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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1999)
Phoenix, AZ, USA
Mar. 15, 1999 to Mar. 19, 1999
ISBN: 0-7803-5041-3
TABLE OF CONTENTS
Author Index (Abstract)
pp. A1-A13
P. Prandoni , LCAV, Ecole Polytech. Fed. de Lausanne, Switzerland
pp. 2411-2414
Wenqing Jiang , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 2419-2422
D. Sinha , Bell Labs., Lucent Technol., Murray Hill, NJ, USA
pp. 2423-2426
A. Bernard , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 2427-2430
Hanying Feng , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 2435-2438
D. Kalogiros , Lab. of Wire Commun., Patras Univ., Greece
pp. 2439-2442
K. Engan , Dept. of Electr. & Comput. Eng., Hogskolen i Stavanger, Stavanger, Norway
pp. 2443-2446
W.-H.J. Chen , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 2447-2450
M. Park , Dept. of Electr. Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 2451-2454
F. Labeau , UCL Commun. & Remote Sensing Lab., Louvain-La-Neuve, Belgium
pp. 2455-2458
F. Marvasti , Dept. of Electron., King's Coll., London, UK
pp. 2459-2462
Z. Cvetkovic , AT&T Labs.-Res., Florham Park, NJ, USA
pp. 2463-2466
Hongya Ge , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 2467-2470
H. Ketterer , Inst. fur Nachrichtentech., Karlsruhe Univ., Germany
pp. 2471-2474
K.S.M. Lee , Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 2475-2478
D.K. Borah , Telecommun. Eng. Group, Australian Nat. Univ., Canberra, ACT, Australia
pp. 2479-2482
J. Gomes , Inst. de Sistemas e Robotica, Inst. Superior Tecnico, Lisbon, Portugal
pp. 2483-2486
A. Doucet , Dept. of Eng., Cambridge Univ., UK
pp. 2487-2490
J. Mannerkoski , Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 2491-2494
S. Lambotharan , Sect. of Signal Process. & Digital Syst., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 2499-2502
S. Fiori , Dipt. di Elettronica e Autom., Ancona Univ., Italy
pp. 2507-2510
Hui Luo , Digital Video Express, Herndon, VA, USA
pp. 2511-2514
M. Milisavljevic , Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2515-2518
Shan Mo , Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
pp. 2519-2522
A. Flaig , Dept. of Electr. & Comput. Eng., Delaware Univ., Newark, DE, USA
pp. 2523-2526
Zhengyuan Xu , Dept. of Electr. & Comput. Eng., Stevens Inst. of Technol., Hoboken, NJ, USA
pp. 2531-2534
Kemin Li , Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
pp. 2535-2538
Qing Zhao , Dept. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 2539-2542
Ph. Loubaton , Lab. Syst. de Commun., Univ. de Marne-la-Vallee, Marne la Vallee, France
pp. 2543-2546
K.C. Teh , Centre for Wireless Commun., Singapore Sci. Park II, Singapore
pp. 2547-2550
J. Blom , Dept. of Electr. Eng., Linkoping Univ., Sweden
pp. 2551-2554
Younsun Kim , Dept. of Electron. Eng., Yonsei Univ., Seoul, South Korea
pp. 2555-2558
P. Shan , Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
pp. 2559-2562
S. Bouchired , Nat. Polytech. Inst. of Toulouse, Toulouse, France
pp. 2563-2566
A. Hayar , GAPSE, Toulouse, France
pp. 2567-2570
P. Strauch , Lucent Technol., AT&T Bell Lab., Swindon, UK
pp. 2571-2574
J.J. Murillo-Fuentes , Dept. de Teoria de la Senal y Comunicaciones, Carlos Univ. III de Madrid, Spain
pp. 2575-2578
J.Q. Trelewicz , Telecommun. Res. Center, Arizona State Univ., Tempe, AZ, USA
pp. 2579-2582
Yong-Suk Moon , Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2583-2586
M. Nafie , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2587-2590
C. Tidestav , Uppsala Univ., Sweden
pp. 2591-2594
S. Gollamudi , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2595-2598
A.M. Sayeer , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 2599-2602
X.F. Wang , Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
pp. 2603-2606
E.N. Onggosanusi , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 2611-2614
Xiaodong Wang , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 2615-2618
Xiang-Yang Zhaung , Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 2623-2626
S. Barbarossa , Infocom Dept., Rome Univ., Italy
pp. 2627-2630
A. Gorokhov , Ecole Superieure d'Electr., CNRS, Gif-sur-Yvette, France
pp. 2631-2634
M.A. Haun , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 2647-2650
T.N. Davidson , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 2651-2654
M.A.A. Ali , Dept. of Electr. Commun., Fac. of Electron. Eng., Manouf, Egypt
pp. 2655-2658
M. Sliskovic , Fac. of Electr. Eng. & Comput., Zagreb Univ., Croatia
pp. 2659-2662
J. Joutsensalo , Jyvaskyla Univ., Finland
pp. 2663-2666
T. Ekman , Signal Syst. Group, Uppsala Univ., Sweden
pp. 2667-2670
J.T. Stonick , Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
pp. 2671-2674
M. Ghosh , Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 2675-2678
N. Warke , DEP R&D Center, Texas Instrum. Inc., Dallas, TX, USA
pp. 2679-2682
Baibing Li , Dept. of Electr. Eng., Katholieke Univ., Leuven, Belgium
pp. 2683-2686
A. Scaglione , INFOCOM Dept., Rome Univ., Italy
pp. 2687-2690
Junqiang Shen , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 2691-2694
A. Host-Madsen , TRLabs, Calgary Univ., Alta., Canada
pp. 2695-2698
I. Ghauri , Inst. Eurecom, Sophia Antipolis, France
pp. 2699-2702
J.K. Tugnait , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 2707-2710
G. Vazquez , Dept. of Signal Theor. & Commun., Polytech. Univ. of Catalonia, Barcelona, Spain
pp. 2711-2714
S. Buzzi , Dipt. di Ing. Elettronica e Telecomunicazioni, Napoli, Italy
pp. 2715-2718
J.H. Gunther , Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 2725-2728
Xiaowen Wang , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 2733-2736
P. Eriksson , Electron. Syst. Design Lab., R. Inst. of Technol., Stockholm, Sweden
pp. 2737-2740
B. Muquet , Centre de Recherche, Motorola Paris, Gif-sur-Yvette, France
pp. 2745-2748
H. Bolcskei , Inst. of Commun. & Radio-Frequency Eng., Vienna Univ. of Technol., Austria
pp. 2749-2752
N. Lashkarian , Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
pp. 2753-2756
D.A. Abraham , Dept. of Electr. & Syst. Eng., Connecticut Univ., Storrs, CT, USA
pp. 2757-2760
D.W. Tufts , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 2761-2764
Z.-H. Michalopoulou , Dept. of Math. Sci., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 2765-2768
Biao Chen , Connecticut Univ., Storrs, CT, USA
pp. 2769-2772
A. Dogandzic , Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
pp. 2773-2776
A. Nehorai , Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
pp. 2781-2784
K. Harmanci , Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
pp. 2789-2792
S.D. Elton , Electron. Warfare Div., Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 2801-2804
S.R. Dooley , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 2809-2812
Yong Wu , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 2813-2816
Qunfei Zhang , Coll. of Marine Eng., Northwestern Polytech. Univ., Xian, China
pp. 2817-2820
J.W.C. Robinson , Defense Res. Establ., Stockholm, Sweden
pp. 2821-2824
M. Jansson , Dept. of Signals, Sensors, & Syst., R. Inst. of Technol., Sweden
pp. 2825-2828
P. Forster , Lab. Electron. et Commun., CNAM, Paris, France
pp. 2829-2832
M. Haardt , Siemens AG, Munich, Germany
pp. 2837-2840
C.P. Mathews , Dept. of Electr. & Comput. Eng., Univ. of West Florida, Pensacola, FL, USA
pp. 2841-2844
Y.I. Abramovich , Cooperative Res. Centre for Sensor Signal & Inf. Process., Mawson Lakes, SA, Australia
pp. 2845-2848
Y. Seliktar , Centre for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2849-2852
R. Chandrasekaran , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 2853-2856
B.M. Sadler , Army Res. Lab., Adelphi, MD, USA
pp. 2857-2860
V. Krishnamurthy , Dept. of Electr. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 2865-2868
A.M. Rao , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 2869-2872
M. Chenu-Tournier , Thomson-CSF Commun., Gennevilliers, France
pp. 2873-2876
Y. Inouye , Dept. of Electron. & Control Syst. Eng., Shimane Univ., Matsue, Japan
pp. 2889-2892
D.L. Jones , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 2893-2896
J. Xavier , Inst. de Sistemas e Robotica, Inst. Superior Tecnico, Lisbon, Portugal
pp. 2897-2900
L. Deneire , Inst. EURECOM, Sophia Antipolis, France
pp. 2905-2908
N. Charkani , Dept. of Adv. Dev., Philips Consumer Commun., Le Mans, France
pp. 2909-2912
Liang Jin , Inst. of Inf. Eng., Xi'an Jiaotong Univ., China
pp. 2913-2916
Yong Xiang , Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 2917-2920
A.-J. van der Veen , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 2921-2924
W. Pora , Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 2925-2928
O. Munoz , Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 2929-2932
Yung-Fang Chen , Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2933-2936
A. Leshem , Delft Univ. of Technol., Netherlands
pp. 2937-2940
R. Raich , Dept. of Electr. Eng.-Syst., Tel Aviv Univ., Israel
pp. 2941-2944
M. Rupi , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 2945-2948
M. Meng , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 2957-2959
T. Svantesson , Dept. of Signals & Syst., Chalmers Univ. of Technol., Goteborg, Sweden
pp. 2961-2964
Ho Yang , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2969-2972
M.A. Ingram , Naval Undersea Warfare Centre, Newport, RI, USA
pp. 2973-2976
Hong Jeong , Dept. of Electr. Eng., POSTECH, Pohang, South Korea
pp. 2977-2980
Y. Zhang , Dept. of Electr. Eng. & Comput. Sci., Lehigh Univ., Bethlehem, PA, USA
pp. 2981-2984
M.J. Smith , Defence Evaluation & Res. Agency, Malvern, UK
pp. 2985-2988
D. Peters , Nortel Technol., Montreal, Que., Canada
pp. 2989-2992
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