- I
- ICASSP
- 1999
- Acoustics, Speech, and Signal Processing, 1999. Proceedings. Vol 1, 1999 IEEE International Conference on
| | This Publication | |
| | | |
| |
| |
| | Bibliographic References | |
| |
| |
| | |
Acoustics, Speech, and Signal Processing, 1999. Proceedings. Vol 1, 1999 IEEE International Conference on
Phoenix, AZ, USA
March 15-March 19
ISBN: 0-7803-5041-3
Table of Contents
S. Heinen, Inst. of Commun. Syst. & Data Process, Aachen Univ. of Technol., Germany
pp. 9-12
T. Amada, Kansai Res. Lab., Toshiba Corp., Kobe, Japan
pp. 13-16
M. Gerken, Inf. Process. Sector, Samsung Adv. Inst. of Technol., Kyungki, South Korea
pp. 21-24
R. Hagen, Audio & Visual Technol. Res., Ericsson Radar Syst. AB, Stockholm, Sweden
pp. 25-28
H. Pobloth, Dept. of Speech Music & Hearing, R. Inst. of Technol., Stockholm, Sweden
pp. 29-32
S.S. Chen, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 37-40
J. Billa, BBN Technol., Cambridge, MA, USA
pp. 41-44
M. Adda-Decker, Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
pp. 45-48
B. Peskin, Dragon Syst. Inc., Newton, MA, USA
pp. 53-56
T. Hain, Dept. of Eng., Cambridge Univ., UK
pp. 57-60
J.R. Glass, Lab. for Comput. Sci., MIT, Cambridge, MA, USA
pp. 61-64
Chung-Hsien Hu, Dept. of Comput. Sci. & Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 65-68
J. Kuo, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 77-80
K. Matsui, Central Res. Lab., Matsushita Electr. Ind. Co. Ltd., Seika, Japan
pp. 81-84
D. Tapias, Telefonica Investigacion y Desarrollo, Madrid, Spain
pp. 89-92
F. Bentelli, Ist. di Inf. e Telecommun., Catania Univ., Italy
pp. 93-96
T. Irino, ATR Human Inf. Process. Res. Lab., Kyoto, Japan
pp. 97-100
P.S.K. Hansen, Dept. of Math. Modelling, Tech. Univ., Lyngby, Denmark
pp. 101-104
M. Siu, BBN Technol./GTE Internetworking, Cambridge, UK
pp. 105-108
J. Picone, Center for Language & Speech Process., Johns Hopkins Univ., Baltimore, MD, USA
pp. 109-112
S. Matsoukas, BBN Technol./GTE Internetworking, Cambridge, UK
pp. 113-116
R. Singh, Sch. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 117-120
J. Kim, Philips Consumer Commun., Piscataway, NJ, USA
pp. 125-128
Yuqing Gao, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 129-132
K. Iwano, Dept. of Inf. & Commun. Eng., Tokyo Univ., Japan
pp. 133-136
Y. Nishida, Speech & Acoust. Lab., NTT Human Interface Labs., Kanagawa, Japan
pp. 137-140
M. Shozakai, LSI Labs., Asahi Chem. Ind. Co. Ltd., Kanagawa, Japan
pp. 141-144
M. Rahim, AT&T Labs.-Res., Florham Park, NJ, USA
pp. 153-156
DongSuk Yuk, CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 157-160
Ji Ming, Sch. of Comput. Sci., Queen's Univ., Belfast, UK
pp. 161-164
Guo Qing, Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
pp. 169-172
P. Nguyen, Speech Technol. Lab., Panasonic Technol. Inc., Santa Barbara, CA, USA
pp. 173-176
R.V. Cox, Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
pp. 185-188
K. Ozawa, C&C Media Res. Labs., NEC Corp., Kanagawa, Japan
pp. 189-192
E. Paksoy, DSP Solutions R&D Center, Texas Instrum. Inc., Dallas, TX, USA
pp. 193-196
D.M. Brookes, Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 213-216
S. Umesh, Dept. of Electr. Eng., Indian Inst. of Technol., Kanpur, India
pp. 217-220
D. Nelson, Dept. of Electr. & Electron. Eng., Univ. of Sci. & Technol. of China, Hefei, China
pp. 221-224
H. Yang, Dept. of Comput. Sci. & Eng., Oregon Graduate Inst. of Sci. & Technol., Beaverton, OR, USA
pp. 225-228
K. Tokuda, Dept. of Comput. Eng., Nagoya Inst. of Technol., Japan
pp. 229-232
K. El-Maleh, Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, Que., Canada
pp. 237-240
N.R. Chong, Whisper Labs., Wollongong Univ., NSW, Australia
pp. 241-244
T. Unno, Center for Signal & Image Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 245-248
S. Villette, Centre for Commun. Syst. Res., Surrey Univ., Guildford, UK
pp. 249-252
Chunyan Li, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 257-260
Jongseo Sohn, Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
pp. 265-268
O. Gottesmann, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 269-272
F. Jabloun, Dept. of Electr. Eng., Bilkent Univ., Ankara, Turkey
pp. 273-276
M. Peters, Res. & Dev. Centre, BMW AG, Munich, Germany
pp. 281-284
S. Tsuge, ATR Interpreting Telephony Res. Labs., Kyoto, Japan
pp. 285-288
H. Hermansky, Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 289-292
M. Karnjanadecha, Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
pp. 293-296
Y. Gong, Speech Res., Media Technols. Lab., Texas Instrum. Inc., Dallas, TX, USA
pp. 297-300
J.J. Godfrey, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Clearwater Bay, Hong Kong
pp. 301-304
Jialong He, Dept. of Spech & Hearing Sci., Arizona State Univ., Tempe, AZ, USA
pp. 305-308
Yong Gu, Vocalis Ltd., Cambridge, UK
pp. 317-320
D. Povey, Dept. of Eng., Cambridge Univ., UK
pp. 333-336
F. Beaufays, Speech Technol. & Res. Lab., SRI Int., Menlo Park, CA, USA
pp. 337-340
R.C. Rose, Res. Dept., AT&T Bell Labs., Florham Park, NJ, USA
pp. 341-344
Wu Chou, Lucent Technols., Bell Labs., Murray Hill, NJ, USA
pp. 345-348
Jiayu Li, Dept. of Stat., Chicago Univ., IL, USA
pp. 349-352
Xiaoqiang Luo, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
pp. 353-356
S. Basu, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 361-364
Qian-Jie Fu, Dept. of Auditory Implants & Perception, House Ear Inst., Los Angeles, CA, USA
pp. 369-372
R.E. Donovan, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 373-376
D. O'Brien, Sch. of Comput. Applications, Dublin City Univ., Ireland
pp. 381-384
K. Narasimhan, Comput. Neuroeng. Lab., Florida Univ., Gainesville, FL, USA
pp. 389-392
A. Robert, Dept. of Electr. Eng., Fed. Inst. of Technol., Lausanne, Switzerland
pp. 393-396
R. Haeb-Umbach, Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea
pp. 401-404
C.P. Chan, Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
pp. 405-408
H. Tolba, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 417-420
T. Nitta, Multimeda Eng. Lab., Toshiba Corp., Kawasaki, Japan
pp. 421-424
P. Ramesh, Dept. of Electr. Eng., Seoul Nat. Univ., South Korea
pp. 429-432
Wei-Tyng Hong, Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 433-436
G. Ruske, Inst. for Human-Machine-Commun., Munich Univ. of Technol., Germany
pp. 441-444
D. Giuliani, ITC-IRST, Centro per la Ricerca Sci. e Technol., Trento, Italy
pp. 449-452
M.R. Nakhai, Dept. of Electron. & Electr. Eng., King's Coll., London, UK
pp. 461-464
N. Malik, Sch. of Electr. & Telecommun. Eng., New South Wales Univ., Sydney, NSW, Australia
pp. 465-468
M. Kohata, Chiba Inst. of Technol., Narashino, Japan
pp. 469-472
J. Jensen, Center for PeronKommunikaion, Aalborg Univ., Denmark
pp. 473-476
E.W.M. Yu, Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong
pp. 477-480
K. Ries, Language Tech. Inst., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 497-500
M. Siegler, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 505-508
J. Golden, BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 509-512
Y. Gotoh, Dept. of Comput. Sci., Sheffield Univ., UK
pp. 513-516
H. Ney, Lehrstuhl fur Inf. VI, Tech. Hochschule Aachen, Germany
pp. 517-520
F. Walls, BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 521-524
R. Blasig, Philips Res. Lab., Aachen, Germany
pp. 529-532
H. Yamamoto, ATR Interpreting Telephony Res. Labs., Kyoto, Japan
pp. 533-536
S.C. Martin, Lehrstuhl fur Inf., Tech. Hochschule Aachen, Germany
pp. 545-548
S.F. Chen, Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 549-552
S. Khudanpur, Center for Language & Speech Process., Johns Hopkins Univ., Baltimore, MD, USA
pp. 553-556
Usage of this product signifies your acceptance of the
Terms of Use.
| | | | | | | |