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- ICASSP
- 2001
- Acoustics, Speech, and Signal Processing, 2001 Vol 5. 2001 IEEE International Conference on
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Acoustics, Speech, and Signal Processing, 2001 Vol 5. 2001 IEEE International Conference on Salt Lake City, UT, USA May 07-May 11 ISBN: 0-7803-7041-4 Table of Contents
D. Jacoby, Dept. of Electr. Eng., Inst. of Technol. of Buenos Aires, Argentina pp. 2689-2692
M.G. Morrow, Dept. of Electr. Eng., US Naval Acad., MD, USA pp. 2693-2696
A. Asif, Tech. Univ. of British Colombia, Surrey, BC, Canada pp. 2697-2700
D.L. Jones, Univ. of Illinois at Urbana-Champaign, IL, USA pp. 2701-2704
E. Sayrol, Univ. Politecnica de Catalunya, Barcelona, Spain pp. 2705-2708
G.C. Orsak, Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA pp. 2709-2712
S.L. Wood, Dept. of Electr. Eng., Santa Clara Univ., CA, USA pp. 2713-2716
A. Spanias, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA pp. 2717-2720
J. Jackson, Georgia Inst. of Technol., Atlanta, GA, USA pp. 2721-2724
J.W. Pierre, Dept. of Electr. Eng., Wyoming Univ., Laramie, WY, USA pp. 2725-2728
F. Asano, Electrotechnical Lab., Tokyo, Japan pp. 2729-2732
H. Saruwatari, Graduate Sch. of Inf. Sci., Nara Inst. of Sci. & Technol., Japan pp. 2733-2736
S. Araki, NTT Commun. Sci. Labs., Kyoto, Japan pp. 2737-2740
Y. Deville, Lab. d'Acoustique, de Metrologie, d'Instrumentation, Univ. Paul Sabatier, Toulouse, France pp. 2741-2744
K. Rahbar, Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada pp. 2745-2748
X. Sun, Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA pp. 2753-2756
M.Z. Ikram, Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA pp. 2757-2760
M. Handa, Course in Electron. Eng., Univ. of Electro-Communications, Tokyo, Japan pp. 2761-2764
J.-C. Pesquet, Lab. Systemes de Commun., Univ. de Marne-la-Vallee, Marne la Vallee, France pp. 2765-2768
M.G. Jafari, Dept. of Electr. Electron. Eng., Imperial Coll., London, UK pp. 2769-2772
H. Mathis, Signal & Inf. Process. Lab., Swiss Fed. Inst. of Technol., Zurich, Switzerland pp. 2777-2780
M. Solazzi, Dipt. di Elettronica e Autom., Ancona Univ., Italy pp. 2781-2784
A. Belouchrani, Elec. Eng. Dept, Ecole Nationale Polytechnique, Algiers, Algeria pp. 2789-2792
M. Joho, Signal & Inf. Process. Lab., Swiss Fed. Inst. of Technol., Zurich, Switzerland pp. 2793-2796
R. Zhang, Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA pp. 2797-2800
A. Ossadtchi, Dept. of Electr. & Comput. Eng., Univ. of Southern California, Los Angeles, CA, USA pp. 2801-2804
E. Moreau, SIS, ISITV, Univ. Toulon et du Var, La Valette du Var, France pp. 2805-2808
N. Bienati, Dip. Elettronica e Informazione, Politecnico di Milano, Italy pp. 2809-2812
K.G. Oweiss, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA pp. 2813-2816
V. Cevher, Sch. of Electron. & Comput. Eng., Georgia Tech., Atlanta, GA, USA pp. 2817-2820
W. Ng, Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada pp. 2821-2824
M.G.S. Bruno, Electr. Eng. Dept., Univ. of Sao Paulo, Brazil pp. 2825-2828
J. Lee, Dept. of Electron. Eng., Korea Univ., Seoul, South Korea pp. 2829-2832
Y.C. Eldar, Res. Lab. of Electron., MIT, Cambridge, MA, USA pp. 2837-2840
Y. Dong, Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA pp. 2841-2844
A.G. Jaffer, Raytheon Electron. Syst., Los Angeles, CA, USA pp. 2845-2848
E. Conte, Dip. di Ingegneria Elettronica e delle Telecomunicazioni, Universita degli Studi di Napoli "Federico II", Italy pp. 2853-2856
P.J. Green, Dept. of Electr. & Electron. Eng., Canterbury Univ., Christchurch, New Zealand pp. 2861-2864
M. Suzuki, Res. Inst. for Electron. Sci., Hokkaido Univ., Sapporo, Japan pp. 2865-2868
N. Nagai, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA pp. 2869-2872
J. Eriksson, Ericsson Microwave Syst. AB, Molndal, Sweden pp. 2873-2876
P. Gulden, Ericsson Microwave Syst. AB, Molndal, Sweden pp. 2877-2880
E. Elsehely, Electron. Eng. Lab., Kent Univ., Canterbury, UK pp. 2881-2884
M.R. Cowper, Signals & Syst. Res. Group, Edinburgh Univ., UK pp. 2885-2888
Yide Wang, Ecole Polytechnique, Nantes Univ., France pp. 2893-2896
Xuejun Liao, Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA pp. 2897-2900
R.H. Anderson, Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA pp. 2901-2904
S. Vasudevan, Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA pp. 2905-2908
P. Parker, Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA pp. 2909-2912
Z. Shutao, Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore pp. 2913-2916
M. Kajala, Speech & Audio Syst. Lab., Nokia Res. Center, Tampere, Finland pp. 2917-2920
R.J. Vaccaro, Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA pp. 2921-2924
F. Wang, Adv. Radio Technology, NSS, Motorola Inc., Arlington Heights, IL, USA pp. 2925-2928
T.R. Kurpjuhn, Inst. for Circuit Theor. & Signal Process., Technische Univ. Munchen, Munich, Germany pp. 2929-2932
G. Gelli, Dipt. di Ingegneria Elettronica e de'lle Telecomunicazioni, Universita degli Studi di Napoli Federico II, via Claudio, Italy pp. 2933-2936
Qian Zhang, DSP Div., Analog Devices Inc., Norwood, MA, USA pp. 2937-2940
B.D. Rao, Center for Wireless Commun., California Univ., San Diego, La Jolla, CA, USA pp. 2949-2952
H.M. Jones, Res. Sch. of Inf., Australian Nat. Univ., Weston Creek, ACT, Australia pp. 2953-2956
H. Boche, Heinrich Hertz Inst. for Commun. Technol., Berlin, Germany pp. 2957-2960
M. Bengtsson, Signal Process., R. Inst. of Technol., Stockholm, Sweden pp. 2961-2964
B.C. Banister, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA pp. 2965-2968
S. Nagaraj, Dept. of Electr. Eng., Notre Dame Univ., IN, USA pp. 2969-2972
Hang Li, Dept. of Electr. Eng., Texas Univ., Austin, TX, USA pp. 2973-2976
O. Besson, Dept. of Avionics & Syst., ENSICA, Toulouse, France pp. 2981-2984
P. Charge, Ecole polytechnique, Nantes Univ., France pp. 2985-2988
A.B. Gershman, Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada pp. 2989-2992
E.G. Larsson, Dept. of Electr. Eng. & Inf. Sci., Ruhr-Univ., Bochum, Germany pp. 2993-2996
J. Ringelstein, Dept. of Electr. Eng. & Inf. Sci., Ruhr-Univ., Bochum, Germany pp. 2997-3000
L.M. Kaplan, Dept. of Engineening, Clark Atlanta Univ., GA, USA pp. 3001-3004
M. Pesavento, Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada pp. 3005-3008
J.C. Chen, Electr. Eng. Dept., Univ. of California, Los Angeles, CA, USA pp. 3013-3016
V. Galanenko, Scientific-Production Enterprise "DELTA", Kiev, Ukraine pp. 3017-3020
Qiyue Zou, Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore pp. 3025-3028
H. Kamiyanagida, Graduate Sch. of Inf. Sci., Nara Inst. of Sci. & Technol., Ikoma, Japan pp. 3033-3036
Juan Liu, Beckman Inst., Univ. of Illinois, Urbana, IL, USA pp. 3037-3040
T. Nagai, Course in Electron. Eng., Univ. of Electro-Communications, Tokyo, Japan pp. 3041-3044
H. Tanaka, Dept. EECE, Waseda Univ., Tokyo, Japan pp. 3045-3048
J.M. Sachar, Div. of Eng., Brown Univ., Providence, RI, USA pp. 3049-3052
K. Ghose, Auditory Neuroethology Lab., Maryland Univ., College Park, MD, USA pp. 3057-3060
Jui-Chung Hung, Ling-Tung Coll., Nat. Tsing Hua Univ., Hsinchu, Taiwan pp. 3061-3064
E.G. Larsson, Dept. of Syst. & Control, Uppsala Univ., Sweden pp. 3069-3072
J.D. Klein, Conexant Syst., Inc., Newport Beach, CA, USA pp. 3077-3080
A. Tkacenko, Dept. of Electr. Eng., Caltech, Pasadena, CA, USA pp. 3089-3092
Tao Jiang, Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA pp. 3093-3096
E.K. Larsson, Dept. of Syst. & Control, Uppsala Univ., Sweden pp. 3097-3100
A.M. Zoubir, Australian Telecommun. Res. Inst., Curtin Univ. of Technol., Perth, WA, Australia pp. 3101-3104
S. Saha, Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA pp. 3109-3112
Y.I. Abramovich, Surveillance Syst. Div. (SSD), Defence Sci. & Technol. Organ., Salisbury, SA, Australia pp. 3113-3116
A. Cichocki, Lab. for Adv. Brain Signal Process., RIKEN, Saitama, Japan pp. 3117-3120
G. Liao, Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, China pp. 3121-3124
S. Bausson, Lab. des Images et des Signaux, ENSIEG, Grenoble, France pp. 3125-3128
Chung-Chieh Lin, Dept. of Electr. & Comput. Eng., State Univ. of New York, Stony Brook, NY, USA pp. 3129-3132
R. Polikar, Dept. of Electr. & Comput. Eng., Rowan Univ., Glassboro, NJ, USA pp. 3137-3140
H. Ocak, Dept. of Electr. Eng., Case Western Reserve Univ., Cleveland, OH, USA pp. 3141-3144
M. Lundberg, Dept. of Signals & Syst., Chalmers Univ. of Technol., Sweden pp. 3157-3160
N. Dasgupta, Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA pp. 3161-3164
F. Nicolls, Dept. of Electr. Eng., Cape Town Univ., Rondebosch, South Africa pp. 3165-3168
N. Erdol, Florida Atlantic Univ., FL, USA pp. 3169-3172
M. Ordowski, Center for Language & Speech Process., Johns Hopkins Univ., Baltimore, MD, USA pp. 3173-3176
M. Coulon, INP-ENSEEIHT, TESA, Toulouse, France pp. 3177-3180
Zhen Wang, Connecticut Univ., Storrs, CT, USA pp. 3181-3184
E. Fishler, Dept. of Electr. Eng.-Syst., Tel Aviv Univ., Israel pp. 3185-3188
L.K. Hansen, Dept. for Math. Modelling, Tech. Univ. of Denmark, Lyngby, Denmark pp. 3197-3200
K. Ghartey, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA pp. 3201-3204
D. Cochran, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., China pp. 3205-3208
M. O'Brien, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., China pp. 3209-3212
P.A.C. Lopes, Inst. Superior Tecnico, Tech. Univ. Lisbon, Portugal pp. 3213-3216
Y. Kajikawa, Dept. of Electron., Kansai Univ., Osaka, Japan pp. 3217-3220
F. Yu, Sch. of Inf. Technol. & Eng., Ottawa Univ., Ont., Canada pp. 3221-3224
M. de Diego, Dept. of Comunicaciones, Univ. Politecnica de Valencia, Spain pp. 3225-3228
A. Sugiyama, Comput. & Commun. Media Res., NEC Corp., Kanagawa, Japan pp. 3229-3232
T. Gansler, Lucent Technol. Bell Labs., Murray Hill, NJ, USA pp. 3233-3236
T. Yensen, Dept. of Syst. & Comput. Eng., Carleton Univ., Ottawa, Ont., Canada pp. 3237-3240
W. Herbordt, Telecommun. Lab., Erlangen-Nurnberg Univ., Erlangen, Germany pp. 3241-3244
M. Jaidane, Sch. of Electron. & Electr. Eng., Kyungpook Nat. Univ., Taegu, South Korea pp. 3249-3252
A.S. Scheuble, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA pp. 3257-3260
M. Covell, Interval Res. Corp., Palo Alto, CA, USA pp. 3261-3264
F. Baumgarte, Multimedia Commun. Res. Lab., Lucent Technol. Bell Labs., Murray Hill, NJ, USA pp. 3265-3268
A. Aggarwal, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA pp. 3269-3272
M.S. Vinton, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA pp. 3277-3280
R. Heusdens, Dept. of Mediamatics, Delft Univ. of Technol., Netherlands pp. 3281-3284
R. Vafin, Dept. of Speech, Music & Hearing, R. Inst. of Technol., Stockholm, Sweden pp. 3285-3288
L. Lin, Sch. of Electr. Eng. & Telecommun., New South Wales Univ., Sydney, NSW, Australia pp. 3293-3296
H. Banno, Graduate Sch. of Eng., Nagoya Univ., Japan pp. 3297-3300
C.Y. Choo, RealChip Commun., Sunnyvale, CA, USA pp. 3301-3304
L.G. Huettel, Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA pp. 3305-3308
R. Duraiswami, Inst. for Adv. Comput. Studies, Maryland Univ., College Park, MD, USA pp. 3309-3312
T. Paatero, Lab. of Acoust. & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland pp. 3313-3316
Wang Peng, Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore pp. 3317-3320
V. Emamian, Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA pp. 3321-3324
M. Davy, Dept. of Eng., Cambridge Univ., UK pp. 3329-3332
N.A. Gumerov, Inst. for Adv. Comput. Studies, Maryland Univ., College Park, MD, USA pp. 3337-3340
C.J. Liu, Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan pp. 3341-3344
L. Savioja, Telecommun. Software & Multimedia Lab., Helsinki Univ. of Technol., Espoo, Finland pp. 3345-3348
F. Orduna-Bustamante, Centro de Instrumentos, Univ. Nacional Autonoma de Mexico, Mexico D.F., Mexico pp. 3349-3352
N. Tsingos, Dept. of Visual Commun. Res., Lucent Technol. Bell Labs., Murray Hill, NJ, USA pp. 3353-3356
Jong-soong Lim, Immersive Audio Lab., Univ. of Southern California, Los Angeles, CA, USA pp. 3357-3360
S. Basu, Media Lab., MIT, Cambridge, MA, USA pp. 3361-3364
M. Goto, PRESTO, Japan Sci. & Technol. Corp., Tsukuba, Japan pp. 3365-3368
G. Garcia, Creative Adv. Technol. Center, Scotts Valley, CA, USA pp. 3369-3372
Borching Su, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan pp. 3377-3380
L. Trautmann, Telecommun. Lab., Univ. of Erlangen-Nuremberg, Erlangen, Germany pp. 3385-3388
M. Afzal, Broadband Test Div., Teradyne Inc., Deerfield, IL, USA pp. 3389-3392vol.6 Usage of this product signifies your acceptance of the Terms of Use.
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