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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1996)
Atlanta, GA, USA
May 7, 1996 to May 10, 1996
ISBN: 0-7803-3192-3
TABLE OF CONTENTS
Authors Index (Abstract)
pp. A1
M.G. Bellanger , CNAM-Electronique, Paris, France
pp. 1272-1275
S. Pokala , Dept. of Electr. Eng., Wright State Univ., Dayton, OH, USA
pp. 1276-1279
K. Sienski , Garland Div., E-Systems, Garland, TX, USA
pp. 1280-1282
Young-Ho Lee , Graduate Sch. of Inf. Sci., Tohoku Univ., Sendai, Japan
pp. 1283-1286
T. Higuch , Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
pp. 1287-1290
Haitao Guo , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 1291-1294
A.A. Hasan , Coll. of Electron. Eng., Bani Waleed, Libya
pp. 1299-1302
H. Sakai , Grad. Sch. of Eng., Kyoto Univ., Japan
pp. 1303-1306
U. Iyer , Dept. of Electr. Eng., Michigan State Univ., East Lansing, MI, USA
pp. 1307-1310
N. Bhatnagar , NORTEL Mission Park, Santa Clara, CA, USA
pp. 1315-1318
D. Akopian , Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 1319-1322
J. Astola , Dept. of Math., Dartmouth Coll., Hanover, NH, USA
pp. 1323-1326
Tak-Wai Shen , Dept. of Electron. Eng., Hong Kong Polytech. Univ., Kowloon, Hong Kong
pp. 1327-1330
G. Harikumar , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 1331-1334
S. Attallah , Equipe Signal et Image, Talence, France
pp. 1343-1346
T. Verma , Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 1351-1354
L.J. Karam , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 1359-1362
Z. Zang , Australian Telcommun. Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 1363-1366
I.W. Selesnick , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 1367-1370
J. Kauraniemi , Lab. of Signal Process. & Comput. Technol., Helsinki Univ. of Technol., Espoo, Finland
pp. 1371-1374
P. Gentili , Dipartimento di Elettronica e Autom., Ancona Univ., Italy
pp. 1375-1378
Yeong-Taeg Kim , Signal Process. Lab., Samsung Electronics Co., Suwon, South Korea
pp. 1383-1386
T. Hinamoto , Fac. of Eng., Hiroshima Univ., Japan
pp. 1387-1390
V. Katkovnik , Dept. of Stat., South Africa Univ., Pretoria, South Africa
pp. 1399-1402
A. Akan , Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
pp. 1403-1406
G.T. Venkatesan , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 1407-1410
B.A. Weisburn , Sebastopol, CA, USA
pp. 1411-1414
I. Koren , Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
pp. 1415-1418
L. FridtjofWisur-Olsen , Nederlandse Aardolie Maatschappij BV, R. Dutch Shell, Schoonebeek, Netherlands
pp. 1419-1422
P. Goncalves , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 1423-1426
B. Tacer , Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
pp. 1427-1430
A.M. Sayeed , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 1431-1434
Z. Cvetkovic , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 1435-1438
KyungHi Chang , Electron. & Telecommun. Res. Inst., Taejon, South Korea
pp. 1443-1446
B.G. Sherlock , Sch. of Electron. & Electr. Eng., Bath Univ., UK
pp. 1447-1450
J.M. Adler , Tangent Syst. Inc., San Diego, CA, USA
pp. 1451-1454
J.M. Shapiro , Aware Inc., Bedford, MA, USA
pp. 1455-1458
M. Vrhel , Biomed. Eng. & Instrum. Program, Nat. Inst. of Health, Bethesda, MD, USA
pp. 1459-1462
M. Lang , MeVis, Bremen, Germany
pp. 1463-1466
J.E. Odegard , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 1467-1470
T.Q. Nguyen , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 1471-1474
Xueming Lin , Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 1475-1478
T. Karp , Telecommun. Inst., Hamburg Univ. of Technol., Germany
pp. 1479-1482
T. Nagai , Fac. of Sci. & Technol., Keio Univ., Yokohama, Japan
pp. 1483-1486
P.P. Vaidyanathan , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 1487-1490
D. Stanhill , Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
pp. 1499-1502
M.J. Lyall , Atlantic Aerosp. Electron. Corp., Greenbelt, MD, USA
pp. 1503-1506
O. Andric , Dept. of Electr. Eng., Florida Atlantic Univ., Boca Raton, FL, USA
pp. 1507-1510
F. Argenti , Dipartimento di Ingegneria Elettronica, Florence Univ., Italy
pp. 1511-1514
P. Moulin , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 1519-1522
F.J. Hampson , Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 1523-1526
M. Vetterli , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 1530-1533
G.A. Williamson , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 1534-1537
Bo Xuan , Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 1538-1541
S.S. Hemami , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
pp. 1542-1545
S.C. Chan , Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
pp. 1546-1549
C.W. Kok , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 1550-1553
See-May Phoong , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 1554-1557
T.C. Farrell , Dept. of Electr. Eng. & Comput. Sci., Kansas Univ., Lawrence, KS, USA
pp. 1558-1561
S. Wada , Dept. of Inf. Sci., Tokyo Denki Univ., Japan
pp. 1562-1565
M. Ikehara , Fac. of Sci. & Technol., Keio Univ., Yokohama, Japan
pp. 1566-1569
R.L. de Queiroz , Xerox Webster Res. Center, NY, USA
pp. 1570-1573
D. Pinchon , Lab. MIP, Univ. Paul Sabatier, Toulouse, France
pp. 1574-1577
Chia-Chun Huang , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 1581a-15814
R.A. Gopinath , Comput. Sci. Dept., IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 1585-1588
T.M. Panicker , Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
pp. 1589-1592
E.A. Heredia , Dept. of Electr. Eng., Delaware Univ., Newark, DE, USA
pp. 1593-1596
E. Roy , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 1597-1600
T. Stathaki , Signal Process. Section, Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 1601-1604
K.M. Cuomo , Lincoln Lab., MIT, Lexington, MA, USA
pp. 1605-1608
S.M. Schweizer , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 1609-1612
S.S.O. Choy , Dept. of Electron. Eng., Hong Kong Polytech., Kowloon, Hong Kong
pp. 1613-1616
H.C. Papadopoulos , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 1617-1620
T. Felderhoff , Abteilung FV/FLI, Robert Bosch GmbH, Stuttgart, Germany
pp. 1621-1624
A.C. Singer , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 1625-1628
D.H. Crawford , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 1629-1632
M. Harteneck , Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK
pp. 1633-1636
J.K. Thomas , Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 1637-1640
H.J. Butterweck , Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
pp. 1641-1643
S. Dasgupta , Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
pp. 1652-1655
S.C. Douglas , Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
pp. 1656-1659
J. Sala , Dept. de Teoria del Senyal i Comunicacions, Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 1660-1663
Z. Malouche , Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 1664-1667
Yuan-Pei Lin , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 1668-1671
D.O. Walsh , Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
pp. 1672-1675
S.J. Reeves , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 1676-1679
S. Heidari , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 1684-1687
Ping Feng , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 1688-1691
A.E. Yagle , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 1692-1694
A.E. Bell , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 1695-1698
K.S. Riedel , Courant Inst. of Math. Sci., New York Univ., NY, USA
pp. 1699-1702
T. Shimamura , Dept. of Electron. & Electr. Eng., Loughborough Univ. of Technol., UK
pp. 1703-1706
I.A. Perez-Alvarez , ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
pp. 1707-1710
Changjing Shang , Dept. of Electron. & Electr. Eng., Loughborough Univ. of Technol., UK
pp. 1711-1714
J. Lee , Dept. of Electr. & Comput. Eng., Florida Inst. of Technol., Melbourne, FL, USA
pp. 1719-1722
M.J. Minardi , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1723-1726
Y. Higa , Texas Instrum., Tsukuba Res. & Dev. Centre Ltd., Ibaraki, Japan
pp. 1727-1730
K. Berberidis , Computer Technol. Inst., Patras, Greece
pp. 1731-1734
S. Zimmermann , Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
pp. 1735-1738
S. Hosur , DSP R&D Centre, Texas Instrum. Inc., Dallas, TX, USA
pp. 1739-1742
K. Egiazarian , Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 1743-1746
H. Krauss , Inst. of Telecommun., Erlangen-Nurnberg Univ., Germany
pp. 1747-1750
N.R. Mangalvedhe , Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
pp. 1751-1754
J. Guerard , Lab. d'Acoust. Musicale, Univ. Pierre et Marie Curie, Paris, France
pp. 1755-1758
Bin Yang , Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
pp. 1759-1762
P.J.W. Melsa , Tellabs Res. Center, Mishawaka, IN, USA
pp. 1763-1766
W.S. Ellis , Cardiovascular Res. Inst., California Univ., San Francisco, CA, USA
pp. 1771-1774
Szi-Wen Chen , Biomed. Eng. Center, Ohio State Univ., Columbus, OH, USA
pp. 1775-1778
V. Shtrom , Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH, USA
pp. 1779-1782
B.D. Rao , Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
pp. 1783-1786
V.K. Goyal , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 1787-1790
S. Dharanipragada , Centre for Language & Speech Process., Johns Hopkins Univ., Baltimore, MD, USA
pp. 1791-1794
E. Sekko , Univ. Claude Bernard, Villeurbanne, France
pp. 1795-1797
T. Lo , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 1798-1801
G.C. Freeland , Signal Process. Div., Strathclyde Univ., Glasgow, UK
pp. 1802-1805
W.M. Lam , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 1806-1809
M. Ali , Texas Instrum. Inc., Dallas, TX, USA
pp. 1810-1813
D.A.F. Florencio , Lab. of Digital Signal Process., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1814-1817
Wei Lin , Dialogic Corp., Parsippany, NJ, USA
pp. 1818-1821
W.W. Edmonson , Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
pp. 1822-1825
L.S. Resende , Univ. Estadual de Campinas, Sao Paulo, Brazil
pp. 1826-1829
H. Broman , Dept. of Appl. Electron., Chalmers Univ. of Technol., Goteborg, Sweden
pp. 1830-1833
S.T. Smith , Lincoln Lab., MIT, Lexington, MA, USA
pp. 1834-1837
F. Jiang , Dept. of Electr. Eng., Keio Univ., Yokohama, Japan
pp. 1838-1841
E.A. Wan , Dept. of Electr. Eng. & Appl. Phys., Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 1842-1845
D.I. Pazaitis , Sect. of Signal Process., Imperial Coll., London, UK
pp. 1846-1849
O. Tanrikulu , Sect. of Signal Process., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 1850-1853
Sang-Sik Ahn , Dept. of Appl. Electron., Korea Univ., Chungnam, South Korea
pp. 1854-1857
M. Moonen , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
pp. 1858-1861
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