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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1995)
Detroit, MI, USA
May 9, 1995 to May 12, 1995
ISBN: 0-7803-2431-5
TABLE OF CONTENTS
A.B. Baggeroer , MIT, Cambridge, MA, USA
H. Schmidt , MIT, Cambridge, MA, USA
pp. 2763-2766
T.G. Birdsall , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2767-2770
J.L. Krolik , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
S. Narasimhan , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 2771-2774
J.M.F. Moura , LASIP, Carnegie Mellon Univ., Pittsburgh, PA, USA
M.J. Rendas , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 2775-2778
C. Noel , Soc. SEMANTICS, Bandol, France
C. Viala , Soc. SEMANTICS, Bandol, France
pp. 2779vol.5-2778
P.W. Fieguth , Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
W.C. Karl , Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
A.S. Willsky , Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
pp. 2781-2784
T.M. Chin , Rosenstiel Sch. of Marine & Atmos. Sci., Miami Univ., FL, USA
A.J. Mariano , Rosenstiel Sch. of Marine & Atmos. Sci., Miami Univ., FL, USA
pp. 2785-2788
A. Asif , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.M.F. Moura , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 2789-2792
J.S. Jaffe , Marine Phys. Lab., Scripps Instn. of Oceanography, La Jolla, CA, USA
G. Chandran , Marine Phys. Lab., Scripps Instn. of Oceanography, La Jolla, CA, USA
E. Reuss , Marine Phys. Lab., Scripps Instn. of Oceanography, La Jolla, CA, USA
pp. 2793-2796
J.J. Simpson , Digital Image Anal. Lab., California Univ., San Diego, La Jolla, CA, USA
pp. 2797-2800
J.C. Curlander , Vexcel Corp., Boulder, CO, USA
pp. 2801-2804
J.D. Gorman , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
N.S. Subotic , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
B.J. Thelen , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
pp. 2805-2808
J. Ward , Lincoln Lab., MIT, Lexington, MA, USA
pp. 2809-2812
J.E. Molyneux , Dept. of Mech. Eng., Widener Univ., Chester, PA, USA
pp. 2813-2816
G. Mavko , Dept. of Geophys., Stanford Univ., CA, USA
N. Lucet , Dept. of Geophys., Stanford Univ., CA, USA
T. Mukerji , Dept. of Geophys., Stanford Univ., CA, USA
pp. 2817-2820
D.J. Thomson , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 2821-2824
M.G. Imhof , Dept. of Earth Atmos. & Planetary Sci., MIT, Cambridge, MA, USA
M.N. Toksoz , Dept. of Earth Atmos. & Planetary Sci., MIT, Cambridge, MA, USA
pp. 2825-2828
M. Richards , Electron. Syst. Technol. Office, Adv. Res. Projects Agency, Arlington, VA, USA
R. Reitmeyer , Dept. of Earth Atmos. & Planetary Sci., MIT, Cambridge, MA, USA
A. Bard , Dept. of Geophys., Stanford Univ., CA, USA
pp. 2829-2832
A. Kalavade , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
J.L. Pino , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
E.A. Lee , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 2833-2836
J. Rabaey , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
L. Guerra , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
R. Mehra , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 2837-2840
B. Friedlander , Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA
pp. 2841-2844
P. Papamichalis , Texas Instrum. Inc., Dallas, TX, USA
J. Reimer , Texas Instrum. Inc., Dallas, TX, USA
J. Rowlands , Texas Instrum. Inc., Dallas, TX, USA
pp. 2845-2848
Chaitali Chakrabarti , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
Mohan Vishwanath , Texas Instrum. Inc., Dallas, TX, USA
R.M. Owens , Texas Instrum. Inc., Dallas, TX, USA
pp. 2849-2852
R.M. Owens , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 2853-2856
S.H. Nawab , Dept. of Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
J.M. Winograd , Dept. of Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
pp. 2857-2860
G.A. Jullien , VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 2861-2864
J.R. Armstrong , Virginia Tech, VA, USA
pp. 2865-2867
V.K. Madisetti , Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
J.H. McClellan , Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
J.H. McClellan , Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
pp. 2869-2872
R.H. Bamberger , Dept. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
B.L. Evans , Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
E.A. Lee , Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
pp. 2873-2876
P. Pype , IMEC, Leuven, Belgium
H. De Man , IMEC, Leuven, Belgium
pp. 2877-2880
O.C. Mauss , Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
M. Pankert , Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
F. Classen , Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
H. Meyr , Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
pp. 2881-2884
D.M. Etter , Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
G.C. Orsak , Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
D.H. Johnson , Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
pp. 2885-2887
S.R. Kulkarni , Dept. of Astron., California Inst. of Technol., Pasadena, CA, USA
pp. 2889vol.5-2887
R. Schild , Harvard-Smithsonian Center for Astrophys., Cambridge, MA, USA
D.J. Thomson , Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
pp. 2891-2894
L.J. Lanzerotti , AT&T Bell Labs., Murray Hill, NJ, USA
D.J. Thomson , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 2895-2898
G.J.M. Aitken , Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont., Canada
pp. 2899-2902
Y. Bresler , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 2903-2906
C.A. Bouman , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
K. Sauer , AT&T Bell Labs., Murray Hill, NJ, USA
S.S. Saquib , Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
pp. 2907-2910
P.S. Lewis , Los Alamos Nat. Lab., NM, USA
J.C. Mosher , Los Alamos Nat. Lab., NM, USA
R.M. Leahy , Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
pp. 2911-2914
O. Tretiak , Image & Comput. Vision Center, Drexel Univ., Philadelphia, PA, USA
A. Goldszal , Image & Comput. Vision Center, Drexel Univ., Philadelphia, PA, USA
pp. 2915-2918
P. Thevenaz , Nat. Inst. of Health, Bethesda, MD, USA
M. Unser , Nat. Inst. of Health, Bethesda, MD, USA
pp. 2919-2922
D. Healy , Dept. of Math., Dartmouth Coll., Hanover, NH, USA
J. Weaver , Nat. Inst. of Health, Bethesda, MD, USA
pp. 2923-2926
C.E. Davila , Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
R. Srebro , Nat. Inst. of Health, Bethesda, MD, USA
H. Azmoodeh , Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
I. Ghaleb , Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
pp. 2927-2930
V. Parsa , New Brunswick Univ., Fredericton, NB, Canada
P. Parker , New Brunswick Univ., Fredericton, NB, Canada
R. Scott , New Brunswick Univ., Fredericton, NB, Canada
pp. 2931-2934
B.R. Kosanovic , Lab. for Comput. Neurosci., Pittsburgh Univ., PA, USA
L.F. Chaparro , New Brunswick Univ., Fredericton, NB, Canada
R.J. Sclabassi , New Brunswick Univ., Fredericton, NB, Canada
pp. 2935-2938
D.L. Sherman , Dept. of Biomed. Eng., Johns Hopkins Univ. Sch. of Med., Baltimore, MD, USA
D.L. Sherman , Dept. of Biomed. Eng., Johns Hopkins Univ. Sch. of Med., Baltimore, MD, USA
L.A. Rossell , New Brunswick Univ., Fredericton, NB, Canada
M.A. Mirski , Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
pp. 2939-2942
J.C. Mosher , Group-ESA-MT MS J580, Los Alamos Nat. Lab., NM, USA
R.M. Leahy , Dept. of Biomed. Eng., Johns Hopkins Univ. Sch. of Med., Baltimore, MD, USA
P.S. Lewis , New Brunswick Univ., Fredericton, NB, Canada
pp. 2943-2946
Xuan Kong , Dept. of Electr. Eng., Northern Illinois Univ., DeKalb, IL, USA
V. Goel , Dept. of Biomed. Eng., Johns Hopkins Univ. Sch. of Med., Baltimore, MD, USA
N. Thakor , New Brunswick Univ., Fredericton, NB, Canada
pp. 2947-2950
A.M. Zoubir , Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 2951-2954
S. Lakshmanan , Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
K.C. Kluge , Dept. of Biomed. Eng., Johns Hopkins Univ. Sch. of Med., Baltimore, MD, USA
pp. 2955-2958
W.B. Ribbens , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
S. Bieser , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2963-2966
A. Sterian , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
P. Runkle , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
G.H. Wakefield , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2967-2970
Y.W. Kim , Dept. of Mech. Eng., Ohio State Univ., Columbus, OH, USA
G. Rizzoni , Dept. of Mech. Eng., Ohio State Univ., Columbus, OH, USA
B. Samimy , Dept. of Mech. Eng., Ohio State Univ., Columbus, OH, USA
Y.Y. Wang , Dept. of Mech. Eng., Ohio State Univ., Columbus, OH, USA
pp. 2971-2974
T. Gioutsos , Artistic Anal. Methods Inc., Brighton, MI, USA
pp. 2975-2978
H. Abut , Dept. of Electr. & Comput. Eng., San Diego State Univ., CA, USA
A. Bilgin , Dept. of Electr. & Comput. Eng., San Diego State Univ., CA, USA
R.M. Bernardi , Dept. of Electr. & Comput. Eng., San Diego State Univ., CA, USA
L.A. Wherry , Dept. of Mech. Eng., Ohio State Univ., Columbus, OH, USA
pp. 2979-2982
R. Leahy , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
Zhenyu Zhou , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
Yung-Chih Hsu , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 2983-2986
Gang-Janp Lin , Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Sau-Gee Chen , Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
T. Wu , Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 2987-2990
J.C. Tejero , Department of Architecture & Technol. of Comput. Electron., Malaga, Spain
S. Bernal , Department of Architecture & Technol. of Comput. Electron., Malaga, Spain
J.A. Hidaldo , Department of Architecture & Technol. of Comput. Electron., Malaga, Spain
J. Fernandez , Department of Architecture & Technol. of Comput. Electron., Malaga, Spain
pp. 2991-2994
T. Chou , MIT, Cambridge, MA, USA
pp. 2995-2998
P.L. Chu , PictureTel Corp., Danvers, MA, USA
pp. 2999-3002
N.A. Whitmal , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
J.C. Rutledge , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
J. Cohen , Department of Architecture & Technol. of Comput. Electron., Malaga, Spain
pp. 3003-3006
Hong Wang , PictureTel Corp., Danvers, MA, USA
pp. 3007-3010
C. Rogers , Dept. of Phys., East Texas State Univ., TX, USA
pp. 3011-3014
S.E. Kirtman , Dept. of Electr. Eng., The Cooper Union, New York, NY, USA
H.F. Silverman , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
pp. 3015-3018
M.S. Brandstein , Div. of Eng., Brown Univ., Providence, RI, USA
J.E. Adcock , Div. of Eng., Brown Univ., Providence, RI, USA
H.F. Silverman , Div. of Eng., Brown Univ., Providence, RI, USA
pp. 3019-3022
S.L. Gay , Dept. of Acoust. Res., AT&T Bell Labs., Murray Hill, NJ, USA
S. Tavathia , Dept. of Acoust. Res., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 3023-3026
S. Minami , Inf. & Commun. Syst. Lab., Toshiba Corp., Kawasaki, Japan
pp. 3027-3030
C. Antweiler , Inst. for Commun. Syst. & Data Process., Tech. Hochschule Aachen, Germany
H.-G. Symanzik , Inst. for Commun. Syst. & Data Process., Tech. Hochschule Aachen, Germany
pp. 3031-3034
A.N. Birkett , Dept. of Syst. & Comput. Eng., Carleton Univ., Ottawa, Ont., Canada
R.A. Goubran , Dept. of Syst. & Comput. Eng., Carleton Univ., Ottawa, Ont., Canada
pp. 3035-3038
O. Tanrikulu , Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
B. Baykal , Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
A.G. Constantinides , Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
J.A. Chambers , Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
P.A. Naylor , Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3039-3042
R. Martin , Inst. for Commun. Syst. & Data Process., Tech. Hochschule Aachen, Germany
J. Altenhoner , Inst. for Commun. Syst. & Data Process., Tech. Hochschule Aachen, Germany
pp. 3043-3046
P. Heitkamper , Inst. fur Netzwerk- und Signaltheorie, Tech. Hochschule Darmstadt, Germany
pp. 3047-3050
A. Sugiyama , Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
F. Landais , Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 3051-3054
A. Stephenne , INRS Telecommun., Verdun, Que., Canada
B. Champagne , INRS Telecommun., Verdun, Que., Canada
pp. 3055-3058
S. Shimauchi , NTT Human Interface Labs., Tokyo, Japan
S. Makino , NTT Human Interface Labs., Tokyo, Japan
pp. 3059-3062
S. Boland , Signal Process. Res. Centre, Queensland Univ., Brisbane, Qld., Australia
M. Deriche , Signal Process. Res. Centre, Queensland Univ., Brisbane, Qld., Australia
pp. 3067-3069
J. Princen , AT&T Bell Labs., Murray Hill, NJ, USA
J.D. Johnston , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 3071-3074
M. Black , Dept. of Electr. Eng., Univ. of Western Ontario, London, Ont., Canada
M. Zeytinoglu , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 3075-3078
Shiufun Cheung , Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.S. Lim , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 3079-3082
J.-M. LeRoux , Matra Commun., Paris, France
R. Lefebvre , Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.-P. Adoul , Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3083-3086
P.E. Kudumakis , Dept. of Electron. & Electr. Eng., King's Coll., London, UK
M.B. Sandler , Dept. of Electron. & Electr. Eng., King's Coll., London, UK
pp. 3087-3090
A.L. Adams , Harris RF Commun., Rochester, NY, USA
S.W. McLaughlin , Dept. of Electron. & Electr. Eng., King's Coll., London, UK
pp. 3091-3094
N. Iwakami , NTT Human Interface Labs., Tokyo, Japan
T. Moriya , NTT Human Interface Labs., Tokyo, Japan
S. Miki , NTT Human Interface Labs., Tokyo, Japan
pp. 3095-3098
J. Benesty , Dept. Signal, Telecom Paris, France
F. Amand , NTT Human Interface Labs., Tokyo, Japan
A. Gilloire , NTT Human Interface Labs., Tokyo, Japan
Y. Grenier , Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3099-3102
J.J. Smith , Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
Y.H. Leung , Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
A. Cantoni , Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 3103-3106
J.R. Buck , Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.C. Preisig , Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
M. Johnson , Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
J. Catipovic , Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3107-3110
J. Tabrikian , Dept. of Electr. Eng., Tel Aviv Univ., Israel
H. Messer , Dept. of Electr. Eng., Tel Aviv Univ., Israel
pp. 3111-3114
B.F. Harrison , Naval Underwater Syst. Center, Newport, RI, USA
R.J. Vaccaro , Dept. of Electr. Eng., Tel Aviv Univ., Israel
D.W. Tufts , Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 3115-3118
V. Premus , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
D. Alexandrou , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 3119-3122
C.F. Mecklenbrauker , Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
D. Maiwald , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
J.F. Bohme , Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 3123-3126
R.N. Carpenter , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
S. Kay , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 3127-3130
O.P. Kenny , Defence Sci. & Technol. Organ., Salisbury, SA, Australia
L.B. White , Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 3131-3134
M.A. Dzieciuch , Scripps Instn. of Oceanogr., California Univ., San Diego, La Jolla, CA, USA
pp. 3135-3137
P. Blanc-Benon , Thomson Sintra ASM, Sophia-Antipolis, France
G. Bienvenu , Thomson Sintra ASM, Sophia-Antipolis, France
pp. 3139-3142
T.G. Manickam , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
R.J. Vaccaro , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 3143-3146
Yisong Ye , Dept. of Electr. Eng., Auburn Univ., AL, USA
J.K. Tugnait , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 3147-3150
H.C. So , Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
P.C. Ching , Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Y.T. Chan , Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 3151-3154
D.W. Tufts , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
Hongya Ge , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 3155-3158
E. Petit , Centre d'Etude des Phenomenes Aleatoires et Geophys., CNRS, St. Martin d'Heres, France
G. Jourdain , Centre d'Etude des Phenomenes Aleatoires et Geophys., CNRS, St. Martin d'Heres, France
pp. 3159-3162
Y. Xiang Yuan , Dept. of Electr. Eng., Saskatchewan Univ., Saskatoon, Sask., Canada
G.C. Carter , Centre d'Etude des Phenomenes Aleatoires et Geophys., CNRS, St. Martin d'Heres, France
J.E. Salt , Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 3163-3166
M.D. Hahm , Dept. of Electr. Eng., Rochester Univ., NY, USA
E.L. Titlebaum , Dept. of Electr. Eng., Rochester Univ., NY, USA
Z.I. Mitrovski , Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 3167-3170
Yingbo Hua , Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
H. Yang , Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
Mingyong Zhou , Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 3171-3174
Xiao-Jiao Tao , Dept. of Radio Eng., Southeast Univ., Nanjing, China
Cai-Rong Zou , Dept. of Radio Eng., Southeast Univ., Nanjing, China
Zhen-Ya He , Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 3175-3178
B. Geller , Domaine Univ., France
V. Capellano , Domaine Univ., France
G. Jourdain , Domaine Univ., France
pp. 3179-3182
F. Lorenzelli , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
K. Yao , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3183-3186
K.J. Raghunath , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
K.K. Parhi , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 3187-3190
S. Freeman , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
M. O'Donnell , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3191-3194
H. Kawai , Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
Y. Inoue , Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
R. Streitenberger , Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
M. Yoshimoto , Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
pp. 3199-3202
Shen-Fu Hsiao , Inst. of Comput. & Inf. Eng., Nat. Sun Yat-Sen Univ., Taiwan
pp. 3203-3206
F.T. Moller , Inst. for Electron. Syst., Aalborg Univ., Denmark
J.B. Andersen , Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
H.R. Jensen , Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
O. Olsen , Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
F.K. Fink , Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3207-3210
D. Rabideau , USAF Rome Lab., Griffiss AFB, NY, USA
A. Steinhardt , Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
pp. 3211-3214
M. Okamoto , Semicond. Res. Center, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
T. Ishikawa , Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
S. Marui , Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
M. Yamasaki , Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
K. Ueda , Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3215-3218
T.P. Kelliher , Dept. of Math. & Comput. Sci., Westminster Coll., New Wilmington, PA, USA
E.S. Gayles , Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
R.M. Owens , Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
M.J. Irwin , Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
pp. 3219-3222
N.L. Passos , Dept. of Comput. Sci. & Eng., Notre Dame Univ., IN, USA
E.H.-M. Sha , Dept. of Comput. Sci. & Eng., Notre Dame Univ., IN, USA
pp. 3223-3226
K.H. Yu , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 3227-3230
Liang-Fang Chao , Dept. of Electr. & Comput. Eng., Iowa State Univ., Ames, IA, USA
E.H.-M. Sha , Dept. of Comput. Sci. & Eng., Notre Dame Univ., IN, USA
pp. 3231-3234
T.M. Parks , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
E.A. Lee , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 3235-3238
M. Kahrs , Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
pp. 3239-3242
T. Grotker , Aachen Univ. of Technol., Germany
P. Zepter , Aachen Univ. of Technol., Germany
H. Meyr , Aachen Univ. of Technol., Germany
pp. 3243-3246
M. Moonen , Dept. of Electr. Eng., Katholieke Univ., Leuven, Heverlee, Belgium
E. Deprettere , Aachen Univ. of Technol., Germany
I.K. Proudler , Aachen Univ. of Technol., Germany
J.G. McWhirter , Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
pp. 3247-3250
M. Shajaan , Electron. Inst., Tech. Univ. Denmark, Lyngby, Denmark
K. Nielsen , Electron. Inst., Tech. Univ. Denmark, Lyngby, Denmark
J.A. Sorensen , Electron. Inst., Tech. Univ. Denmark, Lyngby, Denmark
pp. 3251-3254
G. Bilsen , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
M. Engels , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
R. Lauwereins , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
J.A. Peperstraete , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
pp. 3255-3258
K.P. Khiar , California Univ., Berkeley, CA, USA
E.A. Lee , California Univ., Berkeley, CA, USA
pp. 3259-3262
K. Baudendistel , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 3263-3266
An-Yeu Wu , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
K.J.R. Liu , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 3267-3270
E. Scopa , Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
A. Leone , Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
R. Guerrieri , Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
G. Baccarani , Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
pp. 3271-3274
J. Bruguera , Dept. of Electron., Santiago de Compostela Univ., Spain
T. Lang , Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
pp. 3275-3278
Heonchul Park , Semicond. Div., Samsung Electron. Co. Ltd., Kyoungki, South Korea
Jae-Chul Son , Semicond. Div., Samsung Electron. Co. Ltd., Kyoungki, South Korea
Seong-Rae Cho , Semicond. Div., Samsung Electron. Co. Ltd., Kyoungki, South Korea
pp. 3279-3281
A. Pirson , Thomson Consumer Electron. Components, Meylan, France
F. Yassa , Thomson Consumer Electron. Components, Meylan, France
P. Paul , Thomson Consumer Electron. Components, Meylan, France
B. Canfield , Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
F. Rominger , Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3283-3286
D. Charlot , Thomson Consumer Electron. Components, Meylan, France
J.-M. Bard , Thomson Consumer Electron. Components, Meylan, France
B. Canfield , Thomson Consumer Electron. Components, Meylan, France
C. Cuney , Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
A. Graf , Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3287-3290
A. Akerib , A.S.P. Solutions Ltd., Raanana, Israel
R. Adar , A.S.P. Solutions Ltd., Raanana, Israel
pp. 3291-3294
Chin-Liang Wang , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Ker-Min Chen , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Jin-Min Hsiung , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 3295-3298
Mei-Cheng Lu , Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Chen-Yi Lee , Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 3299-3302
Hangu Yeo , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
Hangu Yeo , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 3303-3306
J.P. Verhasselt , ELIS, Ghent Univ., Belgium
J.-P. Martens , ELIS, Ghent Univ., Belgium
pp. 3307-3310
H.-P. Hutter , Speech Processing Group, Eidgenossische Tech. Hochschule, Zurich, Switzerland
pp. 3311-3314
T.L. Burrows , Dept. of Eng., Cambridge Univ., UK
M. Niranjan , Dept. of Eng., Cambridge Univ., UK
pp. 3315-3318
Tan Lee , Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
P.C. Ching , Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
L.W. Chan , Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 3319-3322
M. Sharma , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
R. Mammone , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 3323-3326
U. Bodenhausen , Dept. of Comput. Sci., Karlsruhe Univ., Germany
H. Hild , Dept. of Comput. Sci., Karlsruhe Univ., Germany
pp. 3327-3330
K. Kasper , Inst. fur Angewandte Phys., Frankfurt Univ., Germany
H. Reininger , Inst. fur Angewandte Phys., Frankfurt Univ., Germany
D. Wolf , Inst. fur Angewandte Phys., Frankfurt Univ., Germany
H. Wust , Inst. fur Angewandte Phys., Frankfurt Univ., Germany
pp. 3331-3334
W. Reichl , Inst. for Human-Machine-Commun., Munich Univ. of Technol., Germany
G. Ruske , Inst. for Human-Machine-Commun., Munich Univ. of Technol., Germany
pp. 3335-3338
E. Levine , Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 3339-3341
Q.J. Zhang , Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
Fang Wang , Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
M.S. Nakhla , Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
pp. 3343-3346
C.S.-T. Choy , Dept. of Electron. Eng., Hong Kong Polytech. Univ, Kowloon, Hong Kong
Wan-Chi Siu , Dept. of Electron. Eng., Hong Kong Polytech. Univ, Kowloon, Hong Kong
pp. 3351-3354
L. Owsley , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
L. Atlas , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
G. Bernard , Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
pp. 3355-3358
Fu-Chiang Tsui , Lab. of Comput. Neurosci., Pittsburgh Univ., PA, USA
Mingui Sun , Lab. of Comput. Neurosci., Pittsburgh Univ., PA, USA
Ching-Chung Li , Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
R.J. Sclabassi , Inst. fur Angewandte Phys., Frankfurt Univ., Germany
pp. 3359-3362
Chuan Wang , Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
Jyh-Ming Kuo , Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
J.C. Principe , Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
pp. 3363-3366
Weibo Liang , Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
M.T. Manry , Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
Qiang Yu , Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
M.S. Dawson , Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
A.K. Fung , Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
pp. 3367-3369
I.M. Elfadel , Masimo Corp., Laguna Hills, CA, USA
pp. 3371-3374
Qi Li , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
D.W. Tufts , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 3375-3378
H.B.D. Sorensen , Dept. of Appl. Electron., Tech. Univ. Denmark, Lyngby, Denmark
U. Hartmann , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
P. Hunnerup , Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
pp. 3379-3382
N.J. Bershad , Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
N. Cubaud , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
J.J. Shynk , Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
pp. 3383-3386
Xieting Ling , Dept. of Electron. Eng., Fudan Univ., Shanghai, China
Wei Tian , Dept. of Electron. Eng., Fudan Univ., Shanghai, China
Bin Liu , Dept. of Electron. Eng., Fudan Univ., Shanghai, China
pp. 3387-3390
J.A. Sorensen , Electron. Inst., Tech. Univ. Denmark, Lyngby, Denmark
pp. 3391-3394
F. Bartolini , Dipartimento di Ingegneria Elettronica, Firenze Univ., Italy
V. Cappellini , Dipartimento di Ingegneria Elettronica, Firenze Univ., Italy
S. Nerozzi , Dipartimento di Ingegneria Elettronica, Firenze Univ., Italy
A. Mecocci , Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
pp. 3395-3398
M.J. Bradley , Sch. of Eng., Durham Univ., UK
P. Mars , Sch. of Eng., Durham Univ., UK
pp. 3399-3402
P. Kuosmanen , Signal Process. Lab., Tampere Univ. of Technol., Finland
K. Egiazarian , Signal Process. Lab., Tampere Univ. of Technol., Finland
J. Astola , Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 3403-3406
B.W. Stiles , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
J. Ghosh , Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 3407-3410
X.Q. Gao , Dept. of Radio Eng., Southeast Univ., Nanjing, China
X.D. Wang , Dept. of Radio Eng., Southeast Univ., Nanjing, China
L.H. Li , Dept. of Radio Eng., Southeast Univ., Nanjing, China
H. Zhang , Dept. of Radio Eng., Southeast Univ., Nanjing, China
Z.Y. He , Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 3411-3414
A.J. Bell , Comput. Neurobiol. Lab., Salk Inst., La Jolla, Ca, USA
T.J. Sejnowski , Comput. Neurobiol. Lab., Salk Inst., La Jolla, Ca, USA
pp. 3415-3418
P. Yee , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
S. Haykin , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 3419-3422
K. Jemili , Dept. of Electr. Eng., Dayton Univ., OH, USA
J.J. Westerkamp , Dept. of Electr. Eng., Dayton Univ., OH, USA
pp. 3423-3426
A.J. Abruntes , INESC, Polytech. Inst. of Lisbon, Portugal
J.S. Marques , Dept. of Electr. Eng., Dayton Univ., OH, USA
pp. 3427-3430
L.W. Cychosz , Dept. of Electr. Eng., Wisconsin Univ., Milwaukee, WI, USA
Jun Zhang , Dept. of Electr. Eng., Wisconsin Univ., Milwaukee, WI, USA
pp. 3431-3434
T. McElroy , Raytheon Co., Marlboro, MA, USA
E. Wilson , Raytheon Co., Marlboro, MA, USA
G. Anspach , Raytheon Co., Marlboro, MA, USA
pp. 3435-3438
H. Watanabe , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
T. Yamaguchi , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
S. Katagiri , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
pp. 3439-3442
Ying Zhao , BBN Syst. & Technol., Cambridge, MA, USA
R. Schwartz , BBN Syst. & Technol., Cambridge, MA, USA
J. Sroka , BBN Syst. & Technol., Cambridge, MA, USA
J. Makhoul , BBN Syst. & Technol., Cambridge, MA, USA
pp. 3443-3446
B. Solaiman , ENST de Bretagne, Brest, France
E.P. Maillard , BBN Syst. & Technol., Cambridge, MA, USA
pp. 3447-3450
Changyi Sun , Forest Resources, Utah State Univ., Logan, UT, USA
Heng-Da Cheng , BBN Syst. & Technol., Cambridge, MA, USA
J.J. McDonnell , BBN Syst. & Technol., Cambridge, MA, USA
C.M.U. Neale , BBN Syst. & Technol., Cambridge, MA, USA
pp. 3451-3454
Chung-Hsien Wu , Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Ching-Wen Lo , Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Jhing-Fa Wang , Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 3455-3458
R.I. Damper , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 3459-3462
S. Garcia-Salicetti , Inst. Nat. des Telecommun., Evry, France
P. Gallinari , Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
B. Dorizzi , Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
A. Mellouk , BBN Syst. & Technol., Cambridge, MA, USA
D. Fanchon , Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 3463-3466
P. Davies , Purdue Univ., West Lafayette, IN, USA
B.R. Silverstein , Purdue Univ., West Lafayette, IN, USA
pp. 3467-3470
Ce Zhu , Dept. of Electron. Eng., Shantou Univ., Guangdong, China
Jun Wang , Purdue Univ., West Lafayette, IN, USA
Taijun Wang , Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 3471-3474
M. Petroni , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
A.S. Malowany , Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
C.C. Johnston , Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
B.J. Stevens , BBN Syst. & Technol., Cambridge, MA, USA
pp. 3475-3478
B. Ulug , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
S.C. Ahalt , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
R.A. Mitchell , Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 3479-3482
Datong Wei , Dept. of Radiol., Michigan Univ., Ann Arbor, MI, USA
B. Sahiner , Dept. of Radiol., Michigan Univ., Ann Arbor, MI, USA
Heang-Ping Chan , Dept. of Radiol., Michigan Univ., Ann Arbor, MI, USA
N. Petrick , Dept. of Radiol., Michigan Univ., Ann Arbor, MI, USA
pp. 3483-3486
Huang Deshuang , Inst. of Autom., Beijing Inst. of Technol., China
Mao Erke , Inst. of Autom., Beijing Inst. of Technol., China
Han Yueqiu , Inst. of Autom., Beijing Inst. of Technol., China
pp. 3487-3490
K.P. Cohen , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
Y.H. Hu , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
W.J. Tompkins , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
J.G. Webster , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 3491-3494
Yuh-Fwu Guu , Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
B. Peikari , Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
pp. 3495-3498
Y. Cai , Dept. of Electr. Eng., Windsor Univ., Ont., Canada
H.K. Kwan , Dept. of Electr. Eng., Windsor Univ., Ont., Canada
pp. 3499-3502
M.A. Zissman , Lincoln Lab., MIT, Lexington, MA, USA
pp. 3503-3506
S. Kadambe , AT&T Bell Labs., Murray Hill, NJ, USA
J.L. Hieronymus , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 3507-3510
Yonghong Yan , Centre for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
E. Barnard , Centre for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 3511-3514
Kung-Pu Li , ITT Aerosp. Commun. Div., San Diego, CA, USA
pp. 3515-3518
E.S. Parris , Ensigma Ltd., Chepstow, UK
M.J. Carey , Ensigma Ltd., Chepstow, UK
pp. 3519-3522
T. Schneider , Hearing Health Care Res. Unit, Univ. of Western Ontario, London, Ont., Canada
D.G. Jamieson , Hearing Health Care Res. Unit, Univ. of Western Ontario, London, Ont., Canada
pp. 3523-3526
D.M. Chabries , Brigham Young Univ., Provo, UT, USA
D.V. Anderson , Brigham Young Univ., Provo, UT, USA
D.V. Anderson , Brigham Young Univ., Provo, UT, USA
R.W. Christiansen , Brigham Young Univ., Provo, UT, USA
pp. 3527-3530
D.V. Anderson , Brigham Young Univ., Provo, UT, USA
R.W. Harris , Brigham Young Univ., Provo, UT, USA
D.M. Chabries , Brigham Young Univ., Provo, UT, USA
pp. 3531-3533
M. Leisenberg , Inst. of Sound & Vibration Res., Southampton Univ., UK
pp. 3535-3538
B. Strope , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
A. Alwan , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3539-3542
A.C. Barthelemy , Naval Undersea Warfare Centre, New London, CT, USA
P.K. Willett , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3543-3546
J.H. Gross , Appl. Res. Lab., Texas Univ., Austin, TX, USA
D.E. Grant , Appl. Res. Lab., Texas Univ., Austin, TX, USA
pp. 3547-3550
O. Gasparini , Ingegneria dei Sistemi, DUNE, Rome, Italy
C. Camporeale , Ingegneria dei Sistemi, DUNE, Rome, Italy
pp. 3551-3554
H. Chuberre , IRISA, Rennes I Univ., France
T. Filleul , IRISA, Rennes I Univ., France
J.-J. Fuchs , IRISA, Rennes I Univ., France
pp. 3555-3558
Y. Chocheyras , Thomson Sintra ASM, Sophia-Antipolis, France
L. Kopp , Thomson Sintra ASM, Sophia-Antipolis, France
pp. 3559-3562
C. Theys , CNRS, Univ. de Nice-Sophia Antipolis, Nice, France
G. Alengrin , CNRS, Univ. de Nice-Sophia Antipolis, Nice, France
pp. 3563-3566
J.P. Le Cadre , CNRS, IRISA, Rennes, France
O. Tremois , CNRS, IRISA, Rennes, France
pp. 3567-3570
C. Rago , Connecticut Univ., Storrs, CT, USA
P. Willett , Connecticut Univ., Storrs, CT, USA
R. Streit , IRISA, Rennes I Univ., France
pp. 3571-3574
P. Gounon , CEPHAG, ENSIEG, St. Martin d'Heres, France
S. Bozinoski , CEPHAG, ENSIEG, St. Martin d'Heres, France
pp. 3575-3578
W.T. Padgett , Dept. of Electr. Comput. Eng., Rose-Hulman Inst. of Technol., Terre Haute, IN, USA
pp. 3579-3582
B. Colnet , CNRS, CRIN-INRIA, Nancy, France
J.-C. Di Martino , CNRS, CRIN-INRIA, Nancy, France
pp. 3583-3586
A. Kundu , RDT&E Div., Naval Command Control & Ocean Surveillance Centre, San Diego, CA, USA
G.C. Chen , RDT&E Div., Naval Command Control & Ocean Surveillance Centre, San Diego, CA, USA
pp. 3587-3590
C.W. Victory , RDT&E Div., NCCOSC, San Diego, CA, USA
R. Trueblood , RDT&E Div., Naval Command Control & Ocean Surveillance Centre, San Diego, CA, USA
pp. 3591-3594
J.N. Maksym , Defence Res. Establ. Atlantic, Dartmouth, NS, Canada
pp. 3595-3598
K.C. Ho , Dept. of Electr. & Comput. Eng., R. Mil. Coll. of Canada, Kingston, Ont., Canada
A.E. Scheidl , Dept. of Electr. & Comput. Eng., R. Mil. Coll. of Canada, Kingston, Ont., Canada
R.J. Inkol , IRISA, Rennes I Univ., France
pp. 3599-3602
B.X. Li , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
S. Haykin , Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 3603-3606
Shun-Hsyung Chang , Dept. of Electr. Eng., Nat. Taiwan Ocean Univ., Keelung, Taiwan
Tong-Yao Lee , Dept. of Electr. Eng., Nat. Taiwan Ocean Univ., Keelung, Taiwan
Wen-Hsien Fang , IRISA, Rennes I Univ., France
pp. 3607-3610
Tser-Ya Dai , Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Ta-Sung Lee , Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 3611-3614
G.J. Melendez , Night Vision & Electron. Sensors Directorate, US Army Commun. & Electron. Command, Fort Monmouth, NJ, USA
S.B. Kesler , Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 3615-3618
J.L. Vaughn , Opt. Sci. Co., Anaheim, CA, USA
N.J. Bershad , Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 3619-3622
G.L. Fudge , Program in Electr. Eng., Texas Univ., Dallas, TX, USA
D.A. Linebarger , Program in Electr. Eng., Texas Univ., Dallas, TX, USA
pp. 3623-3626
V. Murino , Dept. of Biophys. & Electron. Eng., Genoa Univ., Italy
pp. 3627-3630
G.V. Serebryakov , Inst. of Appl. Math. Cybern., Nizhny Novgorod, Russia
D.V. Sidorovitch , Program in Electr. Eng., Texas Univ., Dallas, TX, USA
C. Mecklenbraeuker , IRISA, Rennes I Univ., France
pp. 3631-3634
E.C. Real , Lockheed Sanders Inc., Nashua, NH, USA
D.P. Charette , Lockheed Sanders Inc., Nashua, NH, USA
pp. 3635-3638
K. Teramoto , Dept. of Inf. Sci., Saga Univ., Japan
H. Kamiirisa , Lockheed Sanders Inc., Nashua, NH, USA
pp. 3639-3642
J.E. Garrido-Arenas , Centro Astron. de Yebes, Guadalajara, Spain
J.M. Paez-Borrallo , Lockheed Sanders Inc., Nashua, NH, USA
A. Barcia-Cancio , IRISA, Rennes I Univ., France
pp. 3643-3646
K.B. Eom , Dept. of Electr. Eng. & Comput. Sci., George Washington Univ., Washington, DC, USA
pp. 3647-3650
Hung-Chih Chiang , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
R.L. Moses , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
S.C. Ahalt , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 3655-3658
X. Yu , Div. of Commun. & Surveillance, SAIC, San Diego, CA, USA
A.M. Chen , Div. of Commun. & Surveillance, SAIC, San Diego, CA, USA
I.S. Reed , Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 3659-3662
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