- I
- ICASSP
- 1996
- Acoustics, Speech, and Signal Processing, 1996. ICASSP-96 Vol 4. Conference Proceedings., 1996 IEEE International Conference on
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Acoustics, Speech, and Signal Processing, 1996. ICASSP-96 Vol 4. Conference Proceedings., 1996 IEEE International Conference on
Atlanta, GA, USA
May 07-May 10
ISBN: 0-7803-3192-3
Table of Contents
K. Panusopone, Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
pp. 2021-2023, 2023a
H. Puh, Dept. of Electr. Eng., City Univ. of New York, NY, USA
pp. 1862-1865
H.R. Rabiee, Dept. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 1870-1873
J.M. Lervik, Dept. of Telecommun., Norwegian Univ. of Sci. & Technol., Trondheim, Norway
pp. 1874-1877
E.S. Jang, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 1878-1881
T.D. Tran, Dept. of Electr. & Comput. Eng., Wisconsin Univ., WI, USA
pp. 1882-1885
C.H. Lin, Dept. of Electr. Eng., Nat. Chung Cheng Univ., Chiayi, Taiwan
pp. 1886-1889
Xiaolin Wu, Dept. of Comput. Sci., Univ. of Western Ontario, London, Ont., Canada
pp. 1890-1893
A. Moghaddamzadeh, Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
pp. 1894-1897
A. Kundu, US West Adv. Technol., Boulder, CO, USA
pp. 1902-1905
H. Naseri, Dept. of Electr. Eng., Missouri Univ., Rolla, MO, USA
pp. 1906-1909
E. Steinbach, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany
pp. 1910-1913
F. Moscheni, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 1914-1917
M. Kunt, Dept. of Electron. Eng., Inha Univ., Incheon, South Korea
pp. 1918-1921
Ut-Va Koc, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 1930-1933
E. Linzer, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 1934-1937
E.P. Ong, Sch. of Electron. & Electr. Eng., Birmingham Univ., UK
pp. 1938-1941
M. Spann, Dept. of Electr. Eng., Colorado Univ., Denver, CO, USA
pp. 1942-1945
Yu-Li You, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 1946-1949
H. Lin, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
pp. 1950-1953
S. Moni, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 1954-1961
M.D. Swanson, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 1958-1961
A. Zandi, RICOH California Res. Center, Menlo Park, CA, USA
pp. 1962-1965
G.M. Schuster, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
pp. 1966-1969
K.E. Matthews, Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
pp. 1970-1973
F. Hartung, Telecommun. Inst., Erlangen-Nurnberg Univ., Germany
pp. 1974-1977
Kui Zhang, Dept. of Electron. & Electr. Eng., Surrey Univ., Guildford, UK
pp. 1978-1981
M. Pardas, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 1982-1985
M.Z. Coban, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1990-1993
P. Tiwari, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 1994-1997
P.A.A. Assuncao, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
pp. 1998-2001
A. Tsai, CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 2002-2008
A. Docef, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2009-2012
M. Sipitca, Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2013-2016
A. Bilgin, Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 2017-2020
N. Chaddha, Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 2024-2027
A. Narayan, Dept. of Electr. Eng., Iowa State Univ., Ames, IA, USA
pp. 2028-2031
A. Rao, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 2032-2035
D. Comaniciu, Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
pp. 2036-2039
Youngjun Yoo, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 2040-2043
H.D. Li, Dept. of Electr. Eng., Univ. of South Florida, Tampa, FL, USA
pp. 2044-2047
S. Gadkari, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 2048-2051
K. Rose, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 2052-2055
R.R. Rao, Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2056-2059
P. Salembier, Dept. of Signal Theory & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 2060-2063
Chung-Wei Ku, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 2064-2067
T. Ozcelik, Sony Electron. Inc., San Jose, CA, USA
pp. 2068-2071
F.C.M. Martins, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 2072-2075
E. Feig, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 2092-2095
M.C. Chen, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 2096-2099
Wenjun Zeng, Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 2100-2103
Mungi Choi, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 2112-2115
E.N. Farag, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
pp. 2116-2119
M.I. Elmasry, Dept. of Electr. Eng., Nat. Chung Cheng Univ., Chiayi, Taiwan
pp. 2120-2123
S.J.P. Westen, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 2124-2127
Yiu-fai Wong, Div. of Eng., Texas Univ., San Antonio, TX, USA
pp. 2128-2135
C. LaPre, BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 2136-2139
C. Podilchuk, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 2144-2147
K. Etemad, Center for Autom. Res., Maryland Univ., College Park, MD, USA
pp. 2148-2151
R. Meth, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 2152-2155
R. Chellappa, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 2156-2159
P.A. Feineigle, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 2160-2163
X. Zhang, Comput. Vision Lab., Maryland Univ., College Park, MD, USA
pp. 2164-2167
N. Nikolaidis, Dept. of Electr. & Comput. Eng., Thessaloniki Univ., Greece
pp. 2168-2171
C. Canus, Inst. Nat. de Recherche en Inf. et Autom., Le Chesnay, France
pp. 2172-2175
E. Saber, Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 2176-2179
H.K. Garg, Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore
pp. 2180-2183
G. Agam, Dept. of Electr. & Comput. Eng., Ben-Gurion Univ. of the Negev, Beer-Sheva, Israel
pp. 2184-2187
K. Uma, Dept. of Electr. Eng., Indian Inst. of Sci., Bangalore, India
pp. 2188-2190
H. Aydinoglu, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2191-2194
Jiang Qian, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
pp. 2195-2198
V. Castelli, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 2199-2202
Reitseng Lin, Dept. of Comput. & Inf. Sci., Polytechnic Univ., Brooklyn, NY, USA
pp. 2203-2206
J. You, Sch. of Comput. & Inf. Sci., Univ. of South Australia, The Levels, SA, Australia
pp. 2207-2210
Jyh-Shyan Lin, Dept. of Radiol., George Washington Univ., Washington, DC, USA
pp. 2211-2214
S.T. Acton, Sch. of Electr. & Comput. Eng., Oklahoma State Univ., Stillwater, OK, USA
pp. 2215-2218
P.A. Toft, Electron. Inst., Tech. Univ., Lyngby, Denmark
pp. 2219-2222
D. Nandy, Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
pp. 2223-2226
S.S. Saquib, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2227-2230
J. Fwu, Dept. of Electr. Eng., State Univ. of New York, Stony Brook, NY, USA
pp. 2235-2238
J.R. Smith, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
pp. 2239-2242
T.P. Weldon, Dept. of Electr. Eng., North Carolina Univ., Charlotte, NC, USA
pp. 2243-2246
Lihua Li, Dept. of Radiol., Univ. of South Florida, Tampa, FL, USA
pp. 2251-2254
S.R. Kadaba, Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2255-2258
S. Siren, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 2259-2262
L. Alparone, Dept. of Electron. Eng., Florence Univ., Italy
pp. 2267-2270
M. Mattavelli, Signal Process. Lab., Ecole Polytech. Federale de Lausanne, Switzerland
pp. 2271-2274
W.B. Goh, Sch. of Appl. Sci., Nanyang Technol. Inst., Singapore
pp. 2275-2278
D. Krishnan, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2279-2282
D. Kundur, Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
pp. 2283-2286
Haosong Kong, Dept. of Electr. Eng., Sydney Univ., NSW, Australia
pp. 2287-2290
R.M. Armitano, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2295-2298
Sungook Kim, Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
pp. 2299-2302
Hangu Yeo, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 2303-2306
N. Merhav, Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
pp. 2307-2310
K.W. Cheng, Dept. of Electr. & Electron. Eng., Univ. of Hong Kong, Hong Kong
pp. 2311-2314
Hao Bi, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 2315-2318
P. Csillag, KFKI Res. Inst. for Meas. & Comput. Tech., Budapest, Hungary
pp. 2319-2322
Shengm Zhong, Dept. of Comput. Sci., Univ. of Hong Kong, Hong Kong
pp. 2323-2326
Chi-Kong Wong, Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, Hong Kong
pp. 2327-2330
A. Fuldseth, Dept. of Telecommun., Norwegian Univ. of Sci. & Technol., Trondheim, Norway
pp. 2331-2334
O. Egger, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 2335-2338
I. Kozintsev, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 2343-2346
J.R. Casas, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 2355-2358
G.M. Davis, Dept. of Math., Dartmouth Coll., Hanover, NH, USA
pp. 2359-2362
K. Cinkler, Telecommun. Dept., Hamburg Univ. of Technol., Germany
pp. 2363-2366
Yuen-Wen Lee, Dept. of Electr. Eng., British Columbia Univ., Vancouver, BC, Canada
pp. 2367-2370
R. Rabenstein, Lehrstuhl fur Nachrichtentech., Erlangen-Nurnberg Univ., Germany
pp. 2375-2378
R. Manduchi, Dept. of Comput. Sci., Stanford Univ., CA, USA
pp. 2379-2382
J. Crespo, Fac. de Inf., Univ. Politecnica de Madrid, Spain
pp. 2391-2394
A.J. den Dekker, Dept. of Appl. Phys., Delft Univ. of Technol., Netherlands
pp. 2395-2398
N. Merhav, Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
pp. 2403-2406
S. Urieli, IBM Israel Sci. & Technol. Center, Haifa, Israel
pp. 2407-2410
J.M. Francos, Dept. of Electr. & Comput. Eng., Ben-Gurion Univ. of the Negev, Beer-Sheva, Israel
pp. 2411-2414
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