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Acoustics, Speech, and Signal Processing, 1995. ICASSP-95 Vol 1., 1995 International Conference on
Detroit, MI, USA
May 09-May 12
ISBN: 0-7803-2431-5
Table of Contents
M. Serizawa, C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
K. Ozawa, C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 1-4
P. Kroon, AT&T Bell Labs., Murray Hill, NJ, USA
M. Recchione, C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 5-8
Juin-Hwey Chen, Speech Coding Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 9-12
P. Hedelin, Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
T. Eriksson, Dept. of Inf. Theory, Chalmers Univ. of Technol., Goteborg, Sweden
pp. 17-20
T. Wigren, Ericsson Radio Syst. AB, Stockholm, Sweden
A. Bergstrom, Ericsson Radio Syst. AB, Stockholm, Sweden
S. Harrysson, Ericsson Radio Syst. AB, Stockholm, Sweden
F. Jansson, Ericsson Radio Syst. AB, Stockholm, Sweden
H. Nilson, Ericsson Radio Syst. AB, Stockholm, Sweden
pp. 25-28
A. Kataoka, NTT Human Interface Labs., Tokyo, Japan
S. Hosaka, NTT Human Interface Labs., Tokyo, Japan
J. Ikedo, Ericsson Radio Syst. AB, Stockholm, Sweden
T. Moriya, Ericsson Radio Syst. AB, Stockholm, Sweden
S. Hayashi, Ericsson Radio Syst. AB, Stockholm, Sweden
pp. 29-32
K. Koishida, Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
K. Tokuda, NTT Human Interface Labs., Tokyo, Japan
T. Kobayashi, Ericsson Radio Syst. AB, Stockholm, Sweden
S. Imai, Ericsson Radio Syst. AB, Stockholm, Sweden
pp. 33-36
Shude Zhang, Dept. of Electron. & Electr. Eng., Leeds Univ., UK
G. Lockhart, Dept. of Electron. & Electr. Eng., Leeds Univ., UK
pp. 37-40
L.R. Bahl, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
S. Balakrishnan-Aiyer, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
J.R. Bellgarda, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M. Franz, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
P.S. Gopalakrishnan, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
D. Nahamoo, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M. Novak, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M. Padmanabhan, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
S. Roukos, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 41-44
X. Aubert, Philips Res. Lab., Aachen, Germany
H. Ney, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 49-52
P. Jeanrenaud, BBN Syst. & Technol. Corp., Cambridge, MA, USA
E. Eide, BBN Syst. & Technol. Corp., Cambridge, MA, USA
U. Chaudhari, BBN Syst. & Technol. Corp., Cambridge, MA, USA
J. McDonough, BBN Syst. & Technol. Corp., Cambridge, MA, USA
K. Ng, BBN Syst. & Technol. Corp., Cambridge, MA, USA
M. Siu, BBN Syst. & Technol. Corp., Cambridge, MA, USA
H. Gish, BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 53-56
Ren-Yuan Lyu, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Lee-Feng Chien, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Shiao-Hong Hwang, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Hung-Yun Hsieh, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Rung-Chiuan Yang, BBN Syst. & Technol. Corp., Cambridge, MA, USA
Bo-Ren Bai, BBN Syst. & Technol. Corp., Cambridge, MA, USA
Jia-Chi Weng, BBN Syst. & Technol. Corp., Cambridge, MA, USA
Yen-Ju Yang, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Shi-Wei Lin, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Keh-Jiann Chen, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 57-60
Hsin-Min Wang, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Jia-Lin Shen, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Yen-Ju Yang, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Chiu-Yu Tseng, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Lin-Shan Lee, BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 61-64
J.L. Gauvain, Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
L. Lamel, Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
M. Adda-Decker, Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
pp. 65-68
M.M. Hochberg, Dept. of Eng., Cambridge Univ., UK
S.J. Renals, Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
A.J. Robinson, Lab. d'Informatique pour la Mecanique et les Sci. de l'Ingenieur, CNRS, Orsay, France
G.D. Cook, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 69-72
P.C. Woodland, Dept. of Eng., Cambridge Univ., UK
C.J. Leggetter, Dept. of Eng., Cambridge Univ., UK
J.J. Odell, Dept. of Eng., Cambridge Univ., UK
V. Valtchev, Dept. of Eng., Cambridge Univ., UK
S.J. Young, Dept. of Eng., Cambridge Univ., UK
pp. 73-76
Yuqing Gao, Inst. of Syst. Sci., Nat. Univ. of Singapore, Singapore
Hsiao-Wuen Hon, Inst. of Syst. Sci., Nat. Univ. of Singapore, Singapore
Zhiwei Lin, Inst. of Syst. Sci., Nat. Univ. of Singapore, Singapore
G. Loudon, Inst. of Syst. Sci., Nat. Univ. of Singapore, Singapore
S. Yogananthan, Inst. of Syst. Sci., Nat. Univ. of Singapore, Singapore
Baosheng Yuan, Inst. of Syst. Sci., Nat. Univ. of Singapore, Singapore
pp. 77-80
T. Robinson, Dept. of Eng., Cambridge Univ., UK
J. Fransen, Dept. of Eng., Cambridge Univ., UK
D. Pye, Dept. of Eng., Cambridge Univ., UK
J. Foote, Dept. of Eng., Cambridge Univ., UK
S. Renals, Dept. of Eng., Cambridge Univ., UK
pp. 81-84
Y. Muthusamy, Syst. & Inf. Sci. Lab., Texas Instrum. Inc., Dallas, TX, USA
E. Holliman, Syst. & Inf. Sci. Lab., Texas Instrum. Inc., Dallas, TX, USA
B. Wheatley, Syst. & Inf. Sci. Lab., Texas Instrum. Inc., Dallas, TX, USA
J. Picone, Dept. of Eng., Cambridge Univ., UK
J. Godfrey, Dept. of Eng., Cambridge Univ., UK
pp. 85-88
Yeonja Lim, Autom. Interpretation Section, Electron. & Telecommun. Res. Inst., Seoul, South Korea
Youngjik Lee, Autom. Interpretation Section, Electron. & Telecommun. Res. Inst., Seoul, South Korea
pp. 89-92
Xuedong Huang, Microsoft Corp., Redmond, WA, USA
A. Acero, Microsoft Corp., Redmond, WA, USA
F. Alleva, Microsoft Corp., Redmond, WA, USA
Mei-Yuh Hwang, Microsoft Corp., Redmond, WA, USA
Li Jiang, Microsoft Corp., Redmond, WA, USA
M. Mahajan, Microsoft Corp., Redmond, WA, USA
pp. 93-96
L. Mayfield, Interactive Syst. Lab., Carnegie Mellon Univ., Pittsburgh, PA, USA
M. Gavalda, Interactive Syst. Lab., Carnegie Mellon Univ., Pittsburgh, PA, USA
W. Ward, Interactive Syst. Lab., Carnegie Mellon Univ., Pittsburgh, PA, USA
A. Waibel, Interactive Syst. Lab., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 97-100
J.F. Pitrelli, NYNEX Corp., White Plains, NY, USA
C. Fong, NYNEX Corp., White Plains, NY, USA
S.H. Wong, NYNEX Corp., White Plains, NY, USA
J.R. Spitz, NYNEX Corp., White Plains, NY, USA
H.C. Leung, NYNEX Corp., White Plains, NY, USA
pp. 101-104
K.L. Brown, Signal Process. Center of Technol., Lockheed Sanders Avionics, Nashua, NH, USA
E.B. George, Signal Process. Center of Technol., Lockheed Sanders Avionics, Nashua, NH, USA
pp. 105-108
P. Duchnowski, Interactive Syst. Lab., Karlsruhe Univ., Germany
M. Hunke, Interactive Syst. Lab., Karlsruhe Univ., Germany
D. Busching, Interactive Syst. Lab., Karlsruhe Univ., Germany
U. Meier, Interactive Syst. Lab., Karlsruhe Univ., Germany
A. Waibel, Interactive Syst. Lab., Karlsruhe Univ., Germany
pp. 109-112
V.M. Jimenez, Dept. de Sistemas Inf. y Comput., Univ. Politecnica de Valencia, Spain
A. Castellanos, Dept. de Sistemas Inf. y Comput., Univ. Politecnica de Valencia, Spain
E. Vidal, Dept. de Sistemas Inf. y Comput., Univ. Politecnica de Valencia, Spain
pp. 113-116
Nam-Yong Han, Electron. & Telecommun. Res. Inst., Seoul, South Korea
Hoi-Rin Kim, Electron. & Telecommun. Res. Inst., Seoul, South Korea
Kyu-Woong Hwang, Electron. & Telecommun. Res. Inst., Seoul, South Korea
Young-Mok Ahn, Electron. & Telecommun. Res. Inst., Seoul, South Korea
Joon-Hyung Ryoo, Electron. & Telecommun. Res. Inst., Seoul, South Korea
pp. 117-120
A. Sankar, AT&T Bell Labs., Murray Hill, NJ, USA
Chin-Hui Lee, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 121-124
Y. Minami, NTT Human Interface Labs., Tokyo, Japan
S. Furui, NTT Human Interface Labs., Tokyo, Japan
pp. 129-132
M.J.F. Gales, Dept. of Eng., Cambridge Univ., UK
S.J. Young, Dept. of Eng., Cambridge Univ., UK
pp. 133-136
P.J. Moreno, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
B. Raj, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
E. Gouvea, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
R.M. Stern, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 137-140
L. Neumeyer, Speech Technol. & Res. Lab., SRI Int., Menlo Park, CA, USA
M. Weintraub, Speech Technol. & Res. Lab., SRI Int., Menlo Park, CA, USA
pp. 141-144
Seokyong Moon, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
Jenq-Neng Hwang, Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
pp. 145-148
K. Takagi, C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
H. Hattori, C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
T. Watanabe, C&C Inf. Technol. Res. Labs., NEC Corp., Kawasaki, Japan
pp. 149-152
H.G. Hirsch, Inst. of Commun. Syst. & Data Process., Tech. Hochschule Aachen, Germany
C. Ehrlicher, Inst. of Commun. Syst. & Data Process., Tech. Hochschule Aachen, Germany
pp. 153-156
D. Naik, CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 157-160
P.S. Rao, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.D. Monkowski, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
S. Roukos, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 161-164
M. Tamoto, NTT Basic Res. Labs., Kanagawa, Japan
T. Kawabata, NTT Basic Res. Labs., Kanagawa, Japan
pp. 165-168
H. Lloyd-Thomas, Ensigma Ltd., Chepstow, UK
J.H. Wright, Ensigma Ltd., Chepstow, UK
G.J.F. Jones, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 173-176
R. Kneser, Philips GmbH Forschungslab., Aachen, Germany
H. Ney, Ensigma Ltd., Chepstow, UK
pp. 181-184
G. Bordel, Dept. de Electr. y Electron., Pais Vasco Univ., Bilbao, Spain
I. Torres, Dept. de Electr. y Electron., Pais Vasco Univ., Bilbao, Spain
E. Vidal, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
pp. 185-188
D. Jurafsky, Int. Comput. Sci. Inst., Berkeley, CA, USA
C. Wooters, Int. Comput. Sci. Inst., Berkeley, CA, USA
J. Segal, Int. Comput. Sci. Inst., Berkeley, CA, USA
A. Stolcke, Int. Comput. Sci. Inst., Berkeley, CA, USA
E. Fosler, Int. Comput. Sci. Inst., Berkeley, CA, USA
G. Tajchaman, Int. Comput. Sci. Inst., Berkeley, CA, USA
N. Morgan, Int. Comput. Sci. Inst., Berkeley, CA, USA
pp. 189-192
K. Ries, Karlsruhe Univ., Germany
K. Ries, Karlsruhe Univ., Germany
Ye-Yi Wang, Int. Comput. Sci. Inst., Berkeley, CA, USA
pp. 193-196
C. Pateras, Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
G. Dudek, Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
R. De Mori, Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
pp. 197-200
D.X. Sun, Dept. of Appl. Math. & Stat., State Univ. of New York, Stony Brook, NY, USA
Li Deng, Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
pp. 201-204
F.J. Smith, Sch. of Electr. Eng. & Comput. Sci., Queen's Univ., Belfast, UK
J. Ming, Sch. of Electr. Eng. & Comput. Sci., Queen's Univ., Belfast, UK
P. O'Boyle, Sch. of Electr. Eng. & Comput. Sci., Queen's Univ., Belfast, UK
A.D. Irvine, Sch. of Electr. Eng. & Comput. Sci., Queen's Univ., Belfast, UK
pp. 209-212
S. Sayayama, NTT Human Interface Labs., Kanagawa, Japan
S. Takahashi, NTT Human Interface Labs., Kanagawa, Japan
pp. 213-216
H. Chevalier, Dragon Systems Inc., Newton, MA, USA
C. Ingold, Dragon Systems Inc., Newton, MA, USA
C. Kunz, Dragon Systems Inc., Newton, MA, USA
C. Moore, Dragon Systems Inc., Newton, MA, USA
C. Roven, Dragon Systems Inc., Newton, MA, USA
J. Yamron, Dragon Systems Inc., Newton, MA, USA
B. Baker, Dragon Systems Inc., Newton, MA, USA
P. Bamberg, Dragon Systems Inc., Newton, MA, USA
S. Bridle, Dragon Systems Inc., Newton, MA, USA
T. Bruce, Dragon Systems Inc., Newton, MA, USA
A. Weader, Dragon Systems Inc., Newton, MA, USA
pp. 217-220
E. Eide, BBN Syst. & Technol. Corp., Cambridge, MA, USA
H. Gish, BBN Syst. & Technol. Corp., Cambridge, MA, USA
P. Jeanrenaud, BBN Syst. & Technol. Corp., Cambridge, MA, USA
A. Mielke, BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 221-224
C.D. Mitchell, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
M.P. Harper, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
L.H. Jamieson, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
pp. 229-232
G. Riccardi, Dept. of Speech Res., AT&T Bell Labs., Murray Hill, NJ, USA
E. Bocchieri, Dept. of Speech Res., AT&T Bell Labs., Murray Hill, NJ, USA
R. Pieraccini, Dept. of Speech Res., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 237-240
C.R. Watkins, Dept. of Speech Coding Res., AT&T Bell Labs., Murray Hill, NJ, USA
Juin-Hwey Chen, Dept. of Speech Coding Res., AT&T Bell Labs., Murray Hill, NJ, USA
pp. 241-244
A. Husain, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
V. Cuperman, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
pp. 245-248
I. Shen, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
B. Tang, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
A. Alwan, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
G. Pottie, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 249-252
D. McElroy, Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
B.P. Murray, Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
A.D. Fagan, Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
pp. 253-256
Nam Phamdo, State Univ. of New York, Stony Brook, NY, USA
Cheng-Chieh Lee, Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
R. Laroia, Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
pp. 257-260
I.S. Burnett, Dept. of Electr. & Comput. Eng., Wollongong Univ., NSW, Australia
G.J. Bradley, Dept. of Electr. & Comput. Eng., Wollongong Univ., NSW, Australia
pp. 261-264
J. Thyssen, Tele Danmark Res., Horsholm, Denmark
H. Nielsen, Tele Danmark Res., Horsholm, Denmark
S.D. Hansen, Dept. of Electron. & Electr. Eng., Univ. Coll. Dublin, Ireland
pp. 265-268
B. Kovesi, Dept. SC, ENSTBr, Brest, France
S. Saoudi, Dept. SC, ENSTBr, Brest, France
J.M. Boucher, Dept. SC, ENSTBr, Brest, France
Z. Reguly, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 269-272
S. Dimolitsas, COMSAT Lab., Clarksburg, MD, USA
F.L. Corcoran, COMSAT Lab., Clarksburg, MD, USA
C. Ravishankar, COMSAT Lab., Clarksburg, MD, USA
M. Baraniecki, Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
pp. 273-276
E.H. Lam, Hong Kong Univ. of Sci. & Technol., Hong Kong
O.C. Au, Hong Kong Univ. of Sci. & Technol., Hong Kong
C.C. Chan, Hong Kong Univ. of Sci. & Technol., Hong Kong
K.F. Hui, Hong Kong Univ. of Sci. & Technol., Hong Kong
S.F. Lau, Hong Kong Univ. of Sci. & Technol., Hong Kong
pp. 277-280
R.C. Rose, AT&T Bell Labs., Murray Hill, NJ, USA
B.H. Juang, AT&T Bell Labs., Murray Hill, NJ, USA
C.H. Lee, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 281-284
M.G. Rahim, AT&T Bell Labs., Murray Hill, NJ, USA
Chin-Hui Lee, AT&T Bell Labs., Murray Hill, NJ, USA
Biing-Hwang Juang, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 285-288
H. Kanazawa, Kansai Res. Lab., Toshiba Corp., Kobe, Japan
M. Tachimori, AT&T Bell Labs., Murray Hill, NJ, USA
Y. Takebayashi, AT&T Bell Labs., Murray Hill, NJ, USA
pp. 289-292
T. Schultz, Interactive Syst. Lab., Karlsruhe Univ., Germany
I. Rogina, Interactive Syst. Lab., Karlsruhe Univ., Germany
pp. 293-296
M. Weintraub, Speech Technol. & Res. Program, SRI Int., Menlo Park, CA, USA
pp. 297-300
C. Tadj, Signal Dept., Telecom Paris, France
F. Poirier, Signal Dept., Telecom Paris, France
pp. 301-304
S.V. Kosonocky, CAIP Center, Rutgers Univ., Piscataway, NJ, USA
R.J. Mammone, CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 305-308
G.J.F. Jones, Dept. of Eng., Cambridge Univ., UK
J.T. Foote, Dept. of Eng., Cambridge Univ., UK
K. Sparck Jones, AT&T Bell Labs., Murray Hill, NJ, USA
S.J. Young, Hong Kong Univ. of Sci. & Technol., Hong Kong
pp. 309-312
J.H. Wright, Ensigma Ltd., Chepstow, UK
M.J. Carey, Ensigma Ltd., Chepstow, UK
E. Parris, Ensigma Ltd., Chepstow, UK
pp. 313-316
F. Itakura, Lincoln Lab., MIT, Lexington, MA, USA
T.F. Quatieri, Lincoln Lab., MIT, Lexington, MA, USA
D.A. Reynolds, Lincoln Lab., MIT, Lexington, MA, USA
pp. 325-328
D.A. Reynolds, Lincoln Lab., MIT, Lexington, MA, USA
M.A. Zissman, Lincoln Lab., MIT, Lexington, MA, USA
T.F. Quatieri, Lincoln Lab., MIT, Lexington, MA, USA
G.C. O'Leary, Lincoln Lab., MIT, Lexington, MA, USA
B.A. Carlson, Lincoln Lab., MIT, Lexington, MA, USA
pp. 329-332
M. Schmidt, BBN Syst. & Technol. Corp., Cambridge, MA, USA
H. Gish, BBN Syst. & Technol. Corp., Cambridge, MA, USA
A. Mielke, BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 333-336
W.Y. Hueng, ITT Aerosp. Commun., San Diego, CA, USA
B.D. Rao, BBN Syst. & Technol. Corp., Cambridge, MA, USA
pp. 337-340
Chi-Shi Liu, Telecommun. Lab., Minist. of Transportation & Commun., Taiwan
Hsiao-Chuan Wang, BBN Syst. & Technol. Corp., Cambridge, MA, USA
F.K. Soong, BBN Syst. & Technol. Corp., Cambridge, MA, USA
Chao-Shih Huang, Lincoln Lab., MIT, Lexington, MA, USA
pp. 345-348
Han-Sheng Liou, CAIP Center, Rutgers Univ., Piscataway, NJ, USA
R.J. Mammone, CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 357-360
M.M. Thomson, Lab. of Commun. & Signals, Sao Paulo Univ., Brazil
G.D. Tattersall, CAIP Center, Rutgers Univ., Piscataway, NJ, USA
pp. 365-368
E.G. Schukat-Talamazzini, Friedrich-Alexander Univ., Erlangen, Germany
J. Hornegger, Friedrich-Alexander Univ., Erlangen, Germany
H. Niemann, Friedrich-Alexander Univ., Erlangen, Germany
pp. 369-372
C. Rathinavelu, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
L. Deng, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
pp. 373-376
M.I. Markovic, Inst. of Appl. Math. & Electron., Belgrade, Serbia
B.D. Kovacevic, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
M.M. Milosaljevic, Friedrich-Alexander Univ., Erlangen, Germany
pp. 377-380
J. Pencak, Department of Defense, Ft. Meade, MD, USA
D. Nelson, Department of Defense, Ft. Meade, MD, USA
pp. 381-384
L. Deng, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
J. Nu, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
H. Sameti, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
pp. 385-388
C. Ris, TCTS Labs., Fac. Polytech. de Mons, Belgium
V. Fontaine, TCTS Labs., Fac. Polytech. de Mons, Belgium
H. Leich, TCTS Labs., Fac. Polytech. de Mons, Belgium
pp. 389-392
S. Celebi, Lab. of Comput. Neuroeng., Florida Univ., Gainesville, FL, USA
J.C. Principe, Lab. of Comput. Neuroeng., Florida Univ., Gainesville, FL, USA
pp. 393-396
N. Morgan, Int. Comput. Sci. Inst., Berkeley, CA, USA
H. Bourland, Int. Comput. Sci. Inst., Berkeley, CA, USA
S. Greenberg, Int. Comput. Sci. Inst., Berkeley, CA, USA
H. Hermansky, Int. Comput. Sci. Inst., Berkeley, CA, USA
Su-Lin Wu, Int. Comput. Sci. Inst., Berkeley, CA, USA
pp. 397-400
P.D. Green, Dept. of Comput. Sci., Sheffield Univ., UK
M.P. Cooke, Dept. of Comput. Sci., Sheffield Univ., UK
M.D. Crawford, Dept. of Comput. Sci., Sheffield Univ., UK
pp. 401-404
H. Hermansky, Dept. of Electr. Eng. & Appl. Phys., Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
E.A. Wan, Dept. of Electr. Eng. & Appl. Phys., Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
C. Avendano, Dept. of Electr. Eng. & Appl. Phys., Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 405-408
E. Erzin, Bilkent Univ., Ankara, Turkey
A.E. Cetin, AT&T Bell Labs., Murray Hill, NJ, USA
Y. Yardimci, Dept. of Electr. Eng. & Appl. Phys., Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
pp. 417-420
S. Kajita, Sch. of Eng., Nagoya Univ., Japan
F. Itakura, Sch. of Eng., Nagoya Univ., Japan
pp. 421-424
A. Moreno, Dept. of Signal Theor. & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
S. Tortola, Dept. of Signal Theor. & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
J. Vidal, Dept. of Signal Theor. & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
J.A.R. Fonollosa, Dept. of Signal Theor. & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 429-432
R. Yang, Nokia Res. Center, Tampere, Finland
P. Haavisto, Nokia Res. Center, Tampere, Finland
pp. 433-436
S.V. Vaseghi, Sch. of Inf. Syst., East Anglia Univ., Norwich, UK
B.P. Milner, Sch. of Inf. Syst., East Anglia Univ., Norwich, UK
pp. 437-440
T. Kosaka, ATR Interpreting Telephony Res. Labs., Kyoto, Japan
S. Matsunaga, ATR Interpreting Telephony Res. Labs., Kyoto, Japan
M. Kuraoka, Dept. of Signal Theor. & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 441-444
T. Sloboda, Interactive Syst. Lab., Karlsruhe Univ., Germany
pp. 453-456
Y. Goto, Div. of Eng., Brown Univ., Providence, RI, USA
M.M. Hochberg, ATR Interpreting Telephony Res. Labs., Kyoto, Japan
D.J. Mashao, Dept. of Signal Theor. & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
H.F. Silverman, Dept. of Signal Theor. & Commun., Univ. Politecnica de Catalunya, Barcelona, Spain
pp. 457-460
A. Mellouk, LRI, CNRS, Orsay, France
P. Gallinari, ATR Interpreting Telephony Res. Labs., Kyoto, Japan
pp. 465-468
B. Mouy, Thomson-CSF, Gennevilliers, France
P. De La Noue, Thomson-CSF, Gennevilliers, France
G. Goudezeune, Thomson-CSF, Gennevilliers, France
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M. Nishiguchi, InfoCom Products Co., Sony Corp., Tokyo, Japan
J. Matsumoto, InfoCom Products Co., Sony Corp., Tokyo, Japan
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M.A. Kohler, US Dept. of Defence, Meade, MD, USA
L.M. Supplee, US Dept. of Defence, Meade, MD, USA
T.E. Tremain, US Dept. of Defence, Meade, MD, USA
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A. Das, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
A. Gersho, Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
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V. Cuperman, Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
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P.A. Laurent, Speech Group, Thomson-CSF, Gennevilliers, France
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Gao Yang, Lernout & Hauspie Speech Products n.v., Mons, Belgium
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R.J. Sluijter, Signal Process. Group, Philips Res. Lab., Eindhoven, Netherlands
E. Kathmann, Signal Process. Group, Philips Res. Lab., Eindhoven, Netherlands
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H. Yang, Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
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M.D. Monkowski, Human Language Technol. Group, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny, Human Language Technol. Group, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
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W.J. Holmes, Speech Res. Unit, DRA Malvern, UK
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G. Ruske, Inst. for Human-Machine-Commun., Munich Univ. of Technol., Germany
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R. De Mori, Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
C. Snow, Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
M. Galler, Sch. of Comput. Sci., McGill Univ., Montreal, Que., Canada
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P.S. Gopalakrishnan, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
L.R. Bahl, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
R.L. Mercer, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
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F. Richardson, Dept. of Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
M. Ostendorf, Dept. of Electr. Comput. & Syst. Eng., Boston Univ., MA, USA
J.R. Rohlicek, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
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F. Brugnara, Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
M. Cettolo, Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
M. Federico, Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
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M. Hochberg, Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
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M.A. Siegler, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
R.M. Stern, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
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D.G. Novick, Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
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M. Nakai, Tohoku Univ., Sendai, Japan
H. Singer, Center for Spoken Language Understanding, Oregon Graduate Inst. of Sci. & Technol., Portland, OR, USA
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H. Shimodaira, Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
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M.P. Harper, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
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T.R. Anderson, Dept. of Eng., Cambridge Univ., UK
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K.E. Cummings, Dept. of Eng., Cambridge Univ., UK
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M.A. Clements, Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
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M. Honda, Dept. of Eng., Cambridge Univ., UK
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E.R. Banga, ETSI Telecomunicacion, Vigo Univ., Spain
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T. Kobayashi, ETSI Telecomunicacion, Vigo Univ., Spain
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J.H.L. Hansen, Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
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K.E. Cummings, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
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J.R. Bellegarda, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
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M. Padmanabhan, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
M.A. Picheny, IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
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Minjie Xie, Dept. of Electr. & Comput. Eng., Sherbrooke Univ., Que., Canada
J.-P. Adoul, Dept. of Electr. & Comput. Eng., Sherbrooke Univ., Que., Canada
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H.R.S. Mohammadi, Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
W.H. Holmes, Sch. of Electr. Eng., New South Wales Univ., Kensington, NSW, Australia
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W. Bastiaan Kleijn, Speech Coding Res. Dept., AT&T Bell Labs., Murray Hill, NJ, USA
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C.S. Xydeas, Sch. of Eng., Manchester Univ., UK
C. Papanastasiou, Sch. of Eng., Manchester Univ., UK
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E. Paksoy, US Dept. of Defense, USA
A. Gersho, Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
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W.R. Gardner, Dept. of Electr. & Comput. Eng., California Univ., San Diego, La Jolla, CA, USA
B.D. Rao, US Dept. of Defense, USA
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T. Kobayashi, Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
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V. Darsinos, Precision & Intelligence Lab., Tokyo Inst. of Technol., Yokohama, Japan
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P.C. Doerschuk, Sch. of Electr. Eng., Purdue Univ., West Lafayette, IN, USA
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J.S. Erkelens, Dept. of Appl. Phys., Delft Univ. of Technol., Netherlands
P.M.T. Broersen, Dept. of Appl. Phys., Delft Univ. of Technol., Netherlands
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B. Yegnanarayana, Indian Inst. of Technol., Madras, India
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V. Goncharoff, Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
M. Kaine-Krolak, Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
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A. Potamianos, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
P. Maragos, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
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F. Diaz-de-Maria, Dept. de Electron., Cantabria Univ., Santander, Spain
A.R. Figueiras-Vidal, Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
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M. Rangoussi, Dept. of Electr. Eng., Nat. Tech. Univ. of Athens, Greece
A. Delopoulos, Dept. of Electr. Eng., Nat. Tech. Univ. of Athens, Greece
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N. Virag, Signal Process. Lab., Swiss Federal Inst. of Technol., Lausanne, Switzerland
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A. Akbari Azirani, Lab. Traitement du Signal et de l'Image, Rennes I Univ., France
R. Le Bouquin Jeannes, Lab. Traitement du Signal et de l'Image, Rennes I Univ., France
G. Faucon, Lab. Traitement du Signal et de l'Image, Rennes I Univ., France
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Y. Ephraim, Dept. of Electr. & Comput. Eng., George Mason Univ., Fairfax, VA, USA
H.L. van Trees, Dept. of Electr. & Comput. Eng., George Mason Univ., Fairfax, VA, USA
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H. Sheikhzadeh, Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada
R.L. Brennan, Dept. of Electr. & Comput. Eng., George Mason Univ., Fairfax, VA, USA
H. Sameti, Lab. Traitement du Signal et de l'Image, Rennes I Univ., France
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L. Arslan, Syst. & Inf. Sci. Lab., Texas Instrum. Inc., Dallas, TX, USA
A. McCree, Syst. & Inf. Sci. Lab., Texas Instrum. Inc., Dallas, TX, USA
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J. Carmody, Martin Marietta Labs., Baltimore, MD, USA
J. Rothweiler, Martin Marietta Labs., Baltimore, MD, USA
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Z.B. Nossair, Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
P.L. Silsbee, Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
S.A. Zahorian, Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
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D.P. Morgan, Signal Process. Center of Technol., Lockheed Sanders Inc., Nashua, NH, USA
E.B. George, Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
L.T. Lee, Dept. of Electr. & Comput. Eng., Old Dominion Univ., Norfolk, VA, USA
S.M. Kay, Martin Marietta Labs., Baltimore, MD, USA
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C.D. Yoo, Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.S. Lim, Res. Lab. of Electron., MIT, Cambridge, MA, USA
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J.H.L. Hansen, Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
L.M. Arslan, Dept. of Electr. Eng., Duke Univ., Durham, NC, USA
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R. Haeb-Umbach, Philips GmbH Forschungslab., Aachen, Germany
P. Beyerlein, Philips GmbH Forschungslab., Aachen, Germany
E. Thelen, Philips GmbH Forschungslab., Aachen, Germany
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S.L. do N. Cunha Costa, Dept. de Engenharia Eletrica, Univ. Federal de Pernambuco, Campina Grande, Brazil
B.G. Aguiar Neto, Philips GmbH Forschungslab., Aachen, Germany
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U. Bub, Carnegie Mellon Univ., Pittsburgh, PA, USA
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J.-C. Junqua, Speech Technol. Lab., Panasonic Technol. Inc., Santa Barbara, CA, USA
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D. Fohr, Carnegie Mellon Univ., Pittsburgh, PA, USA
J.-F. Mari, Martin Marietta Labs., Baltimore, MD, USA
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M. Betz, Karlsruhe Univ., Germany
H. Hild, Karlsruhe Univ., Germany
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D. Giuliani, Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
M. Matassoni, Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
M. Omologo, Istituto per la Ricerca Sci. e Tecnologica, Trento, Italy
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T. Imai, NHK Sci. & Tech. Res. Labs., Tokyo, Japan
A. Ando, NHK Sci. & Tech. Res. Labs., Tokyo, Japan
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D.L. Jennings, Dept. of Electr. & Comput. Eng., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
D.W. Ruck, Dept. of Electr. & Comput. Eng., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
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B. Gidas, Div. of Appl. Math., Brown Univ., Providence, RI, USA
A. Murua, Dept. of Electr. & Comput. Eng., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
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