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  • Acoustics, Speech, and Signal Processing, 1994. ICASSP-94 Vol 6., 1994 IEEE International Conference on
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Acoustics, Speech, and Signal Processing, 1994. ICASSP-94 Vol 6., 1994 IEEE International Conference on
Adelaide, SA, Australia
April 19-April 22
ISBN: 0-7803-1775-0
Table of Contents
J. Chao, Dept. of Electr. & Electron. Eng., Chuo Univ., Tokyo, Japan
pp. 101-104
S.C. Ng, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
C.Y. Chung, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
S.H. Leung, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
A. Luk, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 105-108
R.A. Gopinath, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 109-112
Z. Cvetkovic, Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
M. Vetterli, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 117-120
J. Mau, Dept. of Picture Coding & Psychovisual Studies, CCETT, Cesson Sevigne, France
pp. 125-128
T. Chen, AT&T Bell Labs., Holmdel, NJ, USA
P.P. Vaidyanathan, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 129-132
F. Bao, Dept. of Electr. Eng., Florida Atlantic Univ., Boca Raton, FL, USA
N. Erdol, Dept. of Electr. Eng., Florida Atlantic Univ., Boca Raton, FL, USA
pp. 13-16
F. Deprez, CNET, Issy-les-Moulineaux, France
O. Rioul, CNET, Issy-les-Moulineaux, France
P. Duhamel, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 133-136
S.C. Chan, Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 141-144
K. Park, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
R.A. Haddad, Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
pp. 145-148
B.W. Suter, Dept. of the Air Force, Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
M.E. Oxley, Dept. of the Air Force, Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
pp. 153-156
I. Sodagar, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
K. Nayebi, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
K. Nayebi, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
M.J.T. Smith, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 157-160
C. Herley, AT&T Bell Labs., Murray Hill, NJ, USA
N.T. Thao, Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 161-164
A. Reilly, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
G. Frazer, Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 165-168
L. Lin, Ottawa-Carleton Inst. of Electr. Eng., Ottawa Univ., Ont., Canada
T. Aboulnasr, Ottawa-Carleton Inst. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 169-172
P. Rieder, Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
J. Gotze, Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
J.A. Nossek, Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
pp. 17-20
U. Petersohn, Greifswald Univ., Germany
N.J. Fliege, Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
H. Unger, Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
pp. 173-176
I.A. Shah, Philips Lab., Briarcliff Manor, NY, USA
T.A.C.M. Kalker, Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
pp. 181-184
G. Smart, Dept. of Commun. & Electron. Eng., R. Melbourne Inst. of Technol., Vic., Australia
A.B. Bradley, Dept. of Commun. & Electron. Eng., R. Melbourne Inst. of Technol., Vic., Australia
pp. 185-188
Chi-Min Liu, Dept. of Comput. Sci. & Inf. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Kuo-Guan Wu, Dept. of Comput. Sci. & Inf. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Jer-Heh Sheu, Dept. of Comput. Sci. & Inf. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 193-196
J. Perkins, Cooperative Res. Centre for Robust & Adaptive Syst., Salisbury, SA, Australia
I. Coat, Dept. of Comput. Sci. & Inf. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 197-200
L. Lo Presti, Dipartimento di Elettronica, Politecnico di Torino, Italy
G. Cardamone, Dipartimento di Elettronica, Politecnico di Torino, Italy
pp. 201-204
R.D. Priebe, Appl. Res. Lab., Texas Univ., Austin, TX, USA
G.R. Wilson, Appl. Res. Lab., Texas Univ., Austin, TX, USA
pp. 205-208
Soo-Chang Pei, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Chien-Cheng Tseng, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 209-212
Hsiang-Feng Chi, Dept. of Comput. Sci. & Inf. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Ja-Ling Wu, Dept. of Comput. Sci. & Inf. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 213-216
T. Kohama, Tokyo Denki Univ., Japan
S. Nakamura, Tokyo Denki Univ., Japan
H. Hoshino, Tokyo Denki Univ., Japan
pp. 217-220
M.A. Khasawneh, Dept. of Electr. Eng., Jordan Univ. of Sci. & Technol., Irbid, Jordan
T.F. Haddad, Dept. of Electr. Eng., Jordan Univ. of Sci. & Technol., Irbid, Jordan
pp. 221-224
Jeng-Kuang Hwang, Inst. of Electr. Eng., Yuan-Ze Inst. of Technol., Chungli, Taiwan
Shun-Tai Wei, Inst. of Electr. Eng., Yuan-Ze Inst. of Technol., Chungli, Taiwan
pp. 225-228
B. Madhukar, DSP Group, Motorola India Electron. Ltd., Bangalore, India
K. Rajgopal, Inst. of Electr. Eng., Yuan-Ze Inst. of Technol., Chungli, Taiwan
L.M. Patnaik, Tokyo Denki Univ., Japan
pp. 229-232
U. Gummadavelli, Dept. of Electr. Eng., Auburn Univ., AL, USA
J.K. Tugnait, Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 233-236
S. Oh, Integrated Syst. Lab., Texas Instrum. Inc., Dallas, TX, USA
D. Garcia, Integrated Syst. Lab., Texas Instrum. Inc., Dallas, TX, USA
pp. 237-240
S.L. Wood, Dept. of Electr. Eng., Santa Clara Univ., CA, USA
J.R. Treichler, Integrated Syst. Lab., Texas Instrum. Inc., Dallas, TX, USA
pp. 241-244
J.J. Nicolas, Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.S. Lim, Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 245-248
P.M. Aziz, Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
H.V. Sorensen, Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
J. Van der Spiegel, Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 249-252
T. Frederick, Analog Products Div., Racal-Datacom Inc., Sunrise, FL, USA
N. Erdol, Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 25-28
Gin-Kou Ma, Adv. Technol. Center, Ind. Technol. Res. Inst., Hsinchu, Taiwan
Junghsi Lee, Adv. Technol. Center, Ind. Technol. Res. Inst., Hsinchu, Taiwan
V.J. Mathews, Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 257-260
S.U. Zaman, Alcatel Australia Ltd., Sydney, NSW, Australia
K.W. Yates, Adv. Technol. Center, Ind. Technol. Res. Inst., Hsinchu, Taiwan
pp. 261-264
L. Vandendorpe, Telecommun. & Remote Sensing Lab., Univ. Catholique de Louvain, Belgium
P. Delogne, Telecommun. & Remote Sensing Lab., Univ. Catholique de Louvain, Belgium
B. Maison, Telecommun. & Remote Sensing Lab., Univ. Catholique de Louvain, Belgium
L. Cuvelier, Telecommun. & Remote Sensing Lab., Univ. Catholique de Louvain, Belgium
pp. 265-268
F. Sattar, Signal Process. Group, Lund Univ., Sweden
G. Salomonsson, Signal Process. Group, Lund Univ., Sweden
pp. 269-272
A.J. Coulson, Ind. Res. Lab., Lower Hutt, New Zealand
R.G. Vaughan, Ind. Res. Lab., Lower Hutt, New Zealand
pp. 273-276
Li-Chien Lin, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
C.-C.J. Kuo, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 277-280
Xiang-Gen Xia, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
C.-C.J. Kuo, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
Zhen Zhang, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 281-284
A. Tarczynski, SEMSE, Westminster Univ., London, UK
W. Kozinski, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
G.D. Cain, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 285-288
O. Arikan, Dept. of Electr. Eng., Bilkent Univ., Ankara, Turkey
B. Baygun, Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 289-292
S. Qian, DSP Group, Nat. Instrum., Austin, TX, USA
D. Chen, DSP Group, Nat. Instrum., Austin, TX, USA
pp. 29-32
D. Chen, Signal Process. Lab., Seoul Nat. Univ., South Korea
D. Chen, Signal Process. Lab., Seoul Nat. Univ., South Korea
D. Chen, Signal Process. Lab., Seoul Nat. Univ., South Korea
pp. 293-296
T. Adali, Dept. of Electr. Eng., Maryland Univ., Baltimore, MD, USA
M.K. Sonmez, Signal Process. Lab., Seoul Nat. Univ., South Korea
pp. 297-300
C. Bourget, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
T. Aboulnasr, Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 301-304
I.B. Collings, Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
J.B. Moore, Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
pp. 305-308
W.S. Gan, Centre for Signal Process., Nanyang Technol. Univ., Singapore
J.J. Sorahgan, Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
T.S. Durrani, Signal Process. Lab., Seoul Nat. Univ., South Korea
pp. 309-312
J.P. LeBlanc, Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
K. Dogancay, Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
R.A. Kennedy, Signal Process. Lab., Seoul Nat. Univ., South Korea
R.A. Kennedy, Telecommun. & Remote Sensing Lab., Univ. Catholique de Louvain, Belgium
pp. 313-316
C.B. Papadias, Inst. EURECOM, Sophia Antipolis, France
D.T.M. Slock, Inst. EURECOM, Sophia Antipolis, France
pp. 321-324
K. Yamazaki, Dept. of Eng., Australian Nat. Univ., ACT, Australia
R.A. Kennedy, Dept. of Eng., Australian Nat. Univ., ACT, Australia
pp. 325-328
P. Flandrin, Lab. de Phys., Ecole Normale Superieure de Lyon, France
R.G. Baraniuk, Dept. of Eng., Australian Nat. Univ., ACT, Australia
O. Michel, Signal Process. Lab., Seoul Nat. Univ., South Korea
pp. 329-332
O. Michel, Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
O. Michel, Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
Souguil Ann, Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
pp. 33-36
J.R. O'Hair, US Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
B.W. Suter, US Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
pp. 333-336
S. Krishnamachari, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
W.J. Williams, Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 341-344
M.J. Arnold, Queensland Univ. of Technol., Brisbane, Qld., Australia
M. Roessgen, Queensland Univ. of Technol., Brisbane, Qld., Australia
B. Boashash, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 345-348
U.K. Laine, Acoust. Lab., Helsinki Univ. of Technol., Espoo, Finland
M. Karjalainen, Acoust. Lab., Helsinki Univ. of Technol., Espoo, Finland
T. Altosaar, Acoust. Lab., Helsinki Univ. of Technol., Espoo, Finland
pp. 349-352
A.S. El-Dinary, Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD, USA
T.D. Cole, Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD, USA
pp. 353-356
M. Palkar, Comput. Neuroeng. Lab., Florida Univ., Gainesville, FL, USA
J.C. Principe, Comput. Neuroeng. Lab., Florida Univ., Gainesville, FL, USA
pp. 369-372
M.R. Frater, Dept. of Electr. Eng., Australian Defence Force Acad., Canberra, ACT, Australia
M.R. Frater, Comput. Neuroeng. Lab., Florida Univ., Gainesville, FL, USA
pp. 37-40
S. Makino, NTT Human Interface Labs., Tokyo, Japan
Y. Kaneda, NTT Human Interface Labs., Tokyo, Japan
pp. 373-376
K.Y. Yoo, Electron. & Telecommun. Res. Inst., Daejeon, South Korea
N. Hubing, NTT Human Interface Labs., Tokyo, Japan
pp. 377-380
L.S. Resende, DECOM, Univ. Estadual de Campinas, Sao Paulo, Brazil
J.M.T. Romano, DECOM, Univ. Estadual de Campinas, Sao Paulo, Brazil
M.G. Bellanger, Acoust. Lab., Helsinki Univ. of Technol., Espoo, Finland
pp. 381-384
C. Papaodysseus, Nat. Tech. Univ. of Athens, Greece
D. Gorgoyannis, Nat. Tech. Univ. of Athens, Greece
E. Koukoutsis, Nat. Tech. Univ. of Athens, Greece
P. Roussopoulos, Nat. Tech. Univ. of Athens, Greece
pp. 385-388
H. Sakai, Fac. of Eng., Kyoto Univ., Japan
M. Kuroda, Fac. of Eng., Kyoto Univ., Japan
pp. 389-392
B. Schnaufer, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
W.K. Jenkins, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 393-396
Sang-Sik Ahn, Dept. of Med. Electron., Korea Univ., Seoul, South Korea
P.J. Voltz, Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 401-404
J. Homer, Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
pp. 405-408
S. Hosur, Dept. of Electr. Eng. & Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik, Dept. of Electr. Eng. & Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
D. Boley, Dept. of Electr. Eng. & Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 409-412
S. Ikeda, Radio Application Div., NEC Corp., Tokyo, Japan
A. Sugiyama, Dept. of Electr. Eng. & Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 41-44
K. Nishikawa, Electron. & Inf. Eng., Tokyo Metropolitan Univ., Japan
H. Kiya, Electron. & Inf. Eng., Tokyo Metropolitan Univ., Japan
pp. 413-416
Chien-Cheng Tseng, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Soo-Chang Pei, Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 417-420
K.F. Wan, Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
P.C. Ching, Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
pp. 421-424
T. Wang, Inst. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Chin-Liang Wang, Inst. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 425-428
U. Iyer, Michigan State Univ., East Lansing, MI, USA
M. Nayer, Michigan State Univ., East Lansing, MI, USA
H. Ochi, Dept. of Electr. Eng. & Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 433-436
Lap-Pui Chau, Dept. of Electron. Eng., Hong Kong Polytech., Hung Hom, Hong Kong
Wan-Chi Siu, Dept. of Electron. Eng., Hong Kong Polytech., Hung Hom, Hong Kong
pp. 437-440
J. Gotze, Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
pp. 441-444
H. Guo, Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
G.A. Sitton, Dept. of Electron. Eng., Hong Kong Polytech., Hung Hom, Hong Kong
C.S. Burrus, Dept. of Electr. Eng. & Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 445-448
M.O. Kolawole, Jindalee Project, Telecom Australia, Melbourne, Vic., Australia
pp. 45-48
A. Saidi, Paging & Wireless Data Group, Motorola Appl. Res., Boynton Beach, FL, USA
pp. 453-456
Zhongkan Liu, Dept. of Appl. Math., Beijing Univ. of Aeronaut. & Astronaut., China
Mingyong Zho, ECS Dept., Boston Univ., MA, USA
H. Hama, Dept. of Electr. Eng. & Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 457-460
A. Zergainoh, INT/DEC/TNS, Evry, France
P. Duhamel, ECS Dept., Boston Univ., MA, USA
J.P. Vidal, Dept. of Electr. Eng. & Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 461-464
Zhongde Wang, VLSI Res. Group, Windsor Univ., Ont., Canada
G.A. Jullien, VLSI Res. Group, Windsor Univ., Ont., Canada
W.C. Miller, VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 469-472
R. Stasinski, Dept. of Telecom., Norwegian Inst. of Technol., Trondheim, Norway
T.A. Ramstad, Dept. of Telecom., Norwegian Inst. of Technol., Trondheim, Norway
pp. 473-476
M.-H. Cheng, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
V.L. Stonick, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 477-480
C.A. Faria da Rocha, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
O. Macchi, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 481-484
R.H.T. Jongwe, Dept. of Comput. Sci. & Eng. Res. Center, Howard Univ., Washington, DC, USA
pp. 485-488
J. Lee, Comput. & Commun. Res. Lab., Ind. Technol. Res. Inst., Hsinchu, Taiwan
V.J. Mathews, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 489-492
E. Moreau, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
O. Macchi, Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 49-52
T. Ogunfunmi, Dept. of Electr. Eng. & Comput. Sci., Santa Clara Univ., CA, USA
Z. Chen, Dept. of Electr. Eng. & Comput. Sci., Santa Clara Univ., CA, USA
pp. 493-496
J. Sanubari, Dept. of Electron. Eng., Satya Wacana Univ., Salatiga, Indonesia
K. Tokuda, Dept. of Electr. Eng. & Comput. Sci., Santa Clara Univ., CA, USA
M. Onoda, VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 497-500
N.J. Redding, Div. of Inf. Technol., DSTO, Salisbury, SA, Australia
G.N. Newsam, Div. of Inf. Technol., DSTO, Salisbury, SA, Australia
pp. 5-8
V.L. Stonick, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
M.-H. Cheng, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 501-504
C.T. Wangler, Dept. of Mech. Eng., Adelaide Univ., SA, Australia
C.H. Hansen, Dept. of Mech. Eng., Adelaide Univ., SA, Australia
pp. 505-508
J. Tsimbinos, Defence Sci. & Technol. Organ., Melbourne, Vic., Australia
K.V. Lever, Defence Sci. & Technol. Organ., Melbourne, Vic., Australia
pp. 513-516
M.J. Ogorzolek, Dept. of Electr. Eng., Univ. of Min. & Metall., Cracow, Poland
H. Dedieu, Defence Sci. & Technol. Organ., Melbourne, Vic., Australia
pp. 521-524
B.F. La Scala, Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
R.R. Bitmead, Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
pp. 525-527
E.S. Chng, Dept. of Electr. Eng., Edinburgh Univ., UK
S. Chen, Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
B. Mulgrew, VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 529-532
Y. Ono, Dept. of Electron. & Inf. Eng., Tokyo Metropolitan Univ., Japan
H. Kiya, Dept. of Electron. & Inf. Eng., Tokyo Metropolitan Univ., Japan
pp. 53-56
X. Zhao, Dept. of Electr. & Biomed. Eng., Univ. of Southern California, Los Angeles, CA, USA
V.Z. Marmarelis, Dept. of Electr. & Biomed. Eng., Univ. of Southern California, Los Angeles, CA, USA
pp. 533-535
M. Ali, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 537-540
J.T. Stonick, Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.L. Rulla, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
S.H. Ardalan, VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 541-544
J.A. Barreto, Dept. of Electr. Eng., Rice Univ., Houston, TX, USA
C.S. Burrus, Dept. of Electr. Eng., Rice Univ., Houston, TX, USA
pp. 545-548
C.-Y. Tseng, Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 553-556
T.A. Tutunji, Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK, USA
V.E. DeBrunner, Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK, USA
pp. 557-560
T. Ciloglu, Dept. of Electr. & Electron. Eng., Middle East Tech. Univ., Ankara, Turkey
Z. Unver, Dept. of Electr. & Electron. Eng., Middle East Tech. Univ., Ankara, Turkey
pp. 561-564
B.A. Weisburn, Dept. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
T.W. Parks, Dept. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
R.G. Shenoy, VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 565-568
A. Alkhairy, KACST-RICE Dept., MIT, Cambridge, MA, USA
pp. 569-571
S. Van Gerven, ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
D. Van Compernolle, ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
pp. 57-60
D. Van Compernolle, California Univ., Los Angeles, CA, USA
H.J. Orchard, California Univ., Los Angeles, CA, USA
pp. 573-576
M. Gerken, DEE/EPUSP, Lab. of Commun. & Signals, Sao Paulo, Brazil
pp. 577-580
S. Radhakrishnan Pillai, Dept. of Electr. & Electron. Eng., James Cook Univ. of North Queensland, Townsville, Qld., Australia
G.H. Allen, Dept. of Electr. & Electron. Eng., James Cook Univ. of North Queensland, Townsville, Qld., Australia
pp. 585-588
G.H. Allen, Dept. of Electr. & Electron. Eng., James Cook Univ. of North Queensland, Townsville, Qld., Australia
pp. 589-592
B. Beliczynski, Inst. of Control & Ind. Electron., Warsaw Univ. of Technol., Poland
J. Gryka, Dept. of Electr. & Electron. Eng., James Cook Univ. of North Queensland, Townsville, Qld., Australia
I. Kale, VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 593-596
C. Tsai, Dept. Electr. Eng., Chung-Hua Polytech. Inst., Hsin Chu, Taiwan
M.-L. Lin, Dept. Electr. Eng., Chung-Hua Polytech. Inst., Hsin Chu, Taiwan
A.T. Farn, VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 601-604
W.X. Zheng, Telecom. Res. Inst., Curtin Univ. of Technol., Perth, WA, Australia
A. Cantoni, Telecom. Res. Inst., Curtin Univ. of Technol., Perth, WA, Australia
K.L. Teo, VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 605-608
K. Dogancay, Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
R.A. Kennedy, Telecom. Res. Inst., Curtin Univ. of Technol., Perth, WA, Australia
pp. 61-64
T. Kiryu, Dept. of Inf. Eng., Niigata Univ., Japan
H. Kaneko, Telecom. Res. Inst., Curtin Univ. of Technol., Perth, WA, Australia
Y. Saitoh, VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 613-616
G.D. Cain, Sch. of Electr. & Manuf. Syst. Eng., Univ. of Westminster, London, UK
N.P. Murphy, Sch. of Electr. & Manuf. Syst. Eng., Univ. of Westminster, London, UK
A. Tarczynski, Sch. of Electr. & Manuf. Syst. Eng., Univ. of Westminster, London, UK
pp. 621-624
R. Suoranta, Tech. Res. Centre of Finland, Tampere, Finland
K.-P. Estola, Sch. of Electr. & Manuf. Syst. Eng., Univ. of Westminster, London, UK
S. Rantala, Sch. of Electr. & Manuf. Syst. Eng., Univ. of Westminster, London, UK
H. Vaataja, Nat. Tech. Univ. of Athens, Greece
pp. 625-628
J.M. Paez-Borrallo, Dept. SSR, ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
I.A. Perez Alvarez, Dept. SSR, ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
S.Z. Bello, Dept. SSR, ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
pp. 65-68
M. Sakai, Dept. of Electr. Eng., Tokyo Univ., Japan
K. Aizawa, Dept. of Electr. Eng., Tokyo Univ., Japan
M. Hatori, Dept. of Electr. Eng., Tokyo Univ., Japan
pp. 69-72
S.D. Peters, Defence Res. Establ. Atlantic, Dartmouth, NS, Canada
A. Antoniou, Dept. of Electr. Eng., Tokyo Univ., Japan
pp. 73-76
K.J. Raghunath, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
K.K. Parhi, Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 81-84
S. Kinjo, Dept. of Electr. & Electron. Eng., Ryukyus Univ., Okinawa, Japan
pp. 85-88
J. Zhan, Dept. of Electr. Eng., Portland State Univ., OR, USA
F. Li, Dept. of Electr. Eng., Portland State Univ., OR, USA
pp. 89-92
L. Onural, Bilkent Univ., Ankara, Turkey
M. Kocatepe, Bilkent Univ., Ankara, Turkey
H.M. Ozaktas, Bilkent Univ., Ankara, Turkey
pp. 9-III12
C. Kotropoulos, Dept. of Electr. Eng., Thessaloniki Univ., Greece
I. Pitas, Dept. of Electr. Eng., Thessaloniki Univ., Greece
pp. 93-96
I. Pitas, Image & Media Lab., GoldStar Co. Ltd., Seoul, South Korea
I. Pitas, Dept. of Electr. Eng., Thessaloniki Univ., Greece
pp. 97-100
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