- I
- ICASSP
- 1999
- Acoustics, Speech, and Signal Processing, 1999. Proceedings. Vol 2, 1999 IEEE International Conference on
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Acoustics, Speech, and Signal Processing, 1999. Proceedings. Vol 2, 1999 IEEE International Conference on Phoenix, AZ, USA March 15-March 19 ISBN: 0-7803-5041-3 Table of Contents
C. Chesta, Dipt. di Autom. e Inf., Politecnico di Torino, Italy pp. 557-560
K.A. Papineni, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA pp. 561-564
D. Willett, Dept. of Comput. Sci., Gerhard-Mercator-Univ., Duisburg, Germany pp. 565-568
S. Tsakalidis, Dept. of Electron. & Comput. Eng., Tech. Univ. of Crete, Chania, Greece pp. 569-572
W. Reichl, Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA pp. 573-576
Qiang Huo, Dept. of Comput. Sci. & Inf. Syst., Hong Kong Univ., Hong Kong pp. 577-580
P. McMahon, Sch. of Electr. Eng., Queen's Univ., Belfast, UK pp. 581-584
P. Clarkson, Res. Lab., Compaq Comput. Corp., Cambridge, MA, USA pp. 585-588
A. Sixtus, Luhrstuhl fur Inf., Tech. Hochschule Aachen, Germany pp. 593-596
C.D. Mitchell, Lucent Technol., AT&T Bell Labs., Naperville, IL, USA pp. 597-600
Fang Zheng, Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China pp. 601-604
Qi Li, Multimedia Commun. Res. Lab., AT&T Bell Labs., Murray Hill, NJ, USA pp. 605-608
K. Beulen, Lehrstuhl fur Inf., Tech. Hochschule Aachen, Germany pp. 609-612
L. Nguyen, BBN Technol., GTE Internetworking, Cambridge, MA, USA pp. 613-616
P. Geutner, Interactive Syst. Labs., Karlsruhe Univ., Germany pp. 617-620
M. Penagarikano, Dept. Electr. y Electron., Pais Vasco Univ., Lejona, Spain pp. 621-624
K. Ohtsuki, NTT Human Interface Labs., Kanagawa, Japan pp. 625-628
E.C. Kaiser, Center for Spoken Language Understanding, Oregon Graduate Inst., Portland, OR, USA pp. 629-632
Bor-Shen Lin, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan pp. 637-640
D. Llorens, Unitat Predepartmental d'Inf., Univ. Jaume I, Castello, Spain pp. 641-644
J. Davenport, BBN Technol., GTE Internetworking, Cambridge, MA, USA pp. 645-648
W.M. Fisher, Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA pp. 649-652
J.J. Parry, TITR Whisper Labs., Wollongong Univ., NSW, Australia pp. 653-656
A. Vasilache, Signal Process. Lab., Tampere Univ. of Technol., Finland pp. 657-660
M.N. Murthi, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA pp. 669-672
Wonho Yang, Electr. & Comput. Eng., Temple Univ., Philadelphia, PA, USA pp. 673-676
P. Hedelin, Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden pp. 677-680
J. Linden, Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden pp. 681-684
S. Doshita, Human Language Technol. Center, Univ. of Sci. & Technol., Clear Water Bay, Hong Kong pp. 689-692
Yeou-Jiunn Chen, Dept. of Comput. Sci. & Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan pp. 697-700
H. Matsuo, Fac. of Eng. & Resource Sci., Akita Univ., Japan pp. 701-704
D. Jouvet, France Telecom, CNET, Lannion, France pp. 709-712
J.A. Bilmes, Int. Comput. Sci. Inst., Berkeley, CA, USA pp. 713-716
J.R. Bellegarda, Spoken Language Group, Apple Comput. Inc., Cupertino, CA, USA pp. 717-720
A.L. Gorin, Dept. of Speech Res., AT&T Bell Labs., Florham Park, NJ, USA pp. 721-724
D. Aiello, Fondazione Ugo Bordoni, Rome, Italy pp. 725-728
A. Varona, Dept. de Electr. y Electron., Pais Vasco Univ., Bilbao, Spain pp. 729-732
M.P. Harper, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA pp. 733-736
M. Suzuki, Comput. Center, Tohoku Univ., Sendai, Japan pp. 737-740
F. Wessel, Lehrstuhl fur Inf., Tech. Hochschule Aachen, Germany pp. 741-744
A. Kalai, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA pp. 745-748
R. Kuhn, Speech Technol. Lab., Panasonic Technol. Inc., Santa Barbara, CA, USA pp. 749-752
Zuoying Wang, Dept. of Electron. Eng., Tsinghua Univ., Beijing, China pp. 753-756
J. McDonough, Center for Language & Speech Process., Johns Hopkins Univ., Baltimore, MD, USA pp. 757-760
A. Kannan, Nuance Commun., Menlo Park, CA, USA pp. 769-772
P. Raghavan, CAIP Center, Rutgers Univ., Piscataway, NJ, USA pp. 777-780
D. Matrouf, Lab. d'Inf. pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France pp. 785-788
D. Malah, AT&T Bell Labs., Florham Park, NJ, USA pp. 789-792
Chuang He, T Div., Los Alamos Nat. Lab., NM, USA pp. 793-796
A. Yasmin, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada pp. 797-800
Kuan-Chieh Yen, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA pp. 801-804
D.V. Anderson, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA pp. 805-808
C.D. Yoo, Korea Telecom, Seoul, South Korea pp. 809-812
O. Siohan, Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA pp. 825-828
Qi Li, Dept. of Defense, Ft. Meade, MD, USA pp. 829-832
B.L. Pellom, Robust Speech Process. Lab., Duke Univ., Durham, NC, USA pp. 837-840
T. Isobe, Lab. for Inf. Technol., NTT Data Corp., Kanagawa, Japan pp. 841-844
L. Liu, Dept. of Speech & Hearing Sci., Arizona State Univ., Tempe, AZ, USA pp. 845-848
S.A. Zahorian, Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA pp. 849-852
J. Benesty, Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA pp. 853-856
A. Hirano, Fac. of Eng., Kanazawa Univ., Japan pp. 861-864
W.A. Frank, Mobile Phones Dept., Siemens AG, Munich, Germany pp. 865-868
E. Woudenberg, Human Inf. Process. Lab., Adv. Telecommun. Res., Kyoto, Japan pp. 869-872
S. Gustafsson, Inst. of Commun. Syst. & Data Process., Tech. Hochschule Aachen, Germany pp. 873-876
A. Stenger, Telecommun. Lab., Erlangen-Nurnberg Univ., Germany pp. 877-880
B.D. Radlovic, Dept. of Eng., Australian Nat. Univ., Canberra, ACT, Australia pp. 881-884
M. de Diego, Dept. of Comunicaciones, Univ. Politecnica de Valencia, Spain pp. 885-888
C. Garcia, Tech. Services Div., Gov. of Hong Kong, Hong Kong, China pp. 889-892
A. Harma, Lab. of Acoust. & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland pp. 893-896
A. Jin, NTT Human Interface Labs., Musashino, Japan pp. 897-900
T.R. Trinkaus, Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA pp. 901-904
Yuan-Hao Huang, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan pp. 905-908
M. Erne, Signal & Inf. Process. Lab., Fed. Inst. of Technol., Zurich, Switzerland pp. 909-912
C.A. Lanciani, Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA pp. 917-920
S. Wyrsch, Inst. for Signal & Inf. Process., Fed. Inst. of Technol., Zurich, Switzerland pp. 921-924
M.G. Siqueira, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA pp. 925-928
M. Karjalainen, Lab. of Acoust. & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland pp. 929-932
L.C. Gresham, Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA pp. 933-936
M. Omura, Sch. of Eng., Nagoya Univ., Japan pp. 941-944
M.S. Brandstein, Div. of Eng. & Appl. Sci., Harvard Univ., Cambridge, MA, USA pp. 953-956
R. Rabenstein, Telecommun. Lab., Erlangen-Nurnberg Univ., Germany pp. 957-960
C.I. Cheng, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA pp. 961-964
R.O. Duda, Dept. of Electr. Eng., San Jose State Univ., CA, USA pp. 965-968
L. Savioja, Lab. of Acoust. & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland pp. 973-976
V. Valimaki, Lab. of Acoust. & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland pp. 977-980
T.S. Verma, Dept. of Electr. Eng., Stanford Univ., CA, USA pp. 981-984
S.N. Levine, Dept. of Electr. Eng., Stanford Univ., CA, USA pp. 985-988
Y.H. Lam, Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK pp. 989-992
T. Hodes, Comput. Sci. Div., California Univ., Berkeley, CA, USA pp. 993-996
A. Uncini, Dipt. di Elettronica e Autom., Ancona Univ., Italy pp. 997-1000
H. Schwenk, Int. Comput. Sci. Inst., Berkeley, CA, USA pp. 1009-1012
D. Ellis, Int. Comput. Sci. Inst., Berkeley, CA, USA pp. 1013-1016
T. Balachander, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA pp. 1017-1020
E. Maeda, NTT Basic Res. Labs., Atsugi, Japan pp. 1025-1028
D.J. Miller, Dept. of Electr. Eng., Pennsylvania State Univ., University Park, PA, USA pp. 1029-1032
M. Sabry-Rizk, Dept. of Electr. Electron. & Inf. Eng., City Univ., London, UK pp. 1033-1036
D.P. Mandic, Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK pp. 1037-1040
Dongxin Xu, Comput. NeuroEng. Lab., Florida Univ., Gainesville, FL, USA pp. 1045-1048
Lian Yan, Dept. of Electr. Eng., Pennsylvania State Univ., University Park, PA, USA pp. 1049-1052
T. Adali, Dept. of Comput. Sci. & Electr. Eng., Maryland Univ., Baltimore, MD, USA pp. 1053-1056
T. Matsumoto, Dept. of Electr., Electron. & Comput. Eng., Waseda Univ., Tokyo, Japan pp. 1061-1064
Y. Guo, Sch. of Mech. & Production Eng., Nanyang Technol. Inst., Singapore pp. 1069-1072
Hsiao-Chun Wu, Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA pp. 1073-1076
E. Pomponi, Dipt. di Elettronica e Autom., Ancona Univ., Italy pp. 1077-1080
K. Kreutz-Delgado, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA pp. 1081-1084
S. Choi, Sch. of Electr. & Electron. Eng., Chungbuk Nat. Univ., South Korea pp. 1085-1088
S.C. Douglas, Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA pp. 1089-1092
C. Neukirchen, Dept. of Comput. Sci., Gerhard-Mercator-Univ., Duisberg, Germany pp. 1093-1096
A.H. Rambhia, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA pp. 1097-1100
Songyang Yu, Sch. of Electr. & Inf. Eng., Sydney Univ., NSW, Australia pp. 1101-1104
Jyh-Charn Liu, Dept. of Comput. Sci., Texas A&M Univ., College Station, TX, USA pp. 1105-1108
Hau-San Wong, Dept. of Electr. Eng., Sydney Univ., NSW, Australia pp. 1109-1112
S. Rovetta, Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy pp. 1113-1116
M. Poulos, Dept. of Inf., Univ. of Piraeus, Greece pp. 1117-1120
L.N. Andersen, Dept. of Math. Modelling, Tech. Univ., Lyngby, Denmark pp. 1121-1124
H.C. Fu, Dept. of Comput. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan pp. 1125-1128 Usage of this product signifies your acceptance of the Terms of Use.
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