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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1996)
Atlanta, GA, USA
May 7, 1996 to May 10, 1996
ISBN: 0-7803-3192-3
TABLE OF CONTENTS
J. Gunther , Dept. of Electr. & Comput. Eng., Brigham Young Univ., Provo, UT, USA
pp. 2419-2422
Wanzhi Qiu , Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 2423-2426
Yingbo Hua , Dept. of Electr. & Syst. Eng., Connecticut Univ., Storrs, CT, USA
pp. 2427-2430
Zhi Ding , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 2431-2434
M. Kristensson , Dept. of Signal Process., R. Inst. of Technol., Stockholm, Sweden
pp. 2435-2438
J.K. Tugnait , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 2443-2446
E. Moulines , GDR-TDSI, Ecole Nat. Superieure des Telecommun., Paris, France
pp. 2447-2450
E. De Carvalho , Inst. EURECOM, Sophia Antipolis, France
pp. 2451-2454
S.A. Ramprashad , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 2455-2458
Chunming Han , Dept. of Electr. Eng., Connecticut Univ., Storrs, CT, USA
pp. 2459-2462
A. Tesei , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 2467-2470
C.M. Gruner , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 2471-2474
D.H. Johnson , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 2475-2478
J.M. Winograd , Dept. of Electron. Comput. Sci., Boston Univ., MA, USA
pp. 2479-2482
I. Reuven , Dept. of Electr. Eng., Tel Aviv Univ., Israel
pp. 2483-2486
J. Ilow , Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
pp. 2487-2490
A.N. Venetsanopoulos , Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
pp. 2491-2494
J. Fuchs , IRISA, Rennes I Univ., France
pp. 2495-2498
O. Besson , Dept. of Avionics & Syst., ENSICA, Toulouse, France
pp. 2499-2502
J. Razavilar , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 2503-2506
M. Ghogho , Nat. Polytech. Inst. of Toulouse, France
pp. 2507-2510
M. Nafie , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2511-2514
A. Saidi , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2515-2518
C. Couvreur , Service de Phys. Gen., Fac. Polytech., Mons, Belgium
pp. 2519-2522
Qi Cheng , Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 2523-2526
Yingbo Hua , Dept. of Electr. Eng. & Comput. Eng., New Mexico Univ., Albuquerque, NM, USA
pp. 2527-2530
T. Chonavel , Dept. of Sci. Comput., ENSTBr, Brest, France
pp. 2531-2534
B. Champagne , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
pp. 2539-2542
A.V. Keerthi , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 2543-2546
Yinong Ding , Lab. of DSP Syst., Texas Instrum. Corp. Res. & Dev., Dallas, TX, USA
pp. 2547-2550
Y.I. Abramovich , Cooperative Res. Centre for Sensor Signal & Inf. Process., The Levels, SA, Australia
pp. 2551-2554
Dekun Yang , Dept. of Phys., London Univ., UK
pp. 2555-2558
J. Riba , Dept. of Signal Theory & Commun., ETSE Telecommun., Barcelona, Spain
pp. 2559-2562
A. Andersson , Dept. of Appl. Electron., Chalmers Univ. of Technol., Goteborg, Sweden
pp. 2563-2566
M. Torlak , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 2567-2570
J. Ramos , ETSI Telecommun., Polytech. Univ. of Madrid, Spain
pp. 2571-2574
M.D. Zoltowski , Acuson Corp., Mountain View, CA, USA
pp. 2575-2578
A. Recio , Dept. of Commun. Sci. & Disorders, Northwestern Univ., Evanston, IL, USA
pp. 2579-2582
S. Kadambe , Atlantic Aerosp. Electron. Corp., Greenbelt, MA, USA
pp. 2583-2586
S. Celebi , Comput. Neuroeng. Lab., Florida Univ., Gainesville, FL, USA
pp. 2587-2590
M.R. Raghuveer , Dept. of Electr. Eng., Rochester Inst. of Technol., NY, USA
pp. 2591-2593
Neng-Tsann Ueng , Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 2594-2597
M.L. Kramer , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 2598-2601
R.S. Orr , Atlantic Aerosp. Electron. Corp., Greenbelt, MA, USA
pp. 2602-2605
Hsiang-Tsun Li , Dept. of Electr. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 2606-2609
J.C. O'Neill , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2610-2613
M.O. Berin , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 2614-2617
B. Friedlander , Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
pp. 2618-2621
Huan Wu , Electron. Inst., Xidian Univ., Xi'an, China
pp. 2626-2629
M. Zatman , Lincoln Lab., MIT, Lexington, MA, USA
pp. 2630-2633
J.-C. Pesquet , Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 2634-2637
Shih-Ho Wang , Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA
pp. 2638-2641
I.M. Elfadel , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 2642-2645
M. Abe , Dept. of Math. Eng. & Inf. Phys., Tokyo Univ., Japan
pp. 2646-2649
Chuang He , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 2650-2653
I. Sharfer , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2654-2657
Hui Liu , Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
pp. 2658-2661
T.A. Brown , Motorola Inc., Arlington Heights, IL, USA
pp. 2662-2665
J.B. Schodorf , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2666-2669
Dunmin Zheng , Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
pp. 2670-2673
A. Touzni , ENSEA, Cergy-Pontoise, France
pp. 2674-2677
Zifei Wang , Erik Jonsson Sch. of Eng. & Comput. Sci., Texas Univ., Dallas, TX, USA
pp. 2678-2681
H. Wang , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 2682-2685
A. Rao , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 2686-2689
Yu-Chuan Lin , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 2690-2693
D.J. Reader , Commun. Div., Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 2694-2697
C. Serviere , CEPHAG-ENSIEG, St. Martin d'Heres, France
pp. 2698-2701
A. Dapena , Dept. de Electron. y Sistemas, La Coruna Univ., Spain
pp. 2706-2709
O.M. Medina , Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 2710-2713
K. Abed-Meraim , Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 2718-2721
A.-J. van der Veen , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 2722-2725
M.D. Zoltowski , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2730-2733
D.J. Sebald , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 2734-2737
K. Buckley , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2738-2741
C. Carlemalm , S3-Autom. Control, R. Inst. of Technol., Stockholm, Sweden
pp. 2742-2745
D.H. Brooks , Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
pp. 2750-2753
F.A. Heinle , Telecommun. Inst., Erlangen-Nurnberg Univ., Germany
pp. 2754-2757
T. Cooklev , DECE, Toronto Univ., Ont., Canada
pp. 2769-2772
A. Freedman , Valley Forge Res. Center, Pennsylvania Univ., Philadelphia, PA, USA
pp. 2773-2776
G.S. Wagner , Dept. of Phys., Colorado Univ., Boulder, CO, USA
pp. 2777-2780
J.R. Guerci , Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
pp. 2781-2784
J. Wilbur , Acoustics, Signal, Sonar & Image Process. Div., Naval Surface Warfare Center, Panama City, FL, USA
pp. 2785-2788
K.T. Wong , Dept. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2789-2792
S. Umesh , Hunter Coll., City Univ. of New York, NY, USA
pp. 2797-2800
D.W. Tufts , Rhode Island Univ., Kingston, RI, USA
pp. 2801-2804
M. Haardt , Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
pp. 2805-2808
P.D. Fiore , Sanders Associates Inc., Nashua, NH, USA
pp. 2809-2812
R.D. Nowak , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 2813-2816
J. Wohlers , Telecommun. Dept., Hamburg Univ. of Technol., Germany
pp. 2817-2820
I.B. Collings , Coop Res. Centre for Sensor Signal & Inf. Process., Univ. of South Australia, The Levels, SA, Australia
pp. 2821-2824
M. Doroslovacki , Dept. of Electr. Eng. & Comput. Sci., George Washington Univ., Washington, DC, USA
pp. 2825-2828
B.R. Kosanovic , Lab. for Comput. Neurosci., Pittsburgh Univ., PA, USA
pp. 2829-2832
J.G. Gonzalez , Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
pp. 2833-2836
J. Bakkoury , LEN7/GAPSE, Nat. Polytech. Inst. of Toulouse, France
pp. 2837-2840
B. Yazici , Res. & Dev. Center, Gen. Electr. Co., Schenectady, NY, USA
pp. 2841-2844
C.D. Richmond , Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
pp. 2849-2851
K.L. Bell , George Mason Univ., Fairfax, VA, USA
pp. 2852-2855
Bin Yang , Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
pp. 2856-2859
Ho Yang , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2864-2867
P. Chevalier , Div. RGS, STS, Thomson-CSF, Gennevilliers, France
pp. 2868-2871
A. Souloumiac , ETL, Schlumberger Industries, Montrouge, France
pp. 2872-2875
F. Lorenzelli , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 2876-2879
P.C.E. Bennett , Dept. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 2880-2883
P. Tsakalides , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 2884-2887
M.G. Amin , Dept. of Electr. & Comput. Eng., Villanova Univ., PA, USA
pp. 2888-2891
D.B. Ward , Dept. of Eng., Australian Nat. Univ., Canberra, ACT, Australia
pp. 2892-2895
C.S. MacInnes , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 2896-2899
P. Stoica , Syst. & Control Group, Uppsala Univ., Sweden
pp. 2904-2907
Yan Meng , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 2908-2911
J.T. Stonick , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 2912-2915
C.P. Mathews , Dept. of Electr. Eng., Univ. of West Florida, Pensacola, FL, USA
pp. 2916-2919
C. Vaidyanathan , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2920-2923
T. Frederick , Sensormatic Electron. Corp., Boca Raton, FL, USA
pp. 2928-2931
A. Pages-Zamora , Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 2936-2939
N. Delfosse , Dept. Signal, Telecom Paris, France
pp. 2940-2943
A. Doucet , CEA, Centre d'Etudes Nucleaires de Saclay, Gif-sur-Yvette, France
pp. 2948-2951
T. Wigren , Syst. & Control Group, Uppsala Univ., Sweden
pp. 2952-2955
C. Bourin , Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 2956-2959
D.F. Drake , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2960-2963
J.C. Ralston , Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 2964-2967
P. Steeghs , Centre for Tech. Geosci., Delft Univ. of Technol., Netherlands
pp. 2972-2975
Zhiyue Lin , Health Sci. Center, Virginia Univ., Charlottesville, VA, USA
pp. 2976-2978
Hongyu Wang , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 2979-2982
M.M. Scheffe , Div. of Eng., Brown Univ., Providence, RI, USA
pp. 2983-2986
J.O. Chapa , Center for Imaging Sci., Rochester Inst. of Technol., NY, USA
pp. 2987-2989
B.M. Sadler , US Army Res. Lab., Adelphi, MD, USA
pp. 2990-2993
A. Logothetis , Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 2994-2997
J. Sanubari , Dept. of Electron. Eng., Satya Wacana Univ., Salatiga, Indonesia
pp. 2998-3001
Yi Chu , Dept. of Electron. Eng., Nat. Taiwan Inst. of Technol., Taipei, Taiwan
pp. 3006-3009
S. Shamsunder , Dept. of Electr. Eng., Colorado State Univ., Fort Collins, CO, USA
pp. 3010-3013
S. Barbarossa , Dipartimento Infocom, Rome Univ., Italy
pp. 3022-3025
T.F. Andre , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 3026-308a
A.M. Zoubir , Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 3029-3032
Lang Tong , Dept. of Electr. & Syst. Eng., Connecticut Univ., Storrs, CT, USA
pp. 3037-3040
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