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Acoustics, Speech, and Signal Processing, 1999. Proceedings. Vol 1, 1999 IEEE International Conference on
Phoenix, AZ, USA
March 15-March 19
ISBN: 0-7803-5041-3
Table of Contents
M. Gerken, Inf. Process. Sector, Samsung Adv. Inst. of Technol., Kyungki, South Korea
pp. 21-24
R. Hagen, Audio & Visual Technol. Res., Ericsson Radar Syst. AB, Stockholm, Sweden
pp. 25-28
H. Pobloth, Dept. of Speech Music & Hearing, R. Inst. of Technol., Stockholm, Sweden
pp. 29-32
M. Adda-Decker, Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
pp. 45-48
K. Matsui, Central Res. Lab., Matsushita Electr. Ind. Co. Ltd., Seika, Japan
pp. 81-84
M. Shozakai, LSI Labs., Asahi Chem. Ind. Co. Ltd., Kanagawa, Japan
pp. 141-144
Guo Qing, Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
pp. 169-172
R.V. Cox, Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
pp. 185-188
D.M. Brookes, Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 213-216
S. Umesh, Dept. of Electr. Eng., Indian Inst. of Technol., Kanpur, India
pp. 217-220
D. Nelson, Dept. of Electr. & Electron. Eng., Univ. of Sci. & Technol. of China, Hefei, China
pp. 221-224
H. Yang, Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. 225-228
K. El-Maleh, Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, Que., Canada
pp. 237-240
T. Unno, Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 245-248
O. Gottesmann, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 269-272
H. Hermansky, Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 289-292
M. Karnjanadecha, Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
pp. 293-296
J.J. Godfrey, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Clearwater Bay, Hong Kong
pp. 301-304
Jialong He, Dept. of Spech & Hearing Sci., Arizona State Univ., Tempe, AZ, USA
pp. 305-308
Qian-Jie Fu, Dept. of Auditory Implants & Perception, House Ear Inst., Los Angeles, CA, USA
pp. 369-372
A. Robert, Dept. of Electr. Eng., Fed. Inst. of Technol., Lausanne, Switzerland
pp. 393-396
M.R. Nakhai, Dept. of Electron. & Electr. Eng., King's Coll., London, UK
pp. 461-464
N. Malik, Sch. of Electr. & Telecommun. Eng., New South Wales Univ., Sydney, NSW, Australia
pp. 465-468
K. Ries, Language Tech. Inst., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 497-500
H. Ney, Lehrstuhl fur Inf. VI, Tech. Hochschule Aachen, Germany
pp. 517-520
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