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  • Acoustics, Speech, and Signal Processing, 2001 Vol 6. 2001 IEEE International Conference on
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Acoustics, Speech, and Signal Processing, 2001 Vol 6. 2001 IEEE International Conference on
Salt Lake City, UT, USA
May 07-May 11
ISBN: 0-7803-7041-4
Table of Contents
S.A. Mandayam, Dept. of Electr. & Comput. Eng., Rowan Univ., Glassboro, NJ, USA
pp. 3397-3400
U. Qidwai, Dept. of Electr. & Comput. Eng., Massachusetts Univ., Dartmouth, MA, USA
pp. 3405-3408
M.J. Coates, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 3409-3412
Meng-Fu Shih, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3421-3424
D.J. Anderson, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3433-3436
V. Solo, Sch. of Electr. Eng., New South Wales Univ., Sydney, NSW, Australia
pp. 3441-3444
K.A. Moxon, Sch. of Biomed. Eng., Drexel Univ., Philadelphia, PA, USA
pp. 3445-3448
D.K. Eddington, Cochlear Implant Res. Lab., Massachusetts Eye & Ear Infirmary, Boston, MA, USA
pp. 3449-3452
Ching-Hsiang Tseng, Dept. of Electr. Eng., Nat. Taiwan Ocean Univ., Keelung, Taiwan
pp. 3457-3460
J.H. Kotecha, Dept. of Electr. & Comput. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 3465-3468
C. Pantaleon, Dpto. Ing. Comunicaciones, ETSII y Telecom, Cantabria Univ., Santander, Spain
pp. 3477-3480
D. Dimitriadis, Dept. of Electr. & Comput. Eng., Nat. Tech. Univ. of Athens, Greece
pp. 3481-3484
S. Oraintara, Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
pp. 3485-3488
Y. Nakada, Dept. of Electr., Electron. & Comput. Eng., Waseda Univ., Tokyo, Japan
pp. 3509-3512
A. Taleb, Sch. of Electr. & Comput. Eng., Curtin Univ. of Technol., Perth, WA, Australia
pp. 3513-3516
A. Akan, Dept. of Electron. Eng., Istanbul Univ., Turkey
pp. 3529-3532
D.S. Roberts, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 3533-3536
Harmonic transform (Abstract)
Feng Zhang, Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
pp. 3537-3540
S. Aviyente, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3549-3552
B. Barkat, Sch. of Electr. & Comput. Eng., Curtin Univ. of Technol., Perth, WA, Australia
pp. 3561-3564
Weifeng Mu, Dept. of Electr. & Comput. Eng., Villanova Univ., PA, USA
pp. 3577-3580
Linh-Trung Nguyen, Signal Process. Res. Centre, Queensland Univ., Brisbane, Qld., Australia
pp. 3597-3600
D. Marelli, Dept. of Electr. & Comput. Eng., Newcastle Univ., NSW, Australia
pp. 3601-3604
A. Mertins, Dept. of Electr. Comput. & Tele. Eng., Wollongong Univ., NSW, Australia
pp. 3605-3608
A. Hjorungnes, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 3609-3612
K. Attakitmongcol, Sch. of Electr. Eng., Suranaree Univ. of Technol., Nakhon Rachasima, Thailand
pp. 3613-3616
C. Popeea, Dept. of Control & Comput., Bucharest Politechnica Univ., Romania
pp. 3629-3632
B. Vrcelj, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 3637-3640
M.N. Do, Lab. for Audio-Visual Commun., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 3641-3644
N.F. Law, Dept. of Electron. & Inf. Eng., Hong Kong Polytech. Univ., China
pp. 3649-3652
R.F. Von Borries, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 3657-3660
S. Akkarakaran, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 3661-3664
H. Ozkaramanli, Dept. of Electr. & Electron. Eng., Eastern Mediterranean Univ., Mersin, Turkey
pp. 3665-3668
G. Parker, Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 3669-3672
S. Durand, CMLA, Ecole Normale Superieure de Cachan, France
pp. 3685-3688
I.W. Selesnick, Dept. of Electr. & Electron. Eng., Hong Kong Univ., China
pp. 3697-3700
A. Oakman, Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3717-3720
L.S. Resende, Univ. Federal de Santa Catarina, Florianopolis, Brazil
pp. 3729-3732
S. Werner, Lab. of Signal Process., Helsinki Univ. of Technol., Espoo, Finland
pp. 3745-3748
N.G. Chernoguz, TAMAM, Israel Aircraft Ind., Yahud, Israel
pp. 3749-3752
K. Kusaba, Inf. Technol. R&D Center, Mitsubishi Electr. Corp., Kamakura, Japan
pp. 3761-3764
O. Vainio, Dept. of Inf. Technol., Tampere Univ. of Technol., Finland
pp. 3765-3768
R. Merched, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3789-3792
C.S. MacInnes, Appl. Res. Lab., Texas Univ., Austin, TX, USA
pp. 3793-3796
W. Lertniphonphun, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 3801-3804
N.C. Griswold, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 3809-3812
T.N. Davidson, Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 3813-3816
B. Alkire, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3821-3824
C. Guimaraes Lopes, Dept. of Electr. Eng., Univ. Federal de Santa Catarina, Florianapolis, Brazil
pp. 3845-3848
M. Godavarti, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3857-3860
T.Y. Al-Naffouri, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 3869-3872
A.H. Sayed, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3873-3876
P.P. Vaidyanathan, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 3897-3900
B. Beferull-Lozano, Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
pp. 3901-3904
M.J. Borran, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 3925-3928
V. Solo, Sch. of Electr. Eng., New South Wales Univ., Sydney, NSW, Australia
pp. 3929-3932
S.F. Cotter, Dept. of Comput. Sci. & Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 3933-3936
N. Boston, Dept. of Math., Illinois Univ., Urbana, IL, USA
pp. 3965-3967
T.K. Moon, Dept. of Electr. & Comput. Eng., Utah State Univ., Logan, UT, USA
pp. 3977-3980
J.H. Manton, Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 4001-4004
M. Hawkes, Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
pp. 4005-4008
S. Attallah, Centre for Wireless Commun., Nat. Univ. of Singapore, Singapore
pp. 4009-4012
Author lndex (Abstract)
pp. 4055-4068
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