The Community for Technology Leaders
RSS Icon
Subscribe
Acoustics, Speech, and Signal Processing, IEEE International Conference on (1996)
Atlanta, GA, USA
May 7, 1996 to May 10, 1996
ISBN: 0-7803-3192-3
TABLE OF CONTENTS
Authors Index (Abstract)
pp. A1
F.B. Shin , Adv. Concepts & Dev., Loral Defense Syst., Litchfield Park, AZ, USA
pp. 3041-3044
S.K. Mehta , Naval Undersea Warfare Center Div. Newport, New London, CT, USA
pp. 3045-3048
E.C. Real , Sanders Associates Inc., Nashua, NH, USA
pp. 3049-3052
Jar-Ferr Yang , Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 3053-3056
F.M. Garcia , Inst. de Sistemas e Robotica, Inst. Superior Tecnico, Lisbon, Portugal
pp. 3057-3060
R. Lynch , Naval Undersea Warfare Center, New London, CT, USA
pp. 3061-3064
U.D. Hanebeck , Dept. for Autom. Control Eng., Tech. Univ. Munchen, Germany
pp. 3069-3072
B. Colnet , CRIN-INRIA Lorraine, Vandoeuvre-les-Nancy, France
pp. 3073-3076
G.S. Fostick , Dept. of Electr. Eng., Tel Aviv Univ., Israel
pp. 3077-3080
Z.-H. Michalopoulou , Dept. of Math., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 3085-3088
J. Tabrikian , Dept. of Electr. Eng.-Syst., Tel Aviv Univ., Israel
pp. 3089-3092
A. Antoniou , Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
pp. 3093-3096
M. Roessgen , Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 3101-3104
P.K. Kumar , Dept. of Electr. Eng., Indian Inst. of Technol., Madras, India
pp. 3105-3108
Jian Shen , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3109-3112
S.C. Park , Dept. of Electr. Eng. & Comput. Eng., Iowa State Univ., Ames, IA, USA
pp. 3113-3116
P.J. Hahn , Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
pp. 3121-3124
Xinyu Ma , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 3125-3128
J.A. Stuller , Dept. of Electr. Eng., Missouri Univ., Rolla, MO, USA
pp. 3129-3132
A.B. Doser , Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 3133-3136
Z.I. Mitrovski , Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 3137-3140
B.L.F. Daku , Dept. of Electr. Eng., Saskatchewan Univ., Saskatoon, Sask., Canada
pp. 3141-3144
K.C. Ho , Dept. of Electr. & Comput. Eng., R. Mil. Coll. of Canada, Kingston, Ont., Canada
pp. 3145-3148
D.A. Caughey , Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
pp. 3149-3152
D.C. Reid , Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 3153-3156
G.V. Serebryakov , Res. Inst. of Appl. Math. & Cybern., Nizhny Novgorod State Univ., Russia
pp. 3157-3160
A. Zeira , Signal Process. Technol. Ltd., Palo Alto, CA, USA
pp. 3165-3168
M. Hawkes , Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA
pp. 3169-3172
L.L. Presti , Dipartimento di Elettronica, Politecnico di Torino, Italy
pp. 3177-3180
B.D. Jeffs , Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 3181-3184
F. Ahmad , Moore Sch. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 3185-3188
R.C. Qiu , Weber Res. Inst., Polytechnic Univ., Farmingdale, NY, USA
pp. 3189-3192
J.J. Smith , Adaptive Signal Process. Lab., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 3193-3196
A. Wang , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3197-3200
G. Post , Integrated Syst. for Signal Process., Aachen Univ. of Technol., Germany
pp. 3201-3204
L. Goodby , Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 3205-3208
A. Orailoglu , NASA Lewis Res. Center, Cleveland, OH, USA
pp. 3209-3212
R.S. Bajwa , Semicond. Res. Lab., Hitachi America Ltd., San Jose, CA, USA
pp. 3213-3216
L. Bierens , TNO-FEL, The Hague, Netherlands
pp. 3217-3220
Y. Naito , C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 3221-3224
M.F. Aburdene , Dept. of Electr. Eng., Bucknell Univ., Lewisburg, PA, USA
pp. 3225-3228
A.K. Shaw , Dept. of Electr. Eng., Wright State Univ., Dayton, OH, USA
pp. 3229-3232
K. Huber , Deutsche Telekom, Forschungs- und Technologiezentrum, Darmstadt, Germany
pp. 3233-3235
H. Urey , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 3236-3239
W. Namgoong , Comput. Syst. Lab., Stanford Univ., CA, USA
pp. 3240-3243
An-Nan Suen , Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 3252-3255
C. Chakrabarti , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 3256-3259
C. Nagendra , Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 3260-3263
C.C. Lin , Dept. of Electr. Eng., Nat. Chung Cheng Univ., Chiayi, Taiwan
pp. 3264-3267
M. Shajaan , Electron. Inst., Tech. Univ. Denmark, Lyngby, Denmark
pp. 3268-3271
I. Sundsbo , Dept. of Electr. & Comput. Eng., Norwegian Inst. of Technol., Trondheim, Norway
pp. 3272-3275
Hyesook Lim , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 3276-3279
J.D. Mellott , Florida Univ., Gainesville, FL, USA
pp. 3280-3283
Suk-Jin Jung , Dept. of Electron. Eng., Sung Kyun Kwan Univ., Suwon, South Korea
pp. 3284-3286
S.K. Jain , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 3287-3290
Jah-Ming Hsu , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 3291-3294
Weixun Cao , Fraunhofer-Inst. for Integrated Circuits, Erlangen, Germany
pp. 3295-3297
Shaoyun Wang , Crystal Semicond. Corp., Austin, TX, USA
pp. 3298-3301
He Qing , Inst. of Acoust., Acad. Sinica, China
pp. 3302-3305
P.K. Murthy , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 3306-3309
V. Zivojnovic , Integrated Syst. for Signal Proc., Tech. Hochschule Aachen, Germany
pp. 3310-3313
J. Jonsson , Dept. of Comput. Eng., Chalmers Univ. of Technol., Goteborg, Sweden
pp. 3314-3317
D.R. Surma , Dept. of Comput. Sci. & Eng., Notre Dame Univ., IN, USA
pp. 3318-3321
M. Willems , Aachen Univ. of Technol., Germany
pp. 3322-3325
H. Mehta , Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA
pp. 3326-3329
T.C. Denk , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 3330-3333
M.B. Srivastava , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 3334-3337
J.H. Satyanarayana , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 3338-3341
G.R. Cato , Dept. of Comput. Sci., North Carolina State Univ., Raleigh, NC, USA
pp. 3342-3345
Y. Konig , Int. Comput. Sci. Inst., Berkeley, CA, USA
pp. 3350-3353
K. Kasper , Inst. fur Angewandte Phys., Frankfurt Univ., Germany
pp. 3354-3357
Kyungmin Na , Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
pp. 3366-3369
Haizhou Li , CRIN-INRIA Lorraine, Vandoeuvre-les-Nancy, France
pp. 3374-3377
Duanpei Wu , Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA
pp. 3378-3381
J.P. Neto , INESC, Lisbon, Portugal
pp. 3382-3385
L.A. Chan , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 3386-3389
L.K. Hansen , Electron. Inst., Tech. Univ., Lyngby, Denmark
pp. 3394-3397
L.F.C. Pessoa , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 3398-3401
Inhyok Cha , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 3402-3405
X. Zhuang , Dept. of Comput. Eng. & Comput. Sci., Missouri Univ., Columbia, MO, USA
pp. 3406-3409
M. Cavanagh , Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
pp. 3414-3417
S. Young , Dept. of Radiat. Med., Roswell Park Memorial Inst., Buffalo, NY, USA
pp. 3418-3421
Yue Wang , Dept. of Radiol., Georgetown Univ. Hospital, Washington, DC, USA
pp. 3422-3425
Hung Yuen , Dept. of Electron. Eng., Hong Kong Polytech., Kowloon, Hong Kong
pp. 3426-3429
D.H. Kil , Adv. Concepts & Dev., Loral Defense Syst.-AZ, Litchfield Park, OH, USA
pp. 3430-3433
S. Lehmberg , Inst. for Human-Machine-Commun., Tech. Univ. Munchen, Germany
pp. 3434-3437
H.-J. Winkler , Inst. for Human-Machine-Commun., Tech. Univ. Munchen, Germany
pp. 3438-3441
H. Tahani , Campus Computing, Missouri Univ., Columbia, MO, USA
pp. 3446-3449
M. Schuster , Dept. of Comput. Sci., Gerhard-Mercator-Univ., Duisburg, Germany
pp. 3450-3453
G. Kim , Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA
pp. 3454-3457
G. Neil , Dept. of Electr. & Electron. Eng., Nottingham Univ., UK
pp. 3458-3461
Jianwei Miao , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 3462-3465
A.L.N. Fred , Inst. Superior Tecnico, Lisbon, Portugal
pp. 3466-3469
J. Ben-Arie , Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
pp. 3470-3473
Juping Yang , Dept. of Electr. Eng., Keio Univ., Yokohama, Japan
pp. 3474-3477
J. Subrahmonia , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 3478-3481
A. Senior , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 3482-3485
J.A. Benediktsson , Eng. Res. Inst., Iceland Univ., Reykjavik, Iceland
pp. 3490-3493
Liang Zhou , Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
pp. 3494-3497
B. de Jesus , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 3498-3501
K. Nathan , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 3502-3505
J. Subrahmonia , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 3506-3508
K. Torkkola , Phoenix Corp. Res. Labs., Motorola Inc., Tempe, AZ, USA
pp. 3509-3512
F. Puffer , Inst. fur Angewandte Phys., Frankfurt Univ., Germany
pp. 3513-3516
B. Santhanam , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 3517-3520
Lu Yingwei , Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
pp. 3521-3524
D.T. Davis , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 3525-3528
P. Campolucci , Dipartimento di Elettronica e Autom., Ancona Univ., Italy
pp. 3529-3532
Jianhua Xuan , Dept. of Comput. Sci. & Electr. Eng., Maryland Univ., Baltimore, MD, USA
pp. 3533-3536
N.J. Bershad , Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
pp. 3537-3540
A.N. Birkett , Dept. of Syst. & Comput. Eng., Carleton Univ., Ottawa, Ont., Canada
pp. 3541-3544
R.A. Goubran , Interactive Syst. Labs., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 3545-3548
L. Owsley , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 3557-3560
T. Adali , Dept. of Comput. Sci. & Electr. Eng., Maryland Univ., Baltimore, MD, USA
pp. 3561-3564
D. Neumerkel , Daimler-Benz AG, Berlin, Germany
pp. 3565-3568
V. Ramamurti , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 3569-3572
D. Andina , ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
pp. 3573-3576
J.L. Sanz-Gonzalez , Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
pp. 3577-3580
J.R. Boston , Dept. of Math., Dartmouth Coll., Hanover, NH, USA
pp. 3581-3584
6 ms
(Ver 2.0)

Marketing Automation Platform Marketing Automation Tool