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  • Acoustics, Speech, and Signal Processing, 2001 Vol 1. 2001 IEEE International Conference on
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Acoustics, Speech, and Signal Processing, 2001 Vol 1. 2001 IEEE International Conference on
Salt Lake City, UT, USA
May 07-May 11
ISBN: 0-7803-7041-4
Table of Contents
L. Mangu, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 29-32
S. Molau, Lehrstuhl fur Inf. VI, Rheinisch-Westfalische Tech. Hochschule Aachen, Germany
pp. 73-76
W. Gunawan, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 77-80
B. Gajic, Sch. of Microelectron. Eng., Griffith Univ., Brisbane, Qld., Australia
pp. 85-88
P. Kabal, Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
pp. 97-100
Te-Won Lee, Computational Neurobiol. Lab., Salk Inst., La Jolla, CA, USA
pp. 105-108
K. Schnell, Inst. fur Angewandte Phys., Johann Wolfgang Goethe Univ., Frankfurt, Germany
pp. 109-112
L. Gu, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 125-128
T. Fukuda, Graduate School of Eng., Toyohashi Univ. of Technol., Japan
pp. 129-132
Xue-Wen Chen, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 153-156
C. Sanderson, Sch. of Microelectron. Eng., Griffith Univ., Brisbane, Qld., Australia
pp. 157-160
M. Heckmann, Inst. de la Commuinication Parlee, Inst. Nat. Polytech. de Grenoble, France
pp. 161-164
A.V. Barbosa, Center for Res. on Speech, Acoustics, Language & Music, Univ. Fed. de Minas Gerais, Belo Horizonte, Brazil
pp. 181-184
I.A. McCowan, Speech Res. Lab., Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 185-188
F. Jabloun, Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, Que., Canada
pp. 205-208
Hui Jiang, Multimedia Commun. Res. Lab., Lucent Technol. Bell Labs., Murray Hill, NJ, USA
pp. 217-220
M. Westphal, Interactive Syst. Labs., Karlsruhe Univ., Germany
pp. 221-224
M. Afify, Multimedia Commun. Res. Lab, Lucent Technol. Bell Labs., Murray Hill, NJ, USA
pp. 229-232
M.L. Shire, Int. Comput. Sci. Inst., Univ. of California at Berkeley, CA, USA
pp. 253-256
C. Barras, Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
pp. 265-268
K. Koumpis, Digital Signal Process. Group, Nokia Mobile Phones, Copenhagen, Denmark
pp. 277-280
R.W. Morris, Center for Signal & Image Processing, Georgia Inst. of Technol., Atlanta, GA, USA
pp. 289-292
S. Dharanipragada, Human Language Technol., IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 309-312
Jen-Tzung Chien, Dept. of Comput. Sci. & Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 329-332
H. Erdoan, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 333-336
S. Furui, Dept. of Comput. Sci., Tokyo Inst. of Technol., Japan
pp. 365-368
C.S. Lai, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
pp. 377-380
A. Petry, Instituto de Informatica, Univ. Fed. do Rio Grande do Sul, Porto Alegre, Brazil
pp. 405-408
S. Fine, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 417-420
M. Faundez-Zanuy, Escola Universitaria Politecnica de Mataro, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 453-456
Bing Xiang, Sch. of Electr. Eng. & Comput. Eng., Cornell Univ., Ithaca, NY, USA
pp. 509-512
F. Lefevre, Lab. d'Inf. pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
pp. 521-524
Xiaojin Zhu, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 533-536
Shan He, Dept. of Electr. Eng., Shanghai Jiaotong Univ., China
pp. 581-584
Xiaojun Wu, Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
pp. 617-620
R. Vetter, Centre Suisse d'Electronique et de Microtech., Neuchfitel, Switzerland
pp. 641-644
Author Index (Abstract)
pp. a-1-a-14
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