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Acoustics, Speech, and Signal Processing, IEEE International Conference on (1994)
Adelaide, SA, Australia
Apr. 19, 1994 to Apr. 22, 1994
ISBN: 0-7803-1775-0
TABLE OF CONTENTS
R.S. Orr , Atlantic Aerosp. Electron. Corp., Greenbelt, MD, USA
pp. 1-3
J. Chao , Dept. of Electr. & Electron. Eng., Chuo Univ., Tokyo, Japan
pp. 101-104
S.C. Ng , Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
C.Y. Chung , Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
S.H. Leung , Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
A. Luk , Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 105-108
R.A. Gopinath , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 109-112
A. Mertins , Telecommun. Group, Tech. Univ. Hamburg, Germany
pp. 113-116
Z. Cvetkovic , Dept. of Electr. Eng., Columbia Univ., New York, NY, USA
M. Vetterli , Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 117-120
R.G. Shenoy , Schlumberger-Doll Res., Ridgefield, CT, USA
pp. 121-124
J. Mau , Dept. of Picture Coding & Psychovisual Studies, CCETT, Cesson Sevigne, France
pp. 125-128
T. Chen , AT&T Bell Labs., Holmdel, NJ, USA
P.P. Vaidyanathan , Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 129-132
F. Bao , Dept. of Electr. Eng., Florida Atlantic Univ., Boca Raton, FL, USA
N. Erdol , Dept. of Electr. Eng., Florida Atlantic Univ., Boca Raton, FL, USA
pp. 13-16
F. Deprez , CNET, Issy-les-Moulineaux, France
O. Rioul , CNET, Issy-les-Moulineaux, France
P. Duhamel , Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 133-136
M. Ikehara , Fac. of Sci. & Technol., Keio Univ., Yokohama, Japan
pp. 137-140
S.C. Chan , Dept. of Electron. Eng., City Polytech. of Hong Kong, Kowloon, Hong Kong
pp. 141-144
K. Park , Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
R.A. Haddad , Dept. of Electr. Eng., Polytechnic Univ., Brooklyn, NY, USA
pp. 145-148
N.J. Fliege , Hamburg Univ. of Technol., Germany
pp. 149-152
B.W. Suter , Dept. of the Air Force, Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
M.E. Oxley , Dept. of the Air Force, Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
pp. 153-156
I. Sodagar , Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
K. Nayebi , Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
K. Nayebi , Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
M.J.T. Smith , Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 157-160
C. Herley , AT&T Bell Labs., Murray Hill, NJ, USA
N.T. Thao , Digital Signal Process. Lab., Georgia Inst. of Technol., Atlanta, GA, USA
pp. 161-164
A. Reilly , Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
G. Frazer , Signal Process. Res. Centre, Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 165-168
L. Lin , Ottawa-Carleton Inst. of Electr. Eng., Ottawa Univ., Ont., Canada
T. Aboulnasr , Ottawa-Carleton Inst. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 169-172
P. Rieder , Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
J. Gotze , Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
J.A. Nossek , Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
pp. 17-20
U. Petersohn , Greifswald Univ., Germany
N.J. Fliege , Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
H. Unger , Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
pp. 173-176
P.P. Vaidyanathan , Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
pp. 177-180
I.A. Shah , Philips Lab., Briarcliff Manor, NY, USA
T.A.C.M. Kalker , Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
pp. 181-184
G. Smart , Dept. of Commun. & Electron. Eng., R. Melbourne Inst. of Technol., Vic., Australia
A.B. Bradley , Dept. of Commun. & Electron. Eng., R. Melbourne Inst. of Technol., Vic., Australia
pp. 185-188
H. Le Bihan , CCETT, Cesson Sevigne, France
P. Siohan , CCETT, Cesson Sevigne, France
pp. 189-192
Chi-Min Liu , Dept. of Comput. Sci. & Inf. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Kuo-Guan Wu , Dept. of Comput. Sci. & Inf. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Jer-Heh Sheu , Dept. of Comput. Sci. & Inf. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 193-196
J. Perkins , Cooperative Res. Centre for Robust & Adaptive Syst., Salisbury, SA, Australia
I. Coat , Dept. of Comput. Sci. & Inf. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
pp. 197-200
L. Lo Presti , Dipartimento di Elettronica, Politecnico di Torino, Italy
G. Cardamone , Dipartimento di Elettronica, Politecnico di Torino, Italy
pp. 201-204
R.D. Priebe , Appl. Res. Lab., Texas Univ., Austin, TX, USA
G.R. Wilson , Appl. Res. Lab., Texas Univ., Austin, TX, USA
pp. 205-208
Soo-Chang Pei , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Chien-Cheng Tseng , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 209-212
C.-Y. Lu , Commun. Syst. Technol. Lab., Panasonic Technol. Inc., Princeton, NJ, USA
pp. 21-24
Hsiang-Feng Chi , Dept. of Comput. Sci. & Inf. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Ja-Ling Wu , Dept. of Comput. Sci. & Inf. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 213-216
T. Kohama , Tokyo Denki Univ., Japan
S. Nakamura , Tokyo Denki Univ., Japan
H. Hoshino , Tokyo Denki Univ., Japan
pp. 217-220
M.A. Khasawneh , Dept. of Electr. Eng., Jordan Univ. of Sci. & Technol., Irbid, Jordan
T.F. Haddad , Dept. of Electr. Eng., Jordan Univ. of Sci. & Technol., Irbid, Jordan
pp. 221-224
Jeng-Kuang Hwang , Inst. of Electr. Eng., Yuan-Ze Inst. of Technol., Chungli, Taiwan
Shun-Tai Wei , Inst. of Electr. Eng., Yuan-Ze Inst. of Technol., Chungli, Taiwan
pp. 225-228
B. Madhukar , DSP Group, Motorola India Electron. Ltd., Bangalore, India
K. Rajgopal , Inst. of Electr. Eng., Yuan-Ze Inst. of Technol., Chungli, Taiwan
L.M. Patnaik , Tokyo Denki Univ., Japan
pp. 229-232
U. Gummadavelli , Dept. of Electr. Eng., Auburn Univ., AL, USA
J.K. Tugnait , Dept. of Electr. Eng., Auburn Univ., AL, USA
pp. 233-236
S. Oh , Integrated Syst. Lab., Texas Instrum. Inc., Dallas, TX, USA
D. Garcia , Integrated Syst. Lab., Texas Instrum. Inc., Dallas, TX, USA
pp. 237-240
S.L. Wood , Dept. of Electr. Eng., Santa Clara Univ., CA, USA
J.R. Treichler , Integrated Syst. Lab., Texas Instrum. Inc., Dallas, TX, USA
pp. 241-244
J.J. Nicolas , Res. Lab. of Electron., MIT, Cambridge, MA, USA
J.S. Lim , Res. Lab. of Electron., MIT, Cambridge, MA, USA
pp. 245-248
P.M. Aziz , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
H.V. Sorensen , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
J. Van der Spiegel , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 249-252
T. Frederick , Analog Products Div., Racal-Datacom Inc., Sunrise, FL, USA
N. Erdol , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 25-28
Gin-Kou Ma , Adv. Technol. Center, Ind. Technol. Res. Inst., Hsinchu, Taiwan
Junghsi Lee , Adv. Technol. Center, Ind. Technol. Res. Inst., Hsinchu, Taiwan
V.J. Mathews , Dept. of Electr. Eng., Pennsylvania Univ., Philadelphia, PA, USA
pp. 257-260
S.U. Zaman , Alcatel Australia Ltd., Sydney, NSW, Australia
K.W. Yates , Adv. Technol. Center, Ind. Technol. Res. Inst., Hsinchu, Taiwan
pp. 261-264
L. Vandendorpe , Telecommun. & Remote Sensing Lab., Univ. Catholique de Louvain, Belgium
P. Delogne , Telecommun. & Remote Sensing Lab., Univ. Catholique de Louvain, Belgium
B. Maison , Telecommun. & Remote Sensing Lab., Univ. Catholique de Louvain, Belgium
L. Cuvelier , Telecommun. & Remote Sensing Lab., Univ. Catholique de Louvain, Belgium
pp. 265-268
F. Sattar , Signal Process. Group, Lund Univ., Sweden
G. Salomonsson , Signal Process. Group, Lund Univ., Sweden
pp. 269-272
A.J. Coulson , Ind. Res. Lab., Lower Hutt, New Zealand
R.G. Vaughan , Ind. Res. Lab., Lower Hutt, New Zealand
pp. 273-276
Li-Chien Lin , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
C.-C.J. Kuo , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 277-280
Xiang-Gen Xia , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
C.-C.J. Kuo , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
Zhen Zhang , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 281-284
A. Tarczynski , SEMSE, Westminster Univ., London, UK
W. Kozinski , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
G.D. Cain , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 285-288
O. Arikan , Dept. of Electr. Eng., Bilkent Univ., Ankara, Turkey
B. Baygun , Dept. of Electr. Eng. Syst., Univ. of Southern California, Los Angeles, CA, USA
pp. 289-292
S. Qian , DSP Group, Nat. Instrum., Austin, TX, USA
D. Chen , DSP Group, Nat. Instrum., Austin, TX, USA
pp. 29-32
D. Chen , Signal Process. Lab., Seoul Nat. Univ., South Korea
D. Chen , Signal Process. Lab., Seoul Nat. Univ., South Korea
D. Chen , Signal Process. Lab., Seoul Nat. Univ., South Korea
pp. 293-296
T. Adali , Dept. of Electr. Eng., Maryland Univ., Baltimore, MD, USA
M.K. Sonmez , Signal Process. Lab., Seoul Nat. Univ., South Korea
pp. 297-300
C. Bourget , Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
T. Aboulnasr , Dept. of Electr. Eng., Ottawa Univ., Ont., Canada
pp. 301-304
I.B. Collings , Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
J.B. Moore , Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
pp. 305-308
W.S. Gan , Centre for Signal Process., Nanyang Technol. Univ., Singapore
J.J. Sorahgan , Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
T.S. Durrani , Signal Process. Lab., Seoul Nat. Univ., South Korea
pp. 309-312
J.P. LeBlanc , Sch. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
K. Dogancay , Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
R.A. Kennedy , Signal Process. Lab., Seoul Nat. Univ., South Korea
R.A. Kennedy , Telecommun. & Remote Sensing Lab., Univ. Catholique de Louvain, Belgium
pp. 313-316
C.B. Papadias , Inst. EURECOM, Sophia Antipolis, France
D.T.M. Slock , Inst. EURECOM, Sophia Antipolis, France
pp. 321-324
K. Yamazaki , Dept. of Eng., Australian Nat. Univ., ACT, Australia
R.A. Kennedy , Dept. of Eng., Australian Nat. Univ., ACT, Australia
pp. 325-328
P. Flandrin , Lab. de Phys., Ecole Normale Superieure de Lyon, France
R.G. Baraniuk , Dept. of Eng., Australian Nat. Univ., ACT, Australia
O. Michel , Signal Process. Lab., Seoul Nat. Univ., South Korea
pp. 329-332
O. Michel , Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
O. Michel , Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
Souguil Ann , Dept. of Electron. Eng., Seoul Nat. Univ., South Korea
pp. 33-36
J.R. O'Hair , US Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
B.W. Suter , US Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
pp. 333-336
S. Barbarossa , INFOCOM Dept., Rome Univ., Italy
G. Schiappa , INFOCOM Dept., Rome Univ., Italy
pp. 337-340
S. Krishnamachari , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
W.J. Williams , Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
pp. 341-344
M.J. Arnold , Queensland Univ. of Technol., Brisbane, Qld., Australia
M. Roessgen , Queensland Univ. of Technol., Brisbane, Qld., Australia
B. Boashash , Queensland Univ. of Technol., Brisbane, Qld., Australia
pp. 345-348
U.K. Laine , Acoust. Lab., Helsinki Univ. of Technol., Espoo, Finland
M. Karjalainen , Acoust. Lab., Helsinki Univ. of Technol., Espoo, Finland
T. Altosaar , Acoust. Lab., Helsinki Univ. of Technol., Espoo, Finland
pp. 349-352
A.S. El-Dinary , Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD, USA
T.D. Cole , Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD, USA
pp. 353-356
R.G. Baraniuk , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
pp. 357-360
R.A. Nobakht , IBM Corp., Research Triangle Park, NC, USA
pp. 365-368
M. Palkar , Comput. Neuroeng. Lab., Florida Univ., Gainesville, FL, USA
J.C. Principe , Comput. Neuroeng. Lab., Florida Univ., Gainesville, FL, USA
pp. 369-372
M.R. Frater , Dept. of Electr. Eng., Australian Defence Force Acad., Canberra, ACT, Australia
M.R. Frater , Comput. Neuroeng. Lab., Florida Univ., Gainesville, FL, USA
pp. 37-40
S. Makino , NTT Human Interface Labs., Tokyo, Japan
Y. Kaneda , NTT Human Interface Labs., Tokyo, Japan
pp. 373-376
K.Y. Yoo , Electron. & Telecommun. Res. Inst., Daejeon, South Korea
N. Hubing , NTT Human Interface Labs., Tokyo, Japan
pp. 377-380
L.S. Resende , DECOM, Univ. Estadual de Campinas, Sao Paulo, Brazil
J.M.T. Romano , DECOM, Univ. Estadual de Campinas, Sao Paulo, Brazil
M.G. Bellanger , Acoust. Lab., Helsinki Univ. of Technol., Espoo, Finland
pp. 381-384
C. Papaodysseus , Nat. Tech. Univ. of Athens, Greece
D. Gorgoyannis , Nat. Tech. Univ. of Athens, Greece
E. Koukoutsis , Nat. Tech. Univ. of Athens, Greece
P. Roussopoulos , Nat. Tech. Univ. of Athens, Greece
pp. 385-388
H. Sakai , Fac. of Eng., Kyoto Univ., Japan
M. Kuroda , Fac. of Eng., Kyoto Univ., Japan
pp. 389-392
B. Schnaufer , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
W.K. Jenkins , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 393-396
Jenq-Tay Yuan , Fu Jen Catholic Univ., Taipei, Taiwan
pp. 397-400
Sang-Sik Ahn , Dept. of Med. Electron., Korea Univ., Seoul, South Korea
P.J. Voltz , Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
pp. 401-404
J. Homer , Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
pp. 405-408
S. Hosur , Dept. of Electr. Eng. & Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik , Dept. of Electr. Eng. & Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
D. Boley , Dept. of Electr. Eng. & Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 409-412
S. Ikeda , Radio Application Div., NEC Corp., Tokyo, Japan
A. Sugiyama , Dept. of Electr. Eng. & Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 41-44
K. Nishikawa , Electron. & Inf. Eng., Tokyo Metropolitan Univ., Japan
H. Kiya , Electron. & Inf. Eng., Tokyo Metropolitan Univ., Japan
pp. 413-416
Chien-Cheng Tseng , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Soo-Chang Pei , Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
pp. 417-420
K.F. Wan , Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
P.C. Ching , Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, Hong Kong
pp. 421-424
T. Wang , Inst. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Chin-Liang Wang , Inst. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
pp. 425-428
S.C. Douglas , Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
pp. 429-432
U. Iyer , Michigan State Univ., East Lansing, MI, USA
M. Nayer , Michigan State Univ., East Lansing, MI, USA
H. Ochi , Dept. of Electr. Eng. & Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 433-436
Lap-Pui Chau , Dept. of Electron. Eng., Hong Kong Polytech., Hung Hom, Hong Kong
Wan-Chi Siu , Dept. of Electron. Eng., Hong Kong Polytech., Hung Hom, Hong Kong
pp. 437-440
J. Gotze , Inst. of Network Theory & Circuit Design, Tech. Univ. Munchen, Germany
pp. 441-444
H. Guo , Dept. of Electr. & Comput. Eng., Rice Univ., Houston, TX, USA
G.A. Sitton , Dept. of Electron. Eng., Hong Kong Polytech., Hung Hom, Hong Kong
C.S. Burrus , Dept. of Electr. Eng. & Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 445-448
E. Dorken , ECS Dept., Boston Univ., MA, USA
S.H. Nawab , ECS Dept., Boston Univ., MA, USA
pp. 449-452
M.O. Kolawole , Jindalee Project, Telecom Australia, Melbourne, Vic., Australia
pp. 45-48
A. Saidi , Paging & Wireless Data Group, Motorola Appl. Res., Boynton Beach, FL, USA
pp. 453-456
Zhongkan Liu , Dept. of Appl. Math., Beijing Univ. of Aeronaut. & Astronaut., China
Mingyong Zho , ECS Dept., Boston Univ., MA, USA
H. Hama , Dept. of Electr. Eng. & Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 457-460
A. Zergainoh , INT/DEC/TNS, Evry, France
P. Duhamel , ECS Dept., Boston Univ., MA, USA
J.P. Vidal , Dept. of Electr. Eng. & Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
pp. 461-464
D.P.K. Lun , Dept. of Electron. Eng., Hong Kong Polytech., Hung Hom, Hong Kong
pp. 465-468
Zhongde Wang , VLSI Res. Group, Windsor Univ., Ont., Canada
G.A. Jullien , VLSI Res. Group, Windsor Univ., Ont., Canada
W.C. Miller , VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 469-472
R. Stasinski , Dept. of Telecom., Norwegian Inst. of Technol., Trondheim, Norway
T.A. Ramstad , Dept. of Telecom., Norwegian Inst. of Technol., Trondheim, Norway
pp. 473-476
M.-H. Cheng , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
V.L. Stonick , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 477-480
C.A. Faria da Rocha , Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
O. Macchi , Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 481-484
R.H.T. Jongwe , Dept. of Comput. Sci. & Eng. Res. Center, Howard Univ., Washington, DC, USA
pp. 485-488
J. Lee , Comput. & Commun. Res. Lab., Ind. Technol. Res. Inst., Hsinchu, Taiwan
V.J. Mathews , Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 489-492
E. Moreau , Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
O. Macchi , Lab. des Signaux et Syst., CNRS, Gif-sur-Yvette, France
pp. 49-52
T. Ogunfunmi , Dept. of Electr. Eng. & Comput. Sci., Santa Clara Univ., CA, USA
Z. Chen , Dept. of Electr. Eng. & Comput. Sci., Santa Clara Univ., CA, USA
pp. 493-496
J. Sanubari , Dept. of Electron. Eng., Satya Wacana Univ., Salatiga, Indonesia
K. Tokuda , Dept. of Electr. Eng. & Comput. Sci., Santa Clara Univ., CA, USA
M. Onoda , VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 497-500
N.J. Redding , Div. of Inf. Technol., DSTO, Salisbury, SA, Australia
G.N. Newsam , Div. of Inf. Technol., DSTO, Salisbury, SA, Australia
pp. 5-8
V.L. Stonick , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
M.-H. Cheng , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
pp. 501-504
C.T. Wangler , Dept. of Mech. Eng., Adelaide Univ., SA, Australia
C.H. Hansen , Dept. of Mech. Eng., Adelaide Univ., SA, Australia
pp. 505-508
B. Mulgrew , Dept. of Electr. Eng., Edinburgh Univ., UK
pp. 509-512
J. Tsimbinos , Defence Sci. & Technol. Organ., Melbourne, Vic., Australia
K.V. Lever , Defence Sci. & Technol. Organ., Melbourne, Vic., Australia
pp. 513-516
W.A. Frank , Munchen Univ., Germany
pp. 517-520
M.J. Ogorzolek , Dept. of Electr. Eng., Univ. of Min. & Metall., Cracow, Poland
H. Dedieu , Defence Sci. & Technol. Organ., Melbourne, Vic., Australia
pp. 521-524
B.F. La Scala , Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
R.R. Bitmead , Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
pp. 525-527
E.S. Chng , Dept. of Electr. Eng., Edinburgh Univ., UK
S. Chen , Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
B. Mulgrew , VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 529-532
Y. Ono , Dept. of Electron. & Inf. Eng., Tokyo Metropolitan Univ., Japan
H. Kiya , Dept. of Electron. & Inf. Eng., Tokyo Metropolitan Univ., Japan
pp. 53-56
X. Zhao , Dept. of Electr. & Biomed. Eng., Univ. of Southern California, Los Angeles, CA, USA
V.Z. Marmarelis , Dept. of Electr. & Biomed. Eng., Univ. of Southern California, Los Angeles, CA, USA
pp. 533-535
M. Ali , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
A.H. Tewfik , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 537-540
J.T. Stonick , Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
J.L. Rulla , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
S.H. Ardalan , VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 541-544
J.A. Barreto , Dept. of Electr. Eng., Rice Univ., Houston, TX, USA
C.S. Burrus , Dept. of Electr. Eng., Rice Univ., Houston, TX, USA
pp. 545-548
A. Alkhairy , KACST-RICE Dept., MIT, Cambridge, MA, USA
pp. 549-551
C.-Y. Tseng , Signal & Image Process. Inst., Univ. of Southern California, Los Angeles, CA, USA
pp. 553-556
T.A. Tutunji , Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK, USA
V.E. DeBrunner , Sch. of Electr. Eng. & Comput. Sci., Oklahoma Univ., Norman, OK, USA
pp. 557-560
T. Ciloglu , Dept. of Electr. & Electron. Eng., Middle East Tech. Univ., Ankara, Turkey
Z. Unver , Dept. of Electr. & Electron. Eng., Middle East Tech. Univ., Ankara, Turkey
pp. 561-564
B.A. Weisburn , Dept. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
T.W. Parks , Dept. of Electr. Eng., Cornell Univ., Ithaca, NY, USA
R.G. Shenoy , VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 565-568
A. Alkhairy , KACST-RICE Dept., MIT, Cambridge, MA, USA
pp. 569-571
S. Van Gerven , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
D. Van Compernolle , ESAT, Katholieke Univ., Leuven, Heverlee, Belgium
pp. 57-60
D. Van Compernolle , California Univ., Los Angeles, CA, USA
H.J. Orchard , California Univ., Los Angeles, CA, USA
pp. 573-576
M. Gerken , DEE/EPUSP, Lab. of Commun. & Signals, Sao Paulo, Brazil
pp. 577-580
G. Li , Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
pp. 581-584
S. Radhakrishnan Pillai , Dept. of Electr. & Electron. Eng., James Cook Univ. of North Queensland, Townsville, Qld., Australia
G.H. Allen , Dept. of Electr. & Electron. Eng., James Cook Univ. of North Queensland, Townsville, Qld., Australia
pp. 585-588
G.H. Allen , Dept. of Electr. & Electron. Eng., James Cook Univ. of North Queensland, Townsville, Qld., Australia
pp. 589-592
B. Beliczynski , Inst. of Control & Ind. Electron., Warsaw Univ. of Technol., Poland
J. Gryka , Dept. of Electr. & Electron. Eng., James Cook Univ. of North Queensland, Townsville, Qld., Australia
I. Kale , VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 593-596
J.I. Agnomua , Div. of Radiophys., CSIRO, Epping, NSW, Australia
pp. 597-600
C. Tsai , Dept. Electr. Eng., Chung-Hua Polytech. Inst., Hsin Chu, Taiwan
M.-L. Lin , Dept. Electr. Eng., Chung-Hua Polytech. Inst., Hsin Chu, Taiwan
A.T. Farn , VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 601-604
W.X. Zheng , Telecom. Res. Inst., Curtin Univ. of Technol., Perth, WA, Australia
A. Cantoni , Telecom. Res. Inst., Curtin Univ. of Technol., Perth, WA, Australia
K.L. Teo , VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 605-608
P.H. Bauer , Dept. of Electr. Eng., Notre Dame Univ., IN, USA
pp. 609-612
K. Dogancay , Dept. of Syst. Eng., Australian Nat. Univ., Canberra, ACT, Australia
R.A. Kennedy , Telecom. Res. Inst., Curtin Univ. of Technol., Perth, WA, Australia
pp. 61-64
T. Kiryu , Dept. of Inf. Eng., Niigata Univ., Japan
H. Kaneko , Telecom. Res. Inst., Curtin Univ. of Technol., Perth, WA, Australia
Y. Saitoh , VLSI Res. Group, Windsor Univ., Ont., Canada
pp. 613-616
M.T. Hanna , Dept. of Electr. Eng., Bahrain Univ., Bahrain
pp. 617-620
G.D. Cain , Sch. of Electr. & Manuf. Syst. Eng., Univ. of Westminster, London, UK
N.P. Murphy , Sch. of Electr. & Manuf. Syst. Eng., Univ. of Westminster, London, UK
A. Tarczynski , Sch. of Electr. & Manuf. Syst. Eng., Univ. of Westminster, London, UK
pp. 621-624
R. Suoranta , Tech. Res. Centre of Finland, Tampere, Finland
K.-P. Estola , Sch. of Electr. & Manuf. Syst. Eng., Univ. of Westminster, London, UK
S. Rantala , Sch. of Electr. & Manuf. Syst. Eng., Univ. of Westminster, London, UK
H. Vaataja , Nat. Tech. Univ. of Athens, Greece
pp. 625-628
J.M. Paez-Borrallo , Dept. SSR, ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
I.A. Perez Alvarez , Dept. SSR, ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
S.Z. Bello , Dept. SSR, ETSI Telecomunicacion, Univ. Politecnica de Madrid, Spain
pp. 65-68
M. Sakai , Dept. of Electr. Eng., Tokyo Univ., Japan
K. Aizawa , Dept. of Electr. Eng., Tokyo Univ., Japan
M. Hatori , Dept. of Electr. Eng., Tokyo Univ., Japan
pp. 69-72
S.D. Peters , Defence Res. Establ. Atlantic, Dartmouth, NS, Canada
A. Antoniou , Dept. of Electr. Eng., Tokyo Univ., Japan
pp. 73-76
K.J. Raghunath , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
K.K. Parhi , Dept. of Electr. Eng., Minnesota Univ., Minneapolis, MN, USA
pp. 81-84
S. Kinjo , Dept. of Electr. & Electron. Eng., Ryukyus Univ., Okinawa, Japan
pp. 85-88
J. Zhan , Dept. of Electr. Eng., Portland State Univ., OR, USA
F. Li , Dept. of Electr. Eng., Portland State Univ., OR, USA
pp. 89-92
L. Onural , Bilkent Univ., Ankara, Turkey
M. Kocatepe , Bilkent Univ., Ankara, Turkey
H.M. Ozaktas , Bilkent Univ., Ankara, Turkey
pp. 9-III12
C. Kotropoulos , Dept. of Electr. Eng., Thessaloniki Univ., Greece
I. Pitas , Dept. of Electr. Eng., Thessaloniki Univ., Greece
pp. 93-96
I. Pitas , Image & Media Lab., GoldStar Co. Ltd., Seoul, South Korea
I. Pitas , Dept. of Electr. Eng., Thessaloniki Univ., Greece
pp. 97-100
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