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Acoustics, Speech, and Signal Processing, 1995. ICASSP-95 Vol 4., 1995 International Conference on
Detroit, MI, USA
May 09-May 12
ISBN: 0-7803-2431-5
Table of Contents
T. Kalker, California Univ., Berkeley, CA, USA
Hyungju Park, California Univ., Berkeley, CA, USA
M. Vetterli, California Univ., Berkeley, CA, USA
pp. 2121-2124
J. Kovacevic, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 2125-2128
H. Safiri, Dept. of Electr. Eng., Windsor Univ., Ont., Canada
M. Ahmadi, Dept. of Electr. Eng., Windsor Univ., Ont., Canada
pp. 2129-2132
S. Polala, Dept. of Electr. Eng., Wright State Univ., Dayton, OH, USA
A.K. Shaw, Dept. of Electr. Eng., Wright State Univ., Dayton, OH, USA
pp. 2133-2136
S. Coulombe, INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
E. Dubois, INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
pp. 2137-2140
Jiang Hui, Inst. of Acoust., Acad. Sinica, Beijing, China
Jiang Hui, Inst. of Acoust., Acad. Sinica, Beijing, China
pp. 2141-2144
S. Young, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
N. Nasrabadi, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
M. Soumekh, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 2145-2148
M.P. Pepin, Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
M.P. Clark, Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
Jian Li, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 2149-2152
D.D. Giusto, Dept. of Electr. & Electron. Eng., Cagliari Univ., Italy
L. Boroczky, Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
R. Fioravanti, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 2153-2156
N.S. Subotic, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
L.M. Collins, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
J.D. Gorman, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
B.J. Thelen, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
pp. 2157-2160
H. Ito, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
N. Farvardin, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 2161-2164
R.S. Jasinschi, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.M.F. Moura, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.C. Cheng, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Asif, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 2165-2168
R.R. Schultz, Lab. for Image & Signal Anal., Notre Dame Univ., IN, USA
R.L. Stevenson, Lab. for Image & Signal Anal., Notre Dame Univ., IN, USA
pp. 2169-2172
H. Aydinoglu, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
F. Kossentini, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
F. Kossentini, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2173-2176
Fu-Huei Lin, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2177-2180
P.B. Penafiel, Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
N.M. Namazi, Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
pp. 2181-2184
Oh-Jin Kwon, Center for Autom. Res., Maryland Univ., College Park, MD, USA
R. Chellappa, Center for Autom. Res., Maryland Univ., College Park, MD, USA
C. Morimoto, Center for Autom. Res., Maryland Univ., College Park, MD, USA
pp. 2185-2188
J. Katto, Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
M. Ohta, Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 2189-2192
K. Konstantinides, Hewlett-Packard Co., Palo Alto, CA, USA
G.S. Yovanof, Hewlett-Packard Co., Palo Alto, CA, USA
pp. 2193-2196
A.J. Patti, Dept. of Electr. Eng., Rochester Univ., NY, USA
M.I. Sezan, Hewlett-Packard Co., Palo Alto, CA, USA
A.M. Tekalp, Center for Autom. Res., Maryland Univ., College Park, MD, USA
pp. 2197-2200
E.A.B. da Silva, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
D.G. Sampson, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
M. Ghanbari, Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
pp. 2201-2204
P. Lau, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
N.P. Papanikolopoulos, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 2205-2208
Wei Li, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
O. Egger, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
M. Kunt, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 2209-2212
C.D. Creusere, Weapons Div., Naval Air Warfare Center, China Lake, CA, USA
pp. 2213-2216
E.S. Jang, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
M. Venkatraman, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 2217-2220
F. Kossentini, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
W.C. Chung, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.J.T. Smith, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2221-2224
Won-Ha Kim, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
Yu-Hen Hu, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 2225-2228
S. Servetto, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
K. Ramchandran, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
M. Orchard, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 2229-2232
J.R. Smith, Center for Telecommun. Res., Columbia Univ., New York, NY, USA
Shih-Fu Chang, Center for Telecommun. Res., Columbia Univ., New York, NY, USA
pp. 2233-2236
O. Egger, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
A. Nicoulin, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
Wei Li, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 2237-2240
E. Salari, Dept. of Electr. Eng., Toledo Univ., OH, USA
Sheng Lin, Dept. of Electr. Eng., Toledo Univ., OH, USA
pp. 2241-2244
K. Matthews, Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
N. Namazi, Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
pp. 2245-2248
Chung-Lin Huang, Inst. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Jhy-Gau Chen, Inst. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 2249-2252
Wu Chou, AT&T Bell Labs., Murray Hill, NJ, USA
H.H. Chen, Inst. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 2253-2256
Yui-Lam Chan, Dept. of Electron. Eng., Hong Kong Polytech. Univ., Kowloon, Hong Kong
Wan-Chi Siu, Dept. of Electron. Eng., Hong Kong Polytech. Univ., Kowloon, Hong Kong
pp. 2257-2260
F. Moscheni, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
F. Dufaux, Dept. of Electron. Eng., Hong Kong Polytech. Univ., Kowloon, Hong Kong
M. Kunt, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 2261-2264
L. Bonnaud, IRISA, Rennes, France
C. Labit, IRISA, Rennes, France
J. Konrad, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 2265-2268
B.-B. Paul, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
B.-B. Paul, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2269-2272
Y. Senda, Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
H. Harasaki, Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
M. Yano, Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 2273-2276
Y. Altunbasak, Dept. of Electr. Eng., Rochester Univ., NY, USA
A.M. Tekalp, Dept. of Electr. Eng., Rochester Univ., NY, USA
G. Bozdagi, Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 2277-2280
C. Mosquera, Magnetic Resonance Syst. Res. Lab., Stanford Univ., CA, USA
P. Irarrazabal, Magnetic Resonance Syst. Res. Lab., Stanford Univ., CA, USA
D.G. Nishimura, Magnetic Resonance Syst. Res. Lab., Stanford Univ., CA, USA
pp. 2281-2284
J.L.H. Webb, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
J.L.H. Webb, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 2285-2288
A.H. Delaney, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Y. Bresler, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 2295-2298
B. Sahiner, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
A.E. Yagle, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2299-2302
M.H. Johnson, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
E.A. Riskin, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 2303-2306
Yong Zhang, Michigan Univ., Ann Arbor, MI, USA
J.A. Fessler, Michigan Univ., Ann Arbor, MI, USA
N.H. Clinthorne, Michigan Univ., Ann Arbor, MI, USA
W.L. Rogers, Michigan Univ., Ann Arbor, MI, USA
pp. 2307-2310
H. Carfantan, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
A. Mohammad-Djafari, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 2311-2314
M.E. Allam, Dept. of Physiol. & Biophys., Mayo Foundation, Rochester, MN, USA
J.F. Greenleaf, Dept. of Physiol. & Biophys., Mayo Foundation, Rochester, MN, USA
pp. 2315-2318
T.P. O'Rourke, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
R.L. Stevenson, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
Yih-Fang Huang, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
L.C. Perez, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
L.C. Perez, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2319-2322
W.E. Lynch, Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
A.R. Reibman, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
B. Liu, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2323-2326
Bin Zhu, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
O.N. Gerek, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2327-2330
M. Crouse, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
K. Ramchandran, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 2331-2334
E. Feig, IBM Res., Yorktown Heights, NY, USA
H. Peterson, IBM Res., Yorktown Heights, NY, USA
V. Ratnakar, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2339-2342
M. Effros, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
P.A. Chou, IBM Res., Yorktown Heights, NY, USA
pp. 2343-2346
M. Das, Dept. of Electr. Eng., Oakland Univ., Rochester, MI, USA
D.L. Neuhoff, IBM Res., Yorktown Heights, NY, USA
C.L. Lin, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2347-2350
S.J.P. Westen, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
R.L. Lagendijk, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
J. Biemond, Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 2351-2354
R. Lenz, Dept. of Electr. Eng., Linkoping Univ., Sweden
J. Svanberg, Dept. of Electr. Eng., Linkoping Univ., Sweden
pp. 2355-2358
D. Corso, DIBE, Genova Univ., Italy
R. Fioravanti, DIBE, Genova Univ., Italy
S. Fioravanti, DIBE, Genova Univ., Italy
pp. 2359-2362
J.K. Su, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2363-2366
E. Abreu, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
S.K. Mitra, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 2371-2374
R.C. Hardie, Dept. of Electr. Eng., Dayton Univ., OH, USA
K.E. Barner, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 2375-2378
S.G. Chang, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Z. Cvetkovic, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
M. Vetterli, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 2379-2382
S.D. Bayrakeri, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2383-2386
I. Linares, Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2387-2390
I. Tabus, Signal Process. Lab., Tampere Univ. of Technol., Finland
M. Gabbouj, Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 2391-2394
Z. Kato, INRIA, Sophia Antipolis, France
J. Zerubia, INRIA, Sophia Antipolis, France
M. Berthod, INRIA, Sophia Antipolis, France
W. Pieczynski, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2399-2402
C. Swain, Vanderbilt Univ., Nashville, TN, USA
T. Chen, INRIA, Sophia Antipolis, France
pp. 2403-2406
S. Krishnamachari, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
R. Chellappa, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 2407-2410
F. Salzenstein, Dept. Signal et Image, Inst. Nat. des Telecommun., Evry, France
W. Pieczynski, Dept. Signal et Image, Inst. Nat. des Telecommun., Evry, France
pp. 2411-2414
M.L. Comer, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
E.J. Delp, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2415-2418
S. Pagnan, Istituto di Automazione Navale, Genova, Italy
C. Ottonello, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2419-2422
S.R. Titus, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
S.R. Titus, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
J.A. Fessler, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2423-2426
R.O. Hinds, Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
T.N. Pappas, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2427-2430
T.N. Pappas, Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Si-Woong Lee, Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Seong-Dae Kim, Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
pp. 2431-2434
K.O. Perlmutter, Dept. of Electr. Eng., Stanford Univ., CA, USA
R.M. Gray, Dept. of Electr. Eng., Stanford Univ., CA, USA
R.A. Olshen, Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
S.M. Perlmutter, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2435-2438
M. Koschinski, Inst. for Human-Machine Commun., Munich Univ. of Technol., Germany
H.-J. Winkler, Inst. for Human-Machine Commun., Munich Univ. of Technol., Germany
M. Lang, Inst. for Human-Machine Commun., Munich Univ. of Technol., Germany
pp. 2439-2442
A. Edalat, Dept. of Comput., London Univ., UK
D.W.N. Sharp, Dept. of Comput., London Univ., UK
R.L. While, Inst. for Human-Machine Commun., Munich Univ. of Technol., Germany
pp. 2443-2446
R. Buse, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
Z.-Q. Liu, Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
pp. 2447-2450
Z.-Q. Liu, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
W.T. Cathey, Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 2451-2454
N.L. Chang, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
A. Zakhor, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 2455-2458
H.-J. Winkler, Inst. for Human-Machine-Commun., Univ. of Technol., Munich, Germany
H. Fahrner, Inst. for Human-Machine-Commun., Univ. of Technol., Munich, Germany
M. Lang, Inst. for Human-Machine-Commun., Univ. of Technol., Munich, Germany
pp. 2459-2462
S. Fioravanti, Saclant Undersea Res. Center, La Spezia, Italy
D.D. Giusto, Inst. for Human-Machine-Commun., Univ. of Technol., Munich, Germany
pp. 2463-2466
J. You, Sch. of Comput. & Inf. Sci., Univ. of South Australia, The Levels, SA., Australia
E. Pissaloux, Inst. for Human-Machine-Commun., Univ. of Technol., Munich, Germany
H.A. Cohen, Inst. for Human-Machine-Commun., Univ. of Technol., Munich, Germany
pp. 2467-2470
M. Snorrason, Charles River Anal., Cambridge, MA, USA
H. Ruda, Charles River Anal., Cambridge, MA, USA
A. Caglayan, Charles River Anal., Cambridge, MA, USA
pp. 2471-2474
Q.M. Tieng, Queensland Univ. of Technol., Brisbane, Qld., Australia
W.W. Boles, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 2475-2478
M. Lightstone, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
K. Rose, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
S.K. Mitra, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 2479-2482
W. Chen, Dept. of Electr. Eng., Feng Chia Univ., Taichung, Taiwan
E.-H. Yang, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
Z. Zhang, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 2483-2486
I. Moccagatta, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
M. Kunt, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 2487-2490
C.Y. Choo, Dept. of Electr. Eng., San Jose State Univ., CA, USA
E. Kristenson, Dept. of Electr. Eng., San Jose State Univ., CA, USA
N.M. Nasrabadi, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
X. Ran, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2495-2498
D.M. Bethel, Sch. of Electron. & Electr. Eng., Bath Univ., UK
D.M. Monro, Sch. of Electron. & Electr. Eng., Bath Univ., UK
pp. 2499-2502
J.B. Farison, Dept. of Electr. Eng., Toledo Univ., OH, USA
M.K. Quweider, Dept. of Electr. Eng., Toledo Univ., OH, USA
pp. 2503-2506
D. Lebedeff, CNRS, Valbonne, France
P. Mathieu, CNRS, Valbonne, France
E. Barlaud, CNRS, Valbonne, France
C. Lambert-Nebout, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
P. Bellemain, Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2511-2514
F.M.O. Eryurtlu, Surrey Univ., Guildford, UK
A.M. Kondoz, Surrey Univ., Guildford, UK
B.G. Evans, Surrey Univ., Guildford, UK
pp. 2515-2518
Y. Wu, Dept. of Electron. & Inf. Sci., Kyoto Inst. of Technol., Japan
Y. Yoshida, Dept. of Electron. & Inf. Sci., Kyoto Inst. of Technol., Japan
pp. 2519-2522
A. Talukder, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J. Davidson, INFOCOM Dept., Rome Univ., Italy
pp. 2527-2530
M. Pfeiffer, Dept. of Electr. Eng., Kaiserslautern Univ., Germany
M. Pandit, Dept. of Electr. Eng., Kaiserslautern Univ., Germany
pp. 2531-2534
A. Makur, Dept. of Electr. Commun. Eng., Indian Inst. of Sci., Bangalore, India
M.R. Raghuveer, Dept. of Electr. Eng., Kaiserslautern Univ., Germany
pp. 2535-2538
O. Alata, CNRS, Talence, France
P. Baylou, CNRS, Talence, France
M. Najim, CNRS, Talence, France
pp. 2539-2542
S.R. Kadaba, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
S.B. Gelfand, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
R.L. Kashyap, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2543-2546
K. Etemad, Center for Autom. Res., Maryland Univ., College Park, MD, USA
R. Chellappa, Center for Autom. Res., Maryland Univ., College Park, MD, USA
pp. 2547-2550
M.R. El-Sakka, Dept. of Syst. Design Eng., Waterloo Univ., Ont., Canada
M.S. Kamel, Dept. of Syst. Design Eng., Waterloo Univ., Ont., Canada
pp. 2551-2554
D. Hernandez-Sosa, Dept. de Inf. y Sistemas, Univ. de Las Palmas de Gran Canaria, Las Palmas, Spain
J. Cabrera-Gamez, Dept. de Inf. y Sistemas, Univ. de Las Palmas de Gran Canaria, Las Palmas, Spain
A. Falcon-Martel, Dept. de Inf. y Sistemas, Univ. de Las Palmas de Gran Canaria, Las Palmas, Spain
M. Hernandez-Tejera, Dept. de Inf. y Sistemas, Univ. de Las Palmas de Gran Canaria, Las Palmas, Spain
pp. 2555-2558
J. Domaszewicz, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
V.A. Vaishampayan, Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 2559-2562
B. Hurtgen, Inst. fur Elektrische Nachrichtentech., Tech. Hochschule Aachen, Germany
pp. 2563-2566
Hui Zhang, Dept. of Radio Eng., Southeast Univ., Nanjing, China
Xiqi Gao, Dept. of Radio Eng., Southeast Univ., Nanjing, China
Zhenya He, Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 2567-2570
S.J. Woolley, Sch. of Electron. & Electr. Eng., Bath Univ., UK
D.M. Monro, Sch. of Electron. & Electr. Eng., Bath Univ., UK
pp. 2571-2574
L.M. Kaplan, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
C.-C. Jay Kuo, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 2575-2578
S.A. Rizvi, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
N.M. Nasrabadi, Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 2579-2582
N.M. Nasrabadi, Dept. of Electron. Commun. Eng., Kwangwoon Univ., Seoul, South Korea
N.M. Nasrabadi, Dept. of Electron. Commun. Eng., Kwangwoon Univ., Seoul, South Korea
pp. 2583-2586
J. Skowronski, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
I. Dologlou, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 2587-2590
D. Wang, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
J. Hartung, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 2591-2594
A. Bogdan, Center for Telecommun. Res., Columbia Univ., New York, NY, USA
pp. 2595-2598
D.G. Warrier, Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
U.B. Desai, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 2599-2602
G.F. Boudreaux-Bartels, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
A.H. Costa, Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 2603-2606
Yu-Li You, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
M. Kaveh, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2607-2610
X. Yu, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
C.S. Hsu, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
R.H. Bamberger, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
S.J. Reeves, Dept. de Inf. y Sistemas, Univ. de Las Palmas de Gran Canaria, Las Palmas, Spain
pp. 2611-2614
Y. Zhang, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
T.S. Huang, Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
R.J. Adrian, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 2615-2618
K.S. Nathan, Handwriting Recognition Group, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
H.S.M. Beigi, Handwriting Recognition Group, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Jayashree Subrahmonia, Handwriting Recognition Group, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
G.J. Clary, Handwriting Recognition Group, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
H. Maruyama, Handwriting Recognition Group, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 2619-2622
Mou-Yen Chen, ITRI, Hsinchu, Taiwan
A. Kundu, Handwriting Recognition Group, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 2623-2626
Antai Peng, Sch. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
M.H. Hayes, Sch. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
pp. 2627-2629
E.J. Bellegarda, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J.R. Bellegarda, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
K.S. Nathan, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 2631-2634
S. Comes, Lab. de Telecommun. et Teledetection, Univ. Catholique de Louvain, Belgium
O. Bruyndonckx, Lab. de Telecommun. et Teledetection, Univ. Catholique de Louvain, Belgium
B. Macq, Lab. de Telecommun. et Teledetection, Univ. Catholique de Louvain, Belgium
pp. 2635-2638
M. Potkonjak, C&C Res. Labs., NEC Res. Inst., Princeton, NJ, USA
J.M. Rabaey, Lab. de Telecommun. et Teledetection, Univ. Catholique de Louvain, Belgium
pp. 2639-2642
J.L. Pino, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
E.A. Lee, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 2643-2646
M. Willems, Tech. Hochschule Aachen, Germany
M. Pankert, Tech. Hochschule Aachen, Germany
S. Ritz, Tech. Hochschule Aachen, Germany
pp. 2647-2650
S. Ritz, Tech. Hochschule Aachen, Germany
M. Willems, Tech. Hochschule Aachen, Germany
H. Meyr, Tech. Hochschule Aachen, Germany
pp. 2651-2654
Yin-Hwa Huang, Telecommun. Lab., Minist. of Transp. & Commun., Chung-Li, Taiwan
Yuo-Chuan Chang, Telecommun. Lab., Minist. of Transp. & Commun., Chung-Li, Taiwan
Chi-Shyan Wu, Telecommun. Lab., Minist. of Transp. & Commun., Chung-Li, Taiwan
Chien-Hsing Wu, Telecommun. Lab., Minist. of Transp. & Commun., Chung-Li, Taiwan
pp. 2655-2658
J.M. Rabaey, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
M. Potkonjak, Telecommun. Lab., Minist. of Transp. & Commun., Chung-Li, Taiwan
K. Wakabayashi, Telecommun. Lab., Minist. of Transp. & Commun., Chung-Li, Taiwan
pp. 2659-2662
M. Li, Dept. of Electr. & Electron. Eng., Univ. Coll. of Swansea, UK
J.T. Proudfoot, Dept. of Electr. & Electron. Eng., Univ. Coll. of Swansea, UK
G. King, Dept. of Electr. & Electron. Eng., Univ. Coll. of Swansea, UK
pp. 2667-2670
T. Nakatani, NTT Basic Res.I Labs., Atsugi, Japan
T. Kawabata, NTT Basic Res.I Labs., Atsugi, Japan
H.G. Okuno, NTT Basic Res.I Labs., Atsugi, Japan
pp. 2671-2674
A.G. Place, Dept. of Electr. & Comput. Eng., James Cook Univ. of North Queensland, Townsville, Qld., Australia
G.H. Allen, NTT Basic Res.I Labs., Atsugi, Japan
pp. 2675-2678
J.G. Ackenhusen, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
Q.A. Holmes, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
P.A. Kortesoja, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
D.L. McCubbrey, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
P.L. Mohan, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
J.A. Salinger, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
T.N. Wessling, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
L.J. Witter, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
pp. 2679-2682
W.Y. Kan, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
J.V. Krogmeier, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
P.C. Doerschuk, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2683-2686
A. Trihandoyo, Univ. de Technol. de Compiegne, France
A. Belloum, Univ. de Technol. de Compiegne, France
Kun-Mean Hou, Univ. de Technol. de Compiegne, France
pp. 2687-2690
M. Naitoh, Res. Lab., Kokusai Electr. Co. Ltd., Sendai, Japan
M. Kubo, Res. Lab., Kokusai Electr. Co. Ltd., Sendai, Japan
K. Urabe, Res. Lab., Kokusai Electr. Co. Ltd., Sendai, Japan
pp. 2691-2694
J.H. Corley, SCRA, North Charleston, SC, USA
V.K. Madisetti, Res. Lab., Kokusai Electr. Co. Ltd., Sendai, Japan
M.A. Richards, Res. Lab., Kokusai Electr. Co. Ltd., Sendai, Japan
pp. 2695-2698
C. Myers, Lockheed Sanders Inc., Nashua, NH, USA
R. Dreiling, Lockheed Sanders Inc., Nashua, NH, USA
pp. 2699-2702
G. Caracciolo, Corp. Center, Martin Marietta Labs., Moorestown, NJ, USA
J. Pridmore, Corp. Center, Martin Marietta Labs., Moorestown, NJ, USA
pp. 2703-2706
G.A. Shaw, Lincoln Lab., MIT, Lexington, MA, USA
J.C. Anderson, Lincoln Lab., MIT, Lexington, MA, USA
V.K. Madisetti, Res. Lab., Kokusai Electr. Co. Ltd., Sendai, Japan
pp. 2707-2710
V.K. Madisetti, Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
T. Egolf, Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
S. Famorzadeh, Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
L.-R. Dung, Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
pp. 2711-2714
J.M. Winograd, Dept. of Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
S. Hamid Nawab, Dept. of Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
pp. 2715-2718
K. Wang, Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
J. Normile, Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
Hsi-Jung Wu, Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
D. Ponceleon, Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
K. Chu, Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
Kah-Kay Sung, Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
pp. 2719-2722
M. Tahernezhadi, Dept. of Electr. Eng., Northern Illinois Univ., DeKalb, IL, USA
L. Liu, Dept. of Electr. Eng., Northern Illinois Univ., DeKalb, IL, USA
pp. 2723-2726
H. Klingele, Labor Dr. Steinbichler, Am Bauhof 4, Neubeuern, Germany
H. Steinbichler, Labor Dr. Steinbichler, Am Bauhof 4, Neubeuern, Germany
pp. 2727-2730
P. O'Shea, Dept. of Commun. & Electr. Eng., R. Melbourne Inst. of Technol., Vic., Australia
E. Palmer, Labor Dr. Steinbichler, Am Bauhof 4, Neubeuern, Germany
G. Frazer, Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
pp. 2731-2734
J. Streit, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
L. Hanzo, Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 2735-2738
D. Korompis, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
A. Wang, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
K. Yao, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 2739-2742
Hsiang-Ling Li, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
Chaitali Chakrabarti, Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 2743-2746
S.K. Jain, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
K.K. Parhi, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2747-2750
Jianwei Miao, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.A. Clements, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2751-2754
M. An, Aware Inc., Cambridge, MA, USA
N. Anupindi, Aware Inc., Cambridge, MA, USA
M. Bletsas, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
G. Kechriotis, Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
C. Lu, Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
E.S. Manolakos, Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
R. Tolimieri, Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
pp. 2755-2758
Murari Srinivasan, Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
R. DeFries, Aware Inc., Cambridge, MA, USA
pp. 2759-2762
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