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2001 IEEE International Conference on Acoustics, Speech, and Signal Processing. Proceedings (2001)
Salt Lake City, UT, USA
May 7, 2001 to May 11, 2001
ISBN: 0-7803-7041-4
TABLE OF CONTENTS
D. Jacoby , Dept. of Electr. Eng., Inst. of Technol. of Buenos Aires, Argentina
pp. 2689-2692
M.G. Morrow , Dept. of Electr. Eng., US Naval Acad., MD, USA
pp. 2693-2696
A. Asif , Tech. Univ. of British Colombia, Surrey, BC, Canada
pp. 2697-2700
D.L. Jones , Univ. of Illinois at Urbana-Champaign, IL, USA
pp. 2701-2704
E. Sayrol , Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 2705-2708
S.L. Wood , Dept. of Electr. Eng., Santa Clara Univ., CA, USA
pp. 2713-2716
J.W. Pierre , Dept. of Electr. Eng., Wyoming Univ., Laramie, WY, USA
pp. 2725-2728
H. Saruwatari , Graduate Sch. of Inf. Sci., Nara Inst. of Sci. & Technol., Japan
pp. 2733-2736
Y. Deville , Lab. d'Acoustique, de Metrologie, d'Instrumentation, Univ. Paul Sabatier, Toulouse, France
pp. 2741-2744
K. Rahbar , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 2745-2748
P. Comon , I3S, Sophia-Antipolis, France
pp. 2749-2752
X. Sun , Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
pp. 2753-2756
M.Z. Ikram , Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2757-2760
M. Handa , Course in Electron. Eng., Univ. of Electro-Communications, Tokyo, Japan
pp. 2761-2764
J.-C. Pesquet , Lab. Systemes de Commun., Univ. de Marne-la-Vallee, Marne la Vallee, France
pp. 2765-2768
A.-J. van der Veen , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 2773-2776
H. Mathis , Signal & Inf. Process. Lab., Swiss Fed. Inst. of Technol., Zurich, Switzerland
pp. 2777-2780
M. Solazzi , Dipt. di Elettronica e Autom., Ancona Univ., Italy
pp. 2781-2784
A. Belouchrani , Elec. Eng. Dept, Ecole Nationale Polytechnique, Algiers, Algeria
pp. 2789-2792
M. Joho , Signal & Inf. Process. Lab., Swiss Fed. Inst. of Technol., Zurich, Switzerland
pp. 2793-2796
R. Zhang , Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
pp. 2797-2800
A. Ossadtchi , Dept. of Electr. & Comput. Eng., Univ. of Southern California, Los Angeles, CA, USA
pp. 2801-2804
E. Moreau , SIS, ISITV, Univ. Toulon et du Var, La Valette du Var, France
pp. 2805-2808
N. Bienati , Dip. Elettronica e Informazione, Politecnico di Milano, Italy
pp. 2809-2812
K.G. Oweiss , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2813-2816
V. Cevher , Sch. of Electron. & Comput. Eng., Georgia Tech., Atlanta, GA, USA
pp. 2817-2820
W. Ng , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 2821-2824
M.G.S. Bruno , Electr. Eng. Dept., Univ. of Sao Paulo, Brazil
pp. 2825-2828
J. Lee , Dept. of Electron. Eng., Korea Univ., Seoul, South Korea
pp. 2829-2832
F. Gustafsson , Dept. of Electr. Eng., Linkoping Univ., Sweden
pp. 2833-2836
Y.C. Eldar , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 2837-2840
Y. Dong , Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
pp. 2841-2844
A.G. Jaffer , Raytheon Electron. Syst., Los Angeles, CA, USA
pp. 2845-2848
I.P. Kirsteins , Naval Undersea Warfare Center, Newport, RI, USA
pp. 2849-2852
E. Conte , Dip. di Ingegneria Elettronica e delle Telecomunicazioni, Universita degli Studi di Napoli "Federico II", Italy
pp. 2853-2856
P.J. Green , Dept. of Electr. & Electron. Eng., Canterbury Univ., Christchurch, New Zealand
pp. 2861-2864
M. Suzuki , Res. Inst. for Electron. Sci., Hokkaido Univ., Sapporo, Japan
pp. 2865-2868
N. Nagai , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2869-2872
J. Eriksson , Ericsson Microwave Syst. AB, Molndal, Sweden
pp. 2873-2876
P. Gulden , Ericsson Microwave Syst. AB, Molndal, Sweden
pp. 2877-2880
E. Elsehely , Electron. Eng. Lab., Kent Univ., Canterbury, UK
pp. 2881-2884
Xuejun Liao , Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
pp. 2897-2900
R.H. Anderson , Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
pp. 2901-2904
P. Parker , Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 2909-2912
Z. Shutao , Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
pp. 2913-2916
M. Kajala , Speech & Audio Syst. Lab., Nokia Res. Center, Tampere, Finland
pp. 2917-2920
R.J. Vaccaro , Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 2921-2924
F. Wang , Adv. Radio Technology, NSS, Motorola Inc., Arlington Heights, IL, USA
pp. 2925-2928
T.R. Kurpjuhn , Inst. for Circuit Theor. & Signal Process., Technische Univ. Munchen, Munich, Germany
pp. 2929-2932
G. Gelli , Dipt. di Ingegneria Elettronica e de'lle Telecomunicazioni, Universita degli Studi di Napoli Federico II, via Claudio, Italy
pp. 2933-2936
Qian Zhang , DSP Div., Analog Devices Inc., Norwood, MA, USA
pp. 2937-2940
Xinying Zhang , Princeton Univ., NJ, USA
pp. 2945-2948
B.D. Rao , Center for Wireless Commun., California Univ., San Diego, La Jolla, CA, USA
pp. 2949-2952
H.M. Jones , Res. Sch. of Inf., Australian Nat. Univ., Weston Creek, ACT, Australia
pp. 2953-2956
H. Boche , Heinrich Hertz Inst. for Commun. Technol., Berlin, Germany
pp. 2957-2960
M. Bengtsson , Signal Process., R. Inst. of Technol., Stockholm, Sweden
pp. 2961-2964
B.C. Banister , Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 2965-2968
S. Nagaraj , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2969-2972
Hang Li , Dept. of Electr. Eng., Texas Univ., Austin, TX, USA
pp. 2973-2976
T.A. Thomas , Motorola Inc., Schaumburg, IL, USA
pp. 2977-2980
O. Besson , Dept. of Avionics & Syst., ENSICA, Toulouse, France
pp. 2981-2984
P. Charge , Ecole polytechnique, Nantes Univ., France
pp. 2985-2988
A.B. Gershman , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 2989-2992
E.G. Larsson , Dept. of Electr. Eng. & Inf. Sci., Ruhr-Univ., Bochum, Germany
pp. 2993-2996
J. Ringelstein , Dept. of Electr. Eng. & Inf. Sci., Ruhr-Univ., Bochum, Germany
pp. 2997-3000
L.M. Kaplan , Dept. of Engineening, Clark Atlanta Univ., GA, USA
pp. 3001-3004
M. Pesavento , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 3005-3008
J.C. Chen , Electr. Eng. Dept., Univ. of California, Los Angeles, CA, USA
pp. 3013-3016
Qiyue Zou , Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
pp. 3025-3028
H. Kamiyanagida , Graduate Sch. of Inf. Sci., Nara Inst. of Sci. & Technol., Ikoma, Japan
pp. 3033-3036
Juan Liu , Beckman Inst., Univ. of Illinois, Urbana, IL, USA
pp. 3037-3040
T. Nagai , Course in Electron. Eng., Univ. of Electro-Communications, Tokyo, Japan
pp. 3041-3044
J.M. Sachar , Div. of Eng., Brown Univ., Providence, RI, USA
pp. 3049-3052
S.T. Birchfield , Quindi Corp., Palo Alto, CA, USA
pp. 3053-3056
K. Ghose , Auditory Neuroethology Lab., Maryland Univ., College Park, MD, USA
pp. 3057-3060
Jui-Chung Hung , Ling-Tung Coll., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 3061-3064
M.D. Macleod , Dept. of Eng., Cambridge Univ., UK
pp. 3065-3068
E.G. Larsson , Dept. of Syst. & Control, Uppsala Univ., Sweden
pp. 3069-3072
J.D. Klein , Conexant Syst., Inc., Newport Beach, CA, USA
pp. 3077-3080
H.H. Albrecht , Phys. Tech. Bundesanstalt, Berlin, Germany
pp. 3081-3084
Y. Birkelund , Phys. Dept., Tromso Univ., Norway
pp. 3085-3088
A. Tkacenko , Dept. of Electr. Eng., Caltech, Pasadena, CA, USA
pp. 3089-3092
Tao Jiang , Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 3093-3096
E.K. Larsson , Dept. of Syst. & Control, Uppsala Univ., Sweden
pp. 3097-3100
A.M. Zoubir , Australian Telecommun. Res. Inst., Curtin Univ. of Technol., Perth, WA, Australia
pp. 3101-3104
S. Saha , Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 3109-3112
Y.I. Abramovich , Surveillance Syst. Div. (SSD), Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 3113-3116
A. Cichocki , Lab. for Adv. Brain Signal Process., RIKEN, Saitama, Japan
pp. 3117-3120
G. Liao , Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, China
pp. 3121-3124
S. Bausson , Lab. des Images et des Signaux, ENSIEG, Grenoble, France
pp. 3125-3128
Chung-Chieh Lin , Dept. of Electr. & Comput. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 3129-3132
P. Giannopoulos , Dept. of Eng., Cambridge Univ., UK
pp. 3133-3136
R. Polikar , Dept. of Electr. & Comput. Eng., Rowan Univ., Glassboro, NJ, USA
pp. 3137-3140
H. Ocak , Dept. of Electr. Eng., Case Western Reserve Univ., Cleveland, OH, USA
pp. 3141-3144
S. Carstens-Behrens , Dept. of Electr. Eng. & Inf. Sci., Ruhr-Univ., Bochum, Germany
pp. 3145-3148
N. Keshava , Lincoln Lab., MIT, Lexington, MA, USA
pp. 3149-3152
D. Manolakis , Lincoln Lab., MIT, Lexington, MA, USA
pp. 3153-3156
M. Lundberg , Dept. of Signals & Syst., Chalmers Univ. of Technol., Sweden
pp. 3157-3160
N. Dasgupta , Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
pp. 3161-3164
F. Nicolls , Dept. of Electr. Eng., Cape Town Univ., Rondebosch, South Africa
pp. 3165-3168
N. Erdol , Florida Atlantic Univ., FL, USA
pp. 3169-3172
M. Ordowski , Center for Language & Speech Process., Johns Hopkins Univ., Baltimore, MD, USA
pp. 3173-3176
M. Coulon , INP-ENSEEIHT, TESA, Toulouse, France
pp. 3177-3180
Zhen Wang , Connecticut Univ., Storrs, CT, USA
pp. 3181-3184
E. Fishler , Dept. of Electr. Eng.-Syst., Tel Aviv Univ., Israel
pp. 3185-3188
P. Willett , Connecticut Univ., Storrs, CT, USA
pp. 3193-3196
L.K. Hansen , Dept. for Math. Modelling, Tech. Univ. of Denmark, Lyngby, Denmark
pp. 3197-3200
K. Ghartey , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 3201-3204
D. Cochran , Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., China
pp. 3205-3208
M. O'Brien , Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., China
pp. 3209-3212
P.A.C. Lopes , Inst. Superior Tecnico, Tech. Univ. Lisbon, Portugal
pp. 3213-3216
Y. Kajikawa , Dept. of Electron., Kansai Univ., Osaka, Japan
pp. 3217-3220
F. Yu , Sch. of Inf. Technol. & Eng., Ottawa Univ., Ont., Canada
pp. 3221-3224
M. de Diego , Dept. of Comunicaciones, Univ. Politecnica de Valencia, Spain
pp. 3225-3228
A. Sugiyama , Comput. & Commun. Media Res., NEC Corp., Kanagawa, Japan
pp. 3229-3232
T. Gansler , Lucent Technol. Bell Labs., Murray Hill, NJ, USA
pp. 3233-3236
T. Yensen , Dept. of Syst. & Comput. Eng., Carleton Univ., Ottawa, Ont., Canada
pp. 3237-3240
W. Herbordt , Telecommun. Lab., Erlangen-Nurnberg Univ., Erlangen, Germany
pp. 3241-3244
M. Jaidane , Sch. of Electron. & Electr. Eng., Kyungpook Nat. Univ., Taegu, South Korea
pp. 3249-3252
A.S. Scheuble , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 3257-3260
M. Covell , Interval Res. Corp., Palo Alto, CA, USA
pp. 3261-3264
F. Baumgarte , Multimedia Commun. Res. Lab., Lucent Technol. Bell Labs., Murray Hill, NJ, USA
pp. 3265-3268
A. Aggarwal , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 3269-3272
G. Schuller , Bell Labs., Murray Hill, NJ, USA
pp. 3273-3276
M.S. Vinton , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 3277-3280
R. Heusdens , Dept. of Mediamatics, Delft Univ. of Technol., Netherlands
pp. 3281-3284
R. Vafin , Dept. of Speech, Music & Hearing, R. Inst. of Technol., Stockholm, Sweden
pp. 3285-3288
L. Lin , Sch. of Electr. Eng. & Telecommun., New South Wales Univ., Sydney, NSW, Australia
pp. 3293-3296
H. Banno , Graduate Sch. of Eng., Nagoya Univ., Japan
pp. 3297-3300
C.Y. Choo , RealChip Commun., Sunnyvale, CA, USA
pp. 3301-3304
R. Duraiswami , Inst. for Adv. Comput. Studies, Maryland Univ., College Park, MD, USA
pp. 3309-3312
T. Paatero , Lab. of Acoust. & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland
pp. 3313-3316
Wang Peng , Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
pp. 3317-3320
V. Emamian , Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 3321-3324
Y.I. Fujisaka , Dept. of Inf., Kogakuin Univ., Tokyo, Japan
pp. 3325-3328
M. Davy , Dept. of Eng., Cambridge Univ., UK
pp. 3329-3332
T. Horiuchi , Nagaoka Univ. of Technol., Niigata, Japan
pp. 3333-3336
N.A. Gumerov , Inst. for Adv. Comput. Studies, Maryland Univ., College Park, MD, USA
pp. 3337-3340
C.J. Liu , Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 3341-3344
L. Savioja , Telecommun. Software & Multimedia Lab., Helsinki Univ. of Technol., Espoo, Finland
pp. 3345-3348
F. Orduna-Bustamante , Centro de Instrumentos, Univ. Nacional Autonoma de Mexico, Mexico D.F., Mexico
pp. 3349-3352
N. Tsingos , Dept. of Visual Commun. Res., Lucent Technol. Bell Labs., Murray Hill, NJ, USA
pp. 3353-3356
Jong-soong Lim , Immersive Audio Lab., Univ. of Southern California, Los Angeles, CA, USA
pp. 3357-3360
G. Garcia , Creative Adv. Technol. Center, Scotts Valley, CA, USA
pp. 3369-3372
S.H. Nawab , ECE Dept., Boston Univ., MA, USA
pp. 3373-3376
Borching Su , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 3377-3380
A.P. Klapuri , Tampere Univ. of Technol., Finland
pp. 3381-3384
L. Trautmann , Telecommun. Lab., Univ. of Erlangen-Nuremberg, Erlangen, Germany
pp. 3385-3388
M. Afzal , Broadband Test Div., Teradyne Inc., Deerfield, IL, USA
pp. 3389-3392vol.6
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