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Acoustics, Speech, and Signal Processing, 1995. ICASSP-95 Vol 5., 1995 International Conference on
Detroit, MI, USA
May 09-May 12
ISBN: 0-7803-2431-5
Table of Contents
T.G. Birdsall, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2767-2770
J.L. Krolik, Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
S. Narasimhan, Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 2771-2774
J.M.F. Moura, LASIP, Carnegie Mellon Univ., Pittsburgh, PA, USA
M.J. Rendas, Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 2775-2778
P.W. Fieguth, Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
W.C. Karl, Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
A.S. Willsky, Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
pp. 2781-2784
T.M. Chin, Rosenstiel Sch. of Marine & Atmos. Sci., Miami Univ., FL, USA
A.J. Mariano, Rosenstiel Sch. of Marine & Atmos. Sci., Miami Univ., FL, USA
pp. 2785-2788
A. Asif, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.M.F. Moura, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 2789-2792
J.S. Jaffe, Marine Phys. Lab., Scripps Instn. of Oceanography, La Jolla, CA, USA
G. Chandran, Marine Phys. Lab., Scripps Instn. of Oceanography, La Jolla, CA, USA
E. Reuss, Marine Phys. Lab., Scripps Instn. of Oceanography, La Jolla, CA, USA
pp. 2793-2796
J.D. Gorman, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
N.S. Subotic, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
B.J. Thelen, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
pp. 2805-2808
J.E. Molyneux, Dept. of Mech. Eng., Widener Univ., Chester, PA, USA
pp. 2813-2816
G. Mavko, Dept. of Geophys., Stanford Univ., CA, USA
N. Lucet, Dept. of Geophys., Stanford Univ., CA, USA
T. Mukerji, Dept. of Geophys., Stanford Univ., CA, USA
pp. 2817-2820
M.G. Imhof, Dept. of Earth Atmos. & Planetary Sci., MIT, Cambridge, MA, USA
M.N. Toksoz, Dept. of Earth Atmos. & Planetary Sci., MIT, Cambridge, MA, USA
pp. 2825-2828
M. Richards, Electron. Syst. Technol. Office, Adv. Res. Projects Agency, Arlington, VA, USA
R. Reitmeyer, Dept. of Earth Atmos. & Planetary Sci., MIT, Cambridge, MA, USA
A. Bard, Dept. of Geophys., Stanford Univ., CA, USA
pp. 2829-2832
A. Kalavade, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
J.L. Pino, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
E.A. Lee, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 2833-2836
J. Rabaey, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
L. Guerra, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
R. Mehra, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 2837-2840
P. Papamichalis, Texas Instrum. Inc., Dallas, TX, USA
J. Reimer, Texas Instrum. Inc., Dallas, TX, USA
J. Rowlands, Texas Instrum. Inc., Dallas, TX, USA
pp. 2845-2848
Chaitali Chakrabarti, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
Mohan Vishwanath, Texas Instrum. Inc., Dallas, TX, USA
R.M. Owens, Texas Instrum. Inc., Dallas, TX, USA
pp. 2849-2852
R.M. Owens, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 2853-2856
S.H. Nawab, Dept. of Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
J.M. Winograd, Dept. of Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
pp. 2857-2860
V.K. Madisetti, Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
J.H. McClellan, Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
J.H. McClellan, Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
pp. 2869-2872
R.H. Bamberger, Dept. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
B.L. Evans, Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
E.A. Lee, Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
pp. 2873-2876
O.C. Mauss, Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
M. Pankert, Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
F. Classen, Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
H. Meyr, Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
pp. 2881-2884
D.M. Etter, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
G.C. Orsak, Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
D.H. Johnson, Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
pp. 2885-2887
S.R. Kulkarni, Dept. of Astron., California Inst. of Technol., Pasadena, CA, USA
pp. 2889vol.5-2887
R. Schild, Harvard-Smithsonian Center for Astrophys., Cambridge, MA, USA
D.J. Thomson, Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
pp. 2891-2894
L.J. Lanzerotti, AT&T Bell Labs., Murray Hill, NJ, USA
D.J. Thomson, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 2895-2898
G.J.M. Aitken, Dept. of Electr. & Comput. Eng., Queen's Univ., Kingston, Ont., Canada
pp. 2899-2902
Y. Bresler, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 2903-2906
C.A. Bouman, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
K. Sauer, AT&T Bell Labs., Murray Hill, NJ, USA
S.S. Saquib, Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
pp. 2907-2910
P.S. Lewis, Los Alamos Nat. Lab., NM, USA
J.C. Mosher, Los Alamos Nat. Lab., NM, USA
R.M. Leahy, Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
pp. 2911-2914
O. Tretiak, Image & Comput. Vision Center, Drexel Univ., Philadelphia, PA, USA
A. Goldszal, Image & Comput. Vision Center, Drexel Univ., Philadelphia, PA, USA
pp. 2915-2918
P. Thevenaz, Nat. Inst. of Health, Bethesda, MD, USA
M. Unser, Nat. Inst. of Health, Bethesda, MD, USA
pp. 2919-2922
D. Healy, Dept. of Math., Dartmouth Coll., Hanover, NH, USA
J. Weaver, Nat. Inst. of Health, Bethesda, MD, USA
pp. 2923-2926
C.E. Davila, Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
R. Srebro, Nat. Inst. of Health, Bethesda, MD, USA
H. Azmoodeh, Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
I. Ghaleb, Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
pp. 2927-2930
V. Parsa, New Brunswick Univ., Fredericton, NB, Canada
P. Parker, New Brunswick Univ., Fredericton, NB, Canada
R. Scott, New Brunswick Univ., Fredericton, NB, Canada
pp. 2931-2934
B.R. Kosanovic, Lab. for Comput. Neurosci., Pittsburgh Univ., PA, USA
L.F. Chaparro, New Brunswick Univ., Fredericton, NB, Canada
R.J. Sclabassi, New Brunswick Univ., Fredericton, NB, Canada
pp. 2935-2938
D.L. Sherman, Dept. of Biomed. Eng., Johns Hopkins Univ. Sch. of Med., Baltimore, MD, USA
D.L. Sherman, Dept. of Biomed. Eng., Johns Hopkins Univ. Sch. of Med., Baltimore, MD, USA
L.A. Rossell, New Brunswick Univ., Fredericton, NB, Canada
M.A. Mirski, Integrated Syst. for Signal Process., Tech. Hochschule Aachen, Germany
pp. 2939-2942
J.C. Mosher, Group-ESA-MT MS J580, Los Alamos Nat. Lab., NM, USA
R.M. Leahy, Dept. of Biomed. Eng., Johns Hopkins Univ. Sch. of Med., Baltimore, MD, USA
P.S. Lewis, New Brunswick Univ., Fredericton, NB, Canada
pp. 2943-2946
Xuan Kong, Dept. of Electr. Eng., Northern Illinois Univ., DeKalb, IL, USA
V. Goel, Dept. of Biomed. Eng., Johns Hopkins Univ. Sch. of Med., Baltimore, MD, USA
N. Thakor, New Brunswick Univ., Fredericton, NB, Canada
pp. 2947-2950
A.M. Zoubir, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 2951-2954
S. Lakshmanan, Dept. of Electr. & Comput. Eng., Michigan Univ., Dearborn, MI, USA
K.C. Kluge, Dept. of Biomed. Eng., Johns Hopkins Univ. Sch. of Med., Baltimore, MD, USA
pp. 2955-2958
W.B. Ribbens, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
S. Bieser, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2963-2966
A. Sterian, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
P. Runkle, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
G.H. Wakefield, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2967-2970
Y.W. Kim, Dept. of Mech. Eng., Ohio State Univ., Columbus, OH, USA
G. Rizzoni, Dept. of Mech. Eng., Ohio State Univ., Columbus, OH, USA
B. Samimy, Dept. of Mech. Eng., Ohio State Univ., Columbus, OH, USA
Y.Y. Wang, Dept. of Mech. Eng., Ohio State Univ., Columbus, OH, USA
pp. 2971-2974
T. Gioutsos, Artistic Anal. Methods Inc., Brighton, MI, USA
pp. 2975-2978
H. Abut, Dept. of Electr. & Comput. Eng., San Diego State Univ., CA, USA
A. Bilgin, Dept. of Electr. & Comput. Eng., San Diego State Univ., CA, USA
R.M. Bernardi, Dept. of Electr. & Comput. Eng., San Diego State Univ., CA, USA
L.A. Wherry, Dept. of Mech. Eng., Ohio State Univ., Columbus, OH, USA
pp. 2979-2982
R. Leahy, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
Zhenyu Zhou, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
Yung-Chih Hsu, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 2983-2986
Gang-Janp Lin, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Sau-Gee Chen, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
T. Wu, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 2987-2990
J.C. Tejero, Department of Architecture & Technol. of Comput. Electron., Malaga, Spain
S. Bernal, Department of Architecture & Technol. of Comput. Electron., Malaga, Spain
J.A. Hidaldo, Department of Architecture & Technol. of Comput. Electron., Malaga, Spain
J. Fernandez, Department of Architecture & Technol. of Comput. Electron., Malaga, Spain
pp. 2991-2994
N.A. Whitmal, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
J.C. Rutledge, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
J. Cohen, Department of Architecture & Technol. of Comput. Electron., Malaga, Spain
pp. 3003-3006
C. Rogers, Dept. of Phys., East Texas State Univ., TX, USA
pp. 3011-3014
S.E. Kirtman, Dept. of Electr. Eng., The Cooper Union, New York, NY, USA
H.F. Silverman, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
pp. 3015-3018
M.S. Brandstein, Div. of Eng., Brown Univ., Providence, RI, USA
J.E. Adcock, Div. of Eng., Brown Univ., Providence, RI, USA
H.F. Silverman, Div. of Eng., Brown Univ., Providence, RI, USA
pp. 3019-3022
S.L. Gay, Dept. of Acoust. Res., AT&T Bell Labs., Murray Hill, NJ, USA
S. Tavathia, Dept. of Acoust. Res., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 3023-3026
S. Minami, Inf. & Commun. Syst. Lab., Toshiba Corp., Kawasaki, Japan
pp. 3027-3030
C. Antweiler, Inst. for Commun. Syst. & Data Process., Tech. Hochschule Aachen, Germany
H.-G. Symanzik, Inst. for Commun. Syst. & Data Process., Tech. Hochschule Aachen, Germany
pp. 3031-3034
A.N. Birkett, Dept. of Syst. & Comput. Eng., Carleton Univ., Ottawa, Ont., Canada
R.A. Goubran, Dept. of Syst. & Comput. Eng., Carleton Univ., Ottawa, Ont., Canada
pp. 3035-3038
O. Tanrikulu, Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
B. Baykal, Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
A.G. Constantinides, Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
J.A. Chambers, Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
P.A. Naylor, Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3039-3042
R. Martin, Inst. for Commun. Syst. & Data Process., Tech. Hochschule Aachen, Germany
J. Altenhoner, Inst. for Commun. Syst. & Data Process., Tech. Hochschule Aachen, Germany
pp. 3043-3046
P. Heitkamper, Inst. fur Netzwerk- und Signaltheorie, Tech. Hochschule Darmstadt, Germany
pp. 3047-3050
A. Sugiyama, Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
F. Landais, Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 3051-3054
A. Stephenne, INRS Telecommun., Verdun, Que., Canada
B. Champagne, INRS Telecommun., Verdun, Que., Canada
pp. 3055-3058
S. Shimauchi, NTT Human Interface Labs., Tokyo, Japan
S. Makino, NTT Human Interface Labs., Tokyo, Japan
pp. 3059-3062
S. Boland, Signal Process. Res. Centre, Queensland Univ., Brisbane, Qld., Australia
M. Deriche, Signal Process. Res. Centre, Queensland Univ., Brisbane, Qld., Australia
pp. 3067-3069
J. Princen, AT&T Bell Labs., Murray Hill, NJ, USA
J.D. Johnston, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 3071-3074
M. Black, Dept. of Electr. Eng., Univ. of Western Ontario, London, Ont., Canada
M. Zeytinoglu, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 3075-3078
Shiufun Cheung, Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.S. Lim, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 3079-3082
J.-M. LeRoux, Matra Commun., Paris, France
R. Lefebvre, Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.-P. Adoul, Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3083-3086
P.E. Kudumakis, Dept. of Electron. & Electr. Eng., King's Coll., London, UK
M.B. Sandler, Dept. of Electron. & Electr. Eng., King's Coll., London, UK
pp. 3087-3090
A.L. Adams, Harris RF Commun., Rochester, NY, USA
S.W. McLaughlin, Dept. of Electron. & Electr. Eng., King's Coll., London, UK
pp. 3091-3094
N. Iwakami, NTT Human Interface Labs., Tokyo, Japan
T. Moriya, NTT Human Interface Labs., Tokyo, Japan
S. Miki, NTT Human Interface Labs., Tokyo, Japan
pp. 3095-3098
J. Benesty, Dept. Signal, Telecom Paris, France
F. Amand, NTT Human Interface Labs., Tokyo, Japan
A. Gilloire, NTT Human Interface Labs., Tokyo, Japan
Y. Grenier, Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3099-3102
J.J. Smith, Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
Y.H. Leung, Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
A. Cantoni, Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 3103-3106
J.R. Buck, Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.C. Preisig, Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
M. Johnson, Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
J. Catipovic, Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3107-3110
J. Tabrikian, Dept. of Electr. Eng., Tel Aviv Univ., Israel
H. Messer, Dept. of Electr. Eng., Tel Aviv Univ., Israel
pp. 3111-3114
B.F. Harrison, Naval Underwater Syst. Center, Newport, RI, USA
R.J. Vaccaro, Dept. of Electr. Eng., Tel Aviv Univ., Israel
D.W. Tufts, Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 3115-3118
V. Premus, Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
D. Alexandrou, Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 3119-3122
C.F. Mecklenbrauker, Dept. of Electr. Eng., Ruhr-Univ., Bochum, Germany
D. Maiwald, Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
J.F. Bohme, Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 3123-3126
R.N. Carpenter, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
S. Kay, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 3127-3130
O.P. Kenny, Defence Sci. & Technol. Organ., Salisbury, SA, Australia
L.B. White, Defence Sci. & Technol. Organ., Salisbury, SA, Australia
pp. 3131-3134
M.A. Dzieciuch, Scripps Instn. of Oceanogr., California Univ., San Diego, La Jolla, CA, USA
pp. 3135-3137
P. Blanc-Benon, Thomson Sintra ASM, Sophia-Antipolis, France
G. Bienvenu, Thomson Sintra ASM, Sophia-Antipolis, France
pp. 3139-3142
T.G. Manickam, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
R.J. Vaccaro, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 3143-3146
Yisong Ye, Dept. of Electr. Eng., Auburn Univ., AL, USA
J.K. Tugnait, Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 3147-3150
H.C. So, Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
P.C. Ching, Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Y.T. Chan, Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 3151-3154
D.W. Tufts, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
Hongya Ge, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 3155-3158
E. Petit, Centre d'Etude des Phenomenes Aleatoires et Geophys., CNRS, St. Martin d'Heres, France
G. Jourdain, Centre d'Etude des Phenomenes Aleatoires et Geophys., CNRS, St. Martin d'Heres, France
pp. 3159-3162
Y. Xiang Yuan, Dept. of Electr. Eng., Saskatchewan Univ., Saskatoon, Sask., Canada
G.C. Carter, Centre d'Etude des Phenomenes Aleatoires et Geophys., CNRS, St. Martin d'Heres, France
J.E. Salt, Australian Telecom Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 3163-3166
M.D. Hahm, Dept. of Electr. Eng., Rochester Univ., NY, USA
E.L. Titlebaum, Dept. of Electr. Eng., Rochester Univ., NY, USA
Z.I. Mitrovski, Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 3167-3170
Yingbo Hua, Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
H. Yang, Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
Mingyong Zhou, Dept. of Electr. & Electron. Eng., Melbourne Univ., Parkville, Vic., Australia
pp. 3171-3174
Xiao-Jiao Tao, Dept. of Radio Eng., Southeast Univ., Nanjing, China
Cai-Rong Zou, Dept. of Radio Eng., Southeast Univ., Nanjing, China
Zhen-Ya He, Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 3175-3178
F. Lorenzelli, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
K. Yao, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3183-3186
K.J. Raghunath, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
K.K. Parhi, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 3187-3190
S. Freeman, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
M. O'Donnell, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 3191-3194
H. Kawai, Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
Y. Inoue, Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
R. Streitenberger, Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
M. Yoshimoto, Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
pp. 3199-3202
Shen-Fu Hsiao, Inst. of Comput. & Inf. Eng., Nat. Sun Yat-Sen Univ., Taiwan
pp. 3203-3206
F.T. Moller, Inst. for Electron. Syst., Aalborg Univ., Denmark
J.B. Andersen, Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
H.R. Jensen, Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
O. Olsen, Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
F.K. Fink, Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3207-3210
D. Rabideau, USAF Rome Lab., Griffiss AFB, NY, USA
A. Steinhardt, Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
pp. 3211-3214
M. Okamoto, Semicond. Res. Center, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
T. Ishikawa, Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
S. Marui, Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
M. Yamasaki, Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
K. Ueda, Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3215-3218
T.P. Kelliher, Dept. of Math. & Comput. Sci., Westminster Coll., New Wilmington, PA, USA
E.S. Gayles, Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
R.M. Owens, Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
M.J. Irwin, Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
pp. 3219-3222
N.L. Passos, Dept. of Comput. Sci. & Eng., Notre Dame Univ., IN, USA
E.H.-M. Sha, Dept. of Comput. Sci. & Eng., Notre Dame Univ., IN, USA
pp. 3223-3226
K.H. Yu, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 3227-3230
Liang-Fang Chao, Dept. of Electr. & Comput. Eng., Iowa State Univ., Ames, IA, USA
E.H.-M. Sha, Dept. of Comput. Sci. & Eng., Notre Dame Univ., IN, USA
pp. 3231-3234
T.M. Parks, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
E.A. Lee, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 3235-3238
M. Kahrs, Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
pp. 3239-3242
T. Grotker, Aachen Univ. of Technol., Germany
P. Zepter, Aachen Univ. of Technol., Germany
H. Meyr, Aachen Univ. of Technol., Germany
pp. 3243-3246
M. Moonen, Dept. of Electr. Eng., Katholieke Univ., Leuven, Heverlee, Belgium
E. Deprettere, Aachen Univ. of Technol., Germany
I.K. Proudler, Aachen Univ. of Technol., Germany
J.G. McWhirter, Syst. LSI Labs., Mitsubishi Electr. Corp., Hyogo, Japan
pp. 3247-3250
M. Shajaan, Electron. Inst., Tech. Univ. Denmark, Lyngby, Denmark
K. Nielsen, Electron. Inst., Tech. Univ. Denmark, Lyngby, Denmark
J.A. Sorensen, Electron. Inst., Tech. Univ. Denmark, Lyngby, Denmark
pp. 3251-3254
G. Bilsen, ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
M. Engels, ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
R. Lauwereins, ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
J.A. Peperstraete, ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
pp. 3255-3258
K.P. Khiar, California Univ., Berkeley, CA, USA
E.A. Lee, California Univ., Berkeley, CA, USA
pp. 3259-3262
An-Yeu Wu, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
K.J.R. Liu, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 3267-3270
E. Scopa, Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
A. Leone, Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
R. Guerrieri, Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
G. Baccarani, Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
pp. 3271-3274
J. Bruguera, Dept. of Electron., Santiago de Compostela Univ., Spain
T. Lang, Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
pp. 3275-3278
Heonchul Park, Semicond. Div., Samsung Electron. Co. Ltd., Kyoungki, South Korea
Jae-Chul Son, Semicond. Div., Samsung Electron. Co. Ltd., Kyoungki, South Korea
Seong-Rae Cho, Semicond. Div., Samsung Electron. Co. Ltd., Kyoungki, South Korea
pp. 3279-3281
A. Pirson, Thomson Consumer Electron. Components, Meylan, France
F. Yassa, Thomson Consumer Electron. Components, Meylan, France
P. Paul, Thomson Consumer Electron. Components, Meylan, France
B. Canfield, Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
F. Rominger, Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3283-3286
D. Charlot, Thomson Consumer Electron. Components, Meylan, France
J.-M. Bard, Thomson Consumer Electron. Components, Meylan, France
B. Canfield, Thomson Consumer Electron. Components, Meylan, France
C. Cuney, Dipartimento di Elettronica Inf. e Sistemistica, Bologna Univ., Italy
A. Graf, Dept. of Electr. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
pp. 3287-3290
A. Akerib, A.S.P. Solutions Ltd., Raanana, Israel
R. Adar, A.S.P. Solutions Ltd., Raanana, Israel
pp. 3291-3294
Chin-Liang Wang, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Ker-Min Chen, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Jin-Min Hsiung, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 3295-3298
Mei-Cheng Lu, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Chen-Yi Lee, Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 3299-3302
Hangu Yeo, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
Hangu Yeo, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 3303-3306
T.L. Burrows, Dept. of Eng., Cambridge Univ., UK
M. Niranjan, Dept. of Eng., Cambridge Univ., UK
pp. 3315-3318
Tan Lee, Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
P.C. Ching, Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
L.W. Chan, Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 3319-3322
M. Sharma, CAIP Center, Rutgers Univ., Piscataway, NJ, USA
R. Mammone, CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 3323-3326
U. Bodenhausen, Dept. of Comput. Sci., Karlsruhe Univ., Germany
H. Hild, Dept. of Comput. Sci., Karlsruhe Univ., Germany
pp. 3327-3330
K. Kasper, Inst. fur Angewandte Phys., Frankfurt Univ., Germany
H. Reininger, Inst. fur Angewandte Phys., Frankfurt Univ., Germany
D. Wolf, Inst. fur Angewandte Phys., Frankfurt Univ., Germany
H. Wust, Inst. fur Angewandte Phys., Frankfurt Univ., Germany
pp. 3331-3334
W. Reichl, Inst. for Human-Machine-Commun., Munich Univ. of Technol., Germany
G. Ruske, Inst. for Human-Machine-Commun., Munich Univ. of Technol., Germany
pp. 3335-3338
E. Levine, Dept. of Electr. Eng., Stanford Univ., CA, USA
pp. 3339-3341
Q.J. Zhang, Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
Fang Wang, Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
M.S. Nakhla, Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
pp. 3343-3346
C.S.-T. Choy, Dept. of Electron. Eng., Hong Kong Polytech. Univ, Kowloon, Hong Kong
Wan-Chi Siu, Dept. of Electron. Eng., Hong Kong Polytech. Univ, Kowloon, Hong Kong
pp. 3351-3354
L. Owsley, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
L. Atlas, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
G. Bernard, Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
pp. 3355-3358
Fu-Chiang Tsui, Lab. of Comput. Neurosci., Pittsburgh Univ., PA, USA
Mingui Sun, Lab. of Comput. Neurosci., Pittsburgh Univ., PA, USA
Ching-Chung Li, Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
R.J. Sclabassi, Inst. fur Angewandte Phys., Frankfurt Univ., Germany
pp. 3359-3362
Chuan Wang, Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
Jyh-Ming Kuo, Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
J.C. Principe, Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
pp. 3363-3366
Weibo Liang, Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
M.T. Manry, Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
Qiang Yu, Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
M.S. Dawson, Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
A.K. Fung, Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
pp. 3367-3369
Qi Li, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
D.W. Tufts, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 3375-3378
H.B.D. Sorensen, Dept. of Appl. Electron., Tech. Univ. Denmark, Lyngby, Denmark
U. Hartmann, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
P. Hunnerup, Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
pp. 3379-3382
N.J. Bershad, Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
N. Cubaud, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
J.J. Shynk, Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
pp. 3383-3386
Xieting Ling, Dept. of Electron. Eng., Fudan Univ., Shanghai, China
Wei Tian, Dept. of Electron. Eng., Fudan Univ., Shanghai, China
Bin Liu, Dept. of Electron. Eng., Fudan Univ., Shanghai, China
pp. 3387-3390
F. Bartolini, Dipartimento di Ingegneria Elettronica, Firenze Univ., Italy
V. Cappellini, Dipartimento di Ingegneria Elettronica, Firenze Univ., Italy
S. Nerozzi, Dipartimento di Ingegneria Elettronica, Firenze Univ., Italy
A. Mecocci, Dept. of Electr. Eng., Texas Univ., Arlington, TX, USA
pp. 3395-3398
P. Kuosmanen, Signal Process. Lab., Tampere Univ. of Technol., Finland
K. Egiazarian, Signal Process. Lab., Tampere Univ. of Technol., Finland
J. Astola, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 3403-3406
B.W. Stiles, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
J. Ghosh, Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
pp. 3407-3410
X.Q. Gao, Dept. of Radio Eng., Southeast Univ., Nanjing, China
X.D. Wang, Dept. of Radio Eng., Southeast Univ., Nanjing, China
L.H. Li, Dept. of Radio Eng., Southeast Univ., Nanjing, China
H. Zhang, Dept. of Radio Eng., Southeast Univ., Nanjing, China
Z.Y. He, Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 3411-3414
A.J. Bell, Comput. Neurobiol. Lab., Salk Inst., La Jolla, Ca, USA
T.J. Sejnowski, Comput. Neurobiol. Lab., Salk Inst., La Jolla, Ca, USA
pp. 3415-3418
P. Yee, Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
S. Haykin, Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 3419-3422
K. Jemili, Dept. of Electr. Eng., Dayton Univ., OH, USA
J.J. Westerkamp, Dept. of Electr. Eng., Dayton Univ., OH, USA
pp. 3423-3426
A.J. Abruntes, INESC, Polytech. Inst. of Lisbon, Portugal
J.S. Marques, Dept. of Electr. Eng., Dayton Univ., OH, USA
pp. 3427-3430
L.W. Cychosz, Dept. of Electr. Eng., Wisconsin Univ., Milwaukee, WI, USA
Jun Zhang, Dept. of Electr. Eng., Wisconsin Univ., Milwaukee, WI, USA
pp. 3431-3434
T. McElroy, Raytheon Co., Marlboro, MA, USA
E. Wilson, Raytheon Co., Marlboro, MA, USA
G. Anspach, Raytheon Co., Marlboro, MA, USA
pp. 3435-3438
H. Watanabe, ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
T. Yamaguchi, ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
S. Katagiri, ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
pp. 3439-3442
Ying Zhao, BBN Syst. & Technol., Cambridge, MA, USA
R. Schwartz, BBN Syst. & Technol., Cambridge, MA, USA
J. Sroka, BBN Syst. & Technol., Cambridge, MA, USA
J. Makhoul, BBN Syst. & Technol., Cambridge, MA, USA
pp. 3443-3446
B. Solaiman, ENST de Bretagne, Brest, France
E.P. Maillard, BBN Syst. & Technol., Cambridge, MA, USA
pp. 3447-3450
Changyi Sun, Forest Resources, Utah State Univ., Logan, UT, USA
Heng-Da Cheng, BBN Syst. & Technol., Cambridge, MA, USA
J.J. McDonnell, BBN Syst. & Technol., Cambridge, MA, USA
C.M.U. Neale, BBN Syst. & Technol., Cambridge, MA, USA
pp. 3451-3454
Chung-Hsien Wu, Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Ching-Wen Lo, Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Jhing-Fa Wang, Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 3455-3458
S. Garcia-Salicetti, Inst. Nat. des Telecommun., Evry, France
P. Gallinari, Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
B. Dorizzi, Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
A. Mellouk, BBN Syst. & Technol., Cambridge, MA, USA
D. Fanchon, Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 3463-3466
P. Davies, Purdue Univ., West Lafayette, IN, USA
B.R. Silverstein, Purdue Univ., West Lafayette, IN, USA
pp. 3467-3470
Ce Zhu, Dept. of Electron. Eng., Shantou Univ., Guangdong, China
Jun Wang, Purdue Univ., West Lafayette, IN, USA
Taijun Wang, Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 3471-3474
M. Petroni, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
A.S. Malowany, Dept. of Electr. Eng., McGill Univ., Montreal, Que., Canada
C.C. Johnston, Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
B.J. Stevens, BBN Syst. & Technol., Cambridge, MA, USA
pp. 3475-3478
B. Ulug, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
S.C. Ahalt, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
R.A. Mitchell, Inst. of Inf. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
pp. 3479-3482
Datong Wei, Dept. of Radiol., Michigan Univ., Ann Arbor, MI, USA
B. Sahiner, Dept. of Radiol., Michigan Univ., Ann Arbor, MI, USA
Heang-Ping Chan, Dept. of Radiol., Michigan Univ., Ann Arbor, MI, USA
N. Petrick, Dept. of Radiol., Michigan Univ., Ann Arbor, MI, USA
pp. 3483-3486
Huang Deshuang, Inst. of Autom., Beijing Inst. of Technol., China
Mao Erke, Inst. of Autom., Beijing Inst. of Technol., China
Han Yueqiu, Inst. of Autom., Beijing Inst. of Technol., China
pp. 3487-3490
K.P. Cohen, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
Y.H. Hu, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
W.J. Tompkins, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
J.G. Webster, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 3491-3494
Yuh-Fwu Guu, Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
B. Peikari, Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
pp. 3495-3498
Y. Cai, Dept. of Electr. Eng., Windsor Univ., Ont., Canada
H.K. Kwan, Dept. of Electr. Eng., Windsor Univ., Ont., Canada
pp. 3499-3502
S. Kadambe, AT&T Bell Labs., Murray Hill, NJ, USA
J.L. Hieronymus, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 3507-3510
Yonghong Yan, Centre for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
E. Barnard, Centre for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 3511-3514
Kung-Pu Li, ITT Aerosp. Commun. Div., San Diego, CA, USA
pp. 3515-3518
T. Schneider, Hearing Health Care Res. Unit, Univ. of Western Ontario, London, Ont., Canada
D.G. Jamieson, Hearing Health Care Res. Unit, Univ. of Western Ontario, London, Ont., Canada
pp. 3523-3526
D.M. Chabries, Brigham Young Univ., Provo, UT, USA
D.V. Anderson, Brigham Young Univ., Provo, UT, USA
D.V. Anderson, Brigham Young Univ., Provo, UT, USA
R.W. Christiansen, Brigham Young Univ., Provo, UT, USA
pp. 3527-3530
D.V. Anderson, Brigham Young Univ., Provo, UT, USA
R.W. Harris, Brigham Young Univ., Provo, UT, USA
D.M. Chabries, Brigham Young Univ., Provo, UT, USA
pp. 3531-3533
B. Strope, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
A. Alwan, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3539-3542
A.C. Barthelemy, Naval Undersea Warfare Centre, New London, CT, USA
P.K. Willett, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 3543-3546
O. Gasparini, Ingegneria dei Sistemi, DUNE, Rome, Italy
C. Camporeale, Ingegneria dei Sistemi, DUNE, Rome, Italy
pp. 3551-3554
H. Chuberre, IRISA, Rennes I Univ., France
T. Filleul, IRISA, Rennes I Univ., France
J.-J. Fuchs, IRISA, Rennes I Univ., France
pp. 3555-3558
Y. Chocheyras, Thomson Sintra ASM, Sophia-Antipolis, France
L. Kopp, Thomson Sintra ASM, Sophia-Antipolis, France
pp. 3559-3562
C. Theys, CNRS, Univ. de Nice-Sophia Antipolis, Nice, France
G. Alengrin, CNRS, Univ. de Nice-Sophia Antipolis, Nice, France
pp. 3563-3566
C. Rago, Connecticut Univ., Storrs, CT, USA
P. Willett, Connecticut Univ., Storrs, CT, USA
R. Streit, IRISA, Rennes I Univ., France
pp. 3571-3574
P. Gounon, CEPHAG, ENSIEG, St. Martin d'Heres, France
S. Bozinoski, CEPHAG, ENSIEG, St. Martin d'Heres, France
pp. 3575-3578
W.T. Padgett, Dept. of Electr. Comput. Eng., Rose-Hulman Inst. of Technol., Terre Haute, IN, USA
pp. 3579-3582
B. Colnet, CNRS, CRIN-INRIA, Nancy, France
J.-C. Di Martino, CNRS, CRIN-INRIA, Nancy, France
pp. 3583-3586
A. Kundu, RDT&E Div., Naval Command Control & Ocean Surveillance Centre, San Diego, CA, USA
G.C. Chen, RDT&E Div., Naval Command Control & Ocean Surveillance Centre, San Diego, CA, USA
pp. 3587-3590
C.W. Victory, RDT&E Div., NCCOSC, San Diego, CA, USA
R. Trueblood, RDT&E Div., Naval Command Control & Ocean Surveillance Centre, San Diego, CA, USA
pp. 3591-3594
J.N. Maksym, Defence Res. Establ. Atlantic, Dartmouth, NS, Canada
pp. 3595-3598
K.C. Ho, Dept. of Electr. & Comput. Eng., R. Mil. Coll. of Canada, Kingston, Ont., Canada
A.E. Scheidl, Dept. of Electr. & Comput. Eng., R. Mil. Coll. of Canada, Kingston, Ont., Canada
R.J. Inkol, IRISA, Rennes I Univ., France
pp. 3599-3602
B.X. Li, Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
S. Haykin, Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 3603-3606
Shun-Hsyung Chang, Dept. of Electr. Eng., Nat. Taiwan Ocean Univ., Keelung, Taiwan
Tong-Yao Lee, Dept. of Electr. Eng., Nat. Taiwan Ocean Univ., Keelung, Taiwan
Wen-Hsien Fang, IRISA, Rennes I Univ., France
pp. 3607-3610
Tser-Ya Dai, Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Ta-Sung Lee, Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 3611-3614
G.J. Melendez, Night Vision & Electron. Sensors Directorate, US Army Commun. & Electron. Command, Fort Monmouth, NJ, USA
S.B. Kesler, Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 3615-3618
J.L. Vaughn, Opt. Sci. Co., Anaheim, CA, USA
N.J. Bershad, Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 3619-3622
G.L. Fudge, Program in Electr. Eng., Texas Univ., Dallas, TX, USA
D.A. Linebarger, Program in Electr. Eng., Texas Univ., Dallas, TX, USA
pp. 3623-3626
G.V. Serebryakov, Inst. of Appl. Math. Cybern., Nizhny Novgorod, Russia
D.V. Sidorovitch, Program in Electr. Eng., Texas Univ., Dallas, TX, USA
C. Mecklenbraeuker, IRISA, Rennes I Univ., France
pp. 3631-3634
E.C. Real, Lockheed Sanders Inc., Nashua, NH, USA
D.P. Charette, Lockheed Sanders Inc., Nashua, NH, USA
pp. 3635-3638
J.E. Garrido-Arenas, Centro Astron. de Yebes, Guadalajara, Spain
J.M. Paez-Borrallo, Lockheed Sanders Inc., Nashua, NH, USA
A. Barcia-Cancio, IRISA, Rennes I Univ., France
pp. 3643-3646
K.B. Eom, Dept. of Electr. Eng. & Comput. Sci., George Washington Univ., Washington, DC, USA
pp. 3647-3650
Hung-Chih Chiang, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
R.L. Moses, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
S.C. Ahalt, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 3655-3658
X. Yu, Div. of Commun. & Surveillance, SAIC, San Diego, CA, USA
A.M. Chen, Div. of Commun. & Surveillance, SAIC, San Diego, CA, USA
I.S. Reed, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 3659-3662
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