- I
- ICASSP
- 2000
- Acoustics, Speech, and Signal Processing, 2000 Vol 4. 2000 IEEE International Conference on
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Acoustics, Speech, and Signal Processing, 2000 Vol 4. 2000 IEEE International Conference on
Istanbul, Turkey
June 05-June 09
ISBN: 0-7803-6293-4
Table of Contents
Xin Tong, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 1879-1882
T. Haddad, Sch. of Inf. Technol. & Eng., Ottawa Univ., Ont., Canada
pp. 1883-1886
C.B. Peel, Dept. of Electr. & Comput. Eng., Utah State Univ., Logan, UT, USA
pp. 1887-1890
Wen-Jyi Wang, Dept. of Electr. Eng., Chung Yuan Christian Univ., Chung Li, Taiwan
pp. 1895-1898
Qun Gu, Dept. of Electr. & Comput. Eng., Utah State Univ., Logan, UT, USA
pp. 1903-1906
I. Ismaeil, Dept. of Electr. & Comput. Eng., British Columbia Univ., Vancouver, BC, Canada
pp. 1911-1914
M.H. Gokcetekin, Dept. of Electron. & Commun. Eng., Istanbul Tech. Univ., Turkey
pp. 1915-1918
J. Mateos, Dept. de Ciencias de la Comput. e Inteligencia Artificial, Granada Univ., Spain
pp. 1919-1922
W. Badawy, Center for Adv. Comput. Studies, Louisiana Univ., Layayette, LA, USA
pp. 1923-1926
T. Shanableh, Dept. of Electron. Syst. Eng., Essen Univ., Germany
pp. 1927-1930
Junfeng Bai, Dept. of Electr. Eng., Tsinghua Univ., Beijing, China
pp. 1931-1934
A. Serir, LTI Electron. Inst., USTHB, Alger, Algeria
pp. 1935-1938
L. Yin, Dept. of Comput. Sci., Alberta Univ., Edmonton, Alta., Canada
pp. 1943-1946
G. Melnikov, Dept. of Electr. & Comput. Eng., Northtwestern Univ., Evanston, IL, USA
pp. 1947-1950
Te-Shen Liang, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 1951-1954
T. Furon, UIIS Lab., THOMSON Multimedia, Cesson Sevigne, France
pp. 1959-1962
I.B. Ozer, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 1963-1966
S. Tsekeridou, Dept. of Inf., Aristotelian Univ. of Thessaloniki, Greece
pp. 1967-1970
Hongseok Kim, Acess Network Lab., Korea Telecom, Seoul, South Korea
pp. 1971-1974
F. Alturki, Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1975-1978
M. Ramkumar, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 1979-1982
A. Jayawardena, Dept. of Math. Stat. & Comput. Sci., New England Univ., Armidale, NSW, Australia
pp. 1983-1986
S. Eickeler, Fac. of Electr. Eng., Gerhard-Mercator-Univ. Duisburg, Germany
pp. 1991-1994
H.M. Karaca, Dept. of Electr. & Electron. Eng., Bogazici Univ., Istanbul, Turkey
pp. 1999-2002
Y.Y. Gao, Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
pp. 2003-2006
W.-J. Kuo, Dept. of Comput. Sci. & Inf. Eng., Nat. Chung Cheng Univ., Chiaying, Taiwan
pp. 2007-2010
Ju Han, Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
pp. 2011-2014
Kai-Kuang Ma, Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea
pp. 2015-2018
Y. Xu, Dept. of Electr. & Comput. Eng., Rochester Univ., NY, USA
pp. 2019-2022
N. Adami, Dept. of Electron. for Autom., Brescia Univ., Italy
pp. 2023-2026
B. Erol, Dept. of Electr. & Comput. Eng., British Columbia Univ., Vancouver, BC, Canada
pp. 2027-2030
Y. Kim, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 2031-2034
M. Grangetto, Dipt. di Elettronica, Politecnico di Torino, Italy
pp. 2039-2042
L. Oktem, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 2043-2046
F.W. Wheeler, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 2047-2050
R. Oktem, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 2063-2066
R. Zaibi, Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
pp. 2071-2074
E.S. Ebbini, Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2075-2078
H.F. Ates, Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 2079-2082
O.G. Guleryuz, Dept. of Electr. Eng., Polytech. Univ. of Brooklyn, NY, USA
pp. 2083-2086
J.G. Toro, NIBEC, Ulster Univ., Jordanstown, UK
pp. 2087-2090
M. Zhao, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 2095-2098
J.E. Kleider, Syst. Solutions Group, Motorola Inc., Scottsdale, AZ, USA
pp. 2099-2102
Yew-San Lee, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 2103-2106
S. Shirani, Dept. of Electr. & Comput. Eng., British Columbia Univ., Vancouver, BC, Canada
pp. 2107-2110
L.C. Duval, Inst. Francais du Petrole, Rueil-Malmaison, France
pp. 2111-2114
T.D. Tran, Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
pp. 2115-2118
K. Komatsu, Inst. of Ind. Sci., Tokyo Univ., Japan
pp. 2119-2122
K. Sezaki, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
pp. 2123-2126
D.L. Robie, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2131-2134
T. Hamamoto, Dept. of Electr. Eng., Sci. Univ. of Tokyo, Japan
pp. 2135-2138
B. Jia, Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
pp. 2139-2142
Yuns Oh, Dept. of Electr. Eng., POSTECH, Pohang, South Korea
pp. 2143-2146
A. Saidi, Digital DNA Archit. Res. Lab., Motorola Inc., Schaumburg, IL, USA
pp. 2159-2162
A. Elnaggar, Dept. of Electr. Eng., Sultan Qaboos Univ., Muscat, Oman
pp. 2163-2166
Jinsung Oh, Inf. Media Lab., Samsung Electron. Co., Suwon, South Korea
pp. 2167-2170
B. Cohen, Dept. of Electr. & Comput. Eng., Ben-Gurion Univ. of the Negev, Beer-Sheva, Israel
pp. 2171-2174
How-Lung Eng, Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
pp. 2175-2178
H. Zhang, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 2179-2182
Tao Chen, Sch. of Comput. Sci. & Software Eng., Monash Univ., Clayton, Vic., Australia
pp. 2183-2186
S. Xiao, Illinois Univ., Urbana, IL, USA
pp. 2187-2190
S. Horbelt, Biomed. Imaging Group, Swiss Fed. Inst. of Technol., Lausanne, Switzerland
pp. 2191-2194
Z. Devcic, Inst. for Defense Studies, Res. & Dev., Zagreb Univ., Croatia
pp. 2195-2198
J.A. Williams, Space Centre for Satellite Navigation, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 2199-2202
F.A.C.M. Cardoso, Dept. de Comunicacoes, Univ. Estadual de Campinas, Sao Paulo, Brazil
pp. 2203-2206
B.A. Chipman, Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 2207-2210
B.D. Jeffs, Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
pp. 2211-2214
Moon-Chuen Lee, Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, Shatin, China
pp. 2215-2218
M. Rziza, Dept. of Phys., GSC-LEESA, Rabat, Morocco
pp. 2219-2222
A. Quddus, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 2227-2230
G. Park, Centre for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2231-2234
M.J.T. Smith, Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2235-2238
S.T. Acton, Sch. of Electr. & Comput. Eng., Oklahoma State Univ., Stillwater, OK, USA
pp. 2239-2242
S. Chitroub, Univ. des Sci. et de la Technol. Houari-Boumedienne, Algiers, Algeria
pp. 2243-2246
M.J. Bottema, Sch. of Inf. Sci. & Eng., Flinders Univ. of South Australia, Adelaide, SA, Australia
pp. 2247-2250
E. Izquierdo, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
pp. 2251-2254
A.S. Fahmy, Dept. of Syst. & Biomed. Eng., Cairo Univ., Egypt
pp. 2262-2265
A. Saad, Nat. Centre for Macromolecular Imaging, Baylor Coll. of Med., Houston, TX, USA
pp. 2270-2273
M. Martin, E.T.S.I.T., Valladolid Univ., Spain
pp. 2274-2277
M. Cetin, Lab. of Multi-Dimensional Signal Process., Boston Univ., MA, USA
pp. 2278-2281
A. Prochazka, Prague Inst. of Chem. Technol., Praque, Czech Republic
pp. 2282-2285
L.A. Chan, US Army Res. Lab., Adelphi, MD, USA
pp. 2286-2289
M. Mese, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 2290-2293
R. Noumeir, Dept. of Electr. Eng., Ecole de Technol. Superieure, Montreal, Que., Canada
pp. 2294-2297
J.-P. Leduc, Dept. of Math., Washington Univ., St. Louis, MO, USA
pp. 2298-2301
S. Boussakta, Sect. of Electr. & Electron. Eng., Teesside Polytech., Middlesbrough, UK
pp. 2302-2305
S. Petroudi, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2306-2309
P. Carre, IRCOM-SIC Lab., UMR CNRS, France
pp. 2310-2313
N. Le Bihan, Lab. des Images et des Signaux, ENSIEG-Domaine Univ., France
pp. 2314-2317
J. Mars, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Clear Water Bay, China
pp. 2318-2321
C. Garcia, Inst. of Comput. Sci., Found. for Res. & Technol.-Hellas, Heraklion, Greece
pp. 2326-2329
C.A.B. Mello, Dept. de Inf., Univ. Fed. de Pernambuco, Recife, Brazil
pp. 2330-2333
D. Gokcay, Cognitive Neurosci. Lab., Univ. of Florida Brain Inst., Gainesville, FL, USA
pp. 2334-2337
E. Demir, Dept. of Comput. Eng., Bogazici Univ., Istanbul, Turkey
pp. 2342-2344
E.D. Mandel, Lab. of Comput. Sci., Rockefeller Univ., New York, NY, USA
pp. 2345-2348
A.M. Al-Qayedi, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
pp. 2353-2356
M. Pardas, Lucent Technol. Bell Labs., Murray Hill, NJ, USA
pp. 2357-2360
A. Corradini, Dept. of Neuroinf., Tech. Hochschule Ilmenau, Germany
pp. 2361-2364
D. Roy, Media Lab., MIT, Cambridge, MA, USA
pp. 2369-2372
Z. Bozorgzadeh, Dept. of Electr. & Comput. Eng., British Columbia Univ., Vancouver, BC, Canada
pp. 2385-2388
T. Wark, Speech Res. Lab., Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 2389-2392
J.J. Williams, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
pp. 2393-2396
N. Strobel, Telecommun. Lab., Erlangen-Nurnberg Univ., Germany
pp. 2397-2400
A.A. Alatan, Center for Multimedia Res., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 2401-2404
K. Ng, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
pp. 2405-2408
A. Tefa, Dept. of Inf., Aristotelian Univ. of Thessaloniki, Greece
pp. 2409-2412
J. Hunsinger, Inst. for Human-Machine Commun., Tech. Univ. Munchen, Germany
pp. 2413-2416
P.J. Moreno, Cambridge Res. Lab., Compaq Comput. Corp., Cambridge, MA, USA
pp. 2417-2420
Y. Altunbasak, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2421-2424
T.S. Polzin, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 2429-2432
M. Alghoniemy, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2433-2436
D. Pye, AT&T Labs., Cambridge, UK
pp. 2437-2440
H. Sundaram, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
pp. 2441-2444
K. El-Maleh, Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, Que., Canada
pp. 2445-2448
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