- I
- ICASSP
- 2000
- Acoustics, Speech, and Signal Processing, 2000 Vol 1. 2000 IEEE International Conference on
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Acoustics, Speech, and Signal Processing, 2000 Vol 1. 2000 IEEE International Conference on
Istanbul, Turkey
June 05-June 09
ISBN: 0-7803-6293-4
Table of Contents
K.H. Afkhamie, Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 5-8
E. Masry, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 9-12
S.S. Kozat, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 13-16
Byung-Jae Kwak, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 21-24
Jian Yu, Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
pp. 25-28
T.E. Hunter, Dept. of Electr. Eng., Texas Univ., Dallas, TX, USA
pp. 29-32
S.M. Thornton, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 37-40
P. Stoica, Dept. of Syst. & Control, Uppsala Univ., Sweden
pp. 41-44
T. Gustafsson, Dept. of Electr. Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 45-48
L.A. Johnston, Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 49-52
C.L. Brown, Sch. of Electr. & Comput. Eng., Curtin Univ. of Technol., Perth, WA, Australia
pp. 53-56
Hwa-Tung Ong, Sch. of Electr. & Comput. Eng., Curtin Univ. of Technol., Perth, WA, Australia
pp. 57-60
J.H. Kotecha, Dept. of Electr. & Comput. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 61-64
F. Poree, ENST de Bretagne, Brest, France
pp. 69-72
Soo-Chang Pei, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 73-76
L. Stankovic, Elektrotech. Fak., Montenegro Univ., Yugoslavia
pp. 77-80
V. DeBrunner, Sch. of Electr. & Comput. Eng., Oklahoma Univ., Norman, OK, USA
pp. 81-84
C. Richard, Lab. de Modelisation et Surete des Syst., Univ. de Technol. de Troyes, France
pp. 85-88
O. Michel, Lab. de Phys., Ecole Normale Superieure de Lyon, France
pp. 89-92
I.S. Yetik, Dept. of Electr. Eng., Bilkent Univ., Ankara, Turkey
pp. 93-96
K.L. Gaston, Dept. of Math., Virginia Univ., Charlottesville, VA, USA
pp. 97-100
A.J. van Leest, Faculteit Elektrotech., Eindhoven Univ. of Technol., Netherlands
pp. 101-104
S.O. Aase, Dept. of Electr. & Comput. Eng., Hogskolen i Stavanger, Norway
pp. 105-108
W. Liu, Dept. of Electr. & Electron. Eng., Hong Kong Univ., China
pp. 109-112
O.S. Jahromi, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
pp. 113-116
V. Melnik, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 117-120
See-May Phoong, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 121-124
A.A. Bharath, Dept. of Biol. & Med. Syst., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 125-128
I.W. Selesnick, Dept. of Electr. Eng., Polytech. Univ. of Brooklyn, NY, USA
pp. 129-132
Hyeokho Choi, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 133-136
S.S. Abeysekera, Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
pp. 137-140
R. Molina, Dept. de Ciencias de la Comput. e Inteligencia Artificial, Granada Univ., Spain
pp. 141-144
Zhi Ding, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
pp. 145-148
B. Calef, Dept. of Math., California Univ., Berkeley, CA, USA
pp. 149-152
D. Declercq, Dept. of Electr. & Comput. Eng., Minnesota Univ., Duluth, MN, USA
pp. 157-160
P. Ishwar, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 161-164
P.L. Combettes, Lab. d'Anal. Numerique, Univ. Pierre et Marie Curie, Paris, France
pp. 165-168
A. Kalyuzhny, Scientific-Production Enterprise DELTA, Kiev, Ukraine
pp. 169-172
R. Agarwal, Stellate Syst., Montreal, Que., Canada
pp. 173-176
Fang Yangwang, Key Lab. for Radar Signal Process., Xidian Univ., Xi'an, China
pp. 177-180
W.J. Pei, Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 185-188
S.M. Simmons, Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ., UK
pp. 189-192
C. Pantaleon, Dipt. Ing. Comunicaciones, Cantabria Univ., Santander, Spain
pp. 193-196
D. Rajan, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 197-200
V. Solo, Dept. of Stat., Macquarie Univ., North Ryde, NSW, Australia
pp. 217-220
G. Gilboa, Fac. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
pp. 221-224
Jian Luo, City Coll., City Univ. of New York, NY, USA
pp. 225-228
L.C. Ng, Lawrence Livermore Nat. Lab., CA, USA
pp. 229-232
F. Cruz-Roldan, Dept. de Teoria de la Senal y Comunicaciones, Alcala Univ., Spain
pp. 237-240
P. Chainais, Lab. de Phys., Ecole Normale Superieure de Lyon, France
pp. 241-244
D. Veitch, Software Eng. Res. Centre, Melbourne, Vic., Australia
pp. 245-248
M.Y. Hong, Dept. of Math., Arizona State Univ., Tempe, AZ, USA
pp. 249-252
Xudong Jiang, Centre for Signal Process., Nanyang Technol. Inst., Singapore
pp. 253-256
S.-E. Fotinea, Inst. for Language & Speech Process., Amaroussiou, Greece
pp. 257-260
C.L. Fancourt, Comput. Neuro-Eng. Lab., Florida Univ., Gainesville, FL, USA
pp. 261-264
Chung-Chieh Lin, Dept. of Electr. & Comput. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 265-268
T.T. Georgiou, Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 269-272
G.B. Unal, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 277-280
S. Buzzi, Dipt. di Ingegneria Elettronica, Naples Univ., Italy
pp. 281-284
S.D. Howard, Electron. Warfare Div., Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 289-292
M.R. Morelande, Sch. of Electr. & Comput. Eng., Curtin Univ. of Technol., Perth, WA, Australia
pp. 293-296
P.M. Djuric, Dept. of Electr. & Comput. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 297-300
E. Conte, Dipt. di Ingegneria Elettronica, Naples Univ., Italy
pp. 301-304
M. Nikolova, Lab. Traitement et Commun. de l'Inf., CNRS, Paris, France
pp. 305-308
J.A. Gubner, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 309-312
R. Kumaresan, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 313-316
O. Ekiz, Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 321-323
Y.C. Eldar, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 324-327
Lei Ying, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 328-331
P. Bondon, Lab. des Signaux et Syst., Univ. de Paris-Sud, Orsay, France
pp. 332-335
S.D. Casey, Dept. of Math. & Stat., American Univ., Washington, DC, USA
pp. 336-339
A.E. Yagle, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 340-343
A.S. Bopardikar, Center for Imaging Sci., Rochester Inst. of Technol., NY, USA
pp. 344-347
M. Gastpar, Audio Visual Commun. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 348-351
M. Bhouri, UFR de Math. et Inf., Univ. Rene Descartes, Paris, France
pp. 352-355
G. Mirchandani, Dept. of Electr. & Comput. Eng., Vermont Univ., Burlington, VT, USA
pp. 356-359
Heping Ding, Network Edge Technol., Nortel Networks, Ottawa, Ont., Canada
pp. 360-363
Woo-Jin Song, Dept. of Electron. & Electr. Eng., Pohang Inst. of Sci. & Technol., South Korea
pp. 364-367
S. Miyagi, Dept. of Syst. Sci., Kyoto Univ., Japan
pp. 368-371
D. Joachim, Sanders, Lockheed Martin Co., Nashua, NH, USA
pp. 372-375
R. Gupta, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 376-379
R. Gupta, Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore
pp. 380-383
D.A. Pados, Dept. of Electr. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 384-387
Kuan-Chich Yen, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 388-391
L.S. Resende, Dept. of Electr. Eng., Univ. Fed. de Santa Catarina, Florianopolis, Brazil
pp. 392-395
J.A. Chambers, Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 396-399
L.S. Resende, Dept. of Electr. Eng., Univ. Fed. de Santa Catarina, Florianopolis, Brazil
pp. 400-403
O.J. Tobias, Dept. of Electr. Eng., Univ. Fed. de Santa Catarina, Florianopolis, Brazil
pp. 404-407
Chien-Kai Peng, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 408-411
S.C. Douglas, Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
pp. 412-415
I. Fijalkow, ENSEA-UCP, Equipe de Traitement des Images et du Signal, Cergy-Pontoise, France
pp. 416-419
A. Rouxel, Equipe Traitement du Signal et Neuromimetisme, Cesson-Sevigne, France
pp. 420-423
P. Kidmose, Dept. of Math. Modelling, Tech. Univ. Denmark, Lyngby, Denmark
pp. 424-427
C.E. Davila, Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
pp. 432-435
T. Creasy, Sch. of Inf. Technol. & Eng., Ottawa Univ., Ont., Canada
pp. 436-439
N.R. Yousef, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 440-443
X. Sun, Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
pp. 444-447
K. Dogancay, Sch. of Phys. & Electron. Syst. Eng., Univ. of South Australia, Mawson Lakes, SA, Australia
pp. 448-451
S.D. Blunt, Dept. of Electr. Eng., Missouri Univ., Columbia, MO, USA
pp. 452-455
R. Merched, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 456-459
Jongsun Park, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 460-463
R.G. Alves, Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
pp. 468-471
Peng-Hua Wang, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 472-475
Y. Wan, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 476-479
D. Sersic, Dept. of Electron. Syst. & Inf. Processing, Zagreb Univ., Croatia
pp. 480-483
R. Bregovic, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 484-487
D.B.H. Tay, Dept. of Electron. Eng., LaTrobe Univ., Bundoora, Vic., Australia
pp. 488-491
F. Fekri, Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 492-495
Z. Shi, Houston Univ., TX, USA
pp. 496-499
H. Vikalo, Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 500-503
S.C. Chan, Dept. of Electr. & Electron. Eng., Hong Kong Univ., China
pp. 504-507
T. Blu, Biomed. Imaging Group, Swiss Fed. Inst. of Technol., Lausanne, Switzerland
pp. 512-515
B. Dumitrescu, Dept. of Control & Comput., Politehnica Univ. of Bucharest, Romania
pp. 516-519
T. Nagai, Course in Electron. Eng., Univ. of Electro-Commun., Tokyo, Japan
pp. 520-523
G. McDarby, Digital Signal Process. Group, Univ. Coll. Dublin, Ireland
pp. 524-527
Thuyen Le, Inst. of Microelectron. Syst., Darmstadt Univ. of Technol., Germany
pp. 528-531
J. Alhava, Telecommun. Lab., Tampere Univ. of Technol., Finland
pp. 536-539
V. Labunets, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 540-543
J. Tian, Comput. Math. Lab., Rice Univ., Houston, TX, USA
pp. 544-547
D. Wei, Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
pp. 548-551
M.E. Celebi, Fac. of Electr.-Electron. Eng., Istanbul Tech. Univ., Turkey
pp. 552-555
K. Gerlach, Radar Div., Naval Res. Lab., Washington, DC, USA
pp. 556-559
M. Green, Australian Telecommun. Res. Inst., Curtin Univ. of Technol., Perth, WA, Australia
pp. 560-563
Yuanjin Zheng, Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
pp. 572-575
A. Bultan, Electr. & Comput. Eng. Dept., New Jersey Center for Wireless Res., Newark, NJ, USA
pp. 576-579
G. Seco, Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 580-583
B. Chen, Dept. of Electr. & Comput. Eng., Drexel Univ., Philadelphia, PA, USA
pp. 584-587
J.P. Reilly, Dept. of Electr. & Comput. Eng., McMaster Univ., Hamilton, Ont., Canada
pp. 588-591
Y. Matsuyama, Dept. of Electr., Electron. & Comput. Eng., Waseda Univ., Tokyo, Japan
pp. 592-595
A. Ohsumi, Dept. of Mech. & Syst. Eng., Kyoto Inst. of Technol., Japan
pp. 596-599
Chao-Tang Yu, Dept. of Electron. Eng., Southern Taiwan Univ. of Technol., Tainan, Taiwan
pp. 600-603
L. Couvreur, Signal Process. Dept., Fac. Polytech. de Mons, Belgium
pp. 604-607
A. Asif, Inf. Technol., Tech. Univ. of British Columbia, Surrey, BC, Canada
pp. 608-611
Z. Liu, Electr. Eng. Dept., Polytech. Univ., Brooklyn, NY, USA
pp. 616-619
Xuling Luo, Dept. of Comput. Sci. & Electr. Eng., Vermont Univ., Burlington, VT, USA
pp. 620-623
B. Sirkeci, Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
pp. 624-627
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