- I
- ICASSP
- 2000
- Acoustics, Speech, and Signal Processing, 2000 Vol 2. 2000 IEEE International Conference on
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Acoustics, Speech, and Signal Processing, 2000 Vol 2. 2000 IEEE International Conference on
Istanbul, Turkey
June 05-June 09
ISBN: 0-7803-6293-4
Table of Contents
Qiang Hue, Dept. of Comput. Sci. & Inf. Syst., Hong Kong Univ., China
pp. II1001-II1004
S. Matsuda, Japan Adv. Inst. of Sci. & Technol., Ishikawa, Japan
pp. II1005-II1008
J.A. Bilmes, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. II1009-II1012
Liang Gu, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. II1013-II1016
Hsiao-Wuen Hon, Speech Technol. Group, Microsoft Res., Redmond, WA, USA
pp. II1017-II1020
I. Shafran, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. II1021-II1024
W. Byrne, CLSP, Johns Hopkins Univ., MD, USA
pp. II1029-II1032
Yuchang Cao, Sch. of Electron. & Sci. Eng., Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. II1033-II1036
M.Z. Ikram, Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. II1041-II1044
A. Hussain, Dept. of Appl. Comput., Dundee Univ., UK
pp. II1045-II1048
T. Nishiura, Graduate Sch. of Inf. Sci., Nara Inst. of Sci. & Technol., Japan
pp. II1053-II1056
S. Doclo, Dept. of Electr. Eng., Katholieke Univ., Leuven, Belgium
pp. II1061-II1064
D. Tran, Sch. of Comput., Canberra Univ., ACT, Australia
pp. II1069-II1072
B.S. Yarman, Dept. of Electron. Eng., Isik Univ., Maslak-Istanbul, Turkey
pp. II1077-II1080
Sungjoo Ahn, Dept. of Electron. Eng., Korea Univ., Seoul, South Korea
pp. II1081-II1084
L. Besacier, Inst. of Microtechnol., Neuchatel Univ., Switzerland
pp. II1085-II1088
J. Navratil, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. II1097-II1100
S.P. Kishore, Dept. of Comput. Sci. & Eng., Indian Inst. of Technol., Madras, India
pp. II1101-II1104
M. Lieb, Philips GmbH Forschungslab., Aachen, Germany
pp. II1105-II1108
Yunxin Zhao, Dept. of Comput. Eng. & Comput. Sci., Missouri Univ., Columbia, MO, USA
pp. II1109-II1112
R. Sarikaya, Robust Speech Process. Lab., Colorado Univ., Boulder, CO, USA
pp. II1113-II1116
S. Sharma, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. II1117-II1120
C. Cerisara, LORIA, Henri Poincare Univ., Vandoeuvre-les-Nancy, France
pp. II1121-II1124
Kaisheng Yao, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Clear Water Bay, China
pp. II1125-II1128
G. Saon, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. II1129-II1132
A. Koutvas, Dept. of Electr. & Comput. Eng., Patras Univ., Greece
pp. II1133-II1136
Weiran Lin, Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
pp. II1137-II1140
G. Aguilar, Speech Technol. Group, Lucent InterNetworking Syst., Red Bank, NJ, USA
pp. II1141-II1144
K. Koishida, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. II1149-II1152
A. McCree, DSP Solutions R&D Center, Texas Instrum. Inc., Dallas, TX, USA
pp. II1153-II1156
R. Taori, Digital Signal Process. Group, Philips Res. Lab., Eindhoven, Netherlands
pp. II1157-II1160
Juin-Hwey Chen, Speech Technol. Group, Lucent InterNetworking Syst., Red Bank, NJ, USA
pp. II1161-II1164
S. Ragot, Dept. of Electr. & Comput. Eng., Sherbrooke Univ., Que., Canada
pp. II1169-II1172
M. Serizawa, C&C Media Res. Labs., NEC Corp., Kawasaki, Japan
pp. II1173-II1176
W.M. Campbell, Human Interface Lab., Motorola Inc., Tempe, AZ, USA
pp. II1185-II1188
Qi Li, Multimedia Commun. Res. Lab., Lucent Technol. Bell Labs., Murray Hill, NJ, USA
pp. II1189-II1192
W.D. Zhang, Dept. of Electron. & Inf. Eng., Hong Kong Polytech. Univ., China
pp. II1193-II1196
F. Weber, Dragon Syst. Inc., Newton, MA, USA
pp. II1205-II1208
H. Altincay, Dept. of Electr. & Electron. Eng., Middle East Tech. Univ., Ankara, Turkey
pp. II1209-II1212
M. Hebert, Nuance Commun., Menlo Park, CA, USA
pp. II1213-II1216
Bor-Shen Lin, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. II1221-II1224
Xiaoqiang Luo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. II1225-II1228
H.M. Meng, Dept. of Syst. Eng. & Eng. Manage., Chinese Univ. of Hong Kong, Shatin, China
pp. II1229-II1232
D. Goddeau, Cambridge Res. Lab., Compaq Comput. Corp., MA, USA
pp. II1233-II1236
R. San-Segundo, Center for Spoken Language Understanding, Colorado Univ., Boulder, CO, USA
pp. II1237-II1240
M. Coates, Dept. of Electr. & Comput. Sci., Rice Univ., Houston, TX, USA
pp. II633-II636
S. Aviyente, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. II641-II644
Weifeng Mu, Dept. of Electr. & Comput. Eng., Villanova Univ., PA, USA
pp. II645-II648
B.W. Gillespie, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. II649-II652
Shie Qian, DSP Group, Nat. Instrum. Corp., Austin, TX, USA
pp. II653-II656
Z.M. Hussain, Signal Processing Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. II657-II660
B. Barkat, Signal Processing Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. II661-II664
M.I. Doroslovacki, Dept. of Electr. & Comput. Eng., George Washington Univ., Washington, DC, USA
pp. II669-II672
Mingui Sun, Dept. of Neurosurgery & Electr. Eng., Pittsburgh Univ., PA, USA
pp. II673-II676
R. Baraniuk, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. II681-II684
E. Lukasik, Inst. of Comput. Sci., Poznan Univ. of Technol., Poland
pp. II689-II692
A.K. Ozdemir, Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
pp. II693-II696
O. Arikan, Dept. of Electr. & Electron. Eng., Bilkent Univ., Ankara, Turkey
pp. II697-II700
A. Doucet, Signal Processing Lab., Cambridge Univ., UK
pp. II701-II704
N. Bergman, Dept. of Electr. Eng., Linkoping Univ., Sweden
pp. II705-II708
D.D. Muresan, Dept. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. II709-II712
E. Blanco, Univ. Claude Bernard, Villeurbanne, France
pp. II713-II716
M.I. Izzetoglu, Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
pp. II721-II724
Yufei Huang, Dept. of Electr. & Comput. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. II725-II728
T.L. Nguyen, Signal Processing Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. II729-II732
M. Suzuki, Res. Inst. for Electron. Sci., Hokkaido Univ., Sapporo, Japan
pp. II733-II736
B. Hassibi, Lucent Technol. Bell Labs., Murray Hill, NJ, USA
pp. II737-II740
Y. Meron, Dept. of Inf. & Commun. Eng., Tokyo Univ., Japan
pp. II745-II748
B. Logan, Res. Labs., Compaq Comput. Corp., Cambridge, MA, USA
pp. II749-II752
A. Eronen, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. II753-II756
M. Goto, Electrotech. Lab., Ibaraki, Japan
pp. II757-II760
T. Virtanen, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. II765-II768
C. Erkut, Lab. of Acoust. & Audio Signal Processing, Helsinki Univ. of Technol., Espoo, Finland
pp. II769-II772
M. Karjalainen, Lab. of Acoust. & Audio Signal Processing, Helsinki Univ. of Technol., Espoo, Finland
pp. II773-II776
J.J. Lopez, Dept. de Comunicaciones, Univ. Politecnica de Valencia, Spain
pp. II777-II780
D.B. Ward, Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
pp. II781-II784
M.C. Chen, Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. II785-II788
Yang-Won Jung, Dept. of Electr. & Comput. Eng., Yonsei Univ., Seoul, South Korea
pp. II801-II804
A. Stenger, Telecommun. Lab., Erlangen-Nurnberg Univ., Germany
pp. II805-II808
K.C. Ho, Dept. of Electr. Eng., Missouri Univ., Columbia, MO, USA
pp. II809-II812
T. Yensen, Dept. of Syst. & Comput. Eng., Carleton Univ., Ottawa, Ont., Canada
pp. II817-II820
A. Gonzalez, Dept. de Commun., Univ. Politecnica de Valencia, Spain
pp. II833-II836
M. De Diego, Dept. of Comunicaciones, Univ. Politecnica de Valencia, Spain
pp. II837-II840
M.H. Costa, Nucl. de Engenharia Biomed., Univ. Catolica de Pelotas, Brazil
pp. II841-II844
S.J. Elliott, Inst. of Sound & Vibration Res., Southampton Univ., UK
pp. II845-II848
M.A. Trenas, Dept. Comput. Architecture, Malaga Univ., Spain
pp. II849-II852
A. Kusumoto, Dept. of Electr. & Electron. Eng., Sophia Univ., Tokyo, Japan
pp. II853-II856
J. Chalupper, Inst. for Human-Machine Commun., Tech. Univ. of Munich, Germany
pp. II857-II860
C. Schauer, Dept. of Neuroinf., Ilmenau Tech. Univ., Germany
pp. II865-II868
J. Hellgren, Dept. of Neurosci. & Locomotion, Linkoping Univ., Sweden
pp. II869-II872
A. Jbira, Centre for Commun. Syst. Res., Surrey Univ., Guildford, UK
pp. II873-II876
T.S. Verma, Lab. of Acoustics & Audio Signal Processing, Helsinki Univ. of Technol., Espoo, Finland
pp. II877-II880
B. Edler, Multimedia Commun. Res. Lab., AT&T Bell Labs., Murray Hill, NJ, USA
pp. II881-II884
F. Golchin, Sch. of Microelectron. Eng., Griffith Univ., Brisbane, Qld., Australia
pp. II885-II888
H. Najafzadeh, Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, Que., Canada
pp. II893-II896
A. Harma, Lab. of Acoustics & Audio Signal Processing, Helsinki Univ. of Technol., Espoo, Finland
pp. II897-II900
R. Vafin, Dept. of Speech Commun. & Music Acoust., R. Inst. of Technol., Stockholm, Sweden
pp. II901-II904
V.N. Parikh, Speech Technol. Group, Lucent InterNetworking Syst., Red Bank, NJ, USA
pp. II905-II908
Yiteng Huang, Center for Image & Signal Processing, Georgia Inst. of Technol., Atlanta, GA, USA
pp. II909-II912
Wang Peng, Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
pp. II913-II916
S. Sakaguchi, Dept. of Electr. & Electron. Eng., Sophia Univ., Tokyo, Japan
pp. II917-II920
F. Jabloun, Electr. & Comput. Eng. Dept., McGill Univ., Montreal, Que., Canada
pp. II925-II928
C. Christogiannis, Dept. of Electr. & Comput. Eng., Nat. Tech. Univ. of Athens, Greece
pp. II929-II932
A. Arvaniti, Dept. of Syst. Eng. & Eng. Manage., Chinese Univ. of Hong Kong, Shatin, China
pp. II933-II936
R.E. Donovan, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. II937-II940
J. Wouters, Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. II941-II944
A. Kain, Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. II949-II952
Xuejing Sun, Dept. of Commun. Sci. & Disorders, Northwestern Univ., Evanston, IL, USA
pp. II953-II956
O. Siohan, Lucent Technol. Bell Labs., Murray Hill, NJ, USA
pp. II965-II968
B. Doherty, Sch. of Electr. & Electron. Eng., Queen's Univ., Belfast, UK
pp. II969-II972
Shaojun Wang, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. II977-II980
Lei He, Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
pp. II981-II984
A. Gunawardana, Center for Language & Speech Procesing, Johns Hopkins Univ., Baltimore, MD, USA
pp. II985-II988
C. Boulis, Dept. of Electron. & Comput. Eng., Tech. Univ. of Crete, Chania, Greece
pp. II989-II992
E.R. Buhrke, Human Interface lab., Motorola Inc., Naperville, IL, USA
pp. II993-II996
Xintian Wu, Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. II997-I1000
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