., Blekinge Inst. of Technol., Ronneby, Sweden
pp. 3633-3636
B. Vrcelj , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 3637-3640
M.N. Do , Lab. for Audio-Visual Commun., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 3641-3644
V.A. Zheludev , Sch. of Comput. Sci., Tel Aviv Univ., Israel
pp. 3645-3648
N.F. Law , Dept. of Electron. & Inf. Eng., Hong Kong Polytech. Univ., China
pp. 3649-3652
F.C.A. Fernandes , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 3653-3656
R.F. Von Borries , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 3657-3660
S. Akkarakaran , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 3661-3664
H. Ozkaramanli , Dept. of Electr. & Electron. Eng., Eastern Mediterranean Univ., Mersin, Turkey
pp. 3665-3668
G. Parker , Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 3669-3672
I.W. Selesnick , Polytech. Univ., Brooklyn, NY, USA
pp. 3673-3676
D. Babic , Telecommun. Lab., Tampere Univ. of Technol., Finland
pp. 3677-3680
F.G. Meyer , Dept. of Electr. Eng., Colorado Univ., Boulder, CO, USA
pp. 3681-3684
S. Durand , CMLA, Ecole Normale Superieure de Cachan, France
pp. 3685-3688
R. Gandhi , Motorola Broadband Comm. Sector, San Diego, CA, USA
pp. 3689-3692
A.F. Abdelnour , Polytech. Univ., Brooklyn, NY, USA
pp. 3693-3696
I.W. Selesnick , Dept. of Electr. & Electron. Eng., Hong Kong Univ., China
pp. 3697-3700
B.W. Gillespie , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 3701-3704
D.A.F. Florencio , Dept. Eng. Eletrica, Inst. Militar de Engenharia, Rio de Janeiro, Brazil
pp. 3705-3708
J.D. Griesbach , Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 3709-3712
R.T.B. Vasconcellos , COPPE, Fed. Univ. of Rio de Janeiro, Brazil
pp. 3713-3716
A. Oakman , Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3717-3720
W.H. Neo , Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore
pp. 3721-3724
I. Yamada , Dept. of Commun. & Integrated Syst., Tokyo Inst. of Technol., Japan
pp. 3725-3728
L.S. Resende , Univ. Federal de Santa Catarina, Florianopolis, Brazil
pp. 3729-3732
P.M. Djuric , Dept. of Electr. & Comput. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 3733-3736
S. Werner , Lab. of Signal Process., Helsinki Univ. of Technol., Espoo, Finland
pp. 3745-3748
N.G. Chernoguz , TAMAM, Israel Aircraft Ind., Yahud, Israel
pp. 3749-3752
B.E. Dunne , Tellabs Res. Center, Mishawaka, IN, USA
pp. 3757-3760
K. Kusaba , Inf. Technol. R&D Center, Mitsubishi Electr. Corp., Kamakura, Japan
pp. 3761-3764
O. Vainio , Dept. of Inf. Technol., Tampere Univ. of Technol., Finland
pp. 3765-3768
Yuexian Zou , Dept. of Electr. & Electron. Eng., Hong Kong Univ., China
pp. 3769-3772
I.D. Skidmore , DERA, Malvern, UK
pp. 3773-3776
S.H. Leung , Dept. of Electron. Eng., City Univ. of Hong Kong, China
pp. 3777-3780
Zhi Tian , Dept. of Electr. Eng., Michigan Technol. Univ., Houghton, MI, USA
pp. 3781-3784
J. Benesty , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 3785-3788
R. Merched , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3789-3792
C.S. MacInnes , Appl. Res. Lab., Texas Univ., Austin, TX, USA
pp. 3793-3796
W. Lertniphonphun , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 3801-3804
N.C. Griswold , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 3809-3812
T.N. Davidson , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 3813-3816
Chengshan Xiao , Dept. of Electr. Eng., Missouri Univ., Columbia, MO, USA
pp. 3817-3820
B. Alkire , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3821-3824
R. Niemisto , Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 3825-3828
R.A. Vargas , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 3829-3832
K.C. Haddad , Div. of Microelectron., AT&T Bell Labs., Holmdel, NJ, USA
pp. 3833-3836
N.J. Bershad , Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
pp. 3837-3840
H. Sakai , Dept. of Syst. Sci., Kyoto Univ., Japan
pp. 3841-3844
C. Guimaraes Lopes , Dept. of Electr. Eng., Univ. Federal de Santa Catarina, Florianapolis, Brazil
pp. 3845-3848
P. Scalart , France Telecom R&D, Lannion, France
pp. 3849-3852
M. Milisavljevic , Cicada Semicond. Corp., Austin, TX, USA
pp. 3853-3856
M. Godavarti , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3857-3860
T.Y. Al-Naffouri , Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 3869-3872
A.H. Sayed , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3873-3876
R. Adhikary , ECE Dept., Boston Univ., MA, USA
pp. 3877-3880
Fan Xu , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3881-3884
N. Persson , Dept. of Electr. Eng., Linkoping Univ., Sweden
pp. 3885-3888
M. Vetterli , LCAV, Ecole Polytech. Federale de Lausanne, Switzerland
pp. 3893-3896
P.P. Vaidyanathan , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 3897-3900
B. Beferull-Lozano , Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
pp. 3901-3904
C. Mailhes , TeSA, ENSEEIHT, Toulouse, France
pp. 3905-3908
N.A. Fraser , Dept. of Electr. & Comput. Eng., Alberta Univ., Edmonton, Alta., Canada
pp. 3909-3912
J. Elbornsson , Dept. of Electr. Eng., Linkoping Univ., Sweden
pp. 3913-3916
A. Kalyuzhny , Scientific-Production Enterprise DELTA, Kiev, Ukraine
pp. 3917-3920
M.J. Borran , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 3925-3928
V. Solo , Sch. of Electr. Eng., New South Wales Univ., Sydney, NSW, Australia
pp. 3929-3932
S.F. Cotter , Dept. of Comput. Sci. & Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 3933-3936
K. Nishi , Univ. of Electro-Commun., Chofu, Japan
pp. 3937-3940
E. Blanco , LAGEP, Univ. Claude Bernard, Villeurbanne, France
pp. 3941-3944
G. Matz , Inst. of Commun. & Radio-Frequency Eng., Tech. Univ. Wien, Austria
pp. 3945-3948
pp. 4013,4014,4015,4016,4017,4018,4019,4020,4021,4022,4023,4024,4025,4026,4027,4028,4029,4030,4031,4032,4033,4034,4035,4036,4037,4038,4039,4040,4041,4042,4043,4044,4045,4046,4047,4048,4049,4050,4051,4052,4053
Rongzhen Yang , Intel China Software Lab, Shanghai, China
pp. 3953-3955
T. Fabricius , Dept. for Math. Modelling, Tech. Univ. Denmark, Lyngby, Denmark
pp. 3957-3960
R. Rajagopal , Nat. Instrum. Corp., Austin, TX, USA
pp. 3961-3964
N. Boston , Dept. of Math., Illinois Univ., Urbana, IL, USA
pp. 3965-3967
Seungsin Lee , Dept. of Electr. Eng., Rochester Inst. of Technol., NY, USA
pp. 3969-3972
V. Krishnamurthy , Dept. of Electr. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 3973-3976
T.K. Moon , Dept. of Electr. & Comput. Eng., Utah State Univ., Logan, UT, USA
pp. 3977-3980
J.A. Gubner , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 3981-3984
D. Kouame , LUSSI, GIP Ultrasons, Tours, France
pp. 3989-3992
W. Fong , Signal Process. Group, Cambridge Univ., UK
pp. 3997-4000
J.H. Manton , Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 4001-4004
M. Hawkes , Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
pp. 4005-4008
S. Attallah , Centre for Wireless Commun., Nat. Univ. of Singapore, Singapore
pp. 4009-4012
Author lndex (Abstract)
pp. 4055-4068
17 ms
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