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Acoustics, Speech, and Signal Processing, 2001 Vol 5. 2001 IEEE International Conference on
Salt Lake City, UT, USA
May 07-May 11
ISBN: 0-7803-7041-4
Table of Contents
D. Jacoby, Dept. of Electr. Eng., Inst. of Technol. of Buenos Aires, Argentina
pp. 2689-2692
A. Asif, Tech. Univ. of British Colombia, Surrey, BC, Canada
pp. 2697-2700
D.L. Jones, Univ. of Illinois at Urbana-Champaign, IL, USA
pp. 2701-2704
Y. Deville, Lab. d'Acoustique, de Metrologie, d'Instrumentation, Univ. Paul Sabatier, Toulouse, France
pp. 2741-2744
M. Handa, Course in Electron. Eng., Univ. of Electro-Communications, Tokyo, Japan
pp. 2761-2764
A.-J. van der Veen, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 2773-2776
H. Mathis, Signal & Inf. Process. Lab., Swiss Fed. Inst. of Technol., Zurich, Switzerland
pp. 2777-2780
M. Joho, Signal & Inf. Process. Lab., Swiss Fed. Inst. of Technol., Zurich, Switzerland
pp. 2793-2796
R. Zhang, Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
pp. 2797-2800
E. Moreau, SIS, ISITV, Univ. Toulon et du Var, La Valette du Var, France
pp. 2805-2808
V. Cevher, Sch. of Electron. & Comput. Eng., Georgia Tech., Atlanta, GA, USA
pp. 2817-2820
J. Lee, Dept. of Electron. Eng., Korea Univ., Seoul, South Korea
pp. 2829-2832
Y.C. Eldar, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 2837-2840
E. Conte, Dip. di Ingegneria Elettronica e delle Telecomunicazioni, Universita degli Studi di Napoli "Federico II", Italy
pp. 2853-2856
P.J. Green, Dept. of Electr. & Electron. Eng., Canterbury Univ., Christchurch, New Zealand
pp. 2861-2864
N. Nagai, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2869-2872
P. Parker, Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 2909-2912
Z. Shutao, Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
pp. 2913-2916
M. Kajala, Speech & Audio Syst. Lab., Nokia Res. Center, Tampere, Finland
pp. 2917-2920
R.J. Vaccaro, Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 2921-2924
T.R. Kurpjuhn, Inst. for Circuit Theor. & Signal Process., Technische Univ. Munchen, Munich, Germany
pp. 2929-2932
G. Gelli, Dipt. di Ingegneria Elettronica e de'lle Telecomunicazioni, Universita degli Studi di Napoli Federico II, via Claudio, Italy
pp. 2933-2936
M. Bengtsson, Signal Process., R. Inst. of Technol., Stockholm, Sweden
pp. 2961-2964
K. Ghose, Auditory Neuroethology Lab., Maryland Univ., College Park, MD, USA
pp. 3057-3060
J.D. Klein, Conexant Syst., Inc., Newport Beach, CA, USA
pp. 3077-3080
A.M. Zoubir, Australian Telecommun. Res. Inst., Curtin Univ. of Technol., Perth, WA, Australia
pp. 3101-3104
S. Saha, Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 3109-3112
Y.I. Abramovich, Surveillance Syst. Div. (SSD), Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 3113-3116
G. Liao, Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, China
pp. 3121-3124
Chung-Chieh Lin, Dept. of Electr. & Comput. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 3129-3132
S. Carstens-Behrens, Dept. of Electr. Eng. & Inf. Sci., Ruhr-Univ., Bochum, Germany
pp. 3145-3148
M. Lundberg, Dept. of Signals & Syst., Chalmers Univ. of Technol., Sweden
pp. 3157-3160
M. Ordowski, Center for Language & Speech Process., Johns Hopkins Univ., Baltimore, MD, USA
pp. 3173-3176
E. Fishler, Dept. of Electr. Eng.-Syst., Tel Aviv Univ., Israel
pp. 3185-3188
L.K. Hansen, Dept. for Math. Modelling, Tech. Univ. of Denmark, Lyngby, Denmark
pp. 3197-3200
M. O'Brien, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., China
pp. 3209-3212
T. Yensen, Dept. of Syst. & Comput. Eng., Carleton Univ., Ottawa, Ont., Canada
pp. 3237-3240
F. Baumgarte, Multimedia Commun. Res. Lab., Lucent Technol. Bell Labs., Murray Hill, NJ, USA
pp. 3265-3268
A. Aggarwal, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 3269-3272
M.S. Vinton, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 3277-3280
R. Vafin, Dept. of Speech, Music & Hearing, R. Inst. of Technol., Stockholm, Sweden
pp. 3285-3288
L. Lin, Sch. of Electr. Eng. & Telecommun., New South Wales Univ., Sydney, NSW, Australia
pp. 3293-3296
R. Duraiswami, Inst. for Adv. Comput. Studies, Maryland Univ., College Park, MD, USA
pp. 3309-3312
T. Paatero, Lab. of Acoust. & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland
pp. 3313-3316
Wang Peng, Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
pp. 3317-3320
N.A. Gumerov, Inst. for Adv. Comput. Studies, Maryland Univ., College Park, MD, USA
pp. 3337-3340
L. Savioja, Telecommun. Software & Multimedia Lab., Helsinki Univ. of Technol., Espoo, Finland
pp. 3345-3348
F. Orduna-Bustamante, Centro de Instrumentos, Univ. Nacional Autonoma de Mexico, Mexico D.F., Mexico
pp. 3349-3352
N. Tsingos, Dept. of Visual Commun. Res., Lucent Technol. Bell Labs., Murray Hill, NJ, USA
pp. 3353-3356
Jong-soong Lim, Immersive Audio Lab., Univ. of Southern California, Los Angeles, CA, USA
pp. 3357-3360
L. Trautmann, Telecommun. Lab., Univ. of Erlangen-Nuremberg, Erlangen, Germany
pp. 3385-3388
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