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Acoustics, Speech, and Signal Processing, 1995. ICASSP-95 Vol 2., 1995 International Conference on
Detroit, MI, USA
May 09-May 12
ISBN: 0-7803-2431-5
Table of Contents
Hyeokho Choi, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Hyeokho Choi, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 885-888
S. Dharanipragada, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
K.S. Arun, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 889-892
D.A.F. Florencio, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
R.W. Schafer, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 893-896
A. Sabharwal, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
L.C. Potter, Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
pp. 897-900
T.F. Brennan, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
P.H. Milenkovic, Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
pp. 905-908
H. Shimotahira, ATR Opt. & Radio Commun. Res. Labs., Kyoto, Japan
pp. 909-912
J. Zhang, Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
K.M. Wong, Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
Q. Jin, Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
Q. Wu, Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 913-916
A. Rao, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
R. Kumaresan, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 917-920
B. Santhanam, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
J.H. McClellan, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 921-924
H. Oehlmann, CNRS, Vandoeuvre, France
D. Brie, CNRS, Vandoeuvre, France
V. Begotto, CNRS, Vandoeuvre, France
M. Tomczak, CNRS, Vandoeuvre, France
pp. 925-928
T. Adali, Dept. of Electr. Eng., Maryland Univ., Baltimore, MD, USA
M.K. Sonmez, CNRS, Vandoeuvre, France
K. Patel, CNRS, Vandoeuvre, France
pp. 929-932
M. Kajiki, Dept. of Electr. Eng., Keio Univ., Yokohama, Japan
J. Xin, Dept. of Electr. Eng., Keio Univ., Yokohama, Japan
H. Ohmori, Dept. of Electr. Eng., Keio Univ., Yokohama, Japan
A. Sano, Dept. of Electr. Eng., Keio Univ., Yokohama, Japan
pp. 933-936
M.A. Kutay, Dept. of Electr. Eng., Bilkent Univ., Ankara, Turkey
H.M. Ozaktas, Dept. of Electr. Eng., Bilkent Univ., Ankara, Turkey
L. Onural, Dept. of Electr. Eng., Bilkent Univ., Ankara, Turkey
O. Arikan, Dept. of Electr. Eng., Bilkent Univ., Ankara, Turkey
pp. 937-940
H. Kanai, Dept. of Electr. Eng., Tohoku Univ., Sendai, Japan
N. Chubachi, Dept. of Electr. Eng., Tohoku Univ., Sendai, Japan
Y. Koiwa, Dept. of Electr. Eng., Bilkent Univ., Ankara, Turkey
pp. 941-944
M. Tanaka, NTT Human Interface Labs., Tokyo, Japan
Y. Kaneda, NTT Human Interface Labs., Tokyo, Japan
S. Makino, NTT Human Interface Labs., Tokyo, Japan
J. Kojima, NTT Human Interface Labs., Tokyo, Japan
pp. 945-948
B. Hassibi, Inf. Syst. Lab., Stanford Univ., CA, USA
T. Kailath, Inf. Syst. Lab., Stanford Univ., CA, USA
pp. 949-952
T.F. Haddad, Dept. of Electr. Eng., Jordan Univ. of Sci. & Technol., Irbid, Jordan
M.A. Khasawneh, Dept. of Electr. Eng., Jordan Univ. of Sci. & Technol., Irbid, Jordan
pp. 953-956
V.J. Mathews, Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
pp. 957-960
A.M. Sarhan, Dept. of Electr. Eng., Dayton Univ., OH, USA
R.C. Hardie, Dept. of Electr. Eng., Dayton Univ., OH, USA
K.E. Barner, NTT Human Interface Labs., Tokyo, Japan
pp. 961-964
Junghsi Lee, Adv. Technol. Center, Ind. Technol. Res. Inst., Hsinchu, Taiwan
V.J. Mathews, Dept. of Electr. Eng., Dayton Univ., OH, USA
pp. 965-968
F. Capman, Matra Commun., Bois d'Arcy, France
J. Boudy, Matra Commun., Bois d'Arcy, France
P. Lockwood, Matra Commun., Bois d'Arcy, France
pp. 969-972
Z. Fejzo, Aware Inc., Cambridge, MA, USA
H. Lev-Ari, ENSERB, Talence, France
pp. 977-980
J.T. Stonick, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
V.L. Stonick, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.M.F. Moura, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
R.S. Zborowski, NTT Human Interface Labs., Tokyo, Japan
pp. 981-984
M. de Courville, Dept. Signal, Telecom Paris, France
P. Duhamel, Dept. Signal, Telecom Paris, France
pp. 985-988
K. Ashihara, Tokyo Metropolitan Univ., Japan
K. Nishikawa, Tokyo Metropolitan Univ., Japan
H. Kiya, Tokyo Metropolitan Univ., Japan
pp. 989-992
H. Ochi, Dept. of Inf. Eng., Ryukyus Univ., Okinawa, Japan
Y. Higa, Dept. of Inf. Eng., Ryukyus Univ., Okinawa, Japan
S. Kinjo, Dept. of Inf. Eng., Ryukyus Univ., Okinawa, Japan
pp. 993-996
Tzu-Hsien Sang, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
W.J. Williams, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 997-1000
A.H. Costa, Dept. of Electr. & Comput. Eng., Massachusetts Univ., North Dartmouth, MA, USA
G.F. Boudreaux-Bartels, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 1001-1004
J.C. O'Neill, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
W.J. Williams, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 1005-1008
P.J. Loughlin, Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
J.W. Pitton, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
B. Hannaford, Dept. of Inf. Eng., Ryukyus Univ., Okinawa, Japan
pp. 1009-1012
B. Tacer, Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
P.J. Loughlin, Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
pp. 1013-1016
A. Papandreou, Dept. of Electr. Eng., Rhode Island Univ., Kingston, RI, USA
F. Hlawatsch, Dept. of Electr. Eng., Pittsburgh Univ., PA, USA
G.F. Boudreauz-Bartels, Dept. of Inf. Eng., Ryukyus Univ., Okinawa, Japan
pp. 1017-1020
R.G. Baraniuk, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 1021-1024
M.S. Richman, Cornell Univ., Ithaca, NY, USA
T.W. Parks, Cornell Univ., Ithaca, NY, USA
R.G. Shenoy, Dept. of Inf. Eng., Ryukyus Univ., Okinawa, Japan
pp. 1029-1032
D.L. Jones, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
A.M. Sayeed, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 1033-1036
S. Zazo, Univ. Alfonso X El Sabio, Madrid, Spain
J.M. Paez-Borrallo, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
I.A.P. Alvarez, Dept. of Inf. Eng., Ryukyus Univ., Okinawa, Japan
pp. 1037-1040
J.P. LeBlanc, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
I. Fijalkow, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
B. Huber, Dept. of Inf. Eng., Ryukyus Univ., Okinawa, Japan
B. Huber, NTT Human Interface Labs., Tokyo, Japan
pp. 1041-1044
P. Philippe, CCETT, Cesson Sevigne, France
F. Moreau de Saint-Martin, CCETT, Cesson Sevigne, France
L. Mainard, CCETT, Cesson Sevigne, France
pp. 1045-1048
T. Schirtzinger, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
X. Li, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
W.K. Jenkins, Coordinated Sci. Lab., Illinois Univ., Urbana, IL, USA
pp. 1049-1052
K.H. Afkhamie, Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
Zhi-Quan Luo, Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
pp. 1053-1056
M.L. Honig, Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
pp. 1057-1060
L. Ortiz-Balbuena, Digital Syst. Area, Univ. Autonoma Metropolitana Iztapalap, Mexico City, Mexico
A. Martinez-Gonzalez, Digital Syst. Area, Univ. Autonoma Metropolitana Iztapalap, Mexico City, Mexico
H. Perez-Meana, Digital Syst. Area, Univ. Autonoma Metropolitana Iztapalap, Mexico City, Mexico
L. Nino de Rivera, Digital Syst. Area, Univ. Autonoma Metropolitana Iztapalap, Mexico City, Mexico
pp. 1061-1064
M. Doroslovacki, Compunetix Inc., Monroeville, PA, USA
H. Fan, Digital Syst. Area, Univ. Autonoma Metropolitana Iztapalap, Mexico City, Mexico
pp. 1065-1068
T.S. Castelein, Northern Telecom, Netherlands
Y. Bar-Ness, Digital Syst. Area, Univ. Autonoma Metropolitana Iztapalap, Mexico City, Mexico
R. Prasad, Digital Syst. Area, Univ. Autonoma Metropolitana Iztapalap, Mexico City, Mexico
pp. 1069-1072
S. Marcos, Lab. des Signaux et Syst., Ecole Superieure d'Electr., Gif-sur-Yvette, France
S. Cherif, Digital Syst. Area, Univ. Autonoma Metropolitana Iztapalap, Mexico City, Mexico
M. Jaidane, Digital Syst. Area, Univ. Autonoma Metropolitana Iztapalap, Mexico City, Mexico
pp. 1073-1076
S. Del Marco, Aware Inc., Cambridge, MA, USA
P. Heller, Aware Inc., Cambridge, MA, USA
J. Weiss, Aware Inc., Cambridge, MA, USA
pp. 1077-1080
I. Cohen, Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
S. Raz, Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
D. Malah, Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
pp. 1081-1084
I. Djokovic, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
P.P. Vaidyanathan, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 1085-1088
Sigang Qiu, Dept. of Math., Connecticut Univ., Storrs, CT, USA
H.G. Feichtinger, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 1089-1092
N. Erdol, Dept. of Electr. Eng., Florida Atlantic Univ., Boca Raton, FL, USA
Feng Bao, Dept. of Electr. Eng., Florida Atlantic Univ., Boca Raton, FL, USA
Zajing Chen, Dept. of Electr. Eng., Florida Atlantic Univ., Boca Raton, FL, USA
pp. 1093-1096
S.A. Benno, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.M.F. Moura, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 1097-1100
D. Nelson, US Dept of Defense, Fort Meade, MD, USA
pp. 1101-1104
M. Nakashizuka, Fac. of Eng., Niigata Univ., Japan
H. Kikuchi, Fac. of Eng., Niigata Univ., Japan
H. Makino, Fac. of Eng., Niigata Univ., Japan
I. Ishii, Fac. of Eng., Niigata Univ., Japan
pp. 1105-1108
M.A. Coffey, Center for Astrodynamics Res., Colorado Univ., Boulder, CO, USA
D.M. Etter, Center for Astrodynamics Res., Colorado Univ., Boulder, CO, USA
pp. 1109-1112
D.M. Etter, Dept. of Electron. Eng., Hong Kong Polytech. Univ, Hung Hom, Hong Kong
D.P.K. Lun, Dept. of Electron. Eng., Hong Kong Polytech. Univ, Hung Hom, Hong Kong
pp. 1113-1116
H.J. Trussell, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
S.A. Rajala, Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
pp. 1117-1120
T. Aboulnasr, Ottawa-Carleton Inst. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 1121-1124
M. Karjalainen, Acoust. Lab., Helsinki Univ. of Technol., Espoo, Finland
M. Rahkila, Acoust. Lab., Helsinki Univ. of Technol., Espoo, Finland
pp. 1125-1128
A. Donder, Dept. of Inf. Technol., Ulm Univ., Germany
M. Beck, Dept. of Inf. Technol., Ulm Univ., Germany
M. Bossert, Dept. of Inf. Technol., Ulm Univ., Germany
J. Hess, Dept. of Inf. Technol., Ulm Univ., Germany
U. Ketzer, Dept. of Inf. Technol., Ulm Univ., Germany
W.G. Teich, Dept. of Inf. Technol., Ulm Univ., Germany
pp. 1129-1132
K. Berberidis, Computer Technol. Inst., Patras, Greece
S. Theodoridis, Computer Technol. Inst., Patras, Greece
pp. 1133-1136
C.S. Burrus, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
I.W. Selesnick, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 1137-1140
Haesun Park, Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
J. Ben Rosen, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
J. Glick, Dept. of Inf. Technol., Ulm Univ., Germany
pp. 1141-1144
A.E. Yagle, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 1145-1148
Wen-Hsien Fang, Dept. of Electron. Eng., Nat. Taiwan Inst. of Technol., Taipei, Taiwan
Yang-Lung Hwang, Dept. of Electron. Eng., Nat. Taiwan Inst. of Technol., Taipei, Taiwan
pp. 1149-1152
J. Gotze, Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
M. Haardt, Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
J.A. Nossek, Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
pp. 1153-1156
A. Bell, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
R. Joshi, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 1157-1160
B. Carnero, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
A. Drygajlo, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 1161-1164
M. Vrhel, Biomed. Eng. & Instrum. Program, Nat. Inst. of Health, Bethesda, MD, USA
Chulhee Lee, Biomed. Eng. & Instrum. Program, Nat. Inst. of Health, Bethesda, MD, USA
I. Unser, Biomed. Eng. & Instrum. Program, Nat. Inst. of Health, Bethesda, MD, USA
pp. 1165-1168
Wan-Chi Siu, Dept. of Electron. Eng., Hong Kong Polytech. Univ, Hung Hom, Hong Kong
Yuk-Hee Chan, Dept. of Electron. Eng., Hong Kong Polytech. Univ, Hung Hom, Hong Kong
Lap-Pui Chau, Dept. of Electron. Eng., Hong Kong Polytech. Univ, Hung Hom, Hong Kong
pp. 1169-1172
M. Savic, Signal & Speech Res. Group, Rensselaer Polytech. Inst., Troy, NY, USA
M. Chugani, Signal & Speech Res. Group, Rensselaer Polytech. Inst., Troy, NY, USA
K. Peabody, Signal & Speech Res. Group, Rensselaer Polytech. Inst., Troy, NY, USA
A. Husain, Signal & Speech Res. Group, Rensselaer Polytech. Inst., Troy, NY, USA
Ming-Hong Tang, Signal & Speech Res. Group, Rensselaer Polytech. Inst., Troy, NY, USA
Z. Macek, Signal & Speech Res. Group, Rensselaer Polytech. Inst., Troy, NY, USA
pp. 1173-1176
Szi-Wen Chen, Biomed. Eng. Center, Ohio State Univ., Columbus, OH, USA
P.M. Clarkson, Biomed. Eng. Center, Ohio State Univ., Columbus, OH, USA
pp. 1177-1180
P.M. Clarkson, Biomed. Eng. Center, Ohio State Univ., Columbus, OH, USA
Szi-Wen Chen, Biomed. Eng. Center, Ohio State Univ., Columbus, OH, USA
Qi Fan, Biomed. Eng. Center, Ohio State Univ., Columbus, OH, USA
pp. 1181-1184
P.K. Gale, Dept. of Electr. Eng., Wyoming Univ., Laramie, WY, USA
J.W. Pierre, Dept. of Electr. Eng., Wyoming Univ., Laramie, WY, USA
pp. 1185-1188
E. Lindskog, Syst. & Control Group, Uppsala Univ., Sweden
A. Ahlen, Syst. & Control Group, Uppsala Univ., Sweden
M. Sternad, Syst. & Control Group, Uppsala Univ., Sweden
pp. 1189-1192
R.E. Learned, Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
S. Mallat, Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
B. Claus, Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
A.S. Willsky, Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
pp. 1193-1196
Lang Tong, Dept. of Electr. & Syst. Eng., Connecticut Univ., Storrs, CT, USA
pp. 1205-1208
M.V. Tazebay, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
A.N. Akansu, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
pp. 1209-1212
A.-J. van der Veen, Inf. Syst. Lab., Stanford Univ., CA, USA
S. Talwar, Dept. of Electr. & Comput. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
A. Paulraj, Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
pp. 1213-1216
N. Magotra, Dept. of Electr. Eng. & Comput. Eng., New Mexico Univ., Albuquerque, NM, USA
W. McCoy, Dept. of Electr. Eng. & Comput. Eng., New Mexico Univ., Albuquerque, NM, USA
F. Livingston, Dept. of Electr. Eng. & Comput. Eng., New Mexico Univ., Albuquerque, NM, USA
S. Stearns, Lab. for Inf. & Decision Syst., MIT, Cambridge, MA, USA
pp. 1217-1220
N.I. Wijeyesekera, Schlumberger Houston Product Center, TX, USA
R.G. Shenoy, Dept. of Electr. Eng. & Comput. Eng., New Mexico Univ., Albuquerque, NM, USA
pp. 1221-1224
F. Marvasti, Dept. of Electron. & Electr. Eng., King's Coll., London, UK
pp. 1225-1228
L. Vandendorpe, UCL Telecommun. & Remote Sensing Lab., Louvain-la-Neuve, Belgium
B. Maison, UCL Telecommun. & Remote Sensing Lab., Louvain-la-Neuve, Belgium
L. Cuvelier, UCL Telecommun. & Remote Sensing Lab., Louvain-la-Neuve, Belgium
pp. 1229-1232
R. Mani, Dept. of Electr. & Comput. Sci., Boston Univ., MA, USA
S.H. Nawab, Dept. of Electr. & Comput. Sci., Boston Univ., MA, USA
pp. 1233-1236
R.A. Gopinath, Dept. of Comput. Sci., IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 1237-1239
S. Chretien, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
I. Dologlou, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 1240-1243
Li-Chien Lin, Dept. of Electr. Eng., Feng Chia Univ., Taichung, Taiwan
C.-C. Jay Kuo, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 1244-1247
A.G. Jaffer, Hughes Aircraft Co., Fullerton, CA, USA
W.E. Jones, Hughes Aircraft Co., Fullerton, CA, USA
T.J. Abatzoglou, UCL Telecommun. & Remote Sensing Lab., Louvain-la-Neuve, Belgium
pp. 1256-1259
I.W. Selesnick, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
M. Lang, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
C.S. Burrus, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 1260-1263
M. Lang, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 1264-1267
P. Gentili, Dipartimento di Elettronica e Autom., Ancona Univ., Italy
F. Piazza, Dipartimento di Elettronica e Autom., Ancona Univ., Italy
A. Uncini, Dipartimento di Elettronica e Autom., Ancona Univ., Italy
pp. 1268-1271
Chaur-Heh Hsieh, Dept. of Electr. Eng., Chung Cheng Inst. of Technol., Taoyuan, Taiwan
Ying-Luan Han, Dept. of Electr. Eng., Chung Cheng Inst. of Technol., Taoyuan, Taiwan
Chung-Ming Kuo, Dept. of Electr. Eng., Chung Cheng Inst. of Technol., Taoyuan, Taiwan
Yue-Dar Jou, Dept. of Electr. Eng., Chung Cheng Inst. of Technol., Taoyuan, Taiwan
pp. 1272-1275
G.D. Cain, Westminster Univ., London, UK
A. Yardim, Westminster Univ., London, UK
P. Henry, Dept. of Electr. Eng., Chung Cheng Inst. of Technol., Taoyuan, Taiwan
pp. 1276-1279
M.A. Masnadi-Shirazi, Dept. of Electr. Eng., Shiraz Univ., Iran
M. Ghasemi, Dept. of Electr. Eng., Shiraz Univ., Iran
pp. 1284-1287
B. Vo, Telecommun. Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
A. Cantoni, Telecommun. Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
K.L. Teo, Dept. of Electr. Eng., Chung Cheng Inst. of Technol., Taoyuan, Taiwan
pp. 1288-1291
S. Ohno, Fac. of Eng., Kyoto Univ., Japan
H. Sakai, Fac. of Eng., Kyoto Univ., Japan
pp. 1292-1295
R.L. de Queiroz, Xerox Co., Webster, NY, USA
K.R. Rao, Fac. of Eng., Kyoto Univ., Japan
pp. 1296-1299
P. Saghizadeh, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
P. Saghizadeh, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 1300-1303
T.I. Laakso, Sch. of Electron. & Manuf. Syst. Eng., Westminster Univ., London, UK
V. Valimaki, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
J. Henriksson, Dept. of Electr. Eng., Chung Cheng Inst. of Technol., Taoyuan, Taiwan
pp. 1304-1307
W.M. Campbell, Center for Appl. Math., Cornell Univ., Ithaca, NY, USA
T.W. Parks, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 1308-1311
I. Jee, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
R.A. Haddad, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
pp. 1320-1323
B. Tang, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
A. Shen, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
G. Pottie, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
A. Alwan, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 1324-1327
J. Mau, France Telecom, CCETT, Cesson Sevigne, France
J. Valot, France Telecom, CCETT, Cesson Sevigne, France
D. Minaud, France Telecom, CCETT, Cesson Sevigne, France
pp. 1328-1331
A.S. Asdi, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 1332-1335
A.C. Singer, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 1336-1339
T.W. Frison, Randle Inc., Great Falls, VA, USA
H.D.I. Abarbanel, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
L.S. Tsimring, France Telecom, CCETT, Cesson Sevigne, France
pp. 1340-1343
H. Leung, Radar & Space Div., Defence Res. Establ. Ottawa, Ont., Canada
Xinping Huang, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 1344-1347
Lee Chungyong, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
D.B. Williams, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1348-1351
S.H. Isabelle, Res. Lab. of Electron., MIT, Cambridge, MA, USA
G.W. Wornell, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 1352-1355
F.M. Coetzee, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
V.L. Stonick, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 1356-1359
S.A. Talwalkar, Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA
S.M. Kay, Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA
pp. 1360-1363
M. Vinson, Dept. of Phys., Shippensburg Univ., PA, USA
L. Khadra, Dept. of Electr. & Comput. Eng., Rhode Island Univ., Kingston, RI, USA
T. Maayah, France Telecom, CCETT, Cesson Sevigne, France
H. Dickhaus, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 1364-1367
M. Abe, Dept. of Math. Eng. & Inf. Phys., Tokyo Univ., Japan
S. Ando, Dept. of Math. Eng. & Inf. Phys., Tokyo Univ., Japan
pp. 1368-1371
P.L. Combettes, Dept. of Electr. Eng., City Univ. of New York, NY, USA
P. Bondon, Dept. of Math. Eng. & Inf. Phys., Tokyo Univ., Japan
pp. 1372-1375
J.C.M. Bermudez, Dept. of Electr. Eng., Univ. Federal de Santa Catarina, Florianopolis, Brazil
N.J. Bershad, Dept. of Math. Eng. & Inf. Phys., Tokyo Univ., Japan
pp. 1376-1379
Byung-Eul Jun, Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
Dong-Jo Park, Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
Yong-Woon Kim, Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
pp. 1380-1383
A.W. Hull, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
W.K. Jenkins, Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
pp. 1384-1387
M. Rupp, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A.H. Sayed, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 1388-1391
A. Hirano, Inf. Technol. Res. Labs., NEC Corp., Kanagawa, Japan
A. Sugiyama, Inf. Technol. Res. Labs., NEC Corp., Kanagawa, Japan
pp. 1392-1395
O. Arikan, Bilkent Univ., Ankara, Turkey
M. Belge, Bilkent Univ., Ankara, Turkey
A.E. Cetin, Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
E. Erzin, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 1400-1403
K. Mayyas, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
T. Aboulnasr, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 1408-1411
A.A. Rontogiannis, Dept. of Inf., Athens Univ., Greece
S. Theodoridis, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 1412-1415
G.-O. Glentis, Dept. of Electr. Eng., Twente Univ., Enschede, Netherlands
C.H. Slump, Dept. of Electr. Eng., Twente Univ., Enschede, Netherlands
pp. 1420-1423
J. Tuthill, Australian Telecommun. Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
Y.H. Leung, Australian Telecommun. Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
I. Thng, Australian Telecommun. Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 1424-1427
P.S.R. Diniz, COPPE/EE, Univ. Federal do Rio de Janeiro, Brazil
M.G. Siqueira, COPPE/EE, Univ. Federal do Rio de Janeiro, Brazil
pp. 1428-1431
M.M. Milosavljevic, Inst. of Appl. Math. & Electron., Belgrade, Serbia
M.D. Veinovic, Inst. of Appl. Math. & Electron., Belgrade, Serbia
B.D. Kovacevic, Australian Telecommun. Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 1432-1435
G.A. Williamson, Dept. of Electr. & Comput. Eng., Illinois Inst. of Technol., Chicago, IL, USA
J.P. Ashley, Inst. of Appl. Math. & Electron., Belgrade, Serbia
M. Nayeri, Australian Telecommun. Res. Inst., Curtin Univ. of Technol., Bentley, WA, Australia
pp. 1436-1439
R. Shorten, Intelligent Syst. Group, Daimler-Benz Res. GmbH, Berlin, Germany
A. Schutte, Intelligent Syst. Group, Daimler-Benz Res. GmbH, Berlin, Germany
A.D. Fagan, Intelligent Syst. Group, Daimler-Benz Res. GmbH, Berlin, Germany
pp. 1440-1443
H.J.W. Belt, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
A.C. den Brinker, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
F.P.A. Benders, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
pp. 1444-1447
P.P. Vaidyanathan, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
See-May Phoong, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 1448-1451
B. Foster, Nat. Univ. of Ireland, Ireland
C. Herley, Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 1452-1455
Z. Cvetkovic, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
pp. 1456-1459
P.A. Regalia, Dept. Signal et Image, Inst. Nat. des Telecommun., Evry, France
Dong-Yan Huang, Dept. Signal et Image, Inst. Nat. des Telecommun., Evry, France
pp. 1460-1463
T. Cooklev, Dept. of Phys. Electron., Tokyo Inst. of Technol., Japan
A. Nishihara, Dept. of Phys. Electron., Tokyo Inst. of Technol., Japan
T. Yoshida, Dept. of Electr. Eng., Eindhoven Univ. of Technol., Netherlands
M. Sablatash, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 1464-1467
G. Schuller, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
M.J.T. Smith, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 1472-1475
G. Gonzalez-Rosiles, Dept. of Electr. & Comput. Eng., Texas Univ., El Paso, TX, USA
S.D. Cabrera, Dept. of Electr. & Comput. Eng., Texas Univ., El Paso, TX, USA
Sing-Wai Wu, Dept. of Electr. & Comput. Eng., Texas Univ., El Paso, TX, USA
pp. 1476-1479
F. Moreau de Saint-Martin, CCETT, Cesson Sevigne, France
A. Cohen, Dept. of Electr. & Comput. Eng., Texas Univ., El Paso, TX, USA
P. Siohan, Dept. of Electr. & Comput. Eng., Texas Univ., El Paso, TX, USA
pp. 1480-1483
M.K. Tsatsanis, Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
G.B. Giannakis, Dept. of Electr. Eng., Virginia Univ., Charlottesville, VA, USA
pp. 1484-1487
Bo Xuan, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
R.H. Bamberger, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 1488-1491
M.R.K. Khansari, Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
E. Dubois, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
pp. 1492-1495
P.N. Heller, Aware Inc., Cambridge, MA, USA
T.Q. Nguyen, Sch. of Electr. Eng. & Comput. Sci., Washington State Univ., Pullman, WA, USA
H. Singh, Dept. of Electr. & Comput. Eng., Texas Univ., El Paso, TX, USA
W.K. Carey, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 1496-1499
S.C. Chan, Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
pp. 1508-1511
S. Basu, Dept. of Electr. Eng. & Comput. Sci., Stevens Inst. of Technol., Hoboken, NJ, USA
H.M. Choi, Dept. of Electr. Eng. & Comput. Sci., Stevens Inst. of Technol., Hoboken, NJ, USA
pp. 1512-1515
C. Herley, Hewlett-Packard Co., Palo Alto, CA, USA
Zixiang Xiong, Dept. of Electr. Eng. & Comput. Sci., Stevens Inst. of Technol., Hoboken, NJ, USA
K. Ramchandran, Dept. of Electr. & Comput. Eng., Texas Univ., El Paso, TX, USA
M.T. Orchard, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 1516-1519
S.S. Hemami, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
R.M. Gray, Dept. of Electr. Eng. & Comput. Sci., Stevens Inst. of Technol., Hoboken, NJ, USA
pp. 1520-1523
V. Valimaki, Lab. of Acoust. & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland
M. Karjalainen, Lab. of Acoust. & Audio Signal Process., Helsinki Univ. of Technol., Espoo, Finland
pp. 1524-1527
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