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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1999)
Phoenix, AZ, USA
Mar. 15, 1999 to Mar. 19, 1999
ISBN: 0-7803-5041-3
TABLE OF CONTENTS
C. Chesta , Dipt. di Autom. e Inf., Politecnico di Torino, Italy
pp. 557-560
K.A. Papineni , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 561-564
S. Tsakalidis , Dept. of Electron. & Comput. Eng., Tech. Univ. of Crete, Chania, Greece
pp. 569-572
W. Reichl , Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 573-576
Qiang Huo , Dept. of Comput. Sci. & Inf. Syst., Hong Kong Univ., Hong Kong
pp. 577-580
P. McMahon , Sch. of Electr. Eng., Queen's Univ., Belfast, UK
pp. 581-584
P. Clarkson , Res. Lab., Compaq Comput. Corp., Cambridge, MA, USA
pp. 585-588
A. Sixtus , Luhrstuhl fur Inf., Tech. Hochschule Aachen, Germany
pp. 593-596
C.D. Mitchell , Lucent Technol., AT&T Bell Labs., Naperville, IL, USA
pp. 597-600
Fang Zheng , Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
pp. 601-604
Qi Li , Multimedia Commun. Res. Lab., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 605-608
K. Beulen , Lehrstuhl fur Inf., Tech. Hochschule Aachen, Germany
pp. 609-612
L. Nguyen , BBN Technol., GTE Internetworking, Cambridge, MA, USA
pp. 613-616
P. Geutner , Interactive Syst. Labs., Karlsruhe Univ., Germany
pp. 617-620
M. Penagarikano , Dept. Electr. y Electron., Pais Vasco Univ., Lejona, Spain
pp. 621-624
K. Ohtsuki , NTT Human Interface Labs., Kanagawa, Japan
pp. 625-628
E.C. Kaiser , Center for Spoken Language Understanding, Oregon Graduate Inst., Portland, OR, USA
pp. 629-632
Bor-Shen Lin , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 637-640
D. Llorens , Unitat Predepartmental d'Inf., Univ. Jaume I, Castello, Spain
pp. 641-644
J. Davenport , BBN Technol., GTE Internetworking, Cambridge, MA, USA
pp. 645-648
W.M. Fisher , Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
pp. 649-652
J.J. Parry , TITR Whisper Labs., Wollongong Univ., NSW, Australia
pp. 653-656
A. Vasilache , Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 657-660
J. Rothweiler , Sanders, Hudson, NH, USA
pp. 661-664
B. Novorita , Motorola Inc., Schaumburg, IL, USA
pp. 665-668
M.N. Murthi , Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 669-672
P. Hedelin , Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
pp. 677-680
J. Linden , Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
pp. 681-684
S. Doshita , Human Language Technol. Center, Univ. of Sci. & Technol., Clear Water Bay, Hong Kong
pp. 689-692
Yeou-Jiunn Chen , Dept. of Comput. Sci. & Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 697-700
A. Wendemuth , Philips Res. Lab., Aachen, Germany
pp. 705-708
J.A. Bilmes , Int. Comput. Sci. Inst., Berkeley, CA, USA
pp. 713-716
J.R. Bellegarda , Spoken Language Group, Apple Comput. Inc., Cupertino, CA, USA
pp. 717-720
A.L. Gorin , Dept. of Speech Res., AT&T Bell Labs., Florham Park, NJ, USA
pp. 721-724
A. Varona , Dept. de Electr. y Electron., Pais Vasco Univ., Bilbao, Spain
pp. 729-732
M.P. Harper , Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 733-736
M. Suzuki , Comput. Center, Tohoku Univ., Sendai, Japan
pp. 737-740
F. Wessel , Lehrstuhl fur Inf., Tech. Hochschule Aachen, Germany
pp. 741-744
A. Kalai , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 745-748
R. Kuhn , Speech Technol. Lab., Panasonic Technol. Inc., Santa Barbara, CA, USA
pp. 749-752
Zuoying Wang , Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
pp. 753-756
J. McDonough , Center for Language & Speech Process., Johns Hopkins Univ., Baltimore, MD, USA
pp. 757-760
L. Welling , Tech. Hochschule Aachen, Germany
pp. 761-764
D. Matrouf , Lab. d'Inf. pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
pp. 785-788
Chuang He , T Div., Los Alamos Nat. Lab., NM, USA
pp. 793-796
A. Yasmin , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
pp. 797-800
Kuan-Chieh Yen , Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 801-804
D.V. Anderson , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 805-808
L.R. Yanguas , Lincoln Lab., MIT, Lexington, MA, USA
pp. 813-816
J. McLaughlin , Lincoln Lab., MIT, Lexington, MA, USA
pp. 817-820
I. Magrin-Chagnolleau , AT&T Bell Labs., Forham Park, NJ, USA
pp. 821-824
O. Siohan , Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 825-828
Qi Li , Dept. of Defense, Ft. Meade, MD, USA
pp. 829-832
B.L. Pellom , Robust Speech Process. Lab., Duke Univ., Durham, NC, USA
pp. 837-840
T. Isobe , Lab. for Inf. Technol., NTT Data Corp., Kanagawa, Japan
pp. 841-844
L. Liu , Dept. of Speech & Hearing Sci., Arizona State Univ., Tempe, AZ, USA
pp. 845-848
S.A. Zahorian , Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
pp. 849-852
J. Benesty , Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 853-856
W.A. Frank , Mobile Phones Dept., Siemens AG, Munich, Germany
pp. 865-868
E. Woudenberg , Human Inf. Process. Lab., Adv. Telecommun. Res., Kyoto, Japan
pp. 869-872
S. Gustafsson , Inst. of Commun. Syst. & Data Process., Tech. Hochschule Aachen, Germany
pp. 873-876
A. Stenger , Telecommun. Lab., Erlangen-Nurnberg Univ., Germany
pp. 877-880
B.D. Radlovic , Dept. of Eng., Australian Nat. Univ., Canberra, ACT, Australia
pp. 881-884
M. de Diego , Dept. of Comunicaciones, Univ. Politecnica de Valencia, Spain
pp. 885-888
A. Harma , Lab. of Acoust. & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland
pp. 893-896
T.R. Trinkaus , Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 901-904
Yuan-Hao Huang , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 905-908
M. Erne , Signal & Inf. Process. Lab., Fed. Inst. of Technol., Zurich, Switzerland
pp. 909-912
H. Najafzadeh-Azghandi , Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, Que., Canada
pp. 913-916
C.A. Lanciani , Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 917-920
S. Wyrsch , Inst. for Signal & Inf. Process., Fed. Inst. of Technol., Zurich, Switzerland
pp. 921-924
M.G. Siqueira , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 925-928
M. Karjalainen , Lab. of Acoust. & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland
pp. 929-932
T.F. Quatieri , Lincoln Lab., MIT, Lexington, MA, USA
pp. 945-948
M.S. Brandstein , Div. of Eng. & Appl. Sci., Harvard Univ., Cambridge, MA, USA
pp. 953-956
R. Rabenstein , Telecommun. Lab., Erlangen-Nurnberg Univ., Germany
pp. 957-960
C.I. Cheng , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 961-964
R.O. Duda , Dept. of Electr. Eng., San Jose State Univ., CA, USA
pp. 965-968
H.F. Silverman , Div. of Eng., Brown Univ., Providence, RI, USA
pp. 969-972
L. Savioja , Lab. of Acoust. & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland
pp. 973-976
V. Valimaki , Lab. of Acoust. & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland
pp. 977-980
T.S. Verma , Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 981-984
S.N. Levine , Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 985-988
Y.H. Lam , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 989-992
T. Hodes , Comput. Sci. Div., California Univ., Berkeley, CA, USA
pp. 993-996
A. Uncini , Dipt. di Elettronica e Autom., Ancona Univ., Italy
pp. 997-1000
K. Reinhard , Dept. of Eng., Cambridge Univ., UK
pp. 1001-1004
D. Rodriguez-Porcheron , Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 1005-1008
H. Schwenk , Int. Comput. Sci. Inst., Berkeley, CA, USA
pp. 1009-1012
T. Balachander , Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
pp. 1017-1020
E. Maeda , NTT Basic Res. Labs., Atsugi, Japan
pp. 1025-1028
D.J. Miller , Dept. of Electr. Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 1029-1032
D.P. Mandic , Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 1037-1040
M. Winter , CNRS, Sophia-Antipolis, France
pp. 1041-1044
Dongxin Xu , Comput. NeuroEng. Lab., Florida Univ., Gainesville, FL, USA
pp. 1045-1048
Lian Yan , Dept. of Electr. Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 1049-1052
T. Adali , Dept. of Comput. Sci. & Electr. Eng., Maryland Univ., Baltimore, MD, USA
pp. 1053-1056
M. Niranjan , Dept. of Eng., Cambridge Univ., UK
pp. 1065-1068
Y. Guo , Sch. of Mech. & Production Eng., Nanyang Technol. Inst., Singapore
pp. 1069-1072
Hsiao-Chun Wu , Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
pp. 1073-1076
K. Kreutz-Delgado , Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 1081-1084
S. Choi , Sch. of Electr. & Electron. Eng., Chungbuk Nat. Univ., South Korea
pp. 1085-1088
S.C. Douglas , Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
pp. 1089-1092
C. Neukirchen , Dept. of Comput. Sci., Gerhard-Mercator-Univ., Duisberg, Germany
pp. 1093-1096
Jyh-Charn Liu , Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA
pp. 1105-1108
Hau-San Wong , Dept. of Electr. Eng., Sydney Univ., NSW, Australia
pp. 1109-1112
S. Rovetta , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 1113-1116
M. Poulos , Dept. of Inf., Univ. of Piraeus, Greece
pp. 1117-1120
L.N. Andersen , Dept. of Math. Modelling, Tech. Univ., Lyngby, Denmark
pp. 1121-1124
H.C. Fu , Dept. of Comput. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 1125-1128
Author Index (Abstract)
pp. 1129-1141
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