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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1996)
Atlanta, GA, USA
May 7, 1996 to May 10, 1996
ISBN: 0-7803-3192-3
TABLE OF CONTENTS
Authors Index (Abstract)
pp. A1
F. Wolfertstetter , Inst. for Human-Machine-Commun., Munich Univ. of Technol., Germany
pp. 581-584
Y. Gotoh , Div. of Eng., Brown Univ., Providence, RI, USA
pp. 585-588
L.M. Arslan , Robust Speech Processing Lab., Duke Univ., Durham, NC, USA
pp. 589-592
H. Singer , ATR Interpreting Telephony Res. Labs., Kyoto, Japan
pp. 601-604
P.V.S. Rao , Comput. Syst. & Commun. Group, Tata Inst. of Fundamental Res., Bombay, India
pp. 609-612
L.R. Bahl , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 613-616
C.D. Mitchell , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 617-620
S.J. Godsill , Dept. of Eng., Cambridge Univ., UK
pp. 625-628
P. Scalart , CNET, Lannion, France
pp. 629-632
B.L. McKinley , Signal Processing Consultants, Fairfax, VA, USA
pp. 633-636
C.D. Yoo , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 641-644
D.C.B. Chan , Dept. of Eng., Cambridge Univ., UK
pp. 649-652
N. Fakotakis , Dept. of Electr. & Comput. Eng., Patras Univ., Greece
pp. 661-664
Li Liu , Ulm Univ., Germany
pp. 665-668
ChiWei Che , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 673-676
Qi Li , Speech Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 681-684
E.S. Parris , Ensigma Ltd., Chepstow, UK
pp. 685-688
J. Schalkwyk , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 693-696
B.M. Shahshahani , Nuance Commun., Manlo Park, CA, USA
pp. 697-700
Qiang Huo , ATR Interpreting Telephony Res. Labs., Kyoto, Japan
pp. 705-708
Jian Su , Dept. of Electron. Eng., City Univ. of Hong Kong, Hong Kong
pp. 709-712
K. Shinoda , Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 717-720
J. McDonough , BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 721-724
G. Zavaliagkos , BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 725-728
V. Abrash , Speech Res. & Technol. Lab., SRI Int., Menlo Park, CA, USA
pp. 729-732
P.J. Moreno , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 733-736
Jianping Pan , Samsung Adv. Inst. of Technol., KyungKi-Do, South Korea
pp. 741-744
H.C. Ng , Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon Tong, Hong Kong
pp. 745-748
Junchen Du , Dept. of Electr. Eng., Polytech. Univ., Brooklyn, NY, USA
pp. 749-752
Y.K. Lee , LG Electron. Res. Centre, Inf. & Technol. Lab., Seoul, South Korea
pp. 753-756
H. Zarrinkoub , INRS-Telecommun., Quebec Univ., Nuns' Island, Que., Canada
pp. 757-760
J.H.Y. Loo , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
pp. 761-764
T. Eriksson , Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
pp. 765-768
E. Singer , Lincoln Lab., MIT, Lexington, MA, USA
pp. 769-772
Siu-Pun Chui , Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong
pp. 773-776
T. Schultz , Interactive Syst. Labs., Karlsruhe Univ., Germany
pp. 781-784
Yonghong Yan , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 789-792
M.A. Lund , BBN Syst. & Technols., Cambridge, MA, USA
pp. 793-796
L. Welling , Lehrstuhl fur Inf. VI, Tech. Hochschule Aachen, Germany
pp. 797-800
Minsheng Liu , Inst. fur Angewandte Phys., Frankfurt Univ., Germany
pp. 801-804
U. Pillai , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 805-808
K. Hirose , Dept. of Inf. & Commun. Eng., Tokyo Univ., Japan
pp. 809-812
P. Rao , Dept. of Electr. Eng., Indian Inst. of Technol., Kanpur, India
pp. 813-816
J. Luettin , Dept. of Electron. & Electr. Eng., Sheffield Univ., UK
pp. 817-820
I. Kudo , Tsukuba Res. & Dev. Center Ltd., Texas Instrum. Inc., Ibaraki, Japan
pp. 825-828
N. Parlangeau , IRIT, Univ. Paul Sabatier, Toulouse, France
pp. 829-832
U. Meier , Interactive Syst. Labs., Karlsruhe Univ., Germany
pp. 833-836
J. Fritsch , Interactive Syst. Labs., Karlsruhe Univ., Germany
pp. 837-840
Multi channel HMM (Abstract)
Dongkin Xu , Comput. Neuroeng. Lab., Florida Univ., Gainesville, FL, USA
pp. 841-844
C. De La Torre , Speech Technol. Group, Telefonica Investigacion y Desarrollo, Madrid, Spain
pp. 845-848
J.D. Miller , Central Inst. for the Deaf, St. Louis, MO, USA
pp. 849-852
R.A. Cole , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 853-856
R.R. Sarukkai , Dept. of Comput. Sci., Rochester Univ., NY, USA
pp. 857-860
T. Kuhn , Dept. of Res. & Technol., Daimler-Benz AG, Ulm, Germany
pp. 861-864
G. Rigoll , Dept. of Comput. Sci., Gerhard-Mercator-Univ. Duisberg, Germany
pp. 865-868
O. Ronen , Dept. of Electron. & Comput. Sci., Boston Univ., MA, USA
pp. 873-876
R. De Mori , McGill Univ., Montreal, Que., Canada
pp. 877-880
N. Jain , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 881-884
S. Euler , Bosch Telecom, Frankfurt, Germany
pp. 889-892
M.S. Brandstein , Lab. for Eng. Man/Machine Syst., Brown Univ., Providence, RI, USA
pp. 901-904
R.A. Kennedy , Telecommun. Eng., Australian Nat. Univ., Canberra, ACT, Australia
pp. 905-908
S. Affes , INRS-Telecommun., Verdun, Que., Canada
pp. 909-912
M. Omologo , Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
pp. 921-924
P.L. Chu , PictureTel Corp., Danvers, MA, USA
pp. 929-932
E.D. McKinney , Sch. of Electr. Eng., Oklahoma Univ., Norman, OK, USA
pp. 933-936
S. Shimauchi , NTT Human Interface Labs., Tokyo, Japan
pp. 941-944
S. Makino , NTT Human Interface Labs., Tokyo, Japan
pp. 945-948
B. Ayad , Lab. Traitement du Signal et de l'Image, Rennes I Univ., France
pp. 953-956
S.L. Gay , Dept. of Acoust. Res., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 957-960
P.L. De Leon , Dept. of Electr. & Comput. Eng., New Mexico State Univ., Las Cruces, NM, USA
pp. 961-964
A. Omoto , Dept. of Acoust. Design, Kyushu Inst. of Design, Fukuoka, Japan
pp. 965-968
S.E. Wright , Sch. of Eng., Huddersfield Polytech., UK
pp. 973-976
T.F. Quatieri , Lincoln Lab., MIT, Lexington, MA, USA
pp. 977-980
I. Toshio , NTT Basic Res. Labs., Kanagawa, Japan
pp. 981-984
M. Karajalainen , Lab. of Acoustics & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland
pp. 985-988
U.K. Laine , Acoust. Lab., Helsinki Univ. of Technol., Espoo, Finland
pp. 989-992
J. Saunders , Lockheed Martin Co., Nashua, NH, USA
pp. 993-996
R.B. Sussman , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 997-1000
M. Slaney , Interval Res. Corp., Palo Alto, CA, USA
pp. 1001-1004
M. Goodwin , CNMAT, California Univ., Berkeley, CA, USA
pp. 1005-1008
S. Yim , Tsukuba Res. & Dev., Texas Inst., Japan
pp. 1009-1012
J.C. Schmidt , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
pp. 1013-1016
L. Mainard , CCETT, Cesson Sevigne, France
pp. 1017-1020
M. Purat , Inst. for Telecommun., Tech. Univ. Berlin, Germany
pp. 1021-1024
T. McLaughlin , Nat. Libr. Service for the Blind & Physically Handicapped, Washington, DC, USA
pp. 1025-1028
C. Jakob , Dept. of Commun. & Electr. Eng., R. Melbourne Inst. of Technol., Vic., Australia
pp. 1033-1036
D.V. Anderson , Sch. of Electr. & Compu. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1037-1040
S. Boland , Signal Process. Res. Centre, Queensland Univ., Brisbane, Qld., Australia
pp. 1041-1044
M. Kumar , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 1049-1052
D. Sinha , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 1053-1056
G.W. Wornell , Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
pp. 1057-1060
H.V. Poor , Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 1061-1064
U. Madhow , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 1065-1068
L.C. Yun , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 1069-1072
A.L. van der Veen , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 1073-1076
B. Halder , Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 1081-1084
L.K. Hansen , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 1085-1088
M.K. Tsatsanis , Dept. of Electr. Eng. & Comput. Sci., Stevens Inst. of Technol., Hoboken, NJ, USA
pp. 1093-1096
K.H. Chiang , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 1097-1100
J.H. McClellan , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1101-1104
D.M. Etter , Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 1109-1112
C.C. Crane , Dept. of Electr. Eng., Bucknell Univ., Lewisburg, PA, USA
pp. 1121-1124
F. Taylor , Florida Univ., Gainesville, FL, USA
pp. 1125-1128
D. Colton , Center for Spoken Language, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 1129-1132
E. Painter , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 1133-1136
M.R. Bielefeld , Mitre Corp., McLean, VA, USA
pp. 1141-1144
J.D. Tardelli , Arcon Corp., Waltham, MA, USA
pp. 1145-1148
A. Schmidt-Nielsen , Naval Res. Lab., Washington, DC, USA
pp. 1149-1156
E.W. Kreamer , Naval Res. Lab., Washington, DC, USA
pp. 1153-1156
P.D. Gatewood , Arcon Corp., Waltham, MA, USA
pp. 1157-1160
M.A. Kohler , US Dept. of Defense, Ft. Meade, MD, USA
pp. 1161-1164
Y. Seliktar , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1169-1172
J.S. Goldstein , USAF Rome Lab., Griffiss AFB, NY, USA
pp. 1173-1176
L.J. Griffiths , Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 1181-1184
J.L. Krolik , Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
pp. 1185-1188
M.B. Porter , Dept. of Math., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 1189-1192
L.W. Nolte , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 1197-1200
Hang-Bong Kang , DSP Lab., Samsung Adv. Inst. of Technol., Suwon, South Korea
pp. 1201-1204
Yee-Wen Chen , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 1205-1208
K.K. Truong , Atlanta Signal Process. Inc., GA, USA
pp. 1209-1212
B. Tannenbaum , David Sarnoff Res. Center, Princeton, NJ, USA
pp. 1213-1215
M. La Cascia , Dipartimento di Ingegneria Elettrica, Palermo Univ., Italy
pp. 1216-1219
R.S. Jasinschi , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 1220-1223
F. Marques , Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 1224-1227
W. Wolf , Dept. of Electr. Eng., Princeton Univ., NJ, USA
pp. 1228-1231
G.A. Shaw , Lincoln Lab., MIT, Lexington, MA, USA
pp. 1232-1235
M.S.B. Romdhane , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1236-1239
M. Potkonjak , Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
pp. 1240-1243
M. Sheliga , Dept. of Comput. Sci. & Eng., Notre Dame Univ., IN, USA
pp. 1248-1251
E.K. Pauer , Lockheed Sanders Avionics, Nashua, NH, USA
pp. 1252-1255
S. Famorzadeh , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1256-1259
C.B. Robbins , Manage. Commun. & Control Inc., Arlington, VA, USA
pp. 1260-1263
B. Isenstein , Mercury Comput. Syst. Inc., Chelmsford, MA, USA
pp. 1264-1267
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