- I
- ICASSP
- 1996
- Acoustics, Speech, and Signal Processing, 1996. ICASSP-96 Vol 6. Conference Proceedings., 1996 IEEE International Conference on
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Acoustics, Speech, and Signal Processing, 1996. ICASSP-96 Vol 6. Conference Proceedings., 1996 IEEE International Conference on Atlanta, GA, USA May 07-May 10 ISBN: 0-7803-3192-3 Table of Contents
F.B. Shin, Adv. Concepts & Dev., Loral Defense Syst., Litchfield Park, AZ, USA pp. 3041-3044
S.K. Mehta, Naval Undersea Warfare Center Div. Newport, New London, CT, USA pp. 3045-3048
E.C. Real, Sanders Associates Inc., Nashua, NH, USA pp. 3049-3052
Jar-Ferr Yang, Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan pp. 3053-3056
F.M. Garcia, Inst. de Sistemas e Robotica, Inst. Superior Tecnico, Lisbon, Portugal pp. 3057-3060
R. Lynch, Naval Undersea Warfare Center, New London, CT, USA pp. 3061-3064
U.D. Hanebeck, Dept. for Autom. Control Eng., Tech. Univ. Munchen, Germany pp. 3069-3072
B. Colnet, CRIN-INRIA Lorraine, Vandoeuvre-les-Nancy, France pp. 3073-3076
J. Tabrikian, Dept. of Electr. Eng.-Syst., Tel Aviv Univ., Israel pp. 3089-3092
A. Antoniou, Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada pp. 3093-3096
T.T. Ho, Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA pp. 3097-3100
M. Roessgen, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia pp. 3101-3104
P.K. Kumar, Dept. of Electr. Eng., Indian Inst. of Technol., Madras, India pp. 3105-3108
Jian Shen, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA pp. 3109-3112
S.C. Park, Dept. of Electr. Eng. & Comput. Eng., Iowa State Univ., Ames, IA, USA pp. 3113-3116
P.J. Hahn, Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA pp. 3121-3124
Xinyu Ma, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA pp. 3125-3128
J.A. Stuller, Dept. of Electr. Eng., Missouri Univ., Rolla, MO, USA pp. 3129-3132
A.B. Doser, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA pp. 3133-3136
B.L.F. Daku, Dept. of Electr. Eng., Saskatchewan Univ., Saskatoon, Sask., Canada pp. 3141-3144
K.C. Ho, Dept. of Electr. & Comput. Eng., R. Mil. Coll. of Canada, Kingston, Ont., Canada pp. 3145-3148
D.A. Caughey, Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada pp. 3149-3152
D.C. Reid, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia pp. 3153-3156
G.V. Serebryakov, Res. Inst. of Appl. Math. & Cybern., Nizhny Novgorod State Univ., Russia pp. 3157-3160
A. Zeira, Signal Process. Technol. Ltd., Palo Alto, CA, USA pp. 3165-3168
M. Hawkes, Dept. of Electr. Eng., Yale Univ., New Haven, CT, USA pp. 3169-3172
L.L. Presti, Dipartimento di Elettronica, Politecnico di Torino, Italy pp. 3177-3180
B.D. Jeffs, Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA pp. 3181-3184
F. Ahmad, Moore Sch. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA pp. 3185-3188
R.C. Qiu, Weber Res. Inst., Polytechnic Univ., Farmingdale, NY, USA pp. 3189-3192
J.J. Smith, Adaptive Signal Process. Lab., Curtin Univ. of Technol., Bentley, WA, Australia pp. 3193-3196
A. Wang, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA pp. 3197-3200
G. Post, Integrated Syst. for Signal Process., Aachen Univ. of Technol., Germany pp. 3201-3204
L. Goodby, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA pp. 3205-3208
R.S. Bajwa, Semicond. Res. Lab., Hitachi America Ltd., San Jose, CA, USA pp. 3213-3216
Y. Naito, C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan pp. 3221-3224
M.F. Aburdene, Dept. of Electr. Eng., Bucknell Univ., Lewisburg, PA, USA pp. 3225-3228
A.K. Shaw, Dept. of Electr. Eng., Wright State Univ., Dayton, OH, USA pp. 3229-3232
K. Huber, Deutsche Telekom, Forschungs- und Technologiezentrum, Darmstadt, Germany pp. 3233-3235
H. Urey, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA pp. 3236-3239
W. Namgoong, Comput. Syst. Lab., Stanford Univ., CA, USA pp. 3240-3243
An-Nan Suen, Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan pp. 3252-3255
C. Chakrabarti, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA pp. 3256-3259
C. Nagendra, Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA pp. 3260-3263
C.C. Lin, Dept. of Electr. Eng., Nat. Chung Cheng Univ., Chiayi, Taiwan pp. 3264-3267
M. Shajaan, Electron. Inst., Tech. Univ. Denmark, Lyngby, Denmark pp. 3268-3271
I. Sundsbo, Dept. of Electr. & Comput. Eng., Norwegian Inst. of Technol., Trondheim, Norway pp. 3272-3275
Hyesook Lim, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA pp. 3276-3279
Suk-Jin Jung, Dept. of Electron. Eng., Sung Kyun Kwan Univ., Suwon, South Korea pp. 3284-3286
S.K. Jain, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA pp. 3287-3290
Jah-Ming Hsu, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan pp. 3291-3294
Weixun Cao, Fraunhofer-Inst. for Integrated Circuits, Erlangen, Germany pp. 3295-3297
He Qing, Inst. of Acoust., Acad. Sinica, China pp. 3302-3305
P.K. Murthy, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA pp. 3306-3309
V. Zivojnovic, Integrated Syst. for Signal Proc., Tech. Hochschule Aachen, Germany pp. 3310-3313
J. Jonsson, Dept. of Comput. Eng., Chalmers Univ. of Technol., Goteborg, Sweden pp. 3314-3317
D.R. Surma, Dept. of Comput. Sci. & Eng., Notre Dame Univ., IN, USA pp. 3318-3321
H. Mehta, Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA pp. 3326-3329
T.C. Denk, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA pp. 3330-3333
G.R. Cato, Dept. of Comput. Sci., North Carolina State Univ., Raleigh, NC, USA pp. 3342-3345
E. McDermott, ATR Human Inf. Process. Res. Labs., Kyoto, Japan pp. 3346-3349
Y. Konig, Int. Comput. Sci. Inst., Berkeley, CA, USA pp. 3350-3353
K. Kasper, Inst. fur Angewandte Phys., Frankfurt Univ., Germany pp. 3354-3357
Dong-Suk Yuk, CAIP Center, Rutgers Univ., Piscataway, NJ, USA pp. 3358-3361
Kyungmin Na, Dept. of Electron. Eng., Seoul Nat. Univ., South Korea pp. 3366-3369
Haizhou Li, CRIN-INRIA Lorraine, Vandoeuvre-les-Nancy, France pp. 3374-3377
Duanpei Wu, Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA pp. 3378-3381
L.A. Chan, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA pp. 3386-3389
L.K. Hansen, Electron. Inst., Tech. Univ., Lyngby, Denmark pp. 3394-3397
L.F.C. Pessoa, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA pp. 3398-3401
Inhyok Cha, Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA pp. 3402-3405
X. Zhuang, Dept. of Comput. Eng. & Comput. Sci., Missouri Univ., Columbia, MO, USA pp. 3406-3409
M. Cavanagh, Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA pp. 3414-3417
S. Young, Dept. of Radiat. Med., Roswell Park Memorial Inst., Buffalo, NY, USA pp. 3418-3421
Yue Wang, Dept. of Radiol., Georgetown Univ. Hospital, Washington, DC, USA pp. 3422-3425
Hung Yuen, Dept. of Electron. Eng., Hong Kong Polytech., Kowloon, Hong Kong pp. 3426-3429
D.H. Kil, Adv. Concepts & Dev., Loral Defense Syst.-AZ, Litchfield Park, OH, USA pp. 3430-3433
S. Lehmberg, Inst. for Human-Machine-Commun., Tech. Univ. Munchen, Germany pp. 3434-3437
H.-J. Winkler, Inst. for Human-Machine-Commun., Tech. Univ. Munchen, Germany pp. 3438-3441
H. Tahani, Campus Computing, Missouri Univ., Columbia, MO, USA pp. 3446-3449
M. Schuster, Dept. of Comput. Sci., Gerhard-Mercator-Univ., Duisburg, Germany pp. 3450-3453
G. Kim, Center of Excellence for Document Anal. & Recognition, State Univ. of New York, Buffalo, NY, USA pp. 3454-3457
G. Neil, Dept. of Electr. & Electron. Eng., Nottingham Univ., UK pp. 3458-3461
Jianwei Miao, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA pp. 3462-3465
J. Ben-Arie, Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA pp. 3470-3473
Juping Yang, Dept. of Electr. Eng., Keio Univ., Yokohama, Japan pp. 3474-3477
J. Subrahmonia, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA pp. 3478-3481
A. Senior, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA pp. 3482-3485
Liang Zhou, Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan pp. 3494-3497
B. de Jesus, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA pp. 3498-3501
K. Nathan, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA pp. 3502-3505
J. Subrahmonia, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA pp. 3506-3508
K. Torkkola, Phoenix Corp. Res. Labs., Motorola Inc., Tempe, AZ, USA pp. 3509-3512
F. Puffer, Inst. fur Angewandte Phys., Frankfurt Univ., Germany pp. 3513-3516
B. Santhanam, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA pp. 3517-3520
Lu Yingwei, Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore pp. 3521-3524
D.T. Davis, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA pp. 3525-3528
P. Campolucci, Dipartimento di Elettronica e Autom., Ancona Univ., Italy pp. 3529-3532
Jianhua Xuan, Dept. of Comput. Sci. & Electr. Eng., Maryland Univ., Baltimore, MD, USA pp. 3533-3536
N.J. Bershad, Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA pp. 3537-3540
A.N. Birkett, Dept. of Syst. & Comput. Eng., Carleton Univ., Ottawa, Ont., Canada pp. 3541-3544
R.A. Goubran, Interactive Syst. Labs., Carnegie Mellon Univ., Pittsburgh, PA, USA pp. 3545-3548
L. Owsley, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA pp. 3557-3560
T. Adali, Dept. of Comput. Sci. & Electr. Eng., Maryland Univ., Baltimore, MD, USA pp. 3561-3564
V. Ramamurti, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA pp. 3569-3572
D. Andina, ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain pp. 3573-3576
J.R. Boston, Dept. of Math., Dartmouth Coll., Hanover, NH, USA pp. 3581-3584 Usage of this product signifies your acceptance of the Terms of Use.
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