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  • Acoustics, Speech, and Signal Processing, 1996. ICASSP-96 Vol 3. Conference Proceedings., 1996 IEEE International Conference on
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Acoustics, Speech, and Signal Processing, 1996. ICASSP-96 Vol 3. Conference Proceedings., 1996 IEEE International Conference on
Atlanta, GA, USA
May 07-May 10
ISBN: 0-7803-3192-3
Table of Contents
Haitao Guo, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 1291-1294
U. Iyer, Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
pp. 1307-1310
Tak-Wai Shen, Dept. of Electron. Eng., Hong Kong Polytech. Univ., Kowloon, Hong Kong
pp. 1327-1330
T. Verma, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 1351-1354
Z. Zang, Australian Telcommun. Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 1363-1366
I.W. Selesnick, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 1367-1370
J. Kauraniemi, Lab. of Signal Process. & Comput. Technol., Helsinki Univ. of Technol., Espoo, Finland
pp. 1371-1374
Yeong-Taeg Kim, Signal Process. Lab., Samsung Electronics Co., Suwon, South Korea
pp. 1383-1386
L. FridtjofWisur-Olsen, Nederlandse Aardolie Maatschappij BV, R. Dutch Shell, Schoonebeek, Netherlands
pp. 1419-1422
P. Goncalves, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 1423-1426
T.Q. Nguyen, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 1471-1474
Xueming Lin, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 1475-1478
P.P. Vaidyanathan, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 1487-1490
D. Stanhill, Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
pp. 1499-1502
O. Andric, Dept. of Electr. Eng., Florida Atlantic Univ., Boca Raton, FL, USA
pp. 1507-1510
P. Moulin, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 1519-1522
M. Vetterli, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 1530-1533
G.A. Williamson, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 1534-1537
Bo Xuan, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 1538-1541
S.S. Hemami, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 1542-1545
S.C. Chan, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
pp. 1546-1549
C.W. Kok, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 1550-1553
See-May Phoong, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 1554-1557
R.A. Gopinath, Comput. Sci. Dept., IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 1585-1588
T. Stathaki, Signal Process. Section, Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 1601-1604
S.M. Schweizer, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 1609-1612
A.C. Singer, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 1625-1628
D.H. Crawford, Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 1629-1632
J.K. Thomas, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 1637-1640
H.J. Butterweck, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
pp. 1641-1643
S. Dasgupta, Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
pp. 1652-1655
J. Sala, Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 1660-1663
Yuan-Pei Lin, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 1668-1671
S. Heidari, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 1684-1687
A.E. Yagle, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 1692-1694
A.E. Bell, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 1695-1698
K.S. Riedel, Courant Inst. of Math. Sci., New York Univ., NY, USA
pp. 1699-1702
J. Lee, Dept. of Electr. & Comput. Eng., Florida Inst. of Technol., Melbourne, FL, USA
pp. 1719-1722
Y. Higa, Texas Instrum., Tsukuba Res. & Dev. Centre Ltd., Ibaraki, Japan
pp. 1727-1730
S. Zimmermann, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 1735-1738
S. Hosur, DSP R&D Centre, Texas Instrum. Inc., Dallas, TX, USA
pp. 1739-1742
N.R. Mangalvedhe, Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
pp. 1751-1754
J. Guerard, Lab. d'Acoust. Musicale, Univ. Pierre et Marie Curie, Paris, France
pp. 1755-1758
V. Shtrom, Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
pp. 1779-1782
B.D. Rao, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 1783-1786
V.K. Goyal, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 1787-1790
S. Dharanipragada, Centre for Language & Speech Process., Johns Hopkins Univ., Baltimore, MD, USA
pp. 1791-1794
E. Sekko, Univ. Claude Bernard, Villeurbanne, France
pp. 1795-1797
T. Lo, Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 1798-1801
D.A.F. Florencio, Lab. of Digital Signal Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1814-1817
E.A. Wan, Dept. of Electr. Eng. & Appl. Phys., Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 1842-1845
Sang-Sik Ahn, Dept. of Appl. Electron., Korea Univ., Chungnam, South Korea
pp. 1854-1857
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