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2001 IEEE International Conference on Acoustics, Speech, and Signal Processing. Proceedings (2001)
Salt Lake City, UT, USA
May 7, 2001 to May 11, 2001
ISBN: 0-7803-7041-4
TABLE OF CONTENTS
pp. A_1-A_14
J.C. Haartsen , Ericsson Res., Emmen, Netherlands
pp. 2029-2032
SeongHwan Cho , Dept. of Electr. Eng. & Comput. Sci., Massachusetts Inst. of Technol., Cambridge, MA, USA
pp. 2041-2044
H. Ali , Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 2053-2056
Hongbo Yan , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 2057-2060
R. Rajagopal , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 2077-2080
M. Corlay , ENST/TSI, Paris, France
pp. 2093-2096
Hongbo Yan , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 2097-2100
M.H. Jaward , Dept. of Autom. Control & Syst. Eng., Univ. of Sheffield, UK
pp. 2101-2104
H. Vikalo , Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 2105-2108
Min Dong , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 2109-2112
S. Chowdhury , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2113-2116
R. Amara , Lab. des Signaux et Systemes, CNRS-Supelec, Gif-sur-Yvette, France
pp. 2117-2120
Xiaohua Li , Dept. of Electron. Eng., State Univ. of New York, Binghamton, NY, USA
pp. 2121-2124
S. El Asmi , Dept. MASC, Supcom Tunis, Ariana, Tunisia
pp. 2133-2136
J. Xavier , Instituto de Sistemas e Robotica, Instituto Superior Tecnico, Lisboa, Portugal
pp. 2141-2144
A. Dogandzic , Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
pp. 2149-2152
H. Artes , Inst. of Commun. & Radio-Frequency Eng., Vienna Univ. of Technol., Austria
pp. 2153-2156
Yingbo Hua , Dept of EEE, Univ. of Melbourne, Vic., Australia
pp. 2157-2160
T. Ogunfunmi , Electr. Eng. Dept., Santa Clara Univ., CA, USA
pp. 2165-2168
B. Maricic , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 2169-2172
Y. Luo , Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 2173-2176
N.R. Yousef , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 2177-2180
K. Dogancay , Sch. of Electr. & Inf. Eng., Univ. of South Australia, Mawson Lakes, SA, Australia
pp. 2181-2184
Jinghong Ma , Dept. of Electr. & Comput. Eng., Auburn Univ., AL, USA
pp. 2185-2188
Kun Wang , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 2193-2196
X. Mestre , Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 2201-2204
S. Mo , American Microsystems Inc., Pocatello, ID, USA
pp. 2205-2208
J. Selva , Inst. for Commun. & Navigation, German Aerosp. Centre, Wessling, Germany
pp. 2209-2212
N. Petrochilos , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 2217-2220
R.A. Iltis , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 2229-2232
Zhengyuan Xu , Dept. of Electr. Eng., California Univ., Riverside, CA, USA
pp. 2249-2252
S. Chen , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 2253-2256
Wei Zha , Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont., Canada
pp. 2257-2260
L. Vandendorpe , Commun. & Remote Sensing Lab., Univ. Catholique de Louvain, Louvain-la-Neuve, Belgium
pp. 2261-2264
A.M. Chan , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 2265-2268
Jun Hu , EECS Dept., Lehigh Univ., Bethlehem, PA, USA
pp. 2269-2272
Yufei Huang , Dept. of Electr. & Comput. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 2273-2276
J.R. Fonollosa , Dept. of Signal Theor. & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 2281-2284
Yu Gong , Centre for Signal Process., Nanyang Technol. Univ., Singapore
pp. 2285-2288
Juinn-Horng Deng , Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 2289-2292
Shuguang Cui , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 2297-2300
G. Yin , Dept. of Math., Wayne State Univ., Detroit, MI, USA
pp. 2301-2304
Zigang Yang , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 2305-2308
Xuguang Lu , Dept. of Electr. Eng. & Comput. Sci., Stevens Inst. of Technol., Hoboken, NJ, USA
pp. 2313-2316
S. Prakriya , Dept. of Electr. Eng., Indian Inst. of Technol., New Delhi, India
pp. 2317-2320
Yongchul Song , Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
pp. 2325-2328
C.D. Lee , Inst. of Integrated Inf. Syst., Leeds Univ., UK
pp. 2329-2332
P. Marti i Puig , Signal Theor. & Commun., Univ. of Vic, Spain
pp. 2337-2340
X. Villares , Dept. of Signal Theor. & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 2345-2348
A. Lakhzouri , Telecommun. Lab., Tampere Univ. of Technol., Finland
pp. 2349-2352
B. Clerkin , Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
pp. 2353-2356
Yuan-Pei Lin , Dept. of Elec. & Control Engr., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 2357-2360
See-May Phoong , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 2361-2364
K. Van Acker , ESAT/SISTA, Katholieke Univ., Leuven, Belgium
pp. 2365-2368
A. Pandharipande , Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
pp. 2369-2372
T. Strohmer , Dept. of Math., California Univ., Davis, CA, USA
pp. 2373-2376
F. Abdelkefi , LSS SUPELEC, Gif-sur-Yvette, France
pp. 2381-2384
M. Debbah , Motorola Labs-Paris, Espace Technologique Saint-Aubin, Gif-sur-Yvette, France
pp. 2385-2388
Q.H. Spencer , Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 2397-2400
T. Karp , Dept. of ECE, Texas Tech. Univ., Lubbock, TX, USA
pp. 2401-2404
T. Miyagi , Fac. of Inf. Eng., Kyushu Inst. of Technol., Fukuoka, Japan
pp. 2413-2416
E.N. Onggosanusi , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 2421-2424
P. Stoica , Dept. of Syst. & Control, Uppsala Univ., Sweden
pp. 2425-2428
C.B. Peel , Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 2433-2436
D. Gore , Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 2441-2444
A. Paulraj , Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 2445-2448
A.C. McCormick , Dept. of Electron. & Electr. Eng., Edinburgh Univ., UK
pp. 2449-2452
Jianhua Liu , Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
pp. 2457-2460
B. Hassibi , Lucent Technol. Bell Labs., Murray Hill, NJ, USA
pp. 2461-2464
Z. Safar , Dept. of Electr. & Comput. Eng., Maryland Univ., College Park, MD, USA
pp. 2465-2468
Qing Yan , Dept. of Electr. Eng. & Comput. Sci., Lehigh Univ., Bethlehem, PA, USA
pp. 2469-2472
S. Sandhu , Packard 225, Stanford Univ., CA, USA
pp. 2473-2476
Tong Zhang , Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2477-2480
C.B. Papadias , Wireless Commun. Res. Dept., Lucent Technol. Bell Labs., Holmdel, NJ, USA
pp. 2481-2484
T. Svantesson , Dept. of Signals & Syst., Chalmers Univ. of Technol., Goteborg, Sweden
pp. 2485-2488
A.M. Sayeed , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 2489-2492
J.W. Wallace , Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 2497-2500
A. Abdi , Dept. of Electr. & Comp. Eng, Minnesota Univ., Minneapolis, MN, USA
pp. 2505-2508
A. Scaglione , Dept. of Electr. Eng. & Comput. Eng., New Mexico Univ., Albuquerque, NM, USA
pp. 2509-2511
D.R. Larocque , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 2513-2516
A.-G.P. Ziotopoulos , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2517-2520
C. Tepedelenlioglu , Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2521-2524
Ping Liu , Dept. of Electr. Eng., California Univ., Riverside, CA, USA
pp. 2529-2532
C. Lo , Electr. & Comput. Eng. Dept., Utah State Univ., Logan, UT, USA
pp. 2541-2544
A.-B. Salberg , Dept. of Phys., Tromso Univ., Norway
pp. 2549-2552
S. Lesage , ENSEEIHT/TeSA, Toulouse, France
pp. 2553-2556
J. Riba , Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 2561-2564
G. Ben-David , Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
pp. 2569-2572
P. Bunyaratavej , Dept. of Electr. Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 2573-2576
M.M. Abdallah , Dept. of Electr. & Comput. Eng., Maryland Univ., College Park, MD, USA
pp. 2577-2580
D. Declercq , ETIS ENSEA, Cergy-Pontoise, France
pp. 2585-2588
F. Palmieri , Dipt. di Ingegneria dell'Informazione, Universita di Napoli II, Rome, Italy
pp. 2589-2592
Jongtae Lim , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2593-2596
D. Mary , Inst. Eurecom, Sophia Antipolis, France
pp. 2597-2600
C.D. Giurcaneanu , Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 2601-2604
A. Vasilache , Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 2605-2608
F. Fekri , Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2609-2612
A. Bernard , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 2613-2616
R. Nygaard , Dept. of Electr. & Comput. Eng, Stavanger Univ. Coll., Norway
pp. 2617-2620
M.A. Aldajani , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 2621-2624
J. Shih , Dept. of Electr. Eng., Inf. Syst. Lab., Stanford, CA, USA
pp. 2629-2632
Zhongfeng Wang , MorphICs Technol. Inc., Campbell, CA, USA
pp. 2633-2636
Zhipei Chi , Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2637-2640
Xiaodong Wang , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 2641-2644
R. Perkert , Inst. for Commun. Eng. (LNT), Munich Univ. of Technol. (TUM), Germany
pp. 2649-2652
M. Adrat , Inst. of Commun. Syst. & Data Process., Aachen Univ. of Technol., Germany
pp. 2653-2656
M. Koca , Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA
pp. 2661-2664
Chunming Liu , Dept. of Electr. & Comput. Eng., Portland State Univ., OR, USA
pp. 2665-2668
Kin-Fai To , Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, China
pp. 2669-2672
R. Raich , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2673-2676
A. Scaglione , Dept. of Electr. Eng. & Comput. Eng., New Mexico Univ., Albuquerque, NM, USA
pp. 2681-2684