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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1995)
Detroit, MI, USA
May 9, 1995 to May 12, 1995
ISBN: 0-7803-2431-5
TABLE OF CONTENTS
M. Serizawa , C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
K. Ozawa , C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 1-4
P. Kroon , AT&T Bell Labs., Murray Hill, NJ, USA
M. Recchione , C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 5-8
Juin-Hwey Chen , Speech Coding Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 9-12
A. Popescu , Telecom Paris, France
N. Moreau , Telecom Paris, France
pp. 13-16
P. Hedelin , Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
T. Eriksson , Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
pp. 17-20
Cheung-Fat Chan , Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong
pp. 21-24
T. Wigren , Ericsson Radio Syst. AB, Stockholm, Sweden
A. Bergstrom , Ericsson Radio Syst. AB, Stockholm, Sweden
S. Harrysson , Ericsson Radio Syst. AB, Stockholm, Sweden
F. Jansson , Ericsson Radio Syst. AB, Stockholm, Sweden
H. Nilson , Ericsson Radio Syst. AB, Stockholm, Sweden
pp. 25-28
A. Kataoka , NTT Human Interface Labs., Tokyo, Japan
S. Hosaka , NTT Human Interface Labs., Tokyo, Japan
J. Ikedo , Ericsson Radio Syst. AB, Stockholm, Sweden
T. Moriya , Ericsson Radio Syst. AB, Stockholm, Sweden
S. Hayashi , Ericsson Radio Syst. AB, Stockholm, Sweden
pp. 29-32
K. Koishida , Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
K. Tokuda , NTT Human Interface Labs., Tokyo, Japan
T. Kobayashi , Ericsson Radio Syst. AB, Stockholm, Sweden
S. Imai , Ericsson Radio Syst. AB, Stockholm, Sweden
pp. 33-36
Shude Zhang , Dept. of Electron. & Electr. Eng., Leeds Univ., UK
G. Lockhart , Dept. of Electron. & Electr. Eng., Leeds Univ., UK
pp. 37-40
L.R. Bahl , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
S. Balakrishnan-Aiyer , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J.R. Bellgarda , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M. Franz , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.S. Gopalakrishnan , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M. Novak , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M. Padmanabhan , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
S. Roukos , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 41-44
D.B. Paul , Lincoln Lab., MIT, Lexington, MA, USA
pp. 45-48
X. Aubert , Philips Res. Lab., Aachen, Germany
H. Ney , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 49-52
P. Jeanrenaud , BBN Syst. & Technol. Corp., Cambridge, MA, USA
E. Eide , BBN Syst. & Technol. Corp., Cambridge, MA, USA
U. Chaudhari , BBN Syst. & Technol. Corp., Cambridge, MA, USA
J. McDonough , BBN Syst. & Technol. Corp., Cambridge, MA, USA
K. Ng , BBN Syst. & Technol. Corp., Cambridge, MA, USA
M. Siu , BBN Syst. & Technol. Corp., Cambridge, MA, USA
H. Gish , BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 53-56
Ren-Yuan Lyu , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Lee-Feng Chien , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Shiao-Hong Hwang , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Hung-Yun Hsieh , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Rung-Chiuan Yang , BBN Syst. & Technol. Corp., Cambridge, MA, USA
Bo-Ren Bai , BBN Syst. & Technol. Corp., Cambridge, MA, USA
Jia-Chi Weng , BBN Syst. & Technol. Corp., Cambridge, MA, USA
Yen-Ju Yang , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Shi-Wei Lin , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Keh-Jiann Chen , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 57-60
Hsin-Min Wang , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Jia-Lin Shen , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Yen-Ju Yang , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Chiu-Yu Tseng , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Lin-Shan Lee , BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 61-64
J.L. Gauvain , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
L. Lamel , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
M. Adda-Decker , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
pp. 65-68
M.M. Hochberg , Dept. of Eng., Cambridge Univ., UK
S.J. Renals , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
A.J. Robinson , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
G.D. Cook , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 69-72
P.C. Woodland , Dept. of Eng., Cambridge Univ., UK
C.J. Leggetter , Dept. of Eng., Cambridge Univ., UK
J.J. Odell , Dept. of Eng., Cambridge Univ., UK
V. Valtchev , Dept. of Eng., Cambridge Univ., UK
S.J. Young , Dept. of Eng., Cambridge Univ., UK
pp. 73-76
Yuqing Gao , Inst. of Syst. Sci., Nat. Univ. of Singapore, Singapore
Hsiao-Wuen Hon , Inst. of Syst. Sci., Nat. Univ. of Singapore, Singapore
Zhiwei Lin , Inst. of Syst. Sci., Nat. Univ. of Singapore, Singapore
G. Loudon , Inst. of Syst. Sci., Nat. Univ. of Singapore, Singapore
S. Yogananthan , Inst. of Syst. Sci., Nat. Univ. of Singapore, Singapore
Baosheng Yuan , Inst. of Syst. Sci., Nat. Univ. of Singapore, Singapore
pp. 77-80
T. Robinson , Dept. of Eng., Cambridge Univ., UK
J. Fransen , Dept. of Eng., Cambridge Univ., UK
D. Pye , Dept. of Eng., Cambridge Univ., UK
J. Foote , Dept. of Eng., Cambridge Univ., UK
S. Renals , Dept. of Eng., Cambridge Univ., UK
pp. 81-84
Y. Muthusamy , Syst. & Inf. Sci. Lab., Texas Instrum. Inc., Dallas, TX, USA
E. Holliman , Syst. & Inf. Sci. Lab., Texas Instrum. Inc., Dallas, TX, USA
B. Wheatley , Syst. & Inf. Sci. Lab., Texas Instrum. Inc., Dallas, TX, USA
J. Picone , Dept. of Eng., Cambridge Univ., UK
J. Godfrey , Dept. of Eng., Cambridge Univ., UK
pp. 85-88
Yeonja Lim , Autom. Interpretation Section, Electron. & Telecommun. Res. Inst., Seoul, South Korea
Youngjik Lee , Autom. Interpretation Section, Electron. & Telecommun. Res. Inst., Seoul, South Korea
pp. 89-92
Xuedong Huang , Microsoft Corp., Redmond, WA, USA
A. Acero , Microsoft Corp., Redmond, WA, USA
F. Alleva , Microsoft Corp., Redmond, WA, USA
Mei-Yuh Hwang , Microsoft Corp., Redmond, WA, USA
Li Jiang , Microsoft Corp., Redmond, WA, USA
M. Mahajan , Microsoft Corp., Redmond, WA, USA
pp. 93-96
L. Mayfield , Interactive Syst. Lab., Carnegie Mellon Univ., Pittsburgh, PA, USA
M. Gavalda , Interactive Syst. Lab., Carnegie Mellon Univ., Pittsburgh, PA, USA
W. Ward , Interactive Syst. Lab., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel , Interactive Syst. Lab., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 97-100
J.F. Pitrelli , NYNEX Corp., White Plains, NY, USA
C. Fong , NYNEX Corp., White Plains, NY, USA
S.H. Wong , NYNEX Corp., White Plains, NY, USA
J.R. Spitz , NYNEX Corp., White Plains, NY, USA
H.C. Leung , NYNEX Corp., White Plains, NY, USA
pp. 101-104
K.L. Brown , Signal Process. Center of Technol., Lockheed Sanders Avionics, Nashua, NH, USA
E.B. George , Signal Process. Center of Technol., Lockheed Sanders Avionics, Nashua, NH, USA
pp. 105-108
P. Duchnowski , Interactive Syst. Lab., Karlsruhe Univ., Germany
M. Hunke , Interactive Syst. Lab., Karlsruhe Univ., Germany
D. Busching , Interactive Syst. Lab., Karlsruhe Univ., Germany
U. Meier , Interactive Syst. Lab., Karlsruhe Univ., Germany
A. Waibel , Interactive Syst. Lab., Karlsruhe Univ., Germany
pp. 109-112
V.M. Jimenez , Dept. de Sistemas Inf. y Comput., Univ. Politecnica de Valencia, Spain
A. Castellanos , Dept. de Sistemas Inf. y Comput., Univ. Politecnica de Valencia, Spain
E. Vidal , Dept. de Sistemas Inf. y Comput., Univ. Politecnica de Valencia, Spain
pp. 113-116
Nam-Yong Han , Electron. & Telecommun. Res. Inst., Seoul, South Korea
Hoi-Rin Kim , Electron. & Telecommun. Res. Inst., Seoul, South Korea
Kyu-Woong Hwang , Electron. & Telecommun. Res. Inst., Seoul, South Korea
Young-Mok Ahn , Electron. & Telecommun. Res. Inst., Seoul, South Korea
Joon-Hyung Ryoo , Electron. & Telecommun. Res. Inst., Seoul, South Korea
pp. 117-120
A. Sankar , AT&T Bell Labs., Murray Hill, NJ, USA
Chin-Hui Lee , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 121-124
O. Siohan , CRIN-INRIA Lorraine, Vandoeuvre-les-Nancy, France
pp. 125-128
Y. Minami , NTT Human Interface Labs., Tokyo, Japan
S. Furui , NTT Human Interface Labs., Tokyo, Japan
pp. 129-132
M.J.F. Gales , Dept. of Eng., Cambridge Univ., UK
S.J. Young , Dept. of Eng., Cambridge Univ., UK
pp. 133-136
P.J. Moreno , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
B. Raj , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
E. Gouvea , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
R.M. Stern , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 137-140
L. Neumeyer , Speech Technol. & Res. Lab., SRI Int., Menlo Park, CA, USA
M. Weintraub , Speech Technol. & Res. Lab., SRI Int., Menlo Park, CA, USA
pp. 141-144
Seokyong Moon , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
Jenq-Neng Hwang , Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 145-148
K. Takagi , C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
H. Hattori , C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
T. Watanabe , C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 149-152
H.G. Hirsch , Inst. of Commun. Syst. & Data Process., Tech. Hochschule Aachen, Germany
C. Ehrlicher , Inst. of Commun. Syst. & Data Process., Tech. Hochschule Aachen, Germany
pp. 153-156
D. Naik , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 157-160
P.S. Rao , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.D. Monkowski , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
S. Roukos , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 161-164
M. Tamoto , NTT Basic Res. Labs., Kanagawa, Japan
T. Kawabata , NTT Basic Res. Labs., Kanagawa, Japan
pp. 165-168
H. Lloyd-Thomas , Ensigma Ltd., Chepstow, UK
J.H. Wright , Ensigma Ltd., Chepstow, UK
G.J.F. Jones , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 173-176
S.R. Young , Sch. of Comput. Sci., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 177-180
R. Kneser , Philips GmbH Forschungslab., Aachen, Germany
H. Ney , Ensigma Ltd., Chepstow, UK
pp. 181-184
G. Bordel , Dept. de Electr. y Electron., Pais Vasco Univ., Bilbao, Spain
I. Torres , Dept. de Electr. y Electron., Pais Vasco Univ., Bilbao, Spain
E. Vidal , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 185-188
D. Jurafsky , Int. Comput. Sci. Inst., Berkeley, CA, USA
C. Wooters , Int. Comput. Sci. Inst., Berkeley, CA, USA
J. Segal , Int. Comput. Sci. Inst., Berkeley, CA, USA
A. Stolcke , Int. Comput. Sci. Inst., Berkeley, CA, USA
E. Fosler , Int. Comput. Sci. Inst., Berkeley, CA, USA
G. Tajchaman , Int. Comput. Sci. Inst., Berkeley, CA, USA
N. Morgan , Int. Comput. Sci. Inst., Berkeley, CA, USA
pp. 189-192
K. Ries , Karlsruhe Univ., Germany
K. Ries , Karlsruhe Univ., Germany
Ye-Yi Wang , Int. Comput. Sci. Inst., Berkeley, CA, USA
pp. 193-196
C. Pateras , Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
G. Dudek , Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
R. De Mori , Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
pp. 197-200
D.X. Sun , Dept. of Appl. Math. & Stat., State Univ. of New York, Stony Brook, NY, USA
Li Deng , Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
pp. 201-204
J.P. Ueberla , Forum Technol. DRA Malvern, UK
pp. 205-208
F.J. Smith , Sch. of Electr. Eng. & Comput. Sci., Queen's Univ., Belfast, UK
J. Ming , Sch. of Electr. Eng. & Comput. Sci., Queen's Univ., Belfast, UK
P. O'Boyle , Sch. of Electr. Eng. & Comput. Sci., Queen's Univ., Belfast, UK
A.D. Irvine , Sch. of Electr. Eng. & Comput. Sci., Queen's Univ., Belfast, UK
pp. 209-212
S. Sayayama , NTT Human Interface Labs., Kanagawa, Japan
S. Takahashi , NTT Human Interface Labs., Kanagawa, Japan
pp. 213-216
H. Chevalier , Dragon Systems Inc., Newton, MA, USA
C. Ingold , Dragon Systems Inc., Newton, MA, USA
C. Kunz , Dragon Systems Inc., Newton, MA, USA
C. Moore , Dragon Systems Inc., Newton, MA, USA
C. Roven , Dragon Systems Inc., Newton, MA, USA
J. Yamron , Dragon Systems Inc., Newton, MA, USA
B. Baker , Dragon Systems Inc., Newton, MA, USA
P. Bamberg , Dragon Systems Inc., Newton, MA, USA
S. Bridle , Dragon Systems Inc., Newton, MA, USA
T. Bruce , Dragon Systems Inc., Newton, MA, USA
A. Weader , Dragon Systems Inc., Newton, MA, USA
pp. 217-220
E. Eide , BBN Syst. & Technol. Corp., Cambridge, MA, USA
H. Gish , BBN Syst. & Technol. Corp., Cambridge, MA, USA
P. Jeanrenaud , BBN Syst. & Technol. Corp., Cambridge, MA, USA
A. Mielke , BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 221-224
E.P. Giachin , CSELT, Torino, Italy
pp. 225-228
C.D. Mitchell , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
M.P. Harper , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
L.H. Jamieson , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 229-232
G. Riccardi , Dept. of Speech Res., AT&T Bell Labs., Murray Hill, NJ, USA
E. Bocchieri , Dept. of Speech Res., AT&T Bell Labs., Murray Hill, NJ, USA
R. Pieraccini , Dept. of Speech Res., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 237-240
C.R. Watkins , Dept. of Speech Coding Res., AT&T Bell Labs., Murray Hill, NJ, USA
Juin-Hwey Chen , Dept. of Speech Coding Res., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 241-244
A. Husain , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
V. Cuperman , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
pp. 245-248
I. Shen , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
B. Tang , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
A. Alwan , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
G. Pottie , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 249-252
D. McElroy , Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
B.P. Murray , Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
A.D. Fagan , Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
pp. 253-256
Nam Phamdo , State Univ. of New York, Stony Brook, NY, USA
Cheng-Chieh Lee , Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
R. Laroia , Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
pp. 257-260
I.S. Burnett , Dept. of Electr. & Comput. Eng., Wollongong Univ., NSW, Australia
G.J. Bradley , Dept. of Electr. & Comput. Eng., Wollongong Univ., NSW, Australia
pp. 261-264
J. Thyssen , Tele Danmark Res., Horsholm, Denmark
H. Nielsen , Tele Danmark Res., Horsholm, Denmark
S.D. Hansen , Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
pp. 265-268
B. Kovesi , Dept. SC, ENSTBr, Brest, France
S. Saoudi , Dept. SC, ENSTBr, Brest, France
J.M. Boucher , Dept. SC, ENSTBr, Brest, France
Z. Reguly , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 269-272
S. Dimolitsas , COMSAT Lab., Clarksburg, MD, USA
F.L. Corcoran , COMSAT Lab., Clarksburg, MD, USA
C. Ravishankar , COMSAT Lab., Clarksburg, MD, USA
M. Baraniecki , Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 273-276
E.H. Lam , Hong Kong Univ. of Sci. & Technol., Hong Kong
O.C. Au , Hong Kong Univ. of Sci. & Technol., Hong Kong
C.C. Chan , Hong Kong Univ. of Sci. & Technol., Hong Kong
K.F. Hui , Hong Kong Univ. of Sci. & Technol., Hong Kong
S.F. Lau , Hong Kong Univ. of Sci. & Technol., Hong Kong
pp. 277-280
R.C. Rose , AT&T Bell Labs., Murray Hill, NJ, USA
B.H. Juang , AT&T Bell Labs., Murray Hill, NJ, USA
C.H. Lee , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 281-284
M.G. Rahim , AT&T Bell Labs., Murray Hill, NJ, USA
Chin-Hui Lee , AT&T Bell Labs., Murray Hill, NJ, USA
Biing-Hwang Juang , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 285-288
H. Kanazawa , Kansai Res. Lab., Toshiba Corp., Kobe, Japan
M. Tachimori , AT&T Bell Labs., Murray Hill, NJ, USA
Y. Takebayashi , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 289-292
T. Schultz , Interactive Syst. Lab., Karlsruhe Univ., Germany
I. Rogina , Interactive Syst. Lab., Karlsruhe Univ., Germany
pp. 293-296
M. Weintraub , Speech Technol. & Res. Program, SRI Int., Menlo Park, CA, USA
pp. 297-300
C. Tadj , Signal Dept., Telecom Paris, France
F. Poirier , Signal Dept., Telecom Paris, France
pp. 301-304
S.V. Kosonocky , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
R.J. Mammone , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 305-308
G.J.F. Jones , Dept. of Eng., Cambridge Univ., UK
J.T. Foote , Dept. of Eng., Cambridge Univ., UK
K. Sparck Jones , AT&T Bell Labs., Murray Hill, NJ, USA
S.J. Young , Hong Kong Univ. of Sci. & Technol., Hong Kong
pp. 309-312
J.H. Wright , Ensigma Ltd., Chepstow, UK
M.J. Carey , Ensigma Ltd., Chepstow, UK
E. Parris , Ensigma Ltd., Chepstow, UK
pp. 313-316
S. Hayakawa , Sch. of Eng., Nagoya Univ., Japan
F. Itakura , Sch. of Eng., Nagoya Univ., Japan
pp. 321-324
F. Itakura , Lincoln Lab., MIT, Lexington, MA, USA
T.F. Quatieri , Lincoln Lab., MIT, Lexington, MA, USA
D.A. Reynolds , Lincoln Lab., MIT, Lexington, MA, USA
pp. 325-328
D.A. Reynolds , Lincoln Lab., MIT, Lexington, MA, USA
M.A. Zissman , Lincoln Lab., MIT, Lexington, MA, USA
T.F. Quatieri , Lincoln Lab., MIT, Lexington, MA, USA
G.C. O'Leary , Lincoln Lab., MIT, Lexington, MA, USA
B.A. Carlson , Lincoln Lab., MIT, Lexington, MA, USA
pp. 329-332
M. Schmidt , BBN Syst. & Technol. Corp., Cambridge, MA, USA
H. Gish , BBN Syst. & Technol. Corp., Cambridge, MA, USA
A. Mielke , BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 333-336
W.Y. Hueng , ITT Aerosp. Commun., San Diego, CA, USA
B.D. Rao , BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 337-340
B.D. Rao , US Dept. of Defence, Fort Meade, MD, USA
pp. 341-344
Chi-Shi Liu , Telecommun. Lab., Minist. of Transportation & Commun., Taiwan
Hsiao-Chuan Wang , BBN Syst. & Technol. Corp., Cambridge, MA, USA
F.K. Soong , BBN Syst. & Technol. Corp., Cambridge, MA, USA
Chao-Shih Huang , Lincoln Lab., MIT, Lexington, MA, USA
pp. 345-348
K.R. Farrell , Dictaphone Corp., Stratford, CT, USA
pp. 349-352
M.M. Homayounpour , URA, CNRS, Paris, France
G. Chollet , BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 353-356
Han-Sheng Liou , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
R.J. Mammone , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 357-360
M.M. Thomson , Dept. of Electr. & Electron. Eng., Auckland Univ., New Zealand
pp. 361-364
M.M. Thomson , Lab. of Commun. & Signals, Sao Paulo Univ., Brazil
G.D. Tattersall , CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 365-368
E.G. Schukat-Talamazzini , Friedrich-Alexander Univ., Erlangen, Germany
J. Hornegger , Friedrich-Alexander Univ., Erlangen, Germany
H. Niemann , Friedrich-Alexander Univ., Erlangen, Germany
pp. 369-372
C. Rathinavelu , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
L. Deng , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
pp. 373-376
M.I. Markovic , Inst. of Appl. Math. & Electron., Belgrade, Serbia
B.D. Kovacevic , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
M.M. Milosaljevic , Friedrich-Alexander Univ., Erlangen, Germany
pp. 377-380
J. Pencak , Department of Defense, Ft. Meade, MD, USA
D. Nelson , Department of Defense, Ft. Meade, MD, USA
pp. 381-384
L. Deng , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
J. Nu , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
H. Sameti , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
pp. 385-388
C. Ris , TCTS Labs., Fac. Polytech. de Mons, Belgium
V. Fontaine , TCTS Labs., Fac. Polytech. de Mons, Belgium
H. Leich , TCTS Labs., Fac. Polytech. de Mons, Belgium
pp. 389-392
S. Celebi , Lab. of Comput. Neuroeng., Florida Univ., Gainesville, FL, USA
J.C. Principe , Lab. of Comput. Neuroeng., Florida Univ., Gainesville, FL, USA
pp. 393-396
N. Morgan , Int. Comput. Sci. Inst., Berkeley, CA, USA
H. Bourland , Int. Comput. Sci. Inst., Berkeley, CA, USA
S. Greenberg , Int. Comput. Sci. Inst., Berkeley, CA, USA
H. Hermansky , Int. Comput. Sci. Inst., Berkeley, CA, USA
Su-Lin Wu , Int. Comput. Sci. Inst., Berkeley, CA, USA
pp. 397-400
P.D. Green , Dept. of Comput. Sci., Sheffield Univ., UK
M.P. Cooke , Dept. of Comput. Sci., Sheffield Univ., UK
M.D. Crawford , Dept. of Comput. Sci., Sheffield Univ., UK
pp. 401-404
H. Hermansky , Dept. of Electr. Eng. & Appl. Phys., Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
E.A. Wan , Dept. of Electr. Eng. & Appl. Phys., Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
C. Avendano , Dept. of Electr. Eng. & Appl. Phys., Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 405-408
S. Sandhu , AT&T Bell Labs., Murray Hill, NJ, USA
O. Ghitza , AT&T Bell Labs., Murray Hill, NJ, USA
pp. 409-412
K.T. Assaleh , Motorola Inc., Scottsdale, AZ, USA
pp. 413-416
E. Erzin , Bilkent Univ., Ankara, Turkey
A.E. Cetin , AT&T Bell Labs., Murray Hill, NJ, USA
Y. Yardimci , Dept. of Electr. Eng. & Appl. Phys., Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 417-420
S. Kajita , Sch. of Eng., Nagoya Univ., Japan
F. Itakura , Sch. of Eng., Nagoya Univ., Japan
pp. 421-424
A. Moreno , Dept. of Signal Theor. & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
S. Tortola , Dept. of Signal Theor. & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
J. Vidal , Dept. of Signal Theor. & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
J.A.R. Fonollosa , Dept. of Signal Theor. & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 429-432
R. Yang , Nokia Res. Center, Tampere, Finland
P. Haavisto , Nokia Res. Center, Tampere, Finland
pp. 433-436
S.V. Vaseghi , Sch. of Inf. Syst., East Anglia Univ., Norwich, UK
B.P. Milner , Sch. of Inf. Syst., East Anglia Univ., Norwich, UK
pp. 437-440
T. Kosaka , ATR Interpreting Telephony Res. Labs., Kyoto, Japan
S. Matsunaga , ATR Interpreting Telephony Res. Labs., Kyoto, Japan
M. Kuraoka , Dept. of Signal Theor. & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 441-444
P. Geutner , Dept. of Comput. Sci., Karlsruhe Univ., Germany
pp. 445-448
Y. Normandin , CRIM, McGill Univ., Montreal, Que., Canada
pp. 449-452
T. Sloboda , Interactive Syst. Lab., Karlsruhe Univ., Germany
pp. 453-456
Y. Goto , Div. of Eng., Brown Univ., Providence, RI, USA
M.M. Hochberg , ATR Interpreting Telephony Res. Labs., Kyoto, Japan
D.J. Mashao , Dept. of Signal Theor. & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
H.F. Silverman , Dept. of Signal Theor. & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 457-460
J.T. Foote , Dept. of Eng., Cambridge Univ., UK
pp. 461-464
A. Mellouk , LRI, CNRS, Orsay, France
P. Gallinari , ATR Interpreting Telephony Res. Labs., Kyoto, Japan
pp. 465-468
J. Song , Dept. of Electr. & Comput. Eng., Wollongong Univ., NSW, Australia
pp. 469-472
D. Kanevsky , T.J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 473-476
T. Kemp , Karlsruhe Univ., Germany
pp. 477-479
B. Mouy , Thomson-CSF, Gennevilliers, France
P. De La Noue , Thomson-CSF, Gennevilliers, France
G. Goudezeune , Thomson-CSF, Gennevilliers, France
pp. 480-483
M. Nishiguchi , InfoCom Products Co., Sony Corp., Tokyo, Japan
J. Matsumoto , InfoCom Products Co., Sony Corp., Tokyo, Japan
pp. 484-487
M.A. Kohler , US Dept. of Defence, Meade, MD, USA
L.M. Supplee , US Dept. of Defence, Meade, MD, USA
T.E. Tremain , US Dept. of Defence, Meade, MD, USA
pp. 488-491
A. Das , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Gersho , Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
pp. 492-495
V. Cuperman , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
P. Lupini , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
B. Bhattacharya , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
pp. 496-499
P.A. Laurent , Speech Group, Thomson-CSF, Gennevilliers, France
P. De La Noue , Speech Group, Thomson-CSF, Gennevilliers, France
pp. 500-503
Gao Yang , Lernout & Hauspie Speech Products n.v., Mons, Belgium
G. Zanellato , Lernout & Hauspie Speech Products n.v., Mons, Belgium
H. Leich , Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
pp. 504-507
W.B. Kleijn , Lab. of Inf. Principles Res., AT&T Bell Labs., Murray Hill, NJ, USA
J. Haagen , Lab. of Inf. Principles Res., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 508-511
R. Taori , Signal Process. Group, Philips Res. Lab., Eindhoven, Netherlands
R.J. Sluijter , Signal Process. Group, Philips Res. Lab., Eindhoven, Netherlands
E. Kathmann , Signal Process. Group, Philips Res. Lab., Eindhoven, Netherlands
pp. 512-515
H. Yang , Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
S.-N. Koh , Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
P. Sivaprakasapillai , Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
pp. 516-519
S. Takahashi , NTT Human Interface Labs., Kanagawa, Japan
S. Sagayama , NTT Human Interface Labs., Kanagawa, Japan
pp. 520-523
C. Dugast , Philips Res. Lab., Aachen, Germany
P. Beyerlein , Philips Res. Lab., Aachen, Germany
R. Haeb-Umbach , Philips Res. Lab., Aachen, Germany
pp. 524-527
M.D. Monkowski , Human Language Technol. Group, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny , Human Language Technol. Group, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P. Srinivasa Rao , Human Language Technol. Group, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 528-531
Jun He , Fac. Polytech. de Mons, Belgium
H. Leich , Fac. Polytech. de Mons, Belgium
pp. 532-535
W.J. Holmes , Speech Res. Unit, DRA Malvern, UK
M.J. Russell , Speech Res. Unit, DRA Malvern, UK
pp. 536-539
H. Lucke , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
pp. 540-543
F. Wolfertstetter , Inst. for Human-Machine-Commun., Munich Univ. of Technol., Germany
G. Ruske , Inst. for Human-Machine-Commun., Munich Univ. of Technol., Germany
pp. 544-547
D. Burshtein , Dept. of Electr. Eng.-Syst., Tel Aviv Univ., Israel
pp. 548-551
R. Kuhn , Centre de Recherche Inf. de Montreal, Que., Canada
A. Lazarides , Centre de Recherche Inf. de Montreal, Que., Canada
Y. Normandin , Centre de Recherche Inf. de Montreal, Que., Canada
J. Brousseau , Centre de Recherche Inf. de Montreal, Que., Canada
pp. 552-555
T. Watanabe , Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
K. Shinoda , Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
K. Takagi , Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
K.-I. Iso , Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 556-559
P. Laface , Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
C. Vair , Dipartimento di Autom. e Inf., Politecnico di Torino, Italy
L. Fissore , Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 560-563
Z. Li , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
P. Kenny , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
D. O'Shaughnessy , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
pp. 564-567
R. De Mori , Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
C. Snow , Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
M. Galler , Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
pp. 568-571
P.S. Gopalakrishnan , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
L.R. Bahl , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
R.L. Mercer , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 572-575
F. Richardson , Dept. of Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
M. Ostendorf , Dept. of Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
J.R. Rohlicek , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 576-579
T. Moudenc , CNET, Lannion, France
D. Jouvet , CNET, Lannion, France
J. Monne , CNET, Lannion, France
pp. 580-583
T. Shimizu , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
S. Monzen , CNET, Lannion, France
H. Singer , CNET, Lannion, France
S. Matsunaga , Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 584-587
G. Antoniol , Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
F. Brugnara , Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
M. Cettolo , Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
M. Federico , Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
pp. 588-591
S. Patel , Bellcore, Morristown, NJ, USA
pp. 592-595
S. Renals , Dept. of Comput. Sci., Sheffield Univ., UK
M. Hochberg , Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
pp. 596-599
D. O'Shaughnessy , INRS-Telecommun., Quebec Univ., Verdun, Que., Canada
pp. 600-603
S. Fujio , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
Y. Sagisaka , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
N. Higuchi , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
pp. 604-607
L.F.M. ten Bosch , Inst. for Perception Res., Eindhoven, Netherlands
pp. 608-611
M.A. Siegler , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
R.M. Stern , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 612-615
Shaw-Hwa Hwang , Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Sin-Horng Chen , Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 616-619
K. Ward , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
D.G. Novick , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 620-623
M. Nakai , Tohoku Univ., Sendai, Japan
H. Singer , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
Y. Sagisaka , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
H. Shimodaira , Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
pp. 624-627
A. Anastasakos , Northeastern Univ., Boston, MA, USA
R. Schwartz , Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
Han Shu , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
pp. 628-631
S. Potisuk , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
M.P. Harper , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
J.T. Gandour , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
pp. 632-635
F.M. Gimenez de los Galanes , ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
M.H. Savoji , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
J.M. Pardo , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
pp. 636-639
R.E. Donovan , Dept. of Eng., Cambridge Univ., UK
P.C. Woodland , Dept. of Eng., Cambridge Univ., UK
pp. 640-643
J. Slifka , Syst. Res. Labs. Inc., Dayton, OH, USA
T.R. Anderson , Dept. of Eng., Cambridge Univ., UK
pp. 644-647
J.C. Rutledge , Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
K.E. Cummings , Dept. of Eng., Cambridge Univ., UK
D.A. Lambert , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
M.A. Clements , Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
pp. 648-651
H. Yehia , Sch. of Eng., Nagoya Univ., Japan
M. Honda , Dept. of Eng., Cambridge Univ., UK
F. Itakura , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
pp. 652-655
E.R. Banga , ETSI Telecomunicacion, Vigo Univ., Spain
C. Garcia-Mateo , ETSI Telecomunicacion, Vigo Univ., Spain
pp. 656-659
K. Tokuda , Dept. of Electr. & Electron. Eng., Tokyo Inst. of Technol., Japan
T. Kobayashi , ETSI Telecomunicacion, Vigo Univ., Spain
S. Imai , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
pp. 660-663
S.E. Bou-Ghazale , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
J.H.L. Hansen , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 664-667
K.F. Lam , Dept. of Electron. Eng., City Polytech. of Hong Kong, Hong Kong
C.F. Chan , Dept. of Electron. Eng., City Polytech. of Hong Kong, Hong Kong
pp. 668-671
K.E. Cummings , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
J.G. Maloney , Dept. of Electron. Eng., City Polytech. of Hong Kong, Hong Kong
M.A. Clements , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
pp. 672-675
G. Zavaliagkos , Northeastern Univ., Boston, MA, USA
R. Schwartz , Dept. of Electron. Eng., City Polytech. of Hong Kong, Hong Kong
J. Makhoul , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
pp. 676-679
V. Digalakis , Speech Technol. & Res. Lab., SRI Int., Menlo Park, CA, USA
L. Neumeyer , Speech Technol. & Res. Lab., SRI Int., Menlo Park, CA, USA
pp. 680-683
S.M. Ahadi , Dept. of Eng., Cambridge Univ., UK
P.C. Woodland , Dept. of Eng., Cambridge Univ., UK
pp. 684-687
M. Tonomura , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
T. Kosaka , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
S. Matsunaga , ATR Interpreting Telecommun. Res. Labs., Kyoto, Japan
pp. 688-691
J.R. Bellegarda , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.V. de Souza , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M. Padmanabhan , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
L.R. Bahl , IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 692-695
J. Takahashi , NTT Human Interface Labs., Kanagawa, Japan
S. Sagayama , NTT Human Interface Labs., Kanagawa, Japan
pp. 696-699
S.J. Cox , Sch. of Inf. Syst., East Anglia Univ., Norwich, UK
pp. 700-703
Qiang Huo , Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
Chorkin Chan , Dept. of Comput. Sci., Hong Kong Univ., Hong Kong
pp. 708-711
Yunxin Zhao , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 712-715
Minjie Xie , Dept. of Electr. & Comput. Eng., Sherbrooke Univ., Que., Canada
J.-P. Adoul , Dept. of Electr. & Comput. Eng., Sherbrooke Univ., Que., Canada
pp. 716-719
H.R.S. Mohammadi , Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
W.H. Holmes , Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
pp. 720-723
S. Bruhn , Inst. for Telecommun., Tech. Univ. Berlin, Germany
pp. 724-727
A. Goalic , Dept. of Signals & Commun., ENST de Bretagne, Brest, France
S. Saoudi , Dept. of Signals & Commun., ENST de Bretagne, Brest, France
pp. 728-731
H. Petter Knagenhjelm , Speech Coding Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
W. Bastiaan Kleijn , Speech Coding Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 732-735
Dong-Il Chang , Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
Young-Kwon Cho , Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
Souguil Ann , Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
pp. 736-739
C.S. Xydeas , Sch. of Eng., Manchester Univ., UK
C. Papanastasiou , Sch. of Eng., Manchester Univ., UK
pp. 740-743
J.S. Collura , US Dept. of Defense, USA
T.E. Tremain , US Dept. of Defense, USA
pp. 744-747
R. Hagen , Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
E. Paksoy , US Dept. of Defense, USA
A. Gersho , Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
pp. 748-751
W.R. Gardner , Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
B.D. Rao , US Dept. of Defense, USA
pp. 752-755
T. Abe , Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
T. Kobayashi , Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
S. Imai , Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
pp. 756-759
C. D'Alessandro , Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
B. Yegnanarayana , Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
V. Darsinos , Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
pp. 760-763
Shan Lu , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
P.C. Doerschuk , Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 764-767
J.S. Erkelens , Dept. of Appl. Phys., Delft Univ. of Technol., Netherlands
P.M.T. Broersen , Dept. of Appl. Phys., Delft Univ. of Technol., Netherlands
pp. 768-771
H.M. Hanson , Div. of Appl. Sci., Harvard Univ., Cambridge, MA, USA
pp. 772-775
B. Yegnanarayana , Indian Inst. of Technol., Madras, India
R.L.H.M. Smits , Dept. of Appl. Phys., Delft Univ. of Technol., Netherlands
pp. 776-779
V. Goncharoff , Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
M. Kaine-Krolak , Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
pp. 780-783
A. Potamianos , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
P. Maragos , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 784-787
F. Diaz-de-Maria , Dept. de Electron., Cantabria Univ., Santander, Spain
A.R. Figueiras-Vidal , Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 788-791
M. Rangoussi , Dept. of Electr. Eng., Nat. Tech. Univ. of Athens, Greece
A. Delopoulos , Dept. of Electr. Eng., Nat. Tech. Univ. of Athens, Greece
pp. 792-795
N. Virag , Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
pp. 796-799
A. Akbari Azirani , Lab. Traitement du Signal et de l'Image, Rennes I Univ., France
R. Le Bouquin Jeannes , Lab. Traitement du Signal et de l'Image, Rennes I Univ., France
G. Faucon , Lab. Traitement du Signal et de l'Image, Rennes I Univ., France
pp. 800-803
Y. Ephraim , Dept. of Electr. & Comput. Eng., George Mason Univ., Fairfax, VA, USA
H.L. van Trees , Dept. of Electr. & Comput. Eng., George Mason Univ., Fairfax, VA, USA
pp. 804-807
H. Sheikhzadeh , Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
R.L. Brennan , Dept. of Electr. & Comput. Eng., George Mason Univ., Fairfax, VA, USA
H. Sameti , Lab. Traitement du Signal et de l'Image, Rennes I Univ., France
pp. 808-811
L. Arslan , Syst. & Inf. Sci. Lab., Texas Instrum. Inc., Dallas, TX, USA
A. McCree , Syst. & Inf. Sci. Lab., Texas Instrum. Inc., Dallas, TX, USA
V. Viswanathan , Syst. & Inf. Sci. Lab., Texas Instrum. Inc., Dallas, TX, USA
pp. 812-815
E.B. George , Signal Process. Center of Technol., Lockheed Sanders Inc., Nashua, NH, USA
pp. 816-819
T.S. Sun , Martin Marietta Labs., Baltimore, MD, USA
S. Nandkumar , Martin Marietta Labs., Baltimore, MD, USA
J. Carmody , Martin Marietta Labs., Baltimore, MD, USA
J. Rothweiler , Martin Marietta Labs., Baltimore, MD, USA
A. Goldschen , Martin Marietta Labs., Baltimore, MD, USA
N. Russell , Martin Marietta Labs., Baltimore, MD, USA
S. Mpasi , Martin Marietta Labs., Baltimore, MD, USA
P. Green , Martin Marietta Labs., Baltimore, MD, USA
pp. 820-823
Z.B. Nossair , Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
P.L. Silsbee , Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
S.A. Zahorian , Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
pp. 824-827
D.P. Morgan , Signal Process. Center of Technol., Lockheed Sanders Inc., Nashua, NH, USA
E.B. George , Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
L.T. Lee , Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
S.M. Kay , Martin Marietta Labs., Baltimore, MD, USA
pp. 828-831
C.D. Yoo , Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.S. Lim , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 832-835
J.H.L. Hansen , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
L.M. Arslan , Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
pp. 836-839
R. Haeb-Umbach , Philips GmbH Forschungslab., Aachen, Germany
P. Beyerlein , Philips GmbH Forschungslab., Aachen, Germany
E. Thelen , Philips GmbH Forschungslab., Aachen, Germany
pp. 840-843
S.L. do N. Cunha Costa , Dept. de Engenharia Eletrica, Univ. Federal de Pernambuco, Campina Grande, Brazil
B.G. Aguiar Neto , Philips GmbH Forschungslab., Aachen, Germany
pp. 844-847
U. Bub , Carnegie Mellon Univ., Pittsburgh, PA, USA
M. Hunke , Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel , Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 848-851
J.-C. Junqua , Speech Technol. Lab., Panasonic Technol. Inc., Santa Barbara, CA, USA
S. Valente , Speech Technol. Lab., Panasonic Technol. Inc., Santa Barbara, CA, USA
D. Fohr , Carnegie Mellon Univ., Pittsburgh, PA, USA
J.-F. Mari , Martin Marietta Labs., Baltimore, MD, USA
pp. 852-855
M. Betz , Karlsruhe Univ., Germany
H. Hild , Karlsruhe Univ., Germany
pp. 856-859
D. Giuliani , Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
M. Matassoni , Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
M. Omologo , Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
P. Svaizer , Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
pp. 860-863
T. Imai , NHK Sci. & Tech. Res. Labs., Tokyo, Japan
A. Ando , NHK Sci. & Tech. Res. Labs., Tokyo, Japan
E. Miyasaka , NHK Sci. & Tech. Res. Labs., Tokyo, Japan
pp. 864-867
D.L. Jennings , Dept. of Electr. & Comput. Eng., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
D.W. Ruck , Dept. of Electr. & Comput. Eng., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
pp. 868-871
B. Gidas , Div. of Appl. Math., Brown Univ., Providence, RI, USA
A. Murua , Dept. of Electr. & Comput. Eng., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
pp. 872-875
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