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Acoustics, Speech, and Signal Processing, 2000 Vol 4. 2000 IEEE International Conference on
Istanbul, Turkey
June 05-June 09
ISBN: 0-7803-6293-4
Table of Contents
T. Haddad, Sch. of Inf. Technol. & Eng., Ottawa Univ., Ont., Canada
pp. 1883-1886
C.B. Peel, Dept. of Electr. & Comput. Eng., Utah State Univ., Logan, UT, USA
pp. 1887-1890
Wen-Jyi Wang, Dept. of Electr. Eng., Chung Yuan Christian Univ., Chung Li, Taiwan
pp. 1895-1898
Qun Gu, Dept. of Electr. & Comput. Eng., Utah State Univ., Logan, UT, USA
pp. 1903-1906
I. Ismaeil, Dept. of Electr. & Comput. Eng., British Columbia Univ., Vancouver, BC, Canada
pp. 1911-1914
J. Mateos, Dept. de Ciencias de la Comput. e Inteligencia Artificial, Granada Univ., Spain
pp. 1919-1922
A. Serir, LTI Electron. Inst., USTHB, Alger, Algeria
pp. 1935-1938
G. Melnikov, Dept. of Electr. & Comput. Eng., Northtwestern Univ., Evanston, IL, USA
pp. 1947-1950
Te-Shen Liang, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 1951-1954
T. Furon, UIIS Lab., THOMSON Multimedia, Cesson Sevigne, France
pp. 1959-1962
I.B. Ozer, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 1963-1966
S. Tsekeridou, Dept. of Inf., Aristotelian Univ. of Thessaloniki, Greece
pp. 1967-1970
F. Alturki, Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1975-1978
M. Ramkumar, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 1979-1982
S. Eickeler, Fac. of Electr. Eng., Gerhard-Mercator-Univ. Duisburg, Germany
pp. 1991-1994
H.M. Karaca, Dept. of Electr. & Electron. Eng., Bogazici Univ., Istanbul, Turkey
pp. 1999-2002
Y.Y. Gao, Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
pp. 2003-2006
B. Erol, Dept. of Electr. & Comput. Eng., British Columbia Univ., Vancouver, BC, Canada
pp. 2027-2030
L. Oktem, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 2043-2046
F.W. Wheeler, Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
pp. 2047-2050
R. Zaibi, Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
pp. 2071-2074
E.S. Ebbini, Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2075-2078
M. Zhao, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 2095-2098
S. Shirani, Dept. of Electr. & Comput. Eng., British Columbia Univ., Vancouver, BC, Canada
pp. 2107-2110
T.D. Tran, Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
pp. 2115-2118
D.L. Robie, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2131-2134
Yuns Oh, Dept. of Electr. Eng., POSTECH, Pohang, South Korea
pp. 2143-2146
A. Saidi, Digital DNA Archit. Res. Lab., Motorola Inc., Schaumburg, IL, USA
pp. 2159-2162
A. Elnaggar, Dept. of Electr. Eng., Sultan Qaboos Univ., Muscat, Oman
pp. 2163-2166
B. Cohen, Dept. of Electr. & Comput. Eng., Ben-Gurion Univ. of the Negev, Beer-Sheva, Israel
pp. 2171-2174
How-Lung Eng, Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
pp. 2175-2178
Tao Chen, Sch. of Comput. Sci. & Software Eng., Monash Univ., Clayton, Vic., Australia
pp. 2183-2186
S. Horbelt, Biomed. Imaging Group, Swiss Fed. Inst. of Technol., Lausanne, Switzerland
pp. 2191-2194
J.A. Williams, Space Centre for Satellite Navigation, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 2199-2202
B.A. Chipman, Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 2207-2210
Moon-Chuen Lee, Dept. of Comput. Sci. & Eng., Chinese Univ. of Hong Kong, Shatin, China
pp. 2215-2218
G. Park, Centre for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2231-2234
M.J.T. Smith, Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2235-2238
S.T. Acton, Sch. of Electr. & Comput. Eng., Oklahoma State Univ., Stillwater, OK, USA
pp. 2239-2242
M.J. Bottema, Sch. of Inf. Sci. & Eng., Flinders Univ. of South Australia, Adelaide, SA, Australia
pp. 2247-2250
M. Cetin, Lab. of Multi-Dimensional Signal Process., Boston Univ., MA, USA
pp. 2278-2281
R. Noumeir, Dept. of Electr. Eng., Ecole de Technol. Superieure, Montreal, Que., Canada
pp. 2294-2297
S. Boussakta, Sect. of Electr. & Electron. Eng., Teesside Polytech., Middlesbrough, UK
pp. 2302-2305
N. Le Bihan, Lab. des Images et des Signaux, ENSIEG-Domaine Univ., France
pp. 2314-2317
J. Mars, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Clear Water Bay, China
pp. 2318-2321
C. Garcia, Inst. of Comput. Sci., Found. for Res. & Technol.-Hellas, Heraklion, Greece
pp. 2326-2329
M. Pardas, Lucent Technol. Bell Labs., Murray Hill, NJ, USA
pp. 2357-2360
J.J. Williams, Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
pp. 2393-2396
K. Ng, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
pp. 2405-2408
P.J. Moreno, Cambridge Res. Lab., Compaq Comput. Corp., Cambridge, MA, USA
pp. 2417-2420
Y. Altunbasak, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2421-2424
T.S. Polzin, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 2429-2432
M. Alghoniemy, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2433-2436
K. El-Maleh, Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, Que., Canada
pp. 2445-2448
Author Index (Abstract)
pp. 2449-2457
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