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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1999)
Phoenix, AZ, USA
Mar. 15, 1999 to Mar. 19, 1999
ISBN: 0-7803-5041-3
TABLE OF CONTENTS
Author Index (Abstract)
pp. a1-a13
K. Kashino , NTT Basic Res. Labs., Kanagawa, Japan
pp. 2993-2996
S. Eickeler , Fac. of Electr. Eng., Gerhard-Mercator Univ., Duisburg, Germany
pp. 2997-3000
Tong Zhang , Integrated Media Syst. Center, Univ. of Southern California, Los Angeles, CA, USA
pp. 3001-3004
J.A. Lay , Sch. of Electr. & Inf. Eng., Sydney Univ., NSW, Australia
pp. 3009-3012
Yu-Len Huang , Dept. of Comput. Sci. & Inf. Eng., Nat. Chung Cheng Univ., Chiayi, Taiwan
pp. 3013-3016
Yining Deng , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 3017-3020
E. Albuz , Dept. of Electr. & Comput. Eng., Delaware Univ., Newark, DE, USA
pp. 3021-3024
C. Saraceno , PRIP Inst. for Autom., Vienna Univ. of Technol., Austria
pp. 3033-3036
B. Clarkson , Media Lab., MIT, Cambridge, MA, USA
pp. 3037-3040
A. Girgensohn , FX Palo Alto Lab., CA, USA
pp. 3045-3048
M. Ramkumar , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 3049-3052
Zhibin Lei , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 3053-3056
A. Kassler , Dept. of Distributed Syst., Ulm Univ., Germany
pp. 3057-3060
T. Wark , Sch. of Electr. & Electron. Syst. Eng., Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 3061-3064
M. Lievin , Signal & Image Lab., Grenoble Nat. Polytech. Inst., France
pp. 3065-3068
P. Delmas , Signal & Image Lab., Grenoble Nat. Polytech. Inst., France
pp. 3069-3072
M. Yeasin , Electrotech. Lab., Tsukuba, Japan
pp. 3073-3076
A. Mouchtaris , Integrated Media Syst. Center, Univ. of Southern California, Los Angeles, CA, USA
pp. 3077-3080
N. Strobel , Telecommun. Lab., Erlangen-Nurnberg Univ., Germany
pp. 3081-3084
P.G. Georgiou , Integrated Media Syst. Center, Univ. of Southern California, Los Angeles, CA, USA
pp. 3085-3088
A. Klapuri , Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 3089-3092
Juyang Weng , Dept. of Comput. Sci. & Eng., Michigan State Univ., East Lansing, MI, USA
pp. 3093-3096
P. DeLeon , Klipsch Sch. of Electr. & Comput. Eng., New Mexico State Univ., Las Cruces, NM, USA
pp. 3097-3100
J. Biemond , Fac. of Inf. Technol. & Syst., Delft Univ. of Technol., Netherlands
pp. 3101-3104
P.M.B. van Roosmalen , Fac. of Inf. Technol. & Syst., Delft Univ. of Technol., Netherlands
pp. 3105-3108
V.P. Baradad , Inst. Nat. de Recherche en Inf. et Autom., Le Chesnay, France
pp. 3109-3112
Sanghoon Lee , Lab. for Image & Video Eng., Texas Univ., Austin, TX, USA
pp. 3113-3116
S. Shirani , Dept. of Electr. & Comput. Eng., British Columbia Univ., Vancouver, BC, Canada
pp. 3117-3120
Xuemin Chen , Adv. Technol. Dept., Gen. Instrum. Corp., San Diego, CA, USA
pp. 3121-3124
G. Melnikov , Dept. of Electr. & Comput. Eng., Northwestern Univ., Evanston, IL, USA
pp. 3125-3128
V. Ratnakar , Epson Palo Alto Lab., CA, USA
pp. 3133-3136
A.J. Pinho , Dept. de Electron. e Telecoms, Aveiro Univ., Portugal
pp. 3141-3144
D. Mukherjee , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 3145-3148
T. Rosten , Dept. of Telecommun., Norwegian Univ. of Sci. & Technol., Trondheim, Norway
pp. 3153-3156
Qin Jiang , Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 3157-3160
N. Rozic , Dept. of Electron., Univ. of Split, Croatia
pp. 3161-3164
V.N. Ramaswamy , Adv. Multimedia Commun., AT&T Bell Labs., Holmdel, NJ, USA
pp. 3165-3168
F. Rizzo , Dept. of Comput. Sci., Brandeis Univ., Waltham, MA, USA
pp. 3169-3171
Chengjiang Lin , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 3177-3180
Jian-Jiun Ding , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 3181-3184
Y. Shibata , Platform Software Dev. Center, Sony Corp., Tokyo, Japan
pp. 3185-3188
J. Corbett , Dept. of Math., Washington Univ., St. Louis, MO, USA
pp. 3189-3192
E.V. Labunets , Dept. A & IT, Ural State Tech. Univ., Ekaterinburg, Russia
pp. 3193-3196
Khanh Nguyen-Phi , Signal Process. & Multimed. Group, British Columbia Univ., Vancouver, BC, Canada
pp. 3197-3200
Tuyet-Trang Lam , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 3201-3204
G.P. Abousleman , Syst. Solutions Group, Motorola Inc., Scottsdale, AZ, USA
pp. 3205-3208
A. Quddus , Dept. of Electr. Eng., King Fahd Univ. of Pet. & Miner., Dhahran, Saudi Arabia
pp. 3213-3216
Yu-Len Huang , Dept. of Comput. Sci. & Inf. Eng., Nat. Chung-Hsing Univ., Taichung, Taiwan
pp. 3217-3220
P. Monasse , CMLA, Ecole Normale Superieure de Cachan, France
pp. 3221-3224
G. Bozkurt , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 3225-3228
P.D. Wirawan , Dept. Traitement du Signal et des Images, ENST Paris, France
pp. 3229-3232
S. Chardon , ENSSAT, Rennes I Univ., France
pp. 3233-3236
S.E. Reichenbach , Dept. of Comput. Sci. & Eng., Nebraska Univ., Lincoln, NE, USA
pp. 3237-3240
R. Neelamani , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 3241-3244
A. Restrepo , Dept. Ing. Electr. y Electron., Univ. de Los Andes, Santafe de BogotaMerida, Colombia
pp. 3245-3248
N. Nguyan , Sci. Comput. & Comput. Math. Program, Stanford Univ., CA, USA
pp. 3249-3252
R. Molina , Dept. de Ciencias de la Comput. e Inteligencia Artificial, Granada Univ., Spain
pp. 3257-3260
I. Yamada , Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Japan
pp. 3261-3264
R.R. Schulta , Dept. of Electr. Eng., North Dakota Univ., Grand Forks, ND, USA
pp. 3265-3268
T.S. Choi , Dept. of Mech., Kwangju Inst. of Sci. & Technol., South Korea
pp. 3269-3272
A new view of shape (Abstract)
V. Chandran , Sch. of Electr. & Electron. Syst. Eng., Queensland Univ., Brisbane, Qld., Australia
pp. 3277-3280
J. Stauder , IRISA, Rennes, France
pp. 3285-3288
O. Cuisenaire , Commun. & Remote Sensing Lab., Katholieke Univ., Leuven, Belgium
pp. 3293-3296
N. Eua-Anant , Dept. of Electr. & Comput. Eng., Iowa State Univ., Ames, IA, USA
pp. 3297-3300
N. Sochen , Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
pp. 3301-3304
J.C. Nascimento , Inst. Superior Tecnico, Lisbon, Portugal
pp. 3305-3308
L. Ji , Sch. of Electr. & Inf. Eng., Sydney Univ., NSW, Australia
pp. 3309-3312
Jia Li , Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 3313-3316
J.S. Marques , ISR, Inst. Superior Tecnico, Lisbon, Portugal
pp. 3317-3320
J. Banks , Space Centre for Satellite Navigation, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 3321-3324
V. Ortmann , Dept. of Comput. Sci. VI, Bonn Univ., Germany
pp. 3325-3328
N. Merlet , Inst. of Comput. Sci., Hebrew Univ., Jerusalem, Israel
pp. 3329-3332
R. Meth , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 3333-3336
B. Li , Center for Autom. Res., Maryland Univ., College Park, MD, USA
pp. 3337-3340
L. Carin , Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
pp. 3341-3344
M. Hemmendorff , Dept. of Electr. Eng., Linkoping Univ., Sweden
pp. 3345-3348
Mingqi Kong , Dept. of Syst. Sci. & Math., Washington Univ., St. Louis, MO, USA
pp. 3353-3356
S. Srinivasan , Center for Autom. Res., Maryland Univ., College Park, MD, USA
pp. 3357-3360
R. Chellappa , Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea
pp. 3361-3364
J.E. Santos Conde , Fraunhofer Inst. of Microelectron. Circuits & Syst., Duisburg, Germany
pp. 3365-3368
C.B. Peel , Dept. of Electr. & Comput. Eng., Utah State Univ., Logan, UT, USA
pp. 3369-3372
K. Mukherjee , Sch. of Comput. Sci., Univ. of Central Florida, Orlando, FL, USA
pp. 3373-3376
A.P. Tzannes , Air Force Res. Lab., Hanscom AFB, Bedford, MA, USA
pp. 3377-3380
Yui-Lam Chan , Dept. of Electron. & Inf. Eng., Hong Kong Polytech., Kowloon, Hong Kong
pp. 3381-3384
D. Bereziat , Inst. Nat. de Recherche en Inf. et Autom., Le Chesnay, France
pp. 3385-3388
V.F. Ruiz , Dept. of Cybern., Reading Univ., UK
pp. 3389-3392
Chun-Jen Tsai , Electr. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
pp. 3393-3396
S. Tsekeridou , Dept. of Inf., Aristotelian Univ. of Thessaloniki, Greece
pp. 3397-3400
G. Jammal , Inst. fur Netwerk und Signaltheor., Tech. Univ. Darmstadt, Germany
pp. 3401-3404
C. Weerasinghe , Dept. of Electr. Eng., Sydney Univ., NSW, Australia
pp. 3405-3408
E. Lin , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 3409-3412
S.S.S. Poon , Dept. of Electr. & Comput. Eng., British Columbia Univ., Vancouver, BC, Canada
pp. 3413-3416
K.E. Timmermann , Michigan State Univ., East Lansing, MI, USA
pp. 3417-3420
K.J. Jones , ENSEA, CNRS, Cergy, France
pp. 3421-3424
D.L. Guidry , Dept. of Electr. Eng., Louisville Univ., KY, USA
pp. 3425-3428
N.A. Mohamed , Dept. of Electr. Eng., Louisville Univ., KY, USA
pp. 3429-3432
D. Kunz , Philips Res. Lab., Aachen, Germany
pp. 3433-3436
M. Mese , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 3437-3440
Yu-Ping Wang , Dept. of Math., Nat. Univ. of Singapore, Singapore
pp. 3441-3444
M. Haseyama , Sch. of Eng., Hokkaido Univ., Sapporo, Japan
pp. 3445-3448
I. Pollak , Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
pp. 3449-3452
S. Uchihashi , FX Palo Alto Lab., CA, USA
pp. 3453-3456
T. Nakajima , Dept. of Electr. Eng., Keio Univ., Yokohama, Japan
pp. 3457-3460
O.C. Au , Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong
pp. 3461-3464
M.J. Vrhel , Color Savvy Syst. Ltd., Springboro, OH, USA
pp. 3465-3468
V. Solachidis , Dept. of Inf., Thessaloniki Univ., Greece
pp. 3469-3472
E.M. Izquierdo , Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
pp. 3473-3476
Y.S. Tawfik , Electron. Res. Inst., Giza, Egypt
pp. 3481-3484
Lei Zheng , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 3485-3488
S. Muller , Dept. of Comput. Sci., Gerhard-Mercator-Univ., Duisburg, Germany
pp. 3489-3492
S. Sista , Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 3493-3496
E. Clark , Dept. of Electron. & Electr. Eng., Dublin Univ., Ireland
pp. 3497-3500
Fang Liu , Lincoln Lab., MIT, Lexington, MA, USA
pp. 3501-3504
C. Garnier , Dept. Inf., Ecole Louis de Broglie, Bruz, France
pp. 3513-3516
Shen-Fu Hsiao , Inst. of Comput. & Inf. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
pp. 3517-3520
A.N. Marana , Univ. Estadual Paulista, Sao Paulo, Brazil
pp. 3521-3524
R. Rau , Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 3525-3528
X. Dupuis , Univ. de Nice-Sophia Antipolis, Valbonne, France
pp. 3529-3532
T. Tan , Sch. of Electr. & Inf. Eng., Sydney Univ., NSW, Australia
pp. 3537-3540
Chung-Lin Huang , Dept. of Electr. Eng., Univ. of South California, Los Angles, CA, USA
pp. 3541-3544
J. Maciel , Inst. de Sistemas e Robotica, Inst. Superior Tecnico, Lisbon, Portugal
pp. 3545-3548
P. Morguet , Inst. for Human-Machine-Commun., Munchen Univ. of Technol., Germany
pp. 3549-3552
A.V. Nefian , Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 3553-3556
A.M. Alattar , Digimarc, Lake Oswego, OR, USA
pp. 3557-3560
M. Harteneck , Signal Process. Div., Strathclyde Univ., Glasgow, UK
pp. 3565-3568
Hen-Geul Yeh , Dept. of Electr. Eng., California State Univ., Long Beach, CA, USA
pp. 3569-3572
C.H.G. Wright , Dept. of Electr. Eng., US Air Force Acad., Colorado Springs, CO, USA
pp. 3573-3576
J.W. Pierre , Dept. of Electr. Eng., Wyoming Univ., Laramie, WY, USA
pp. 3577-3580
E. Doering , Dept. of Electr. & Comput. Eng., Rose-Hulman Inst. of Technol., Terre Haute, IN, USA
pp. 3581-3584
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