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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1995)
Detroit, MI, USA
May 9, 1995 to May 12, 1995
ISBN: 0-7803-2431-5
TABLE OF CONTENTS
Hyungju Park , California Univ., Berkeley, CA, USA
T. Kalker , California Univ., Berkeley, CA, USA
pp. 2121-2124
J. Kovacevic , Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 2125-2128
H. Safiri , Dept. of Electr. Eng., Windsor Univ., Ont., Canada
pp. 2129-2132
S. Polala , Dept. of Electr. Eng., Wright State Univ., Dayton, OH, USA
pp. 2133-2136
S. Coulombe , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
E. Dubois , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
pp. 2137-2140
Jiang Hui , Inst. of Acoust., Acad. Sinica, Beijing, China
pp. 2141-2144
N. Nasrabadi , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
M. Soumekh , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 2145-2148
M.P. Clark , Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
M.P. Pepin , Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
pp. 2149-2152
L. Boroczky , Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
R. Fioravanti , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
D.D. Giusto , Dept. of Electr. & Electron. Eng., Cagliari Univ., Italy
pp. 2153-2156
L.M. Collins , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
N.S. Subotic , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
B.J. Thelen , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
pp. 2157-2160
H. Ito , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
N. Farvardin , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 2161-2164
R.S. Jasinschi , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.M.F. Moura , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.C. Cheng , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Asif , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 2165-2168
R.R. Schultz , Lab. for Image & Signal Anal., Notre Dame Univ., IN, USA
R.L. Stevenson , Lab. for Image & Signal Anal., Notre Dame Univ., IN, USA
pp. 2169-2172
F. Kossentini , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
F. Kossentini , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2173-2176
Fu-Huei Lin , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.M. Mersereau , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2177-2180
P.B. Penafiel , Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
N.M. Namazi , Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
pp. 2181-2184
R. Chellappa , Center for Autom. Res., Maryland Univ., College Park, MD, USA
C. Morimoto , Center for Autom. Res., Maryland Univ., College Park, MD, USA
pp. 2185-2188
J. Katto , Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 2189-2192
K. Konstantinides , Hewlett-Packard Co., Palo Alto, CA, USA
G.S. Yovanof , Hewlett-Packard Co., Palo Alto, CA, USA
pp. 2193-2196
M.I. Sezan , Hewlett-Packard Co., Palo Alto, CA, USA
A.J. Patti , Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 2197-2200
E.A.B. da Silva , Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
D.G. Sampson , Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
M. Ghanbari , Dept. of Electron. Syst. Eng., Essex Univ., Colchester, UK
pp. 2201-2204
P. Lau , Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 2205-2208
Wei Li , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
M. Kunt , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 2209-2212
C.D. Creusere , Weapons Div., Naval Air Warfare Center, China Lake, CA, USA
pp. 2213-2216
E.S. Jang , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
M. Venkatraman , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 2217-2220
F. Kossentini , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
W.C. Chung , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.J.T. Smith , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2221-2224
Won-Ha Kim , Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 2225-2228
S. Servetto , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
K. Ramchandran , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
M. Orchard , Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 2229-2232
J.R. Smith , Center for Telecommun. Res., Columbia Univ., New York, NY, USA
Shih-Fu Chang , Center for Telecommun. Res., Columbia Univ., New York, NY, USA
pp. 2233-2236
A. Nicoulin , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
Wei Li , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 2237-2240
E. Salari , Dept. of Electr. Eng., Toledo Univ., OH, USA
Sheng Lin , Dept. of Electr. Eng., Toledo Univ., OH, USA
pp. 2241-2244
K. Matthews , Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
N. Namazi , Dept. of Electr. Eng., Catholic Univ. of America, Washington, DC, USA
pp. 2245-2248
Chung-Lin Huang , Inst. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Jhy-Gau Chen , Inst. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 2249-2252
Wu Chou , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 2253-2256
Yui-Lam Chan , Dept. of Electron. Eng., Hong Kong Polytech. Univ., Kowloon, Hong Kong
Wan-Chi Siu , Dept. of Electron. Eng., Hong Kong Polytech. Univ., Kowloon, Hong Kong
pp. 2257-2260
F. Dufaux , Dept. of Electron. Eng., Hong Kong Polytech. Univ., Kowloon, Hong Kong
F. Moscheni , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 2261-2264
C. Labit , IRISA, Rennes, France
L. Bonnaud , IRISA, Rennes, France
pp. 2265-2268
B.-B. Paul , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2269-2272
H. Harasaki , Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
Y. Senda , Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 2273-2276
Y. Altunbasak , Dept. of Electr. Eng., Rochester Univ., NY, USA
G. Bozdagi , Dept. of Electr. Eng., Rochester Univ., NY, USA
pp. 2277-2280
P. Irarrazabal , Magnetic Resonance Syst. Res. Lab., Stanford Univ., CA, USA
D.G. Nishimura , Magnetic Resonance Syst. Res. Lab., Stanford Univ., CA, USA
pp. 2281-2284
J.L.H. Webb , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
J.L.H. Webb , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 2285-2288
V. Solo , Dept. of Stat., Macquarie Univ., Sydney, NSW, Australia
pp. 2289-2290
A.H. Delaney , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Y. Bresler , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 2295-2298
B. Sahiner , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
A.E. Yagle , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2299-2302
M.H. Johnson , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 2303-2306
Yong Zhang , Michigan Univ., Ann Arbor, MI, USA
N.H. Clinthorne , Michigan Univ., Ann Arbor, MI, USA
W.L. Rogers , Michigan Univ., Ann Arbor, MI, USA
pp. 2307-2310
H. Carfantan , Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
A. Mohammad-Djafari , Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 2311-2314
M.E. Allam , Dept. of Physiol. & Biophys., Mayo Foundation, Rochester, MN, USA
pp. 2315-2318
R.L. Stevenson , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
Yih-Fang Huang , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
L.C. Perez , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
L.C. Perez , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2319-2322
W.E. Lynch , Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
B. Liu , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2323-2326
Bin Zhu , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
O.N. Gerek , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2327-2330
M. Crouse , Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
K. Ramchandran , Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
pp. 2331-2334
K. Ramchandran , Hewlett-Packard Lab, Palo Alto, CA, USA
pp. 2335-2338
H. Peterson , IBM Res., Yorktown Heights, NY, USA
V. Ratnakar , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2339-2342
M. Effros , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 2343-2346
M. Das , Dept. of Electr. Eng., Oakland Univ., Rochester, MI, USA
D.L. Neuhoff , IBM Res., Yorktown Heights, NY, USA
C.L. Lin , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2347-2350
S.J.P. Westen , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
R.L. Lagendijk , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
J. Biemond , Dept. of Electr. Eng., Delft Univ. of Technol., Netherlands
pp. 2351-2354
R. Lenz , Dept. of Electr. Eng., Linkoping Univ., Sweden
pp. 2355-2358
R. Fioravanti , DIBE, Genova Univ., Italy
S. Fioravanti , DIBE, Genova Univ., Italy
pp. 2359-2362
J.K. Su , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2363-2366
J.-M. Odobez , IRISA, Rennes, France
J.-P. Leduc , IRISA, Rennes, France
pp. 2367-2370
E. Abreu , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 2371-2374
R.C. Hardie , Dept. of Electr. Eng., Dayton Univ., OH, USA
pp. 2375-2378
S.G. Chang , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Z. Cvetkovic , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
M. Vetterli , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 2379-2382
S.D. Bayrakeri , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2383-2386
I. Linares , Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2387-2390
I. Tabus , Signal Process. Lab., Tampere Univ. of Technol., Finland
pp. 2391-2394
W.W.C. Jiang , Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
pp. 2395-2398
J. Zerubia , INRIA, Sophia Antipolis, France
Z. Kato , INRIA, Sophia Antipolis, France
W. Pieczynski , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2399-2402
C. Swain , Vanderbilt Univ., Nashville, TN, USA
pp. 2403-2406
S. Krishnamachari , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
pp. 2407-2410
F. Salzenstein , Dept. Signal et Image, Inst. Nat. des Telecommun., Evry, France
pp. 2411-2414
M.L. Comer , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
E.J. Delp , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2415-2418
S. Pagnan , Istituto di Automazione Navale, Genova, Italy
pp. 2419-2422
S.R. Titus , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
J.A. Fessler , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2423-2426
R.O. Hinds , Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
T.N. Pappas , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 2427-2430
Si-Woong Lee , Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
T.N. Pappas , Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
pp. 2431-2434
R.M. Gray , Dept. of Electr. Eng., Stanford Univ., CA, USA
R.A. Olshen , Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
S.M. Perlmutter , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2435-2438
H.-J. Winkler , Inst. for Human-Machine Commun., Munich Univ. of Technol., Germany
M. Koschinski , Inst. for Human-Machine Commun., Munich Univ. of Technol., Germany
pp. 2439-2442
A. Edalat , Dept. of Comput., London Univ., UK
D.W.N. Sharp , Dept. of Comput., London Univ., UK
R.L. While , Inst. for Human-Machine Commun., Munich Univ. of Technol., Germany
pp. 2443-2446
R. Buse , Dept. of Comput. Sci., Melbourne Univ., Parkville, Vic., Australia
pp. 2447-2450
Z.-Q. Liu , Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA
pp. 2451-2454
N.L. Chang , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 2455-2458
H. Fahrner , Inst. for Human-Machine-Commun., Univ. of Technol., Munich, Germany
H.-J. Winkler , Inst. for Human-Machine-Commun., Univ. of Technol., Munich, Germany
pp. 2459-2462
S. Fioravanti , Saclant Undersea Res. Center, La Spezia, Italy
D.D. Giusto , Inst. for Human-Machine-Commun., Univ. of Technol., Munich, Germany
pp. 2463-2466
E. Pissaloux , Inst. for Human-Machine-Commun., Univ. of Technol., Munich, Germany
H.A. Cohen , Inst. for Human-Machine-Commun., Univ. of Technol., Munich, Germany
pp. 2467-2470
M. Snorrason , Charles River Anal., Cambridge, MA, USA
H. Ruda , Charles River Anal., Cambridge, MA, USA
A. Caglayan , Charles River Anal., Cambridge, MA, USA
pp. 2471-2474
Q.M. Tieng , Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 2475-2478
M. Lightstone , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
S.K. Mitra , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 2479-2482
E.-H. Yang , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
W. Chen , Dept. of Electr. Eng., Feng Chia Univ., Taichung, Taiwan
pp. 2483-2486
I. Moccagatta , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 2487-2490
C. Chan , California Univ., Berkeley, CA, USA
M. Vetterli , California Univ., Berkeley, CA, USA
pp. 2491-2494
E. Kristenson , Dept. of Electr. Eng., San Jose State Univ., CA, USA
N.M. Nasrabadi , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
X. Ran , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2495-2498
D.M. Bethel , Sch. of Electron. & Electr. Eng., Bath Univ., UK
D.M. Monro , Sch. of Electron. & Electr. Eng., Bath Univ., UK
pp. 2499-2502
J.B. Farison , Dept. of Electr. Eng., Toledo Univ., OH, USA
M.K. Quweider , Dept. of Electr. Eng., Toledo Univ., OH, USA
pp. 2503-2506
M. Skoglund , Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
pp. 2507-2510
P. Mathieu , CNRS, Valbonne, France
D. Lebedeff , CNRS, Valbonne, France
C. Lambert-Nebout , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
P. Bellemain , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 2511-2514
F.M.O. Eryurtlu , Surrey Univ., Guildford, UK
B.G. Evans , Surrey Univ., Guildford, UK
pp. 2515-2518
Y. Wu , Dept. of Electron. & Inf. Sci., Kyoto Inst. of Technol., Japan
Y. Yoshida , Dept. of Electron. & Inf. Sci., Kyoto Inst. of Technol., Japan
pp. 2519-2522
A. Talukder , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J. Davidson , INFOCOM Dept., Rome Univ., Italy
pp. 2527-2530
M. Pfeiffer , Dept. of Electr. Eng., Kaiserslautern Univ., Germany
pp. 2531-2534
A. Makur , Dept. of Electr. Commun. Eng., Indian Inst. of Sci., Bangalore, India
M.R. Raghuveer , Dept. of Electr. Eng., Kaiserslautern Univ., Germany
pp. 2535-2538
O. Alata , CNRS, Talence, France
P. Baylou , CNRS, Talence, France
M. Najim , CNRS, Talence, France
pp. 2539-2542
S.B. Gelfand , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
S.R. Kadaba , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2543-2546
K. Etemad , Center for Autom. Res., Maryland Univ., College Park, MD, USA
R. Chellappa , Center for Autom. Res., Maryland Univ., College Park, MD, USA
pp. 2547-2550
M.R. El-Sakka , Dept. of Syst. Design Eng., Waterloo Univ., Ont., Canada
pp. 2551-2554
D. Hernandez-Sosa , Dept. de Inf. y Sistemas, Univ. de Las Palmas de Gran Canaria, Las Palmas, Spain
J. Cabrera-Gamez , Dept. de Inf. y Sistemas, Univ. de Las Palmas de Gran Canaria, Las Palmas, Spain
A. Falcon-Martel , Dept. de Inf. y Sistemas, Univ. de Las Palmas de Gran Canaria, Las Palmas, Spain
M. Hernandez-Tejera , Dept. de Inf. y Sistemas, Univ. de Las Palmas de Gran Canaria, Las Palmas, Spain
pp. 2555-2558
J. Domaszewicz , Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
pp. 2559-2562
B. Hurtgen , Inst. fur Elektrische Nachrichtentech., Tech. Hochschule Aachen, Germany
pp. 2563-2566
Hui Zhang , Dept. of Radio Eng., Southeast Univ., Nanjing, China
Zhenya He , Dept. of Radio Eng., Southeast Univ., Nanjing, China
pp. 2567-2570
S.J. Woolley , Sch. of Electron. & Electr. Eng., Bath Univ., UK
D.M. Monro , Sch. of Electron. & Electr. Eng., Bath Univ., UK
pp. 2571-2574
L.M. Kaplan , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 2575-2578
S.A. Rizvi , Dept. of Electr. & Comput. Eng., State Univ. of New York, Buffalo, NY, USA
pp. 2579-2582
N.M. Nasrabadi , Dept. of Electron. Commun. Eng., Kwangwoon Univ., Seoul, South Korea
pp. 2583-2586
J. Skowronski , Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 2587-2590
D. Wang , Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
J. Hartung , Signal Process. Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 2591-2594
A. Bogdan , Center for Telecommun. Res., Columbia Univ., New York, NY, USA
pp. 2595-2598
D.G. Warrier , Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
pp. 2599-2602
G.F. Boudreaux-Bartels , Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 2603-2606
Yu-Li You , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
M. Kaveh , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2607-2610
C.S. Hsu , Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
R.H. Bamberger , Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
S.J. Reeves , Dept. de Inf. y Sistemas, Univ. de Las Palmas de Gran Canaria, Las Palmas, Spain
pp. 2611-2614
Y. Zhang , Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
T.S. Huang , Beckman Inst. for Adv. Sci. & Technol., Illinois Univ., Urbana, IL, USA
R.J. Adrian , Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 2615-2618
H.S.M. Beigi , Handwriting Recognition Group, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Jayashree Subrahmonia , Handwriting Recognition Group, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
G.J. Clary , Handwriting Recognition Group, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
H. Maruyama , Handwriting Recognition Group, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 2619-2622
Mou-Yen Chen , ITRI, Hsinchu, Taiwan
A. Kundu , Handwriting Recognition Group, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 2623-2626
Antai Peng , Sch. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
pp. 2627-2629
J.R. Bellegarda , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
E.J. Bellegarda , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 2631-2634
O. Bruyndonckx , Lab. de Telecommun. et Teledetection, Univ. Catholique de Louvain, Belgium
S. Comes , Lab. de Telecommun. et Teledetection, Univ. Catholique de Louvain, Belgium
pp. 2635-2638
M. Potkonjak , C&C Res. Labs., NEC Res. Inst., Princeton, NJ, USA
J.M. Rabaey , Lab. de Telecommun. et Teledetection, Univ. Catholique de Louvain, Belgium
pp. 2639-2642
J.L. Pino , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 2643-2646
M. Willems , Tech. Hochschule Aachen, Germany
M. Pankert , Tech. Hochschule Aachen, Germany
S. Ritz , Tech. Hochschule Aachen, Germany
pp. 2647-2650
S. Ritz , Tech. Hochschule Aachen, Germany
M. Willems , Tech. Hochschule Aachen, Germany
H. Meyr , Tech. Hochschule Aachen, Germany
pp. 2651-2654
Yuo-Chuan Chang , Telecommun. Lab., Minist. of Transp. & Commun., Chung-Li, Taiwan
Chi-Shyan Wu , Telecommun. Lab., Minist. of Transp. & Commun., Chung-Li, Taiwan
Yin-Hwa Huang , Telecommun. Lab., Minist. of Transp. & Commun., Chung-Li, Taiwan
pp. 2655-2658
J.M. Rabaey , Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
K. Wakabayashi , Telecommun. Lab., Minist. of Transp. & Commun., Chung-Li, Taiwan
pp. 2659-2662
J.T. Proudfoot , Dept. of Electr. & Electron. Eng., Univ. Coll. of Swansea, UK
G. King , Dept. of Electr. & Electron. Eng., Univ. Coll. of Swansea, UK
pp. 2667-2670
T. Nakatani , NTT Basic Res.I Labs., Atsugi, Japan
T. Kawabata , NTT Basic Res.I Labs., Atsugi, Japan
H.G. Okuno , NTT Basic Res.I Labs., Atsugi, Japan
pp. 2671-2674
A.G. Place , Dept. of Electr. & Comput. Eng., James Cook Univ. of North Queensland, Townsville, Qld., Australia
pp. 2675-2678
Q.A. Holmes , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
P.A. Kortesoja , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
D.L. McCubbrey , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
P.L. Mohan , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
J.A. Salinger , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
T.N. Wessling , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
J.G. Ackenhusen , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
pp. 2679-2682
W.Y. Kan , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
P.C. Doerschuk , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 2683-2686
A. Trihandoyo , Univ. de Technol. de Compiegne, France
Kun-Mean Hou , Univ. de Technol. de Compiegne, France
pp. 2687-2690
M. Naitoh , Res. Lab., Kokusai Electr. Co. Ltd., Sendai, Japan
M. Kubo , Res. Lab., Kokusai Electr. Co. Ltd., Sendai, Japan
K. Urabe , Res. Lab., Kokusai Electr. Co. Ltd., Sendai, Japan
pp. 2691-2694
J.H. Corley , SCRA, North Charleston, SC, USA
V.K. Madisetti , Res. Lab., Kokusai Electr. Co. Ltd., Sendai, Japan
M.A. Richards , Res. Lab., Kokusai Electr. Co. Ltd., Sendai, Japan
pp. 2695-2698
C. Myers , Lockheed Sanders Inc., Nashua, NH, USA
R. Dreiling , Lockheed Sanders Inc., Nashua, NH, USA
pp. 2699-2702
G. Caracciolo , Corp. Center, Martin Marietta Labs., Moorestown, NJ, USA
J. Pridmore , Corp. Center, Martin Marietta Labs., Moorestown, NJ, USA
pp. 2703-2706
G.A. Shaw , Lincoln Lab., MIT, Lexington, MA, USA
V.K. Madisetti , Res. Lab., Kokusai Electr. Co. Ltd., Sendai, Japan
pp. 2707-2710
T. Egolf , Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
V.K. Madisetti , Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
L.-R. Dung , Dept. of Electr. & Comput. Eng., Georgia Tech. Res. Inst., Atlanta, GA, USA
pp. 2711-2714
J.M. Winograd , Dept. of Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
pp. 2715-2718
J. Normile , Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
K. Wang , Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
D. Ponceleon , Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
K. Chu , Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
Kah-Kay Sung , Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
pp. 2719-2722
M. Tahernezhadi , Dept. of Electr. Eng., Northern Illinois Univ., DeKalb, IL, USA
pp. 2723-2726
H. Klingele , Labor Dr. Steinbichler, Am Bauhof 4, Neubeuern, Germany
pp. 2727-2730
P. O'Shea , Dept. of Commun. & Electr. Eng., R. Melbourne Inst. of Technol., Vic., Australia
E. Palmer , Labor Dr. Steinbichler, Am Bauhof 4, Neubeuern, Germany
G. Frazer , Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
pp. 2731-2734
J. Streit , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
L. Hanzo , Dept. of Electron. & Comput. Sci., Southampton Univ., UK
pp. 2735-2738
A. Wang , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
K. Yao , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 2739-2742
Hsiang-Ling Li , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
Chaitali Chakrabarti , Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
pp. 2743-2746
S.K. Jain , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
K.K. Parhi , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 2747-2750
Jianwei Miao , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.A. Clements , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 2751-2754
N. Anupindi , Aware Inc., Cambridge, MA, USA
M. Bletsas , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
G. Kechriotis , Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
C. Lu , Adv. Technol. Group, Apple Comput. Inc., Cupertino, CA, USA
M. An , Aware Inc., Cambridge, MA, USA
R. Tolimieri , Environ. Res. Inst. of Michigan, Ann Arbor, MI, USA
pp. 2755-2758
Murari Srinivasan , Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
R. DeFries , Aware Inc., Cambridge, MA, USA
pp. 2759-2762
52 ms
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