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Acoustics, Speech, and Signal Processing, 1999. Proceedings. Vol 2, 1999 IEEE International Conference on
Phoenix, AZ, USA
March 15-March 19
ISBN: 0-7803-5041-3
Table of Contents
K.A. Papineni, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 561-564
Qi Li, Multimedia Commun. Res. Lab., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 605-608
L. Nguyen, BBN Technol., GTE Internetworking, Cambridge, MA, USA
pp. 613-616
E.C. Kaiser, Center for Spoken Language Understanding, Oregon Graduate Inst., Portland, OR, USA
pp. 629-632
J. Davenport, BBN Technol., GTE Internetworking, Cambridge, MA, USA
pp. 645-648
W.M. Fisher, Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
pp. 649-652
M.N. Murthi, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 669-672
J. Linden, Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
pp. 681-684
S. Doshita, Human Language Technol. Center, Univ. of Sci. & Technol., Clear Water Bay, Hong Kong
pp. 689-692
A. Kalai, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 745-748
J. McDonough, Center for Language & Speech Process., Johns Hopkins Univ., Baltimore, MD, USA
pp. 757-760
D. Matrouf, Lab. d'Inf. pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
pp. 785-788
A. Yasmin, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
pp. 797-800
D.V. Anderson, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 805-808
L. Liu, Dept. of Speech & Hearing Sci., Arizona State Univ., Tempe, AZ, USA
pp. 845-848
A. Harma, Lab. of Acoust. & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland
pp. 893-896
T.R. Trinkaus, Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 901-904
C.A. Lanciani, Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 917-920
S. Wyrsch, Inst. for Signal & Inf. Process., Fed. Inst. of Technol., Zurich, Switzerland
pp. 921-924
M. Karjalainen, Lab. of Acoust. & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland
pp. 929-932
M.S. Brandstein, Div. of Eng. & Appl. Sci., Harvard Univ., Cambridge, MA, USA
pp. 953-956
R. Rabenstein, Telecommun. Lab., Erlangen-Nurnberg Univ., Germany
pp. 957-960
V. Valimaki, Lab. of Acoust. & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland
pp. 977-980
Y.H. Lam, Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 989-992
T. Balachander, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
pp. 1017-1020
D.J. Miller, Dept. of Electr. Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 1029-1032
Dongxin Xu, Comput. NeuroEng. Lab., Florida Univ., Gainesville, FL, USA
pp. 1045-1048
Lian Yan, Dept. of Electr. Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 1049-1052
T. Adali, Dept. of Comput. Sci. & Electr. Eng., Maryland Univ., Baltimore, MD, USA
pp. 1053-1056
Y. Guo, Sch. of Mech. & Production Eng., Nanyang Technol. Inst., Singapore
pp. 1069-1072
Hsiao-Chun Wu, Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
pp. 1073-1076
K. Kreutz-Delgado, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 1081-1084
Jyh-Charn Liu, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA
pp. 1105-1108
S. Rovetta, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 1113-1116
Author Index (Abstract)
pp. 1129-1141
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