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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1999)
Phoenix, AZ, USA
Mar. 15, 1999 to Mar. 19, 1999
ISBN: 0-7803-5041-3
TABLE OF CONTENTS
Author Index (Abstract)
pp. A1-A13
Yuexian Zou , Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
pp. 1765-1768
H. Oktem , Process. Lab., Tampere Univ. of Technol., Finland
pp. 1769-1772
H. Krim , Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 1773-1776
P. Stoica , Syst. & Control Group, Uppsala Univ., Sweden
pp. 1777-1780
T. Kimura , R&D Lab., Kyushu Matsushita Electr. Co. Ltd., Japan
pp. 1785-1788
G.T. Venkatesan , Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 1789-1792
R. Ruiz , Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 1793-1796
K.I. Diamantaras , Dept. of Inf., Technol. Educ. Inst., Sindos, Greece
pp. 1801-1804
G. Olmo , Dept. of Electron., Politecnico di Torino, Italy
pp. 1805-1808
J.-J. Fuchs , Rennes I Univ., France
pp. 1809-1812
J. Riba , Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 1817-1820
P.M. Oliveira , Escola Naval-DAEI, Almada, Portugal
pp. 1821-1824
P.M. Baggenstoss , Naval Undersea Warfare Center, Newport, RI, USA
pp. 1825-1828
A. Nehorai , Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
pp. 1829-1832
S.G. Sankaran , Bradley Dept. of Electr. Eng. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
pp. 1837-1840
S. Koike , NEC Corp., Tokyo, Japan
pp. 1845-1848
Cheng-Shing Wu , Dept. of Electr. Eng., Nat. Central Univ., Chung-Li, Taiwan
pp. 1849-1852
M.I. Haddad , Dept. of Electr. Eng., Jordan Univ. of Sci. & Technol., Irbid, Jordan
pp. 1853-1856
M.L.R. De Campos , Programa de Engenharia Eletrica, Univ. Fed. do Rio de Janeiro, Brazil
pp. 1857-1860
M.R. Petraglia , Fed. Univ. of Rio de Janeiro, Brazil
pp. 1861-1864
Junghsi Lee , Dept. of Electr. Eng., Yuan-Ze Univ., Chung-Li, Taiwan
pp. 1865-1868
O.J. Tobias , Dept. of Electr. Eng., Univ. Fed. de Santa Catarina, Florianapolis, Brazil
pp. 1873-1876
M. Lundberg , Div. of Signal Process., Lulea Univ. of Technol., Sweden
pp. 1877-1880
R. Henning , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 1881-1884
B.W. Suter , Air Force Res. Lab., IFGC, Rome, NY, USA
pp. 1885-1888
S. Tongsima , Dept. of Comput. Sci. & Eng., Notre Dame Univ., IN, USA
pp. 1889-1892
M. Goel , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 1893-1896
P.D. Fiore , Sanders, Lockheed Martin Co., Nashua, NH, USA
pp. 1897-1900
D. Kirovski , Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
pp. 1901-1904
S. McInerney , Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
pp. 1909-1912
Wei-Lung Liu , Dept. of Electr. Eng., Nat. Chung Cheng Univ., Taiwan
pp. 1917-1920
Ching-Hsien Chang , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 1921-1924
J. Bonk , Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
pp. 1925-1928
Shen-Fu Hsiao , Inst. of Comput. & Inf. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
pp. 1929-1932
G. Lightbody , Queen's Univ., Belfast, UK
pp. 1933-1936
R.A. Freking , Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 1937-1940
S. Rovetta , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 1941-1944
T. Le , Inst. of Microelectron. Syst., Tech. Hochschule Darmstadt, Germany
pp. 1949-1952
V.G. Moshnyaga , Dept. of Electron. & Comput. Sci., Fukuoka Univ., Japan
pp. 1953-1956
J.H. Takala , Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 1957-1960
Bai-Jue Shie , Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 1961-1964
L. Navoni , Innovative Syst. Design Group, Milan, Italy
pp. 1965-1968
M. Novell , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 1969-1972
S. Bellis , Nat. Microelectron. Res. Centre, Univ. Coll. Cork, Ireland
pp. 1973-1976
J.Y.F. Hsieh , Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 1977-1980
T. Takizawa , C&C Media Res. Labs., NEC Corp., Kawasaki, Japan
pp. 1981-1984
D. Kirovski , Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
pp. 1993-1996
T.W. O'Neil , Dept. of Comput. Sci. & Eng., Notre Dame Univ., IN, USA
pp. 2001-2004
S. Kobayashi , Mobile Commun. Syst., Tech. Univ. Dresden, Germany
pp. 2009-2012
D.M. Etter , Sci. & Technol., Washington, DC, USA
pp. 2017-2020
T.P. Barnwell , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2021-2024
R.W. Schafer , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 2025-2028
S. Lamouri , Dept. of Electr. & Comput. Eng., San Diego State Univ., CA, USA
pp. 2029-2032
V. Stonick , Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
pp. 2033-2036
C.R. Hewes , Texas Instrum. Inc., Dallas, TX, USA
pp. 2037-2038
J.J. Benedetto , Dept. of Math., Maryland Univ., College Park, MD, USA
pp. 2039-2042
P.J.S.G. Ferreira , Dept. de Electron. e Telecoms, Aveiro Univ., Portugal
pp. 2043-2046
T. Strohmer , Dept. of Math., California Univ., Davis, CA, USA
pp. 2047-2050
D. Walnut , Dept. of Math. Sci., George Mason Univ., Fairfax, VA, USA
pp. 2051-2054
G.G. Walter , Dept. of Math. Sci., Wisconsin Univ., Milwaukee, WI, USA
pp. 2057-2059
B. Chen , Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
pp. 2061-2064
M. Wu , Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 2065vol.4-2064
F. Mintzer , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 2067-2069
J.-P. Linnartz , Philips Res. Lab., Eindhoven, Netherlands
pp. 2071-2074
A.H. Tewfik , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2075vol.4-2074
P. Jessop , Int. Fed. of the Phonographic Ind., London, UK
pp. 2077-2078
J.-C. Junqua , Speech Technol. Lab., Panasonic Technols Inc., Santa Barbara, CA, USA
pp. 2083-2086
Guojun Zhou , Robust Speech Process. Lab., Duke Univ., Durham, NC, USA
pp. 2087-2090
A.J. South , Syst. Integration Dept, Defence Eval. & Res. Agency, Farnborough, UK
pp. 2095-2098
D.C. Munson , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 2099-2102
M. Papazoglou , Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
pp. 2103-2106
M. Porter , Marine Phys. Lab., La Jolla, CA, USA
pp. 2107-2110
P. Gerstoft , Marine Phys. Lab., Univ. of California, San Diego, CA, USA
pp. 2111-2114
P. Runkle , Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
pp. 2115-2118
U. Meyer-Baese , High Speed Digital Archit. Lab., Florida Univ., Gainesville, FL, USA
pp. 2119-2122
C. Dick , Xilinx Inc., San Jose, CA, USA
pp. 2123-2126
Dongho Kim , Adv. Micro Devices Inc., Austin, TX, USA
pp. 2127-2130
K. Nadehara , C&C Media Res. Labs., NEC Corp., Kawasaki, Japan
pp. 2131-2134
S.M. Joshi , CSEE Dept., Maryland Univ., Baltimore, MD, USA
pp. 2135-2138
J. Fridman , Analog Devices Inc., Norwood, MA, USA
pp. 2139-2142
J.G.R. Delva , Dept. of Electr. Eng. & Comput. Sci., Wisconsin Univ., Milwaukee, WI, USA
pp. 2143-2146
Hao Shi , Siemens Microelectron. Inc., San Jose, CA, USA
pp. 2147-2150
E.A. Suominen , Squire, Sanders & Dempsey LLP, Phoenix, AZ, USA
pp. 2151-2154
Bogong Su , Dept. of Comput. Sci., William Paterson Coll., Wayne, NJ, USA
pp. 2155-2158
S. Masud , DSiP Labs., Queen's Univ., Belfast, UK
pp. 2167-2170
M. Ben-Romdhane , Rockwell Inst. Sci. Center, Thousand Oaks, CA, USA
pp. 2175-2178
H.C. Bhagatwala , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 2179-2182
O. Tanrikulu , DSP Software Eng. Inc., Bedford, MA, USA
pp. 2183-2186
W. Jacklin , Electron. & Syst. Integration Div., Northrop Grumman Corp., Rolling Meadows, IL, USA
pp. 2191-2194
A. Mehaoua , Centre for Commun. Syst. Res., Cambridge Univ., UK
pp. 2195-2198
E. Daeipour , DSP Software Eng. Inc., Bedford, MA, USA
pp. 2199-2202
H. Sampath , Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 2203-2206
Junchen Du , Wireless & Multimedia Microelectron. Group, Lucent Technol., Allentown, PA, USA
pp. 2207-2210
M.S. Andrews , LOGIC Devices Inc., Sunnyvale, CA, USA
pp. 2215-2218
S. Narang , IBM Solutions Res. Center, New Delhi, India
pp. 2219-2222
M. Budagavi , DSP Sols. R&D Center, Texas Instrum. Inc., Dallas, TX, USA
pp. 2223-2226
I. Koo , British Columbia Univ., Vancouver, BC, Canada
pp. 2227-2230
R.D. Turney , CORE Solutions Group, Xilinx Inc., San Jose, CA, USA
pp. 2231-2234
Yap-Peng Tan , Digital Imaging & Video Div., Intel Corp., Chandler, AZ, USA
pp. 2239-2242
G.P. Abousleman , Syst. Solutions Group, Motorola Inc., Scottsdale, AZ, USA
pp. 2243-2246
L.L. Winger , Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
pp. 2247-2250
S. Carstens-Behrens , Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
pp. 2255-2258
Y. Muthusamy , DSP Solutions R&D Center, Texas Instrum. Inc., Dallas, TX, USA
pp. 2259-2262
A. Unsal , Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
pp. 2263-2266
S. Fornero , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 2267-2270
R. Miralles , Dipt. Comunicaciones, Univ. Politecnica de Valencia, Spain
pp. 2271-2274
J.C. Ralston , Dept. of Exploration & Min., CSIRO, Kenmore, Qld., Australia
pp. 2275-2278
A. Green , Honeywell-Measurex, Arizona State Univ., Phoenix, AZ, USA
pp. 2279-2282
J. Kridner , Texas Instrum. Inc., Stafford, TX, USA
pp. 2283-2286
Hyen-O Oh , Dept. of Electron. Eng., Yonsei Univ., Seoul, South Korea
pp. 2287-2290
Fenghua Liu , Nokia Mobile Phones, San Diego, CA, USA
pp. 2299-2302
R. Heidari , AT&T Bell Labs., Florham Park, NJ, USA
pp. 2303-2306
C.S. Xydeas , Speech & Image Process. Lab., Manchester Univ., UK
pp. 2311-2314
M. Ikeda , Graduate Sch. of Eng., Nagoya Univ., Japan
pp. 2315-2318
M.A. Koets , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 2319-2322
S.M. Kogon , Lincoln Lab., MIT, Lexington, MA, USA
pp. 2323-2326
Ping Gao , Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
pp. 2327-2330
M. Pattichis , Dept. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 2331-2334
A. Kam , Dept. of Electr. & Comput. Eng., Ben-Gurion Univ. of the Negev, Beer-Sheva, Israel
pp. 2335-2338
B. Boashash , Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 2351-2354
I. Christoyianni , Dept. of Electr. & Comput. Eng., Patras Univ., Greece
pp. 2355-2358
D. Chowdhury , Comput. Enhancement Archit. Lab., Intel Corp., Chandler, AZ, USA
pp. 2363-2366
Zhemin Tu , Dept. of Appl. Sci., Arkansas Univ., Little Rock, AR, USA
pp. 2367-2370
V. Kafedziski , Telecommun. Res. Center, Arizona State Univ., Tempe, AZ, USA
pp. 2375-2378
J.E. Kleider , Solutions Group, Motorola Inc., Scottsdale, AZ, USA
pp. 2379-2382
C. Brunner , Siemens AG, Munich, Germany
pp. 2383-2386
M. Akiho , Alpine Electron. Inc., Hokkaido Univ., Sapporo, Japan
pp. 2387-2390
J. Chaoui , Wireless Bus. Unit, Texas Instrum., Villeneuve Loubet, France
pp. 2391-2394
I. Haskan , Dept. of Electr. & Electron. Eng., Bogazici Univ., Istanbul, Turkey
pp. 2399-2402
Duanpei Wu , Dept. of Spoken Language Technol., Sony US Res. Labs., San Jose, CA, USA
pp. 2407-2410
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