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Acoustics, Speech, and Signal Processing, IEEE International Conference on (2000)
Istanbul, Turkey
June 5, 2000 to June 9, 2000
ISBN: 0-7803-6293-4
TABLE OF CONTENTS
Author Index (Abstract)
pp. A1-A11
N.D. Sidiropoulos , Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
pp. 2449-2452
A.-J. van der Veen , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 2453-2456
Mindi Sheng , Dept. of Electron. Comput. & Eng. Comput. Sci., Cincinnati Univ., OH, USA
pp. 2457-2460
Jie Zhu , Center for Signal Process., Nanyang Technol. Inst., Singapore
pp. 2465-2468
V. Krishnamurthy , Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 2469-2472
Yu Gong , Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore
pp. 2473-2476
S. Lasaulce , Centre de Recherche de Motorola, Gif-sur-Yvette, France
pp. 2481-2484
D.T.M. Slock , Inst. Eurecom, Sophia Antipolis, France
pp. 2485-2488
Wing-Kin Ma , Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, China
pp. 2489-2492
Xiangyang Zhuang , Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 2493-2496
G.B. Giannakis , Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2501-2504
Yuan-Pei Lin , Dept. of Electr. & Control Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 2505-2508
Hongbo Yan , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 2509-2512
Chin-Liang Wang , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 2513-2516
Z. Cvetkovic , AT&T Shannon Lab., Florham Park, NJ, USA
pp. 2517-2520
R. Dabora , Dept. of Electr. Eng., Tel Aviv Univ., Israel
pp. 2521-2524
S. Stanczak , Heinrich-Hertz-Inst. fur Nachrichtentech. Berlin GmbH, Germany
pp. 2533-2536
A. Leshem , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 2537-2540
S. Adireddy , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 2541-2544
J. Riba , Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 2549-2552
I.N. Psaromiligkos , Dept. of Electr. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 2557-2560
G. Ganesan , Dept. of Syst. & Control, Uppsala Univ., Sweden
pp. 2561-2564
Yung-Yi Wang , Nat. Taiwan Univ. of Sci. & Technol., Taipei, Taiwan
pp. 2565-2568
H. Boleskei , Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 2569-2572
Huan Yao , AT&T Labs.-Res., Florham Park, NJ, USA
pp. 2573-2576
X. Mestre , Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 2577-2580
M. Le Bot , Lab. Electron. et Commun., Conservatoire Nat. des Arts et Metiers, Paris, France
pp. 2585-2588
Ruifeng Zhang , Dept. of Electr. & Comput. Eng., Stevens Inst. of Technol., Hoboken, NJ, USA
pp. 2593-2596
H. Khalil , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 2597-2600
B. Chen , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 2601-2604
T. Trump , Ericsson Radio Syst. AB, Stockholm, Sweden
pp. 2605-2608
K. Nagarajan , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2609-2612
H. Yin , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 2613-2616
M.A.U. Khan , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2617-2620
Yan Wang , Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. Technol., China
pp. 2621-2624
S. Hoskote , Dept. of Electr. & Comput. Eng., Utah State Univ., Logan, UT, USA
pp. 2625-2628
T.K. Moon , Sch. of Comput. & Comm., Taegu Univ., Kyungpook, South Korea
pp. 2629-2632
Kwok-Hung Chei , Dept. of Inf. Eng., Chinese Univ. of Hong Kong, Shatin, China
pp. 2633-2636
H. Coward , Dept. of Telecommun., Norwegian Univ. of Sci. & Technol., Trondheim, Norway
pp. 2637-2640
T.-T. Lam , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 2645-2648
A. Demir , Lucent Technol. Bell Labs., Murray Hill, NJ, USA
pp. 2649-2652
Z. Chi , Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2653-2656
M.-A.R. Baissas , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 2657-2660
T. Rancurel , TESA, ENSEEIHT, Toulouse, France
pp. 2661-2664
M. Ghogho , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 2665-2668
J.L. Buetefuer , Cooperative Res. Centre for Satellite Syst., Univ. of South Australia, Mawson Lakes, SA, Australia
pp. 2669-2672
A. Scaglione , Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2677-2680
A.M. Rabiei , Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont., Canada
pp. 2685-2688
M. Wasserblat , Dept. of Electr. & Comput. Eng., Ben-Gurion Univ. of the Negev, Beer-Sheva, Israel
pp. 2689-2692
T. Adali , Dept. of Comput. Sci. & Electr. Eng., Maryland Univ., Baltimore, MD, USA
pp. 2693-2696
R. Amara , Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 2697-2700
S. Chen , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 2701-2704
M. Khames , Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
pp. 2705-2708
P.A. Regalia , Inst. Nat. des Telecommun., Evry, France
pp. 2709-2712
S.F. Cotter , Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 2713-2716
H. Gazzah , Inst. Nat. des Telecommun., Evry, France
pp. 2717-2720
A.G. Orozco-Lugo , Inst. of Integrated Inf. Syst., Leeds Univ., UK
pp. 2721-2724
A.T. Erdogan , Stanford University
pp. 2729-2732
P.D. Teal , Australian National University
pp. 2733-2736
G.T. Zhou , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2737-2740
C.W. Kok , Hong Kong Univ. of Sci. & Technol., China
pp. 2741-2744
J.H. Manton , Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 2749-2752
G. Gelli , Dipt. di Ingegneria Elettronica e delle Telecomunicazioni, Univ. degli Studi Federico II de Napoli, Italy
pp. 2753-2756
M. Nilsson , Dept. of Signals, Sensors & Syst., R. Inst. of Technol., Stockholm, Sweden
pp. 2757-2760
J. Milanovic , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 2761-2764
S. Gollamudi , Lab. for Image & Signal Anal., Notre Dame Univ., IN, USA
pp. 2765-2768
I. Panagiotopoulos , Transmission & Access Syst. Dept., INTRACOM SA, Peania, Greece
pp. 2777-2780
F. Lahouti , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
pp. 2781-2784
D.A. Gore , Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 2785-2788
T.N. Davidson , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 2789-2792
N.S. Alagha , Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, Que., Canada
pp. 2793-2796
A. Cay , Dept. of Electr. & Comput. Eng., Naval Postgraduate Sch., Monterey, CA, USA
pp. 2801-2804
J. Xavier , Inst. de Sistemas e Robotica, Inst. Superior Tecnico, Lisbon, Portugal
pp. 2809-2812
N. Al-Dhahir , AT&T Shannon Lab., Florham Park, NJ, USA
pp. 2817-2820
R. Suleesathira , Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
pp. 2821-2824
H.W. Fung , Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
pp. 2829-2832
E.N. Onggosanusi , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 2837-2840
A.M. Sayed , SK Telecom, Redwood City, CA, USA
pp. 2841-2844
Kuei-Chiang Lai , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 2845-2848
Ta-Sung Lee , Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 2849-2852
J. Luo , Dept. of Electr. & Syst. Eng., Connecticut Univ., Storrs, CT, USA
pp. 2853-2856
T.H. Li , Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2861-2864
T.P. Krauss , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2865-2868
M. Torlak , Dept. of Electr. Eng., Texas Univ., Dallas, TX, USA
pp. 2869-2872
I. Ghauri , Inst. Eurecom, Sophia Antipolis, France
pp. 2873-2876
Xiaodong Cai , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 2877-2880
O. Kucur , Dept. of Electron. Eng., Gebze Inst. of Technol., Turkey
pp. 2881-2884
M. Valkama , Telecommun. Lab., Tampere Univ. of Technol., Finland
pp. 2885-2888
K.I. Diamantaras , Dept. of Inf., Technological Educ. Inst. of Thessaloniki, Sindos, Greece
pp. 2889-2892
G. Mandyam , Equipe de Traitement des Images et du Signal, ENSEA, Cergy, France
pp. 2897-2900
Xiaohua Li , Dept. of ECECS, Cincinnati Univ., OH, USA
pp. 2901-2904
L. Li , Dept. of ECECS, Cincinnati Univ., OH, USA
pp. 2905-2908
U. Tureli , Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
pp. 2909-2912
B.D. Van Veen , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 2913-2916
J. Miguez , Dept. de Electron. e Sistemas, Univ. da Coruna, Spain
pp. 2917-2920
B. Huang , Billions of Oper. per Second Inc., Chapel Hill, NC, USA
pp. 2921-2924
Tong-Tong Li , Dept. of Electr. & Comput. Eng., Auburn Univ., AL, USA
pp. 2925-2928
S. Mudulodu , Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 2933-2936
S. Houcke , Lab. Syst. de Commun., Univ. de Marne-la-Vallee, France
pp. 2937-2940
E. Panagirci , Dept. of Electron. Eng., ISIK Univ., Istanbul, Turkey
pp. 2949-2952
Hyunsoo Cheon , Dept. of Electr. & Comput. Eng., Yonsei Univ., Seoul, South Korea
pp. 2957-2960
G. Arslan , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 2965-2968
A. Scaglione , Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2969-2972
B. Muquet , Centre de Recherche Motorola Paris, Gif-sur-Yvette, France
pp. 2973-2976
J. Gomes , Inst. de Sistemas e Robotica, Inst. Superior Tecnico, Lisbon, Portugal
pp. 2981-2984
A. Jourjine , Siemens Corp. Res. Inc., Princeton, NJ, USA
pp. 2985-2988
M. Schubert , Dept. of Broadband Mobile Commun. Networks, Heinrich Hertz Inst. for Commun. Technol. Berlin, Germany
pp. 2993-2996
A. Abdi , Dept. of Electr. & Comp. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2997-3000
D.P. Palomar , Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 3001-3004
M.A. Lagunas , Dept. of Electr. Eng., Yuan-Ze Inst. of Technol., Chungli, Taiwan
pp. 3005-3008
J.S. Hammerschmidt , Inst. for Integrated Circuits, Tech. Univ. Munchen, Germany
pp. 3013-3016
P. Forster , Lab. Electron. et Commun., CNAM, Paris, France
pp. 3017-3020
Y. Akyildiz , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 3021-3024
N. Cadalli , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 3025-3028
V. Luc , Office Nat. d'Etudes et de Recherches Aerospatiales, Chatillon, France
pp. 3029-3032
A.A. Abdel-Samad , Electr. & Comput. Eng. Dept., Minnesota Univ., Minneapolis, MN, USA
pp. 3033-3036
Wing-Kit Chung , Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, China
pp. 3037-3040
M. Pesavento , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 3049-3052
A.N. Lemma , Fac. of Inf. Technol., Delft Univ. of Technol., Netherlands
pp. 3053-3056
A.L. Swindlehurst , Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 3057-3060
J.S. Lee , Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3061-3064
A.B. Gershman , Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 3065-3068
S.N. Batalama , Dept. of Electr. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 3069-3072
J. Eriksson , Ericsson Microwave Syst., Molndal, Sweden
pp. 3073-3076
A. Tuncay Koc , Dept. of Electr. & Electron. Eng., Middle East Tech. Univ., Ankara, Turkey
pp. 3077-3080
E. Larsson , Dept. of Syst. & Control, Uppsala Univ., Sweden
pp. 3081-3084
J. Kang , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 3085-3088
B.K. Lau , Australian Telecommun. Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 3093-3096
G.A. Fabrizio , CSSIP, Adelaide Univ., SA, Australia
pp. 3097-3100
J. Xin , YRP Mobile Telecommun. Key Technol., Res. Labs. Co. Ltd., Yokosuka, Japan
pp. 3105-3108
A. Austeng , Dept. of Inf., Oslo Univ., Norway
pp. 3109-3112
A. Ferreol , Thomson-CSF, Gennevilliers, France
pp. 3113-3116
Y.I. Abramovich , Cooperative Res. Centre for Sensor Signal & Inf. Processing, Mawson Lakes, SA, Australia
pp. 3117-3120
N. Chiurtu , Mobile Commun. Lab., Swiss Fed. Inst. of Technol., Lausanne, Switzerland
pp. 3121-3123
Y. Hua , Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 3124-3127
X. Liu , Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
pp. 3128-3131
Y. Zhang , Dept. of Electr. & Comput. Eng., Villanova Univ., PA, USA
pp. 3132-3135
A. Yeredor , Dept. of Electr. Eng., Tel Aviv Univ., Israel
pp. 3136-3139
C.B. Papadias , Wireless Commun. Res. Dept., Lucent Technol. Bell Labs., Holmdel, NJ, USA
pp. 3144-3147
A. Ahmed , Dept. of Eng., Cambridge Univ., UK
pp. 3148-3151
S. Cruces , Area de Teoria de la Senal, Seville Univ., Spain
pp. 3152-3155
V. Zarzoso , Dept. of Electr. Eng. & Electron., Liverpool Univ., UK
pp. 3160-3163
A. Sleiman , Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3164-3167
H.C. So , Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, China
pp. 3168-3171
M. Jansson , Dept. of Signals, Sensors & Syst., Signal Processing, R. Inst. of Technol., Stockholm, Sweden
pp. 3172-3175
Pei-Jung Chung , Dept. of Electr. Eng. & Inf. Sci., Ruhr-Univ., Bochum, Germany
pp. 3176-3179
J.F. Bohme , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 3180-3183
J.-R. Larocque , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 3184-3187
Jeong-Ho Park , Dept. of Electr. Eng., POSTECH, Pohang, South Korea
pp. 3188-3191
M.G.S. Bruno , Electr. Eng. Dept., Sao Paulo Univ., Brazil
pp. 3192-3195
M. Nicoli , Dipt. Elettronica e Inf., Politecnico di Milano, Italy
pp. 3196-3199
C.C. Ko , Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore
pp. 3200-3203
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